JPH10100375A - Method and device for printing on printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for printing on a printed wiring board which is superior in accuracy of positioning and productivity in terms of the printing method for the printed wiring board wherein a board is positioned on a reference position by using two positioning holes to be aligned thereto and the printing is performed on the surface of the board. SOLUTION: There is disclosed a method for positioning a board by using positioning holes 51, 51. Aligning pins 21, 21 each having a cone shape section 211 of which diameter in the bottom face is greater than that of the positioning hole 51 are inserted into the respective positioning holes 51, 51 so that the board is brought into contact with the base. The aligning pins 21, 21 which can be expanded or contracted in the diameter direction are inserted into the two positioning holes 51, 51, respectively such that each of the diameters of the pins 21, 21 is smaller than that of the corresponding positioning holes. Next, the diameters of the aligning pins 21, 21 are expanded and abutted to the positioning holes 51, 51, respectively.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board printing method and a printed circuit board printing apparatus.

[0002]

2. Description of the Related Art Printed wiring boards are used in electric and electronic equipment. This printed wiring board uses an organic substrate such as a metal foil-clad laminate, and after drilling a through-hole that penetrates the board, performs metal plating on the surface of the metal foil and the wall of the through-hole, and connects the front and back. Then, after etching the metal foil and metal plating layer on the substrate surface to form a conductor circuit on the substrate surface, solder resist is applied so that solder does not adhere to the surface of the part other than the conductor circuit to be connected to electronic components. It is manufactured by a method of forming a film or the like.

[0003] As a method of etching the metal foil and the metal plating layer on the surface of the substrate, there is a method of printing a resist ink to protect a portion to be left for a conductor circuit before the etching, a method of printing a dry film resist, and the like. After protecting the metal foil and metal plating layer left for conductor circuits by printing the dry film resist by adhering the sheet called to the entire surface of the substrate, exposing, and then removing the dry film resist in the portion to be etched Is performed by an etching method. Similarly, when a solder resist film is formed, the solder resist film is formed by a method of printing a resist ink or a method of printing using a dry film resist.

When printing is performed using resist ink or dry film resist, it is necessary to align through holes formed in the substrate with plates of a printing apparatus. A method has been put to practical use in which holes are formed, and the positioning holes are inserted into pins having substantially the same diameter as the positioning holes provided in the printing apparatus.

However, the printed wiring board is liable to cause a variation in the spacing between the positioning holes due to the shrinkage of the substrate in a heating process or the like during the manufacturing process. In some cases, the positioning holes are deformed when trying to insert them into the pins provided in the above. When the positioning holes are deformed, there is a problem that a deviation is likely to occur between an actual through-hole hole and the like and a printing position, and the positioning accuracy is low. In addition, a method is considered in which some pins are movable pins so that the positioning holes are not deformed. However, in this method, the displacement due to the shrinkage of the substrate is shifted to the movable pin side, and the movable pin side is displaced. There was a problem that alignment accuracy was low.

Therefore, in order to manufacture a high-precision printed wiring board having a small tolerance of a deviation between a through-hole or the like and a printing position, the position of an optical system such as a CCD as disclosed in Japanese Patent Application Laid-Open No. H5-222994 is disclosed. The detecting means and the position detecting means are fixed, and the position detecting means is
The position of a plurality of positioning holes formed in a substrate is image-recognized using an apparatus having a support base or the like that can move in the direction and the θ direction, and the amount of displacement between the substrate and a predetermined reference position of the printing apparatus is determined. The method of adjusting the position of the substrate to a predetermined reference position of the printing apparatus for each substrate by moving the position of the substrate by the amount of the positional deviation amount is being studied.

However, in this method, although the positioning holes are not deformed, the positioning accuracy can be improved.
In order to improve the accuracy, after preliminarily adjusting the positional shift using a CCD having a wide field of view, use a CCD with a high accuracy but a narrow viewing angle, and it is difficult to improve the accuracy unless it is readjusted. There was a problem that it took a long time and the productivity was low. Therefore, the alignment accuracy is excellent,
In addition, there is a demand for a method of printing a printed wiring board having excellent productivity.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to use two positioning holes on a substrate having a plurality of positioning holes. A printed wiring board printing method for printing a printed wiring board on a substrate surface after aligning the board to a predetermined reference position, wherein the printed wiring board printing method is excellent in alignment accuracy and excellent in productivity. It is in.

