JPH1012776A - Connecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attach a passive device easily in a short time. SOLUTION: An attaching portion 20 for detachably connecting a power supply noise preventing capacitor 5 to a main body 11 is provided to a connecting device 10, and the attaching portion 20 for connecting the capacitor 5 is respectively connected electrically to a contact member 13 for connecting a power supply wiring 33a among a group of contact members 13 of the connecting device 10 and to the contact member 13 for connecting ground wiring 33b. By providing a capacitor attaching portion to a connecting device, a capacitor replacement work for filtering out power supply noise can be simply executed, so that capacitor replacing work time can be shortened, electrical characteristics test time can be reduced, and test accuracy can be improved. By abolishing a solder bump portion, the occurrence of parasitic capacity, parasitic resistance and inductance components of the solder bump portion can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting ICs to a tester, for example, in a screening test or a screening test for non-defective products in a semiconductor integrated circuit device (hereinafter referred to as IC) manufacturing factory. The present invention relates to a technology effective for a connection device used for connection.

[0002]

2. Description of the Related Art In general, when a screening test and a screening test for non-defective and defective ICs are performed in an IC manufacturing factory, the IC uses a connection device called an IC socket (hereinafter, also referred to as an IC socket). Used to be electrically connected to the tester of the screening tester or screening tester. When a screening test or a screening test is performed, the IC socket is mounted on a testing board of the screening test device or the screening test device.
The IC socket is configured so that an IC to be connected can be removably mounted. The IC socket is electrically connected to a tester of a screening inspection device or a screening test device through each contact member that contacts each outer lead of the IC. Connection is made.

In such a screening test or screening test, if noise is present in the power supplied to the IC to be tested, a proper and accurate test cannot be ensured. Therefore, conventionally, a capacitor as a passive element for preventing power supply noise is connected in parallel to the IC socket. That is, a pair of outer leads of the capacitor are soldered to positions near the IC socket on the power supply wiring and the ground wiring of the testing board, respectively.

Japanese Patent Application Laid-Open No. 58-51482 discloses an example of an IC socket.

[0005]

Since the capacity of a capacitor for preventing noise varies depending on the type and specification of an IC to be tested, a capacitor having a capacity completely compatible with the device under test has to be found. Requires trial and error,
It is necessary to repeat the work of mounting the capacitor on the testing board many times. However, since the work of attaching the capacitor to the testing board is performed by soldering work, the work efficiency is low and the work of attaching the capacitor is delayed, and the downtime of the tester and hence the inspection and test time are lengthened.

[0006] An object of the present invention is to provide a connection device that can perform a passive element mounting operation simply and in a short time.

[0007] The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0008]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, the connection device is provided with a passive element mounting portion to which the passive element is detachably connected to the main body.
The passive element mounting portion is configured to electrically connect the passive element to a contact member to which a power supply line is connected and a contact member to which a ground line is connected, of a contact member group of the connection device. And

According to the above-described means, by repeating the operation of attaching and detaching the passive element to and from the passive element mounting portion of the connection device, desired characteristics are exhibited in order to adjust the parasitic capacitance, the parasitic resistance and the parasitic inductance. The passive element to be connected can be electrically connected to a connection device, that is, an object to be connected. Therefore, for example, when the object connected to the connection device is electrically connected to the tester, the power supply noise can be completely removed by the passive element.
The desired electrical characteristics can be obtained by the tester.

[0011]

1 shows a connecting device according to an embodiment of the present invention. FIG. 1 (a) is an exploded perspective view, and FIG. 1 (b) is an attached state along the line bb in FIG. 1 (a). It is an expanded sectional view.
2A and 2B show a capacitor mounting portion, wherein FIG. 2A is a cross-sectional view showing a mounted state, and FIG. 2B is a cross-sectional view showing a state where the capacitor is removed.

In the present embodiment, the connection device according to the present invention is a connection device for electrically connecting an IC having a dual in-line package (hereinafter, referred to as a DIP IC) to a tester of an IC handler. Is configured as The package of the DIP / IC 1 as an object to be connected includes a resin sealing body 2 formed in a substantially rectangular flat plate shape, and a plurality of outer leads 3 are provided on a pair of side surfaces on the long side of the resin sealing body 2. And the same number is arranged. The outer leads 3 project at right angles from the side surfaces of the resin sealing body 2, and are bent substantially vertically downward at the base end. The lower end of the group of outer leads 3 is a flat surface lower than the lower surface of the resin sealing body 2. Are aligned within. An index 4 for indicating the direction of the DIP / IC 1 is formed on one short side of the resin sealing body 2.

