JP2001135561A - Stage system, aligner and method of fabrication for device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform highly accurate positional control of a fine motion stage over a wide control band. SOLUTION: The stage system comprises a fine motion stage 3 for moving a position control object while holding, a rough motion stage 4 for moving the fine motion stage while mounting, first means for measuring the position of a mirror 2 fixed to the rough motion stage by irradiating the mirror with laser light, a second means for measuring the relative position between the fine motion stage and the rough motion stage or the mirror, and means for controlling the position of the fine and rough motion stages based on the positions measured the first and second position measuring means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage device used for controlling the position of a substrate or the like at high speed and with high accuracy in a semiconductor exposure apparatus or the like.

[0002]

2. Description of the Related Art FIG. 10 shows a structure of a wafer stage in a conventional semiconductor exposure apparatus. In the following, the position in the three translational axes (X, Y, Z) directions with respect to the reference coordinate system and the positions in the three rotational axes (Θx, Θy, Θz) directions around the three translational axes will be referred to as a six-degree-of-freedom position. I do. In the figure, 41
Is a surface plate, which is supported by a floor F via a damper. Reference numeral 43 denotes a Y stage, which can be moved in the Y direction on the reference surface of the surface plate 41 by a Y linear motor 46 that generates a thrust in the Y direction along a fixed guide 42 fixed to the surface plate 41. The space between the surface plate 41 and the Y stage and the space between the fixed guide 42 and the Y stage 43 are connected by air via air pads 44a to 44c, which are static pressure bearings, and are non-contact. The Y stage 43 has a guide in the X direction, and thereby guides the X stage 45 mounted on the Y stage 43 in the X direction. The Y stage 43 is provided with an X linear motor stator that generates a force in the X direction, and cooperates with the X linear motor mover provided on the X stage 45 to convert the X stage 45 to the Y stage. Then, it is driven in the X direction. The platen 41, the X guide, and the X stage 45 are connected by air via an air pad, which is a static pressure bearing, and are non-contact.

[0003] A tilt stage 48 is mounted on the X stage 45. A stage substrate 51 provided with a wafer chuck holds a wafer 53 as an object to be exposed. The stage substrate 51 is mounted on the tilt stage 48. The tilt stage 48 moves the stage substrate 51 in the Z direction and rotates three axes (Θ) by the thrust of a linear motor (not shown).
(x, Θy, Θz) direction rotation. Stage substrate 51
Above are provided measurement mirrors 49a and 49b used for position measurement in the X and Y directions. Ideally, measurement mirrors 49a and 49b are integrated with stage substrate 51, but may be separately manufactured due to manufacturing restrictions and joined by some connection means.

FIG. 8 is a top view of the stage substrate 51 shown in FIG. 10. The position measuring mirror is composed of two mirrors 49a for measuring the position in the X direction and 49b for measuring the position in the Y direction. Is shown. FIG. 9 shows FIG.
3 shows the side surface of the stage substrate 51 in detail.
The position measuring mirrors 49a and 49b are
4 is supported on the stage substrate.

[0005] With the stage device of this semiconductor exposure apparatus, an in-plane direction (X, Y,.
z) and positioning in six degrees of freedom in the vertical direction (Z, Θx, Θy), and exposure for one chip is performed. The position in the in-plane direction is measured by using a laser interferometer 50 integrated with a lens barrel (not shown), and the tilt direction is measured by an alignment measurement system (not shown) integrated with the lens barrel.
Thus, the position in the Z direction and the angle of the rotation component are measured.
In FIG. 10, it is assumed that the lens barrel and the surface plate 41 are integral, and for convenience, a laser interferometer 50 is provided on the surface plate 41. Although a measuring device in the Z direction is not shown, by measuring three points on the stage substrate 51 or the wafer 53 from the lens barrel, the measurement in the Z direction (Z) and the tilt direction (Δx, Δy) can be performed. It is possible.

