JPH10125847A - Semiconductor device and semiconductor device mounting board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely contact a semiconductor device to a semiconductor device mounting board through spherical terminals. SOLUTION: A semiconductor device 10 has a semiconductor element covered with a mold resin 12 on a wiring board 11 having solder balls 13 soldered to the lower surface of the board 11 to form spherical terminals for electric connection to externals. The solder balls 13 are disposed like a matrix on the board 11 lower surface such that those having smaller diameters locate at the marginal area and those having larger diameters locate at the central area according to the warp of the semiconductor device 10. When the device 10 is mounted on a mounting board, the solder balls 13 can surely contact this board, thereby avoiding poor contact of the device 10 to the mounting board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a semiconductor device mounting substrate, and more particularly, to a semiconductor device and a semiconductor device mounting substrate which reliably contact a spherical terminal of the semiconductor device and the semiconductor device mounting substrate.

[0002]

2. Description of the Related Art Conventionally, BGA (Ball Grid Array)
As described above, in a semiconductor device in which spherical terminals are arranged in a matrix as terminals for electrical connection to the outside, spherical terminals of the same size are arranged in a matrix at the same pattern pitch.

[0003] For example, as shown in FIG.
In the package 1, a semiconductor element 2 is mounted on a wiring board 4 via a silver paste 3, and upper portions of the semiconductor element 2, the silver paste 3 and the wiring board 4 are covered with a mold resin 5. Solder balls 6, which are spherical terminals, are soldered on the lower surface of the wiring board 4 in a matrix as shown in FIG. 4, and all of the solder balls 6, as shown in FIGS. Has a uniform size, for example, φ760 μm. in this case,
The solder ball 6 is soldered on a land provided on the back surface of the wiring board 4, and the land also has a uniform size such as φ6 so that the solder ball 6 has a uniform size.
It is formed to a thickness of 00 μm.

[0004]

However, in such a conventional semiconductor device, there is a possibility that a contact failure between the solder ball, which is a spherical terminal, and the mounting board may occur. That is, the semiconductor element, the silver paste, the wiring board, and the solder balls constituting the semiconductor device have different coefficients of linear expansion, and the semiconductor device is finally mounted after the assembly process for manufacturing the semiconductor device through the test process. The semiconductor device may be warped by undergoing various processing steps before being mounted on the substrate, so that the solder balls of the semiconductor device do not come into contact with the mounting substrate, which may result in poor contact. This phenomenon is more remarkable as the number of solder balls, which are spherical terminals, is larger. In particular, there is a possibility that poor contact between the solder ball at the center of the semiconductor device and the mounting board may occur.

Therefore, the invention according to the first aspect of the present invention is to increase the spherical diameter of the spherical terminals arranged in a matrix on the lower surface of the wiring board of the semiconductor device for electrical connection to the outside, so that the spherical terminals are closer to the center than to the outer periphery. By forming the semiconductor device in a large size, the warpage generated in the semiconductor device in the manufacturing process of the semiconductor manufacturing device is absorbed by the change in the spherical diameter of the spherical terminal, and the mounting substrate on which the semiconductor device is mounted and the spherical terminal of the semiconductor device are mounted. It is an object of the present invention to provide a semiconductor device capable of reliably contacting the semiconductor device and preventing occurrence of poor contact.

According to a second aspect of the present invention, a spherical terminal having a uniform spherical diameter is arranged in a matrix on a lower surface of a wiring board of a semiconductor device via a land, and a land diameter of the land arranged in a matrix is provided. Are formed smaller in the central portion than in the outer peripheral portion, so that the height of the spherical terminals arranged in a matrix is increased from the outer peripheral portion toward the central portion, and the semiconductor device generated in the manufacturing process of the semiconductor manufacturing apparatus. Semiconductor device that can absorb the warpage of the spherical terminal of the spherical terminal by a change in the spherical diameter of the spherical terminal and securely contact the mounting substrate on which the semiconductor device is mounted with the spherical terminal of the semiconductor device, thereby preventing the occurrence of poor contact. It is intended to provide.

