JPH10125222A - Manufacture of shadow mask, and exposure device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture shadow masks with a high yield by reducing the occurrence of defects caused by the attachment of foreign matters. SOLUTION: In this method for manufacturing shadow masks, a pair of original plates 12a and 12b forming a pattern corresponding to an opening hole on both sides of an electron beam passage hole of the shadow mask are exposed to carry out printing of the pattern of the original plate in a state in close contact with a resist formed on both sides of a shadow mask material 10. Then, protecting films 26a and 26b are disposed between the shadow mask material 10 and the original arts 12a and 12b, and the original arts 12a and 12b are exposed in such a state as closely contacted to the resist through the protecting films. After exposure is completed, an exposed portion of a band-like metal plate is forwarded to the outside of arrangement of a vacuum close contact printing frame, and a portion in close contact with an exposed portion of the protecting film is also forwarded to the outside thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a color CRT shadow mask and an exposure apparatus.

[0002]

2. Description of the Related Art In general, a color cathode ray tube faces a phosphor screen composed of three color phosphor layers emitting blue, green and red light, and an electron beam emitted from an electron gun is incident on a predetermined phosphor layer. A shadow mask for sorting is arranged.

[0003] This shadow mask has a thickness of 0.12 to
A large number of circular or rectangular electron beam passage holes are formed in a predetermined arrangement on a metal plate such as aluminum killed steel of about 0.25 mm or low thermal expansion amber. As shown in FIG. 3, the electron beam passage hole has an opening 1 on one surface on the phosphor screen side larger than an opening 2 on the other surface on the electron gun side, and the other on the electron gun side. Is formed in a shape having a small diameter portion 4 which substantially determines the diameter of the electron beam passage hole 3.

Conventionally, this shadow mask has a first original plate on which a pattern corresponding to the opening 1 on the one surface is formed and a second original plate on which a pattern corresponding to the opening 2 on the other surface is formed. It is manufactured by a photo-etching method using a pair of masters including the master as an optical mask.

[0005] The manufacturing process is roughly divided into (a) a resist forming step of forming a resist on both sides of a shadow mask material plate, and (b) an exposure in which a pair of masters are brought into close contact with the resists on both sides to print the pattern of each master. Step (c) A developing step of removing unexposed portions of the resist (d) An etching step of etching the removed portions of the resist to form electron beam passage holes (e) An inspection step.

In general, a pair of masters used in the production of this shadow mask comprises a glass dry plate in which a pattern corresponding to the opening of the shadow mask is formed in an emulsion layer applied and formed on one surface of a glass substrate. In the exposure step, a pair of masters is attached to a vacuum contact printing frame, and the pair of masters is arranged with a strip-shaped shadow mask material plate having resists formed on both sides thereof, and the relative positions of the pair of masters are accurately determined. The alignment is performed, and the emulsion layer is exposed to the resist of the shadow mask material by a vacuum adhesion mechanism. After the exposure, the vacuum contact is released, the pair of masters is separated from the shadow mask material, and the exposed portion is sent out of the vacuum contact frame.

However, when a pair of original patterns are printed on the resist on both sides of the shadow mask material by such a method, the shadow mask of a color CRT used for a display or a monitor has, for example, a hole diameter of 0.1.
Since a high-precision circular electron beam passage hole is required, with an accuracy of 00 to 0.150 mm, an arrangement pitch of 0.2 to 0.3 mm, and a hole diameter accuracy of ± 3 μm, at the time of exposure, production of a shadow mask for a general consumer color CRT However, even if foreign matter adheres to an extent that did not cause a problem, it would be a fatal defect and defect defects would occur frequently.

In the conventional method of manufacturing a shadow mask, since the pattern is baked by directly adhering the emulsion layer of the original to the resist of the shadow mask material, foreign substances such as metal chips and dust adhere to the surface of the shadow mask material plate. Or doing
Or, if it adheres during the exposure operation, it damages the emulsion layer of the original, causing a part of the pattern of the original to be missing or an opaque part of the original, which is used as a color cathode ray tube used for displays and the like. A high-definition shadow mask having a small arrangement pitch and a small hole diameter is a fatal defect.

[0009]

As described above, the shadow mask of the color cathode ray tube has a first original plate on which a pattern corresponding to the opening on one surface is formed and a pattern corresponding to the opening on the other surface. In an exposure step of manufacturing a pair of originals including the second original on which an optical mask is formed as an optical mask by a photo-etching method and printing the patterns of the pair of originals on resists formed on both surfaces of a shadow mask material, With the emulsion layer of the master as the resist side, each emulsion layer is directly adhered to the resist to print the pattern.