The positioning in these six axes is achieved by forming a servo system for each axis. Based on the position information from the laser interferometer, the compensator calculates a drive command for an X-direction linear motor and a Y-direction linear motor, which are actuators for the X and Y directions of the stage, and drives the X and Y stages. . In addition, a compensator calculates a drive command value for the actuator of the tilt stage 48 in accordance with the position in the Z direction, the angle in the rotation direction, and the measured value in the Z direction, and drives the tilt stage 48.

As described above, the wafer stage can arbitrarily control the positions of six degrees of freedom of three translational axes and three rotational axes with respect to the lens barrel as the reference position, and can perform precise positioning. .

[0008]

As described above, highly accurate position measurement of the stage is performed by using a laser interferometer and a mirror in combination. Since the final position control is performed on the wafer itself, mounting the mirror on the wafer substrate close to the wafer is natural from the viewpoint of accuracy. However, mounting a mirror is a disadvantageous factor from a vibrational point of view.

In order to realize a highly accurate position control system,
The gain of the position control loop needs to be high. For that purpose, it is necessary to design the resonance frequency of the mechanical system included in the control loop to be high. In the position control system of the tilt stage, when the mirror is mounted on the tilt stage, the coupling rigidity between the mirror and the tilt stage, that is, FIG.
The resonance point formed by the rigidity of the support member 54 directly enters the position control loop of the tilt stage. Therefore, if the frequency of the resonance point is low, the control loop gain of the position control loop of the tilt stage cannot be increased. Therefore, a highly accurate position control system cannot be configured.

[0010] As can be seen from FIG.
It is required that the area of stage substrate 51 on which a and 49b are mounted be made large. This increases the weight of the tilt stage. The weight of the mirror itself also increases the weight of the tilt stage. Mounting the measurement mirror on the tilt stage in this way increases the area and weight of the tilt stage. These factors lower the frequency of the vibration mode of the tilt stage, and ultimately lower the servo band of the tilt stage.

Therefore, the present invention provides a stage device comprising:
It is an object to perform high-precision position control with a wide control band for a fine movement stage. In the above description, the stage on which the wafer is mounted is referred to as a tilt stage. However, in the following description, the stage for which the final position accuracy equivalent to the tilt stage is required is the fine movement stage.
The stage on which the stage is mounted is called a coarse movement stage.

[0012]

In order to solve the above-mentioned problems, a first stage device of the present invention comprises a fine movement stage which moves while holding an object to be position-controlled, and moves by mounting the fine movement stage. A coarse movement stage, first position measurement means for irradiating a mirror mounted on the coarse movement stage with laser light to measure the position of the mirror, and measuring a relative position between the fine movement stage and the coarse movement stage Second
And position control means for controlling the positions of the fine movement stage and the coarse movement stage based on the positions measured by the first and second position measurement means.

The second stage device includes a fine moving stage that holds and moves the object to be position-controlled, a coarse moving stage that carries the fine moving stage, and a laser mounted on a mirror attached to the coarse moving stage. First position measuring means for irradiating light to measure the position of the mirror, second position measuring means for measuring a relative position between the fine movement stage and the mirror, and the first and second position measuring means And a position control means for controlling the positions of the fine movement stage and the coarse movement stage based on the measurement positions of the fine movement stage and the coarse movement stage.

The third stage device is similar to the second stage device, and further includes third position measuring means for measuring a relative position between the mirror and the coarse movement stage, and the position control means includes a first position measuring device and a second position measuring device. The position of the fine movement stage and the coarse movement stage are controlled based on the positions measured by the second and third position measurement means.

In a fourth stage apparatus, in any one of the first to third stage apparatuses, each position measuring means measures a position having six degrees of freedom, and the position control means comprises the fine movement stage. And the position of the coarse movement stage is controlled.

The fifth stage apparatus is characterized in that in any one of the first to fourth stage apparatuses, an electromagnetic non-contact actuator for driving the fine movement stage is provided.

