JPH10144740A - Manufacturing method/device for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate non-operation state of a device due to improper lot handling and to improve the valid operation rate of an expensive test device, by identifying and managing the lot of semiconductor devices and sequentially testing or marking the semiconductor devices in a carrier unit instead of management based on the lot ID. SOLUTION: A manufacture device is constituted of a management computer 1, a test device 2 and a mark device 3. A carrier ID is given to respective carriers storing the semiconductor device and latest information on the lot ID of the semiconductor devices stored in the respective carries are managed. Even if the test device 2 or the mark device 3 is in the middle of the processing of the semiconductor devices of the prescribed lot, the carrier storing the semiconductor devices of the other lot are sequentially supplied without waiting for the completion of processing. Namely, non-operation state of the device owing to improper handling is removed and the valid operation rate of the test device 2 and the like can be improved by processing the semiconductor device in the carrier unit smaller than a lot unit.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and an apparatus for manufacturing a semiconductor device, and more particularly to a method and an apparatus for manufacturing a semiconductor device in a test step and a mark step after assembling the semiconductor device.

[0002]

2. Description of the Related Art In a conventional semiconductor device wafer manufacturing process and assembling process, in order to cope with quality problems after shipping, semiconductor devices are usually processed in lot units and processing conditions are changed for each lot. Unify, processing equipment, processing date and time,
Lot processing histories such as processing conditions and processing results are recorded and managed by a computer in correspondence with lot IDs assigned to each lot.

[0003] After the assembly process, a test process, a burn-in process,
In the marking process, similarly, processing is performed in lot units,
The test result for each lot is also recorded and managed by a computer in association with the lot ID in the same manner as the processing history, and the processing history recorded and managed by the computer by marking the lot ID on the semiconductor device in the marking process. The test results are associated with the actual semiconductor devices.

A test apparatus and a mark apparatus that perform a test step and a mark step continuously perform an operation of taking out a semiconductor device housed in a carrier such as a magazine and a tray, performing test and mark processing, and housing the semiconductor device again in the carrier. The process is continued until the semiconductor devices in all the carriers loaded in the carrier supply unit of the device are processed and stored in the carriers in the carrier discharge unit.

FIG. 4 is an explanatory diagram schematically showing a test device and a mark device for performing a conventional test process and a mark process.

The test device and the mark device shown in FIG. 4 include a first test device 10 for performing a first test process, a second test device 12 for performing a second test process, and a mark device for performing a mark process. 14. The first test device 10, the second test device 12, and the marking device 14 for performing the marking process constitute one device for each column separated by a dotted line.

The flow of the test process and the mark process in the test device and the mark device of FIG. 4 is as follows. When the carrier of the lot to be processed is loaded into the carrier supply unit 10a of the first test apparatus 10, the semiconductor device is taken out of the carrier and transported to the test unit 10b, and the semiconductor device is tested. The test results are recorded and managed by a computer in association with the lot ID assigned to each lot. After the test, the semiconductor device is transported to the carrier discharge unit 10c, and is stored in the carrier loaded in the carrier discharge unit 10c.

When the second test apparatus 12 is processing another lot, the carrier in which the semiconductor device is housed has one end,
It is transported to the first lot storage 11 and stored. The carrier stored in the first lot storage 11 waits until the processing of another lot in the second test apparatus 12 is completed and the second test apparatus 12 is completely empty, and It is loaded in the carrier supply unit 12a of the test device 12. In response to this, similarly to the first test apparatus, the semiconductor device is taken out of the carrier and transported to the test section 12b, and the semiconductor device is tested. The test results are recorded and recorded by a computer in association with the lot ID.
Be managed. After the test, the semiconductor device is transported to the carrier discharge unit 12c and stored in the carrier loaded in the carrier discharge unit 12c.

When the marking device 14 is processing another lot, the carrier containing the semiconductor device is transported and stored at one end to the second lot storage 13. The carrier stored in the second lot storage 13 waits for the processing of another lot in the marking device 14 to be completed and the marking device 12 to be completely vacant, and then sent to the carrier supply unit 14a of the marking device 14. Will be loaded. In response to this, the semiconductor device is taken out of the carrier and transported to the marker 12b, and a lot ID, a classification according to a test result, and the like are marked on the semiconductor device. After the end of the mark, the semiconductor device is transported to the carrier discharge unit 14c, and the carrier discharge unit 14c
And is sent to the next process.

