JPH10132654A - Container for infrared detection element, and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To facilitate and quicken a vacuum sealing by bonding a member for selecting infrared rays to be detected through a bonding material to a container body while closing an infrared ray incident hole and then closing a sealing hole penetrating the container body with a sealant having a melting point lower than that of the bonding material. SOLUTION: A bonding material 9 is provided on the bonding face of a cover 5 around an infrared ray incident hole 6. An infrared optical component 7 is set while closing the infrared ray incident hole 6. It is then thrown into a hating furnace in order to fuse the bonding material 9 and then returned to normal temperature, thus bonding the infrared optical component 7 to the cover 5. Subsequently, the flange part 5a of the cover 5 is welded to a base 2. The container for detection element is then entirely placed in a vacuum chamber and evacuated thus removing air and various gases. A sealant 12 is placed in a vacuum sealing hole 10 and thermally fused to close the hole. Since a sealant 12 having a melting point lower than that of the bonding material 9 is employed, vacuum seal is prevented from being broken at the part of the bonding material 9 due to shift of the infrared optical component 7 caused by fusion of the bonding material 9 when the sealant 12 is being fused.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a detection element container in which a detection element for detecting infrared rays or the like is vacuum-sealed and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, various detection element containers in which a detection element for detecting infrared rays or the like is vacuum sealed are provided.
Hereinafter, an infrared detecting element will be described as an example of the detecting element of the detecting element container. There are two types of infrared detection elements, so-called quantum type and thermal type. Thermal infrared detection elements are not widely used in quantum applications in terms of sensitivity, but do not require cooling, have a simple structure, and are inexpensive to manufacture, and are therefore widely used in various practical applications. In order to increase the sensitivity of this thermal type infrared detecting element, the heat generated by the infrared detecting section when irradiating infrared rays should be prevented from escaping to the outside as much as possible, and the heat should be increased to increase the temperature change of the infrared detecting section. It is necessary to improve insulation. In order to enhance the thermal insulation of the infrared detecting section, a means for storing a thermal infrared detecting element in a vacuum package and further forming the infrared detecting section in a hollow structure is generally used.

[0003] As such a conventional detection element container, for example, there is a container disclosed in Japanese Patent Application Laid-Open No. 7-122667. FIG. 11 is a vertical sectional view showing a conventional detection element container. In the drawing, reference numeral 31 denotes an infrared detecting element which has a hollow structure and is fixed to a base 32 made of metal. Reference numeral 33 denotes a pin for connecting an electric signal from the infrared detecting element 31 to the outside. The pin 33 is provided on the base 32 and is drawn out through a wire 34 for electrically connecting the electric signal of the infrared detecting element 31 to the outside. ing. 35
Is a lid made of metal and has an infrared incident hole 36. Reference numeral 37 denotes an infrared optical component that transmits only infrared light of a specific wavelength to be measured, and is fixed so as to cover the infrared incident hole 36 of the lid 35. 3
Reference numeral 8 denotes a metal gasket, which is provided between the lid 35 and the base 32 of the container. The container for the detecting element is vacuum-sealed by cold-pressing the base 32 and the lid 35 sandwiching the metal gasket 38 in a vacuum chamber to thereby maintain the vacuum inside the package. ing.

Next, the operation will be described. Only infrared light of a specific wavelength passes through the infrared optical component 37 and enters the infrared detection element 31. Then, the predetermined electric signal converted by the infrared detecting element 31 is transmitted to the wire 34 and the pin 33.
Is output to the outside of the detection element container via

[0005]

Since the conventional detecting element container is constructed as described above, if a cold pressure welding method is used for sealing a general metal container, the inside of the chamber in a vacuum state is not used. Therefore, there is a problem that the lubricating oil of the processing machine is vaporized and gas is mixed into the container.

In addition, there is a problem that a vacuum chamber having a size large enough to install a processing machine must be prepared, and the entire apparatus becomes large.

Further, since the vacuum chamber has a large capacity,
There is also a problem that it takes a long time to make a vacuum from the atmospheric pressure.

In addition, since the base 32 and the lid 35 are mechanically pressed against each other, there is another problem that metal scraps are easily mixed into the container.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and is intended for a detection element which can be easily assembled, can be formed in a compact processing apparatus as a whole, and can perform highly reliable vacuum sealing easily and quickly. The purpose is to obtain a container.

Another object of the present invention is to provide a method for manufacturing a container for a detection element, which is easy to assemble, enables a compact processing apparatus as a whole, and can perform highly reliable vacuum sealing easily and quickly.

