JPH10125594A - Stage controller and aligner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To align two stages with each other with the high precision and in a short time. SOLUTION: The position error between the target position of a wafer stage 14 and the present position of the wafer stage 14 which is obtained by an interferometer 32 is calculated by a position error calculation unit 50. A wafer stage control unit 52 supplies a control value in accordance with the calculated result as an operation signal to drive a wafer driver 34 which has the wafer stage 14 converged to the target position. If the wafer stage 14 is shifted from the target position, a reticle stage 16 is controlled to be shifted in accordance with an error signal from the position error calculation unit 50 as a target value signal to perform the relative alignment. At that time, the target value signal is let through a target value filter unit 54 to eliminate frequency band components, by which the vibration is enlarged from the control characteristics of the reticle stage, and then supplied to a position error calculation unit 56. With this constitution, the two stages can be aligned with each other with the high precision.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage control apparatus and an exposure apparatus, and more particularly to a stage control apparatus for relatively positioning a plurality of stages and an exposure apparatus using the stage control apparatus.

[0002]

2. Description of the Related Art Conventionally, in a photolithography process in a process of manufacturing a semiconductor element, a liquid crystal display substrate, or the like, a projection optical system is used to project a circuit pattern formed on a mask (or reticle; hereinafter, collectively referred to as a “reticle” as appropriate). Through,
An exposure apparatus that projects onto a photosensitive substrate such as a wafer or a glass plate coated with a photoresist on the surface is used. Among them, a step-and-repeat type reduction projection exposure apparatus adopting a sequential movement type batch exposure method is used. (So-called steppers) are often used.

In an exposure apparatus such as a stepper, a wafer stage on which a photosensitive substrate such as a wafer is placed is sequentially and precisely positioned at an exposure position to perform an exposure operation, and a circuit pattern image of a reticle is sequentially transferred onto a wafer. Had been done. Here, the reticle on which the conventional circuit pattern image is formed is fixed to the reticle holder by fixing means such as a vacuum chuck.

For this reason, in the conventional exposure apparatus, even if the wafer stage is moved two-dimensionally and precisely positioned, the wafer stage is rotated by θ in the moving plane (hereinafter, referred to as “θ”).
If the wafer stage is positioned at the target position, the relative position between the reticle and the wafer will be shifted if the wafer stage is positioned at the target position if there is an offset (a fixed amount of position error) in controlling the position of the wafer stage. As a result, a large transfer error was caused.

Therefore, in order to eliminate the above-mentioned displacement of the relative position between the reticle and the wafer, a fine movement mechanism is also provided on the reticle side, and the reticle stage is moved in accordance with the positioning error of the wafer stage, so that the wafer and the reticle are moved. It has been proposed to reduce the relative position error with the reticle. This will be described with reference to FIG. 6, which shows a stage control mechanism for relatively positioning the wafer stage and the reticle stage.

According to FIG. 6, when a target position of a wafer stage is input from a main computer (not shown) or the like, the position error calculator 102 calculates the target position and the wafer stage 112 measured by an interferometer 114 described later. Is calculated and sent to the wafer stage control unit 104. The wafer stage control unit 104 performs a control operation (for example, a P or PI operation) using the position error as an operation signal, and gives a control amount to the wafer driving device 110. Wafer driving device 1
At 10, a thrust corresponding to the control amount is generated to drive the wafer stage 112. As a result, the wafer stage 112 moves, the position of the wafer stage 12 is measured by the interferometer 114, and the measured value is fed back to the position error calculator 102 described above.

In the control mechanism shown in FIG. 6, the output of the position error calculator 102 is given as a target value to a position error calculator 106 constituting a reticle stage control system. The position error calculator 106 calculates a position deviation, which is a difference between the target value and the current position of the reticle stage 118 measured by an interferometer 120 described later, and sends the calculated difference to the reticle stage controller 108. The reticle stage control unit 108 performs a control operation (for example, a P or PI operation) using this difference as an operation signal, and gives a control amount to the reticle driving device 116. The reticle driving device 116 drives the reticle stage 118 by generating a thrust according to the control amount. As a result, the reticle stage 118 slightly moves, the position of the reticle stage 118 is measured by the interferometer 120, and the measured value is fed back to the position error calculating unit 106 described above.

