JPH1010723A - Photosensitive resin composition and photosensitive element using same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To diminish sludge generated at the time of development and to improve plating resistance, adhesion to a base metal and tenting reliability by incorporating a specified compd. as an essential component into an ethylenic unsatd. compd. SOLUTION: This photosensitive resin compsn. contains a polymer binder having carboxyl groups, a photopolymn. initiator and a photopolymerizable compd. having at least one polymerizable ethylenic unsatd. group in one molecule and contg. a compd. represented by formula I as an essential component by 10-90 pts.wt. per 100 pts.wt. of the photopolymerizable compd. In the formula I, R<1> is a trivalent org. group and R<2> is a group represented by formula II, wherein R<3> is H or methyl, X is alkylene oxide and (n) is an integer of 1-14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a photosensitive resin composition and a photosensitive element using the same.

[0002]

2. Description of the Related Art Conventionally, there are two methods of manufacturing a printed wiring board, a tenting method and a plating method. The tenting method is
In this method, a copper through hole for mounting a chip is protected with a resist, and an electric circuit is formed through etching and resist peeling. On the other hand, in the plating method, copper is deposited in through holes by electroplating, protected by solder plating,
In this method, an electric circuit is formed by stripping and etching a resist. When these methods are performed, a photosensitive resin composition and a photosensitive element using the same are used as a resist, and an alkali developing type in which an uncured portion is removed with an alkaline aqueous solution is mainly used.

[0003] However, when an alkali-developable photosensitive resin composition is used, the unpolymerized photosensitive resin composition dissolves in the developing solution, and the dissolved components become sludge, which re-adheres to the substrate. This is the cause of short-circuit failure. In particular, the use of a combination of an antifoaming agent that suppresses foaming during development causes a problem of increasing the amount of sludge generated. Therefore, conventional photosensitive resin compositions and photosensitive elements have short-circuit defects due to sludge generation. To prevent this, the developer must be cleaned in a short period of time and the filter used in the circulating pump must be replaced in a short period of time.

Further, Japanese Patent Publication No. 4-39661 discloses that
Although a photopolymerizable composition characterized by containing a surfactant is disclosed, it is mainly intended to prevent softening and swelling of a polyvinyl chloride resin portion of a developing machine, and a sludge generated at the time of development. Is not described. Furthermore, in recent years, with the increase in wiring density and precision of printed wiring boards, tent reliability has become a problem in the tenting method with respect to the formation of irregularly shaped through-holes, narrowing of through-hole lands, and the like. In the plating method, resistance to plating chemicals is required, but in the prior art, if this resistance is increased, the cured film becomes hard and brittle, and it is difficult to achieve compatibility with tent reliability, which has been a problem.

JP-A-7-128851 discloses a binder polymer containing a carboxyl group, a photopolymerization initiator and a polymerizable ethylenically unsaturated compound, wherein the ethylenically unsaturated compound is a linear urethane (meth) Acrylate and γ-chloro-β-hydroxypropyl-β′-
It is disclosed that a photosensitive resin composition containing methacryloyloxyethyl-o-phthalate as an essential component and a photosensitive element using the same have excellent plating resistance and adhesion. In addition, subsequent investigations and examinations revealed that sludge reduction was achieved. However, tent reliability was not very good with this combination.

[0006]

According to the first aspect of the present invention, the sludge generated during development is reduced, and the plating resistance and the adhesion to the underlying metal can be reduced by either the copper through-hole method or the solder through-hole method. An object of the present invention is to provide a photosensitive resin composition which is excellent in adhesion and the like and has good tent reliability. The invention according to claim 2 has the effects of the invention according to claim 1, and further reduces sludge, and is excellent in plating resistance, adhesion and tent reliability. The invention described in claim 3 has the effects of the invention described in claim 1 or 2, and is further excellent in coating properties, photosensitivity, and mechanical properties of a photocured product. The invention according to claim 4 reduces sludge, is excellent in plating resistance, adhesion, tent reliability, coating properties, photosensitivity, mechanical properties of a photocured product, and is also excellent in handling properties and workability. To provide a photosensitive element.

