JPH0998457A - Printed wiring board wiring method and matrix terminal wiring method - Google Patents
Printed wiring board wiring method and matrix terminal wiring methodInfo
- Publication number
- JPH0998457A JPH0998457A JP25359795A JP25359795A JPH0998457A JP H0998457 A JPH0998457 A JP H0998457A JP 25359795 A JP25359795 A JP 25359795A JP 25359795 A JP25359795 A JP 25359795A JP H0998457 A JPH0998457 A JP H0998457A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- wiring board
- pair lines
- printed wiring
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
Abstract
Description
【発明の属する技術分野】本発明は、マトリクス間の結
線を印刷配線板を介してコネクタ結合するための印刷配
線板配線方法およびマトリクス端子配線方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board wiring method and a matrix terminal wiring method for connecting connectors between matrices via a printed wiring board.
【従来の技術】従来、電話交換機と加入者線を結ぶ主配
線盤(MDF)のジャンパリングをロボットを用いて自
動的に行えるようにした自動MDF装置や、専用線網間
の配線、中継線間の配線、交換機と伝送装置間の配線等
の配線システムにおいては、マトリクス間を直接ケーブ
ル的にジャンパリングする方法が一般的であり、印刷配
線板を介してコネクタ結合する方法は下記の課題を有す
ることから実用化されていなかった。2. Description of the Related Art Conventionally, an automatic MDF device for automatically jumpering a main distribution board (MDF) connecting a telephone exchange and a subscriber line using a robot, wiring between dedicated line networks, and relay lines In a wiring system such as wiring between terminals and wiring between a switch and a transmission device, a method of jumpering directly between matrices is generally used, and a method of connecting a connector through a printed wiring board has the following problems. It was not put to practical use because it had it.
【発明が解決しようとする課題】図11は、コネクタ結
合のための印刷配線板の配線の特徴を示す説明図であ
る。図において、1は印刷配線板、2はコネクタ部、3
はマトリクスであり、ここでは該マトリクス3はダブル
マトリクスボードにより実現されている。ここで、この
ような装置の場合、マトリクス3の4辺から1〜64の
ペア線がコネクタ部2の1〜64ペアに対応すべく配線
する必要がある。同図から明らかな如く、このような印
刷配線板1上の配線は平均配線長が極めて長く、また投
網状となる。従って、通常の配線方法では、交差が極め
て多くなり、多層度が極めて多くなり、このことから装
置が割高となり実用化を阻んでいた。なお、本例ではダ
ブルマトリクスボードを使ったが、シングルマトリクス
ボードでもよい。さらに、マトリクスの数も、ここでは
2個で示したが、3,4,5…個でもよい。さらに、コ
ネクタについても、入出力1辺に出力して配置している
が、これも1辺に限らない。本発明は、以上の問題点に
鑑み、多層度を低くし配線パスを単純化する方法を得
て、印刷配線板を介したコネクタ結合の装置を低価格に
して実用化することを目的とする。FIG. 11 is an explanatory view showing the characteristics of the wiring of the printed wiring board for connector connection. In the figure, 1 is a printed wiring board, 2 is a connector part, 3
Is a matrix, and here the matrix 3 is realized by a double matrix board. Here, in the case of such a device, it is necessary to wire the pair lines of 1 to 64 from the four sides of the matrix 3 so as to correspond to the 1 to 64 pairs of the connector unit 2. As is clear from the figure, the wiring on such a printed wiring board 1 has an extremely long average wiring length and has a mesh shape. Therefore, in the normal wiring method, the number of intersections is extremely large and the multi-layer degree is extremely large, which makes the device expensive and prevents its practical use. Although the double matrix board is used in this example, a single matrix board may be used. Further, although the number of matrices is shown as two here, it may be 3, 4, 5, ... Further, the connectors are also arranged so that they are output to one side of the input / output, but this is not limited to one side. In view of the above problems, it is an object of the present invention to obtain a method for reducing the number of layers and simplifying wiring paths, and to reduce the cost of a device for connector coupling via a printed wiring board and put it into practical use. .