Another object of the present invention is to provide a printed wiring board printing apparatus capable of printing a printed wiring board with excellent alignment accuracy and excellent productivity.

[0010]

According to a first aspect of the present invention, there is provided a method of printing a printed wiring board, comprising: positioning a substrate at a predetermined reference position using two positioning holes of a substrate having a plurality of positioning holes. After that, in the method of printing a printed wiring board to be printed on the substrate surface, the method of positioning using the positioning hole is a matching pin having a conical portion whose bottom diameter is greater than or equal to the diameter of the positioning hole, The method is characterized in that two positioning holes are respectively inserted into and brought into contact with alignment pins formed so that the substrate is inserted from the apex side of the conical portion.

According to a second aspect of the present invention, there is provided a method for printing a printed wiring board, comprising: positioning a substrate at a predetermined reference position using two positioning holes on a substrate having a plurality of positioning holes; In the printing method of the printed wiring board to be printed, the method of positioning using the positioning holes,
Using a diametrically expandable and contractable alignment pin, insert the two positioning holes into the alignment pin with the diameter of the alignment pin being smaller than the diameter of the positioning hole, and then expand the diameter of the alignment pin. The method is characterized in that a matching pin is brought into contact with each positioning hole.

According to a third aspect of the present invention, there is provided a method of printing a printed wiring board according to the first or second aspect, wherein the step of inserting the positioning hole into the alignment pin is performed before the step of inserting the positioning hole. After each of the two positioning holes is inserted into a supply position adjustment pin having a diameter smaller than the diameter of the positioning hole provided at a substrate supply position provided in a desired direction from the reference position, the substrate is moved in the desired direction. And a step of transporting the substrate supply position a distance away from a predetermined reference position in a direction opposite to the above.

According to a fourth aspect of the present invention, there is provided a method of printing a printed wiring board, comprising: positioning a substrate at a predetermined reference position using two positioning holes on a substrate having a plurality of positioning holes; In the printing method of the printed wiring board to be printed, the method of positioning using the positioning holes,
After each of the two positioning holes is inserted into a supply position adjustment pin having a diameter smaller than the diameter of the positioning hole provided at a substrate supply position provided in a desired direction and separated from a predetermined reference position, the substrate is moved to the desired position. In the direction opposite to the direction, the substrate supply position is transported a distance away from a predetermined reference position, and the substrate is arranged at the reference position. Then, the position of each positioning hole is image-recognized, and the substrate and the predetermined reference position are recognized. The method is characterized in that a displacement amount from a position is obtained, and the position of the substrate is moved by the displacement amount.

According to a fifth aspect of the present invention, there is provided a method for printing a printed wiring board according to the third or fourth aspect, wherein the diameter of the supply position adjusting pin is smaller than the diameter of the positioning hole by 0. .3 to 1.5 mm thin.

A printed wiring board printing apparatus according to a sixth aspect of the present invention is a printed wiring board printing apparatus used in the method for printing a printed wiring board according to the third aspect, wherein the substrate supply means includes supply position adjusting pins. And a positioning unit having alignment pins, and after closely fixing the substrate in close contact with the substrate inserted into the supply position adjusting pin of the substrate supply unit, supplying the substrate in a direction opposite to the desired direction. Substrate transport means for transporting the substrate at a distance from a predetermined reference position, and then inserting a positioning hole into the alignment pin.

According to the printed wiring board printing method according to the first and second aspects of the present invention, the distance between the positioning holes is deviated from the designed distance by contracting or expanding during the manufacturing process of the printed wiring board. Is inserted into the alignment pins, the displacement caused by the contraction or expansion of the substrate is equally distributed from the center of the substrate to one alignment pin and from the center of the substrate to the other alignment pin. Therefore, printing with excellent alignment accuracy can be performed. Further, since the positioning can be performed only by inserting the substrate into the alignment pins, the positioning can be performed with excellent productivity.

According to the method of printing a printed wiring board according to the third aspect of the present invention, the position of the positioning hole of the conveyed substrate substantially coincides with the position of the alignment pin formed at the predetermined reference position. It can be easily inserted into the pin,
The operation of inserting the positioning holes into the alignment pins can be easily automated.