As described above, when the reticle side is fixed and the wafer stage is moved for precise positioning, the wafer stage is yawed (θ) during the positioning operation.
(Rotation) or a control offset causes rotation or shift of the transferred image, causing a large transfer error. In order to improve this, the position error calculator 106 sets the position error on the wafer stage side output from the position error calculator 102 as a target value, and calculates an error signal between the target value and the current position of the reticle stage 118. A stage control mechanism for finely moving the reticle stage 118 side as an operation signal to relatively align the wafer and the reticle is adopted.

[0009]

However, in such a stage control mechanism, the reticle stage on which the reticle is mounted is always positioned based on the deviation (error signal) between the current position of the wafer stage and the target position. Because of the necessity of the reticle stage, if the error signal converges to the target value while the wafer stage vibrates at a frequency that makes the vibration larger due to the control characteristics of the reticle stage, if the reticle stage tries to correct it, There have been disadvantages in that the relative error between the wafer and the reticle is further increased to deteriorate the positioning accuracy, and that the time until the stage is settled (positioning time) is long.

FIG. 7A shows the frequency spectrum (broken line R) of the position error signal of the reticle stage following the position error signal with respect to the frequency spectrum (solid line W) of the position error signal of the wafer stage. Have been. As shown in FIG. 7A, when the position error signal (W) of the wafer stage includes frequency components (f1 to f2) that increase the vibration due to the control characteristics of the reticle stage, this is not the case. The error amplitude of the position error signal (R) of the following reticle stage is further increased.

FIG. 7B shows a position error (solid line W) when only the wafer stage is moved and positioned using the position error signal shown in FIG. 7A, and the position of the wafer stage and the reticle. The relative error (dashed lines R, W) when both stages are moved and relatively positioned are shown. As can be seen from FIG. 7B, the position error (W) when only the wafer stage is moved is larger than the position error (W).
The relative position error (R, W) when the correction is performed by the reticle stage becomes larger, and the positioning accuracy is deteriorated, and the time required for the positioning becomes longer.

The present invention has been made in view of the disadvantages of the related art, and has as its object to perform high-accuracy positioning in a short time when two stages are relatively positioned. It is an object of the present invention to provide a stage control device that can perform the above.

Another object of the present invention is to perform relative positioning between a wafer stage and a reticle stage as two stages with high accuracy and in a short time.
An object of the present invention is to provide an exposure apparatus with high exposure accuracy and high throughput.

[0014]

According to the first aspect of the present invention, a first stage (14) and a second stage (16) are provided.
A control system (32, 34, 52) for controlling the movement of the first stage (14) according to a target value; A first error signal output means (50) for outputting an error signal corresponding to a deviation from a target value; and a specific frequency which increases vibration due to control characteristics of the second stage (16) included in the error signal. A vibration component removing means (54) for selectively removing a band component; and the error signal from which the specific frequency band component has been removed by the vibration component removing means (54) is used as a target value signal as a target value signal in the second stage ( 16) closed loop control system (19, 2)
2, 56, 58,).

According to this, the movement of the first stage is controlled by the control system according to the target value. At the same time,
An error signal corresponding to a deviation from a target value of the first stage is output by the first error signal output means, and a specific frequency band component included in the error signal, which increases vibration due to control characteristics of the second stage. Is selectively removed by the vibration component removing means. The error signal from which the specific frequency band component has been removed is provided to the closed loop control system as a target value signal. The closed loop control system controls the movement of the second stage based on the target value signal. In this case, the first
The second stage is moved and controlled by using, as a target value signal, an error signal obtained by removing a frequency band component that increases vibration due to control characteristics of the second stage from among error signals corresponding to a deviation from a target value of the stage. Thus, the first stage and the second stage can be relatively positioned without deteriorating the positioning accuracy.

