JPH0999547A - Automatic instruction device of recognition mark position and instruction method - Google Patents

Automatic instruction device of recognition mark position and instruction method

Info

Publication number
JPH0999547A
JPH0999547A JP7258880A JP25888095A JPH0999547A JP H0999547 A JPH0999547 A JP H0999547A JP 7258880 A JP7258880 A JP 7258880A JP 25888095 A JP25888095 A JP 25888095A JP H0999547 A JPH0999547 A JP H0999547A
Authority
JP
Japan
Prior art keywords
camera
recognition
wide
range
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7258880A
Other languages
Japanese (ja)
Inventor
Hideo Sakon
英雄 左近
Takeo Tsukuda
猛郎 佃
Kunio Oe
邦夫 大江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7258880A priority Critical patent/JPH0999547A/en
Publication of JPH0999547A publication Critical patent/JPH0999547A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Abstract

PROBLEM TO BE SOLVED: To automate mark instruction on a printed board and a screen mask by coaxially arranging optical axes of a wide range photographing camera and a recognizing high magnification camera, switching these cameras as occasion demands, and photographing a recognition mark. SOLUTION: A recognizing high magnification camera 9 to be used for recognition correction is arranged such that its optical axis is coaxial to a mark instruction through a wide range photographing camera 8 for photographing wide ranges, a lenses 10, 11 and a half mirror 12. A camera switching device 16 turns on and off a marker irradiation device 13 by a control signal 18 coming from a recognition board 17 and switches between the wide range photographing camera 8 and the recognizing high magnification camera 9. Errors ΔX, ΔY between the center point of the wide range photographing camera 8 and the recognition mark are read by a CCD element. Coordinates Cx2 and Cy2 at a target camera position are calculated based on Cx2=Cx1+ΔX.T, Cy2=Cy1+ΔY.T, wherein Cx1 and Cy1 represent a present camera position and T represents a length of a printed board per picture element.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は認識マーク位置の教示自
動装置と教示方法に関し、特に電子部品実装用プリント
基板へクリーム半田を印刷する設備の認識カメラに係
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic teaching device and a teaching method for a recognition mark position, and more particularly to a recognition camera of equipment for printing cream solder on a printed circuit board for mounting electronic parts.

【0002】[0002]

【従来の技術】近年は電子機器の小型化に伴い、電子部
品、特にICチップをリード線に接続し、全体を樹脂や
セラミックで封止したQFP(Quad Flat Package)のリ
ード狭ピッチ化が進み、クリーム半田印刷機は狭ピッチ
ランド印刷への対応が要求されている。
2. Description of the Related Art In recent years, with the miniaturization of electronic equipment, the lead pitch of a QFP (Quad Flat Package) in which electronic components, especially IC chips are connected to lead wires and wholly sealed with resin or ceramics has become narrower. The cream solder printing machine is required to support narrow pitch land printing.

【0003】図4は従来のクリーム半田印刷機の概略構
成図を示し、図4の構成において、ステージ1はプリン
ト基板2を所定の位置に規正しスクリーンマスク3まで
移動させる装置である。認識カメラ4はプリント基板2
とスクリーンマスク3に設けられた認識マーク(図略)を
撮影し、認識モニター5は認識カメラ4の撮影している
映像を表示する。カメラ軸6は認識カメラ4を任意の位
置へ移動させる機構である。スキージ7はクリーム半田
をスクリーンマスク3の開口部へ充填しプリント基板2
へ印刷する装置である。
FIG. 4 is a schematic block diagram of a conventional cream solder printing machine. In the configuration shown in FIG. 4, the stage 1 is an apparatus that sets the printed board 2 to a predetermined position and moves it to the screen mask 3. The recognition camera 4 is the printed circuit board 2
The recognition mark (not shown) provided on the screen mask 3 is photographed, and the recognition monitor 5 displays the image photographed by the recognition camera 4. The camera shaft 6 is a mechanism for moving the recognition camera 4 to an arbitrary position. The squeegee 7 fills the opening of the screen mask 3 with the cream solder and the printed circuit board 2
Is a device for printing.