According to the printed wiring board printing method of the fourth aspect of the present invention, the position of the positioning hole of the conveyed substrate substantially coincides with the position of the alignment pin formed at the predetermined reference position. Preliminary adjustment of misalignment using position detection means with a wide field of view is no longer necessary, and direct positioning is possible using high-precision but narrow-viewing-angle position detection means, resulting in excellent positioning accuracy. ,And,
It is possible to print a printed wiring board with excellent productivity.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A printed wiring board printing method and a printed wiring board printing apparatus according to the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an embodiment of a method for printing a printed wiring board according to claim 1 of the present invention, wherein FIG. 1A is a perspective view of a printing apparatus using the method, and FIG. FIG. 4 is an explanatory diagram of a main part showing a state where a board is inserted into a pin.
FIG. 2 is an explanatory view of a main part showing a state in which a substrate is inserted into an alignment pin in one embodiment of the method of manufacturing a printed wiring board according to claim 1 of the present invention. FIG. 3 is a perspective view of a printing apparatus using an embodiment of the method for manufacturing a printed wiring board according to claim 2 of the present invention, and FIG. 4 is a method for manufacturing a printed wiring board according to claim 2 of the present invention. FIG. 5 is an explanatory view of a main part showing a state in which a substrate is inserted into a matching pin according to the embodiment;
FIG. 6 is an explanatory view of a principal part showing a state in which a substrate is inserted into matching pins according to another embodiment of the method for manufacturing a printed wiring board according to claim 2 of the present invention. It is a principal part explanatory view showing the state which inserted the board | substrate to the matching pin of further another embodiment of the manufacturing method of such a printed wiring board. FIG. 7 is a perspective view of a printing apparatus using an embodiment of the method for manufacturing a printed wiring board according to claim 4 of the present invention.

[Printing Method for Printed Wiring Board According to Claim 1 of the Present Invention] A printing apparatus using one embodiment of the method for printing a printed wiring board according to claim 1 of the present invention is shown in FIG.
As shown in (a), a substrate supply means 1 on which a plurality of substrates 5 are loaded, a positioning means 2 having alignment pins 21 and 21 at predetermined reference positions, and a substrate 5 loaded on the substrate supply means 1 It has a substrate transfer means (not shown) for transferring to the positioning means 2.

Alignment pins 21 provided in positioning means 2
As shown in FIG. 1B, reference numerals 1 and 2 denote alignment pins 21 and 21 having conical portions 211 whose bottom surfaces have diameters equal to or larger than the diameters of the positioning holes 51 and 51, respectively. It is formed so that the substrate 5 is inserted. When the two positioning holes 51, 51 of the substrate 5 are inserted into the alignment pins 21, 21, respectively, the alignment pins 21, 21 are inserted.
21, the positioning holes 51 and 5 are formed in the conical portion 211.
1 to come into contact with the wall surface.

Therefore, when the substrate 5 shrinks in a heating step or the like during the manufacturing process of the printed wiring board, as shown in FIG. 2A, the two positioning holes 51, 51 are respectively aligned with the alignment pins 21, 21. Into the positioning holes 5
The outer portion of the substrate 5 in the circumferences of the bases 1 and 51 contacts the conical portions 211 and 211 of the alignment pin. FIG. 2 is a view in which the alignment pins 21 and 21 are cut away at the bottom portion of the substrate 5. In addition, when the substrate 5 is extended, FIG.
As shown in (c), the inside of the substrate 5 in the circumference of the positioning holes 51, 51 is the conical portion 2 of the alignment pin.
11 and 211, and when the substrate is at the designed value, as shown in FIG.
1 and 51 are in contact with the conical portions 211 and 211 of the alignment pin all around.

For this reason, when a substrate whose positioning holes are deviated from the designed distance due to contraction or expansion during the manufacturing process of the printed wiring board or the like is inserted into the alignment pins (21), the substrate 5 contracts or expands. The displacement caused by the
Is uniformly distributed in the direction from the center to one of the alignment pins and in the direction from the center of the substrate 5 to the other alignment pin, so that printing with excellent alignment accuracy can be performed. Also,
Since the positioning can be performed only by inserting the substrate 5 into the alignment pins, the positioning can be performed with excellent productivity.

