JPH10115835A - Liquid crystal panel display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the seal of an IC chip by potting resin irreducible minimum thickness only with a panel holder without using an excess frame such as a potting frame, to correctly hold the position of a liquid crystal panel, and to make a display device thin, and low in cost. SOLUTION: A wiring pattern is formed on a substrate 1, and the IC chip 2 is connected to its prescribed position. The panel holder 4 is fixed onto the substrate 1. The panel holder 4 is provided with a panel hold part 4a placing and holding the liquid crystal panel 5, a fitting hole 4b for an inter-connector 6 conducting between a connection electrode on the substrate and the leader terminal part 5a of the liquid crystal panel 5 and a through hole 4c for potting the IC chip on a position opposite to the IC chip 2. The potting resin is poured into the through hole 4c, and the IC chip 2 is sealed, and the inter-connector 6 is fitted to the fitting hole 4b, and the liquid crystal panel 5 is placed on the panel hold part 4a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal panel display device.

[0002]

2. Description of the Related Art Conventionally, liquid crystal panel display devices have been used for compact cameras and many other devices. In this device, an integrated circuit chip (hereinafter, referred to as an “IC chip”) for controlling a camera or controlling a liquid crystal is disposed substantially at the center of the substrate, but requires a space for placing the IC chip on the substrate in advance. A circuit pattern in which an input / output land is provided near this space is printed, and after placing an IC chip, the terminal of the chip and the corresponding land are wire-bonded. Thereafter, in order to protect the IC chip and the bonding wires, a thermosetting resin (potting resin) is poured and sealed, but in order to prevent the potting resin from flowing out and diffusing beyond a predetermined range. Forming a potting frame of the size of a separate member and mounting it on the substrate, or making a substantially square enclosure (silicon dam) of silicone resin large enough to be sealed on the top surface of the substrate with silicon resin Each time, an appropriate amount of thermosetting resin (potting resin) is poured into a potting frame or a silicon dam to seal an IC chip or the like. Thereafter, the liquid crystal panel is fixed to the substrate using a panel holder.

[0003]

In the above-mentioned conventional example using a potting frame, the thickness of the potting resin can be reduced to a necessary minimum and uniform. In addition, the potting frame must be formed as a separate member, and there is a problem that the cost is increased accordingly. In addition, by silicon dam,
It is difficult to make the thickness as small as possible and uniform, it is unavoidable that the thickness tends to be large, there is a limit to the reduction in thickness, and there is a problem that the number of steps increases due to the printing of silicon resin. .

[0004]

In order to solve the above-mentioned problems, the present invention employs a panel holder having a function of a potting frame and a function of holding a position of a liquid crystal panel. By using this panel holder, the IC chip can be sealed with the minimum necessary thickness, and at the same time, the liquid crystal panel can be held in the correct position. Further, there is no need to prepare an extra frame and the number of processes does not increase. It is possible to reduce the thickness and cost.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention includes a substrate, a panel holder, and a liquid crystal panel. The IC chip is connected to a predetermined position of the wiring pattern on the substrate, the panel holder is fixed on the substrate, and the IC is mounted at a position facing the IC chip.
A through hole for chip potting and a panel holding portion for mounting and holding a liquid crystal panel are provided. The connection electrode on the substrate and the lead terminal of the liquid crystal panel are electrically connected by an interconnector.

Further, the panel holder is provided with a fitting hole for fitting an interconnector for conducting the connection electrode on the substrate to the lead terminal portion of the liquid crystal panel. Is preferred. Further, a panel holding frame fixed to the substrate by being fitted to the above-mentioned panel holder and holding the liquid crystal panel so as not to escape may be further provided.

The through hole of the panel holder configured as described above prevents the resin from flowing over a wide area when the IC chip is sealed with the potting resin, and at the same time, seals the IC chip with a minimum necessary thickness. work. Further, the panel holding portion of the panel holder holds the liquid crystal panel at a correct position to facilitate conduction with connection electrodes on the substrate. Further, the through hole of the panel holder facilitates maintaining the interconnector at an optimum position for conducting the connection electrode on the substrate to the lead terminal portion of the liquid crystal panel. Further, the panel holding frame works so that the incorporated liquid crystal panel is not easily separated.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment will be described with reference to the drawings. In FIG. 1, on a substrate 1, control of a liquid crystal panel display device and control of a camera using the liquid crystal panel display device are used. The IC chip 2 is connected. That is, a space for arranging the IC chip 2 is defined substantially at the center of the substrate 1, and a circuit pattern (not shown) provided with input / output lands in the vicinity thereof is formed by a well-known printed wiring technique. It is formed. The IC chip 2 is placed in the space, and terminals of the IC chip and corresponding lands are wire-bonded. Circuit elements 3 such as resistors, capacitors, and transistors are connected to the circuit pattern at predetermined positions on the substrate 1.