Further, the exposure apparatus of the present invention provides the first apparatus of the present invention.
To any of the fifth to fifth stage devices. Further, the device manufacturing method of the present invention includes the steps of preparing the exposure apparatus of the present invention, applying a photosensitive material to the wafer, exposing the wafer with the exposure apparatus, and developing the exposed wafer. It is characterized by having.

In the configuration of the present invention, the mirror which deteriorates the control characteristics of the fine movement stage (tilt stage) is arranged on the coarse movement stage, and the position of the fine movement stage is adjusted by the coarse movement stage or the mirror arranged thereon. The position is obtained by measuring the relative position between the micromotion stage and the fine movement stage. According to this, since the resonance frequency caused by the rigidity of the mirror can be configured outside the control system of the fine movement stage, a high-precision position control system with a wide control band is realized for the fine movement stage. Further, by removing the mirror from the fine movement stage, the size and weight of the fine movement stage can be reduced, and the frequency of the vibration mode of the fine movement stage can be designed on the high frequency side. This also has the effect of increasing the servo band of the control system of the fine movement stage.

[0019]

[Embodiment 1] FIG. 1 is a configuration diagram of a mechanical system of a stage device according to a first embodiment of the present invention. The drive mechanism of the coarse movement stage 4 and the drive mechanism of the fine movement stage 3 have the same configuration as that of the above-described wafer stage, and thus the description is omitted.
As shown in the figure, this device is mounted on a fine movement stage 3 that holds a target object for position control and performs fine movement, a coarse movement stage 4 that mounts the fine movement stage 3 and performs coarse movement, and a coarse movement stage 4. A laser interferometer for measuring the position of the mirror 2 by irradiating the mirror 2 with laser light from the lens barrel support 1 (reference structure), and a detector for measuring a relative position 7 between the fine movement stage 3 and the coarse movement stage 4 The positions of the fine movement stage 3 and the coarse movement stage 4 are controlled based on the measurement results obtained by the laser interferometer and the detector.

This configuration is effective when the joint 5 between the coarse movement stage 4 and the mirror 2 has sufficient rigidity. This configuration has a greater degree of freedom in the location for detecting the relative position between the coarse movement stage 4 and the fine movement stage 3 and is easier to design than the configuration described in the second embodiment.

FIG. 6 shows a position control means 10 in the mechanical system shown in FIG.
FIG. The operation will be described using this. The laser interferometer 11 has a position 14 in the space of the mirror 2 rigidly attached to the coarse movement stage 4 and a lens barrel 1.
Relative position 18 between position 17 in space of (reference structure)
Is measured, and a measured value 6 is output. On the other hand, the position detector 12
Measures the relative position 7a between the position 15 of the fine movement stage 3 in the space and the position 14 of the mirror 2 in the space, and outputs the measurement result as the relative position 7. The position 19 of the fine movement stage 3 with respect to the lens barrel 1 is calculated from the position 7 and the position 6 from the laser interferometer 11.

Based on the difference between the position command value 22 to the coarse movement stage 4 and the position 6 of the coarse movement stage 4, the position compensator 2
Reference numeral 4 denotes a coarse movement stage drive unit (not shown) that drives the coarse movement stage 4 to generate a thrust 26 to drive the coarse movement stage 4. Further, based on the difference between the position command value 21 to the fine movement stage 3 and the position 19, the position compensator 23 of the fine movement stage 3 generates a driving thrust 25 of the fine movement stage 3 by the fine movement stage driving means (not shown). The fine movement stage 3 is driven by this force to control the position.

As described above, according to the present embodiment, the mirror for deteriorating the control characteristics of the fine movement stage is arranged on the coarse movement stage, and the position of the fine movement stage or the mirror on the coarse movement stage and the fine movement stage Is obtained by measuring the relative position of the fine movement stage, it is possible to perform high-precision position control with a wide control band for the fine movement stage.
Further, the size and weight of the fine movement stage can be reduced, and the frequency of the vibration mode of the fine movement stage can be shifted to the high frequency side, so that the servo band of the control system of the fine movement stage can be increased.