According to a second aspect of the present invention, in the stage control device according to the first aspect, the control system includes the first control system.
First position detecting means (32) for detecting the position of the stage (14); first moving means (34) for moving the first stage (14) in a predetermined direction; An error signal from the first error signal output means (50), which is output based on a target value of the stage (14) and a detection position of the first position detection means (32), is used as an operation signal. A first stage for controlling the first moving means so that the first stage moves to a target position;
And the closed-loop control system includes:
Second position detecting means (22) for detecting the position of the second stage (16); second moving means (19) for moving the second stage (16) in a predetermined direction; The error signal from which the specific frequency band component has been removed by the vibration component removing means (54) is used as a target value signal of the second stage (16), and the target value signal and the second
Second error signal output means (56) for outputting an error signal based on a deviation from the position detected by the position detection means (22);
The second stage (16) uses the error signal output from the second error signal output means (56) as an operation signal.
And second control means (58) for controlling the second moving means (19) so as to adjust the position of the second stage to the first stage (14).

According to this, the position of the first stage is detected by the first position detecting means constituting the control system, and the first control means detects the position of the first stage based on the detected position of the first position detecting means. The first moving means is controlled so as to move one stage to a target position. At the same time, as described above, the first error signal output means outputs an error signal according to the deviation from the target value of the first stage, and the second signal included in the error signal has a vibration characteristic due to the control characteristic of the second stage. Is selectively removed by the vibration removing means, and the error signal is provided to the closed loop control system as a target value signal.

On the other hand, the position of the second stage is measured by second position measuring means constituting a closed loop control system,
Based on the measured position and the target value signal, the second error signal output means outputs an error signal corresponding to the deviation between the second stage and the first stage, and the second control means outputs the second error signal. The movement of the second stage is controlled via the moving means. Therefore, the relative position between the first stage and the second stage is accurately adjusted in a short time without increasing the vibration of the second stage.

The invention described in claim 3 is the invention according to claim 1 or 2
In the stage control device described in (1), the vibration component removing means (54) is a low-pass filter.

According to this, the high-frequency band component that makes the vibration larger is cut off due to the control characteristics of the second stage, and the low-pass filter that passes only the lower frequency band component is used. The stage can be moved without increasing the vibration.

According to a fourth aspect of the present invention, there is provided an exposure apparatus for transferring a pattern of a mask (R) onto a photosensitive substrate (W) via a projection optical system, wherein the photosensitive substrate (W) is mounted. The stage controller according to claim 1 or 2, which controls movement of a first stage (14) and a second stage (16) on which the mask (R) is mounted.

According to this, since the exposure apparatus of the present invention includes the stage control device, the first stage is a stage on which a photosensitive substrate is mounted, and the second stage is the second stage.
By setting this stage as a stage on which a mask is mounted and positioning the two stages relative to each other, highly accurate exposure can be performed, and the throughput of the exposure processing can be improved.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 schematically shows a configuration of a step-and-repeat type reduction projection type exposure apparatus (so-called stepper) 10 equipped with a stage control apparatus according to the present invention.

This reduction projection type exposure apparatus 10 holds a wafer W as a photosensitive substrate on a wafer support table 12 in two-dimensional directions (an X-axis direction parallel to the plane of FIG. 1 and a Y-axis direction orthogonal to the plane of FIG. 1). ) And a wafer stage 14 as a first stage movable to
4, a projection optical system PL whose optical axis direction is the Z-axis direction orthogonal to the XY plane, and a reticle R as a mask which is disposed further above the projection optical system PL and serves as a mask.
And a reticle stage 16 as a second stage that moves minutely in a plane parallel to the movement plane of the wafer stage 14 while holding the wafer.