The conical portion 211 of the alignment pin is
The shape is not limited to the conical shape, and includes a shape having a rounded tip and a shape having a flat shape. The diameter of the bottom surface of the conical portion 211 is not particularly limited as long as the diameter is equal to or larger than the diameter of the positioning hole 51. This is preferable because the device is not excessively large.

Further, as shown in FIG. 1A, the printing apparatus transfers the substrate 5 from the substrate supply means 1 to the positioning means 2.
Is transported. Then, the supply position adjusting pins 11, 11 of the substrate supply means 1 are provided at substrate supply positions provided in a desired direction from the predetermined reference position.
It has. The supply position adjusting pins 11, 11 are pins having a diameter smaller than the diameter of the positioning holes 51, 51. The supply position adjusting pins 11, 11 contract or expand during the manufacturing process of the printed wiring board or the like, and the distance between the positioning holes 51, 51 becomes the design interval. Substrate 5 deviated from
Even so, it can be easily inserted.

Further, from the substrate supply means 1 to the positioning means 2
The substrate transporting means for transporting the substrate 5 to the substrate is fixed to the substrate 5 in close contact with the substrate 5 inserted into the supply position adjusting pins 11 of the substrate supply means 1, and then opposite to the desired direction. In the direction V, the substrate supply position is moved a distance away from a predetermined reference position, and the substrate 5 is conveyed to the positioning means 2, and then the positioning pins 21, 21 are provided with positioning holes 51, 51.
Is to be inserted.

As described above, prior to the step of inserting the positioning holes 51, 51 into the alignment pins 21, 21, the positioning holes 51 provided at the substrate supply position provided in a desired direction from the predetermined reference position are provided. , 51 are provided with two positioning holes 51, 51.
After each is inserted, a step of transporting the substrate 5 in the direction V opposite to the desired direction by a distance separated from the substrate supply position by a predetermined reference position is included. The positions of the positioning holes 51, 51 substantially match the positions of the alignment pins 21, 21 formed at a predetermined reference position, and the tip of the conical portion of the alignment pins 21, 21 is thin, so that the alignment pins are formed. This is preferable because it is possible to easily insert the positioning holes 51, 51 into the alignment pins 21, 21.

The diameter of the supply position adjusting pins 11, 11 is 0.3 to 1.5 m larger than the diameter of the positioning holes 51, 51.
It is preferable that m is thin. If the distance is less than 0.3 mm, the substrate transfer means is in close contact with the substrate 5 and the supply position adjusting pins 11, 11
When it is attempted to remove the substrate 5 from the substrate, it may be difficult to remove the substrate 5.
May not be inserted when it is attempted to insert it into the alignment pins 21 and 21 after transporting the same.

The desired direction in which the substrate supply position is provided at a desired distance from the predetermined reference position is not particularly limited, and the direction of the line connecting the two alignment pins 21 and 21, Any direction, such as a direction orthogonal to the direction of the line connecting the two alignment pins 21 and 21, may be used. When the substrate transport means is formed to transport the substrate 5 by rotating about the rotation axis, the direction of the arc on which the substrate is transported is also included in the desired direction.

According to the present invention, the substrate 5 is positioned at a predetermined reference position using the two positioning holes 51, 51 of the substrate 5. For example, using the third hole, the position of the hole is adjusted. Those that do not adjust the position are not included in the positioning holes 51, 51, such as preventing incorrect mounting of the substrate 5 on the front and back and left and right depending on whether or not a pin smaller than the diameter is inserted. Further, the reference position is not limited to a position where printing is performed at that position, and even if printing is performed after the substrate 5 is conveyed from that position, the position is determined using the positioning holes 51 and 51 thereafter. If there is no alignment, the last aligned position is included in the reference position.

The substrate 5 used in the present invention is not particularly limited as long as it has a plurality of positioning holes 51, 51. For example, epoxy resin, phenol resin, polyimide resin, unsaturated polyester Thermosetting resins such as resin-based and polyphenylene ether-based resins, and sheets in which a metal layer is formed on one or both surfaces of a sheet obtained by mixing an inorganic filler or the like with these thermosetting resins, or inorganic materials such as glass Substrates such as cloth of fibers, organic fibers such as polyester, polyamide, and cotton, and paper or the like are bonded with the above-mentioned thermosetting resin or the like, and a metal layer is formed on one side or both sides. The metal layer may form a circuit or the like by etching a predetermined portion. The method for forming the positioning hole 51 is not particularly limited, and the positioning hole 51 is formed by cutting with a drill or punching out with a die.

