JPH10103933A - Inspecting instrument for mounted substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a highly accurate inspection by improving discrimination accuracy of excessively large or small quantity of a solder fillet. SOLUTION: Prior to inspection, an arithmetic processing means determines coordinate points indicating the sectional shapes of fillet masters based on image signals of an acceptable solder fillet master, an excessively large solder fillet master and an excessively small solder fillet master taken by an image pickup means prior to inspection and defines sectional area values of the acceptable solder fillet master, the excessively large solder fillet master and the excessively small solder fillet master from the coordinate points to obtain and store an excessively large size discrimination threshold and an excessively small size discrimination threshold value from the sectional area values. In the inspection, coordinate points indicating the shape of the cross section of a solder fillet to be inspected are determined based on an image signal of the solder fillet to be inspected taken by an image pickup means (step 103) and a sectional area value of the solder fillet to be inspected is defined from the coordinate points (step 105). Then, the sectional area value is compared with the excessively large size discrimination value and the excessively small size discrimination value to judge the propriety of the solder fillet to be inspected (step 106).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting board inspection apparatus for inspecting the quality of a solder fillet of a board on which electronic components are mounted.

[0002]

2. Description of the Related Art Conventionally, as a mounting board inspection apparatus, a solder fillet is irradiated with red, green, and blue illumination lights at different angles from each other, and the reflected light of the solder fillet is made incident on a CCD camera to obtain an area ratio of three colors. 2. Description of the Related Art There is known a mounting board inspection apparatus configured to determine the quality of a solder fillet based on the information.

[0003]

However, according to the conventional mounting board inspection apparatus, even though the solder fillet is actually "good", the solder fillet is properly inspected due to the mounting displacement of the electronic component with respect to the board. In the case where the inspection is performed out of the range, one of the three colors is missing and only the two colors appear in the image, thereby erroneously determining that the solder fillet is “defective”. There was something. In addition, the conventional mounting board inspection apparatus has problems that it is difficult to find an unsoldered fillet, and it is difficult to accurately determine whether the amount of the solder fillet is too large or too small.

The present invention solves the above-mentioned problems of the conventional device and improves the accuracy of determining whether the amount of the solder fillet is too large or too small by accurately measuring the cross-sectional shape of the solder fillet. It is an object of the present invention to provide a mounting board inspection apparatus capable of performing the inspection of (1).

[0005]

According to a first aspect of the present invention, there is provided a mounting board inspection apparatus for inspecting the quality of a solder fillet of a board on which an electronic component is mounted.
A multi-stage annular illumination means for irradiating the solder fillet with illumination light, an imaging means for receiving reflected light from the solder fillet, and an arithmetic processing means for judging the quality of the solder fillet to be inspected, the arithmetic processing means Finds a coordinate point representing the cross-sectional shape of the solder fillet to be inspected based on the image signal of the solder fillet to be inspected by the imaging means, finds a cross-sectional area value of the solder fillet to be inspected from the coordinate points,
The cross-sectional area value is compared with a predetermined determination threshold to determine the quality of the solder fillet to be inspected.

According to a second aspect of the present invention, there is provided a mounting board inspection apparatus for inspecting the quality of a solder fillet of a board on which an electronic component is mounted, wherein the solder fillet is irradiated with illumination light. Illuminating means, imaging means for receiving the reflected light of the solder fillet, and arithmetic processing means for judging the quality of the solder fillet to be inspected, the arithmetic processing means comprising: Based on the image signals of the master, excessive solder fillet master and under solder fillet master, coordinate points representing the cross-sectional shape of each fillet master are obtained. Are calculated, and an over-discrimination threshold and an under-discrimination threshold are determined from these cross-sectional area values. At the time of inspection, a coordinate point representing a cross-sectional shape of the solder fillet to be inspected is obtained based on an image signal of the solder fillet to be inspected by the imaging means, and a sectional area value of the solder fillet to be inspected is obtained from the coordinate points. The cross-sectional area value is compared with the over-determination threshold value and the under-determination threshold value to determine the quality of the solder fillet to be inspected.

