JPH1013052A - Electronic device housing - Google Patents

Electronic device housing

Info

Publication number
JPH1013052A
JPH1013052A JP16407796A JP16407796A JPH1013052A JP H1013052 A JPH1013052 A JP H1013052A JP 16407796 A JP16407796 A JP 16407796A JP 16407796 A JP16407796 A JP 16407796A JP H1013052 A JPH1013052 A JP H1013052A
Authority
JP
Japan
Prior art keywords
housing
packing
opening
shim
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16407796A
Other languages
Japanese (ja)
Other versions
JP2751921B2 (en
Inventor
Takashi Ogawa
隆志 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16407796A priority Critical patent/JP2751921B2/en
Publication of JPH1013052A publication Critical patent/JPH1013052A/en
Application granted granted Critical
Publication of JP2751921B2 publication Critical patent/JP2751921B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce the outer dimensions of a part of a housing and realize miniaturization and light weight of an electronic device by attaching a shim which is in press-contact with a wall surface of an opening at an inner side of both housings and can be deformed elastically. SOLUTION: After a shim attaching part 24f of a packing 24 is forced into a packing attaching hole 26a of a shim 25 and the packing 24 is fixed to a first housing 22, a second housing 23 is fixed to the first housing 22 with an opening wall of the second housing 23 faced between both sealing parts 24c, 24d of the packing 24. Then, the first housing 22 and the second housing 23 are sealed by liquid and electromagnetic shielding is carried out as the shim 25 comes into contact with opening wall surfaces 22d, 23d. In the process, a pressing piece 24E of the packing 24 is pressed and deformed between both opening edge faces 22c, 23c and enlarged in a direction (a packing width direction) perpendicular to a pressing direction and the enlarged part comes into close contact with each of the opening edge faces 22c, 23c. Furthermore, each of elastic pieces 27, 28 is elastically deformed and each of bent parts 27a, 28a comes into contact with the opening wall surfaces 22d, 23d.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、デジタルあるいは
アナログ信号処理を行う通信機器等に使用して好適な電
子機器筐体に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device housing suitable for use in communication equipment for performing digital or analog signal processing.

【0002】[0002]

【従来の技術】一般に、電子機器には、電磁波障害対策
上および雨水浸入対策上から、機器筐体を電磁遮蔽(不
要輻射の漏洩や侵入を阻止)すると共に、液封すること
が要求されている。
2. Description of the Related Art In general, electronic equipment is required to be electromagnetically shielded (to prevent unnecessary radiation from leaking or entering) and to be liquid-sealed in order to prevent electromagnetic wave interference and rainwater intrusion. I have.

【0003】従来、この種の電子機器筐体は、例えば実
開平4−111785号公報に「筐体の防水・導電構
造」として開示されており、図5に示すように構成され
ている。これを同図に基づいて説明すると、同図におい
て、符号1で示す電子機器筐体は、箱体2と蓋体3とパ
ッキン4と弾性片5とを備えている。
Conventionally, this type of electronic equipment housing is disclosed in, for example, Japanese Utility Model Application Laid-Open No. 4-111785 as "waterproof / conductive structure of housing" and is configured as shown in FIG. This will be described with reference to the same drawing. In the same drawing, an electronic device housing denoted by reference numeral 1 includes a box 2, a cover 3, a packing 4, and an elastic piece 5.

【0004】箱体2は一方に開口する開口部2aを有す
る導電性部材からなる箱体によって形成されており、内
部には電子部品実装基板(図示せず)等が収納されてい
る。箱体2の外側開口周縁には、先端面に開口するねじ
穴6aを有するスタット6が立設されている。
The box 2 is formed of a box made of a conductive member having an opening 2a opened on one side, and houses an electronic component mounting board (not shown) and the like inside. A stat 6 having a screw hole 6a opening at the tip end surface is provided upright on the outer peripheral edge of the outer opening of the box body 2.

【0005】蓋体3は、ねじ穴6aに螺合する取付ねじ
7によって箱体2に対し開閉自在に固定されており、箱
体2と同様に箱状の導電性部材によって形成されてい
る。この蓋体3の裏面には、開口部2aの開口周縁に沿
って延在するパッキン取付用溝8を形成する内外2つの
L字状金属枠9,10が取り付けられている。また、蓋
体3には、取付ねじ7が挿通するねじ挿通孔3aが設け
られている。
[0005] The lid 3 is fixed to the box 2 so as to be openable and closable by mounting screws 7 screwed into the screw holes 6a, and is formed of a box-shaped conductive member like the box 2. Two L-shaped metal frames 9, 10 inside and outside forming a packing mounting groove 8 extending along the periphery of the opening 2 a are mounted on the back surface of the lid 3. The cover 3 is provided with a screw insertion hole 3a through which the mounting screw 7 is inserted.