Therefore, if foreign matter adheres to the plate surface of the shadow mask material or adheres during the exposure operation,
As a result, the emulsion layer of the original plate is damaged, and a part of the pattern of the original plate is missing or an opaque portion is formed on the original plate. Such a shadow mask is disadvantageous, and there is a problem that defect defects occur frequently.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a shadow mask and an exposure apparatus which can reduce the occurrence of defects due to the adhesion of foreign matter and can manufacture the mask with a high yield. With the goal.

[0012]

[Means for Solving the Problems]

(1) A pair of masters, in which patterns corresponding to the openings on both sides of the electron beam passage holes of the shadow mask are formed on the resist formed on both sides of the strip plate-shaped shadow mask material, are brought into close contact with a vacuum contact frame. In a method of manufacturing a shadow mask in which a pair of original patterns are printed on resist on both sides by exposing, a part of a long protective film is inserted between a shadow mask material and each original, and the protective film is interposed. Then, the original was brought into close contact with the resists on both sides and exposed, and after the exposure was completed, the exposed part of the shadow mask material and the part adhered to the exposed part of the protective film were sent out of the vacuum contact printing frame. .

(2) In the shadow mask manufacturing method of (1), the exposed portion of the shadow mask material and the portion of the protective film that are in close contact with the exposed portion are synchronously sent out of the portion where the vacuum contact printing frame is arranged. I put it out.

(3) A pair of masters, in which patterns corresponding to the openings on both sides of the electron beam passage holes of the shadow mask are formed on the resists formed on both sides of the strip-shaped shadow mask material, by using a vacuum contact printing frame. An exposure apparatus for a shadow mask that prints a pair of original patterns on resists on both sides by closely contacting exposure is provided with a protective film interposed between the shadow mask material and the original.

(4) A pair of original plates each having a resist formed on both sides of a strip-shaped shadow mask material and a pattern corresponding to the openings on both sides of the electron beam passage holes of the shadow mask formed on the pair of original plates by a vacuum contact printing frame. In a shadow mask exposure device that prints a pair of original patterns on the resist on both sides by exposing it in close contact, a part of the mask is inserted between the shadow mask material and the original when exposing the original to the resist in close contact. And a delivery mechanism that, after the end of the exposure, sends out the part that is in close contact with the end of exposure of the protective film in synchronization with the end of exposure of the shadow mask material, to the outside of the vacuum contact frame. Provided.

(5) In the shadow mask exposure apparatus of (3) or (4), the protective film is any one of polyethylene, polyester, polyvinylidene chloride, polyvinyl chloride and polypropylene.

(6) The thickness of the protective film of (5) is set to 3
μm to 20 μm.

[0018]

Embodiments of the present invention will be described below with reference to the drawings.

As shown in FIG. 1A, the plate thickness is 0.12 m
A photosensitive agent mainly composed of alkali caseinate and ammonium bichromate is applied to both sides of a strip-shaped shadow mask material 10 made of low thermal expansion amber having a width of 400 mm and a thickness of 400 mm to form a resist 11 having a thickness of 7 to 8 μm. Form.

Next, as shown in FIG. 1B, the first original plate 12a in which the dot patterns corresponding to the large holes on one surface of the shadow mask are formed on the resists 11 on both surfaces, and the resist 11 on the other surface. The second original plate 12b on which the dot pattern corresponding to the small hole is formed is brought into close contact with a protective film (not shown), and is exposed to ultraviolet rays emitted from the light source portions 13a and 13b to thereby form the resist 11 on both surfaces. Then, the patterns of the original plates 12a and 12b are printed. An exposure device described later is used for printing the pattern.

Next, the resist 11 on both sides on which the pattern is baked is developed to remove the unexposed portions, and as shown in FIG. A resist 14a having a pattern corresponding to the large holes on the surface of the shadow mask and a resist 14b having a pattern corresponding to the small holes on the other surface of the shadow mask are formed on the other surface.

Next, as shown in FIG. 1D, an etching protection film 15a made of polyethylene terephthalate resin or the like is adhered to one surface of the shadow mask material 10 on which the resist 14a is formed to form a resist 14b. With the other surface facing down, spraying an etching solution containing ferric chloride as a main component on the other surface,
Small holes 16 (concave holes) are formed in the other surface.

Next, the resist 14b on the other surface was peeled off using an aqueous alkaline solution, and as shown in FIG. 4E, the resist 14b was formed on the other surface and the other surface where the resist was peeled off. A varnish is applied in the small holes to form the etching resistant layer 17. Further, an etching protection film 15b made of polyethylene terephthalate resin or the like is stuck on the etching resistant layer 17, and the etching protection film stuck on the one surface is removed.