A further object of the present invention is to provide a method for manufacturing a container for a detecting element which can easily prevent thermal damage to components during manufacturing.

[0012]

According to a first aspect of the present invention, there is provided a container for a detection element, wherein a container body having a detection element built therein and having an entrance hole through which a detection target is incident, and the entrance hole is closed by a fixing material. As a detection target selection material fixed to the container body, a sealing hole provided through the container body,
A sealing material having a melting temperature lower than the melting temperature of the fixing material and closing the sealing hole.

According to a second aspect of the present invention, there is provided a container for a detection element, the container body having a detection element built therein and having an incident hole through which a detection object is incident, and the container body being covered with a fixing material so as to cover the incident hole. A fixed detection target selection material, a sealing hole provided through the container body, and a sealing material having a melting temperature lower than the melting temperature of the fixing material and closing the sealing hole. The thickness of the container body in the vicinity of the sealing hole is formed to be smaller than the thickness of a portion other than the vicinity of the sealing hole.

According to a third aspect of the present invention, there is provided a container for a detection element, wherein a positioning portion for determining a fixing position of a detection target selection material with respect to a container body is provided in the container body.

According to a fourth aspect of the present invention, in the detecting element container, the positioning portion may be configured such that the thickness of the container main body at a portion where the detection target selection material is fixed and the thickness of the container main body at a portion where the detection target selection material is not fixed. It is formed so as to be thinner than the wall thickness, and is formed so that the detection target selection material can be fitted therein.

According to a fifth aspect of the present invention, in the detection element container, the positioning portion is formed in a convex shape capable of contacting any or all of the outer peripheral portion of the detection target selection material.

According to a sixth aspect of the present invention, there is provided a container for a detection element, wherein an incident hole and a sealing hole are provided on the same surface of a container body.

According to a seventh aspect of the invention, there is provided a container for a detection element, wherein a sealing hole is provided at a position serving as a mark with respect to an output terminal to be used as a reference.

[0019] The method for manufacturing a container for a detection element according to the invention of claim 8 includes a step of fixing the detection element to the container body;
The method includes a step of fixing the detection target selection material to the container body with a fixing material, and a step of heating the sealing material after evacuation from the sealing hole and closing the sealing hole.

According to a ninth aspect of the present invention, in the method of manufacturing a container for a detecting element according to the invention, in the step of closing the sealing hole by heating the sealing material after evacuation from the sealing hole, heating the sealing material. Before performing the operation, an infrared shielding material is provided on the outer surface of the detection target selection material, and after heating the sealing material, the infrared shielding material is removed from the detection target selection material.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below. Embodiment 1 FIG. FIG. 1 is a vertical sectional view showing a container for a detection element according to Embodiment 1 of the present invention, and FIG. 2 is a flowchart showing a method for manufacturing the container for a detection element. In the figure,
Reference numeral 1 denotes an infrared detection element (detection element) that detects infrared rays (a detection target), converts the infrared rays into electric signals, and outputs the electric signals. The infrared detection element 1 has a heat-insulating hollow structure, and is made of, for example, a metal base (container body) using an epoxy resin adhesive. ) 2. 1a
Is a chip pad (output terminal) formed on the infrared detecting element 1 for making an electrical connection with the outside of the element. 3
Is a metal pin (output terminal) provided through a predetermined position of the base 2 to output an electric signal of the infrared detecting element 1 to the outside, and 4 is an electrical connection between the infrared detecting element 1 and the pin 3. (Output terminal), for example, using gold or aluminum. 5 is formed in a bottomed cylindrical shape,
It is a metal lid (container main body) having a flange portion 5a and an upper surface portion 5b. The upper surface portion 5b is provided with a rectangular infrared incident hole (incident hole) 6. The flange 5a is fixed to the base 2 by welding or the like.

Reference numeral 7 denotes a square infrared optical component (a detection target selection material) that transmits only infrared light of a specific wavelength to be measured.
And a fixing material 9 covering the infrared incident hole 6 of the lid 5.
To the upper surface 5b. The infrared optical component 7 is formed in a plate shape using, for example, a semiconductor such as germanium or silicon as a material, and antireflection films are provided on both surfaces of the plate. A metal thin film for facilitating fixation to the material 9 is formed in advance by, for example, sputtering or the like. Also, the infrared optical component 7 has been described by taking a rectangular plate shape as an example, but other shapes such as a circular plate shape may of course be used.

The fixing material 9 is made of, for example, lead-tin (Pb-Sn)
Eutectic solder is formed by printing in a paste form on the fixing surface. Although the description has been made on the assumption that the lead-tin eutectic solder is used as the fixing material 9, an adhesive such as an epoxy resin or glass may be used.