【0006】パッキン4は、先端部を開口部2aの開口
周縁に圧接させパッキン取付用溝8内に装着されてお
り、全体がゴム等からなる平面視枠状の可撓性部材によ
って形成されている。
The gasket 4 is mounted in the gasket mounting groove 8 with its front end pressed against the periphery of the opening 2a, and is entirely formed of a frame-like flexible member made of rubber or the like. I have.

【0007】弾性片5は、スリット11を介して並列す
る多数のカール部12a,13aを有する内外2つの導
電片12,13からなり、L字状金属枠9,10に対し
て各カール部12a,13aを開口部2aの開口周縁に
圧接させ装着されている。
The elastic piece 5 comprises two inner and outer conductive pieces 12 and 13 having a large number of curled portions 12a and 13a arranged in parallel through a slit 11, and each of the curled portions 12a with respect to the L-shaped metal frames 9 and 10. , 13a are pressed against the periphery of the opening 2a.

【0008】この弾性片5(導電片12,13)によっ
て、箱体2と蓋体3とが導通し、かつパッキン取付用溝
8外のパッキン4が挟圧保持される。
By the elastic pieces 5 (conductive pieces 12 and 13), the box 2 and the lid 3 are electrically connected, and the packing 4 outside the packing mounting groove 8 is pressed and held.

【0009】このように構成された電子機器筐体1を電
磁遮蔽すると共に、液封するには、L字状金属枠9の内
側およびL字状金属枠10の外側に各々導電片12,1
3を装着し、次いでパッキン取付用溝8内に導電片1
2,13を押し広げてパッキン4を装着し、しかる後蓋
体3を箱体2に取付ねじ7によって固定することにより
行う。
In order to electromagnetically shield and liquid seal the electronic device housing 1 configured as described above, conductive pieces 12 and 1 are provided inside the L-shaped metal frame 9 and outside the L-shaped metal frame 10, respectively.
3 and then insert the conductive piece 1 into the packing mounting groove 8.
The packing 2 is mounted by pushing and spreading the packings 2 and 13, and then the lid 3 is fixed to the box 2 with the mounting screws 7.

【0010】これにより、パッキン4の先端部が押圧変
形して押圧方向と直角な方向(パッキン幅方向)に広が
り、この広がり部分が開口部2aの開口周縁に密接する
と共に、各導電片12,13が弾性変形してカール部1
2a,13aが圧接する。
As a result, the tip end of the packing 4 is pressed and deformed and spreads in a direction perpendicular to the pressing direction (the packing width direction), and this expanded portion comes into close contact with the opening periphery of the opening 2a, and the conductive pieces 12 and 13 is elastically deformed and the curl portion 1 is deformed.
2a and 13a are pressed.

【0011】[0011]

【発明が解決しようとする課題】ところで、従来の電子
機器筐体においては、蓋体3の裏面と開口部2aの開口
周縁との間に液封用のパッキン4と電磁遮蔽用の弾性片
5(導電片12,13)が配設される構造であるため、
パッキン4による封止部と導電片12,13による導通
部が電子部品実装領域内で行われていた。
By the way, in the conventional electronic device housing, a liquid seal packing 4 and an electromagnetic shielding elastic piece 5 are provided between the back surface of the lid 3 and the periphery of the opening 2a. (Conductive pieces 12, 13) are arranged,
The sealing part by the packing 4 and the conduction part by the conductive pieces 12 and 13 have been formed in the electronic component mounting area.

【0012】この結果、箱体2内の部品実装容積を変更
しないためには、箱体2の外形寸法が大きくなり、電子
機器が大型・重量化するという問題があった。
As a result, in order not to change the component mounting volume in the box 2, there is a problem that the outer dimensions of the box 2 become large and the electronic equipment becomes large and heavy.

【0013】本発明はこのような事情に鑑みてなされた
もので、筐体一部の外形寸法を短縮することができ、も
って電子機器の小型・軽量化を図ることができる電子機
器筐体の提供を目的とするものである。
SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and it is possible to reduce the outer dimensions of a part of the housing, thereby reducing the size and weight of the electronic equipment. It is intended to be provided.

