JPH0997305A - Optical scanner device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the scanning angle of an optical scanner device, which makes an optical scan by turning a reflecting mirror in the one-dimentional direction, without increasing the size of the device. SOLUTION: On both sides of a mirror part 33 where the reflecting mirror is formed, spring parts 35 and 37 are formed directly and formed into a rectangular wave shape, and piezoelectric elements are adhered to mount parts 47 and 46 connecting the spring part 35 and an external frame 31 to form a piezoelectric unimorph for driving, thereby constituting an optical deflecting element for optical scanning. Consequently, the reflecting mirror and a coil for vibration generation need not be supported by the spring parts 35 and 37 unlike a conventional device, and the spring parts 35 and 37 can be made small. Further, since the spring parts 35 and 37 are formed into a rectangular-wave shape, the spring parts 35 and 37 can be shortened in overall length while their substantial lengths are maintained. Therefore, while the scanning angle is secured, the deflecting element, and then the optical scanner device, can be made small-sized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical scanner used in a bar code reader, a laser printer, a laser radar or the like to scan a scanning object with a predetermined light in a one-dimensional direction. Regarding the device.

[0002]

2. Description of the Related Art Conventionally, as an optical scanner device of this kind, as disclosed in, for example, Japanese Patent Laid-Open No. 63-85765, a reflection mirror, a plane coil for generating vibration, and these parts are provided from both sides. An optical deflection element, in which the supporting torsional vibration portion is formed on the same plate made of a crystal plate or the like, is provided. By energizing the plane coil of the optical deflection element, the torsional vibration portion is torsionally vibrated to cause the mirror to move in a predetermined direction. It is known that the laser light is scanned by rotating the laser light in the direction.

[0003]

However, in such a conventional optical scanner device, the pair of torsional vibrating portions forming a so-called double-supported beam supports the reflecting mirror and the plane coil, and the vibration of the torsional vibrating portion causes these to occur. Since the respective parts are configured to rotate together, the stress applied to the torsional vibration part during scanning is large, and it is necessary to increase the width of the torsional vibration part and the like to withstand the stress. If the width of the torsional vibrating portion is increased in this way, the width of vibration and thus the scanning angle cannot be increased. Therefore, in order to rotate the mirror portion at a large scanning angle, it is inevitable. There is a problem that the length of the torsional vibration part must be increased, which leads to an increase in size of the device.

The present invention has been made in view of the above problems, and an optical scanner device in which a reflection mirror is supported by a pair of torsional vibration parts and the reflection mirror is rotated in a predetermined scanning direction by the torsional vibration of the torsional vibration part. In the above, it is an object to increase the scanning angle without increasing the size of the device.

[0005]

To achieve the above object, in an optical scanner device according to a first aspect of the present invention, a mirror portion in which a reflecting surface for reflecting light is formed by a pair of torsional vibration portions is provided. Exciting means for directly supporting from both sides, forming each torsional vibration part in a folded shape that changes into a rectangular wave shape around the rotation axis of the mirror part, and further vibrating the torsional vibration part to rotate the mirror part. Is provided at one of the connecting portions that connects the torsional vibration portion and the outer frame.

Therefore, according to the present invention, it is not necessary to support the vibrating means by the torsional vibration part, and only the stress associated with the rotation of the mirror part is applied to the torsional vibration part. It is not necessary to increase the width of the torsional vibration part so as to withstand the stress caused by the rotation of the vibrating means in addition to the rotation of the mirror part. Therefore, the torsional vibration part is lengthened to obtain a desired scanning angle. No need. Further, in the present invention, since the torsional vibration portion has a folded shape, the entire length of the torsional vibration portion can be shortened while ensuring the substantial length of the torsional vibration portion. Therefore, according to the present invention, it is possible to reduce the area occupied by the torsional vibration part in the optical deflection element,
It is possible to reduce the size of the optical scanner device.