The connection device 10 is configured so that a capacitor as a passive element for removing power supply noise can be detachably attached thereto, and the capacitor is configured to appropriately adjust a parasitic capacitance and a parasitic resistance. Have been.
In the present embodiment, the capacitor 5 as a passive element for removing power supply noise includes a sealing member 6 in which a functional portion (not shown) of the capacitor is sealed, and a functional portion inside the sealing member 6. And a pair of outer leads 7, 7 electrically connected to each other. The sealing body 6 is formed in a circular flat plate shape, and the pair of outer leads 7, 7 protrude from a part of the circumferential surface of the sealing body 6, respectively. Each of the outer leads 7 is formed into an elongated leg shape by using a conductive wire having an appropriate plastic deformability capable of easily bending and maintaining a bent shape.

The connection device 10 for the DIP-IC 1 includes a main body 11 formed of a rectangular flat plate larger than the DIP-IC 1 by using an insulating material such as a resin. A plurality of connected object outer lead insertion holes (hereinafter, referred to as insertion holes) 12 are arranged on the upper surface of the rectangular shape of the main body 11 in a two-file platoon along a long side and are formed in a hole shape having a square cross section. The number of insertion holes 12 is DIP
The number of outer leads 3 of the IC 1 is set to the same number or more. In the illustrated example, the number of the insertion holes 12 is the same as the number of the outer leads 3. The inter-row width of both insertion hole groups 12 is set equal to the inter-row width of both outer lead groups 3, and the pitch of the insertion holes 12 in each row is set equal to the pitch of the outer leads 3 in each row. The size of the insertion hole 12 is set so that at least the lower end of the outer lead 3 can be inserted below the seating plane.

A contact member 13 is mounted in each of the insertion holes 12. The contact member 13 is made of a conductive plate material such as phosphor bronze and the like, which exerts an appropriate elastic force, and is integrally formed into a substantially Y-shaped column shape by press working. The Y-shaped head of the contact member 13 constitutes an object-side connection portion 14 for sandwiching and electrically connecting the lower end of the outer lead 3 from both sides, and the Y-shaped leg of the contact member 13 described later. Testing
A board-side connection portion 15 electrically connected to a through-hole conductor of the board is formed.

At both ends on the shorter sides of the rectangular upper surface of the main body 11, a capacitor mounting portion 20 for mounting the capacitor 5 is provided. Each of the capacitor mounting portions 20 has a pair of capacitor / outer lead mounting holes (hereinafter, referred to as mounting holes) 21 to which the outer leads 7 of the capacitor 5 are mounted. The two mounting holes 21 are arranged substantially on the extension lines of the rows of the insertion holes 12 and are formed in a hole shape having a square cross section. The distance between the pair of mounting holes 21 corresponds to the distance between the pair of outer leads 7 of the capacitor 5. The size of the mounting hole 21 is set to be larger than the thickness of the outer lead 7 of the capacitor 5. Mounting hole 21
Are formed in a two-stage upper and lower hole shape, the upper stage is formed in a substantially cubic hole shape to form an outer lead insertion portion 22, and the lower stage is formed in a substantially regular square pyramid hole shape to form a slider accommodation portion (hereinafter, referred to as 23 is formed.
A contact conductor 24 is attached to the inner peripheral surface of the mounting hole 21, and one end of an electric wiring 25 is electrically connected to the contact conductor 24 on the upper surface of the main body 11. The other end of the electric wiring 25 is electrically connected to the contact member 13 of the predetermined insertion hole 12.

The mounting hole 21 has a pair of contact members 2.
6, 26 are mounted. The contact member 26 is made of a conductive plate material such as phosphor bronze and the like, which exerts an appropriate elastic force, and is integrally formed into a substantially quadrangular elliptical flat plate by press working. The pair of contact members 26, 26 are slidably inserted in the vertical direction along the center line of the mounting hole 21 in a back-to-back state with the short diameter side facing upward. The upper end of each contact member 26 is engaged with a stopper 27 projecting inward from the upper end opening edge of the mounting hole 21 from below. Therefore, the upper limit of the contact member 26 is regulated by the stopper 27.