Reference numeral 10 denotes a vacuum sealing hole (sealing hole) provided through the upper surface 5b to evacuate the detecting element container, and 12 denotes a vacuum sealing after the detecting element container is evacuated. It is a sealing material for sealing the holes 10, and uses, for example, bismuth-based low-melting solder whose melting temperature is lower than the melting temperature of the fixing material 9. This is to prevent the fixing material 9 from melting when the sealing material 12 is heated and melted, thereby preventing the infrared optical component 7 from moving and breaking the vacuum sealing at the fixing material 9.

In the above embodiment, the case where the detecting element container is divided into two parts, the lid 5 and the base 2, is shown because the infrared optical component 7 is fixed to the lid 5 and This is because workability is good in terms of fixing the infrared detecting element 1 to the second element 2, venting each element, and the like. Therefore,
If it is configured with good workability, it is not always necessary to configure the lid 5 and the base 2 separately. In addition, although both the lid 5 and the base 2 are described as being made of metal, non-metals such as ceramics may be used, or the surfaces may be plated with metal.

Next, a method for manufacturing the container for the detection element will be described. In FIG. 2, step ST1 is a step of fixing the infrared detecting element 1 to the base 2. First, the infrared detecting element 1 is bonded and fixed to the base 2 while taking care not to break the heat insulating hollow structure formed in the infrared detecting element 1. Then, the wire 4 is connected to the chip pad 1a, and then the wire 4 is connected to the pin 3 of the base 2. Next, the base 2 to which the infrared detecting element 1 is fixed is heated at a predetermined temperature for a predetermined time according to the contained gas such as the adhesive, so that the adhesive, the infrared detecting element 1 and the base 2 are degassed. It is also possible to do it in stages. By this degassing, generation of gas from the infrared detecting element 1 or the adhesive after vacuum sealing can be effectively prevented.

Step ST2 is a step of fixing the infrared optical component 7 to the lid 5. That is, first, for example, a paste-like fixing material 9 is printed and provided on the fixing surface around the infrared incident hole 6 of the lid 5. Next, the infrared optical component 7 is arranged so as to cover the infrared incident hole 6. Then, in this state, it is put into a heating furnace or the like, and is heated for a predetermined time and at a predetermined temperature to melt the fixing material 9, and is returned to normal temperature to fix the infrared optical component 7 to the lid 5. Since the inside of the detection element container is evacuated later, it is sufficiently fixed so that the vacuum is not broken at this fixed portion. Next, the infrared optical component 7 and the fixing material 9 are degassed by heating the lid 5 to which the infrared optical component 7 is fixed for a predetermined time and at a predetermined temperature in accordance with the gas contained in the fixing material 9. This degassing temperature is set lower than the heat resistant temperature of the infrared optical component 7 and the melting temperature of the fixing material 9.

Step ST3 is a step of fixing the lid 5 and the base 2 on which the components have been mounted. That is, the flange 5a of the lid 5 and the base 2 are welded by, for example, electric resistance welding.

Step ST4 is a step of vacuum-sealing the detection element container. First, the entire detection element container is placed in a vacuum chamber (not shown), the atmosphere in the chamber is evacuated, and a predetermined time elapses while maintaining the vacuum,
Remove air and various gases from the detector element container. next,
The sealing material 12 is placed in the vacuum sealing hole 10, and the sealing material 12 is heated and melted by, for example, an infrared heater attached to a vacuum chamber (not shown). When the sealing material 12 melts and closes the vacuum sealing hole 10, it is gradually cooled and the temperature of the detecting element container is returned to room temperature. Thereby, the sealing material 12 solidifies, and the vacuum sealing is completed.

Since the melting temperature of the sealing material 12 is lower than the melting temperature of the fixing material 9, the fixing material 9 is melted during the melting of the sealing material 12 and the infrared optical component 7 is melted. Can be prevented from being moved or the vacuum sealing at the fixing material 9 can be prevented from being broken. Furthermore, since the heating temperature at the time of sealing can be lowered, the heat resistance temperature of other components can also be lowered.

Next, the operation will be described. Only infrared light of a specific wavelength passes through the infrared optical component 7 and enters the infrared detection element 1. Then, a predetermined electric signal converted by the infrared detecting element 1 is output from the chip pad 1a and output to the outside of the detecting element container via the wire 4 and the pin 3. In this case, since the inside of the container for the detection element is vacuum-sealed by the above-described method, a high degree of vacuum can be maintained, and the outflow of heat generated in the infrared detection unit can be effectively prevented. Therefore, the temperature of the infrared detecting element 1 is efficiently increased, and the sensitivity of detecting infrared rays is also improved.