【課題を解決するための手段】本発明は、マトリクス間
の結線を印刷配線板を介してコネクタ結合するための印
刷配線板配線方法において、配線をペア線とし、該ペア
線を上下隣接2層間のパタンとし、かつ、前記ペア線の
配線群を小群化し、小群単位のルーティングを行うこと
を特徴とする。このとき、小群内のペア線間に所要のS
N比を確保できるひねりを入れると良い。さらに、マト
リクス間の結線を印刷配線板を介してコネクタ結合する
ためのマトリクス端子配線方法において、マトリクスの
端子配置を千鳥状にすると良い。SUMMARY OF THE INVENTION The present invention provides a printed wiring board wiring method for connecting connectors between matrices via a printed wiring board, wherein the wiring is a pair of wires, and the pair of wires is a pair of upper and lower adjacent layers. Pattern, and the wiring group of the pair of wires is divided into small groups, and routing is performed in small group units. At this time, the required S between the paired wires in the small group
It is good to add a twist that can secure the N ratio. Further, in the matrix terminal wiring method for connecting the connections between the matrices to each other through the printed wiring board, it is preferable that the matrix terminals are arranged in a staggered manner.
【発明の実施の形態】以下、本発明の実施の形態を図面
に従って説明する。図1は本願第1の発明の一実施の形
態を示す平面図であり、ルートの配線を示す。図2は図
1のA−A′断面図、図3は図1のB−B′断面図を示
す。本願第1の発明は、まず、多層板での隣接する2層
間にペア線4を割り付ける。これにより、配線パスは1
本をベースに考えればよいことに単純化できる。次に、
配線を小群化する。たとえば、マトリクスの各辺を図1
に示す如く四ペア線毎とか、八ペア線毎等にグルーピン
グし、このグループ毎にルートを割り振りすることとす
る。グループ配線パタン間は所要の距離をあける。図4
は同実施の形態を示す平面図であり、SN比保証の配線
を示す。ここで、上記グループ内の配線パタンについ
て、図4に示す如く、隣接間漏話に対し所要のSN比を
保証するためのひねり5を距離に応じ挿入すると、小群
内のペア線4間の漏話特性を押さえることができる。図
4において、a,b,c及びf部のひねり5ではI,II
層のペア間での上下入れ換え、e部のひねり5ではIII
,IV層のペア間での入れ換え、d部ではペア間上下入
れ換え及びI,II層ペアからIII ,IV層ペアへのペア層
移動が行われている。図5は図4のd部のひねり5の詳
細を示す要部斜視図、図6は同要部平面図であり、図に
おいて6はスルーホールであり、そのうちスルーホール
6aによりI層からIII 層への移動を果たし、スルーホ
ール6aによりI層からIII 層への移動を果たし、スル
ーホール6bによりII層からIV層への移動を果たす。ま
た、グループルーティングでひくと、コネクタの端子に
達したとき、並び順が逆になることもある。この場合
は、途中の比較的配線の混んでいないことろで、並び順
反転のパタンを入れる。図7はその並び順反転方法の一
例を示す平面図、図8は図7の分解平面図である。次
に、本願の第2の発明の方法を説明する。マトリクスの
端子部は、配線パタンに厳しく影響するため、ペア線4
毎の千鳥パタンをとる必要がある。図9,図10はマト
リクス端子配置と配線例を示す平面図であり、マトリク
ス3が2つ並んだ例を示している。図中、7はマトリク
スの端子ペアである。ここで、図9は単純なマトリクス
端子配置と配線例を示す平面図である。図10は本願第
2の発明の一実施の形態を示す平面図であり、印刷配線
板の配線を意識した千鳥状の端子配置を示す。ここで、
図9の方法では、左側のマトリクス3からの配線を右側
のマトリクス3の右側まで引き出すためには、端子間パ
タン通過チャネルが1本しかとれないため、ペア線では
4層が必須となる。一方、図10で示す本願第2の発明
の方法では、右側のマトリクス3の端子ペア7を図のよ
うに2倍通せるため、ペア線では2層でよいことにな
る。すなわち、端子ペア7を通過させるチャネル数をか
せぐことで、この部分で多層度がネックにならないよう
になっている。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing an embodiment of the first invention of the present application, showing route wiring. 2 is a sectional view taken along the line AA 'of FIG. 1, and FIG. 3 is a sectional view taken along the line BB' of FIG. In the first invention of the present application, first, the pair wire 4 is allocated between two adjacent layers in the multilayer board. As a result, the wiring path is 1
It can be simplified by thinking based on a book. next,
Group the wiring into small groups. For example, each side of the matrix is
As shown in (4), grouping is performed every four pairs of lines, every eight pairs of lines, etc., and the route is assigned to each group. Leave a required distance between the group wiring patterns. FIG.