According to a third aspect of the present invention, there is provided a mounting board inspection apparatus for inspecting the quality of a solder fillet of a board on which an electronic component is mounted, wherein the solder fillet is irradiated with illumination light. Illuminating means, imaging means for receiving the reflected light of the solder fillet, and arithmetic processing means for judging the quality of the solder fillet to be inspected, the arithmetic processing means comprising: Based on the image signals of the master, oversized solder fillet master, and undersized solder fillet master, coordinate points representing the cross-sectional shape of each fillet master are determined, and overdetermined from each coordinate point by a statistical method based on multidimensional information. A threshold and an under-determination threshold are obtained and stored, and at the time of inspection, based on the image signal of the solder fillet to be inspected by the imaging means. A coordinate point representing the cross-sectional shape of the solder fillet to be inspected is obtained, and a unique value of the solder fillet to be inspected is obtained from this coordinate point by a statistical method based on multidimensional information. It is characterized in that the quality of the inspection target solder fillet is determined by comparing the threshold value with the threshold value.

According to a fourth aspect of the present invention, there is provided a mounting board inspection apparatus.
Alternatively, in the mounting board inspection apparatus according to the third aspect, the over-determination threshold and the under-determination threshold are each correctable.

[0009]

According to the first aspect of the present invention, a coordinate point representing a cross-sectional shape of the solder fillet to be inspected is obtained based on an image signal of the solder fillet to be inspected by the imaging means, and the inspection object is determined from the coordinate points. The cross-sectional area value of the solder fillet is determined, and the cross-sectional area value is compared with a predetermined determination threshold to determine the quality of the solder fillet to be inspected, thereby improving the accuracy of determining whether the amount of the solder fillet is excessively large or small. As a result, a highly accurate inspection can be performed.

According to the second aspect of the present invention, before the inspection, the sectional shape of each fillet master is represented based on the image signals of the good solder fillet master, the excessive solder fillet master, and the small solder fillet master by the imaging means. The coordinate points are determined, the cross-sectional area values of the good solder fillet master, the excessive solder fillet master, and the under-sized solder fillet master are determined from the coordinate points, and the over-determination threshold value and the under-determination threshold value are determined from these cross-sectional area values and stored. In addition, at the time of inspection, a coordinate point representing a cross-sectional shape of the solder fillet to be inspected is obtained based on an image signal of the solder fillet to be inspected by the imaging means, and a cross-sectional area value of the solder fillet to be inspected is obtained from the coordinate points. The cross-sectional area value is compared with the over-determination threshold and the under-determination threshold to determine the quality of the solder fillet to be inspected. Because there was Unishi, the solder fillet excessive, to improve the discrimination accuracy of too small, it is possible to perform highly precise inspection.

According to the third aspect of the present invention, before the inspection, the sectional shape of each fillet master is represented based on the image signals of the good solder fillet master, the excessive solder fillet master, and the undersized solder fillet master by the imaging means. A coordinate point is obtained, and an over-discrimination threshold and an under-discrimination threshold are obtained and stored by a statistical method based on multidimensional information from each coordinate point, and at the time of inspection, an image of the solder fillet to be inspected by the imaging means is obtained. A coordinate point representing a cross-sectional shape of the solder fillet to be inspected is obtained based on the signal, and a unique value of the solder fillet to be inspected is obtained from the coordinate points by a statistical method based on multidimensional information. Since the quality of the solder fillet to be inspected is judged by comparing with the under-determination threshold value, whether the solder fillet is too large or too small is determined. Degrees to improve, can be inspected with high accuracy.

According to the fourth aspect of the present invention, the over-threshold threshold and the under-threshold threshold can be respectively corrected. Since a determination threshold suitable for an image signal can be set, it is possible to determine whether the solder fillet is too large or too small in a long-term online measurement process.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a configuration diagram of a mounting board inspection apparatus according to one embodiment.