As described above, according to the first embodiment, only the detection element container or only the detection element container and the heating device are installed in the vacuum chamber.
Since the vacuum chamber to be used can be made small and inexpensive, and the volume inside the vacuum chamber is small and other mechanical devices are not included, the degree of vacuum in the vacuum chamber at the time of vacuum sealing can be further improved. Is obtained. Further, since the vacuum sealing hole 10 and the infrared optical component 7 are on the same surface, that is, on the upper surface portion 5b, an effect is obtained that the assembling work is easy and the inspection is easy also at the time of product inspection. Further, by fixing the infrared optical component 7 to the outside of the upper surface portion 5b of the lid 5, a fixing force due to atmospheric pressure and gravity is applied in addition to the fixing material 9, so that the infrared optical component 7 can be arranged in a more stable state. The effect is also obtained.

In the above procedure, step ST
1 and step ST2 are not limited to the order, and the same effect can be obtained by performing either of them first. Also, in step ST4 of performing vacuum sealing, the description has been made assuming that the heating device is attached to the inside of the vacuum chamber.
The present invention is not limited to this, and heating may be performed by a heating device provided outside.

Embodiment 2 FIG. 3 is an enlarged sectional view showing a vacuum sealed portion of the detection element container according to Embodiment 2 of the present invention. In the figure, reference numeral 13 denotes a thin portion formed near the outer periphery of the vacuum sealing hole 10 in the upper surface portion 5b, and its thickness d
1 is made thinner than the thickness d2 of the upper surface portion 5b (d1 <d
2) It is formed with reduced heat capacity and reduced thermal conductivity. Other configurations are the same as those in the first embodiment, and the corresponding parts are denoted by the same reference numerals and description thereof will be omitted.

The order of assembling the detection element containers is the same as that of steps ST1 to ST3 in the first embodiment. The difference is the vacuum sealing procedure in step ST4. That is, in step ST4, first, the entirety of the detection element container is placed in a vacuum chamber, the atmosphere in the vacuum chamber is evacuated, and a predetermined time elapses while the vacuum is maintained. Extract various gases. Next, the sealing material 12 is placed on the thin portion 13, and the vicinity of the thin portion 13 is heated by, for example, a beam of a hot wire with a pin spot. At this time, the thin portion 13 is easily heated because of its small heat capacity, and has low heat conductivity to the surroundings because of its small thermal conductivity. Therefore, the sealing material 1
2, the temperature rise of the thin portion 13 becomes faster, only this portion is locally heated, and the sealing material 12 can be melted efficiently. Then, when the sealing material 12 melts and closes the vacuum sealing hole 10, it is gradually cooled. Further, the temperature of the container for detecting elements is returned to normal temperature, whereby the sealing material 12 is solidified, and the vacuum sealing is completed.

The operation after the assembling of the detecting element container is the same as that of the first embodiment, and the description is omitted.

As described above, according to the second embodiment, it is possible to obtain an effect that a vacuum device can be achieved in a short time with a heating device having a smaller output. Further, the effect that the molten sealing material 12 does not protrude from the periphery of the vacuum sealing hole 10 and can be sealed with a smaller amount can be obtained.
Therefore, the solder used for the sealing material 12 does not need to be limited to a low temperature. Furthermore, since the heat conduction to the components other than the vacuum sealing portion is small, the effect that the heat-resistant temperature of those components can be reduced can be obtained.

The thermal resistance from the periphery of the vacuum sealing hole 10 heated at the time of vacuum sealing to portions other than the vacuum sealing portion increases as the thin portion 13 is spread outward. Thermal damage to other components such as the optical component 7 and the fixing material 9 can be further reduced. However, since the vacuum holding strength of the lid 5 deteriorates in order to reduce the wall thickness, it is desirable to make the thin portion 13 as wide as possible within a range where the vacuum holding strength is maintained.

The method of spot heating the thin portion 13 is not limited to the above-described method, and a method of installing a heating device such as a laser soldering device inside or outside the vacuum chamber can be adopted.

Embodiment 3 FIG. 4 is an enlarged sectional view showing a vacuum-sealed portion of the detection element container according to Embodiment 3 of the present invention. In the figure, reference numeral 14 denotes a projection substantially perpendicular to the vicinity of the vacuum sealing hole 10 in order to stop an excessive flow when the sealing material 12 provided in the vacuum sealing hole 10 of the thin portion 13 is heated and melted. This is a sealing material flow stopping portion provided. The other configuration is the same as that of the second embodiment, and the description is omitted.