[0007]

The present invention comprises (A) a binder polymer having a carboxyl group, (B) a photopolymerization initiator, and (C) at least one polymerizable ethylenically unsaturated group in a molecule. Wherein the component (C) has the general formula (I)

Embedded image [Wherein, R ¹ represents a trivalent organic group, and R ² represents a compound of the general formula (II)

Embedded image (Wherein, R ³ represents a hydrogen atom or a methyl group, X represents an alkylene oxide group, and n represents an integer of 1 to 14).] The present invention relates to a photosensitive resin composition contained therein.

In the present invention, the content of the compound represented by the general formula (I) in the component (C) is 100%.
The present invention relates to the photosensitive resin composition, which accounts for 10 to 90 parts by weight of the photosensitive resin composition. Further, in the present invention, the component (A) is contained in an amount of 40 to 80 parts by weight, and the component (B) is added in an amount of 0.1 to 20 parts by weight based on 100 parts by weight of the total amount of the components (A) and (C). The present invention relates to the photosensitive resin composition containing 20 to 60 parts by weight of the component (C) and having the total amount of the components (A) and (C) as 100 parts by weight. The present invention also relates to a photosensitive element obtained by applying the photosensitive resin composition on a support and drying the composition.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
Examples of the binder polymer having a carboxyl group used as the component (A) in the present invention include a copolymer of an alkyl acrylate or an alkyl methacrylate, acrylic acid or methacrylic acid, and a vinyl monomer copolymerizable therewith. And the like. These copolymers are used alone or in combination of two or more.

Examples of the alkyl acrylate or alkyl methacrylate include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, and the like.
Examples thereof include 2-ethylhexyl acrylate and 2-ethylhexyl methacrylate.

Examples of the alkyl acrylate or alkyl methacrylate or vinyl monomers copolymerizable with acrylic acid or methacrylic acid include tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, and dimethyl acrylate. Aminoethyl ester, dimethylaminoethyl methacrylate, diethylaminoethyl acrylate, diethylaminoethyl methacrylate, glycidyl acrylate, glycidyl methacrylate, 2,2,2-trifluoroethyl acrylate, 2,2,2- Trifluoroethyl methacrylate, 2,2,3,3-tetrafluoropropyl acrylate, 2,2,3,3-tetrafluoropropyl methacrylate, acrylic Amide, diacetone acrylamide, styrene, vinyl toluene, and the like.

The photopolymerization initiator used as the component (B) in the photosensitive resin composition of the present invention includes, for example, aromatic ketones (benzophenone, N, N'-tetramethyl-
4,4'-diaminobenzophenone (Michler's ketone), N, N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2-ethylanthraquinone, phenanthrenequinone, etc., benzoin ether ( Benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether and the like, benzoin derivatives (methyl benzoin, ethyl benzoin and the like), benzyl derivatives (benzyl dimethyl ketal and the like), 2,4,5-triarylimidazole dimer (2- ( o-chlorophenyl) -4,
5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,
5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4- Di (p-methoxyphenyl) -5-phenylimidazole dimer, 2- (2,
4-dimethoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methylmercaptophenyl)
-4,5-diphenylimidazole dimer, etc.) and acridine derivatives (9-phenylacridine, 1,7-bis (9,9'-acridinyl) heptane, etc.) and the like. These are used alone or in combination of two or more.

The compound represented by the above general formula (I) which is contained as an essential component in the photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule as the component (C) in the present invention. In the above formula (I)
Wherein, as the trivalent organic group represented by R ¹ ,
10 are preferred, for example, methine group, ethanetriyl group, 1,2,3-propanetriyl group, butanetriyl group, pentanetriyl group, neopentanetriyl group, hexanetriyl group, heptanetriyl group, octant Examples include a lyyl group, a 2-ethyl-hexanetriyl group, a nonanthryl group, and a decanetriyl group. Further, in the above general formula (II) represented by R ² , the alkylene oxide group represented by X is not particularly limited, and examples thereof include an ethylene oxide group, a propylene oxide group,
Examples thereof include a butylene oxide group, a pentylene oxide group, and a hexylene oxide group. Among them, an ethylene oxide group and a propylene oxide group are preferable.