【0004】次に上記構成のクリーム半田印刷機の動作
について説明する。クリーム半田印刷機の動作は主に、
プリント基板2をスクリーンマスク3の位置へ合わせる
動作(版合わせ)とクリーム半田をスクリーンマスク3の
開口部へ充填する動作(印刷動作)に分けられる。
Next, the operation of the cream solder printing machine having the above construction will be described. The operation of the cream solder printing machine is mainly
It is divided into an operation of aligning the printed circuit board 2 with the position of the screen mask 3 (plate alignment) and an operation of filling the opening of the screen mask 3 with cream solder (printing operation).

【0005】版合わせ動作は、まずプリント基板2をス
テージ1へ搬入し規正を行う。その後、認識カメラ4に
よりプリント基板2に設けた認識マークの位置を計測
し、プリント基板2の中心位置を求める。この中心位置
を、あらかじめ認識カメラ4で計測したスクリーンマス
ク3の中心位置に合わせるようにステージ1を移動させ
る。
In the plate aligning operation, first, the printed board 2 is carried into the stage 1 and is calibrated. After that, the position of the recognition mark provided on the printed circuit board 2 is measured by the recognition camera 4 to obtain the center position of the printed circuit board 2. The stage 1 is moved so that this center position is aligned with the center position of the screen mask 3 measured by the recognition camera 4 in advance.

【0006】印刷動作は、前記版合わせが行われた後、
スキージ7をあらかじめ設定した速度で移動させること
により、スクリーンマスク3の開口部へクリーム半田を
充填する。
The printing operation is performed after the plate alignment is performed.
By moving the squeegee 7 at a preset speed, the cream solder is filled in the opening of the screen mask 3.

【0007】このような動作を行うクリーム半田印刷機
において狭ピッチ化QFPへの対応としては、版合わせ
動作における誤差(スクリーンマスク3のパターンとプ
リント基板2のパターンのズレ)を減少させることが要
求される。図4の構成のクリーム半田印刷機では、一般
に認識カメラ4の高倍率化、ステージ1の駆動軸移動量
の高分解能化という手段が採られている。
In order to cope with the narrow pitch QFP in the cream solder printing machine performing such an operation, it is required to reduce the error in the plate matching operation (deviation between the pattern of the screen mask 3 and the pattern of the printed board 2). To be done. In the cream solder printing machine having the configuration shown in FIG. 4, generally, means for increasing the magnification of the recognition camera 4 and increasing the resolution of the movement amount of the drive shaft of the stage 1 are adopted.

【0008】[0008]

【発明が解決しようとする課題】しかしながら、図4の
構成のクリーム半田印刷機では、スクリーンマスク3の
固定位置やプリント基板2の規正時の変動を補正するた
めに、スクリーンマスク3やプリント基板2に設けられ
た認識マーク位置を認識カメラ4で取り込む必要があ
る。このため、あらかじめスクリーンマスク3とプリン
ト基板2の認識マークの位置を教示する必要がある。
However, in the cream solder printer having the configuration shown in FIG. 4, in order to correct the fixed position of the screen mask 3 and the fluctuation of the printed circuit board 2 at the time of setting, the screen mask 3 and the printed circuit board 2 are corrected. It is necessary for the recognition camera 4 to capture the position of the recognition mark provided on the. Therefore, it is necessary to teach the positions of the screen mask 3 and the recognition marks on the printed circuit board 2 in advance.

【0009】従来の教示方法は、オペレータが、プリン
ト基板2上のマークの教示時はサンプルのプリント基板
2をステージ1に規正、スクリーンマスク3上の認識マ
ークの教示時はスクリーンマスク3をクリーム半田印刷
機にセットし、認識カメラ4が現在撮影している位置を
認識モニター5により確認しながら行う。
In the conventional teaching method, the operator sets the sample printed circuit board 2 on the stage 1 when teaching the marks on the printed circuit board 2, and cream solders the screen mask 3 when teaching the recognition marks on the screen mask 3. It is set in a printing machine and the recognition monitor 5 confirms the position where the recognition camera 4 is currently photographing.