A pair of sliders 28 are accommodated in the accommodating portion 23 of the mounting hole 21, respectively. Each slider 28 is formed in a semi-trapezoidal hexahedral shape, and is disposed such that the hypotenuse of the semi-trapezoid is in sliding contact with the conical surface of the housing portion 23. That is, the pair of sliders 28, 28 are symmetrically arranged with the center line extending in the up-down direction of the housing portion 23 in a state where the side surfaces facing the slope face each other, and face the slope. Each of the side surfaces is brought into sliding contact with each of the contact members 26, 26 from outside. A pair of compression coil springs (hereinafter, referred to as “compression coil springs”)
It is called a spring. ) 29, 29 are accommodated, and each spring 29 urges each slider 28 to push up the respective slider 28 by applying a reaction force to the bottom surface of the accommodation portion 23.

The connecting device 10 configured as described above
It is mounted on a testing board (hereinafter, referred to as a board) 30 of the C tester. The board 30 has a main body 31 formed of an insulating substrate such as a glass epoxy resin substrate. At predetermined positions on the upper surface of the main body 31, a plurality of (only one is shown) through-hole conductors 32 are arranged in a two-column tandem and formed in a square cross-sectional hole shape. The number of the through-hole conductors 32 depends on the contact member 1 of the connection device 10 which is the object to be connected.
The number is set to be equal to or more than the number of three. In the illustrated example, the number of through-hole conductors 32 is the same as the number of contact members 13. The inter-row width of both the through-hole conductors 32 is set equal to the inter-row width of both the contact members 13, and the pitch of the through-hole conductors 32 in each row is the same as the contact member 1 in each row.
3 is set equal to the pitch. The size of the through-hole conductor 32 is set to a size that can maintain electrical connection with the contact member 13 when the contact member 13 is inserted.

Each through-hole conductor 32 has an electric wiring 3
3 are electrically connected to each other, and the electric wiring 33 is appropriately laid on the surface or inside of the main body 31. Each electric wiring 33 is electrically connected to a tester (not shown) at the other end. Electrical wiring 33
At least one electrical wire in the group is used as an electrical wire for supplying electric power (hereinafter, referred to as a power wire 33a), and at least one other electrical wire is an electrical wire for grounding (hereinafter, a ground wire). This is used as the wiring 33b.) In the present embodiment, the power supply wiring 33a and the ground wiring 33b are electrically connected to the through-hole conductors 32, 32 located at opposite ends of each group of the through-hole conductors 32, respectively.

Next, a method of using the connection device according to the above configuration and the operation thereof will be described. A capacitor 5 having a capacity corresponding to the DIP / IC 1 as an object to be measured to be subjected to an electrical characteristic test by a tester is selected in advance and attached to at least one of the capacitor attachment portions 20 of the connection device 10.

At the time of this mounting, the pair of outer leads 7 of the capacitor 5 are slowly inserted into the pair of mounting holes 21 of the mounting portion 20. When the outer lead 7 is slowly inserted into the mounting hole 21, FIG.
As shown in (a), the pair of sliders 28, 28 of the mounting hole 21 are kept pushed up by the respective springs 29, 29, so that the two contact members 2
6 and 26 are in a state of holding the outer lead 7. When the outer leads 7 are sandwiched between the two contact members 26, 26, the outer leads 7 pass through the contact members 26, 26, the contact conductor 24, and the electric wiring 25 to the contact members 13 in the predetermined insertion holes 12 in the connection device 10. It will be in an electrically connected state.

The contact members 13, 13 of the pair of insertion holes 12, to which the outer leads 7, 7 of the capacitor 5 are electrically connected, are connected to the power supply wiring 33 of the board 30.
a and the ground line 33b, the capacitor 5 is electrically connected to the power supply line 33a and the ground line 33b.

Thereafter, the DIP IC 1 as a test object to be subjected to an electrical characteristic test by a tester is automatically attached to the connection device 10 while the upper surface thereof is held by being vacuum-adsorbed by a collet (not shown). Then, the outer leads 3 are inserted into the designated insertion holes 12 respectively. When the outer lead 3 is inserted into the insertion hole 12, the outer lead 3 is sandwiched by the connection part 14 of the contact member 13, thereby being electrically connected to the contact member 13. Since the board-side connection portion 15 of each contact member 13 is electrically connected to each through-hole conductor 32 of the board 30, the DIP IC 1 includes three outer leads, a group of contact members 13, a group of through-hole conductors 32, and It is in a state of being electrically connected to the tester through the wiring 33 group.