【0014】[0014]

【課題を解決するための手段】上記目的を達成するた
め、本発明の請求項1記載の電子機器筐体は、第1開口
部を有する導電性部材からなる第1筐体と、この第1筐
体に開閉自在に設けられ第2開口部を有する導電性部材
からなる第2筐体と、この第2筐体と第1筐体との間に
介装され両開口部の開口端面と開口壁面に密接可能な封
止部を有するパッキンと、このパッキンに取り付けられ
両筐体の内外両開口壁面のうち内側の開口壁面に圧接す
る弾性変形可能なシムとを備えた構成としてある。した
がって、第1筐体および第2筐体がパッキンの開口壁面
および開口端面への密接によって液封されると共に、シ
ムの両筐体の内側開口壁面への接触によって電磁遮蔽さ
れる。
According to a first aspect of the present invention, there is provided an electronic apparatus housing, comprising: a first housing made of a conductive member having a first opening; A second housing made of a conductive member having a second opening and capable of being opened and closed in the housing, and an opening end face and an opening interposed between the second housing and the first housing; The structure includes a packing having a sealing portion that can be in close contact with the wall surface, and an elastically deformable shim attached to the packing and pressed against the inner opening wall surface of both the inner and outer opening wall surfaces of both housings. Therefore, the first housing and the second housing are liquid-sealed by the close contact with the opening wall surface and the opening end surface of the packing, and are electromagnetically shielded by the contact of the shim with the inner opening wall surfaces of both housings.

【0015】請求項2記載の発明は、請求項1記載の電
子機器筐体において、シムがパッキンに対する取付部と
なるシム本体と、このシム本体に一体に形成され両筐体
の開口壁面に圧接する多数の弾性片とからなる構成とし
てある。したがって、第1筐体および第2筐体の電磁遮
蔽が両筐体の内側開口壁面に対する弾性片の接触によっ
て行われる。
According to a second aspect of the present invention, there is provided the electronic apparatus housing according to the first aspect, wherein the shim is a mounting portion for the packing and the shim body is formed integrally with the shim body and pressed against the opening wall surfaces of both housings. And a large number of elastic pieces. Therefore, the electromagnetic shielding of the first housing and the second housing is performed by the contact of the elastic pieces with the inner opening wall surfaces of the two housings.

【0016】請求項3記載の発明は、請求項2記載の電
子機器筐体において、各弾性片がシムの両端縁に多数の
スリットを設けることにより形成されている構成として
ある。したがって、第1筐体および第2筐体の電磁遮蔽
が両筐体の内側開口壁面に対する各弾性片の接触によっ
て行われる。
According to a third aspect of the present invention, in the electronic device housing of the second aspect, each elastic piece is formed by providing a large number of slits at both end edges of the shim. Therefore, the electromagnetic shielding of the first housing and the second housing is performed by the contact of each elastic piece with the inner opening wall surface of both housings.

【0017】請求項4記載の発明は、請求項1記載の電
子機器筐体において、パッキンの封止部に両筐体の開口
端面に対応する押圧子を設けた構成としてある。したが
って、両筐体の開口端面間における液封が各開口端面に
対する押圧子の密接によって行われる。
According to a fourth aspect of the present invention, in the electronic device housing according to the first aspect, a pressing member corresponding to an opening end surface of both housings is provided in a sealing portion of the packing. Therefore, liquid sealing between the open end faces of both housings is performed by the close contact of the presser to each open end face.

【0018】請求項5記載の発明は、請求項1または請
求項4記載の電子機器筐体において、パッキンが両筐体
の内外開口壁面に対応する押圧部を有する断面視ほぼH
字形状のパッキンによって形成されている構成としてあ
る。したがって、両筐体の内外開口壁面における液封が
各開口壁面に対する各押圧部の密接によって行われる。
According to a fifth aspect of the present invention, there is provided the electronic apparatus housing according to the first or fourth aspect, wherein the packing has a pressing portion corresponding to the inner and outer opening wall surfaces of the two housings in a substantially H-section view.
It is configured to be formed by a letter-shaped packing. Therefore, liquid sealing on the inner and outer opening wall surfaces of both housings is performed by close contact of each pressing portion with each opening wall surface.

【0019】請求項6記載の発明は、請求項1または請
求項4記載の電子機器筐体において、パッキンが第1筐
体の内外開口壁面および第2筐体の外側開口壁面に対応
する押圧部を有する断面視ほぼh字形状のパッキンによ
って形成されている構成としてある。したがって、第1
筐体の内外開口壁面および第2筐体の外側開口壁面にお
ける液封が各開口壁面に対する各押圧部の密接によって
行われる。
According to a sixth aspect of the present invention, in the electronic device housing according to the first or fourth aspect, the packings correspond to the inner and outer opening walls of the first housing and the outer opening walls of the second housing. , And is formed by a packing having a substantially h-shaped cross section when viewed from above. Therefore, the first
Liquid sealing on the inner and outer opening wall surfaces of the housing and the outer opening wall surface of the second housing is performed by the close contact of each pressing portion to each opening wall surface.

