JPH10142138A - Method for panalyzing resin fluidity of prepreg and method for inspecting pressed heat plate accuracy - Google Patents

Method for panalyzing resin fluidity of prepreg and method for inspecting pressed heat plate accuracy

Info

Publication number
JPH10142138A
JPH10142138A JP30338096A JP30338096A JPH10142138A JP H10142138 A JPH10142138 A JP H10142138A JP 30338096 A JP30338096 A JP 30338096A JP 30338096 A JP30338096 A JP 30338096A JP H10142138 A JPH10142138 A JP H10142138A
Authority
JP
Japan
Prior art keywords
marking
prepreg
heating
resin
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30338096A
Other languages
Japanese (ja)
Inventor
Yutaka Mizuno
裕 水野
Kiyoshi Kikuchi
清 菊地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP30338096A priority Critical patent/JPH10142138A/en
Publication of JPH10142138A publication Critical patent/JPH10142138A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Abstract

PROBLEM TO BE SOLVED: To accurately examine the fluidity of prepreg resin by forming a marking that can be identified after heated press on a surface, heating and pressing a prepreg by a press, and analyzing resin fluidity from the change in the marking. SOLUTION: A lattice-shaped marking 1 is formed horizontally and vertically with a specific gap using an oil-based felt pen, and further a centered dot circle with a specific diameter is drawn at the center of each lattice, thus forming a circular marking 2. The prepreg is sandwiched between stainless mirror plates and is heated and pressed at specific temperature and pressure for a specific amount of time, thus clearly grasping the degree and direction of flow of resin from the change in the marking and confirming the degree of parallelization of the heated plate from the condition of a lattice-shaped marking 1b and a circular marking 2b after heated press.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プリプレグの樹脂
流動性分析方法及びプレス熱板(以下、熱板という)精
度の検査方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for analyzing resin fluidity of a prepreg and a method for inspecting the accuracy of a hot plate (hereinafter referred to as a hot plate).

【0002】[0002]

【従来の技術】プリント配線板の基板材料や電気絶縁用
の電気用積層板は、所定枚数のプリプレグを重ねて加熱
加圧して製造される。多層プリント配線板は、構成材を
プリプレグを介して重ねて加熱加圧して製造される。こ
こで、構成材とは、内層材及び外層材であり、内層材は
内層回路を形成したプリント配線板、また外層材は外層
回路を形成するための片面銅張積層板又は銅はくであ
る。
2. Description of the Related Art A substrate material for a printed wiring board and an electrical laminate for electrical insulation are manufactured by laminating a predetermined number of prepregs and heating and pressing them. The multilayer printed wiring board is manufactured by laminating constituent materials via a prepreg and heating and pressing. Here, the constituent materials are an inner layer material and an outer layer material, wherein the inner layer material is a printed wiring board on which an inner layer circuit is formed, and the outer layer material is a single-sided copper-clad laminate or copper foil for forming an outer layer circuit. .

【0003】積層板及び多層プリント配線板の製造にお
いて使用されるプリプレグは、繊維基材に熱硬化性樹脂
ワニスを含浸した後、含浸した熱硬化性樹脂を半硬化状
態にしたものである。プリプレグに含浸された熱硬化性
樹脂は、加熱により一旦溶融して流動状態となり、その
後硬化反応が進行して不溶不融の硬化樹脂に変化する。
プリプレグに含浸された熱硬化性樹脂が溶融したときの
流動性は樹脂の組成及び半硬化状態にするときの条件に
依存する。この流動性が適正でないと、ボイド、カスレ
など製品不良の原因となる。従来、この流動性について
は、プリプレグを試験的に加熱加圧することにより調べ
ていた。
[0003] A prepreg used in the production of a laminated board and a multilayer printed wiring board is obtained by impregnating a thermosetting resin varnish into a fiber base material, and then impregnating the impregnated thermosetting resin into a semi-cured state. The thermosetting resin impregnated in the prepreg is temporarily melted by heating to be in a fluid state, and then the curing reaction proceeds to change into an insoluble and infused cured resin.
The fluidity of the thermosetting resin impregnated in the prepreg when it melts depends on the composition of the resin and the conditions under which the prepreg is brought into a semi-cured state. If the fluidity is not appropriate, it may cause product defects such as voids and blurring. Conventionally, the fluidity has been examined by heating and pressing the prepreg on a trial basis.