The bonding direction of the propylene oxide group is as follows.

Embedded image There are two types. In the above general formula (II), n is 1 to 1
It is an integer of 4 and preferably 2 to 14. If n exceeds 14, the mechanical strength decreases.

The compound represented by the general formula (I) is, for example, a compound represented by the following general formula (II-1), (II-2) or (II-3): General formula (III)
And the like.

[0016]

Embedded image [Wherein, R ³ and n have the same meanings as in general formula (II), and m is an integer of 3 to 6.]

Embedded image [Wherein, R ¹ has the same meaning as in formula (I)]

In the above general formula (II-2), the propylene oxide unit of this block segment is
Due to the notation, the bonding position of the methyl group is on the carbon atom next to the oxygen atom, but this is not a limitation, and the methyl group is bonded on the carbon atom next to the oxygen atom. Or propylene oxide units in which a methyl group is bonded to a carbon atom adjacent to an oxygen atom and propylene oxide units in which a methyl group is bonded to a carbon atom adjacent to an oxygen atom are alternately or randomly mixed May be present.

In addition to the compound represented by the general formula (I), which is an essential component in the component (C), for example, polyhydric alcohols (polyethylene glycol diacrylate, polyethylene glycol dimethacrylate (ethylene group Having a number of 2 to 14), trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, trimethylolpropane triacrylate,
Trimethylolpropane trimethacrylate, tetramethylolmethane triacrylate, tetramethylolmethanetrimethacrylate, tetramethylolmethanetetraacrylate, tetramethylolmethanetetramethacrylate, polypropylene glycol diacrylate,
Α, β-unsaturated carboxylic acid to polypropylene glycol dimethacrylate (having 2 to 14 propylene groups), dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, etc. Bisphenol A dioxyethylene diacrylate or bisphenol A dioxyethylene dimethacrylate (bisphenol A dioxyethylene diacrylate, bisphenol A dioxyethylene dimethacrylate, bisphenol A trioxyethylene diacrylate, bisphenol A) A-trioxyethylene dimethacrylate, bisphenol A decaoxyethylene diacrylate, bisphenol Glyceryl group-containing compounds (trimethylolpropane triglycidyl ether triacrylate,
A compound obtained by adding an α, β-unsaturated carboxylic acid to bisphenol A diglycidyl ether acrylate, etc., an alkyl ester of acrylic acid or an alkyl ester of methacrylic acid (methyl acrylate, methyl methacrylate, ethyl acrylate) Ester, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-acrylic acid
Ethylhexyl ester, 2-ethylhexyl methacrylate, etc.).

In the present invention, the amount of component (A) is
It is preferable that the amount be in the range of 40 to 80 parts by weight based on 100 parts by weight of the total amount of the components (A) and (C). If the amount is less than 40 parts by weight, the photocured product tends to be brittle, and when used as a photosensitive element, the coating properties tend to be poor. If the amount exceeds 80 parts by weight, the sensitivity tends to be insufficient.

The amount of component (B) is 0.1 to 20 parts by weight based on 100 parts by weight of the total of components (A) and (C).
It is preferred to be in the range of parts by weight. When the blending amount is 0.
If the amount is less than 1 part by weight, the sensitivity tends to be insufficient. If the amount is more than 20 parts by weight, the absorption on the surface of the composition during exposure increases, and the internal photocuring becomes insufficient. Tend.