As described above, it is not guaranteed that the semiconductor device processed by the test device and the mark device will be stored again in the same carrier as before the processing. Therefore, even if the test apparatus and the mark apparatus have a function of distinguishing the carrier before processing for each lot, when carriers of a plurality of different lots are loaded into the carrier supply unit of the apparatus,
After processing, the carrier and the lot can no longer be matched,
In some cases, semiconductor devices of different lots are stored in one carrier. Therefore, in actual operation, batch processing is performed in lot units. That is, only one lot of carriers is loaded in the carrier supply unit of the apparatus, and all the semiconductor devices in the carrier loaded in the carrier supply unit are stored in the carrier of the carrier discharge unit.
Until the processing of a lot is completed, the carrier supply unit is not loaded with a carrier of another lot.

[0011]

As described above, a test apparatus and a mark apparatus for performing a test step and a mark step have a mechanism capable of continuous processing, but are required to prevent semiconductor devices from different lots from being mixed. In order to prevent this, batch processing is performed for each lot without performing continuous processing for a plurality of lots. Therefore, the following three problems occur.

First, at the beginning and end of each lot process, time is required only for transferring the semiconductor device, which is not the main purpose of the process, and the effective operation rate of the device is reduced. Second, even if one lot process is completed in the apparatus that performs a certain process, if the next process apparatus completes one lot process and the device is not completely empty, the subsequent lot process is not performed. Without proceeding, lot stagnation occurs due to waiting for the equipment to be available.

Third, even if one lot processing is completed in the apparatus that performs a certain process and the apparatus becomes empty, if one lot processing is not completed in the previous apparatus, the lot is not processed. Cannot be advanced to the next process, and a non-operating state of the apparatus due to a lot wait occurs.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to eliminate an inoperative state of an apparatus due to a lot waiting, thereby improving an effective operation rate of an expensive test apparatus and the like. It is an object of the present invention to provide a method and an apparatus for manufacturing a semiconductor device, which can reduce a stock of an intermediate product by eliminating a stagnation of a lot due to an idle state of the device.

[0015]

According to the method of manufacturing a semiconductor device according to the present invention, there is provided a method of manufacturing a semiconductor device having a test step of testing the quality or performance of the semiconductor device and a mark step of making a predetermined mark on the semiconductor device. In the method, the test step and the mark step use a plurality of carriers each having a carrier identification code for identifying an individual carrier, and use a plurality of lots such that only a single lot of semiconductor devices are stored for each carrier. The semiconductor device stored in one carrier is transported, and the lot to which the semiconductor device stored in one carrier belongs is determined by managing and identifying the lot to which the semiconductor device stored in each carrier belongs based on the carrier identification code. Regardless of whether or not the lot to which the semiconductor device stored in the In this configuration, the effective operation rate of expensive test equipment and the like is improved by eliminating the non-operation state of the equipment due to the lot waiting, and the empty space of the equipment. The stagnation of lots due to waiting can be eliminated, and the inventory of intermediate products can be reduced.

According to the semiconductor device manufacturing apparatus according to the present invention, in the semiconductor device manufacturing apparatus for testing the quality or performance of the semiconductor device and making a predetermined mark on the semiconductor device, a carrier for identifying individual carriers is provided. A plurality of lots of semiconductor devices are stored and transported by using a plurality of carriers each having an identification code so that only a single lot of semiconductor devices are stored for each carrier, and stored in each carrier based on the carrier identification code. By identifying and managing the lot to which the semiconductor device belongs, regardless of whether the lot to which the semiconductor device contained in one carrier belongs and the lot to which the semiconductor device contained in another carrier belongs are the same, The test or mark of the semiconductor device is sequentially performed on a carrier basis. Improve the effective utilization rate of expensive test equipment such as the exclusion of non-working state of, also, it is possible to reduce the stock of intermediate products to the exclusion of the lot stagnation by free waiting for equipment.

[0017]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a method and an apparatus for manufacturing a semiconductor device according to the present invention will be described below with reference to the drawings.

First, an outline of a method and an apparatus for manufacturing a semiconductor device according to the present invention will be described.