As described above, after each outer lead 3 of the DIP IC 1 is electrically connected to the tester through the connection device 10, a test signal is exchanged between the DIP IC 1 and the tester, and a desired electrical connection is established. A characteristic test is performed. At the time of this electrical characteristic test, the capacitor 5 is connected to the power supply wiring 33 via the capacitor mounting portion 20 of the connection device 10.
Since it is electrically connected to a and the ground wiring 33b, power supply noise during the test is effectively removed. Therefore, an appropriate and high-precision electrical characteristic test is performed.

When the desired test is completed, the DIP IC 1
Is automatically lifted off from the connecting device 10 by the collet and transferred to the next step. Thereafter, by repeating the above operation, the connection device 1 per DIP IC 1
An electrical characteristic test is performed via the “0”.

If the capacitor 5 selected in advance does not show the expected effective value and the electrical characteristic test does not show the expected value due to the occurrence of unexpected noise or the like, the connection device The capacitors 5 attached to the 10 capacitor attachment portions 20 are appropriately replaced as desired.

At the time of replacement of the capacitor 5 with respect to the capacitor mounting portion 20, once the outer lead 7 of the capacitor 5 inserted into the mounting hole 21 is pushed in and then pulled up, the capacitor 5 is attached to the capacitor mounting portion 2.
It can be easily removed from zero with one touch operation.
That is, when the outer lead 7 is pushed in momentarily,
As shown in FIG. 2B, the pair of contact members 26, 26 of the mounting hole 21 push down the sliders 28, 28 against the springs 29, 29. As a result, the outer lead 7 is released from the clamped state when the distance between the sliders 28 and 28 is reduced and the distance between the sliders 28 is increased. When the holding state of both contact members 26, 26 is released, the outer leads 7 are released.
Can be lightly pulled out from both contact members 26, 26.

After the capacitor 5 is removed from the capacitor mounting portion 20 of the connecting device 10 in this manner,
The capacitor 5 having another characteristic is mounted on the capacitor mounting portion 20 of the connection device 10 by the mounting operation described above. In the present embodiment, since the replacement operation of the capacitor can be performed very easily as described above, the replacement operation can be repeatedly performed until the expected value is obtained in the electrical characteristic test. . As a result, an appropriate and high-precision electrical characteristic test for the DIP IC 1 can be secured, and as a result, DI
The quality and reliability of the P-IC 1 can be improved.

FIG. 3 is a circuit diagram showing an example of connection of a capacitor to a DIP / IC. FIG. 3A shows a DIP-I
An example in which one capacitor 5 is connected in parallel to C1 is shown.

FIG. 3B shows an example in which a large-capacity capacitor 5a and a small-capacity capacitor 5b are connected in parallel to the DIP IC 1. According to this connection example, large noise is removed by the large-capacity capacitor 5a, and small noise is removed by the small-capacity capacitor 5b.

FIG. 3C shows an example in which two capacitors 5, 5 are connected in series with each other. According to this connection example, one capacitor 5 causes the other capacitor 5
By compensating for the capacity shortage, the total capacity of the DIP IC 1 can be freely adjusted.

According to the above-described embodiment, the following effects can be obtained. (1) Capacitor mounting part 2 capable of detachably connecting capacitor 5 for removing power supply noise to connection device 10
By providing 0, the replacement operation of the capacitor 5 can be performed extremely easily, and therefore, the replacement operation can be performed as many times as necessary until the desired value is obtained for the electrical characteristic test.

(2) According to the above (1), a proper and high-precision electrical characteristic test for the DIP IC 1 can be ensured by replacing the capacitor 5, so that the quality and reliability of the DIP IC 1 Can be increased.

(3) According to the above (1), the capacitor 5
Since the time required for the replacement of the tester can be shortened, the stop time of the expensive tester can be shortened, the time for the entire test can be shortened, and the productivity can be improved.