【0010】このとき、教示したい認識マークと認識カ
メラ4による撮影像の中心との間に差があれば、認識モ
ニター5から認識カメラ4の現在位置を推測し、カメラ
軸6を操作し、認識マークを認識カメラ4の中心になる
ように調整する。
At this time, if there is a difference between the recognition mark to be taught and the center of the image taken by the recognition camera 4, the current position of the recognition camera 4 is estimated from the recognition monitor 5, the camera axis 6 is operated, and recognition is performed. The mark is adjusted so as to be in the center of the recognition camera 4.

【0011】しかし、クリーム半田印刷機の高精度化で
認識カメラ4が高倍率化していくなか、撮影することが
可能な範囲が狭まり認識モニター5に表示されるプリン
ト基板2やスクリーンマスク3のパターン特徴から、認
識カメラ4の撮影位置を推測することは困難となってい
る。さらに認識カメラ4と認識マークの位置関係を目視
により確認したとしても、認識カメラ4の撮影位置を表
示する手段を用いない場合、数ミリ四方の視野内に認識
マークを捉えるのはかなりの困難を要する。
However, as the recognition camera 4 becomes higher in magnification as the accuracy of the cream solder printing machine becomes higher, the range that can be photographed becomes narrower and the pattern of the printed circuit board 2 and the screen mask 3 displayed on the recognition monitor 5. It is difficult to estimate the shooting position of the recognition camera 4 from the characteristics. Further, even if the positional relationship between the recognition camera 4 and the recognition mark is visually confirmed, it is quite difficult to capture the recognition mark within a field of view of several millimeters square unless a means for displaying the photographing position of the recognition camera 4 is used. It costs.

【0012】また、カメラ軸6をオペレータが任意の位
置に停止させようとした場合、認識モニター5で確認で
きる範囲がきわめて狭いため、目標位置に近づいている
ことを気づかずに行き過ぎ、戻すという操作を繰り返
す。
Further, when the operator tries to stop the camera shaft 6 at an arbitrary position, since the range which can be confirmed by the recognition monitor 5 is extremely narrow, an operation of overshooting and returning without noticing that the target position is approached. repeat.

【0013】さらに認識マークと似た形状がプリント基
板2やマスクスクリーン3上のパターンにある場合、本
来の認識マークと異なる位置を教示する場合がある。
Further, when the pattern on the printed board 2 or the mask screen 3 has a shape similar to the recognition mark, a position different from the original recognition mark may be taught.

【0014】本発明は、前記従来の問題を解決し、教示
(プログラム作成)時間を短縮、オペレータの作業を自動
化することが可能なクリーム半田印刷機に用いて好適な
認識マーク位置の教示自動装置と教示方法の提供を目的
とする。
The present invention solves and teaches the above conventional problems.
(Producing a program) An object of the present invention is to provide a teaching automatic device and a teaching method suitable for a recognition solder mark position suitable for a cream solder printing machine that can shorten the time and automate the work of an operator.

【0015】[0015]

【課題を解決するための手段】本発明は上記目的を達成
するために認識マーク位置の教示自動装置は、光軸が同
軸上に配置され、マーク教示時に広範囲を撮影するカメ
ラおよび認識補正に用いる認識用高倍率カメラと、前記
広範囲撮影用カメラと認識用高倍率カメラの現在の撮影
位置を確認するマーカー照射装置と、前記広範囲撮影用
カメラと認識用高倍率カメラを切り替えるハーフミラー
を、認識ボードからのコントロール信号によって回転さ
せるカメラ切替装置と、前記広範囲撮影用カメラと認識
用高倍率カメラの撮影出力を画像表示する認識モニター
とを有することを特徴とする。
In order to achieve the above object, the present invention is directed to a recognition mark position automatic teaching device which is used for a recognition correction and a camera for photographing a wide range when a mark is taught. The recognition board includes a recognition high-magnification camera, a marker irradiation device for confirming the current photographing positions of the wide-range photographing camera and the recognition high-magnification camera, and a half mirror for switching the wide-range photographing camera and the recognition high-magnification camera. And a recognition monitor for displaying the photographing output of the wide-range photographing camera and the recognition high-magnification camera as an image.

