JPH10135076A - Chip-like circuit part and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form an insulation film in specified state, without braking a chip element assembly by enabling insulation paint to be transferred to a circumferential surface of a chip element assembly, while rotating it in a proper position. SOLUTION: A chip element assembly 11 provided with recessed parts 17, 17 at a center of both edge faces ids used. after at least a pair of electrodes 12, 12 consisting of a conductor film are formed in a surface of the chip element assembly 11, projections 18, 8 at points of chucks 15, 15 are fit and held to the recessed parts 17, 17. Insulating pain 19 is applied to cover a circumferential surface of the ship assembly 11 between the electrodes 12, 12, while rotating the chip element assembly 11 around center thereof in the state. Then, the insulating paint 19 is hardened and an insulation film is formed. The insulating paint 19 is applied to a circumferential surface of the chip element assembly 11 by transferring it from a circumferential surface of a rotating transfer roll 13 to a circumferential surface of the chip element assembly 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a columnar chip-shaped circuit component having at least a pair of electrodes formed on a surface of a chip body made of a dielectric or the like, and a method for manufacturing the same. The present invention relates to a chip-like circuit component in which an insulating coating is applied to a gap between electrodes on a peripheral surface of a chip body and a method of manufacturing the same.

[0002]

2. Description of the Related Art A chip-like circuit component in which a pair of butting electrodes are formed on the surface of a chip body 1 with a gap therebetween is already known, for example, from Japanese Patent Application Laid-Open No. Hei 3-232221. Shown in the figure. Such a conventional chip-shaped circuit component is such that a pair of electrodes 2 and 2 are formed on both sides thereof with a central gap on the outer peripheral surface of a chip body 1 made of a ceramic dielectric or the like having a cylindrical shape. It is. The gap and the electrodes 2, 2 are formed over the entire circumference of the dielectric 1, and the electrodes 2, 2 are completely separated by the gap. Further, in the example shown in the figure, the gap between the electrodes 2 and 2 is covered with an insulating coating 4 made of resin or the like. The electrodes 2, 2 at both ends of the dielectric 11 are exposed from the insulating coating 4 as terminal portions.

Next, a method of manufacturing such a chip-shaped circuit component will be described with reference to FIG. 6. First, as shown in FIG. 6A, a columnar chip body 1 is prepared. next,
As shown in FIG. 6B, a pair of electrodes 2 and 2 made of a conductive film are formed on both ends of the chip body 1. This electrode 2,
The conductive film for forming 2 is formed by applying a conductive paste to the surface of the chip body 1 and baking it, or by plating. First, after a conductor film is formed on the entire surface of the chip body 1 in this way, the conductor film is laser-trimmed to form a gap in the center of the entire periphery of the chip body 1 and a pair of electrodes. Separate as 2, 2. Thereafter, the gap portion insulating coating 4 and the like are formed, and FIG.
As a result, a chip-shaped circuit component as shown by is obtained.

As another means for forming the electrodes 12, 12, both ends of the chip body 1 are immersed in a conductive paste to leave a gap portion, and a conductive paste is applied thereto. Means for forming 2 are also employed. FIG. 6C shows that the insulating coating 4 is formed.
An example of a step of applying an insulating paint 9 to the center of the peripheral surface of the chip body 1 will be described. As shown in this figure, both ends of the chip body 1 are sandwiched between a pair of chucks 5 and 5 having a tapered recess 6, and in this state, the chip body 1 is held around the central axis by the chucks 5 and 5. While rotating, transfer roller 3
Is transferred onto the peripheral surface of the chip body 1. Thereafter, the applied insulating paint 9 is cured to form an insulating coating 14 as shown in FIG.

[0005]

As described above, the chip body 1 is sandwiched between a pair of chucks 5, 5 having a tapered recess 6 as shown in FIG. When applying 9, as shown in FIG. 6C, the chip body 1 may not be able to be rotated in a state where the center axes of the chucks 5 and 5 and the chip body 1 are completely aligned. For example, as shown in FIG. 7, the center axis of the chip body 1 may be inclined with respect to the center axes of the chucks 5 and 5, and the chip body 1 may be rotated in this state.