【0020】請求項7記載の発明は、請求項1または請
求項4記載の電子機器筐体において、パッキンが両筐体
の外側開口壁面に対応する押圧部を有する断面視ほぼT
字形状のパッキンによって形成されている構成としてあ
る。したがって、両筐体の外側開口壁面における液封が
各開口壁面に対する各押圧部の密接によって行われる。
According to a seventh aspect of the present invention, there is provided the electronic device housing according to the first or fourth aspect, wherein the packing has a pressing portion corresponding to the outer opening wall surface of both housings in a substantially sectional view.
It is configured to be formed by a letter-shaped packing. Therefore, the liquid sealing on the outer opening wall surfaces of both housings is performed by the close contact of each pressing portion to each opening wall surface.

【0021】[0021]

【発明の実施の形態】以下、本発明の第1の実施形態に
係る電子機器筐体につき、図1および図2を参照して説
明する。図1は本発明の第1の実施形態に係る電子機器
筐体の要部を示す縦断面図、図2は本発明の第1の実施
形態に係る電子機器の外観を示す斜視図である。同図に
おいて、符号21で示す電子機器筐体は、第1筐体22
と第2筐体23とパッキン24とシム25とを備えてい
る。この電子機器筐体21内には電子部品実装基板(図
示せず)等が収納される。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic apparatus housing according to a first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a longitudinal sectional view showing a main part of an electronic device housing according to the first embodiment of the present invention, and FIG. 2 is a perspective view showing an external appearance of the electronic device according to the first embodiment of the present invention. In the figure, an electronic device housing denoted by reference numeral 21 is a first housing 22.
, A second housing 23, a packing 24, and a shim 25. An electronic component mounting board (not shown) and the like are housed in the electronic device housing 21.

【0022】第1筐体22は、上方に開口する第1開口
部22aを有する導電性部材からなる角箱体によって形
成されている。この第1筐体22には、開口壁外側部を
切り欠くことにより段状面22bが形成されている。そ
して、第1筐体22には、パッキン24およびシム25
の装着部となる開口端面22cと内外2つの開口壁面2
2d,22eが形成されている。
The first housing 22 is formed of a rectangular box made of a conductive member having a first opening 22a opening upward. The first housing 22 has a stepped surface 22b formed by cutting out the outside of the opening wall. The first housing 22 includes a packing 24 and a shim 25.
End face 22c serving as a mounting portion for the vehicle and two inner and outer opening wall surfaces 2
2d and 22e are formed.

【0023】第2筐体23は、第1筐体22に開閉自在
に設けられており、下方に開口する第2開口部23aを
有する導電性部材からなる角箱体によって形成されてい
る。この第2筐体23には、開口壁外側部を切り欠くこ
とにより段状面23bが形成されている。そして、第2
筐体23には、第1筐体22と同様にパッキン24およ
びシム25の装着部となる開口端面23cと内外2つの
開口壁面23d,23eが形成されている。
The second housing 23 is provided on the first housing 22 so as to be openable and closable, and is formed of a square box made of a conductive member having a second opening 23a that opens downward. The second housing 23 has a stepped surface 23b formed by cutting out the outside of the opening wall. And the second
Similarly to the first housing 22, the housing 23 has an opening end surface 23c as a mounting portion for the packing 24 and the shim 25, and two inner and outer opening wall surfaces 23d and 23e.

【0024】パッキン24は、第1筐体22と第2筐体
23との間に介装されており、全体が第1開口部22a
の開口端面22cと開口壁面22d,22eおよび第2
開口部23aの開口端面23cと開口壁面23d,23
eに密接可能な封止部24a〜24eを有し、開口壁面
22d,23dから離間する方向に突出するシム取付部
24fを含む断面視ほぼH字形状の可撓性部材によって
形成されている。
The packing 24 is interposed between the first housing 22 and the second housing 23, and has a first opening 22a as a whole.
Opening end face 22c and opening wall faces 22d, 22e and the second
Opening end surface 23c of opening 23a and opening wall surfaces 23d, 23
e, and is formed of a flexible member having a substantially H-shape in cross section including a shim mounting portion 24f that has sealing portions 24a to 24e that can be brought into close contact with e and that protrudes in a direction away from the opening wall surfaces 22d and 23d.

【0025】これら封止部24a〜24eのうち封止部
24a〜24dは、各々対応する開口壁面22d,22
e,23d,23eを押圧する方向に若干反って湾曲形
成されている。これら封止部24a〜24dの先端部に
は、各開口壁面22d,22e,23d,23eに対応
する押圧部24A〜24Dが設けられている。
Of these sealing portions 24a to 24e, the sealing portions 24a to 24d are respectively formed by the corresponding opening wall surfaces 22d, 22d.
e, 23d, and 23e are slightly curved in the direction of pressing. Pressing portions 24A to 24D corresponding to the respective opening wall surfaces 22d, 22e, 23d, and 23e are provided at the tips of the sealing portions 24a to 24d.