More specifically, the reticle stage 16 is mounted on a reticle support 18 and a reticle R is held on the reticle stage 16 by a vacuum chuck (not shown) or the like. Reticle stage 16
In the plane perpendicular to the optical axis of the projection optical system PL, the X direction parallel to the plane of FIG. 1, the Y direction perpendicular to the plane of FIG.
Direction), a reticle driving device 1 as a second moving means
9, the reticle R can be moved by a very small amount, and the reticle R can be controlled with high accuracy in a two-dimensional plane. A movable mirror (actually, a movable mirror for Y-axis extended in the X-axis direction and a movable mirror for X-axis extended in the Y-axis direction)
Although there are movable mirrors for axes, these movable mirrors are typically shown as movable mirrors 20 in FIG. ) Are arranged, and an interferometer 22 as a second position detecting means arranged on the reticle support 18 (this interferometer is also actually an interferometer for measuring the position in the X axis direction and two interferometers in the Y axis direction). Although there are a total of three interferometers for measurement, these interferometers are typically illustrated as interferometers 22 in FIG. 1), so that the reticle stage 16 is always in the X, Y, and θ directions. Is monitored. The position information S1 obtained by the interferometer 22 is supplied to the main control system 24.

On the wafer support 12 described above,
A wafer Y-axis stage 26 movable in the Y-axis direction is mounted. On the wafer Y-axis stage 26, a wafer X-axis stage 28 movable in the X-axis direction is mounted. The wafer W is held on the wafer stage 14 by vacuum suction.

The above-mentioned wafer stage 14 is capable of minute movement in the Z-axis direction which is the optical axis direction of the projection optical system PL. The movable mirror 30 is placed on the wafer stage 14.
(Actually, there are a Y-axis moving mirror extending in the X-axis direction and an X-axis moving mirror extending in the Y-axis direction. In FIG. Is fixed, and an interferometer 32 as a first position detecting means disposed outside (this interferometer is actually also an interferometer for measuring the position in the X-axis direction and two Y-axis Although there are a total of three interferometers for measuring the directional position, these interferometers are typically shown as interferometers 32 in FIG. 1).
The positions of the wafer stage 14 in the X, Y, and θ directions are monitored, and position information obtained by the interferometer 32 is supplied to the main control system 24.

The main control system 24 controls the positioning operation of the wafer Y-axis stage 26, the wafer X-axis stage 28, and the wafer stage 14 via a wafer driving device 34 or the like as first moving means, and controls the entire apparatus. This controls the operation of.

As will be described later, the interferometer 32 on the wafer side is used.
In order to establish a correspondence between the wafer coordinate system defined by the coordinates measured by the reticle side and the reticle coordinate system defined by the coordinates measured by the reticle-side interferometer 22,
A reference mark plate 36 is fixed near the wafer W on the wafer stage 14.

As the projection optical system PL, a so-called double-sided telecentric system having a predetermined reduction ratio, for example, 1/5 is used. In this projection optical system PL, the surface of the wafer W and the pattern surface of the reticle R are set so as to be substantially conjugate with each other, and the wafer stage 1 is controlled based on a signal from a focus detection system (not shown).
Focusing operation is enabled by Z-driving 4 by a small amount.

Next, the stage control device according to the present embodiment is configured as shown in FIG. The main control system 24 in FIG. 2 is a target position (S2) of the wafer stage.
And a position error calculator 50 as first error signal output means for calculating an error signal between the current position of the wafer stage 14 and the current position of the wafer stage 14 measured by the interferometer 32. The error signal calculated by the position error calculator 50 is an operation signal. As a first control means for controlling the movement of the wafer stage, a specific frequency band in which vibration increases due to the control characteristics of the reticle stage included in the error signal from the position error calculation unit 50 A target value filter unit 54 as a vibration component removing unit having a built-in filter for cutting off components, and a reticle measured by the interferometer 22 as a target value signal using a signal from which a specific frequency band component has been removed by the target value filter unit 54. A position error calculating section 56 as a second error signal output means for calculating an error signal from the current position of the stage 16; And a like reticle stage control unit 58 as a second control means for controlling the movement of the reticle stage the computed error signal as an operation signal.