[Printing Method of Printed Wiring Board According to Claim 2 of the Present Invention] A printing apparatus using one embodiment of a method of printing a printed wiring board according to claim 2 of the present invention is as shown in FIG. A substrate supply means 1 on which a plurality of substrates 5 are loaded;
The positioning means 2 includes alignment pins 21 and 21 at predetermined reference positions, and a substrate transfer means (not shown) for transferring the substrate 5 loaded on the substrate supply means 1 to the positioning means 2.

The alignment pins provided in the positioning means are shown in FIG.
As shown in FIGS. 4A and 4B, the alignment pins 21 are diametrically expandable and contractible. As shown in FIG. After the two positioning holes 51 are inserted into the alignment pin 21 with a diameter smaller than the diameter, as shown in FIG. 4B, the opening / closing drive unit 213 is raised to divide the alignment pin support unit 212. Then, the diameter of the alignment pin 21 is expanded so as to come into contact with the wall surface of the positioning hole 51.

Therefore, when the substrate shrinks in a heating step or the like in the manufacturing process of the printed wiring board, as shown in FIG. 5A, the two positioning holes 51, 51 are respectively fitted to the alignment pins 21, 21. When inserted, the positioning holes 5
The outer portion of the substrate 5 in the circumferences of the bases 1 and 51 comes into contact with the alignment pins 21 and 21. Also, if the substrate is stretched,
As shown in FIG. 5C, the positioning holes 51 and 5 are respectively provided.
In the circumference of 1, the portion inside the substrate 5 is the alignment pin 21,
21 and when the substrate is as designed, as shown in FIG. 5B, the positioning holes 51, 51 are respectively provided.
At a plurality of positions.

For this reason, when a substrate in which the distance between the positioning holes is deviated from the designed distance due to contraction or expansion during the manufacturing process of the printed wiring board is inserted into the alignment pins 21 and 21,
The displacement caused by the contraction or extension of the substrate 5 is caused by the direction of one of the alignment pins 21 from the center of the substrate 5 and the displacement of the substrate 5.
Is uniformly distributed in the direction of the other alignment pin 21 from the center of the print head, so that printing with excellent alignment accuracy can be performed. Also, the board 5 is inserted into the matching pins 21 and 21,
Since the alignment can be performed only by expanding the diameter of the alignment pins 21 and 21, the alignment with excellent productivity can be performed.

The direction in which the alignment pins 21 and 21 are divided is not limited to the direction of the line connecting the two alignment pins 21 and 21. For example, as shown in FIG. May be divided in a direction orthogonal to the direction of the line connecting. Further, the number of divisions of the matching pins 21 is not limited to two, but may be larger.

In this printing apparatus, the positioning holes 51 and 51 are formed in the alignment pins 21 and 21 similarly to the printing apparatus using the method for printing a printed wiring board according to the first aspect of the present invention.
Before the step of inserting the positioning holes 51, the two positioning holes 51 are provided in the supply position adjusting pins provided at a substrate supply position provided in a desired direction from a predetermined reference position and having a diameter smaller than the diameter of the positioning holes 51 and 51. , 51 after each insertion, a step of transporting the substrate 5 in the direction V opposite to the desired direction by a distance away from the substrate supply position from a predetermined reference position. By inserting the two positioning holes 51 into the alignment pins 21 in a state where the diameter of 21 is smaller than the positioning holes 51 of the substrate 5,
The positioning holes 51, 51 can be easily inserted into the alignment pins 21, 21, and the positioning holes 5, 5 can be inserted into the alignment pins 21, 21.
This is preferable because the work of inserting the first and the first 51 can be easily automated.

[Printing Method of Printed Wiring Board According to Claim 4 of the Present Invention] A printing apparatus using one embodiment of the method of printing a printed wiring board according to claim 4 of the present invention is as shown in FIG. A substrate supply means 1 on which a plurality of substrates 5 are loaded;
Positioning means 2 having an image recognition device (not shown) for positioning at a predetermined reference position, and substrate transport means (not shown) for transporting the substrate 5 loaded on the substrate supply means 1 to the positioning means 2 have.