According to a third aspect of the present invention, the spherical diameter of the spherical terminals arranged on the lower surface of the wiring board of the semiconductor device for electrical connection with the outside via lands in the form of a matrix is set at the center rather than the outer peripheral portion. And the land diameter of the lands arranged in a matrix is made smaller at the center than the outer periphery, so that the height of the spherical terminals arranged in a matrix is increased from the outer periphery to the center. As the height increases, the warpage of the semiconductor device generated in the manufacturing process of the semiconductor manufacturing device is absorbed by the change in the diameter of the spherical terminal of the spherical terminal, and the mounting substrate on which the semiconductor device is mounted and the spherical terminal of the semiconductor device are further improved. It is an object of the present invention to provide a semiconductor device capable of making contact more reliably and preventing occurrence of contact failure more reliably.

According to a fourth aspect of the present invention, a land diameter for connecting a spherical terminal of a semiconductor device mounting board on which a semiconductor device on which spherical terminals are arranged in a matrix for electrical connection to the outside is determined. By making the land in the center part smaller than the land in the outer peripheral part, the height of the spherical terminal soldered to the land is increased from the outer peripheral part to the central part, so that the semiconductor generated in the manufacturing process of the semiconductor manufacturing apparatus. A semiconductor that absorbs warpage of a device by a change in the diameter of the spherical terminal of the spherical terminal and reliably contacts the mounting substrate on which the semiconductor device is mounted and the spherical terminal of the semiconductor device, thereby preventing the occurrence of poor contact. It is intended to provide a device.

[0009]

According to a first aspect of the present invention, there is provided a semiconductor device having spherical terminals arranged in a matrix for electrical connection with the outside, wherein the spherical terminals arranged in the matrix are provided. The above-mentioned object is achieved by the terminal having a larger spherical diameter in the central portion than in the outer peripheral portion.

According to the above structure, the spherical terminals of the spherical terminals arranged in a matrix on the lower surface of the wiring board of the semiconductor device for electrical connection to the outside are formed so as to be larger in the central portion than in the outer peripheral portion. Therefore, the warpage generated in the semiconductor device in the manufacturing process of the semiconductor manufacturing device is absorbed by the change in the spherical diameter of the spherical terminal, and the mounting substrate on which the semiconductor device is mounted and the spherical terminal of the semiconductor device are reliably formed. Contact can be made, and occurrence of poor contact can be prevented.

According to a second aspect of the present invention, in the semiconductor device according to the present invention, the spherical terminals are formed on lands arranged in a matrix on a wiring board for electrical connection with the outside. The above-mentioned object is achieved because the lands arranged in a matrix having a uniform spherical diameter have a smaller land diameter at the center portion than at the outer peripheral portion.

According to the above structure, the spherical terminals having a uniform spherical diameter are arranged in a matrix on the lower surface of the wiring board of the semiconductor device via the land, and the land diameter of the lands arranged in the matrix is reduced. The height of the spherical terminals arranged in a matrix can be increased from the outer peripheral portion toward the central portion because the central portion is formed smaller in the central portion than the outer peripheral portion. The warpage of the device can be absorbed by a change in the size of the spherical diameter of the spherical terminal. As a result, the mounting substrate on which the semiconductor device is mounted and the spherical terminal of the semiconductor device can be reliably brought into contact, and the occurrence of poor contact can be prevented.

According to a third aspect of the present invention, there is provided a semiconductor device in which spherical terminals for electrical connection with the outside are formed on lands arranged in a matrix on a wiring board. The spherical terminal, the spherical terminal of the central portion than the spherical terminal of the outer peripheral portion, its spherical diameter is larger, the land arranged in a matrix, the land of the central portion than the land of the outer peripheral portion. The above-mentioned object is achieved by the land having a smaller land diameter.

According to the above arrangement, the spherical terminals arranged on the lower surface of the wiring board of the semiconductor device for electrical connection to the outside via the lands in a matrix form have a spherical diameter that is closer to the center than to the outer periphery. As the land diameter of the lands arranged in a matrix is made smaller toward the center than the outer periphery, the height of the spherical terminals arranged in a matrix goes from the outer periphery to the center. And the warpage of the semiconductor device generated in the manufacturing process of the semiconductor manufacturing apparatus can be absorbed by the change in the diameter of the spherical terminal. As a result, the mounting substrate on which the semiconductor device is mounted and the spherical terminal of the semiconductor device can be more reliably brought into contact, and the occurrence of poor contact can be more reliably prevented.