【0016】また、認識マーク位置の教示方法は、前記
広範囲撮影用カメラが撮影した前記認識モニターの画面
表示におけるカメラ撮影像の中心点と認識マークの中心
位置を一致させるため前記中心点からの誤差ΔX,ΔY
を前記広範囲撮影用カメラのCCD画素で読み取り、次
に当該広範囲撮影用カメラの移動すべき座標Cx2,C
y2を求める。
Further, in the teaching method of the recognition mark position, since the center point of the camera image on the screen display of the recognition monitor photographed by the wide-range photographing camera and the center position of the recognition mark are matched, an error from the center point is generated. ΔX, ΔY
Is read by the CCD pixel of the wide-range shooting camera, and then the coordinates Cx2, C to be moved by the wide-range shooting camera are read.
Find y2.

【0017】[0017]

【数2】Cx2=Cx1+ΔX・T Cy2=Cy1+ΔY・T ただし、Cx1,Cy1は現在の広範囲撮影用カメラの座
標、Tは変換係数であって、広範囲撮影用カメラのCC
D画素の1画素あたりのプリント基板上の長さ 次に得られた座標Cx2,Cy2へ広範囲撮影用カメラを
移動させた後、前記認識用高倍率カメラに切り替え前記
認識モニターの画面表示からカメラ座標位置を取り込む
ことによりマーク教示を行うことを特徴とする。
[Formula 2] Cx2 = Cx1 + ΔX · T Cy2 = Cy1 + ΔY · T where Cx1 and Cy1 are the coordinates of the current wide-range shooting camera, and T is the conversion coefficient, which is CC of the wide-range shooting camera.
Length of printed circuit board per pixel of D pixel After moving the camera for wide-range shooting to the coordinates Cx2, Cy2 obtained next, switch to the high-magnification camera for recognition and switch from the screen display of the recognition monitor to camera coordinates The feature is that mark teaching is performed by capturing the position.

【0018】[0018]

【作用】本発明によれば、クリーム半田印刷機に広範囲
撮影用カメラと認識用高倍率カメラの光軸を同軸に配置
し、前記両カメラの用途により随時、切り替え、両カメ
ラの取付位置の誤差を考慮することなく、認識マークの
撮影ができることによって、プリント基板やスクリーン
マスクに設けられたマーク教示を自動化することがで
き、オペレータがプログラム作成に費やす時間を大幅に
短縮することができる。
According to the present invention, the optical axes of the wide-range photographing camera and the recognition high-magnification camera are coaxially arranged in the cream solder printing machine, and switching is performed at any time depending on the use of the both cameras, and an error in the mounting positions of both cameras is caused. Since the recognition mark can be photographed without considering the above, the mark teaching provided on the printed circuit board or the screen mask can be automated, and the time spent by the operator for creating the program can be significantly reduced.

【0019】[0019]

【実施例】図1は本発明の一実施例における認識マーク
位置の教示自動装置の構成を示すブロック図であり、ク
リーム半田印刷機の認識カメラ部を示している。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a block diagram showing the structure of an automatic teaching device for the recognition mark position in one embodiment of the present invention, showing a recognition camera section of a cream solder printing machine.