【0004】電気用積層板、多層プリント配線板何れに
しても、成形には平行熱板(以下単に熱板という)を備
えたプレスが使用されている。熱板を備えたプレスによ
る成形は、一般には平行板成形と称している。平行板成
形において、熱板精度は、製品の品質を左右する。熱板
の精度、特に、平行度が適正でないと、圧力むらがで
き、厚さ精度を悪化させる。従来、熱板の精度を検査す
る方法としては、熱板の間にはんだ線を置き、加圧、又
は、加熱加圧した後、はんだ線の厚さを測定する方法、
熱板の間に感圧紙を置き、加圧した後、感圧紙の変色度
合いにより圧力分布を知る方法などが知られている。
A press equipped with a parallel hot plate (hereinafter simply referred to as a hot plate) is used for molding, both for an electric laminate and a multilayer printed wiring board. Forming by a press having a hot plate is generally called parallel plate forming. In parallel plate molding, hot plate accuracy affects product quality. If the accuracy of the hot plate, particularly the degree of parallelism, is not appropriate, pressure unevenness occurs and the thickness accuracy deteriorates. Conventionally, as a method of inspecting the accuracy of the hot plate, placing a solder wire between the hot plate, pressurized, or, after heating and pressurizing, a method of measuring the thickness of the solder wire,
A method is known in which pressure-sensitive paper is placed between hot plates, and after pressure is applied, the pressure distribution is determined based on the degree of discoloration of the pressure-sensitive paper.

【0005】[0005]

【発明が解決しようとする課題】はんだ線を用いる方法
や感圧紙を用いる方法では、プリプレグの流動性を調べ
ることができない。また、実際の成形時には、クッショ
ン、回路の凹凸、治具類の存在も影響するので、成形と
同じ条件とはならない。単に、プリプレグをプレスによ
り試験的に加熱加圧する方法では熱板精度を検査するこ
とができない。本発明は、実際の成形に即した条件で分
析することができるリプレグの樹脂流動性分析方法、及
び、熱板精度の検査方法を提供することを目的とするも
のである。
In a method using a solder wire or a method using pressure-sensitive paper, the fluidity of a prepreg cannot be examined. Further, at the time of actual molding, the same conditions as molding are not obtained because the presence of cushions, unevenness of the circuit, and the presence of jigs also affect the molding. The method of simply heating and pressurizing the prepreg on a test basis with a press cannot check the accuracy of the hot plate. An object of the present invention is to provide a method for analyzing resin fluidity of a prepreg and a method for inspecting the accuracy of a hot plate, which can be analyzed under conditions suitable for actual molding.

【0006】[0006]

【課題を解決するための手段】本発明の第一は、加熱加
圧後に識別可能なマーキングを表面に形成したプリプレ
グを、プレスにより加熱加圧して、マーキングの変化か
ら樹脂流動性を分析することを特徴とするプリプレグの
樹脂流動性分析方法である。加熱加圧によりプリプレグ
の樹脂が流動するのに伴い、マーキングが変化するが、
このマーキングの変化度合い、特に移動距離から、流動
性を判定することができる。本発明の第二は、加熱加圧
後に識別可能なマーキングを表面に形成したプリプレグ
を、熱板間に置き、加熱加圧して、マーキングの変化か
ら熱板の平行度を確認することを特徴とする熱板精度の
検査方法である。プリプレグの樹脂が流動することによ
るマーキングの変化が均等であれば、熱板の平行度が良
好であると判定できる。なお、熱板精度の定量的確認
は、プリプレグを加熱加圧した後にその厚さを測定する
ことにより可能である。
A first aspect of the present invention is to heat and press a prepreg having a surface on which a identifiable marking is formed after heating and pressurizing by a press, and to analyze the resin fluidity from a change in the marking. A method for analyzing resin fluidity of a prepreg. As the resin of the prepreg flows due to heating and pressing, the marking changes,
The fluidity can be determined from the degree of change of the marking, particularly from the moving distance. The second aspect of the present invention is characterized in that a prepreg having a surface on which a identifiable marking is formed after heating and pressing is placed between hot plates, heated and pressed, and the parallelism of the hot plate is confirmed from a change in the marking. This is a method for inspecting the accuracy of a hot plate. If the change in marking caused by the flow of the resin of the prepreg is uniform, it can be determined that the parallelism of the hot plate is good. The accuracy of the hot plate can be quantitatively confirmed by measuring the thickness of the prepreg after heating and pressing.

【0007】[0007]

【発明の実施の形態】加熱加圧後に識別可能なマーキン
グとは、加熱加圧により消失しないマーキングである。
このようなマーキングとしては、油性のインクを用いた
筆記具、特に、フェルトペンが最適である。水性のイン
クは、熱硬化性樹脂との親和性が悪くてマーキングでき
ないので好ましくない。また、刻印のようなマーキング
は、加熱加圧中に消失してしまうので不適である。イン
クの色調は、熱硬化性樹脂と異なる色調であればよく、
他に制限はない。
BEST MODE FOR CARRYING OUT THE INVENTION A marking that can be identified after heating and pressing is a marking that does not disappear by heating and pressing.
As such a marking, a writing instrument using oil-based ink, particularly a felt pen, is optimal. Aqueous inks are not preferred because they have poor affinity for thermosetting resins and cannot be marked. Markings such as stamps are not suitable because they disappear during heating and pressing. The color tone of the ink may be different from that of the thermosetting resin,
There are no other restrictions.