[0006] In this manner, the chip body 1 is displaced from the center axis of the chip body 1 and the center axes of the chucks 5, 5.
Is rotated, the rotation of the chip body 1 is blurred, so that the application of the insulating paint 9 to the peripheral surface of the chip body 1 and the dislocation of the application position occur. For this reason, defects such as nonuniformity of the film thickness of the insulating coating 4 to be formed, the insulating coating 4 not being formed at the position where the insulating coating 4 is to be formed, or the insulating coating 4 not being formed at the position where the insulating coating 4 is to be formed. . In addition, the tip element 1
Of the chip element 1 may be cracked or broken due to stress concentration.

According to the present invention, it is possible to transfer the insulating paint to the peripheral surface of the conventional chip-shaped circuit component while rotating the chip body in a correct posture in view of the problem of the method for manufacturing the same. Accordingly, it is an object of the present invention to provide a chip-like circuit component capable of forming an insulating coating in a predetermined state without damaging the chip body, and a method of manufacturing the same.

[0008]

According to the present invention, in order to achieve such an object, tapered recesses 17 and 17 are provided at the centers of both end surfaces of the chip body 11 so that a pair of chucks 1 are provided.
The projections 18, 18 of the chucks 5, 15 are fitted into the recesses 17, 17, and the central axes of the chucks 15, 15 and the chip element 11
The chip body 11 is held and rotated so that the center axis of the chip body substantially coincides with the center axis. Then, in this state, the insulating material 19 adhered to the peripheral surface of the transfer roller 13 is applied to the peripheral surface of the chip element 11 and transferred, thereby transferring the chip element 1
The insulating coating 14 can be formed in a uniform state on the peripheral surface of No. 1.

That is, the chip-shaped circuit component according to the present invention comprises at least a pair of electrodes 12, 12 made of a conductive film formed on the surface of the chip body 11 with a gap therebetween, and the chip element between the electrodes 12, 12. An insulating coating covering the peripheral surface of the chip body;
7 and 17 are provided. This recess 17, 1
Reference numeral 7 denotes a tapered surface whose center axis substantially coincides with that of the chip body 11, and the electrodes 12, 12 formed at the ends of the chip body 11 include the surfaces inside the recesses 17, 17. Is formed.

Further, in the method of manufacturing a chip-shaped circuit component according to the present invention, a step of forming at least a pair of electrodes 12 made of a conductive film with a gap on the surface of a chip body 11; Chip body 11 between 12
Forming the insulating coating 14 covering the peripheral surface of the chip body 11 using the chip body 11 provided with the concave portions 17 at the centers of both end surfaces. Then, the chip body 11
At least one pair of electrodes 12, 1 made of a conductive film on the surface of
After the formation of the chuck 2, the chuck 15,
The projections 18, 18 at the tips of the fifteen are fitted and held. In this state, while rotating the chip body 11 around its center, an insulating paint 19 is applied so as to cover the peripheral surface of the chip body 11 between the electrodes 12. Next, the insulating paint 19 is cured to form the insulating coating 14. The application of the insulating paint 19 to the peripheral surface of the chip body 11 is performed by transferring the insulating paint 19 from the peripheral surface of the rotating transfer roll 13 to the periphery of the chip body 11.

In the chip-shaped circuit component and the method of manufacturing the same according to the present invention, the concave portion 17 is provided at the center of both end faces.
Using the chip body 11 provided with the
The projections 18, 18 at the tips of the chucks 15, 15 are fitted to the chip 17 and the chip body 11 is rotated around its center, so that the center axis of the chip body 11 and the center axis of the chucks 15, 15 are substantially aligned. The chip body 11 can be held by the chucks 15 and 15 in a state where they are aligned. Thereby, the chip body 11 can be accurately rotated around its central axis. In this state, an insulating paint 19 is applied so as to cover the peripheral surface of the chip body 11 between the electrodes 12, 12,
Since this is cured to form the insulating coating 14, the insulating coating 14 having a substantially uniform thickness can be formed on the chip body 11.

Further, since the ends of the chip body 11 are held by the chucks 15 and 15 in a correct state, a local concentration of load does not occur at the end of the chip body 11. Therefore, the chip body 11 does not crack or break due to stress concentration, and the occurrence of defective products due to mechanical damage can be suppressed.