In the test step and the mark step, processing that affects the quality of the semiconductor device of each lot is not performed. Therefore, if the lot ID can be marked on the actual semiconductor device by associating the test result with the lot ID, the test process and the marking process are processes that do not need to be performed on a lot-by-lot basis. Therefore,
In order to make it possible to move between processes in smaller units than the conventional batch-type batch processing, eliminate lot stagnation and improve the operation rate of the equipment, test and mark processes by the following methods and equipment I do.

In order to associate the actual semiconductor device with the lot ID and maintain the correspondence until the semiconductor device is marked with the lot ID in the marking step, the semiconductor device is housed in a carrier and interposed between the processes. It is premised that the movement is performed. By assigning a carrier ID to each carrier to uniquely identify them and managing the relationship between the carrier ID and the lot ID on a database of a management computer, the above correspondence can be maintained. Becomes

As described above, there is no guarantee that the semiconductor device housed in the carrier and loaded in the test apparatus will be housed again in the same carrier after the test and discharged. Therefore, the test apparatus according to the present invention notifies the management computer of the carrier replacement information of the semiconductor device, and records the carrier ID recorded on the database of the computer.
By updating the relationship between the actual semiconductor device and the lot ID, the relationship between the actual semiconductor device and the lot ID can be maintained. Therefore, in the test step and the mark step, the semiconductor device can be processed in carrier units.

Hereinafter, a specific configuration of an embodiment of a method and an apparatus for manufacturing a semiconductor device according to the present invention will be described.

FIG. 1 is an explanatory view schematically showing a semiconductor device manufacturing apparatus for carrying out a semiconductor device manufacturing method according to the present invention. An apparatus for manufacturing a semiconductor device according to the present invention includes a management computer 1, a test apparatus 2, and a mark apparatus 3. Although a single test apparatus is shown for convenience of description, a plurality of test apparatuses may be provided.

The apparatus for manufacturing a semiconductor device according to the present invention is configured in more detail as follows.

The test apparatus 2 includes a controller 2a for transmitting and receiving data to and from the management computer 1, and a test mechanism 2 '.
It is composed of The test mechanism unit 2 'includes a carrier supply unit 2d in which a semiconductor device to be processed is stored,
A carrier ID reader 2b for reading the carrier ID of the carrier taken out from the carrier supply unit 2d and transmitting the carrier ID to the controller 2a; a test unit 2i for testing the semiconductor device taken out of the carrier; An empty carrier discharge unit 2f for discharging the changed carrier, an empty carrier supply unit 2g for supplying an empty carrier for storing the semiconductor device after the test, and a carrier for storing the defective semiconductor device. Defective carrier discharge unit 2h, carrier ID reader 2c for reading the carrier ID of the carrier containing the non-defective semiconductor device and transmitting it to controller 2a, and non-defective carrier discharge unit 2e for discharging the carrier containing the non-defective semiconductor device
It is composed of

The marking device 3 includes a controller 3a for transmitting and receiving data to and from the management computer 1, and a marking mechanism 3 '.
It is composed of The mark mechanism unit 3 ′ includes a carrier supply unit 3 d in which a semiconductor device to be processed is stored,
A carrier ID reader 3b for reading the carrier ID of the carrier taken out from the carrier supply unit 3d and transmitting it to the controller 3a; a marker 3c for marking the semiconductor device taken out of the carrier; and a semiconductor device taken out and emptied Empty carrier discharge section 3f for discharging the carrier, empty carrier supply section 3g for supplying an empty carrier for accommodating the semiconductor device after the end of the mark, and discharging the carrier containing the semiconductor device after the end of the mark. And a carrier discharging unit 3e.

In the management computer 1, the type name of the semiconductor device, the processing performed on the semiconductor device in each step before the test process, and the like correspond to the lot ID assigned to each lot of the semiconductor device. First database 1 to be registered
a and the carrier I of the carrier in which the semiconductor device is stored
D, a second database 1b in which the number of semiconductor devices housed in the carrier and the lot ID are registered, and a search result 4c obtained in response to receiving the carrier processing start notification 4b from the controller 2a of the test apparatus 2, A database search / record deletion unit 1c for deleting the record and transmitting the search result 4e to the controller 2a of the test device 2, and a carrier discharge notification 5b received from the carrier discharge notification 5b from the controller 2a of the test device 2. A record registration unit 1d for registering the contents of the notification 5b in the second database 1b, and a controller 3a of the marking device 3
6c according to the carrier processing start notification 6b
And the search result 6d is stored in the controller 3a
And a database search means 1e for transmitting the data to the server.