Next, as shown in (f), the other surface provided with the etching-resistant layer 17 and the etching protection film 15b is turned up, and one surface is mainly composed of ferric chloride. A large hole 18 (concave hole) communicating with the small hole is formed on one surface by spraying the etchant.

Thereafter, the etching protection film 15
b is removed, and the resist 14a on one side and the etching-resistant layer 17 on the other side are removed using an alkaline aqueous solution.
Is peeled off, an electron beam passage hole 19 in which the large hole 18 on one surface communicates with the small hole 16 on the other surface as shown in FIG.

FIG. 2 shows an exposure apparatus for printing a pattern on the resist 11 formed on both sides of the shadow mask material 10.

This exposure apparatus uses the above-described plate thickness of 0.12 m.
m, a width of 400 mm, and a length of about 250 m.
And a take-up unit 22 that winds up the shadow mask material 10 sent out from the spool 20 attached to the send-out unit 21 is disposed at a predetermined interval. The delivery section 21 is provided with a brake mechanism (not shown), and the winding section 22 is provided with a drive mechanism (not shown) capable of intermittent driving. The shadow mask material 10 is sent out by a necessary amount from the spool 20 attached to the sending-out unit 21 by the intermittent driving of this driving mechanism, and is wound up by the winding-up unit 22.

An exposure section 23 is provided between the sending section 21 and the winding section 22 which are arranged at the predetermined intervals. The exposure unit 23 holds the first and second masters 12a and 12b with the shadow mask material 10 sent from the sending unit 21 interposed therebetween, and holds the held masters 12a and 12b.
12b is driven so as to be able to come into contact with and separate from the shadow mask material 10, and the original masks 12a and 12b are vacuum-contacted to the resists on both sides of the shadow mask material 10 via a protective film described later. And a light source unit 24 that emits ultraviolet rays for printing the patterns of the first and second original plates 12a and 12b on the resists on both surfaces of the shadow mask material 10.

The first and second original plates 12a and 12b are:
Each of the master plates 1 was composed of a glass dry plate in which dot patterns corresponding to large holes and small holes on both sides of a shadow mask were formed on an emulsion layer applied and formed on one surface of a glass substrate.
2a and 12b are held in a vacuum contact grill with the emulsion layer facing the strip-shaped metal plate 10.

Further, in this exposure apparatus, a spool 2 of protective films 26a and 26b having a thickness of, for example, 10 μm, a width of 420 mm and a length of about 1000 m is provided on the exposure section 23.
7a, 27b is attached to the protective film sending section 28a.
, 28b and the protective film sending sections 28a, 28b
There are provided protective film take-up portions 29a and 29b for winding the protective films 26a and 26b sent from the camera. A brake mechanism (not shown) is provided at each of the protective film sending sections 28a and 28b, and an intermittent winding section 22 for winding the shadow mask material 10 is provided at each of the protective film winding sections 29a and 29b. A driving mechanism (not shown) capable of intermittent driving in synchronization with driving is provided. Due to the intermittent driving of the driving mechanism, the protective films 26a and 26b synchronize with the delivery of the shadow mask material 10 from the spool 20 attached to the delivery section 21 and have the same amount as the delivery amount of the shadow mask material 10. The shadow mask material 10 and the first and second originals 12a are sent out.
, 12b between the protective film winding portions 29a,
29b.

The strip-shaped metal plate 10 and the first and second masters 1
Protective film 26a, 2 disposed between 2a, 12b
As 6b, a resin film of any one of polyethylene, polyester, polyvinylidene chloride, polyvinyl chloride, and polypropylene having a thickness of 3 to 20 μm is used.

In this exposure apparatus, the vacuum contact grill is driven forward and each protective film 26a is moved by the vacuum contact grill.
, 26b are pushed in the direction of the shadow mask material 10, and the held first and second masters 12a, 12b are brought into close contact with the resists on both sides of the shadow mask material 10, and then the shadow mask material 10 and the masters 12a, 12b The air interposed between the masters 12a and 12b is exhausted.
Is brought into vacuum contact with the resist on both sides of the shadow mask material 10 via the protective films 26a and 26b. afterwards,
For example, ultraviolet rays radiated from the light source unit 24 having an output of 5 kW are irradiated for about 60 seconds to apply resists 12a, 1
Print 2b pattern. After the printing of the pattern is completed, the vacuum is released, the vacuum contact grill is retracted to separate the originals 12a and 12b from the shadow mask material 10, and then, the winding unit 22 is driven to drive the shadow mask material 10 into position. The exposed portion where the pattern is printed is sent out of the portion where the vacuum contact printing frame is placed. At this time, the protective film winding units 29a and 29b are driven in synchronization with the delivery of the shadow mask material 10, and the respective protective films 26a and 2b are driven.
The portion 6b, which is in close contact with the end portion of the exposure, is sent out of the portion where the vacuum contact grill is placed. The pattern is printed by repeating this series of operations.