The order of assembling the container for the detecting element is the same as that in steps ST1 to ST4 in the second embodiment, and the description is omitted.

The operation after assembling the container for the detecting element is the same as that in the first embodiment, and the description is omitted.

As described above, according to the third embodiment, the range in which the molten sealing material 12 flows can be reduced by providing the sealing material flow stopping portion 14, and the sealing material 12 The required amount can be reduced, and the effect of easily controlling the thickness of the sealing material 12 can be obtained. Note that the size of the sealing material flow stopping portion 14 is not particularly limited as long as the above-described effect is obtained.

Embodiment 4 FIG. FIG. 5 is an enlarged sectional view showing a vacuum sealed portion of a detection element container according to Embodiment 4 of the present invention. In the figure, 16 is inclined upward from the vicinity of the periphery of the vacuum sealing hole 10 in order to stop excess flow when the sealing material 12 installed in the vacuum sealing hole 10 of the thin portion 13 is heated and melted. This is a sealing material flow stopper provided. The other configuration is the same as that of the second embodiment, and the description is omitted.

The order of assembling the detecting element containers is the same as that in steps ST1 to ST4 in the second embodiment, and a description thereof will be omitted.

The operation after the assembling of the detecting element container is the same as that of the first embodiment, and the description is omitted.

As described above, according to the fourth embodiment, the same effect as that of the third embodiment can be obtained by providing the sealing material flow stopping portion 16 at an inclination, and the sealing material can be sealed at the time of melting and heating. The effect that the stopper 12 can be installed more stably than in the case of the third embodiment is obtained.

Embodiment 5 FIG. FIG. 6 is a plan view showing a lid of a detection element container according to Embodiment 5 of the present invention.
In the figure, reference numeral 18 denotes a positioning portion for determining a position at which the infrared optical component 7 is fixed to a predetermined position on the upper surface 5b of the lid 5. The positioning portion 18 is formed, for example, in an L-shape so as to match the corner portion of the infrared optical component 7, and is welded to a position corresponding to the four corner portions of the infrared optical component 7 fixed to the upper surface 5 b. It is attached in advance by the above method.
The other configuration is the same as that of the second embodiment, and the description is omitted.

The order of assembling the container for the detecting element is the same as that in steps ST1 to ST4 in the first embodiment, and the description is omitted.

The operation after assembling the container for the detecting element is the same as that in the first embodiment, and the description is omitted.

As described above, according to the fifth embodiment, by providing the positioning portion 18, in the step ST2 of fixing the infrared optical component 7 to the lid 5, the positioning can be performed with high accuracy. 9 can be prevented from being displaced in the horizontal direction when the infrared optical component 7 is melted. In the fifth embodiment,
The positioning portion 18 has been described as being provided at a position corresponding to the four corners of the infrared optical component 7, but is not limited thereto, and may be provided so as to correspond to four sides or the entire circumference of the infrared optical component 7. .

Embodiment 6 FIG. FIG. 7 is an enlarged sectional view showing a fixing portion of an infrared optical component according to Embodiment 6 of the present invention. In the figure, reference numeral 20 denotes a concave portion for forming the portion of the upper surface portion 5b to which the infrared optical component 7 is to be fixed so as to be thinner than the periphery thereof, and fitting and positioning the infrared optical component 7 via the fixing material 9 so as to be fixed. The positioning step (positioning unit) provided. That is, the positioning step 20
, So that the infrared optical component 7 can be fitted,
It is formed in an area slightly larger than the outer shape of the infrared optical component 7, and is thinned by, for example, etching. Other configurations are the same as those in the first embodiment, and a description thereof will not be repeated.

The order of assembling the container for the detecting element is the same as that in steps ST1 to ST4 in the first embodiment, and a description thereof will be omitted.

The operation after the assembling of the detection element container is the same as that in the first embodiment, and a description thereof will be omitted.

As described above, according to the sixth embodiment, by providing the positioning step portion 20, in step ST2 of fixing the infrared optical component 7 to the lid 5, the positioning can be performed with high accuracy. It is possible to prevent the material 9 from flowing out to a portion other than the fixing surface, and to obtain an effect of minimizing the amount of the fixing material 9 used. Further, the thickness of the fixing material 9 becomes constant when the fixing material 9 is melted, and the effect of improving the reliability of the degree of vacuum sealing in the positioning step 20 can be obtained.