In FIG. 1, reference numeral 1 denotes a substrate. A chip component 2 as an electronic component is mounted on a substrate 1, and the chip component 2 is soldered to the substrate 1, and a solder fillet 3 is formed between a surface of the substrate 1 and an end surface of the chip component 2. . The substrate 1 is held by a substrate holder 4. The substrate holder 4 can be moved in the X-axis direction by the movement of the X-axis stage 5 and in the Y-axis direction by the movement of the Y-axis stage 6, respectively.
Is movable in the X-axis direction and the Y-axis direction with the movement of. Therefore, the solder fillet 3 is connected to the X-axis stage 5
Each position of the Y-axis stage 6 can be changed in the X-axis direction and the Y-axis direction.

Above the solder fillet 3, a CCD camera 7 of, for example, 250,000 pixels as image pickup means for picking up an image of the shape of the solder fillet 3 is fixed.

Further, above the solder fillet 3, a solder
Irradiate the fillet 3 with illumination light, and
Multi-stage ring to make the light incident on the CCD camera 7
Lighting means L₁ , L_Two ……, L_n-1 , L_n Is fixed
I have. This annular illumination means L ₁ , L_Two ……, L_n-1 ,
L_n Consists of, for example, a red LED, and the illumination angle θ of each stage
₁ , Θ_Two , ……, θ_n-1 , Θ_n Is indicated by the arrow in FIG.
As such, they are set at different angles from each other.

The X-axis stage 5 and the Y-axis stage 6 are driven and controlled by the control device 10, and the image signal of the CCD camera 7 is input to the control device 10, and the illumination means L ₁ , L
_{2, ......, L n-1} , L n is driven and controlled by the control device 10.

The control device 10 includes an X-axis stage 5 and a Y-axis stage 5.
A stage controller 11 for driving and controlling the axis stage 6;
A place where the image signal of the CD camera 7 is captured and binarized.
An image processing unit 12 for performing fixed image processing,
Lighting means L₁ , L_Two ……, L _n-1 , L_n Switch on,
An illumination control unit 13 for controlling brightness and the like. Stay
Image controller 12, image controller 12, and illumination controller 13
Correspond to the CPU (central processing unit) 1 via the bus 14, respectively.
5 is connected to the CPU 15, the stage control unit 11,
The processing unit 12 and the illumination control unit 13 are controlled overall.
The CPU 15 has a ROM (reading only) via the bus 14.
16) and RAM (writable memo at any time)
B) 17 is connected.

Next, an example of the processing performed by the control device 10 will be described in order with reference to FIG.

(1) First, the X-axis stage 5 is controlled by the stage control unit 11 so that the position of the solder fillet 3 to be inspected with respect to the CCD camera 7 is a reference position, that is, a predetermined position at which the solder fillet 3 can be imaged. And Y
The axis stage 6 is moved (Step 100).

(2) Next, the illumination control unit 13 switches and turns on the multi-stage annular illumination means L ₁ , L ₂ ,..., L _{n− 1} , L _n in a predetermined order, and a plurality of different illumination angles θ. ₁ , θ
_{2, ......, θ n-1} , θ n in so as to irradiate illumination light to the test object solder fillet 3 turns on the annular illumination means such as L ₁ should be initially lit, illumination by annular illumination means L ₁ irradiates illumination light to the inspected solder fillet 3 at an angle theta ₁ (step 101). Thereby, the reflected light of the solder fillet 3 to be inspected enters the CCD camera 7.

(3) Next, an image signal is taken in from the CCD camera 7 by the image processing section 12 (step 102).

(4) Next, the CPU 15 outputs an image signal
Coordinate points representing the cross-sectional shape of the solder fillet 3 to be inspected
(X₁ , Z₁ ) Of the X coordinate position X₁ And further
X coordinate position X₁ And lighting angle θ₁ And Z coordinate position Z₁ 
, And the coordinate point (X₁ , Z₁ ) And R
It is stored in the AM 17 (step 103). This allows
Annular illumination means L₁ Lighting angle θ₁ Inspection target solder
Inspection target soldering when illuminating light is applied to fillet 3
Point (X) representing the cross-sectional shape of the₁ , Z ₁ )
Round.