When the emulsion layers on which the patterns of the original plates 12a and 12b are formed are brought into close contact with the resists formed on both sides of the shadow mask material 10 via the protective films 26a and 26b, the plate of the shadow mask material 10 Even if foreign matter such as metal chips or dust adheres to the surface, or adheres during the exposure operation, the protective film 26a, which is interposed between the shadow mask material 10 and the originals 12a, 12b,
26b prevents the emulsion layers of the masters 12a and 12b from being damaged. Therefore, by printing a pattern using such an exposure apparatus, a high-definition shadow mask of a color cathode-ray tube used for a display having a small hole diameter and an array pitch compared to a conventional shadow mask of a conventional color cathode-ray tube for general use can be obtained. The defect defects that occur frequently can be greatly reduced.

Table 1 shows 10 lots of the original plate in the case of printing the pattern with the protective film interposed between the shadow mask material and the original plate as described above, and in the case of printing the pattern without the intervening protective film. The number of occurrences of defects is shown in comparison.

[0035]

[Table 1] As shown in Table 1, the conventional method without the protective film caused 15 defects per 10 lots of the original plate. However, when the protective film was interposed, the defect was greatly reduced to one defect. Could be reduced.

In the above embodiment, a high-definition shadow mask of a color cathode-ray tube used for a display or the like has been described. However, the present invention can be applied to the production of a shadow mask of a general consumer color cathode-ray tube. .

[0037]

When the exposure apparatus is constructed as described above and a shadow mask is manufactured, the damage of the original can be prevented by the protective film interposed between the shadow mask material and the original, and the shadow mask generated by the damage of the original can be prevented. Defects can be significantly reduced.

[Brief description of the drawings]

FIGS. 1A to 1G are diagrams for explaining a method of manufacturing a shadow mask according to an embodiment of the present invention; FIG.

FIG. 2 is a diagram showing a configuration of an exposure apparatus used for manufacturing the shadow mask.

FIG. 3 is a view showing the shape of an electron beam passage hole of a shadow mask.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Strip-plate-shaped shadow mask material 11 ... Resist 12a, 12b ... A pair of original plates 13a, 13b ... Light source part 16 ... Small hole 18 ... Large hole 19 ... Electron beam passage hole 26a, 26b ... Protective film

Claims (6)

[Claims] 1. A pair of masters having a pattern corresponding to the openings on both sides of an electron beam passage hole of a shadow mask formed on a resist formed on both sides of a strip-shaped shadow mask material by a vacuum contact printing frame. In the method of manufacturing a shadow mask for baking the pattern of the pair of masters on the resist on both sides by exposing, a part of a long protective film is interposed between the shadow mask material and the masters. Then, the original is brought into close contact with the resists on both sides through the protective film, and the resist is exposed. After the exposure is completed, the exposed portion of the shadow mask material and the portion adhered to the exposed portion of the protective film are subjected to the vacuum contact firing. A method of manufacturing a shadow mask, wherein the shadow mask is sent out of the portion where the frame is arranged. 2. The shadow according to claim 1, wherein the exposed portion of the shadow mask material and the portion of the protective film that are in close contact with the exposed portion are synchronously sent out of the vacuum contact frame. Manufacturing method of mask. 3. A pair of masters having a pattern corresponding to the openings on both sides of an electron beam passage hole of a shadow mask formed on a resist formed on both sides of a strip plate-shaped shadow mask material by a vacuum contact printing frame. An exposure apparatus for a shadow mask that prints the pair of original patterns on the resists on both sides by exposing and exposing, comprising a protective film interposed between the shadow mask material and the original. Exposure equipment for shadow masks. 4. A pair of masters having a pattern corresponding to the openings on both sides of the electron beam passage holes of the shadow mask formed on a resist formed on both sides of a strip plate-shaped shadow mask material by a vacuum bonding frame. A mask for exposing the pair of masters to the resists on both sides by exposing the master to the resist. When exposing the master to the resist in close contact with the resist, there is a gap between the shadow mask material and the master. A long protective film in which the portion is interposed, and after the end of the exposure, the portion in close contact with the end of the exposure of the protective film in synchronization with the end of the exposure of the shadow mask material is out of the portion where the vacuum contact printing frame is arranged. An exposure apparatus for a shadow mask, comprising a delivery mechanism for delivering. 5. The shadow mask exposure apparatus according to claim 3, wherein the protective film is made of any one of a resin film of polyethylene, polyester, polyvinylidene chloride, polyvinyl chloride, and polypropylene. 6. The protective film has a thickness of 3 μm to 20 μm.
The shadow mask exposure apparatus according to claim 5, wherein