【0020】図1において、8はマーク教示に広範囲を
撮影するカメラ(以下、広範囲撮影用カメラ:CAM1
という)であり、CCD画素で構成される。9は認識補
正に用いる認識用高倍率カメラ(CAM2)であり、前記
広範囲撮影用カメラ8とは、レンズ10,11およびハーフ
ミラー(MIRROR)12を介して光軸が同軸上に位置するよう
に配置されている。13はマーカー照射装置(MARKER)であ
り、これは前記広範囲撮影用カメラ8もしくは認識用高
倍率カメラ9がレンズ14を介して照明装置15からプリン
ト基板2もしくはスクリーンマスク3上の現在どの位置
を撮影しているかを目視により確認するために用いられ
る。16はカメラ切替装置であり、前記広範囲撮影用カメ
ラ8,認識用高倍率カメラ9,マーカー照射装置13およ
びハーフミラー12に接続されており、認識ボード17から
のコントロール信号18によりマーカー照射装置13のマー
カー照射のON,OFF、広範囲撮影用カメラ8と認識用高
倍率カメラ9の切り替え、つまりハーフミラー12の回転
および認識モニター19の映像出力信号の切り替えを行う
ものである。
In FIG. 1, reference numeral 8 denotes a camera for photographing a wide area for mark teaching (hereinafter referred to as a wide area photographing camera: CAM1).
And is composed of CCD pixels. Reference numeral 9 denotes a recognition high-magnification camera (CAM2) used for recognition correction so that the optical axis is coaxial with the wide-range photographing camera 8 via lenses 10 and 11 and a half mirror (MIRROR) 12. It is arranged. Reference numeral 13 is a marker irradiation device (MARKER), which is used to photograph the current position on the printed circuit board 2 or the screen mask 3 from the illumination device 15 through the lens 14 by the wide-range photographing camera 8 or the recognition high-magnification camera 9. It is used to visually confirm whether or not the operation is being performed. Reference numeral 16 denotes a camera switching device, which is connected to the wide-range photographing camera 8, the recognition high-magnification camera 9, the marker irradiation device 13 and the half mirror 12, and the marker irradiation device 13 is controlled by the control signal 18 from the recognition board 17. Marker irradiation is turned ON / OFF, the wide-range photographing camera 8 and the recognition high-magnification camera 9 are switched, that is, the half mirror 12 is rotated and the image output signal of the recognition monitor 19 is switched.

【0021】以上のように構成された本実施例の動作を
前記図4,図2のマーク教示時の工程説明図および図3
のフローチャートを用いて説明する。
The operation of the present embodiment constructed as described above will be described with reference to FIGS.
This will be described with reference to the flowchart of.

【0022】図2(1)はプリント基板2を教示中の広範
囲撮影用カメラ8,認識用高倍率カメラ9等の状態を示
す斜視図、図2(2)および(3)はそれぞれ認識モニター19
上の広範囲撮影用カメラ(CAM1)8および認識用高倍
率カメラ(CAM2)9の画面表示例を示す。まず、認識
マーク20の教示は最初に図4に示すステージ1にプリン
ト基板2を搬入しセットする。そこで、認識ボード17か
らのコントロール信号18により広範囲撮影用カメラ(C
AM1)8に切り替える(S1)。このときの認識モニター1
9の画面表示19aを図2(2)に例示する。ここで認識モニ
ター19の十字マークのクロス点が、現在の広範囲撮影用
カメラ(CAM1)8の撮影範囲の中心点8aである。こ
れは、マーカー照射装置13のマーカー照射点13aとも一
致する(S2)。
FIG. 2 (1) is a perspective view showing a state of the wide-range photographing camera 8, the recognition high-magnification camera 9, etc. while teaching the printed circuit board 2, and FIGS. 2 (2) and 2 (3) respectively show the recognition monitor 19.
An example of the screen display of the above-mentioned wide-range photographing camera (CAM1) 8 and recognition high-magnification camera (CAM2) 9 is shown. First, in order to teach the recognition mark 20, the printed circuit board 2 is first carried in and set on the stage 1 shown in FIG. Therefore, the control signal 18 from the recognition board 17 is used for the wide-range shooting camera (C
Switch to AM1) 8 (S1). Recognition monitor at this time 1
The screen display 19a of 9 is illustrated in FIG. 2 (2). Here, the cross point of the cross mark on the recognition monitor 19 is the center point 8a of the shooting range of the current wide-range shooting camera (CAM1) 8. This also matches the marker irradiation point 13a of the marker irradiation device 13 (S2).