The positioning means 2 includes positioning holes 51, 51
Is recognized by the position detection means of an optical system such as a CCD camera, the amount of displacement between the substrate 5 and a predetermined reference position is determined, and a gantry movable in the X, Y, and θ directions is provided. The position of the substrate 5 is adjusted to a predetermined reference position by moving by the amount of the displacement amount.

In the case of this printing apparatus, similarly to the printing apparatus using the method for printing a printed wiring board according to the first aspect of the present invention, a substrate supply device provided in a desired direction from a predetermined reference position is provided. After inserting the two positioning holes 51, 51 into the supply position adjustment pins having a diameter smaller than the diameter of the positioning holes 51, 51 provided at the positions, the substrate 5 is placed in the direction V opposite to the desired direction. The substrate supply position is transported a distance away from a predetermined reference position.

Therefore, the positions of the positioning holes 51, 51 of the substrate 5 conveyed to the positioning means 2 substantially coincide with the positions of the position detecting means provided corresponding to the predetermined reference position. The step of preliminarily adjusting the position shift using the position detecting means having a field of view becomes unnecessary, and the position can be aligned using the position detecting means having a high direct accuracy but a narrow viewing angle, and the positioning accuracy is excellent, and It is possible to print a printed wiring board with excellent productivity.

[0042]

According to the printed wiring board printing method according to the first and second aspects of the present invention, the distance between the positioning holes is deviated from the designed distance by contracting or expanding during the manufacturing process of the printed wiring board. When the inserted board is inserted into the matching pins,
The displacement caused by the contraction or expansion of the board is evenly distributed from the center of the board to one of the alignment pins and from the center of the board to the other alignment pin.
Printing with excellent alignment accuracy becomes possible. In addition, since positioning can be performed simply by inserting the board into the alignment pins,
Excellent positioning can be achieved with high productivity.

According to the method of printing a printed wiring board according to the third aspect of the present invention, in addition to the above-described effects, the position of the positioning hole of the transported substrate is further determined by the position of the alignment pin formed at a predetermined reference position. Therefore, the positioning pin can be easily inserted into the alignment pin, and the operation of inserting the positioning hole into the alignment pin can be easily automated.

According to the printed wiring board printing method according to the fourth aspect of the present invention, the position of the positioning hole of the conveyed substrate substantially matches the position of the alignment pin formed at the predetermined reference position. Preliminary adjustment of misalignment using position detection means with a wide field of view is no longer necessary, and direct positioning is possible using high-precision but narrow-viewing-angle position detection means, resulting in excellent positioning accuracy. ,And,
It is possible to print a printed wiring board with excellent productivity.

According to the printed wiring board printing method of the present invention, when the substrate is pulled out from the supply position adjusting pin, the substrate can be easily removed, and when the substrate is transported and inserted into the alignment pin, The displacement between the alignment pin and the positioning hole is reduced.

According to the printed wiring board printing apparatus of the sixth aspect of the present invention, it is possible to print a printed wiring board having excellent alignment accuracy and excellent productivity.

[Brief description of the drawings]

FIG. 1 is a view showing one embodiment of a method for printing a printed wiring board according to claim 1 of the present invention, (a) is a perspective view of a printing apparatus using the method, and (b) is FIG. 4 is an explanatory view of a relevant part showing a state where a substrate is inserted into an alignment pin.

FIG. 2 is an explanatory view of a main part showing a state in which a substrate is inserted into an alignment pin in one embodiment of the method for manufacturing a printed wiring board according to claim 1 of the present invention.

FIG. 3 is a perspective view of a printing apparatus using one embodiment of a method for manufacturing a printed wiring board according to claim 2 of the present invention.

FIG. 4 is an essential part explanatory view showing a state in which a substrate is inserted into an alignment pin in one embodiment of the method for manufacturing a printed wiring board according to claim 2 of the present invention.

FIG. 5 is an explanatory view of a principal part showing a state in which a substrate is inserted into matching pins in another embodiment of the method for manufacturing a printed wiring board according to claim 2 of the present invention.