The amount of the component (C) is 20 to 6 parts by weight based on 100 parts by weight of the total amount of the components (A) and (C).
It is preferably in the range of 0 parts by weight. If this blending amount is 2
If the amount is less than 0 parts by weight, the sensitivity tends to be insufficient, and if it exceeds 60 parts by weight, the photocured product tends to become brittle. The compounding amount of the compound represented by the general formula (I), which is an essential component in the component (C), is preferably from 10 to 90 parts by weight, and more preferably from 60 to 90 parts by weight, per 100 parts by weight of the component (C).
More preferably, it is 90 parts by weight. This compounding amount is 1
If the amount is less than 0 parts by weight, plating resistance, adhesion and tent reliability tend to be inferior, and if it exceeds 90 parts by weight, the amount of sludge tends to increase.

The photosensitive resin composition of the present invention further comprises:
Additives such as dyes, color formers, plasticizers, pigments, flame retardants, stabilizers, and adhesion promoters may be added as necessary. It is preferable that the amount of these used is 2 parts by weight or less based on 100 parts by weight of the total of the components (A), (B) and (C).

The photosensitive resin composition of the present invention comprises a solvent capable of dissolving the components (A), (B) and (C), for example, toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, A uniform solution can be obtained by dissolving and mixing in chloroform, N, N-dimethylformamide, methylene chloride, methyl alcohol, ethyl alcohol, and the like.

The photosensitive resin composition of the present invention is coated on a support and dried to obtain a photosensitive element (laminate). As the support, a polymer film, for example, a film made of polyethylene terephthalate, polypropylene, polyethylene or the like is used, and among these, a polyethylene terephthalate film is preferable. Since these polymer films must be removable from the photosensitive layer later, they must not have been subjected to a surface treatment or made of a material that cannot be removed. The thickness of these polymer films is usually 5 to 10
0 μm, preferably 10 to 30 μm. One of these polymer films, as a support film of the photosensitive layer,
The other one may be laminated on both sides of the photosensitive layer as a protective film for the photosensitive layer.

In producing a photoresist image using the photosensitive element of the present invention, if the above protective film is present, after removing the protective film, the photosensitive layer is pressed against a substrate while heating. It is laminated by doing. The surface to be laminated is usually a metal surface, but is not particularly limited. The temperature of the thermocompression bonding of the photosensitive layer is not particularly limited, but is usually 90 to 130 ° C. Further, the pressure for heating and pressing the photosensitive layer is not particularly limited, but is usually 3 kg / cm ² . If the photosensitive layer is heated as described above, it is not necessary to pre-heat the substrate in advance, but it is also possible to perform a pre-heat treatment on the substrate in order to further improve lamination properties.

The photosensitive layer thus completed in lamination is
Next, it is imagewise exposed to actinic light using a negative or positive film. At this time, if the polymer film present on the photosensitive layer is transparent, it may be exposed as it is, but if it is opaque, it must be removed.
From the viewpoint of protection of the photosensitive layer, the polymer film is transparent, and it is preferable to expose the polymer film while leaving the polymer film remaining. As the active light, a light generated from a known active light source, for example, a carbon arc, a mercury vapor arc, a xenon arc, or the like is used. Since the sensitivity of the photopolymerization initiator contained in the photosensitive layer is usually maximum in the ultraviolet region, the active light source should be one that effectively emits ultraviolet light. of course,
When the photopolymerization initiator is sensitive to visible light, for example, 9,
In the case of 10-phenanthrenequinone or the like, visible light is used as the active light, and in addition to the above-mentioned light sources, a flood lamp for photography, a sun lamp, and the like are used.

Next, after exposure, if a polymer film or the like is present on the photosensitive layer, it is removed, and then, using an aqueous alkali solution, for example, spraying, rocking immersion, brushing, scrubbing, etc. The unexposed portion is removed by a known method, and development is performed. Examples of the base of the aqueous alkali solution include alkali hydroxides such as lithium, sodium or potassium hydroxide, alkali carbonates such as lithium, sodium or potassium carbonate or bicarbonate, and alkali metals such as potassium phosphate and sodium phosphate. Phosphates, alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate are used, and an aqueous solution of sodium carbonate is particularly preferable. The pH of the aqueous alkali solution used for development is preferably in the range of 9 to 11,
The temperature is adjusted according to the developability of the photosensitive layer. Further, a surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating development, and the like may be mixed in the alkaline aqueous solution.