A panel holder 4 is fixed on the substrate 1. The panel holder 4 has a size that surrounds the liquid crystal panel 5, and a panel holding portion 4a on which the liquid crystal panel 5 is mounted is provided in the middle of the height of the enclosure. A fitting hole 4b for the interconnector 6, such as a conductive rubber (trade name: zebra rubber), is provided on one side of the panel holding portion 4a. Further, the panel holding portion 4a is provided with a through hole 4c having a size surrounding a predetermined range centered on the IC chip 2 and the land.

[0010] The depth of the through hole 4c is set to a minimum and necessary depth for sealing the IC chip 2. A connection electrode (not shown) is formed on the substrate 1 and is electrically connected to the lead terminal portion 5a of the liquid crystal panel 5, and a fitting hole 4b of the panel holder 4 is provided at a position facing the connection electrode. . The interconnector 6 conducts the connection electrode and the lead terminal portion 5a, and is set at an optimum position by being fitted into the fitting hole 4b. A window 7a is formed in the housing 7 of the camera facing the substrate 1. A projection 8a formed on the upper surface of the transparent cover 8 fits into the window 7a. The upper surface is flush with the upper surface.

To assemble, the IC chip 2 is die-bonded to the substrate 1 and then wire-bonded, the circuit element 3 is mounted, and the panel holder 4 is positioned and fixed to the substrate 1. When a predetermined amount of potting resin is poured into the through hole 4c and cured, the IC chip 2 and the land are sealed with a minimum necessary thickness. The projection 8a of the transparent cover 8 is fitted in the window hole 7a of the housing 7 and fixed in advance. Next, the interconnector 6 is fitted into the fitting hole 4b, the liquid crystal panel 5 is placed on the panel holding portion 4a, and the liquid crystal panel 5 is brought into contact with the housing 7 to which the transparent cover 8 is fixed. The assembly is completed by connecting the substrate 1 with a mounting screw while pressing the substrate 1 against the housing 7. The display on the liquid crystal panel 5 can be visually recognized from outside the housing 7 through the transparent cover 8.

FIG. 2 shows another embodiment, in which a panel holding frame 9 is used in addition to the above-described structure. The panel holding frame 9 is fitted to the panel holder 4, and has an edge 9 a for holding the outer peripheral upper surface of the liquid crystal panel 5. A mounting hole 9 b is provided in the outer peripheral portion of the panel holding frame 9, and a screw (not shown) is screwed into the mounting portion 1 b of the substrate 1 through the mounting hole 9 b. Figure 1 shows other structures
And the same reference numerals are used.

For assembling, after the liquid crystal panel 5 is placed on the panel holding portion 4a in the same manner as in the case of FIG. 1, the panel holding frame 9 is fitted to the panel holder 4, and the panel holding frame 9 is attached to the substrate. Fix to 1. Therefore, the liquid crystal panel 5 is fixed so as not to escape by the edge 9a. Thereafter, the liquid crystal panel 5 is made to face the transparent cover 8 fixed to the housing 7, and the substrate 1 is connected to the housing 7 with mounting screws or the like, and the assembly is completed. In this example, even if the substrate 1 is removed from the housing 7, the liquid crystal panel 5 is still held by the panel holding frame 9.
, The housing 7 and the substrate 1 can be freely separated at the time of maintenance or the like, and the work is easy.

[0014]

According to the present invention, since the through holes are integrally provided in the panel holder, it is not necessary to use a potting frame or a silicon dam. For this reason, the number of steps can be reduced and the cost can be reduced. Further, when the IC chip is sealed with the potting resin by the through holes, the resin can be prevented from flowing over a wide area, and at the same time, the potting resin can be reduced to a necessary minimum thickness, thereby achieving a reduction in thickness. Also,
Since the through-hole is integrally provided in the panel holder, the interconnector can be easily maintained at an optimum position for conducting the connection electrode on the substrate to the lead-out terminal of the liquid crystal panel. Further, when the panel holding frame is provided, the work can be facilitated without the liquid crystal panel being separated from the substrate at the time of maintenance or the like.

[Brief description of the drawings]

FIG. 1 is a developed perspective view showing one embodiment of the present invention.

FIG. 2 is a developed perspective view showing another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 IC chip 4 Panel holder 4a Panel holding part 4b Fitting hole 4c Through hole 5 Liquid crystal panel 5a Pull-out terminal part 6 Interconnector 9 Panel holding frame

Claims (3)

[Claims] 1. A substrate, a panel holder, and a liquid crystal panel are provided. An IC chip is connected to a predetermined position of a wiring pattern on the substrate. The panel holder is fixed on the substrate. The above IC
A through hole for potting the IC chip and a panel holding portion for mounting and holding the liquid crystal panel are provided at positions facing the chip, and a connection electrode on the substrate and a lead terminal portion of the liquid crystal panel are provided. Is a liquid crystal panel display device which is electrically connected by an interconnector. 2. The panel holder according to claim 1, wherein the panel holder is provided with a fitting hole for fitting an interconnector that connects a connection electrode on the substrate to a lead terminal portion of the liquid crystal panel. A liquid crystal panel display device characterized by the above-mentioned. 3. The liquid crystal panel display device according to claim 1, further comprising a panel holding frame that is fitted to the panel holder and fixed to the substrate, and holds the liquid crystal panel so as not to escape. .