(4) By eliminating the solder pile for connecting the capacitor 5, it is possible to reduce the occurrence of the parasitic capacitance, the parasitic resistance, and the inductance component of the solder pile, and as a result, the electric power especially at high frequencies is reduced. Deterioration of measurement accuracy at the time of measurement of dynamic characteristics can be suppressed.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

For example, the capacitor mounting section 20 is not limited to a symmetrical configuration. That is, the capacitor mounting portion 20
Are a pair of contact members 26, 26, stoppers 27, 2
7, sliders 28, 28 and springs 29, 29
The outer lead 7 of the capacitor 5 may be sandwiched by a single contact member 26, stopper 27, slider 28 and spring 29.

Further, the capacitor mounting portion 20 is not limited to the structure in which the capacitor can be attached and detached by the one-touch operation shown in the above-described embodiment, but may be a contact member by an operation other than the insertion of the outer lead of the capacitor, such as an eyeball clip structure. May be opened so that the outer lead is held by the spring, so that the capacitor can be detachably connected.

The number of the capacitor mounting portions 20 is not limited to two, but may be one or three or more.

The object to be connected in the connection device 10 is a DIP
Not limited to IC. That is, the electrical connection structure between the connection device 10 and the object to be connected is not limited to the structure shown in the above-described embodiment.
It can be appropriately selected depending on the structure. For example, in the case of a surface mount type package having an outer lead having an outline structure such as a gull wing shape or an I-lead shape, a contact member that contacts the outer lead having the outline structure is configured to contact the outer lead from below. Will be.

Further, the contact member is not limited to be formed of a conductive material having elasticity, but may be formed of a conductive sheet or the like.

In the above description, the invention made mainly by the inventor is applied to a connection device for electrically connecting a DIP / IC as a device under test to a tester for an electrical characteristic test, which is an application field of the background. However, the present invention is not limited to such a case, and a connection device for electrically connecting the device under test to a tester for a screening test such as a burn-in test or an aging test, and further, electronic components such as a mounting board of a computer. And connection devices (IC sockets) used for mounting electronic devices.

[0044]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

By providing the connection device with a passive element mounting portion to which a passive element for adjusting a parasitic capacitance, a parasitic resistance and a parasitic inductance can be detachably connected, the operation of replacing the passive element can be performed very easily. it can.

[Brief description of the drawings]

FIGS. 1A and 1B show a connecting device according to an embodiment of the present invention, wherein FIG. 1A is an exploded perspective view, and FIG.
It is an expanded sectional view of an attachment state along a b line.

FIGS. 2A and 2B show a capacitor mounting portion, wherein FIG. 2A is a cross-sectional view showing a mounted state, and FIG.

FIGS. 3 (a), (b) and (c) are DIPs of capacitors.
-It is each circuit diagram which shows the example of a connection with IC.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... DIP / IC (connection object), 2 ... resin sealing body, 3 ...
Outer lead, 4 ... Index, 5 ... Capacitor (passive element), 5a, 5b ... Capacitor, 6 ... Seal, 7 ...
Outer lead, 10 connection device, 11 body, 12 outer lead insertion hole, 13 contact member, 14 connection object side connection portion, 15 board side connection portion, 20 capacitor connection portion, 21 capacitor connection hole, 22: outer lead insertion portion, 23: slider housing portion, 24: contact conductor, 25: electric wiring, 26: contact member, 27:
Stopper, 28 slider, 29 compression coil spring, 30 testing board, 31 body, 32
... through-hole conductors, 33 ... electric wiring, 33a ... power supply wiring, 33b ... ground wiring.

Claims (4)

[Claims] 1. A connection device in which a plurality of contact members to which an outer lead of an object to be connected is detachably connected are arranged in a main body, wherein a passive element mounting portion for detachably mounting a passive element to the main body is provided. Wherein the passive element mounting portion is configured to electrically connect the passive element to a contact member to which a power supply wiring is connected and a contact member to which a ground wiring is connected among the contact member group. Characteristic connection device. 2. The connection device according to claim 1, wherein a plurality of the passive element mounting portions are provided. 3. The connection device according to claim 1, wherein the passive element is a capacitor for removing power supply noise. 4. The passive element mounting portion includes a mounting hole into which an outer lead of the passive element is inserted and mounted, a contact member inserted into the mounting hole, and an inclined surface formed in the contact member and the mounting hole. The slider according to claim 1, 2 or 3, further comprising a slider slidably interposed between the slider and a spring that constantly biases the slider in the opening direction of the mounting hole. Connection device.