(5) Next, it is determined whether or not all the switching lighting of the multi-stage annular illumination means has been completed and all image signals have been captured (step 104). At this point, the process returns to step 101 because only the first image signal capture has been completed.

[0026] (6) In step 101, turns off the annular illumination means L ₁ by the illumination control unit 13 turns on the annular lighting means L ₂ instead, the illumination angle theta ₂ by annular illumination means L ₂ Irradiation light is applied to the solder fillet 3 to be inspected. Then, similarly to the above (3) and (4), an image signal is fetched from the CCD camera 7 (step 102) and coordinate points (X) representing the cross-sectional shape of the solder fillet 3 to be inspected.
₂ , Z ₂ ) is obtained and stored in the RAM 17 (step 10).
3).

(7) Thereafter, the remaining annular illumination means L ₃ ,.
, L _n-1 and L _n are sequentially turned on, and a coordinate point (X) representing the sectional shape of the solder fillet 3 to be inspected based on the respective illumination angles θ ₃ ,..., Θ _n-1 and θ _{n. 3,} Z _3), ...
.., (X _n−1 , Z _n−1 ), (X _n , Z _n )
17 (steps 101 to 103). And
When all the switching lighting of the multi-stage annular illumination means is completed (step 104), the process proceeds to step 105.

(8) In step 105,
Section shape of the solder fillet 3 to be inspected, obtained as described above
Coordinate point (X₁ , Z₁ ), (X_Two , Z_Two ), (X
_Three , Z _Three ), ..., (X_n-1 , Z_n-1 ), (X_n , Z
_n ), The sectional area value S of the solder fillet 3 to be inspected
Ask for.

(9) Next, the cross-sectional area obtained in step 105
Value S and a predetermined over-determination threshold S _ULAnd underdetermined threshold
Value S_LLAnd the cross-sectional area value S is determined to be_ULThan
Is also small and underdetermined threshold S_LLInspect if greater than
Judge that the target solder fillet 3 is “good”,
The cross-sectional area value S is excessively large._ULOr more, or
Cross-sectional area value S is underdetermined threshold S_LLInspection if:
It is determined that the target solder fillet 3 is “defective”.

FIG. 5 shows an annular illuminating means L having four stages.
₁ , L_Two , L_Three , L_Four The solder fillet to be inspected using
3 is good solder fillet 3_OKIs too large
Let 3_U , If too small solder fillet 3_L Is
The reflected light of each solder fillet in the case is shown.
As shown in FIG. 5, the number of solder fillets 3 to be inspected is too large.
Field fillet 3_U , The illumination angle θ₁ , Θ
_Two , Θ_Three , Θ_Four X coordinate position X obtained corresponding to_1U,
X_2U, X_3U, X_4UIs a good solder fillet 3_OKLighting angle
Degree θ₁ , Θ_Two , Θ_Three , Θ_Four X coordinate position obtained corresponding to
X_{1 OK} , X_2OK , X_3OK, X_4OK On the right side of the drawing
On the other hand, the solder fillet 3 to be inspected is too small.
Set 3_L , The illumination angle θ₁ , Θ_Two , Θ_Three ,
θ_Four X coordinate position X obtained corresponding to_1L, X_2L, X_3L, X
_4LIs a good solder fillet 3_OKLighting angle θ ₁ , Θ_Two ,
θ_Three , Θ_Four X coordinate position X obtained corresponding to_{1 OK} , X
_2OK , X_3OK , X _4OK Is shifted to the left of the drawing.
Call Then, the X coordinate position of the solder fillet 3 to be inspected
X₁ , X_Two , X_Three , X_Four And lighting angle θ₁ , Θ_Two , Θ_Three ,
θ_Four Represents the sectional shape of the solder fillet 3 to be inspected.
Z coordinate position Z of coordinate point (X, Z)₁, Z_Two , Z_Three , Z_Four 
Can be requested.