Embodiment 7 FIG. FIG. 8 is an enlarged sectional view showing a fixing portion of an infrared optical component according to Embodiment 7 of the present invention. In the figure, reference numeral 22 denotes a curved portion formed around the portion of the upper surface portion 5b to which the infrared optical component 7 is to be fixed, so that the infrared optical component 7 can be positioned and fixed by sandwiching the infrared optical component 7 via the fixing material 9. Positioning protrusion (positioning part)
It is formed by, for example, press working. Other configurations are the same as those in the first embodiment, and a description thereof will not be repeated.

The order of assembling the container for the detecting element is the same as that in the steps ST1 to ST4 in the first embodiment, and the description is omitted.

The operation after assembling the container for the detecting element is the same as that in the first embodiment, and the description is omitted.

As described above, according to the seventh embodiment, by providing the positioning projection 22, the infrared optical component 7 can be accurately positioned and fixed in the step ST2 of fixing the infrared optical component 7 to the lid 5. It is possible to prevent the material 9 from flowing out to a portion other than the fixing surface, and to obtain an effect of minimizing the amount of the fixing material 9 used. In addition, the thickness of the fixing material 9 becomes constant when the fixing material 9 is melted, and the effect of improving the reliability of the degree of vacuum sealing at the positioning projection 22 can be obtained. Furthermore, since the thickness of the lid 5 is constant, the strength is strong, and the effect of the positioning projection 22 reinforcing the lid 5 can be obtained. The positioning projection 22 is provided with the lid 5.
Since the upper surface portion 5b can be formed by press working, an effect of easily producing a large amount at low cost can be obtained.

In the seventh embodiment, the position where the positioning projection 22 is formed is limited. However, if the infrared optical component 7 can be positioned, the infrared optical component 7 need not be formed at the above position.

Embodiment 8 FIG. FIG. 9 is a plan view showing a lid according to Embodiment 8 of the present invention. In the figure, 3a
Is a first pin (an output terminal to be used as a reference) which is determined to be the first when a number is assigned to the pin 3. The feature of the eighth embodiment is that the vacuum sealing hole 10 is provided on the upper surface 5b of the lid 5 and vacuum-sealed so as to be located near the first pin 3a when viewed from above. is there. Other configurations are the same as those in the first embodiment.
Description is omitted.

The order of assembling the container for the detecting element is the same as that in steps ST1 to ST4 in the first embodiment, and a description thereof will be omitted.

The operation after the assembling of the detecting element container is the same as that in the first embodiment, and the description is omitted.

As described above, according to the eighth embodiment, the vacuum sealing hole 10 is provided on the upper surface 5b of the lid 5 so as to be located near the first pin 3a when viewed from the upper surface. Since the vacuum sealing is performed, it becomes a mark in the direction in which the detection element container is mounted on the substrate, and an effect of preventing an incorrect mounting position can be obtained. Further, since the vacuum sealing portion serves as a mark, it is possible to obtain an effect that it is not necessary to print a predetermined mark or the like for recognizing the position of the first pin 3a.

In the eighth embodiment, the first pin 3
Although the description has been made assuming that the vacuum sealing hole 10 is provided in the vicinity of “a”, the present invention is not limited to this. If there is a particularly important pin, it may be provided so that the pin can be used as a reference. Further, it is not always necessary to provide the infrared optical component 7 on the same surface as long as it is near the object to be recognized.

Embodiment 9 FIG. 10 is an enlarged sectional view showing a fixing portion of an infrared optical component according to Embodiment 9 of the present invention. In the figure, reference numeral 24 denotes an infrared shielding heat-resistant material (infrared shielding material) that shields infrared light that enters the detection element container from the infrared incident hole 6 during vacuum sealing and can withstand the heating temperature. The infrared optical component 7 is formed in a tape shape having substantially the same size as that of the infrared optical component 7 and is detachably provided on the upper surface of the infrared optical component 7. Other configurations are the same as those in the first embodiment, and a description thereof will not be repeated.

The order of assembling the container for the detection element is the same as that of the steps ST1 to ST3 in the first embodiment, but when the entire container for the detection element is heated by the infrared heating device in step ST4, the container for the infrared shielding is used. The difference is that the heat resistant material 24 is attached on the surface of the infrared optical component 7. Further, as another example of an assembling order, the heat-insulating material for infrared shielding 24 is placed on the surface of the infrared optical component 7 from before step ST2 when the infrared optical component 7 is fixed to the lid 5 until the container for the detection element is actually used. It is also different in that it can be attached to

The operation after the assembling of the detection element container is the same as that in the first embodiment, and the description is omitted.

