JPH1048822A - Photosensitive resin composition and photosensitive element using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the generation of a sludge and bubbles at the time of a development and to improve plating resistance and adhesion to a base metal by incorporating a specified polymer diner, a photopolymn. initiator and a specified photopolymerizable compd. contg. a specified unsatd. urethane compd. and a specified compd. SOLUTION: This photosensitive resin compsn. contains a polymer binder (A) having carboxyl groups, a photopolymn. initiator (B) and a photopolymerizable compd. (C) having ethylenic unsatd. groups in one molecule and contg. an unsatd. urethane compd. represented by formula I and a compd. represented by formula III as essential components. In the formula I, R<1> is a trivalent org. group and R<2> is a group represented by formula II [where X is alkylene oxide and (n) is an integer of 1-14]. In the formula III, Y is alkylene oxide and (k) is an integer of 1-10. The amt. of the urethane compd. is 10-90 pts.wt. based on 100 pts.wt. of the component (C).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a photosensitive resin composition and a photosensitive element using the same.

[0002]

2. Description of the Related Art Conventionally, there are two methods of manufacturing a printed wiring board, a tenting method and a plating method. The tenting method protects the copper through hole for chip mounting with resist,
This is a method of forming an electric circuit through etching and resist peeling. On the other hand, the plating method is a method in which copper is deposited in a through hole by electroplating, protected by solder plating, and an electric circuit is formed by peeling off resist and etching. When these methods are performed, a photosensitive resin composition and a photosensitive element using the same are used as a resist, and an alkali developing type in which an uncured portion is removed with an alkaline aqueous solution is mainly used.

[0003] However, when an alkali-developable photosensitive resin composition is used, the unpolymerized photosensitive resin composition dissolves in the developing solution, and the dissolved components become sludge, which re-adheres to the substrate. This is the cause of short-circuit failure. or,
The use of a combination of an antifoaming agent that suppresses foaming during development has the problem of increasing the amount of sludge generated. Low foaming at the time was also required. Japanese Patent Publication No. 4-39661 discloses a photopolymerizable composition characterized by containing a surfactant, which is used for softening and swelling of a polyvinyl chloride resin portion of a developing machine. The main purpose is to prevent
There is no description of sludge generated during development.

Further, with the recent increase in wiring density and precision of printed wiring boards, the tenting method has a problem of tent reliability against the formation of irregular shaped through-holes, narrowing of through-hole lands, and the like. In addition, plating methods require resistance to plating chemicals.However, if the resistance is increased in the conventional technology, the cured film becomes hard and brittle, making it difficult to achieve compatibility with tent reliability. I was

[0005]

According to the first aspect of the present invention, sludge and foaming generated during development are reduced, and the plating resistance and the base metal can be reduced by either the copper through-hole method or the solder through-hole method. Excellent adhesion with
Further, the present invention provides a photosensitive resin composition having good tent reliability. The invention described in claim 2 is more excellent in plating resistance, adhesion, suppression of sludge, and the like, in addition to the effects of the invention described in claim 1. The invention according to claim 3 provides, in addition to the effects of the invention according to claim 1 or 2, further photocurability, coating properties,
Excellent sensitivity etc. The invention according to claim 4 reduces sludge and foaming generated during development, and is excellent in plating resistance, adhesion to a base metal and the like by any of a copper through-hole method and a solder through-hole method, and An object of the present invention is to provide a photosensitive element having good tent reliability.

[0006]

SUMMARY OF THE INVENTION The present invention comprises (A) a binder polymer having a carboxyl group, (B) a photopolymerizable initiator, and (C) a photopolymerization having a polymerizable ethylenically unsaturated group in a molecule. A compound of the general formula (I)

Embedded image [Wherein, R ¹ represents a trivalent organic group, and R ² represents a compound of the general formula (II)

Embedded image (Wherein, R ³ represents a hydrogen atom or a methyl group, X represents an alkylene oxide group, and n represents an integer of 1 to 14), and a general formula (III) )

Embedded image [Wherein, Y represents an alkylene oxide group, and k represents 1 to
Which is an integer of 10).