[0013]

Embodiments of the present invention will now be described specifically and in detail with reference to the drawings.
FIG. 1 shows an example of a chip-shaped circuit component according to the present invention. For example, when the chip-shaped circuit component is a chip-shaped capacitor, the illustrated chip body 11 is a columnar member made of a dielectric or the like, and has concave portions 17, 17 having a conical taper at the center of both end surfaces thereof. Are formed. The center axis including the apex of the tapered recesses 17 and 17 and the chip body 1
1 substantially coincides with the central axis.

An electrode made of a conductive film of silver, zinc, nickel, copper, palladium, or an alloy thereof, except for a strip-shaped circumferential surface which is a gap between the electrodes 12, 12 of the entire surface of the chip body 11. 12 and 12 are formed, and these electrodes 12 and 12 are separated by the gap. In other words, the edges of the pair of electrodes 12, 12 face each other via the gap. The conductor film forming the electrodes 12, 12 is:
It is also formed on the surface of the recesses 17, 17.

Further, an insulating coating 14 made of an insulating paint such as an epoxy resin is formed at the center of the outer periphery of the chip body 11, and the entire gap between the electrodes 12, 12 is covered. The parts on both sides of the insulating coating 14 of the electrodes 12, 12 are
It becomes a terminal electrode for connecting this chip-shaped circuit component to a circuit or the like. Nickel plating, tin plating, solder plating, or the like may be applied to the terminal electrode to improve its solderability. Further, a metal cap or the like may be fitted.

Such a chip-shaped circuit component is manufactured as follows. First, a columnar chip body 11 made of a dielectric ceramic as shown in FIG. 2A is prepared. In the center of both end faces of the chip body 11, the tapered recesses 17, 17 as described above are formed. Such recesses 17 may be formed on both end surfaces of the chip body 11 before molding the chip body 11 from the dielectric material, or the chip body may be formed from the dielectric material. After that, it may be formed by machining before or after firing.

Next, a conductive paste is applied to the outer peripheral surface and the end surface on both sides of the chip element body 11 except for a part which is a gap between the peripheral parts of the peripheral surface. The application of the conductive paste is generally performed by, for example, a so-called dip method in which an end of the chip body 11 is dipped in the conductive paste and then pulled up. For example, a jig provided with a large number of elastic holding holes is used, the chip body 11 is fitted into the holding holes, and one end of the chip body 11 projects from the surface of the jig. Then, the end of the chip body 11 protruding from the surface of the jig is immersed in the conductive paste. afterwards,
The conductive paste is dried. Next, the other end of the chip body 11 protrudes from the holding hole of the jig, the other end protruding is dipped in a conductive paste, and the conductive paste is dried. Thereafter, these conductive pastes are baked to form electrodes 12 and 12 made of a conductive film as shown in FIG. 2B. The conductor films forming the electrodes 12 are also formed on the surfaces of the recesses 17.

As another means for forming the conductive film for forming the electrodes 12, 12, a conductive film is formed on the entire surface of the chip body 11 by means such as plating or application and baking of a conductive paste, followed by laser trimming or the like. Chip body 1 by means of
By removing the conductor film at the center of the peripheral surface of
Means for dividing 2 and 12 can be given.

Thereafter, as shown in FIG. 2C, a pair of chucks 1 are inserted into the recesses 17 on both end surfaces of the chip body 11.
The projections 18, 18 of 5, 15 are fitted, and the chuck 15,
The chip element body 11 is held between 15. The chucks 15, 15 shown in FIG. 2 (c) have a flange 16 at the tip of the shaft, and a conical projection 18 having the same taper as the concave portion 17 on the end face of the chip body 11 projects from the center of this end face. Has been established. This tapered projection 18 is
The end faces of the flange 16 are in contact with the end faces of the chip body 11 in a state of being fitted into the recesses 17, 17, and the pair of chucks 15, 15 hold the end faces of the chip body 11 from both sides. At this time, the central axes of the chucks 15 and 15 coincide with the central axis of the chip body.

In this state, the pair of shafts 15 and 15 are rotated by a rotating machine (not shown), whereby the chip body 1 is rotated.
1 is rotated about its central axis. On the other hand, the transfer roller 13 is disposed facing the peripheral surface of the chip body 11 rotated in this manner. While the transfer roller 13 rotates, the insulating paint 19 such as epoxy resin adhered to the peripheral surface of the transfer roller 13 is applied to the gap between the peripheral surface of the rotating chip element 11 and transferred. At this time, the chip body 11
Is accurately rotated about its central axis, so that the insulating paint 19 is applied in a predetermined state without causing application unevenness of the insulating paint 19. Thereafter, the insulating coating 19 applied to the intermediate portion of the peripheral surface of the chip body 11 is cured to form the insulating coating 14 as shown in FIG.