According to a fourth aspect of the present invention, there is provided a semiconductor device mounting board comprising: a semiconductor device having spherical terminals arranged in a matrix for electrical connection to the outside; In the semiconductor device mounting board, the land is arranged in the matrix, and the land in the center is smaller in the land than in the periphery in the land, thereby achieving the above object. .

According to the above configuration, the land diameter for connecting the spherical terminal of the semiconductor device mounting board on which the semiconductor device on which the spherical terminals are arranged in a matrix for electrical connection with the outside is set to the outer peripheral portion of the semiconductor device. The land at the center of the land is smaller than that of the land, so that the height of the spherical terminal soldered to the land can be increased from the outer periphery to the center, which is generated in the manufacturing process of the semiconductor manufacturing apparatus. Of the semiconductor device can be absorbed by a change in the size of the spherical diameter of the spherical terminal. As a result, the mounting substrate on which the semiconductor device is mounted and the spherical terminal of the semiconductor device can be reliably brought into contact, and the occurrence of poor contact can be prevented.

[0017]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. It should be noted that the embodiments described below are preferred embodiments of the present invention, and therefore, various technically preferable limitations are added. However, the scope of the present invention is not limited to the following description. The embodiments are not limited to these embodiments unless otherwise specified.

FIG. 1 is a diagram showing one embodiment of a semiconductor device and a semiconductor device mounting substrate of the present invention. FIG. 1 is a diagram to which one embodiment of the semiconductor device and the semiconductor device mounting substrate of the present invention is applied. FIG. 3 is a side view of the semiconductor device 10.

In FIG. 1, a semiconductor device 10 has a semiconductor element (not shown) covered with a mold resin 12 formed on a wiring board 11, and a lower surface of the wiring board 11 for electrical connection to the outside. A plurality of solder balls 13 are soldered as spherical terminals.

The solder balls 13 are arranged in a matrix on the lower surface of the wiring board 11, and the ball diameters of the solder balls 13 are arranged on the outer periphery (outer periphery) of the solder balls 13 arranged in a matrix.
Are small, and larger ones are used toward the center.

That is, the semiconductor device 10 includes a semiconductor element, a wiring board 11 and a molding resin 1 which are constituent members thereof.
Due to the difference between the linear expansion coefficients of 2 and the like, warpage occurs during various processing steps from the assembly step to the test step until the semiconductor device is finally mounted on the mounting board.
Therefore, the amount of the generated warpage is measured in advance, or
Calculate and prepare a plurality of types of solder balls 13 having a ball diameter corresponding to the warpage amount, arrange the solder ball 13 having the largest ball diameter at the center of the lower surface of the wiring board 11, and thereafter,
The solder balls 13 having smaller sphere diameters are sequentially arranged on the outer peripheral portion of the lower surface of the wiring board 11. In this case, a squeegee (sieve) or the like may be used because the larger the diameter of the solder ball 13 is, the closer to the center of the lower surface of the wiring board 11.

When the solder balls 13 are arranged in a matrix on the lower surface of the wiring board 11 in this manner, the solder balls 13 are sequentially arranged from the outer periphery to the center of the lower surface of the wiring board 11 in accordance with the amount of warpage of the wiring board 11. Since the solder ball 13 having a large ball diameter is arranged, when the semiconductor device 10 is mounted on the mounting board, the solder ball 13 can be reliably brought into contact with the mounting board, and the solder ball 13 and the semiconductor device 10 can be mounted. The occurrence of poor contact with the substrate can be prevented.

FIG. 2 is a view showing one embodiment of a semiconductor device and a semiconductor device mounting board of the present invention, and FIG. 2 is a diagram to which one embodiment of the semiconductor device and the semiconductor device mounting board of the present invention is applied. FIG. 2 is a side view of the semiconductor device mounting board 20 and the semiconductor device 21 mounted on the semiconductor device mounting board 20.

In FIG. 2, the semiconductor device 21 has a semiconductor element (not shown) covered with a mold resin 23 formed on a wiring board 22, and a lower surface of the wiring board 22 for electrical connection to the outside. A plurality of solder balls 24 as spherical terminals are soldered via lands 25.

The lands 25 are arranged in a matrix on the lower surface of the wiring board 22. The land diameter is large on the outer peripheral side of the lands 25 arranged in the matrix and becomes smaller toward the center.

The solder balls 24 have the same spherical diameter, and the solder balls 24 having the same spherical diameter are soldered onto the lands 25 having smaller land diameters from the outer peripheral side toward the center. ing.