[Second Embodiment] In the first embodiment, the mirror 2 is used.
It is assumed that the coupling rigidity between the mirror 2 and the coarse movement stage 4 is sufficiently high and the mirror 2 and the coarse movement stage 4 can be regarded as one rigid body. However, actually, the coupling rigidity between the mirror 2 and the coarse movement stage 4 has a finite value, and has a certain resonance frequency.
Therefore, if the resonance frequency is not sufficiently high, the vibration at the resonance point created by the mirror 2 and the coarse movement stage 4 enters the position control loop of the fine movement stage 3 and limits the servo band of the fine movement stage 3.

In this embodiment, as shown in FIG. 2, the relative position 8 between the fine movement stage 3 and the mirror 2 is measured. According to this configuration, if the rigidity of the mirror 2 main body is sufficiently high, a resonance point due to the joining of the mirror 2 and the coarse movement stage 4 does not enter the servo loop of the fine movement stage 3, so that the servo band of the fine movement stage 3 is increased. It becomes possible to set. Therefore, high-precision position control of fine movement stage 3 becomes possible.

On the other hand, since the resonance point is included in the position measurement value of the coarse movement stage 4, when the resonance frequency is low, the servo band of the coarse movement stage 4 is limited. Therefore, in this configuration, although it is desired to increase the servo band of the fine movement stage 3,
This is effective as an application example where the servo band of the coarse movement stage 4 may be low.

[Embodiment 3] In the configuration of Embodiment 2, the servo loop of the fine movement stage 3 is composed of the coarse movement stage 4 and the mirror 2.
Since this becomes irrelevant to the resonance point, the servo band can be set high. On the other hand, since this resonance point enters the servo loop of the coarse movement stage 4, the coarse movement stage 4
Is limited to this resonance frequency.

Therefore, in this embodiment, as shown in FIG.
A means for measuring the relative position 9 between the mirror 2 and the coarse movement stage 4 is further provided in the configuration of the second embodiment. Then, the relative position between the mirror 2 and the coarse movement stage 4 is measured, and a position control system of the coarse movement stage 4 is configured using this position information. The resonance point of the mirror 2 is prevented from entering. Therefore, with this configuration, it is possible to set the servo band of the position control system of coarse movement stage 4 high. In this configuration, the servo band of the fine movement stage 3 and the coarse movement stage 4
This is effective when it is desired to increase both of the servo bands.

FIG. 7 shows a position control means 10 in the mechanical system shown in FIG.
FIG. 3 is a block diagram of a configuration in which is incorporated. The operation of the present embodiment will be described using this. The laser interferometer 11 measures a relative position 18 between a position 14 in the space of the mirror 2 and a position 17 in the space of the lens barrel support 1 (reference structure), and outputs a measured value 6. The measuring device 13 measures the relative position 9a between the mirror 2 and the coarse movement stage, which is the difference between the position 16 in the space of the coarse movement stage 4 and the position 14 in the space of the mirror 2, and determines the relative position 9 Output. Based on this position 9 and the position 6 from the laser interferometer 11, the lens barrel 1 of the coarse movement stage 4
Is calculated.

On the other hand, the position detector 12 is
The relative displacement 7a between the position 15 in the space of the mirror 2 and the position 14 in the space of the mirror 2 is measured, and the measurement result is output as the relative position 8. Based on the position 8 and the position 6 from the laser interferometer 11, the position 19 of the fine movement stage 3 with respect to the lens barrel support 1 is calculated.