【0023】次に前記クロス点(中心点8a)と認識マー
ク20の中心位置を一致させるためにクロス点(中心点)8
aからの誤差ΔX,ΔYを広範囲撮影用カメラ(CAM
1)8のCCD素子で読み取り、この広範囲撮影用カメ
ラ(CAM1)8に予め登録された認識マーク20が撮影さ
れているか計測できる(S3)。次に移動すべき広範囲撮影
用カメラ(CAM1)8の中心点8aと視野内の認識マー
ク20の差、つまり移動すべき目標カメラ位置の座標Cx
2,Cy2を(数3)で算出する(S4)。この算出は認識ボー
ド17に内蔵のCPUで行う。
Next, in order to match the center position of the recognition mark 20 with the cross point (center point 8a), the cross point (center point) 8
Wide-angle shooting camera (CAM
1) It is possible to measure whether or not the recognition mark 20 registered in advance in the wide-range photographing camera (CAM1) 8 is photographed by reading with the CCD element 8 (S3). The difference between the center point 8a of the wide-range shooting camera (CAM1) 8 to be moved next and the recognition mark 20 in the field of view, that is, the coordinate Cx of the target camera position to be moved.
2, Cy2 is calculated by (Equation 3) (S4). This calculation is performed by the CPU built in the recognition board 17.

【0024】[0024]

【数3】Cx2=Cx1+ΔX・T Cy2=Cy1+ΔY・T ただし、Cx1,Cy1は現在の広範囲撮影用カメラ8の
座標、Tは変換係数であって、広範囲撮影用カメラ(C
AM1)8のCCD画素の1画素あたりのプリント基板
2上の長さである。
[Expression 3] Cx2 = Cx1 + ΔX · T Cy2 = Cy1 + ΔY · T where Cx1 and Cy1 are the coordinates of the current wide-range shooting camera 8, and T is a conversion coefficient, and the wide-range shooting camera (C
AM 1) 8 CCD pixel length per pixel on the printed circuit board 2.

【0025】次に上記(数3)で得られた座標Cx2,C
y2に誤差ΔX・T,ΔY・Tを加えて広範囲撮影用カ
メラ(CAM1)8を移動させ(S5)、認識用高倍率カメラ
(CAM2)9に認識ボード17からのコントロール信号18
によりカメラ切替装置16で切り替える(S6)。
Next, the coordinates Cx2, C obtained in the above (Equation 3)
High magnification camera for recognition by adding error ΔX ・ T, ΔY ・ T to y2 and moving wide-range shooting camera (CAM1) 8 (S5)
Control signal 18 from recognition board 17 to (CAM2) 9
Is switched by the camera switching device 16 (S6).

【0026】次に認識ボード17からのコントロール信号
18によりカメラ切替装置16を介してマーカー照射装置13
を動作させマーカーをプリント基板2もしくはスクリー
ンマスク3上に照射する(S7)。このときの認識モニター
19の画面表示19bを図2(3)に例示する。この場合、認識
マーク20の中心と広範囲撮影用カメラ(CAM1)8の中
心点8aとが一致することとなる(S8)。
Next, the control signal from the recognition board 17
Marker irradiation device 13 via camera switching device 16 by 18
Is operated to irradiate the marker on the printed circuit board 2 or the screen mask 3 (S7). Recognition monitor at this time
The screen display 19b of 19 is illustrated in FIG. In this case, the center of the recognition mark 20 and the center point 8a of the wide-range shooting camera (CAM1) 8 coincide with each other (S8).

【0027】もし、プリント基板2もしくはスクリーン
マスク3に照射されたマーカーと、認識モニター19に映
しだされる映像(図2(2))を確認し、必要あればカメラ
位置を修正する。そして、マーク認識を行い(S9)、カメ
ラ座標位置を取り込むことによりマーク教示が行われ
る。
If the marker illuminated on the printed board 2 or the screen mask 3 and the image displayed on the recognition monitor 19 (FIG. 2 (2)) are confirmed, the camera position is corrected if necessary. Then, mark recognition is performed (S9), and mark teaching is performed by capturing the camera coordinate position.