As described above, according to the ninth embodiment, the infrared ray radiating inside the detecting element container is shielded by attaching the infrared ray shielding heat resistant material 24 on the surface of the infrared optical component 7. The effect of preventing thermal damage to the infrared detecting element 1 can be obtained. Also, before the step ST2 in which the infrared optical component 7 is fixed to the lid 5 and before the detection element container is actually used, the heat insulating material 24 for infrared shielding is stuck on the surface of the infrared optical component 7 by In addition to the effects similar to those described above, the effect that the surface of the infrared optical component 7 can be protected from scratches and contamination can be obtained. Note that the upper surface 5 shown in FIG.
Use a heat collecting device even if a heating device that irradiates the entire surface of the detection element container by covering a portion other than the vacuum sealing portion with the infrared shielding heat resistant material 24 is used. Instead, it is also possible to locally heat only the vacuum sealing portion.

The first to ninth embodiments described above
In the above, the container used for the infrared detecting element 1 has been described, but the present invention is not limited to this, and it is necessary to provide a window for detection and to use various containers that require vacuum sealing. Needless to say, it can be used.

[0071]

As described above, according to the first aspect of the present invention, a container body having a built-in detecting element and having an incident hole through which a detection object is incident, and the container body having a fixing material for closing the incident hole. A detection target selection material fixed to the container body, a sealing hole provided through the container body, and a sealing material having a melting temperature lower than the melting temperature of the fixing material and closing the sealing hole With this configuration, it is easy to assemble, the whole processing apparatus can be made compact, and there is an effect that a highly reliable vacuum sealing container can be obtained easily and quickly.

According to the second aspect of the present invention, there is provided a container body having a built-in detection element and having an entrance hole through which a detection target enters.
A detection target selection member fixed to the container main body so as to cover the incident hole with a fixing material, a sealing hole provided through the container main body, and a melting temperature lower than the melting temperature of the fixing material. And a sealing material that closes the sealing hole, and the thickness of the container body near the sealing hole is formed to be smaller than the thickness of a portion other than the vicinity of the sealing hole. The heat capacity in the vicinity of the sealing hole becomes small and heating becomes easy, and the heat conductivity to the surroundings becomes small due to the small heat conductivity. Therefore, the temperature in the vicinity of the sealing hole rises faster, and only this portion can be locally heated, so that the sealing material can be efficiently melted.

According to the third aspect of the present invention, since the positioning portion for determining the fixed position of the detection target selection material with respect to the container main body is provided on the container main body, the detection target selection material is accurately positioned on the container main body. Therefore, there is an effect that it is possible to prevent the displacement of the detection target selection material when the fixing material is melted.

According to the fourth aspect of the present invention, the positioning portion makes the thickness of the container main body at the portion where the detection target selection material is fixed larger than the thickness of the container main body at the portion where the detection target selection material is not fixed. The detection target selection material is formed to be thin so that the detection target selection material can be fitted, so that the detection target selection material can be accurately positioned on the container body, and the adhesion material can be prevented from flowing out of parts other than the adhesion surface. This has the effect of minimizing the amount of fixing material used. further,
When the fixing material is melted, its thickness becomes constant, and there is an effect that the reliability of the degree of vacuum sealing at the positioning portion is improved.

According to the fifth aspect of the present invention, since the positioning portion is formed in a convex shape capable of contacting any or all of the outer peripheral portion of the detection target selection member, the thickness of the container body is increased. It is possible to easily produce a large amount and inexpensively with a constant thickness, and particularly, there is an effect that the positioning portion reinforces the container body.

According to the sixth aspect of the present invention, since the incident hole and the sealing hole are provided on the same surface of the container body, it is easy to assemble and easily inspect during product inspection. is there.

According to the seventh aspect of the present invention, the sealing hole is
Since the sensor is provided at a position serving as a mark with respect to the output terminal to be used as a reference, the mark serves as a mark in a direction in which the detection element container is mounted on the substrate, and there is an effect that an incorrect mounting position can be prevented. Also, conventionally, a predetermined mark or the like is printed and provided as the mark, but there is an effect that the mark is not required.

According to the eighth aspect of the present invention, the step of fixing the detection element to the container body, the step of fixing the detection target selection material to the container body by the fixing material, and sealing after evacuating from the sealing hole. Since the process comprises a step of heating the stopper and closing the sealing hole, it is easy to assemble, the whole processing apparatus can be made compact, and the highly reliable vacuum sealing can be easily and quickly performed. This is effective in obtaining a method for manufacturing a container for use.