The target value filter unit 54, which is a characteristic component of the present embodiment, will be described.

The target value filter unit 54 has a built-in filter for cutting a specific frequency band component included in a position error signal between the target position and the current position of the wafer stage 14 output from the position error calculation unit 50 described above. ing. This particular frequency band component is, as shown in FIG.
It means a frequency band component in which the sensitivity function (so-called disturbance suppression characteristic) of the control characteristic including the mechanical system in the reticle stage 16 exceeds 0 dB (f1 to f2 in FIG. 3). Generally, in a higher-order system including mechanical resonance, FIG.
As shown in the figure, the portion where the sensitivity function exceeds 0 dB (f
1 to f2), the reticle stage control unit 5
When an input signal containing the frequency band components (f1 to f2) is input as an operation signal to the control signal 8, the vibration increases and an error in positioning to the target value increases. Such a frequency band (f1 to f2) can be specified in advance according to a system including a mechanical system. For this reason, in the present embodiment, a filter having a characteristic capable of selectively removing the frequency band components (f1 to f2) known in advance is built in the target value filter unit 54. FIG. 4 shows the frequency characteristics of the target value filter unit 54 used in the present embodiment. As shown in FIG. 4, the target value filter unit 54 is a low-pass filter that reduces signal components in the frequency band of f1 to f2 and passes a frequency band component lower than f1.

Next, the operation of the stage control device of the present embodiment configured as described above will be described with reference to FIGS.

The target position (S 2) of the wafer stage is input from a main computer (not shown) to the position error calculator 50 of the main control system 24 shown in FIG. The 14 current positions are input, and a position error (position deviation) with respect to the target position is calculated and sent to the wafer stage control unit 52. The wafer stage control unit 52 performs a control operation (P or PI operation) using the position error as an operation signal, and gives a control amount to the wafer driving device 34. The wafer driving device 34 drives the wafer stage by generating a thrust according to the given control amount. As a result, the wafer stage 14 moves, the position of the wafer stage 14 is measured by the interference system 32, and the measured value is fed back to the position error calculator 50 described above. Such a feedback control operation is performed such that the difference between the target position by the servo and the current position of the wafer stage measured by the interferometer 32 converges to zero, and the feedback control operation is performed at the target position. Is controlled as close as possible to This means that if the wafer stage is rotated by θ or there is a control offset (a certain amount of error), the wafer stage can be accurately moved to the target position even if it can be moved near the target position. Is not possible.

Therefore, in the stage control device according to the present embodiment, when the wafer stage is displaced from the target position, relative positioning is performed by moving the reticle stage side. Reticle stage control unit 58
When the movement of the reticle stage 16 is controlled by
An error signal from a position error calculator 50 for calculating the error between the wafer stage position and the target position is used as a target value signal. At this time, the reticle stage 14
If a frequency band component that increases the vibration of the reticle stage 14 is included, the vibration occurs during the movement of the reticle stage 14 and causes a position error.
The error signal passed through is used.

As shown in FIG. 3, the sensitivity function of the control characteristic of the reticle stage 16 is 0 in the frequency band between f1 and f2.
If it exceeds dB, f1 to f2 as shown in FIG.
A target value filter unit 54 having a built-in filter (low-pass filter) having a characteristic of selectively removing the frequency band component is used. As a result, even if the reticle stage 16 is driven by using the error signal output from the position error calculation unit 50 as a target value signal, the vibration of the reticle stage 16 does not increase, so that the reticle stage is relatively positioned at the wafer stage position. In this case, the alignment error can be reduced.