【0026】封止部24eには、両開口部22a,23
aの開口端面22c,23cに対応する押圧子24Eが
設けられている。
The sealing portion 24e has two openings 22a, 23
The pressing element 24E corresponding to the opening end faces 22c and 23c of FIG.

【0027】シム取付部24fは、パッキン長手方向に
並列する多数の突子によって構成されている。
The shim mounting portion 24f is composed of a number of protrusions arranged in parallel in the longitudinal direction of the packing.

【0028】シム25は、各シム取付部24fに対応す
る多数のパッキン取付孔26aを有するシム本体26
と、第1筐体22の開口壁面22dおよび第2筐体23
の開口壁面23dに圧接する折曲部27a,28aを有
する多数の弾性片27,28とからなる金属等の導電部
材によって形成されている。
The shim 25 is a shim body 26 having a number of packing mounting holes 26a corresponding to the respective shim mounting portions 24f.
And the opening wall surface 22d of the first housing 22 and the second housing 23
And a plurality of elastic pieces 27 and 28 having bent portions 27a and 28a pressed against the opening wall surface 23d.

【0029】シム本体26は、パッキン取付孔26aに
シム取付部24fを圧入することによりパッキン24に
対して取り付けられている。
The shim body 26 is attached to the packing 24 by press-fitting the shim attaching portion 24f into the packing attaching hole 26a.

【0030】各弾性片27,28は、シム25の両端縁
に多数のスリット29を設けることにより一体に形成さ
れている。
Each of the elastic pieces 27 and 28 is integrally formed by providing a large number of slits 29 at both ends of the shim 25.

【0031】このように構成された電子機器筐体におい
ては、予めシム25のパッキン取付孔26aにパッキン
24のシム取付部24fを圧入してシム25とパッキン
24を一体化し、パッキン24の両封止部間24a,2
4b間に第1筐体22の開口壁を臨ませて第1筐体22
にパッキン24を装着した後、パッキン24の両封止部
24c,24d間に第2筐体23の開口壁を臨ませて第
1筐体22に第2筐体23を装着すると、第1筐体22
および第2筐体23がパッキン24(押圧部24A〜2
4D,押圧子24E)の開口端面22c,23cと開口
壁面22d,22e,23d,23eへの密接によって
液封されると共に、シム25(弾性片27,28の折曲
部27a,28a)の開口壁面22d,23dへの接触
によって電磁遮蔽される。
In the electronic device housing thus constructed, the shim 25 and the packing 24 are integrated by pressing the shim mounting portion 24f of the packing 24 into the packing mounting hole 26a of the shim 25 in advance. 24a, 2 between stop parts
4b with the opening wall of the first housing 22 facing the first housing 22.
After the packing 24 is mounted on the first housing 22, the second housing 23 is mounted on the first housing 22 with the opening wall of the second housing 23 facing between the sealing portions 24c and 24d of the packing 24. Body 22
And the second housing 23 is provided with a packing 24 (pressing portions 24A to 2A).
4D, the sealing is performed by the close contact between the opening end surfaces 22c, 23c of the pressing element 24E) and the opening wall surfaces 22d, 22e, 23d, 23e, and the opening of the shim 25 (the bent portions 27a, 28a of the elastic pieces 27, 28). Electromagnetic shielding is achieved by contact with the wall surfaces 22d and 23d.

【0032】このとき、パッキン24の押圧子24E
は、両開口端面22c,23c間において押圧変形して
押圧方向と直角な方向(パッキン幅方向)に広がり、こ
の広がり部分が各開口端面22c,23cに密接する。
また、各弾性片27,28は、弾性変形して各折曲部2
7a,28aが開口壁面22d,23dに接触する。
At this time, the pressing element 24E of the packing 24
Is pressed and deformed between the two open end faces 22c and 23c and spreads in a direction perpendicular to the pressing direction (the packing width direction), and the expanded portion comes into close contact with each of the open end faces 22c and 23c.
Further, each of the elastic pieces 27 and 28 is elastically deformed so that each of the bent portions 2
7a and 28a contact the opening wall surfaces 22d and 23d.