Next, an example of a method of setting the above-mentioned excessive determination threshold _SUL and underdetermination threshold _SLL will be described with reference to FIG. FIG. 3 shows the content of the determination threshold value setting process performed by the control device 10 before the inspection.

(1) First, one of a number of target solder fillet masters is a good solder fillet master,
The operator determines whether the master is an oversized solder fillet master or an undersized solder fillet master (steps 200 to 202). If it is determined that the master is a good solder fillet master, the process proceeds to steps 100 to 100 in FIG.
Performs the same processing as 105 obtains a cross-sectional area values S _OK non-defective solder fillets master stores the cross-sectional area value S _OK as good master data (step 203), if it is determined that excessive solder fillet master to obtain the cross-sectional area values S _U excessive solder fillet master executes the same processing as steps 100 to 105 in FIG. 2 described above, and stores the cross-sectional area values S _U as excessive master data (step 204) , when it is determined that too small solder fillet master obtains the cross-sectional area values S _L of under-solder fillet master executes the same processing as steps 100 to 105 in FIG. 2 described above, the cross-sectional area values S _L Is stored as under master data (step 205).

(2) Next, a cross-sectional area value is similarly obtained for the remaining solder fillet masters, and the cross-sectional area value is stored as master data of non-defective master data, oversized master data, or undersized master data. (Step 20
0-205).

(3) When mastering is completed for all solder fillet masters (step 20)
6), as described above in obtained good master data S _OK, excessive master data S _U, the following formulas under-master data S _L, sets the excess determination threshold value S _UL and under the determination threshold value S _LL based on (step 207 ).

S _UL = (S _U + S _OK ) / 2 S _LL = (S _L + S _OK ) / 2 The over-determination threshold S _UL and the under-determination threshold S _LL set as described above are the determination thresholds shown in FIG. The correction can be performed by the correction processing. Hereinafter, the content of the determination threshold value correction processing will be described with reference to FIG.

(1) First, coordinate points (X, Z) representing the sectional shape of the inspected solder fillet 3 to be inspected are stored in the RAM 17.
(Step 300).

(2) Next, it is determined whether the coordinate points (X, Z) are continuous or discontinuous (step 301).

(3) Next, the worker inputs a pass / fail judgment value determined based on experience and intuition, that is, an over-judgment threshold and an under-judgment threshold (step 302).

(4) Next, the discrimination thresholds S _UL , S _LL currently set on the apparatus side are compared with the over-discrimination threshold and the under-discrimination threshold input in step 302 to determine the current discrimination threshold S _UL , calculating a margin S _LL (step 303).

(5) Next, the current determination threshold S_UL, S_LLComplement
It is determined whether the correction is necessary (step 304). here
If no correction is required, step 301
If it is determined that the cross-sectional shape is discontinuous in
In step 303, the determination threshold S_UL, S _LLIt is judged that the margin of
This is the case when refusal is made. The discontinuity of the cross-sectional shape
(Holes, dents), oxidation of solder fillet surface,
Wrinkles and irregularities due to uneven surface tension during solder fillet solidification
Contamination, soldering conditions (amount of solder, solder components, temperature, time
Etc.). Cross section is discontinuous
The solder fillet is inherently "bad"
Is determined based on the cross-sectional area value S of the “bad” solder fillet
Threshold S_UL, S_LLIt is not appropriate to correct
No correction is made if the shape is discontinuous.

(6) If it is determined that correction is necessary, the determination thresholds S _UL and S _LL are corrected (step 305). Here, the correction of the discrimination thresholds S _UL and S _LL is performed, for example, such that the distribution of the cross-sectional area value S of the solder fillet 3 to be inspected includes the excessive discrimination threshold S _UL. Is determined, the over-determination threshold value S _UL is increased and corrected to a value larger than the upper limit of the distribution. On the other hand, when it is determined that these solder fillets 3 are “bad”, the over-determination threshold is determined. The threshold value _SLL is reduced and corrected to a value smaller than the lower limit value of the distribution.