The method for manufacturing a semiconductor device according to the present invention, that is, the method for processing a semiconductor device by the apparatus for manufacturing a semiconductor device according to the present invention is implemented as follows.

In the first database 1a of the management computer 1, the type name of the semiconductor device, the processing performed on the semiconductor device in each process before the test process, and the like are added for each lot of the semiconductor device. Registered corresponding to the lot ID. On the other hand, each record of the second database 1b of the management computer 1 is used in the final process of the assembly process before the test process, for example, in the lead cutting / bending process.
It is registered when the semiconductor device is first stored in the carrier. In the second database 1b, the carrier ID of the carrier containing the semiconductor device, the number of semiconductor devices contained in the carrier, and the lot ID are registered. Therefore, semiconductor devices are housed in each carrier such that all semiconductor devices housed in one carrier are of the same lot.

In the test step, the test apparatus 2 takes out the carrier from the carrier supply unit 2d, reads the carrier ID of the carrier by the carrier ID reader 2b, and uses the read carrier ID 4a as the carrier processing start notification 4b via the controller 2a. It is transmitted to the management computer 1. When the management computer 1 receives the carrier processing start notification 4b, it searches the database.
The record deleting means 1c operates, searches the second database 1b based on the carrier ID 4a, and searches the second database 1b.
After obtaining the search result 4c corresponding to a, the record is deleted. The search result 4c is converted into the search result 4e via the database search / record deletion unit 1c as the search result 4e.
To the controller 2a. Controller 2a
Identifies the lot ID of the semiconductor device removed from the carrier based on the search result 4e received from the management computer 1.

On the other hand, the semiconductor device taken out of the carrier is subjected to a predetermined test in the test section 2i of the test apparatus 2, and is classified into a non-defective product and a defective product according to the test result, and is stored in the carrier again. In this test, the controller 2a has already identified the lot ID of the target semiconductor device. For example, if the test conditions and contents are different for each lot, the controller 2a executes a test conforming to the semiconductor device of the lot. It can be carried out. In addition, defective semiconductor devices
It is stored in the carrier taken out from the empty carrier supply section 2g and is discharged to the defective carrier discharge section 2h.

On the other hand, the non-defective semiconductor device is stored in the carrier after the carrier ID of the carrier taken out from the empty carrier supply section 2g is read by the carrier ID reader 2c. At this time, as long as the semiconductor devices are semiconductor devices of the same lot, they may be housed in one carrier even if they are housed in different carriers at first. Therefore, as long as semiconductor devices of the same lot are successively transported, the semiconductor devices are sequentially stored until the carrier is fully loaded. Conversely, semiconductor devices of different lots are not mixed and accommodated in one carrier, and when semiconductor devices of the same lot are exhausted, even if the carrier is not fully loaded, Semiconductor devices of other lots are not stored.

When the carrier containing the non-defective semiconductor device is discharged to the non-defective carrier discharge section 2e, a carrier discharge notice 5b is transmitted from the controller 2a to the management computer 1. Carrier discharge notification 5b
Is composed of a carrier ID 5a read by the carrier ID reader 2c, the number of semiconductor devices housed in the carrier, and a lot ID. In the management computer 1, upon receiving the carrier discharge notification 5b, the record registration means 1d operates, and registers the contents of the carrier discharge notification 5b in the second database 1b.

By performing the test process in accordance with the above procedure, even if the semiconductor device is stored in a carrier different from the initial one in the test process, the latest carrier ID and lot ID are stored in the second database 1b of the management computer 1. Can be managed.

In the marking step, the marking device 3 takes out the carrier from the carrier supply unit 3d, reads the carrier ID of the carrier by the carrier ID reader 3b, and uses the read carrier ID 6a as the carrier processing start notification 6b via the controller 3a. It is transmitted to the management computer 1. In the management computer 1, upon receiving the carrier processing start notification 6b, the database search means 1e operates, searches the second database 1b based on the carrier ID 6a, and obtains a search result 6c corresponding to the carrier ID 6a. The search result 6c is transmitted to the controller 3a of the marking device 3 as the search result 6d via the database search means 1e. The controller 3a identifies the lot ID of the semiconductor device taken out of the carrier from the search result 6d received from the management computer 1, transmits the identified lot ID 6e to the marker 3c in synchronization with the transport of the semiconductor device, and sends the identified lot ID 6e to the semiconductor device. Lot I
Mark D6e. The semiconductor device with the mark is stored in the carrier supplied from the empty carrier supply unit 3g and discharged from the carrier discharge unit 3e.