【0033】次に、本発明の第2の実施形態および第3
の実施形態につき、図3と図4を用いて説明する。 (第2の実施形態)図3は本発明の第2の実施形態に係
る電子機器筐体の要部を示す断面図で、同図において図
1および図2と同一の部材については同一の符号を付
し、詳細な説明は省略する。同図において、符号31で
示す電子機器筐体は、第1筐体22と第2筐体23とパ
ッキン32とシム25とを備えている。
Next, the second embodiment and the third embodiment of the present invention will be described.
The embodiment will be described with reference to FIGS. 3 and 4. FIG. (Second Embodiment) FIG. 3 is a cross-sectional view showing a main part of an electronic apparatus housing according to a second embodiment of the present invention. In FIG. 3, the same members as those in FIGS. And a detailed description is omitted. In the figure, an electronic device housing denoted by reference numeral 31 includes a first housing 22, a second housing 23, a packing 32, and a shim 25.

【0034】パッキン32は、第1筐体22と第2筐体
23との間に介装されており、全体が第1開口部22a
の開口端面22cと開口壁面22eおよび第2開口部2
3aの開口端面23cと開口壁面23d,23eに密接
可能な封止部32a〜32dを有し、開口壁面22d,
23dから離間する方向に突出するシム取付部32eを
含む断面視ほぼh字形状の可撓性部材によって形成され
ている。
The packing 32 is interposed between the first housing 22 and the second housing 23, and has a first opening 22a as a whole.
End face 22c and opening wall face 22e of the first and second openings 2
3a has sealing portions 32a to 32d that can be in close contact with the opening end surface 23c and the opening wall surfaces 23d and 23e.
It is formed of a flexible member having a substantially h-shaped cross section including a shim mounting portion 32e protruding in a direction away from 23d.

【0035】これら封止部32a〜32dのうち封止部
32a〜32cは、各々対応する開口壁面22e,23
d,23eを押圧する方向に若干反って湾曲形成されて
いる。これら封止部32a〜32cの先端部には、各開
口壁面22e,23d,23eに対応する押圧部32A
〜32Cが設けられている。
Of the sealing portions 32a to 32d, the sealing portions 32a to 32c correspond to the opening wall surfaces 22e and 23, respectively.
It is slightly curved in the direction to press d and 23e. Pressing portions 32A corresponding to the respective opening wall surfaces 22e, 23d, and 23e are provided at the tips of the sealing portions 32a to 32c.
To 32C are provided.

【0036】封止部32dには、両開口部22a,23
aの開口端面22c,23cに対応する押圧子32Dが
設けられている。
The sealing portion 32d has both openings 22a, 23
A pressing element 32D corresponding to the opening end faces 22c and 23c of FIG.

【0037】なお、本実施形態における電子機器筐体の
液封および電磁遮蔽は、第1の実施形態と同様にして行
われるから、その説明については省略する。
The liquid sealing and electromagnetic shielding of the housing of the electronic device according to the present embodiment are performed in the same manner as in the first embodiment, and a description thereof will be omitted.

【0038】(第3の実施形態)図4は本発明の第3実
施形態に係る電子機器筐体の要部を示す断面図で、図1
および図2と同一の部材については同一の符号を付し、
詳細な説明は省略する。同図において、符号41で示す
電子機器筐体は、第1筐体22と第2筐体23とパッキ
ン42とシム25とを備えている。
(Third Embodiment) FIG. 4 is a sectional view showing a main part of an electronic apparatus housing according to a third embodiment of the present invention.
2 and the same members as those in FIG.
Detailed description is omitted. In the figure, an electronic device housing indicated by reference numeral 41 includes a first housing 22, a second housing 23, a packing 42, and a shim 25.

【0039】パッキン42は、第1筐体22と第2筐体
23との間に介装されており、全体が第1開口部22a
の開口端面22cと開口壁面22eおよび第2開口部2
3aの開口端面23cと開口壁面23eに密接可能な封
止部42a〜42cを有し、開口壁面22d,23dか
ら離間する方向に突出するシム取付部42dを含む断面
視ほぼT字形状の可撓性部材によって形成されている。
The packing 42 is interposed between the first housing 22 and the second housing 23, and has a first opening 22a as a whole.
End face 22c and opening wall face 22e of the first and second openings 2
3a, which has sealing portions 42a to 42c that can be in close contact with the opening end surface 23c and the opening wall surface 23e, and includes a shim mounting portion 42d protruding in a direction away from the opening wall surfaces 22d, 23d. It is formed by a sex member.

【0040】これら封止部42a〜42cのうち封止部
42aおよび42bは、各々対応する開口壁面22e,
23eを押圧する方向に若干反って湾曲形成されてい
る。これら封止部42a,42bの先端部には、各開口
壁面22e,23eに対応する押圧部42A,42Bが
設けられている。
Of the sealing portions 42a to 42c, the sealing portions 42a and 42b are respectively provided with the corresponding opening wall surfaces 22e,
23e is curved slightly in the direction of pressing. Pressing portions 42A, 42B corresponding to the respective opening wall surfaces 22e, 23e are provided at the distal ends of the sealing portions 42a, 42b.