The position compensator 24 generates a thrust 26 by coarse movement stage driving means (not shown) for driving the coarse movement stage 4 based on the difference between the position command value 22 and the position 20 to the coarse movement stage 4, The coarse movement stage 4 is driven. Further, the position compensator 23 applies a driving thrust 25 to the fine movement stage 3 by a fine movement stage driving means (not shown) based on a difference between the position command value 21 to the fine movement stage 3 and the position 19.
The fine movement stage 3 is driven by this force to control the position.

[Embodiment 4] In Embodiments 1 to 3 described above, no mention was made of the measurement directions (X, Y, Z, Θx, Θy, Θz) and the number of axes. These configurations are determined from the relationship between the required control axes and the accuracy. Here, a case is considered where the coarse movement stage 4 and the fine movement stage 3 are configured by six-axis control in the configuration of FIG. As shown in FIG. 4, by using six laser interferometers, the six-axis position of the mirror 2 with respect to the lens barrel 1 can be measured. Also, the relative position between the coarse movement stage 4 and the fine movement stage 3 is set to 6
By measuring with relative position measuring devices such as linear encoders, the relative positions of six axes between the coarse movement stage 4 and the fine movement stage 3 can be measured. Using these two 6-axis position information, the coarse movement stage 4
And a six-axis position control system of the fine movement stage 3 can be realized.

FIG. 4A is a view of the stage device of this embodiment as viewed from above, and FIG. 4B is a view of the stage device as viewed from the side. The measuring beams 30a to 30c from the laser interferometer are arranged on the same plane, and the positions thereof in the X direction and Y
The rotational position Θy around the axis is measured. In addition, measurement light 30c
Is reflected by a triangular mirror and further reflected by a mirror (not shown) attached to the lens barrel support 1, whereby the position in the Z direction can be measured. The measuring beams 30d and 30e from the laser interferometer are in the same plane, and measure the position in the Y direction and the rotational position Δx around the X axis. The measuring light 30f can be combined with the measuring light 30d.
Measure z. Thus, the six-axis position of the coarse movement stage 4 with respect to the lens barrel 1 can be measured.

The relative position measuring devices 31a to 31f measure the relative positions of the coarse moving stage 4 and the fine moving stage 3. The relative position measuring device 31a measures the position in the X direction, and the relative position measuring device 31c measures the position in the Y direction. Rotational position Θz around the Z axis by relative position measuring devices 31a and 31b
Can be measured. Further, the relative position measuring devices 31d to 31f can measure the position in the Z direction and Δx and Δy. Using the above-mentioned laser interferometer and signals output from these relative position detectors, a control system for six-axis position can be configured according to the configuration of FIGS.

[Embodiment 5] The embodiment 1 did not refer to the force generation mechanism. In this embodiment, a method using an electromagnetic actuator as a thrust generating mechanism will be described. In order to increase the control accuracy of the fine movement stage 3, it is desirable that the vibration of the coarse movement stage 4 is not transmitted to the fine movement stage 3. Therefore, it is desirable that the fine movement stage is supported in a non-contact manner with respect to the coarse movement stage, and it is desirable to use a linear motor capable of applying a force in a non-contact manner as an actuator for driving the fine movement stage 3.
The mover side of the linear motor is the fine movement stage 3. On the other hand, it is desirable to use the coarse movement stage 4 on the stator side. By using the stator as the coarse movement stage 4, the movable range of the actuator of the fine movement stage 3 can be shortened. The stator can be provided, for example, on a surface plate or the like that supports the coarse movement stage 4, but in this case, the movable range of the actuator needs to be long.

Therefore, in the present embodiment, an actuator 32 is added between the coarse movement stage 4 and the fine movement stage 3 to the structure shown in FIG. If actuators for six axes are prepared, the fine movement stage can be moved in six axes directions with respect to the coarse movement stage.