【0028】[0028]

【発明の効果】以上説明したように本発明によれば、ク
リーム半田印刷機に、広範囲撮影用カメラと認識用高倍
率カメラの光軸を同軸上に配置し、前記両カメラの用途
により随時切り替え、両カメラの取付位置の誤差を考慮
することなく、認識マークの撮影ができることによっ
て、プリント基板やスクリーンマスクに設けられたマー
ク教示を自動化することができ、オペレータがプログラ
ム作成に費やす時間を大幅に短縮することができる。
As described above, according to the present invention, the optical axes of the wide-range photographing camera and the recognition high-magnification camera are coaxially arranged in the cream solder printing machine, and the cream solder printing machine can be switched at any time depending on the use of the both cameras. Since the recognition mark can be photographed without considering the error of the mounting positions of both cameras, the mark teaching provided on the printed circuit board and the screen mask can be automated, and the operator can spend a lot of time to create the program. It can be shortened.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例における認識マーク位置の教
示自動装置の構成を示すブロック図である。
FIG. 1 is a block diagram showing a configuration of an automatic teaching mark position teaching apparatus according to an embodiment of the present invention.

【図2】図1のマーク教示時の工程を説明する図であ
る。
FIG. 2 is a diagram illustrating a process at the time of teaching marks in FIG.

【図3】図1の動作を説明するフローチャートである。3 is a flowchart illustrating the operation of FIG.

【図4】従来のクリーム半田印刷機の概略構成図であ
る。
FIG. 4 is a schematic configuration diagram of a conventional cream solder printing machine.

【符号の説明】[Explanation of symbols]

1…ステージ、 2…プリント基板、 3…スクリーン
マスク、 7…スキージ、 8…広範囲撮影用カメラ
(CAM1)、 9…認識用高倍率カメラ(CAM2)、
10,11,14…レンズ、 12…ハーフミラー、 13…マー
カー照射装置、 15…照明装置、 16…カメラ切替装
置、 17…認識ボード、 18…コントロール信号、 19
…認識モニター、 20…認識マーク。
1 ... Stage, 2 ... Printed circuit board, 3 ... Screen mask, 7 ... Squeegee, 8 ... Wide range camera
(CAM1), 9 ... High magnification camera for recognition (CAM2),
10, 11, 14 ... Lens, 12 ... Half mirror, 13 ... Marker irradiation device, 15 ... Illumination device, 16 ... Camera switching device, 17 ... Recognition board, 18 ... Control signal, 19
… Recognition monitor, 20… recognition mark.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 光軸が同軸上に配置され、マーク教示時
に広範囲を撮影するカメラおよび認識補正に用いる認識
用高倍率カメラと、前記広範囲撮影用カメラと認識用高
倍率カメラの現在の撮影位置を確認するマーカー照射装
置と、前記広範囲撮影用カメラと認識用高倍率カメラを
切り替えるハーフミラーを、認識ボードからのコントロ
ール信号によって回転させるカメラ切替装置と、前記広
範囲撮影用カメラと認識用高倍率カメラの撮影出力を画
像表示する認識モニターとを有することを特徴とする認
識マーク位置の教示自動装置。
1. A camera which has a coaxial optical axis and which captures a wide range at the time of teaching a mark, and a recognition high-magnification camera used for recognition correction, and current photographing positions of the wide-range photography camera and the recognition high-magnification camera. A marker irradiating device for confirming the above, a camera switching device for rotating a half mirror for switching the wide-range shooting camera and the recognition high-magnification camera according to a control signal from the recognition board, the wide-range shooting camera and the recognition high-magnification camera An automatic teaching device for a recognition mark position, comprising: a recognition monitor that displays the imaged output of the image.
【請求項2】 前記広範囲撮影用カメラが撮影した前記
認識モニターの画面表示におけるカメラ撮影像の中心点
と認識マークの中心位置を一致させるため前記中心点か
らの誤差ΔX,ΔYを前記広範囲撮影用カメラのCCD
画素で読み取り、次に当該広範囲撮影用カメラの移動す
べき座標Cx2,Cy2を求める。 【数1】Cx2=Cx1+ΔX・T Cy2=Cy1+ΔY・T ただし、Cx1,Cy1は現在の広範囲撮影用カメラの座
標、Tは変換係数であって、広範囲撮影用カメラのCC
D画素の1画素あたりのプリント基板上の長さ 次に得られた座標Cx2,Cy2へ広範囲撮影用カメラを
移動させた後、前記認識用高倍率カメラに切り替え前記
認識モニターの画面表示からカメラ座標位置を取り込む
ことによりマーク教示を行うことを特徴とする認識マー
ク位置の教示方法。
2. The errors ΔX and ΔY from the center point for the wide-range photographing are adjusted so that the center point of the camera image on the screen display of the recognition monitor photographed by the wide-range photographing camera coincides with the center position of the recognition mark. CCD of camera
The pixel is read, and then the coordinates Cx2, Cy2 to be moved by the wide range photographing camera are obtained. [Equation 1] Cx2 = Cx1 + ΔX · T Cy2 = Cy1 + ΔY · T where Cx1 and Cy1 are the coordinates of the current wide-range shooting camera, and T is the conversion coefficient, which is CC of the wide-range shooting camera.
Length of printed circuit board per pixel of D pixel After moving the camera for wide-range shooting to the coordinates Cx2, Cy2 obtained next, switch to the high-magnification camera for recognition and switch from the screen display of the recognition monitor to camera coordinates A teaching method of a recognition mark position, which is characterized by performing mark teaching by capturing a position.
JP7258880A 1995-10-05 1995-10-05 Automatic instruction device of recognition mark position and instruction method Pending JPH0999547A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7258880A JPH0999547A (en) 1995-10-05 1995-10-05 Automatic instruction device of recognition mark position and instruction method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7258880A JPH0999547A (en) 1995-10-05 1995-10-05 Automatic instruction device of recognition mark position and instruction method