[FIG. 6] is a plan view showing the same embodiment, showing wiring for guaranteed SN ratio. Here, regarding the wiring patterns in the above group, as shown in FIG. 4, when a twist 5 for ensuring a required SN ratio for adjacent crosstalk is inserted according to the distance, crosstalk between the paired wires 4 in the small group is performed. The characteristics can be suppressed. In FIG. 4, in the twist 5 of the parts a, b, c and f, I, II
Swap layers between pairs of layers, twist e of part 5 in III
, IV layers are exchanged between pairs, and in section d, pairs are vertically exchanged and pair layers are moved from I, II layer pairs to III, IV layer pairs. 5 is a perspective view of a main part showing details of the twist 5 of the d part in FIG. 4, FIG. 6 is a plan view of the main part, and 6 is a through hole in the drawing. Through the through hole 6a to move from the I layer to the III layer, and through hole 6b from the II layer to the IV layer. In addition, when group routing is used, when the terminals of the connector are reached, the order may be reversed. In this case, a pattern of line order inversion is inserted because the wiring is relatively free in the middle. 7 is a plan view showing an example of the arrangement order inversion method, and FIG. 8 is an exploded plan view of FIG. Next, the method of the second invention of the present application will be described. Since the terminal part of the matrix severely affects the wiring pattern, the pair wire 4
It is necessary to take a staggered pattern for each. FIGS. 9 and 10 are plan views showing matrix terminal arrangements and wiring examples, in which two matrices 3 are arranged side by side. In the figure, 7 is a matrix terminal pair. Here, FIG. 9 is a plan view showing a simple matrix terminal arrangement and wiring example. FIG. 10 is a plan view showing an embodiment of the second invention of the present application, showing a staggered terminal arrangement in consideration of the wiring of a printed wiring board. here,
In the method of FIG. 9, in order to draw the wiring from the left side matrix 3 to the right side of the right side matrix 3, only one inter-terminal pattern passage channel can be taken, and therefore four layers are indispensable for the pair line. On the other hand, in the method of the second invention of the present application shown in FIG. 10, since the terminal pair 7 of the matrix 3 on the right side can be doubled as shown in the figure, the number of pairs of lines is two. That is, by increasing the number of channels through which the terminal pair 7 passes, the multilayer degree does not become a bottleneck in this portion.
【発明の効果】以上詳細に説明した如く、本願第1の発
明によれば、マトリクス間の結線を印刷配線板を介して
コネクタ結合するための印刷配線板配線方法において、
配線をペア線とし、該ペア線を上下隣接2層間のパタン
とし、かつ、前記ペア線の配線群を小群化し、小群単位
のルーティングを行うので、多層度を低くし配線パスを
単純化することが可能となり、印刷配線板を介したコネ
クタ結合の装置を低価格にして実用化するという効果が
ある。さらに、上記構成に加えて、小群内のペア線間に
所要のSN比を確保できるひねりを入れると、小群内の
ペア線間の漏話特性を押さえることができるという効果
がある。さらに、本願第2の発明によれば、マトリクス
間の結線を印刷配線板を介してコネクタ結合するための
マトリクス端子配線方法において、マトリクスの端子配
置を千鳥状にするので、端子部を通過させるチャネル数
がかせげ、2層構造を維持できるという効果がある。As described above in detail, according to the first invention of the present application, in the printed wiring board wiring method for connecting the connections between the matrices through the printed wiring board by the connector,
Since the wiring is a pair wire, the pair wire is a pattern between two upper and lower adjacent layers, and the wiring group of the pair line is subgrouped and the routing is performed in units of subgroups, the multiplicity is lowered and the wiring path is simplified. Therefore, there is an effect that a device for connecting a connector via a printed wiring board can be realized at a low cost. Further, in addition to the above configuration, if a twist capable of ensuring a required SN ratio is provided between the paired wires in the small group, there is an effect that the crosstalk characteristic between the paired wires in the small group can be suppressed. Further, according to the second invention of the present application, in the matrix terminal wiring method for connecting the connections between the matrices by the connector through the printed wiring board, the matrix terminals are arranged in a staggered manner, so that the channels that pass through the terminals are passed. There is an effect that the number can be increased and the two-layer structure can be maintained.
【図1】第1の発明の一実施の形態におけるルートの配
線を示す平面図である。FIG. 1 is a plan view showing wiring of a route according to an embodiment of the first invention.
【図2】図1のA−A′断面図である。FIG. 2 is a sectional view taken along the line AA ′ of FIG.
【図3】図1のB−B′断面図である。FIG. 3 is a sectional view taken along line BB ′ of FIG. 1;
【図4】第1の発明の一実施の形態におけるSN比保証
の配線を示す平面図である。FIG. 4 is a plan view showing wiring for guaranteed SN ratio in the embodiment of the first invention.