As described above, the mounting board of this embodiment
According to the inspection device, the soldering target to be inspected by the imaging unit 7 is
Of the solder fillet 3 to be inspected based on the image signal of the
Find coordinate points (X, Z) representing the cross-sectional shape, and
From (X, Z), the sectional area value S of the solder fillet 3 to be inspected
Is calculated, and this cross-sectional area value S and a predetermined determination threshold value S_UL, S
_LLTo judge the quality of the solder fillet 3 to be inspected
The amount of solder fillet is too large or too small
The accuracy of discrimination is improved and high-precision inspection can be performed.
Wear.

According to the mounting board inspection apparatus of the present embodiment, before the inspection, the cross section of each fillet master is determined based on the image signals of the good solder fillet master, the excessive solder fillet master, and the under solder fillet master by the imaging means 7. The coordinate points representing the shape are obtained, and the cross-sectional area values of the non-defective solder fillet master, the excessive solder fillet master, and the insufficient solder fillet master are determined from the coordinate points (steps 200 to 205). The _SUL and the underdetermination threshold _SLL are obtained and stored (step 207), and the coordinates representing the cross-sectional shape of the solder fillet 3 to be inspected based on the image signal of the solder fillet 3 to be inspected by the imaging means 7 at the time of inspection. A point (X, Z) is obtained, and a sectional area value S of the solder fillet 3 to be inspected is obtained from the coordinate point (X, Z). Due to so as to determine the quality of the area value S and excessive determination threshold value S _UL and under the determination threshold value S is compared with the _LL inspected solder fillets 3, the solder fillet excessive, to improve the discrimination accuracy of too small, precision An inspection can be performed.

Further, according to the mounting board inspection apparatus of this embodiment, since the over-determination threshold value S _UL and the under-determination threshold value S _LL can be respectively corrected, the imaging means 7 and the illuminating means L ₁ -L
_{Even if} the image signal changes due to a long-term change of _n , etc., since a determination threshold suitable for the image signal at that time can be set,
It is possible to determine whether the solder fillet is too large or too small.

Next, a main part of a mounting board inspection apparatus according to another embodiment will be described.

As shown by a two-dot chain line in FIG. 1, this mounting board inspection apparatus has a D
An SP (digital signal processor) 18 is additionally provided. Then, before inspection, coordinate points representing the cross-sectional shape of each fillet master are obtained based on the image signals of the good solder fillet master, the excessive solder fillet master, and the undersized solder fillet master by the imaging unit 7, and a number of coordinate points are determined from each coordinate point. An over-discrimination threshold S _UL and an under-discrimination threshold S _LL are obtained and stored by a statistical method based on dimensional information, and are inspected based on the image signal of the solder fillet 3 to be inspected by the imaging means 7 at the time of inspection. A coordinate point (X, Z) representing the cross-sectional shape of the target solder fillet 3 is obtained, and the coordinate point (X, Z) is obtained.
Z), a unique value of the solder fillet 3 to be inspected is obtained by a statistical method based on multidimensional information, and this unique value is compared with the over-determination threshold value S _UL and the under-determination threshold value S _LL to determine the solder fillet 3 to be inspected. It is configured to determine pass / fail.

Here, as an example of a method of obtaining the discrimination thresholds S _UL and S _LL by a statistical method based on multidimensional information, “Distance of Mahalanobis” (Reference: Genichi Taguchi, “Quality Engineering” vol. 3 No. 1 “Comprehensive evaluation based on multidimensional information and design of SN ratio multidimensional sensing system”). In this method,
The data is normalized from the “good” solder fillet group, R ⁻¹ is calculated from the simple correlation inverse matrix, and the Mahalanobis distance D is calculated.
_{Ask for OK} ² . Similarly, for the solder fillet group of “the solder amount is excessive” and the solder fillet group of “the solder amount is too small”, the above is calculated, and the Mahalanobis distance D _{+ NG} ² ,
Determine the D _-NG ^2. And the Mahalanobis distance D _OK ² ,
An over-determination threshold S _UL and an under-determination threshold S _LL are obtained from D _{+ NG} ² and D _-NG ² based on the following equation.