Referring to FIG. 5A, a low-pass filter process having the characteristics shown in FIG. 4 is performed on the frequency spectrum (solid line W) of the error signal of the wafer stage output from the position error calculator 50. As a result, the frequency spectrum becomes as shown by the broken line F, and the frequency band components (f1 to f2) on the high frequency side that increase the vibration of the reticle stage 16 by filtering are selectively removed.

As described above, the position error calculating section 56 which is provided with the error signal from which the specific frequency band component has been removed as the target value signal of the reticle stage,
Is calculated with respect to the position signal from the interferometer 22 for measuring the current position. The error signal calculated by the position error calculator 56 is provided to the reticle stage controller 58 as an operation signal. Reticle stage control unit 58
Feedback-controls the reticle driving device 19 so that the error signal converges to zero, and when the error signal becomes zero, it means that the relative positioning of the wafer stage 14 and the reticle stage 16 has been completed, The movement control of the reticle stage 16 is stopped.

Referring to FIG. 5B, a frequency spectrum (solid line F) obtained by filtering an error signal of the wafer stage with respect to the target position by a low-pass filter is used as a target value signal, and a reticle is formed based on the target value signal. In the frequency spectrum (dashed line R) when the stage is made to follow, since the frequency band component that increases the vibration is reduced due to the control characteristics of the reticle stage, the vibration of the reticle stage 16 shows the conventional example in FIG. It can be seen that it is greatly reduced as compared with.

As a result of the relative positioning of the wafer stage and the reticle stage as described above, the relative position error (dashed lines R and W) between the wafer stage 14 and the reticle stage 16 is shown in FIG. As described above, the frequency spectrum (solid line W) when the positioning is performed only by the wafer stage 14 can be further reduced, and the alignment between the wafer stage and the reticle stage can be performed with high accuracy. Can be improved.

Further, the relative positioning between the wafer stage side and the reticle stage side is converged to the target position while being automatically controlled mutually, and the vibration generated at that time can be suppressed. The settling time of the stage to be aligned is shortened, the alignment time is shortened, and the throughput of the exposure processing can be improved.

In the above-described embodiment, the low-pass filter is used for the target value filter section 54 as the vibration component removing means. However, the present invention is not limited to this. Since the frequency band components that increase the vibration are individually different from each other in terms of control characteristics, it is necessary to use a filter having characteristics corresponding to each frequency band.

As the type of filter, for example, a moving average filter may be used in addition to the low-pass filter.

Further, the configuration of the filter includes an analog filter that performs analog processing like an electric circuit, and a C filter.
A digital filter that performs digital processing using a PU or the like may be used.

In the above embodiment, the case where the present invention is applied to the exposure apparatus of the step-and-repeat method has been described. However, the scope of the present invention is not limited to this, and the present invention is not limited to this. Scan method, can be applied to other exposure equipment,
Furthermore, the present invention is not limited to the exposure apparatus, and any apparatus that can control the position of two stages relative to each other can be suitably applied.

For example, when the present invention is applied to a scanning type exposure apparatus, a combination of a coarse movement stage in place of the wafer stage and a fine movement stage in place of the reticle stage may be used.
Synchronous control of two stages can be performed with high accuracy and responsiveness.

[0049]

As described above, according to the first to third aspects of the present invention, when the two stages are relatively positioned, they are included in the error signal from the target value of one of the stages. By controlling the movement of the other stage using the signal from which the frequency component that increases the vibration has been removed as the target value signal, the positioning of both stages can be performed with high accuracy, and the positioning until the vibration of the stage is settled. There is an unprecedented excellent effect that time can be shortened.

According to the fourth aspect of the present invention, the stage control device of the present invention is applied to control of two stages on which the photosensitive substrate and the mask of the exposure device are mounted, respectively. Thus, there is an effect that an exposure operation with good throughput can be performed.

[Brief description of the drawings]

FIG. 1 is a diagram showing the configuration of a step-and-repeat reduction projection exposure apparatus including a stage control device according to the present invention.