【図5】図4のd部のひねり5の詳細を示す要部斜視図
である。FIG. 5 is a perspective view of a main part showing details of a twist 5 of a d part in FIG.
【図6】図4のd部のひねり5の詳細を示す要部平面図
である。FIG. 6 is a plan view of a main portion showing details of a twist 5 of a d portion in FIG.
【図7】第1の発明の一実施の形態における並び順反転
方法の一例を示す平面図である。FIG. 7 is a plan view showing an example of a sequence order inversion method in the embodiment of the first invention.
【図8】図7の分解平面図である。FIG. 8 is an exploded plan view of FIG.
【図9】単純なマトリクス端子配置と配線例を示す平面
図である。FIG. 9 is a plan view showing a simple matrix terminal arrangement and a wiring example.
【図10】第2の発明の一実施の形態における千鳥状の
マトリクス端子配置と配線例を示す平面図である。FIG. 10 is a plan view showing a staggered matrix terminal arrangement and a wiring example according to an embodiment of the second invention.
【図11】コネクタ結合のための印刷配線板の配線の特
徴を示す説明図である。FIG. 11 is an explanatory diagram showing characteristics of wiring of a printed wiring board for connector connection.
1 印刷配線板 2 コネクタ部 3 マトリクス 4 ペア線 5 ひねり 6 スルーホール 7 端子ペア 1 Printed wiring board 2 Connector part 3 Matrix 4 Pair wire 5 Twist 6 Through hole 7 Terminal pair
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小此木 敏夫 東京都千代田区内幸町一丁目1番6号 日 本電信電話株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Kokonoki 1-1-6 Uchisaiwaicho, Chiyoda-ku, Tokyo Nihon Telegraph and Telephone Corporation
Claims (3)
てコネクタ結合するための印刷配線板配線方法におい
て、 配線をペア線とし、該ペア線を上下隣接2層間のパタン
とし、 かつ、前記ペア線の配線群を小群化し、小群単位のルー
ティングを行うことを特徴とするコネクタ結合するため
の印刷配線板配線方法。1. A printed wiring board wiring method for connector-connecting a connection between matrices via a printed wiring board, wherein the wiring is a pair line, and the pair line is a pattern between two adjacent upper and lower layers, and the pair A printed wiring board wiring method for connector coupling, characterized in that a wiring group of lines is divided into small groups and routing is performed in small group units.
できるひねりを入れることを特徴とする請求項1項記載
の印刷配線板配線方法。2. The printed wiring board wiring method according to claim 1, wherein a twist capable of ensuring a required SN ratio is provided between the paired wires in the small group.
てコネクタ結合するためのマトリクス端子配線方法にお
いて、 マトリクスの端子配置を千鳥状にすることを特徴とする
マトリクス端子配線方法。3. A matrix terminal wiring method for connector-connecting connections between matrices through a printed wiring board, wherein the matrix terminal arrangement is staggered.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25359795A JPH0998457A (en) | 1995-09-29 | 1995-09-29 | Printed wiring board wiring method and matrix terminal wiring method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25359795A JPH0998457A (en) | 1995-09-29 | 1995-09-29 | Printed wiring board wiring method and matrix terminal wiring method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0998457A true JPH0998457A (en) | 1997-04-08 |
Family
ID=17253598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25359795A Pending JPH0998457A (en) | 1995-09-29 | 1995-09-29 | Printed wiring board wiring method and matrix terminal wiring method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0998457A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999060558A1 (en) * | 1998-05-20 | 1999-11-25 | Seiko Epson Corporation | Electrooptic device, electronic device, and driver circuit for electrooptic device |
JP4942811B2 (en) * | 2007-02-27 | 2012-05-30 | 京セラ株式会社 | Wiring board, electric signal transmission system and electronic device |
-
1995
- 1995-09-29 JP JP25359795A patent/JPH0998457A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999060558A1 (en) * | 1998-05-20 | 1999-11-25 | Seiko Epson Corporation | Electrooptic device, electronic device, and driver circuit for electrooptic device |
US6577068B2 (en) | 1998-05-20 | 2003-06-10 | Seiko Epson Corporation | Electro-optical element driving circuit, electro-optical device, and electronic device |
JP4942811B2 (en) * | 2007-02-27 | 2012-05-30 | 京セラ株式会社 | Wiring board, electric signal transmission system and electronic device |
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