Thus, the test process and the mark process are completed. As described above, according to the method and apparatus for manufacturing a semiconductor device according to the present invention, a carrier ID is attached to each carrier accommodating a semiconductor device, and the latest lot ID of the semiconductor device accommodated in each carrier is updated. By managing the information, even if the test device or the mark device is processing a semiconductor device of a certain lot, the carriers containing the semiconductor devices of other lots can be sequentially input without waiting for the completion of the process. it can. That is, since semiconductor devices can be processed in a carrier unit smaller than a lot unit, the non-operating state of the device due to the lot waiting is eliminated to improve the effective operation rate of expensive test equipment and the like, and In addition, it is possible to reduce the stock of intermediate products by eliminating the stagnation of lots due to waiting for empty devices.

FIG. 2 is an explanatory view schematically showing a test apparatus and a mark apparatus for performing a test step and a mark step according to the method of manufacturing a semiconductor device and the structure of the apparatus according to the present invention.

The test device and the mark device shown in FIG. 2 are a first test device 7 for performing a first test process, and a second test device.
And a marking device 8 for performing a marking process. The first test device 7, the second test device 8, and the marking device 9 for performing the marking process constitute one device for each column separated by a dotted line.

As is apparent from comparison with FIG. 4, the test apparatus and the mark apparatus according to the present invention are different from the conventional test step and the mark step, and the first and second test apparatuses 7 and 8 are different.
Or, even if the marking device 9 is processing a semiconductor device of a certain lot, carriers accommodating semiconductor devices of other lots can be sequentially loaded without waiting for the completion of the process, which has been conventionally required. There is no need to set up lot storage.

The carriers accommodating the semiconductor devices are sequentially
After the semiconductor device is loaded into each carrier supply unit 7a of the first test apparatus 7 for performing the first test process and subjected to a predetermined test in each test unit 7b, the semiconductor device is again stored in the carrier and the carrier discharge unit 7c Is discharged from The carriers discharged from the first test apparatus 7 are supplied to the respective carrier supply units 8 of the second test apparatus 8 that perform the second test process in the order in which the carriers are discharged, regardless of the lot ID of the stored semiconductor device.
a.

In the second test device 8, similarly,
After a predetermined test is performed in each test section 8b, the semiconductor device is stored again in the carrier and discharged from the carrier discharge section 8c. The carrier discharged from the second test device 8 is the lot ID of the stored semiconductor device in the same manner as described above.
Irrespective of this, they are loaded into the carrier supply section 9a of the marking device 9 which performs the marking process in the order of ejection.

The marking device 9 sequentially marks the identified lot ID of the semiconductor device on the semiconductor device taken out of the carrier loaded in the carrier supply section 9a by the marker 9b. After the end of the mark, the semiconductor device is stored again in the carrier and discharged from the carrier discharge section 9c.
At this time, since the semiconductor device is already marked, it is possible to mix and store semiconductor devices of different lots in one carrier.

As described above, according to the method and apparatus for manufacturing a semiconductor device according to the present invention, the semiconductor device can be processed in a carrier unit smaller than a lot unit. Even while semiconductor devices of a lot are being processed, carriers accommodating semiconductor devices of other lots can be sequentially loaded without waiting for the completion of the processing. As a result, it is possible to achieve the object of the present invention, that is, the improvement of the effective operation rate of the test device and the like and the reduction of the stock of the intermediate products.

FIG. 3 shows a case where the method and apparatus for manufacturing a semiconductor device according to the present invention are used (FIG. 3A) and a case where a conventional method and apparatus for manufacturing a semiconductor device are used (FIG. 3).
It is explanatory drawing which represented typically the required time of two different lot processing in (b)). Times tAS and tBS are transport times before the start of the process, times tA and tB are times during which the process is actually performed, and times tAE and tBE are transport times after the start of the process.

As shown in FIG. 3B, the processing of the next lot B can be started only after the processing of the lot A has been completed and the conveyance of the lot A has been completed. could not. Therefore, the time required for processing lot A and lot B is tAS + tA + tAE + tBS + tB +
tBE.