【0041】封止部42cには、両開口部22a,23
aの開口端面22c,23cに対応する押圧子42Cが
設けられている。
The sealing portion 42c has two openings 22a, 23
A pressing element 42C corresponding to the opening end faces 22c and 23c of FIG.

【0042】なお、本実施形態における電子機器筐体の
液封および電磁遮蔽は、第1の実施形態と同様にして行
われるから、その説明については省略する。
Note that the liquid sealing and electromagnetic shielding of the electronic device housing in the present embodiment are performed in the same manner as in the first embodiment, and a description thereof will be omitted.

【0043】上述した各実施形態においては、通信機器
に使用する例について説明したが、本発明はこれに限定
されず、他の電子機器にも使用できることは勿論であ
る。
In each of the embodiments described above, an example in which the present invention is used for a communication device has been described. However, the present invention is not limited to this, and it goes without saying that the present invention can be used for other electronic devices.

【0044】[0044]

【発明の効果】以上説明したように本発明によれば、第
1開口部を有する導電性部材からなる第1筐体と、この
第1筐体に開閉自在に設けられ第2開口部を有する導電
性部材からなる第2筐体と、この第2筐体と第1筐体と
の間に介装され両開口部の開口端面と開口壁面に密接可
能な封止部を有するパッキンと、このパッキンに取り付
けられ両筐体の内外両開口壁面のうち内側の開口壁面に
圧接する弾性変形可能なシムとを備えたので、第1筐体
および第2筐体がパッキンの開口壁面および開口端面へ
の密接によって液封されると共に、シムの両筐体の内側
開口壁面への接触によって電磁遮蔽される。
As described above, according to the present invention, a first housing made of a conductive member having a first opening, and a second opening provided in the first housing so as to be openable and closable are provided. A second housing made of a conductive member, a packing interposed between the second housing and the first housing, and having a sealing portion capable of closely contacting the opening end surfaces and the opening wall surfaces of both openings; An elastically deformable shim that is attached to the packing and presses against the inner opening wall surface of the inner and outer opening walls of both housings, so that the first housing and the second housing are moved to the opening wall surface and the opening end surface of the packing; And the electromagnetically shielded by contact of the shim with the inner opening wall surfaces of both housings.

【0045】したがって、パッキンによる封止とシムに
よる導通を電子部品実装領域外で行うことができるか
ら、筐体一部の外形寸法を短縮することができ、電子機
器の小型・軽量化を図ることができる。
Therefore, since the sealing by the packing and the conduction by the shim can be performed outside the electronic component mounting area, the external dimensions of a part of the housing can be reduced, and the size and weight of the electronic device can be reduced. Can be.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施形態に係る電子機器筐体の
要部を示す断面図である。
FIG. 1 is a cross-sectional view illustrating a main part of an electronic device housing according to a first embodiment of the present invention.

【図2】本発明の第1の実施形態に係る電子機器筐体の
外観を示す斜視図である。
FIG. 2 is a perspective view showing an external appearance of an electronic device housing according to the first embodiment of the present invention.

【図3】本発明の第2の実施形態に係る電子機器筐体を
示す断面図である。
FIG. 3 is a cross-sectional view illustrating an electronic device housing according to a second embodiment of the present invention.

【図4】本発明の第3の実施形態に係る電子機器筐体を
示す断面図である。
FIG. 4 is a cross-sectional view illustrating an electronic device housing according to a third embodiment of the present invention.

【図5】従来における電子機器筐体を示す断面図であ
る。
FIG. 5 is a cross-sectional view illustrating a conventional electronic device housing.

【符号の説明】 21 電子機器筐体 22 第1筐体 22a 第1開口部 22c 開口端面 22d,22e 開口壁面 23 第2筐体 23a 第2開口部 23c 開口端面 23d,23e 開口壁面 24 パッキン 24a〜24e 封止部 24E 押圧子 25 シム 26 シム本体 27,28 弾性片DESCRIPTION OF SYMBOLS 21 Electronic device housing 22 First housing 22a First opening 22c Opening end surface 22d, 22e Opening wall surface 23 Second housing 23a Second opening 23c Opening end surface 23d, 23e Opening wall surface 24 Packing 24a- 24e Sealing part 24E Presser 25 Shim 26 Shim body 27, 28 Elastic piece

Claims (7)