【0008】マーキングは、プリプレグ全面に対称形と
するのが好ましい。このようなマーキングとしては、例
えば、図1の(a)に示すような格子状マーキング1が
挙げられる。また、単一形状とするのではなく、例え
ば、図1の(a)に示すように格子状マーキング1の格
子の中に円形マーキング2を描くように、いくつかの形
状のマーキングを併用するのが好ましい。
The marking is preferably symmetrical over the entire surface of the prepreg. As such a marking, for example, a grid-like marking 1 as shown in FIG. Also, instead of using a single shape, for example, as shown in FIG. 1A, several shapes of markings are used in combination such that a circular marking 2 is drawn in a grid of a grid-like marking 1. Is preferred.

【0009】[0009]

【実施例】【Example】

実施例1 厚さ0.2mm、510×510mmのガラス布基材エ
ポキシ樹脂プリプレグ(日立化成工業株式会社製、GE
A−67N(商品名)を使用した)に油性のフェルトペ
ンを用いて、幅3mmの直線を50mm間隔で縦横に引
いて、格子状マーキング1を形成し、さらに、各格子の
中心に直径約5mmの中黒円を描いて円形マーキング2
を形成した(図1(a)参照)。このプリプレグ1枚を
ステンレス鏡板の間に挿み、温度170℃、圧力3MP
aで120分間加熱加圧した。その結果、マーキングは
図1(b)に示すように変化していた。樹脂の流動方向
や流動の度合いを明瞭に把握でき、かつ加熱加圧後の格
子状マーキング1b及び加熱加圧後の円形マーキング2
bの形態からみて熱板の平行度も良好であることが確認
された。
Example 1 Glass cloth-based epoxy resin prepreg 0.2 mm thick, 510 × 510 mm (GE manufactured by Hitachi Chemical Co., Ltd.
A-67N (trade name) was drawn using an oil-based felt pen to draw a straight line having a width of 3 mm vertically and horizontally at intervals of 50 mm to form a grid-like marking 1. Draw a 5mm black circle and make a circular marking 2
Was formed (see FIG. 1A). One sheet of this prepreg is inserted between stainless steel head plates, at a temperature of 170 ° C. and a pressure of 3MP.
a and heating and pressurizing for 120 minutes. As a result, the marking changed as shown in FIG. The flow direction and the degree of flow of the resin can be clearly grasped, and the grid-like marking 1b after heating and pressing and the circular marking 2 after heating and pressing
It was confirmed from the view b that the parallelism of the hot plate was also good.

【0010】実施例2 熱板中央部が摩耗により凹んでいるプレスを使用して実
施例1と同様に加熱加圧した。その結果、中央部のマー
キングは、図1(c)に示すように変化していた。すな
わち、熱板の凹み部分に向かって樹脂が流れるので、円
形マーキング2及び格子状マーキング1の線も熱板の凹
み部分に向かって移動し、加熱加圧後の格子状マーキン
グ1c及び加熱加圧後の円形マーキング2cの形態とな
っていた。そこで、熱板を研削して平行度を修正して実
施例1と同様に加熱加圧した。その結果、プリプレグの
マーキングは図1(b)とほぼ同様にになり、熱板の平
行度が実施例1のプレスと同等となったことが確認され
た。
Example 2 Heat and pressure were applied in the same manner as in Example 1 using a press in which the center of the hot plate was concave due to wear. As a result, the marking at the center changed as shown in FIG. That is, since the resin flows toward the concave portion of the hot plate, the lines of the circular marking 2 and the grid-like marking 1 also move toward the concave portion of the hot plate, and the grid-like marking 1c after heating and pressurizing and the heating and pressurizing. This was in the form of the later circular marking 2c. Then, the hot plate was ground to correct the parallelism, and heated and pressed in the same manner as in Example 1. As a result, the marking of the prepreg was almost the same as that of FIG. 1B, and it was confirmed that the parallelism of the hot plate was equivalent to that of the press of Example 1.