On the other hand, when the method and apparatus for manufacturing a semiconductor device according to the present invention are used, as shown in FIG.
Is transported and loaded in advance, and after the processing of the lot A, the processing of the lot B can be started immediately without waiting for the transport of the lot A. Therefore, the time required for processing lot A and lot B is tAS + tA + tB.
+ TBE.

As described above, when the method and the apparatus for manufacturing a semiconductor device according to the present invention are used, the processing time is shortened to improve the effective operation rate of the test apparatus and the like and to improve the intermediate products. Inventory reduction can be achieved.

[0048]

According to the method of manufacturing a semiconductor device according to the present invention, a test method for testing the quality or performance of a semiconductor device and a method of manufacturing a semiconductor device having a mark step of applying a predetermined mark to the semiconductor device are described. The step and the mark step are performed by using a plurality of carriers each having a carrier identification code for identifying each carrier, and using a plurality of semiconductor devices of a plurality of lots such that only a single lot of semiconductor devices are stored for each carrier. By storing and transporting, and by identifying and managing the lot to which the semiconductor device housed in each carrier belongs based on the carrier identification code, the lot to which the semiconductor device housed in one carrier belongs and the lot accommodated in another carrier Regardless of whether the lot to which the semiconductor device belongs is the same or not, the test or mark In since assumed to be successively performed steps, with exclusion of non-working state of the apparatus according to the lot waiting to improve the effective utilization rate of expensive test equipment such as, also,
It is possible to reduce the stock of the intermediate product by eliminating the stagnation of the lot due to the idle waiting of the device.

According to the semiconductor device manufacturing apparatus of the present invention, in the semiconductor device manufacturing apparatus for testing the quality or performance of the semiconductor device and making a predetermined mark on the semiconductor device, a carrier for identifying each carrier is used. A plurality of lots of semiconductor devices are stored and transported by using a plurality of carriers each having an identification code so that only a single lot of semiconductor devices are stored for each carrier, and stored in each carrier based on the carrier identification code. By identifying and managing the lot to which the semiconductor device belongs, regardless of whether the lot to which the semiconductor device contained in one carrier belongs and the lot to which the semiconductor device contained in another carrier belongs are the same, Since testing or marking of semiconductor devices is performed sequentially for each carrier, non-operational status of devices due to lot waiting Dividing improve the effective utilization rate of expensive test equipment or the like, also, it is possible to reduce the stock of intermediate products to the exclusion of the lot stagnation by free waiting for equipment.

[Brief description of the drawings]

FIG. 1 is an explanatory view schematically showing a semiconductor device manufacturing apparatus for carrying out a semiconductor device manufacturing method according to the present invention.

FIG. 2 is an explanatory view schematically showing a test apparatus and a mark apparatus that perform a test step and a mark step according to a method of manufacturing a semiconductor device and a configuration of the manufacturing apparatus according to the present invention.

FIGS. 3A and 3B show two different lot processes in the case of using the semiconductor device manufacturing method and the manufacturing apparatus according to the present invention (a) and in the case of using the conventional semiconductor device manufacturing method and the manufacturing apparatus (b). Explanatory drawing which represented the required time typically.

FIG. 4 is an explanatory view schematically showing a test device and a mark device that perform a conventional test process and a mark process.

[Explanation of symbols]

 1 Management computer 2, 7, 8, 10, 12 Test device 3, 9, 14 Marking device

Claims (10)