FIG. 3 shows the chip element 11 as described above.
This shows another example of the chucks 15 used to apply the insulating paint 19 to the peripheral surface of the chuck 15. In the figure, the projections 18 of the chuck 15 are formed in a hemispherical shape. When a part of the spherical surface of the projections 18 comes into contact with the surfaces of the tapered recesses 17, 17, the chucks 15, 1
5 holds the chip body 11 in a predetermined position.

FIG. 4 shows the chip element 11 as described above.
FIG. 14 shows still another example of the chucks 15, 15 used when applying the insulating paint 19 to the peripheral surface of FIG.
A chuck 15 without a flange 16 is used. Therefore, the chucks 15, 15 shown in FIG. 4 hold the chip body 11 in a predetermined position only by fitting the projections 18, 18 into the recesses 17, 17.

[0023]

As described above, in the chip-shaped circuit component and the method of manufacturing the same according to the present invention, it is possible to transfer the insulating paint 19 to the peripheral surface while rotating the chip body 11 in a correct posture. In this case, the insulating coating 14 can be formed in a predetermined state without damaging the chip body 11.

[Brief description of the drawings]

FIG. 1 is a vertical sectional side view showing an example of a chip-shaped circuit component according to the present invention.

FIG. 2 is a vertical sectional side view showing an example of a manufacturing process of the chip-shaped circuit component.

FIG. 3 is a vertical sectional side view showing another example of a chuck used in a step of manufacturing the example of the chip-shaped circuit component.

FIG. 4 is a longitudinal sectional side view showing another example of a chuck used in a step of manufacturing the example of the chip-shaped circuit component.

FIG. 5 is a vertical sectional side view showing a conventional example of a chip-shaped circuit component.

FIG. 6 is a vertical sectional side view showing an example of a manufacturing process of the conventional chip-shaped circuit component.

FIG. 7 is a vertical sectional side view showing a state in which the center axes of the chuck and the chip body are shifted in a manufacturing process of the chip-shaped circuit component of the conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Chip body 12 Electrode 14 Insulating coating 15 Chuck 17 Depression of end face of chip body 18 Protrusion at tip of chuck 19 Insulating paint

Claims (5)

[Claims] At least one pair of electrodes (1) made of a conductive film formed on a surface of a chip body (11) with a gap therebetween.
2) and (12) and a chip-shaped circuit component having an insulating coating (14) covering the peripheral surface of the chip body (11) between the electrodes (12) and (12). A chip-shaped circuit component, wherein concave portions (17) and (17) are provided at the centers of both end surfaces of the chip-shaped circuit component. 2. The chip-shaped circuit component according to claim 1, wherein the recesses (17), (17) are formed by tapered surfaces whose central axes substantially coincide with the chip body (11). . 3. A chip according to claim 1, wherein a conductor film for forming electrodes (12) is formed on the surfaces inside the recesses (17). Circuit components. 4. At least one pair of electrodes (12), (1) made of a conductive film with a gap provided on the surface of the chip body (11).
(2) forming an insulating coating (14) covering the peripheral surface of the chip body (11) between the electrodes (12) and (12);
Forming a chip-shaped circuit component having the steps of: forming concave portions (17), (17) at the centers of both end surfaces.
The chip body (11) provided with
At least one pair of electrodes (1
After forming 2) and (12), the concave portions (17) and (1)
7) The projections (1) at the tips of the chucks (15) and (15)
8) and (18) are fitted and held, and the chip body (11)
While rotating the electrode (1) around its central axis.
2) A chip characterized in that an insulating coating (19) is applied so as to cover the peripheral surface of the chip body (11) between (12) and (12), and this is cured to form an insulating coating (14). Manufacturing method of shaped circuit parts. 5. The application of the insulating paint (19) to the peripheral surface of the chip body (11) is performed by transferring the insulating paint (19) from the peripheral surface of the rotating transfer roll (13) to the peripheral surface of the chip body (11). The method according to claim 4, wherein the method is performed.