[0048] _{S UL = {(D + NG} 2 + D OK 2) 1/2 / 2} × K 1 S LL = {(D -NG 2 + D OK 2) 1/2 / 2} × K 1 ( provided that (K ₁ : parameter obtained by experiment) According to this embodiment, too, the accuracy of discriminating whether the solder fillet is too large or too small can be improved, and a high-precision inspection can be performed.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a mounting board inspection apparatus according to one embodiment.

FIG. 2 is a flowchart showing processing contents of the apparatus.

FIG. 3 is a flowchart showing processing contents of the same apparatus.

FIG. 4 is a flowchart showing processing contents of the same apparatus.

FIG. 5 is an explanatory diagram for explaining the operation of the apparatus.

[Explanation of symbols]

1 substrate 2 chip component (electronic component) 3 inspected solder fillet 7 CCD camera (imaging means) L ₁ ~L _n multistage annular illumination means 10 control unit (central processing unit)

Claims (4)

[Claims] 1. A mounting board inspection apparatus for inspecting the quality of a solder fillet on a board on which an electronic component is mounted, comprising: a multi-stage annular illumination means for irradiating the solder fillet with illumination light; An imaging unit that receives the reflected light, and an arithmetic processing unit that determines the acceptability of the solder fillet to be inspected is provided. The arithmetic processing unit is configured to calculate the solder fillet to be inspected based on an image signal of the solder fillet to be inspected by the imaging unit. A coordinate point representing a cross-sectional shape is obtained, a cross-sectional area value of the solder fillet to be inspected is obtained from the coordinate point, and the cross-sectional area value is compared with a predetermined determination threshold value to determine the quality of the solder fillet to be inspected. Characterized mounting board inspection equipment. 2. A mounting board inspection apparatus for inspecting the quality of a solder fillet of a board on which an electronic component is mounted, comprising: a multi-stage annular illumination means for irradiating the solder fillet with illumination light; An imaging unit for receiving the reflected light; and an arithmetic processing unit for judging the quality of the solder fillet to be inspected, the arithmetic processing unit comprising: a non-defective solder fillet master, an excessive solder fillet master, Based on each image signal of the solder fillet master, a coordinate point representing a cross-sectional shape of each fillet master is obtained, and from these coordinate points, respective cross-sectional area values of a good solder fillet master, an excessive solder fillet master, and an under solder fillet master are obtained. An over-discrimination threshold and an under-discrimination threshold are obtained and stored from these cross-sectional area values, and at the time of inspection, A coordinate point representing the cross-sectional shape of the solder fillet to be inspected is determined based on the image signal of the solder fillet to be inspected by the imaging means, and a sectional area value of the solder fillet to be inspected is determined from the coordinate points. A mounting board inspection apparatus characterized by comparing a determination threshold value with the underdetermination threshold value to determine the quality of a solder fillet to be inspected. 3. A mounting board inspection apparatus for inspecting the quality of a solder fillet of a board on which an electronic component is mounted, comprising: a multi-stage annular illumination means for irradiating the solder fillet with illumination light; An imaging unit for receiving the reflected light; and an arithmetic processing unit for judging the quality of the solder fillet to be inspected, the arithmetic processing unit comprising: a non-defective solder fillet master, an excessive solder fillet master, A coordinate point representing the cross-sectional shape of each fillet master is obtained based on each image signal of the solder fillet master, and an over-discrimination threshold and an under-discrimination threshold are determined from each coordinate point by a statistical method based on multidimensional information. At the time of inspection, disconnection of the solder fillet to be inspected is performed based on the image signal of the solder fillet to be inspected by the imaging means. Obtain a coordinate point representing a surface shape, obtain an eigenvalue of the solder fillet to be inspected by a statistical method based on multidimensional information from the coordinate point, and compare the eigenvalue with the over-determination threshold and the under-determination threshold. A mounting board inspection apparatus for determining the quality of a solder fillet to be inspected. 4. The over-determination threshold and the under-determination threshold are each correctable.
Or the mounting board inspection apparatus according to 3.