FIG. 6 is an explanatory view of a main part showing a state where a substrate is inserted into an alignment pin according to still another embodiment of the method for manufacturing a printed wiring board according to claim 2 of the present invention.

FIG. 7 is a perspective view of a printing apparatus using one embodiment of a method for manufacturing a printed wiring board according to claim 4 of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate supply means 2 Positioning means 5 Substrate 11 Supply position adjustment pin 21 Alignment pin 51 Positioning hole 211 Conical part

Claims (6)

[Claims] 1. After positioning a substrate (5) at a predetermined reference position using two positioning holes (51, 51) of a substrate (5) having a plurality of positioning holes (51, 51),
In the method of printing a printed wiring board for printing on the surface of the substrate (5), the method of positioning using the positioning holes (51, 51) is such that the diameter of the bottom surface is larger than the diameter of the positioning holes (51, 51). Alignment pins (21, 21) each having a conical portion (211), the alignment pins (21, 21) formed so that the substrate (5) is inserted from the vertex side of the conical portion (211). A method for printing a printed wiring board, comprising: inserting and positioning two positioning holes (51, 51). 2. After positioning the substrate (5) at a predetermined reference position using two positioning holes (51, 51) of the substrate (5) having a plurality of positioning holes (51, 51),
In the method of printing a printed wiring board to be printed on the surface of the substrate (5), the method of positioning using the positioning holes (51, 51) is based on the alignment pins (21, 2) that can be enlarged and reduced in the diameter direction.
1), the positioning pins (21, 21) are smaller in diameter than the positioning holes (51, 51) in a state where the positioning pins (21, 21) have two positioning holes (51, 5).
1) and then the matching pins (21, 2)
By expanding the diameter of 1), the respective positioning holes (51, 5)
A method for printing a printed wiring board, wherein the method is a method of contacting the matching pins (21, 21) with (1). 3. Prior to the step of inserting the positioning holes (51, 51) into the alignment pins (21, 21), a positioning provided at a substrate supply position provided in a desired direction from the predetermined reference position is provided. After inserting the two positioning holes (51, 51) into the supply position adjusting pins (11, 11) each having a diameter smaller than the diameter of the holes (51, 51), the substrate (5) is turned in the opposite direction to the desired direction. 3. The method for printing a printed wiring board according to claim 1, further comprising a step of transporting the substrate supply position in a direction (V) at a distance from a predetermined reference position. 4. After positioning the substrate (5) at a predetermined reference position using two positioning holes (51, 51) of the substrate (5) having a plurality of positioning holes (51, 51),
In the method of printing a printed wiring board to be printed on the surface of the substrate (5), the method of positioning using the positioning holes (51, 51) is performed at a substrate supply position provided in a desired direction from a predetermined reference position. The positioning holes (51, 5
Supply position adjusting pin (11, 11) smaller in diameter than 1)
After inserting the two positioning holes (51, 51), the substrate (5) is conveyed in the direction (V) opposite to the desired direction at a distance away from the predetermined reference position by the substrate supply position. Then, the substrate (5) is arranged at the reference position, and the position of each positioning hole (51, 51) is image-recognized to determine the amount of positional deviation between the substrate (5) and the predetermined reference position. 5) A method of printing a printed wiring board, wherein the method of 5) is a method of moving the position by the amount of the positional deviation. 5. The diameter of the supply position adjusting pin (11, 11) is 0.3 to 1 .1 from the diameter of the positioning hole (51, 51).
The method for printing a printed wiring board according to claim 3, wherein the printed wiring board is thin by 5 mm. 6. A printed wiring board printing apparatus used in the method for printing a printed wiring board according to claim 3, wherein the substrate supply means (1) includes supply position adjusting pins (11, 11).
Positioning means (2) having alignment pins (21, 21); and supply position adjusting pins (1) of the substrate supply means (1).
After relatively fixing the substrate (5) in close contact with the substrate (5) inserted in the first and the first (11), the substrate supply position is set to a predetermined reference position in a direction (V) opposite to the desired direction. The substrate (5) is transported a distance away from the alignment pin (2).
A printed circuit board printing apparatus, comprising: a substrate transporting means for inserting positioning holes (51, 51) into (1, 21).