That is, the semiconductor device 21 includes a semiconductor element, a wiring board 22 and a molding resin 2 which are constituent members thereof.
Due to the difference in the coefficient of linear expansion of 3 or the like, warpage occurs during various processing steps from the assembly step to the test step until the semiconductor device is finally mounted on the mounting board. Therefore, the amount of warpage occurring in the semiconductor device 21 is measured or calculated in advance, and the land 25 having the largest land diameter is placed on the outer peripheral portion of the lower surface of the wiring board 22 in accordance with the amount of warpage. The lands 25 having a smaller land diameter are sequentially formed at the center of the lower surface of the wiring board 22.

The solder balls 24 having the same spherical diameter are soldered on the lands 25 arranged as described above. This land 2
The width of the solder ball 24 soldered on 5 is restricted by the size of the land 25, and its height is determined by the surface tension of the solder. And land 25
The solder balls 24 to be soldered thereon have the same ball diameters, but the land diameters of the lands 25 are different. Therefore, due to the surface tension of the solder, the solder balls 24 on which the lands 25 having large land diameters are formed are formed. The height increases from the outer peripheral portion of the wiring board 22 toward the center of the wiring board 22 where the land 25 having a smaller land diameter is formed.

When the semiconductor device 21 to which the solder balls 24 are soldered in this manner is mounted on the mounting substrate 20 on which the lands 26 having a uniform land diameter are formed, the semiconductor device 21 warps as shown in FIG. However, the solder ball 24 of the semiconductor device 21 can be reliably brought into contact with the land 26 of the flat mounting board 20 and soldered to prevent the occurrence of a contact failure.

In the above embodiment, the land 25 having a smaller land diameter from the outer periphery to the center of the wiring board 22 is formed on the lower surface of the wiring board 22 of the semiconductor device 21. The formation of the land different from the land is not limited to the formation on the lower surface side of the wiring board of the semiconductor device. For example, in FIG. 2, the land 2 having the same land diameter is formed on the lower surface of the wiring substrate 22 of the semiconductor device 21.
5 are formed in a matrix shape, and solder balls 24 having the same spherical diameter are soldered on the lands 25. The mounting board 20 on which the semiconductor device 21 is mounted is mounted on the mounting board 20 from the outer peripheral portion of the matrix-shaped solder balls 24 to the center. A land 26 having a land diameter gradually decreasing toward the portion may be formed. Also in this case, the height of the solder ball 24 to be soldered on the land 26 having a different land diameter formed on the mounting board 20 is determined according to the land diameter, and the solder ball 24 of the warped semiconductor device 21 is formed. 24 can be reliably soldered to the land 26 of the mounting board 20.

Further, in the above embodiment, the solder balls 24 having the same particle size are soldered to the lands 25 having different land diameters. However, the solder balls 24 are not limited to those having the same particle size. Similarly to the first embodiment, a solder ball 24 having a larger particle diameter from the outer peripheral portion to the central portion of the wiring board 22 may be used. By doing so, even when the warpage of the semiconductor device 21 is large, the semiconductor device 21 and the mounting substrate 20 can be more reliably brought into contact.

Further, as in the above embodiment, the land 25 of the wiring board 22 of the semiconductor device 21 is formed with a smaller land diameter from the outer periphery to the inner periphery, and the land 26 of the mounting board 20 is formed. Alternatively, a solder ball having a smaller land diameter from the outer peripheral portion to the inner peripheral portion may be formed, and a solder ball having a larger particle size from the outer peripheral portion to the inner peripheral portion may be used. With this configuration, even when the warpage of the semiconductor device 21 is further increased, the semiconductor device 21 and the mounting board 20 can be more reliably brought into contact.

Although the invention made by the inventor has been specifically described based on the preferred embodiments, the invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the invention. It goes without saying that it is possible.

[0034]

According to the semiconductor device of the first aspect of the present invention, the spherical diameter of the spherical terminals arranged in a matrix on the lower surface of the wiring board of the semiconductor device for electrical connection to the outside is determined by the outer peripheral portion. The larger the central portion, the larger the mounting substrate on which the semiconductor device is mounted by absorbing the warpage generated in the semiconductor device in the manufacturing process of the semiconductor manufacturing device by the change in the spherical diameter of the spherical terminal. And the spherical terminal of the semiconductor device can be reliably brought into contact with each other, and occurrence of poor contact can be prevented.