[Claims] 1. A method for manufacturing a semiconductor device, comprising: a test step of testing the quality or performance of a semiconductor device; and a mark step of making a predetermined mark on the semiconductor device, wherein the test step and the mark step identify individual carriers. A plurality of semiconductor devices of a plurality of lots are housed and transported so that only a single lot of semiconductor devices are housed in each of the plurality of carriers by using the plurality of carriers each having a carrier identification code for performing the carrier identification. By identifying and managing the lot to which the semiconductor device housed in each carrier belongs based on a code, the lot to which the semiconductor device housed in one carrier belongs and the semiconductor device housed in another carrier Irrespective of whether the lot to which it belongs is the same or not, The semiconductor device is sequentially performed for each carrier. 2. A method for manufacturing a semiconductor device, comprising: a test step of testing the quality or performance of the semiconductor device; and a mark step of making a predetermined mark on the semiconductor device, wherein the test step and the mark step identify individual carriers. A plurality of semiconductor devices of a plurality of lots are housed and transported such that only a single lot of semiconductor devices are housed for each of the carriers using the plurality of carriers each having a carrier identification code for performing the test or The semiconductor stored in each of the carriers based on the carrier identification code before taking out the semiconductor device from the carrier to perform the mark and after storing the semiconductor device in the carrier after the test or the mark is completed. By identifying and managing the lot to which the equipment belongs, Regardless of whether the lot to which the semiconductor device accommodated in the carrier belongs and the lot to which the semiconductor device accommodated in the other carrier belongs are the same, the test or the mark of the semiconductor device is performed in units of the carrier. A method for manufacturing a semiconductor device, comprising sequentially performing steps. 3. A plurality of semiconductor devices of a plurality of lots, each of which is provided with a carrier identification code for identifying an individual carrier, so that only a single lot of semiconductor devices are accommodated for each carrier. A first step of sequentially loading the carrier into a test apparatus carrier supply unit of a test apparatus; and a second step of reading a test apparatus supply carrier identification code of the test apparatus supply carrier supplied from the test apparatus carrier supply unit. And a first database for storing and holding a lot identification code assigned to each lot of the semiconductor device and lot information corresponding to the lot identification code, each carrier identification code and each carrier identification code Before being stored in each of the carriers with each of the carrier identification codes as carrier information corresponding to From the second database of the storage holding means and a second database for the storing lot identification code and the number held in the semiconductor device,
Based on the test device supply carrier identification code, the test device supply carrier information corresponding to the test device supply carrier identification code is retrieved and read, and the test device supply carrier identification code and the test device supply code are retrieved. A third step of deleting carrier information from the second database, a fourth step of performing a predetermined test on the semiconductor device taken out of the test apparatus supply carrier, and a single step for each of the carriers. The non-defective discharge carrier identification code for the test device is read out of the non-defective discharge carrier for the test device in which the semiconductor device is stored based on the result of the predetermined test so that only the semiconductor device of the lot is stored. And a non-defective product discharge carrier for the test device. A fifth step of registering the information as the information in the second database together with the non-defective product discharge carrier identification code for the test apparatus, and a sixth step of sequentially discharging the non-defective product discharge carrier for the test apparatus from the non-defective product discharge carrier discharge unit for the test apparatus A seventh step of sequentially loading the non-defective product discharging carrier for the test device discharged from the non-defective product discharging carrier discharging unit for the test device into a marking device carrier supply unit of a marking device; and Eighth step of reading the mark device supply carrier identification code of the non-defective ejection carrier for the test device supplied as the mark device supply carrier, and reading the mark device supply carrier from the second database of the storage holding means. The mark corresponding to the supply carrier identification code for the marking device based on the identification code. A ninth step of retrieving and reading device supply carrier information; and performing a predetermined mark on the semiconductor device taken out from the mark device supply carrier based on the read mark device supply carrier information. A tenth process, and an eleventh process of sequentially storing the semiconductor device provided with the predetermined mark in a discharging device for a marking device and sequentially discharging the discharging carrier for a marking device. Semiconductor device manufacturing method. 4. The test device supply carrier according to claim 3, wherein the contents and conditions of the predetermined test in the fourth step are read out in the third step. A method for manufacturing a semiconductor device, which is determined according to information. 5. The method of manufacturing a semiconductor device according to claim 3, wherein the first to sixth steps are performed before performing each of the steps after the seventh step. A plurality of times of repeating the series of steps described above, and performing the different predetermined test each time. 6. A semiconductor device manufacturing apparatus for testing the quality or performance of a semiconductor device and making a predetermined mark on the semiconductor device, wherein a plurality of the carriers each having a carrier identification code for identifying each carrier are used. A plurality of lots of semiconductor devices are stored and transported such that only a single lot of semiconductor devices are stored for each carrier, and the semiconductor devices stored in the respective carriers based on the carrier identification code belong. By identifying and managing lots, regardless of whether the lot to which the semiconductor device housed in one carrier belongs and the lot to which the semiconductor device housed in another carrier belongs are the same, Manufacturing the semiconductor device, wherein the test or the mark of the device is sequentially performed for each carrier. Manufacturing equipment. 