【特許請求の範囲】[Claims] 【請求項1】 第1開口部を有する導電性部材からなる
第1筐体と、 この第1筐体に開閉自在に設けられ、第2開口部を有す
る導電性部材からなる第2筐体と、 この第2筐体と上記第1筐体との間に介装され、上記両
開口部の開口端面と開口壁面に密接可能な封止部を有す
るパッキンと、 このパッキンに取り付けられ、上記両筐体の内外両開口
壁面のうち内側の開口壁面に圧接する弾性変形可能なシ
ムとを備えたことを特徴とする電子機器筐体。
A first housing made of a conductive member having a first opening; and a second housing made of a conductive member having a second opening and provided on the first housing so as to be openable and closable. A packing interposed between the second housing and the first housing, the packing having a sealing portion capable of being in close contact with the opening end surfaces and the opening wall surfaces of the opening portions; An electronic device housing comprising: an elastically deformable shim that presses against an inner opening wall surface of both inner and outer opening walls of the housing.
【請求項2】 上記シムは、 上記パッキンに対する取付部となるシム本体と、 このシム本体に一体に形成され、上記両筐体の開口壁面
に圧接する多数の弾性片とによって構成されていること
を特徴とする請求項1記載の電子機器筐体。
2. The shim includes a shim main body serving as a mounting portion for the packing, and a number of elastic pieces formed integrally with the shim main body and pressed against the opening wall surfaces of the two housings. The electronic device housing according to claim 1, wherein:
【請求項3】 上記弾性片は、上記シムの両端縁に多数
のスリットを設けることにより形成されていることを特
徴とする請求項2記載の電子機器筐体。
3. The electronic device housing according to claim 2, wherein said elastic piece is formed by providing a large number of slits at both end edges of said shim.
【請求項4】上記パッキンの封止部には、上記両筐体の
開口端面に対応する押圧子が設けられていることを特徴
とする請求項1記載の電子機器筐体。
4. The electronic device housing according to claim 1, wherein a presser corresponding to an opening end face of each of the housings is provided at a sealing portion of the packing.
【請求項5】 上記パッキンは、上記両筐体の内外開口
壁面に対応する押圧部を有する断面視ほぼH字形状のパ
ッキンによって形成されていることを特徴とする請求項
1または請求項4記載の電子機器筐体。
5. The packing according to claim 1, wherein the packing is formed of a packing having a substantially H-shaped cross section when the packing has pressing portions corresponding to the inner and outer opening walls. Electronic equipment housing.
【請求項6】 上記パッキンは、上記第1筐体の内外開
口壁面および上記第2筐体の外側開口壁面に対応する押
圧部を有する断面視ほぼh字形状のパッキンによって形
成されていることを特徴とする請求項1または請求項4
記載の電子機器筐体。
6. The packing is formed by a packing having a substantially h-shaped cross-section having a pressing portion corresponding to the inner and outer opening wall surfaces of the first housing and the outer opening wall surface of the second housing. Claim 1 or Claim 4 characterized by the above-mentioned.
The electronic device casing according to the above.
【請求項7】 上記パッキンは、上記両筐体の外側開口
壁面に対応する押圧部を有する断面視ほぼT字形状のパ
ッキンによって形成されていることを特徴とする請求項
1または請求項4記載の電子機器筐体。
7. The packing according to claim 1, wherein the packing is formed by a packing having a substantially T-shaped cross-section having a pressing portion corresponding to an outer opening wall surface of the both housings. Electronic equipment housing.
JP16407796A 1996-06-25 1996-06-25 Electronic equipment housing Expired - Lifetime JP2751921B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16407796A JP2751921B2 (en) 1996-06-25 1996-06-25 Electronic equipment housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16407796A JP2751921B2 (en) 1996-06-25 1996-06-25 Electronic equipment housing

Publications (2)

Publication Number Publication Date
JPH1013052A true JPH1013052A (en) 1998-01-16
JP2751921B2 JP2751921B2 (en) 1998-05-18

Family

ID=15786349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16407796A Expired - Lifetime JP2751921B2 (en) 1996-06-25 1996-06-25 Electronic equipment housing

Country Status (1)

Country Link
JP (1) JP2751921B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008022558A1 (en) * 2006-08-17 2008-02-28 Zhejiang Chint Electrics Co., Ltd Mounting and fixing apparatus of analog-to-digital electrical equipment
JP2014072368A (en) * 2012-09-28 2014-04-21 Shindengen Electric Mfg Co Ltd Electromagnetic shielding structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008022558A1 (en) * 2006-08-17 2008-02-28 Zhejiang Chint Electrics Co., Ltd Mounting and fixing apparatus of analog-to-digital electrical equipment
US8576579B2 (en) 2006-08-17 2013-11-05 Zhejiang Chint Electrics Co., Ltd. Mounting and fixing apparatus for analog-to-digital electrical equipment
JP2014072368A (en) * 2012-09-28 2014-04-21 Shindengen Electric Mfg Co Ltd Electromagnetic shielding structure

Also Published As

Publication number Publication date
JP2751921B2 (en) 1998-05-18

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