Further, when manufacturing a printed wiring board, the surface of the substrate exposed by using the developed photoresist image as a mask is treated by a known method such as etching or plating. Then, the photoresist image is usually
It is peeled off with an aqueous solution that is more alkaline than the aqueous alkaline solution used for development. As the strong alkaline aqueous solution, for example, an aqueous solution of 1 to 5% by weight of sodium hydroxide is used.

By using the compound represented by the general formula (I) used in the present invention, the reliability of the tent including the elongation of the tent can be improved comprehensively. This is because the isocyanuric acid structure affects the tent strength, and the linear urethane (meth) acrylate segment bonded to the alkylene oxide group affects the tent elongation,
It is presumed that they interact well.

[0030]

Next, the present invention will be described with reference to examples. Examples 1 and 2 and Comparative Examples 1 to 6 The materials shown in Tables 1 and 2 were blended to prepare solutions.

[0031]

[Table 1]

[0032]

[Table 2]

The component (C) shown in Table 3 was dissolved in the obtained solution to obtain a solution of the photosensitive resin composition. Next, the solution of the photosensitive resin composition was uniformly applied on a polyethylene terephthalate film having a thickness of 25 μm.
And dried with a hot air convection dryer for 10 minutes to obtain a photosensitive element. The film thickness of the photosensitive resin composition layer after drying is 50
μm.

On the other hand, the copper surface of a copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-E-61) which is a glass epoxy material having a 35 μm-thick copper foil laminated on both sides is # 60.
The surface of the copper-clad laminate is polished using a polishing machine having a brush equivalent to 0 (manufactured by Sankeisha Co., Ltd.), washed with water, dried in an air stream, and heated to 80 ° C. on the copper surface. The photosensitive resin composition layer was laminated while being heated to 120 ° C. Then
Using a negative film on the substrate thus obtained, a 3 kW high-pressure mercury lamp (HMW-201 manufactured by Oak Manufacturing Co., Ltd.)
Exposure of 90 mJ / cm ² was performed in B). Next, the polyethylene terephthalate film was removed, and 1% by weight at 30 ° C.
Unexposed portions were removed by spraying 1 liter of an aqueous solution of sodium carbonate for 60 seconds. The following tests were performed on the laminate having the obtained pattern, and the results of the tests are summarized in Table 3.

Amount of sludge In the developing step, the sludge generated was separated by a centrifugal separator, filtered, dried at 150 ° C. for 4 hours, and the weight of the sludge was measured.

Adhesion Adhesion was determined by measuring the width of the line (μ)
m), the smaller the value of the adhesiveness, the higher the adhesiveness of the copper-clad laminate, even if the line is thin, without peeling off from the copper-clad laminate.

Plating Resistance The developed copper-clad laminate was immersed in a degreasing solution (PC-455 (manufactured by Meltex Co., Ltd.), 25% by weight) for 5 minutes, washed with water, and immersed in a soft etch solution (ammonium persulfate, 150 g / liter). 2
Immersion in 10% by weight sulfuric acid for 1 minute to prepare a copper sulfate plating bath [75 g of copper sulfate /
Liter, sulfuric acid 190 g / liter, chlorine ion 50 ppm, copper glyme PCM (manufactured by Meltex) 5 ml / liter), and copper sulfate plating was performed at room temperature at 3 A / dm ² for 40 minutes. Then, wash with water and add 1% by weight
Immersion in a solder plating bath (45% by weight tin borofluoride 64)
ml / liter, 45% by weight lead borofluoride 22ml / liter, 42% by weight borofluoric acid 200ml / liter, Plutin LA
Conductivity Salt (Meltex) 20
g / liter, 40 ml / liter of Plutin LA starter (manufactured by Meltex), and solder plating was performed at room temperature.
Performed at 5 A / dm ² for 15 minutes.