FIG. 2 is a block diagram showing a relationship between a main control system having a characteristic configuration of the present embodiment and each control system of a wafer stage and a reticle stage.

FIG. 3 is a diagram showing a sensitivity function of a control characteristic including a mechanical system of a reticle stage.

FIG. 4 is a characteristic diagram of a target value filter used in the present embodiment.

5A and 5B show frequency spectra of a wafer stage and a reticle stage used in the present embodiment, and FIG. 5A shows a frequency spectrum of a position error signal of the wafer stage and a case where a low-pass filter process is performed on the position error signal. It is a figure which shows a frequency spectrum, (b) is a figure which shows the frequency spectrum when the reticle stage follows the target value signal-processed in (a), (c) moves only the wafer stage, FIG. 9 is a diagram illustrating a position error when the wafer stage is moved and a relative position error when both the wafer stage and the reticle stage are moved.

FIG. 6 is a block diagram showing a configuration of a control system of a conventional stage control device.

7A and 7B show frequency spectra of a wafer stage and a reticle stage in a conventional example, and FIG. 7A shows a frequency spectrum of a position error signal of the wafer stage and a frequency spectrum of a position error signal of the reticle stage following the position error signal. FIG. 4B is a diagram showing a position error when only the wafer stage is moved using the position error signal shown in FIG. 4A and a relative position error when both the wafer stage and the reticle stage are moved. FIG.

[Explanation of symbols]

Reference Signs List 10 reduction projection exposure apparatus (exposure apparatus) 14 wafer stage (first stage) 16 reticle stage (second stage) 19 reticle driving apparatus (second moving means, part of closed loop control system) 22 interferometer (second No. 2 position detecting means, part of closed loop control system) 32 Interferometer (first position detecting means, part of control system) 34 Wafer driving device (first moving means, part of control system) 50 position Error calculation unit (first error signal output unit) 52 Wafer stage control unit (first control unit, part of control system) 54 Target value filter unit (vibration component removal unit) 56 Position error calculation unit (second Error signal output means, part of closed loop control system) 58 Reticle stage controller (second control means, part of closed loop control system) W Wafer (photosensitive substrate) R Reticle (mask)

Claims (4)

[Claims] 1. A stage control device for relatively positioning a first stage and a second stage, wherein the control system controls movement of the first stage according to a target value; First error signal output means for outputting an error signal corresponding to a deviation from a target value of one stage; a specific frequency band component included in the error signal and increasing vibration due to control characteristics of the second stage And a closed-loop control system that controls the movement of the second stage using the error signal from which a specific frequency band component has been removed by the vibration component removing means as a target value signal. Stage control device. 2. The control system includes: first position detecting means for detecting a position of the first stage; first moving means for moving the first stage in a predetermined direction; The first stage moves to a target position using an error signal from the first error signal output unit output based on a target value of the stage and a detection position of the first position detection unit as an operation signal. First control means for controlling the first moving means so as to perform the control, the closed loop control system includes: a second position detection means for detecting a position of the second stage; and the second Second moving means for moving the stage in a predetermined direction; the error signal from which a specific frequency band component has been removed by the vibration component removing means is set as a target value signal of the second stage; The second
A second error signal output means for outputting an error signal based on a deviation from a position detected by the position detection means; an error signal output from the second error signal output means as an operation signal;
2. The stage control device according to claim 1, further comprising a second control unit that controls the second moving unit so that the position of the second stage is adjusted to the position of the first stage. 3. 3. The stage control device according to claim 1, wherein the vibration component removing unit is a low-pass filter. 4. An exposure apparatus for transferring a pattern of a mask onto a photosensitive substrate via a projection optical system, wherein the first stage has the photosensitive substrate mounted thereon, and the second stage has the mask mounted thereon. An exposure apparatus comprising: the stage control device according to claim 1 or 2 as a stage control device for controlling movement of the stage.