The folded shape of each torsional vibrating portion may be a rectangular wave shape consisting of a straight line portion. In this case, stress is applied to the corner portion (especially the inner corner portion) of the folded portion of each torsional vibration portion. It becomes easier to concentrate. Therefore, as described in claim 2, a sine wave shape with rounded corners of a rectangular wave is used, or, as described in claim 3, the width of a portion orthogonal to the rotation axis of the mirror part is set. On the other hand, if it is formed such that the width of the portion parallel to the rotation axis is large, the stress applied to the corner portion of the torsional vibration portion can be reduced and the strength thereof can be improved, which is more desirable.

Further, since the torsional vibration portion has a folded shape, it is an extremely effective means for reducing the size of the scanner device while ensuring the scanning angle, but when such a folded shape receives an external force. Since it is easily deformed, care must be taken when handling it.

Therefore, as described in claim 4, an inner frame surrounding each torsional vibrating portion and the mirror portion is provided, and the connecting portion of each torsional vibrating portion and the connecting portion is connected by this inner frame. This is more desirable because each torsional vibration part can be protected by the inner frame and can be easily handled.

When the optical deflection element is provided with the inner frame as described above, both ends of the torsional vibration part may be coupled to the mirror part and the inner frame at the position on the rotation axis of the mirror part. However, in this case, both ends of the torsional vibration part must be folded back to the position on the rotation axis of the mirror part and further connected to the mirror part and the inner frame at that position. It can be unnecessarily long.

Therefore, when the torsional vibrating portion becomes unnecessarily long as described above, the both ends of each torsional vibrating portion face the mirror portion and the inner frame, respectively, as described in claim 5. You may make it couple | bond in the position which becomes mutually diagonal among the parts. That is, such a configuration can be an extremely effective means for downsizing the optical scanner device when the optical deflection element is provided with the inner frame.

On the other hand, as the vibrating means provided in the connecting portion, a coil which generates an electromagnetic force by energization like the conventional device can be used, but in this case, the coil must be arranged in a fixed magnetic field. , A permanent magnet for forming a fixed magnetic field must be separately provided. Therefore, as the vibration means,
As described in claim 6, it is desirable that the piezoelectric unimorph or the piezoelectric bimorph be composed of a plate-shaped piezoelectric element adhered to the connecting portion. That is, if the vibrating means is composed of the piezoelectric unimorph or the piezoelectric bimorph in this way, the torsional vibration section can be torsionally vibrated at a desired frequency simply by changing the voltage applied to the vibrating means. It becomes possible to reduce the size further.

When the vibrating means is composed of a piezoelectric unimorph or a piezoelectric bimorph as described above, it is preferable that the vibrating means is constituted by:
As described in 1, the connecting portion, a pair of mounting portions protruding from the inner side of the outer frame toward the rotating shaft, and a connecting portion that connects both ends of the connecting portion and the torsional vibration portion is coupled at a substantially central position. In addition, the pair of mounting portions to which the plate-shaped piezoelectric element is bonded are required to have at least the surface thereof to be conductive so as to be an electrode of the piezoelectric element.
For this purpose, a conductive metal plate may be used for the plate material itself that constitutes the mirror part, the torsional vibration part, the connecting part, or the like, or a non-conductive plate-shaped member is used for the plate material. After the above-mentioned respective portions are formed, the conductive coating may be formed on the entire plate-shaped member or only on the mounting portion.

Further, in order to vibrate the torsional vibrating portion by the piezoelectric unimorph or the piezoelectric bimorph as described above, the end portions of the piezoelectric unimorph or the piezoelectric bimorph on the outer frame side are fixed, and each piezoelectric unimorph or each piezoelectric bimorph is different from each other. It is necessary to apply a drive voltage for displacing in the direction, but in this case, as described in claim 7, the substrate on which the outer frame side end of the piezoelectric unimorph or the piezoelectric bimorph is patterned with wiring for voltage application. And the conductive metal plate.