According to the ninth aspect of the present invention, in the step of closing the sealing hole by heating the sealing material after evacuation from the sealing hole, before heating the sealing material, the infrared shielding material may be used. Is provided on the outer surface of the detection target selection material, and the infrared shielding material is removed from the detection target selection material after heating the sealing material, so that heat damage to the components during manufacturing can be easily performed. There is an effect that a method for manufacturing a detection element container that can be prevented can be obtained.

[Brief description of the drawings]

FIG. 1 is a vertical sectional view showing a detection element container according to Embodiment 1 of the present invention.

FIG. 2 is a flowchart illustrating a method for manufacturing a detection element container.

FIG. 3 is an enlarged sectional view showing a vacuum sealed portion of a detection element container according to a second embodiment of the present invention.

FIG. 4 is an enlarged sectional view showing a vacuum sealed portion of a detection element container according to a third embodiment of the present invention.

FIG. 5 is an enlarged sectional view showing a vacuum sealed portion of a detection element container according to a fourth embodiment of the present invention.

FIG. 6 is a plan view showing a lid of a detection element container according to a fifth embodiment of the present invention.

FIG. 7 is an enlarged sectional view showing a fixing portion of an infrared optical component according to a sixth embodiment of the present invention.

FIG. 8 is an enlarged sectional view showing a fixing portion of an infrared optical component according to a seventh embodiment of the present invention.

FIG. 9 is a plan view showing a lid according to Embodiment 8 of the present invention.

FIG. 10 is an enlarged sectional view showing a fixing portion of an infrared optical component according to Embodiment 9 of the present invention.

FIG. 11 is a vertical sectional view showing a conventional detection element container.

[Explanation of symbols]

1 infrared detecting element (detecting element), 1a chip pad (output terminal), 2 base (container main body), 3 pin (output terminal), 3a 1st pin (output terminal to be a reference),
4 wire (output terminal), 5 lid (container body), 6
Infrared incident hole (incident hole), 7 infrared optical component (detection target selection material), 9 fixing material, 10 vacuum sealing hole (sealing hole), 12 sealing material, 18 positioning section, 20 positioning step section (positioning) Part), 22 positioning protrusion (positioning part), 24 heat-resistant material for infrared shielding (infrared shielding material).

Claims (9)

[Claims] 1. A container body having a built-in detection element having an output terminal and having an incident hole through which a detection target enters, and a container that is fixed to the container body so as to cover the incident hole with a fusible fixing material, and is provided with an incident light. A detection target selection material for selecting a detection target to be detected, a sealing hole provided through the container body, and a sealing material having a melting temperature lower than the melting temperature of the fixing material and closing the sealing hole A container for a detection element comprising: 2. A container main body having a built-in detection element having an output terminal and having an incident hole through which a detection target enters, and a container that is fixed to the container main body so as to cover the incident hole with a fusible adhesive, A detection target selection material for selecting a detection target to be detected, a sealing hole provided through the container body, and a sealing material having a melting temperature lower than the melting temperature of the fixing material and closing the sealing hole Wherein the thickness of the container body near the sealing hole is smaller than the thickness of a portion other than the vicinity of the sealing hole. 3. The container for a detection element according to claim 1, wherein a positioning portion for determining a fixing position of the detection target selection member with respect to the container body is provided on the container body. 4. The positioning section, wherein the thickness of the container body at a portion to which the detection target selection material is fixed is formed smaller than the thickness of the container body at a portion to which the detection target selection material is not fixed, and the detection target selection material is selected. The container for a detection element according to claim 3, wherein the container is formed so as to be fitted therein. 5. The container for a detection element according to claim 3, wherein the positioning portion is formed in a convex shape capable of contacting any or all of the outer peripheral portion of the detection target selection material. 6. The detecting element container according to claim 1, wherein the incident hole and the sealing hole are provided on the same surface of the container body. 7. The detecting element according to claim 1, wherein the sealing hole is provided at a position serving as a mark for an output terminal to be used as a reference. container. 8. A step of fixing the detection element to the container body;
A method for manufacturing a container for a detection element, comprising: a step of fixing a detection target selection material to the container body with a fixing material; and a step of heating a sealing material after evacuation from a sealing hole to close the sealing hole. 9. In a step of heating the sealing material after evacuating the sealing hole and closing the sealing hole, an infrared shielding material for shielding infrared rays is selected before heating the sealing material. 9. The method according to claim 8, wherein the infrared shielding material is removed from the detection target selecting material after the sealing material is provided on an outer surface of the material.