[Embodiment of Exposure Apparatus] Next, an embodiment of a scanning exposure apparatus in which the stage apparatus of the above-described embodiment is mounted as a wafer stage will be described with reference to FIG. The lens barrel base 96 is supported from a floor or a base 91 via a damper 98. The lens barrel base 96 supports the reticle stage base 94 and also supports a projection optical system 97 located between the reticle stage 95 and the wafer stage 93. The wafer stage 93 is supported on a stage base 92 supported by a floor or a base 91,
The wafer is placed and positioned. The reticle stage 95 is supported on a reticle stage base 94 supported by a lens barrel base 96, and is movable with a reticle on which a circuit pattern is formed. Exposure light for exposing the reticle mounted on the reticle stage 95 to the wafer on the wafer stage 93 is generated from an illumination optical system 99.

The wafer stage 93 is scanned in synchronization with the reticle stage 95. Reticle stage 9
During the scanning of the wafer 5 and the wafer stage 93, the positions of the two are continuously detected, and are fed back to the driving units of the reticle stage 95 and the wafer stage 93, respectively.
The position measurement of wafer stage 93 is performed by the above-described position measurement method. As a result, both the scanning movement start positions can be accurately synchronized, and the scanning speed of the constant-speed scanning region can be controlled with high accuracy. The reticle pattern is exposed on the wafer while both are scanningly moved with respect to the projection optical system 97, and the circuit pattern is transferred. According to the present embodiment, high-speed and high-precision exposure can be performed because the stage apparatus of the above-described embodiment is used as a wafer stage.

[Embodiment of Device Manufacturing Method] Next, an embodiment of a method of manufacturing a semiconductor device using the above-described exposure apparatus will be described. FIG. 12 shows a semiconductor device (IC, L
1 shows a manufacturing flow of a semiconductor chip such as an SI, a liquid crystal panel, a CCD, and the like. In step S1 (circuit design), a circuit of a semiconductor device is designed. In step S2 (mask production), a mask on which the designed circuit pattern is formed is produced. In step S3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step S4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. Step S5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer prepared in step S4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). Including. In step S6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step S5 are performed. Through these steps, a semiconductor device is completed and shipped (step S7).

FIG. 13 shows the wafer process (step S).
The detailed flow of 4) is shown. In step S11 (oxidation), the surface of the wafer is oxidized. Step S12 (CV
In D), an insulating film is formed on the wafer surface. Step S1
In 3 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step S14 (ion implantation), ions are implanted into the wafer. In step S15 (resist processing), a photosensitive agent is applied to the wafer. In step S16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the exposure apparatus described above. In step S17 (developing), the exposed wafer is developed. In step S18 (etching), portions other than the developed resist image are removed. In step S19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. By using the manufacturing method of this embodiment,
A highly integrated semiconductor device, which was conventionally difficult to manufacture, can be manufactured.

[0041]

As described above, according to the present invention, the mirror for deteriorating the control characteristics of the fine moving stage is arranged on the coarse moving stage, and the position of the fine moving stage is set to the fine moving stage or the mirror on the coarse moving stage. Since the position can be obtained by measuring the relative position with respect to the stage, high-precision position control with a wide control band for the fine movement stage can be performed.
Further, the size and weight of the fine movement stage can be reduced, and the frequency of the vibration mode of the fine movement stage can be shifted to the high frequency side, so that the servo band of the control system of the fine movement stage can be increased.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a mechanical system of a stage device according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram of a mechanical system of a stage device according to a second embodiment of the present invention.

FIG. 3 is a configuration diagram of a mechanical system of a stage device according to a third embodiment of the present invention.

FIG. 4 is a top view and a side view of a stage device according to a fourth embodiment of the present invention.

FIG. 5 is a configuration diagram of a mechanical system of a stage device according to a fifth embodiment of the present invention.

FIG. 6 is a block diagram of a configuration in which position control means is incorporated in the mechanical system of FIG.

FIG. 7 is a block diagram of a configuration in which position control means is incorporated in the mechanical system of FIG.

FIG. 8 is a top view of a fine movement stage according to the related art.

FIG. 9 is a side view of a fine movement stage according to the related art.