After washing with water and drying, to examine the plating resistance,
Immediately, a cellophane tape was applied and peeled off vertically (90 ° peel-off test), and the presence or absence of peeling of the resist was observed. After the resist was peeled off, the presence or absence of the solder plating was observed with an optical microscope from above. When the solder plating is buried, solder deposited by plating is observed below the transparent resist through the transparent resist.

Tent strength and elongation A photosensitive resin composition was laminated on both sides of a base material in which 100 holes of 6 mm in diameter were formed on a copper-clad laminate having a thickness of 1.6 mm, and 90 mJ / c
Exposure of m ² was performed and development was performed for 60 seconds. Next, the strength of the hole drilled in the substrate was measured by a rheometer (manufactured by FUDOH) using a cylinder having an insertion diameter of 1.5 mm, and the strength up to breaking was measured.

As shown in FIG. 1, a photosensitive resin composition was laminated on both sides of a substrate having a large number of holes, as shown in FIG.
Exposure at mJ / cm ² was performed and development for 60 seconds was performed twice. After the development, a triple hole 2 (h) in which three holes each having a diameter (d) of 4 mm among three holes of the evaluation substrate 1 shown in FIG.
= 8 mm) The number of broken holes out of a total of 18 was measured, and the deformed tent breaking ratio was calculated and evaluated from the following formula.

(Equation 1) The tent strength, tent elongation and deformed tent tear rate in Table 3 were considered as indexes of tent reliability.

[0041]

[Table 3]

As is apparent from the above results, by using the compound represented by the general formula (I), the amount of sludge generated during development can be reduced, and the adhesion, plating resistance and tent reliability are improved. I was able to.

[0043]

According to the present invention, the photosensitive resin composition according to the present invention reduces the amount of sludge generated at the time of development by a copper through-hole method.
Either of the solder through hole methods is excellent in plating resistance, adhesion to the underlying metal, and the like, and has good tent reliability. The photosensitive resin composition according to claim 2 has the effects of the photosensitive resin composition according to claim 1,
Sludge is reduced, plating resistance, adhesion and tent reliability are excellent. The photosensitive resin composition according to the third aspect has the effects of the photosensitive resin composition according to the first or second aspect, and further has excellent coating properties, photosensitivity, and mechanical properties of the photocured product.
The photosensitive element according to claim 4 reduces sludge,
Plating resistance, adhesion, tent reliability, coating properties, photosensitivity,
It has excellent mechanical properties and the like of the photocured product, and also has excellent handling and workability.

[Brief description of the drawings]

FIG. 1 is a plan view of an evaluation board used for evaluating a deformed tent tear rate in Examples and Comparative Examples.

FIG. 2 is an enlarged explanatory view of a triple hole in FIG. 1;

[Explanation of symbols]

 1 Evaluation board 2 Triple hole

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical display location H05K 3/00 H05K 3/00 F 3/18 0430-4E 3/18 D

Claims (4)

[Claims] 1. A composition comprising (A) a binder polymer having a carboxyl group, (B) a photopolymerization initiator, and (C) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in a molecule. The component (C) has the general formula (I): [In the formula, R ¹ represents a trivalent organic group, and R ² represents a compound represented by the general formula (II). (Wherein, R ³ represents a hydrogen atom or a methyl group, X represents an alkylene oxide group, and n represents an integer of 1 to 14).] A photosensitive resin composition. 2. The content of the compound represented by the general formula (I) in the component (C) is from 10 to 9 per 100 parts by weight of the component (C).
The photosensitive resin composition according to claim 1, which is 0 parts by weight. (3) 40 to 80 parts by weight of the component (A), (B)
The component is used in an amount of 0.1 to 20 parts by weight based on 100 parts by weight of the total of the components (A) and (C), and the component (C) is used in an amount of 20 to 6
0 parts by weight, and the total amount of the components (A) and (C) is 10
3. The photosensitive resin composition according to claim 1, wherein the amount is 0 parts by weight. 4. A photosensitive element obtained by applying the photosensitive resin composition according to claim 1, 2 or 3 on a support and drying.