7. A semiconductor device manufacturing apparatus for testing the quality or performance of a semiconductor device and making a predetermined mark on the semiconductor device, comprising: a plurality of carriers each having a carrier identification code for identifying each carrier; A plurality of lots of semiconductor devices are stored and transported such that only a single lot of semiconductor devices are stored for each carrier, and the semiconductor device is taken out of the carrier to perform the test or the mark. After the test or the mark is completed and the semiconductor device is housed in the carrier, the lot to which the semiconductor device housed in each carrier belongs is identified and managed based on the carrier identification code, whereby one of the The lot to which the semiconductor device stored in the carrier belongs and the lot stored in another carrier. An apparatus for manufacturing the semiconductor device, wherein the test or the mark of the semiconductor device is sequentially performed in units of the carrier, regardless of whether or not the lot to which the semiconductor device belongs is the same. 8. A first database for storing and holding a lot identification code assigned to each lot of a semiconductor device and lot information corresponding to the lot identification code, and a carrier identification code for identifying individual carriers. The lot identification code of the semiconductor device accommodated in each of the carriers to which the respective carrier identification code is attached as the carrier identification code of the plurality of carriers and the carrier information corresponding to the respective carrier identification code, respectively, and Memory holding means having a second database for storing and holding the number; test mechanism control means for controlling a test mechanism; and a plurality of carriers each containing only a single lot of semiconductor devices. A test apparatus carrier supply unit into which the carrier containing the lot of the semiconductor devices is loaded; A first carrier identification code reading unit for reading a test device supply carrier identification code of a test device supply carrier supplied from the test device carrier supply unit and transmitting the test device supply carrier identification code to the test mechanism control unit; Test means for performing a predetermined test on the semiconductor device taken out from the supply carrier; semiconductor device classification means for classifying the semiconductor device based on the test result; and a single lot of the carrier for each carrier. A test device non-defective product discharge carrier identification code of a test device non-defective product discharge carrier in which the semiconductor device classified as non-defective is stored by the semiconductor device classification means so that only the semiconductor device is stored, and the test mechanism unit is read. Second carrier identification code reading means for transmitting to the control means,
A test device having a non-defective product discharge carrier discharge unit for discharging the non-defective product discharge carrier for the test device; and a test device supply carrier identification code received from the test mechanism unit control unit. The test equipment supply carrier information corresponding to the test equipment supply carrier identification code is searched and read from the second database, and the test equipment supply carrier identification code and the test equipment supply carrier information are retrieved. A retrieval / deletion unit for deleting from the second database; and a non-defective product discharge carrier identification code for the test device, based on the non-defective product discharge carrier identification code for test device received from the test mechanism unit control unit. Along with the test equipment supply carrier information. Registering means for registering non-defective product discharge carrier information for the device in the second database; mark mechanism control means for controlling a mark mechanism; and a mark device carrier supply unit into which the non-defective product test carrier is loaded. A third carrier identification unit for reading a mark device supply carrier identification code of the non-defective product ejection carrier for the test device supplied from the mark device carrier supply unit as the mark device supply carrier, and transmitting the code to the mark mechanism unit control means; Code reading means, mark means for applying a predetermined mark to the semiconductor device taken out from the mark device supply carrier in response to an instruction signal received from the mark mechanism control means, and the predetermined mark is provided. Marking device key for discharging a marking device discharging carrier in which the semiconductor device is sequentially stored. A mark device having a rear discharge unit, and a mark device supply carrier identification code from the second database of the storage holding unit based on the mark device supply carrier identification code received from the mark mechanism unit control means. The mark mechanism supply carrier information is searched and read out, and the mark mechanism supply control section controls the mark mechanism supply carrier information so that the mark mechanism section control means generates the instruction signal and transmits the instruction signal to the mark means. An apparatus for manufacturing a semiconductor device, comprising: a search unit that transmits the data to a unit. 9. The semiconductor device manufacturing apparatus according to claim 8, wherein the contents and conditions of the predetermined test performed by the test means are included in the test apparatus supply carrier information read by the search and delete means. An apparatus for manufacturing a semiconductor device, wherein the apparatus is determined in accordance with the above. 10. The apparatus for manufacturing a semiconductor device according to claim 8, wherein a plurality of said test devices are provided, and said test means of each of said test devices are different from each other in said predetermined device. An apparatus for manufacturing a semiconductor device, which performs a test.