[0007] The present invention also relates to the present invention, wherein the content of the urethane unsaturated compound represented by the general formula (I) in the component (C) is:
(C) The photosensitive resin composition is 10 to 90 parts by weight based on 100 parts by weight of the component. Also, the present invention
(A) component, (B) component and the compounding amount of (C) component,
Component (A) is 40 to 80 parts by weight, and component (B) is 100 parts by weight of the total of components (A) and (C).
3. The photosensitive resin composition according to claim 1, wherein 0.1 to 20 parts by weight and the component (C) are 20 to 60 parts by weight. The present invention also relates to a photosensitive element obtained by applying the photosensitive resin composition on a support and drying the composition.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The photosensitive resin composition of the present invention comprises
(A) a binder polymer having a carboxyl group,
(B) a photopolymerizable initiator and (C) a urethane represented by the general formula (I) in the component (C), which contains a photopolymerizable compound having a polymerizable ethylenically unsaturated group in a molecule. It contains a system unsaturated compound and the compound represented by the general formula (III) as essential components.

The (A) binder polymer having a carboxyl group in the present invention includes, for example, a copolymer of acrylic acid or methacrylic acid with a vinyl monomer copolymerizable therewith. This copolymer is used alone or in combination of two or more. Examples of the vinyl monomer include methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, tetrahydrofurfuryl acrylate, dimethylaminoethyl acrylate, diethylaminoethyl acrylate, glycidyl acrylate,
2,2-trifluoroethyl acrylate, 2,2
Examples thereof include 3,3-tetrafluoropropyl acrylate, methacrylate, acrylamide, diacetone acrylamide, styrene, and vinyl toluene corresponding thereto.

The acid value of the component (A) is preferably from 100 to 500, and the weight average molecular weight (measured by gel permeation chromatography (GPC) and converted by a calibration curve using standard polystyrene) is 20. 000
Preferably it is ~ 300,000. Acid value is 10
If it is less than 0, the developing time tends to be long, and if it exceeds 500, the developing solution resistance of the photocured resist tends to decrease. If the weight average molecular weight is less than 30,000, the developer resistance tends to decrease, and
If it exceeds 00, the developing time tends to be long.

The photopolymerizable initiator (B) in the present invention includes, for example, 2,4,5-triphenylimidazole dimer (2,2'-bis (o-chlorophenyl) -4,
4 ', 5,5'-tetraphenylbiimidazole, 2,
2'-bis (o-chlorophenyl) -4,4 ', 5
5'-tetrakis (m-methoxyphenyl) biimidazole, 2,2'-bis (p-carboxyphenyl)-
4,4 ', 5,5'-tetraphenylbiimidazole,
2,2'-bis (p-chlorophenyl) -4,4 ',
5,5'-tetrakis (p-methoxyphenyl) -biimidazole, 2,2'-di-o-tolyl-4,4 ',
5,5'-tetraphenylbiimidazole, 2,2'-
Di-p-tolyl-4,4'-di-o-tolyl-5,5 '
-Diphenylbiimidazole, etc.), aromatic ketones (benzophenone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N, N'-tetramethyl-4,4'-diaminobenzophenone, 4-
Methoxy-4'-dimethylaminobenzophenone, 2-
Ethyl anthraquinone, phenanthrenequinone, etc.), benzoin (benzoin ether such as benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, methyl benzoin, ethyl benzoin, etc.), benzyl derivative (benzyl dimethyl ketal, etc.)
And the like. These are used alone or in combination of two or more.

The photopolymerizable compound (C) having a polymerizable ethylenically unsaturated group in the molecule according to the present invention has a general formula (I)

Embedded image [Wherein, R ¹ represents a trivalent organic group, and R ² represents a compound of the general formula (II)

Embedded image (Wherein, R ³ represents a hydrogen atom or a methyl group, X represents an alkylene oxide group, and n represents an integer of 1 to 14), and a general formula (III) )

Embedded image [Wherein, Y represents an alkylene oxide group, and k represents 1 to
Which is an integer of 10] as an essential component.