According to the semiconductor device of the second aspect of the present invention, spherical terminals having a uniform spherical diameter are arranged in a matrix on the lower surface of the wiring board of the semiconductor device via the lands, and are arranged in a matrix. Because the land diameter of the land is smaller at the center than at the outer periphery,
The height of the spherical terminals arranged in a matrix can be increased from the outer peripheral portion to the central portion, and the warpage of the semiconductor device generated in the manufacturing process of the semiconductor manufacturing device is reduced by the size of the spherical diameter of the spherical terminal. It can be absorbed by changes. As a result, the mounting substrate on which the semiconductor device is mounted and the spherical terminal of the semiconductor device can be reliably brought into contact, and the occurrence of poor contact can be prevented.

According to the semiconductor device of the third aspect of the present invention, the spherical diameter of the spherical terminals disposed on the lower surface of the wiring board of the semiconductor device via a land in a matrix for electrical connection with the outside is determined by: The larger the central part than the outer peripheral part, the larger the land diameter of the lands arranged in the matrix is smaller than the outer peripheral part in the center, so the height of the spherical terminals arranged in the matrix is The height can be increased from the outer peripheral portion to the central portion, and the warpage of the semiconductor device generated in the manufacturing process of the semiconductor manufacturing device can be absorbed by the change in the spherical diameter of the spherical terminal. As a result, the mounting substrate on which the semiconductor device is mounted and the spherical terminal of the semiconductor device can be more reliably brought into contact, and the occurrence of poor contact can be more reliably prevented.

According to the semiconductor device mounting board of the present invention, the spherical terminals of the semiconductor device mounting board for mounting the semiconductor device on which the spherical terminals are arranged in a matrix for electrical connection with the outside are mounted. Since the land diameter is smaller at the center of the land than at the outer periphery of the semiconductor device, the height of the spherical terminals soldered to the land can be increased from the outer periphery toward the center. In addition, the warpage of the semiconductor device generated in the manufacturing process of the semiconductor manufacturing device can be absorbed by the change in the diameter of the spherical terminal. As a result, the mounting substrate on which the semiconductor device is mounted and the spherical terminal of the semiconductor device can be reliably brought into contact, and the occurrence of poor contact can be prevented.

[Brief description of the drawings]

FIG. 1 is a side view of a semiconductor device to which a first embodiment of a semiconductor device and a semiconductor device mounting board of the present invention is applied.

FIG. 2 is a side view of a semiconductor device and a semiconductor device mounting substrate according to a second embodiment of the present invention;

FIG. 3 is a side sectional view of a conventional semiconductor device.

FIG. 4 is a bottom view of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Semiconductor device 11 Wiring board 12 Mold resin 13 Solder ball 20 Semiconductor device mounting board 21 Semiconductor device 22 Wiring board 23 Mold resin 24 Solder ball 25, 26 Land

Claims (4)

[Claims] 1. A semiconductor device in which spherical terminals for electrical connection to the outside are arranged in a matrix, wherein the spherical terminals arranged in a matrix are arranged at a central portion of the semiconductor device relative to the spherical terminals at an outer peripheral portion. A semiconductor device, wherein the spherical terminal has a larger spherical diameter as the spherical terminal. 2. A semiconductor device in which spherical terminals for electrical connection to the outside are formed on lands arranged in a matrix on a wiring board, wherein the spherical terminals have a uniform spherical diameter, and The semiconductor device according to claim 1, wherein the land arranged in a shape has a smaller land diameter in a central portion than in a peripheral portion. 3. A semiconductor device in which spherical terminals for electrical connection to the outside are formed on lands arranged in a matrix on a wiring board, wherein the spherical terminals arranged in a matrix are provided on an outer peripheral portion. The spherical diameter of the spherical terminal in the central portion is larger than that of the spherical terminal, and the land arranged in the matrix has a smaller land diameter in the central portion than in the outer peripheral portion. A semiconductor device characterized by the above-mentioned. 4. A semiconductor device mounting board having lands arranged in a matrix corresponding to a matrix arrangement of the spherical terminals, wherein the semiconductor device has spherical terminals for electrical connection to the outside arranged in a matrix. The semiconductor device mounting substrate according to claim 1, wherein the lands arranged in a matrix have a smaller land diameter in a central portion than in an outer peripheral portion.