FIG. 10 is a diagram showing a configuration of a stage device according to a conventional technique.

FIG. 11 is an elevational view showing an embodiment of a scanning exposure apparatus equipped with the stage device of the present invention.

FIG. 12 is a flowchart illustrating an embodiment of a method of manufacturing a semiconductor device using the exposure apparatus of the present invention.

FIG. 13 is a flowchart showing a detailed flow of a wafer process in FIG. 12;

[Explanation of symbols]

1: reference structure, 2: mirror, 3: fine movement stage, 4: coarse movement stage, 5: support member, 6: laser interferometer measurement position, 7: relative position measurement value between coarse movement stage and fine movement stage, 7a: Relative position between the coarse and fine stages,
8: measured relative position between mirror and fine movement stage, 9: measured relative position between mirror and coarse movement stage, 9a: relative position between mirror and coarse movement stage, 10: position control means, 1
1: laser interferometer, 12: relative position measuring device between coarse moving stage and fine moving stage, 13: relative position measuring device between mirror and coarse moving stage, 14: mirror spatial position, 15: fine moving stage spatial position, 16: Coarse stage position, 17:
Reference structure space position, 18: Relative position between reference structure and mirror, 19: Fine movement stage calculation position, 20: Coarse movement stage calculation position, 21: Fine movement stage position command value, 22: Coarse movement stage position command value, 23: Fine movement stage position compensation means, 24: coarse movement stage position compensation means, 25: fine movement stage drive thrust, 26: coarse movement stage drive thrust, 30a-
30f: laser interferometer measurement value, 31a to 31f: relative position measurement value, 32: electromagnetic actuator, 41: surface plate, 4
2: fixed guide, 43: Y stage, 44a to 44c:
Air pad, 45: X stage, 46: Y linear motor, 48: tilt stage, 49a, 49b: mirror,
50: laser interferometer, 51: stage substrate, 53: wafer, 54: support member, 91: base, 92: stage base, 93: wafer stage, 94: reticle stage base, 95: reticle stage, 96: mirror Tube surface plate, 97:
Projection optical system, 98: damper, 99: illumination optical system.

Claims (7)

[Claims] A fine movement stage for holding and moving an object to be position-controlled; a coarse movement stage for mounting and moving the fine movement stage; and irradiating a mirror attached to the coarse movement stage with laser light. First position measuring means for measuring the position of the mirror, second position measuring means for measuring a relative position between the fine movement stage and coarse movement stage, and measurement positions by the first and second position measurement means And a position control means for controlling the positions of the fine movement stage and the coarse movement stage based on the condition. 2. A fine movement stage that holds and moves an object to be position-controlled, a coarse movement stage that mounts and moves the fine movement stage, and irradiates a mirror attached to the coarse movement stage with laser light. First position measuring means for measuring the position of the mirror, second position measuring means for measuring a relative position between the fine movement stage and the mirror,
And a position control means for controlling the positions of the fine movement stage and the coarse movement stage based on the positions measured by the second position measurement means. And a third position measuring means for measuring a relative position between the mirror and the coarse movement stage, wherein the position control means sets a position measured by the first, second and third position measuring means. 3. The stage apparatus according to claim 2, wherein the positions of the fine movement stage and the coarse movement stage are controlled based on the movement. 4. Each position measuring means measures a position having six degrees of freedom, and the position control means controls a position having six degrees of freedom of the fine movement stage and a position of the coarse movement stage. Claim 1 characterized by the fact that
4. The stage device according to any one of items 3. 5. The stage apparatus according to claim 1, further comprising an electromagnetic non-contact actuator for driving the fine movement stage. 6. An exposure apparatus comprising the stage device according to claim 1. 7. The method according to claim 6, further comprising the steps of: preparing the exposure apparatus according to claim 6; applying a photosensitive material to the wafer; exposing the wafer with the exposure apparatus; and developing the exposed wafer. Characteristic device manufacturing method.