In the above general formula (I), R ¹ is a trivalent organic group, and such a trivalent organic group is not particularly limited. For example, methine group, ethanetriyl group,
1,2,3-propanetriyl group, butanetriyl group,
Trivalent having 1 to 10 carbon atoms such as a pentanetriyl group, a neopentantriyl group, a hexanetriyl group, a heptanetriyl group, an octanetriyl group, a 2-ethyl-hexanetriyl group, a nonanthryl group, and a decanetriyl group And a chain hydrocarbon group. In the general formula (I), R ² is a group represented by the general formula (II), and R ³ in the general formula (II) is a hydrogen atom or a methyl group;
X is an alkylene oxide group, and n is an integer of 1 to 14. The alkylene oxide group in the general formula (II) is not particularly limited. For example, an alkylene oxide group having 1 to 6 carbon atoms such as an ethylene oxide group, a propylene oxide group, a butylene oxide group, a pentylene oxide group, and a hexylene oxide group. Examples thereof include an alkylene oxide group, and among them, an ethylene oxide group and a propylene oxide group are preferable.

The bonding direction of the propylene oxide group is as follows.

Embedded image There are two types. Further, n in the general formula (II) is
It must be an integer of 1 to 14, preferably an integer of 2 to 14. If n exceeds 14, the mechanical strength decreases.

As the compound represented by the above general formula (II), for example, the compound represented by the general formula (II-1), the general formula (II-2) or the general formula (II-3) A compound;
It can be obtained by a reaction with the compound represented by the general formula (IV) or the like.

Embedded image [Wherein, R ³ and n have the same meanings as in general formula (II), and m is an integer of 3 to 6.]

Embedded image [Wherein, R ¹ has the same meaning as in general formula (I)]

In the general formula (II-2), the propylene oxide unit of this block segment is
For the sake of notation, the bonding position of the methyl group is on the carbon atom next to the oxygen atom, but is not limited to this structure.

Embedded image Etc. shall be included.

In the compound represented by the above general formula (III), which is an essential component in the component (C) in the present invention, Y is an alkylene oxide group, and k is an integer of 1 to 10. Examples of the alkylene oxide group in the above general formula (III) include the same alkylene oxide groups as those in the above general formula (II), and among these, a butylene oxide group is preferable in terms of developability, resolution and the like. Can be In addition, the above general formula (II
N in I) must be an integer of 1 to 10,
It is preferably an integer of 2 to 10. If n exceeds 10, the mechanical strength decreases.

The component (C) in the present invention includes:
Compounds other than the urethane unsaturated compound represented by the general formula (I) and the compound represented by the general formula (III) can be used. Examples of the compound other than the compounds represented by the general formulas (I) and (III) include polyhydric alcohols (polyethylene glycol diacrylate, polyethylene glycol dimethacrylate (having 2 to 14 ethylene groups). ), Trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, trimethylolpropane triacrylate,
Trimethylolpropane trimethacrylate, tetramethylolmethane triacrylate, tetramethylolmethanetrimethacrylate, tetramethylolmethanetetraacrylate, tetramethylolmethanetetramethacrylate, polypropylene glycol diacrylate,
Α, β-unsaturated carboxylic acid to polypropylene glycol dimethacrylate (having 2 to 14 propylene groups), dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, etc. Bisphenol A polyoxyethylene diacrylate or bisphenol A polyoxyethylene dimethacrylate (bisphenol A dioxyethylene diacrylate, bisphenol A dioxyethylene dimethacrylate, bisphenol A trioxyethylene diacrylate, bisphenol A) A trioxyethylene dimethacrylate, bisphenol A decaoxy ethylene diacrylate, bisphene Compounds obtained by adding α, β-unsaturated carboxylic acids to glycidyl group-containing compounds (trimethylolpropane triglycidyl ether triacrylate, bisphenol A diglycidyl ether acrylate, etc.), acrylics Alkyl esters of acids or alkyl esters of methacrylic acid (ethyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-methyl acrylate)
Ethylhexyl ester, 2-ethylhexyl methacrylate, etc.).

The amount of the component (A) in the present invention is as follows:
The amount is preferably from 40 to 80 parts by weight based on 100 parts by weight of the total of the components (A) and (C). If the amount is less than 40 parts by weight, the photocured product tends to be brittle, and when used as a photosensitive element, the coating properties tend to be poor. If the amount exceeds 80 parts by weight, the sensitivity tends to be insufficient.

The compounding amount of the component (B) in the present invention is as follows:
Preferably, the amount is 0.1 to 20 parts by weight based on 100 parts by weight of the total of the components (A) and (C). If the amount is less than 0.1 part by weight, the sensitivity tends to be insufficient. If the amount exceeds 20 parts by weight, the absorption on the surface of the composition during exposure increases, and the internal photo-curing increases. It tends to be insufficient.