【0011】実施例3 熱板平行度が乱れたプレスを使用して実施例1と同様に
加熱加圧した。その結果、マーキングは、図1(d)に
示すようになっていた。すなわち、熱板間隔が広い部分
に向かって樹脂が流れるので、円形マーキング2及び格
子状マーキング1の線も、加熱加圧後の格子状マーキン
グ1d及び加熱加圧後の円形マーキング2dのような形
態となっていた。なお、図1(d)はマーキングの乱れ
が大きい部分を抜き出して図示したものである。図1
(d)から、熱板間隔は、プリプレグが図1(d)に相
当する部分の空間が大きくなっていると判断された。そ
こで、熱板とプレス本体殿間にスペーサーを入れて平行
度を調整して、実施例1と同様に加熱加圧した。その結
果、プリプレグのマーキングは図1(b)とほぼ同等に
になり、熱板の平行度が実施例1のプレスと同等となっ
たことが確認された。
Example 3 A hot press was performed in the same manner as in Example 1 using a press having a disturbed parallelism of the hot plate. As a result, the marking was as shown in FIG. In other words, since the resin flows toward the portion where the interval between the hot plates is wide, the lines of the circular marking 2 and the grid-like marking 1 also have a form like the grid-like marking 1d after the heating and pressing and the circular marking 2d after the heating and pressing. Had become. FIG. 1D shows a portion where the marking is largely disturbed. FIG.
From (d), it was determined that the space between the hot plates was large in the portion of the prepreg corresponding to FIG. 1 (d). Therefore, a spacer was inserted between the hot plate and the press body to adjust the parallelism, and heating and pressing were performed in the same manner as in Example 1. As a result, it was confirmed that the marking of the prepreg was substantially equal to that of FIG. 1B, and that the parallelism of the hot plate was equivalent to that of the press of Example 1.

【0012】[0012]

【発明の効果】本発明によれば、プリプレグの樹脂の流
動性を的確に調べることができる。また、同じ操作で熱
板精度を検査することができる。
According to the present invention, the fluidity of the resin of the prepreg can be accurately investigated. In addition, the accuracy of the hot plate can be inspected by the same operation.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例に関する平面図であり、
(a)は加熱加圧前の状態を示し、(b)は加熱加圧後
の状態を示し、(c)及び(d)は同じく加熱加圧後の
状態で乱れが大きい部分を抜き出して示す。
FIG. 1 is a plan view of an embodiment of the present invention,
(A) shows a state before heating and pressurizing, (b) shows a state after heating and pressurizing, and (c) and (d) similarly show a portion after the heating and pressurizing where a large turbulence is extracted. .

【符号の説明】[Explanation of symbols]

1 格子状マーキング 2 円形マーキング 1b,1c,1d 加熱加圧後の格子状マーキング 2b,2c,2d 加熱加圧後の円形マーキング 1 Lattice marking 2 Circular marking 1b, 1c, 1d Lattice marking after heating and pressing 2b, 2c, 2d Circular marking after heating and pressing

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 加熱加圧後に識別可能なマーキングを表
面に形成したプリプレグを、プレスにより加熱加圧し
て、マーキングの変化から樹脂流動性を分析することを
特徴とするプリプレグの樹脂流動性分析方法。
1. A method for analyzing resin fluidity of a prepreg, comprising: applying a heat and a pressure to a prepreg having a surface on which a identifiable marking is formed after heating and pressing by a press; and analyzing the resin fluidity from a change in the marking. .
【請求項2】 加熱加圧後に識別可能なマーキングを表
面に形成したプリプレグを、プレス熱板間に置き、加熱
加圧して、マーキングの変化からプレス熱板の平行度を
確認することを特徴とするプレス熱板精度の検査方法。
2. The method according to claim 1, further comprising placing a prepreg on the surface of which a identifiable marking is formed after heating and pressurizing, placing the prepreg between press hotplates, heating and pressurizing, and confirming the parallelism of the press hotplate from a change in the marking. Press hot plate accuracy inspection method.
JP30338096A 1996-11-14 1996-11-14 Method for panalyzing resin fluidity of prepreg and method for inspecting pressed heat plate accuracy Pending JPH10142138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30338096A JPH10142138A (en) 1996-11-14 1996-11-14 Method for panalyzing resin fluidity of prepreg and method for inspecting pressed heat plate accuracy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30338096A JPH10142138A (en) 1996-11-14 1996-11-14 Method for panalyzing resin fluidity of prepreg and method for inspecting pressed heat plate accuracy

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006107031A Division JP2006258819A (en) 2006-04-10 2006-04-10 Test method for press hot platen precision

Publications (1)

Publication Number Publication Date
JPH10142138A true JPH10142138A (en) 1998-05-29

Family

ID=17920323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30338096A Pending JPH10142138A (en) 1996-11-14 1996-11-14 Method for panalyzing resin fluidity of prepreg and method for inspecting pressed heat plate accuracy

Country Status (1)

Country Link
JP (1) JPH10142138A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103512832A (en) * 2013-10-09 2014-01-15 广东生益科技股份有限公司 Method for detecting flowing condition of glue during laminating boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103512832A (en) * 2013-10-09 2014-01-15 广东生益科技股份有限公司 Method for detecting flowing condition of glue during laminating boards

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