Publications (1)

Publication Number Publication Date
JPH0999547A true JPH0999547A (en) 1997-04-15

Family

ID=17326320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7258880A Pending JPH0999547A (en) 1995-10-05 1995-10-05 Automatic instruction device of recognition mark position and instruction method

Country Status (1)

Country Link
JP (1) JPH0999547A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620557B1 (en) 2000-01-26 2003-09-16 Mitsubishi Denki Kabushiki Kaisha Photo-mask, photo-mask pair, semiconductor device and method of manufacturing a semiconductor device
CN102501615A (en) * 2011-10-12 2012-06-20 江苏锐毕利实业有限公司 Rigid printed circuit board spray printing positioning method
CN103419487A (en) * 2013-09-04 2013-12-04 昆山市三星机械制造有限公司 Full-automatic printing machine with deviation rectifying device
JP2017227818A (en) * 2016-06-24 2017-12-28 三菱電機株式会社 Optical axis adjusting device
CN110370830A (en) * 2019-07-29 2019-10-25 百力达太阳能股份有限公司 A kind of method of sight check printing quality
CN117428351A (en) * 2023-12-21 2024-01-23 珠海市申科谱工业科技有限公司 Wafer cutting method and device, electronic equipment and medium

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620557B1 (en) 2000-01-26 2003-09-16 Mitsubishi Denki Kabushiki Kaisha Photo-mask, photo-mask pair, semiconductor device and method of manufacturing a semiconductor device
CN102501615A (en) * 2011-10-12 2012-06-20 江苏锐毕利实业有限公司 Rigid printed circuit board spray printing positioning method
CN103419487A (en) * 2013-09-04 2013-12-04 昆山市三星机械制造有限公司 Full-automatic printing machine with deviation rectifying device
JP2017227818A (en) * 2016-06-24 2017-12-28 三菱電機株式会社 Optical axis adjusting device
CN110370830A (en) * 2019-07-29 2019-10-25 百力达太阳能股份有限公司 A kind of method of sight check printing quality
CN117428351A (en) * 2023-12-21 2024-01-23 珠海市申科谱工业科技有限公司 Wafer cutting method and device, electronic equipment and medium
CN117428351B (en) * 2023-12-21 2024-03-15 珠海市申科谱工业科技有限公司 Wafer cutting method and device, electronic equipment and medium

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