The amount of the component (C) in the present invention is as follows:
It is preferable that the content is in the range of 20 to 60 parts by weight based on 100 parts by weight of the total amount of the components (A) and (C). If the amount is less than 20 parts by weight, the sensitivity tends to be insufficient, and if it exceeds 60 parts by weight, the photocured product tends to become brittle.

The compounding amount of the compound represented by the general formula (I), which is an essential component in the component (C) in the present invention, is 10 to 90 parts by weight based on 100 parts by weight of the component (C). And more preferably 60 to 90 parts by weight. If the amount is less than 10 parts by weight, the plating resistance, adhesion and tent reliability tend to be poor,
If the amount exceeds 90 parts by weight, the amount of sludge tends to increase. The compounding amount of the compound represented by the general formula (III), which is an essential component in the component (C) in the present invention, is as follows:
It is preferably from 10 to 90 parts by weight, more preferably from 10 to 40 parts by weight, based on 100 parts by weight of the component (C). When the amount is less than 10 parts by weight, plating resistance, adhesion, tent reliability and foamability tend to be inferior, and when it exceeds 90 parts by weight, the amount of sludge tends to increase.

The photosensitive resin composition of the present invention may optionally contain additives such as a dye, a color former, a plasticizer, a pigment, a flame retardant, a stabilizer, and an adhesion promoter.

In the photosensitive resin composition of the present invention, the above components are dissolved in a solvent dissolving them, for example, toluene, acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, chloroform, methylene chloride, By dissolving in dimethylformamide, methanol, ethanol or the like, a uniform solution can be obtained.

The photosensitive element of the present invention is obtained by applying the above-mentioned photosensitive resin composition of the present invention on a support by a conventional method and drying it. As the support in the present invention, a polymer film, for example, polyethylene terephthalate,
A film made of polypropylene, polyethylene, or the like is used, and among them, a polyethylene terephthalate film is preferable. Since these polymer films must be removable from the photosensitive layer later, they must not have been subjected to a surface treatment or made of a material that cannot be removed. Further, the thickness of these polymer films is preferably 5 to 100 μm,
More preferably, it is 30 μm. One of these polymer films may be laminated on both sides of the photosensitive layer as a support film for the photosensitive layer and the other as a protective film for the photosensitive layer.

Examples of the coating method include a roll coating method, a knife coating method and a spray coating method.
The drying temperature is usually from 80 to 150C, and the drying time is usually from 1 to 30 minutes. The thickness of the photosensitive layer in the photosensitive element of the present invention is preferably from 1 to 100 μm, and more preferably from 10 to 60 μm.

In producing a photoresist image using the photosensitive element of the present invention, if the above protective film is present, after removing the protective film, the photosensitive layer is pressed against a substrate while heating. It is laminated by doing. The surface to be laminated is usually a metal surface, but is not particularly limited. The temperature of the thermocompression bonding of the photosensitive layer is not particularly limited, but is usually 90 to 130 ° C. Further, the pressure for heating and pressing the photosensitive layer is not particularly limited, but is usually 3 kg / cm ² . If the photosensitive layer is heated as described above, it is not necessary to preheat the substrate in advance, but the substrate may be preheated to further improve the lamination property.

The photosensitive layer thus completed in lamination is
Next, it is imagewise exposed to actinic light using a negative or positive film. At this time, if the polymer film present on the photosensitive layer is transparent, it may be exposed as it is, and if it is opaque, it must be removed. From the viewpoint of protection of the photosensitive layer, the polymer film is transparent, and it is preferable to expose the polymer film while leaving the polymer film remaining.

As the active light, light generated from a known active light source, for example, a carbon arc, a mercury vapor arc, a xenon arc or the like is used. Since the sensitivity of the photopolymerization initiator contained in the photosensitive layer is usually maximum in the ultraviolet region, the active light source should be one that effectively emits ultraviolet light. When the photopolymerization initiator is sensitive to visible light, for example, 9,10-phenanthrenequinone or the like, visible light is used as the active light, and the light source other than those described above is photographic light. Flood light bulbs, sun lamps and the like are also used.

Next, after exposure, if a polymer film or the like is present on the photosensitive layer, it is removed, and then, using an aqueous alkali solution, for example, spraying, rocking immersion, brushing, scraping, etc. The unexposed portion is removed by a known method described above, and development is performed. As the base of the alkaline aqueous solution, for example, lithium hydroxide, sodium hydroxide, alkali hydroxide such as potassium hydroxide, lithium carbonate or bicarbonate, sodium carbonate or bicarbonate, Alkali carbonates such as potassium carbonate or bicarbonate,
Alkali metal phosphates such as potassium phosphate and sodium phosphate, and alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate are used, and sodium carbonate is particularly preferable. The pH of the aqueous alkali solution used for development is preferably 9 to 11, and the temperature is adjusted according to the developability of the photosensitive layer. Further, a surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating the development, and the like may be mixed in the alkaline aqueous solution.

Further, when manufacturing a printed wiring board, the surface of the substrate exposed using the developed photoresist image as a mask is treated by a known method such as etching or plating. Then, the photoresist image is usually
It is peeled off with an aqueous solution that is more alkaline than the aqueous alkaline solution used for development. As the strong alkaline aqueous solution, for example, an aqueous solution of 1 to 5% by weight of sodium hydroxide is used.

[0031]

The present invention will be described below with reference to examples. Examples 1 and 2 and Comparative Examples 1 to 4 The materials (components (A), (B), additives and solvents) shown in Tables 1 and 2 were blended to obtain solutions.

[0032]

[Table 1]

[0033]

[Table 2]

The component (C) shown in Table 3 was dissolved in this solution to obtain a solution of the photosensitive resin composition.

[0035]

[Table 3]

Next, the solution of the photosensitive resin composition was added to 2
The photosensitive element was obtained by uniformly coating on a 5 μm-thick polyethylene terephthalate film and drying with a hot air convection dryer at 100 ° C. for 10 minutes. The dried film thickness of the photosensitive resin composition layer was 50 μm.

On the other hand, the copper surface of a copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-E-61) which is a glass epoxy material in which silver foil (thickness: 35 μm) is laminated on both sides is # 600.
Polishing using a polishing machine (manufactured by Sankeisha Co., Ltd.) having a considerable brush, washing with water, and drying in an air stream, heating the obtained copper-clad laminate to 80 ° C. The conductive resin composition layer was laminated while being heated to 120 ° C. Then
Using a negative film on the substrate thus obtained, a 3 kW high-pressure mercury lamp (HMW-20 manufactured by Oak Manufacturing Co., Ltd.)
Exposure of 90 mJ / cm ² was performed in 1B).

Next, the polyethylene terephthalate film was removed, and 1 liter of a 1% by weight aqueous sodium carbonate solution was sprayed at 30 ° C. for 60 seconds to remove unexposed portions. In this development step, the sludge generated was separated and filtered by a centrifugal separator, and further filtered at 150 ° C.
After drying for 4 hours, the weight of the sludge was measured. The foaming property was determined by measuring the height from the upper end of the developer surface to the upper end of the foam after spraying for 90 minutes in the same developing step. The adhesion is expressed by the width (μm) of the line remaining without being separated from the developer, and the smaller the value of the adhesion, the thinner the copper-clad laminate without peeling from the copper-clad laminate. Indicates that the adhesion is high.

The plating resistance was determined by laminating as described above and performing exposure at a predetermined exposure amount. Then, after development with the above developer, degreasing (PC-455 (manufactured by Meltex Corporation))
25% by weight) 5 minutes immersion → water washing → soft etch (ammonium persulfate 150 g / l) 2 minutes immersion → water washing → 10% by weight
Pretreatment is performed in the order of immersion in sulfuric acid for 1 minute, and a copper sulfate plating bath (copper sulfate 75 g / liter, sulfuric acid 190 g / liter, chlorine ion 50 pp)
m, cover glyme PCM (manufactured by Meltex Co., Ltd., 5 ml / liter), and copper sulfate plating was performed at room temperature at 3 A / dm ² for 40 minutes. After that, it was washed with water, immersed in 10% by weight of borofluoric acid for 1 minute, and subjected to a solder plating bath (45% by weight of tin borofluoride 64 ml / l, 45% of lead borofluoride 22 ml / l.
2% by weight borofluoric acid 200ml / liter, Plutin LA Conductivity Salt (Meltex)
20g / liter, Putin LA starter (manufactured by Meltex) 40ml / liter) and solder plating at room temperature.
Performed at 1.5 A / dm ² for 15 minutes.

After washing with water and drying, a cellophane tape was immediately applied to check the plating resistance, and the cellophane tape was peeled off in a vertical direction (90 ° peel-off test) to check whether or not the resist had peeled off. Further, after the resist was peeled off, the presence or absence of the solder plating was observed from above using an optical microscope. When the solder plating is buried, solder deposited by plating is observed below the transparent resist through the transparent resist.

Next, a copper-clad laminate having a thickness of 1.6 mm
A laminate of the photosensitive resin composition was laminated on both sides of a substrate having 100 holes, and exposed to 90 mJ / cm ² and developed for 60 seconds. Next, the strength of this hole was measured using a rheometer (manufactured by FUDOH) using a cylinder having a diameter of 1.5 mm and an insertion diameter, and the strength up to breakage and elongation were measured.

A 1.6 mm thick copper-clad laminate has a diameter of 4 mm.
A laminate of the photosensitive resin composition was laminated on both sides of a base material (see FIG. 1) having three consecutive mm holes and exposed to 90 mJ / cm ² and developed twice for 60 seconds. Was. Then, after the development, the portions shown in 1 of FIG.
The number of torn holes in the hole was measured and evaluated as a deformed tent tear ratio (the following formula).

(Equation 1) Table 4 summarizes the above results. The tent strength, tent elongation and deformed tent tear rate in Table 4 were considered as tent reliability.

[0043]

[Table 4]

As is clear from the above results, Examples 1 and 2 of the present invention reduce sludge and foaming during development, and are excellent in adhesion, plating resistance and tent reliability.

[0045]

According to the present invention, the photosensitive resin composition according to the present invention reduces sludge and foaming generated at the time of development, and has a plating resistance and a base metal by any of a copper through-hole method and a solder through-hole method. And excellent tent reliability. The photosensitive resin composition according to the second aspect exhibits the effects of the photosensitive resin composition according to the first aspect, and is more excellent in plating resistance, adhesion, suppression of sludge, and the like. The photosensitive resin composition according to the third aspect is the first aspect.
Or the effect of the photosensitive resin composition described in 2 is obtained, and further, photocurability, coating properties, sensitivity, and the like are excellent. The photosensitive element according to claim 4 reduces sludge and foaming generated during development, and is excellent in plating resistance, adhesion to a base metal, and the like by any of a copper through-hole method and a solder through-hole method. And the tent reliability is good.

[Brief description of the drawings]

FIG. 1 is an evaluation board for evaluating a deformed tent tear rate in Examples. One of 18 places where the deformed tent tear rate was evaluated is shown enlarged.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical display location G03F 7/033 G03F 7/033 H05K 3/06 H05K 3/06 J H 3/18 0430-4E 3 / 18 D

Claims (4)

[Claims] 1. A composition comprising (A) a binder polymer having a carboxyl group, (B) a photopolymerizable initiator, and (C) a photopolymerizable compound having a polymerizable ethylenically unsaturated group in a molecule. ) In the component, a compound of the general formula (I) [In the formula, R ¹ represents a trivalent organic group, and R ² represents a compound represented by the general formula (II). (Wherein, R ³ represents a hydrogen atom or a methyl group, X represents an alkylene oxide group, and n represents an integer of 1 to 14), and a general formula (III) ) [Wherein, Y represents an alkylene oxide group, and k represents 1 to
Which is an integer of 10] as an essential component. 2. The content of the urethane unsaturated compound represented by the general formula (I) in the component (C) is at least 100%.
The photosensitive resin composition according to claim 1, wherein the amount is 10 to 90 parts by weight based on part by weight. 3. The amount of component (A), component (B) and component (C) is 40 to 100 parts by weight in total of component (A) and component (C). 80 parts by weight,
The component (B) is 0.1 to 20 parts by weight and the component (C) is
The photosensitive resin composition according to claim 1, which is 20 to 60 parts by weight. 4. A photosensitive element, wherein the photosensitive resin composition according to claim 1, 2 or 3 is applied on a support and dried.