That is, in this way, the piezoelectric unimorph or the piezoelectric bimorph can be fixed by the substrate and the metal plate, and the voltage applied to the substrate is applied with the metal plate side being grounded to the ground line or the like with the common electrode serving as the common electrode. By applying a drive voltage to each piezoelectric unimorph or each piezoelectric bimorph via the wiring for, each piezoelectric unimorph or each piezoelectric bimorph can be displaced, the fixing means for fixing the vibration means and its drive system, It can be realized with an extremely simple configuration.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. In the following description, FIG. 1 shows the overall configuration of the optical scanner device of the embodiment to which the present invention is applied, in which (a) is its rear view and (b) is its front view. 2A and 2B show the shape of a plate that constitutes the optical deflecting element of the optical scanner device 1 of the present embodiment. FIG. 2A is an overall view thereof, and FIG. 2B is an enlarged view of a spring portion as a torsional vibration portion. .

As shown in FIG. 1, the optical scanner device 1 includes a plate 3 as an optical deflecting element formed of a thin leaf spring material.
, A reflection mirror 5 installed at the center of the surface of the plate 3, and piezoelectric unimorphs 6, 7 composed of plate-shaped piezoelectric elements 6a, 7a, 8a, 9a also arranged at the four corners of the surface of the plate 3. 8 and 9 and each of these piezoelectric unimorphs 6 to
It is composed of a hollow substrate 11 arranged so as to cover the outer end portion of 9 from the surface side of the plate 3, and a conductive metal plate for sandwiching the piezoelectric unimorphs 6 to 9 and the plate 3 between the substrate 11. It is provided with a hollow pressing plate 13.

The plate 3 is formed by punching out a thin plate-shaped (thickness of about 0.05 mm) conductive material made of a conductive metal (beryllium copper, stainless steel for spring, etc.) using etching, electric discharge machining or the like. It is formed as shown in FIG. That is, the plate 3 is an outer frame 31 having substantially the same size as the pressing plate 13 (outer shape: about 20 mm × 20 mm), and a substantially square mirror that is located approximately at the center of the outer frame 31 and has the reflection mirror 5 provided on the surface thereof. The portion 33 and a diagonal portion of the mirror portion 33 extend in the up-down direction and have a folded shape that changes in a rectangular wave shape around a central axis (rotation axis) Z passing through the center of the mirror portion 33 in the left-right width direction. A pair of spring portions 35 and 37 (hatched portions in FIGS. 1 and 2) as torsional vibration portions are respectively coupled to the outer end portions of the spring portions 35 and 37, and the spring portions 35 and 37 and the mirror portion 33 are connected to each other. Inner frame 39
And the mirror portion 3 from the left and right upper and lower end portions of the hollow portion of the outer frame 31.
Piezoelectric unimorph 6 extending toward the rotation axis Z of
Mounting parts 46, 47, 48, 49 for forming 9 and these 4
Of the individual mounting parts 46 to 49, the mounting part 4 facing each other.
6, 47 and 48, 49, and upper and lower end portions of the inner frame 39 are connected to each other by T-shaped connecting portions 41, 43 which connect the mirror portion 33 on the rotation axis Z.

Here, the spring portions 35 and 37 are the mirror portions 3
3 is supported from both sides, and the mirror portion 33 is rotated about the rotation axis Z by its own torsional vibration. Therefore, at the time of vibration, the stress is likely to be concentrated at the inner corner portion (corner) of the folded portion such as C shown in FIG. 2B. Therefore, each corner is slightly rounded (so-called R), but in the present embodiment, in order to further reduce the concentrated stress, the rotation axis Z with respect to the width A of the portion orthogonal to the rotation axis Z is The width B of the parallel portion is increased. This is because, in the spring portions 35 and 37 formed in the rectangular wave shape, the apex portion of the rectangular wave parallel to the rotation axis Z is largely twisted. In this embodiment, the spring portions 35 and 37 are configured as described above. 35,
The strength of 37 is increased.

The spring portions 35 and 37 are connected to the mirror portion 3 by
3 and the inner frame 39 are connected to the opposing surfaces at diagonal positions. This is to enable the mirror portion 33 and the inner frame 39 to be connected without providing the spring portions 35 and 37 with unnecessary folds, and by doing so, the plate 3 becomes larger in the vertical direction. Is being prevented.

Further, in the present embodiment, as the reflection mirror 5 provided in the mirror portion 33, a silicon mirror having a high reflection coating by aluminum vapor deposition is used.
The reflection mirror 5 is adhered to the substrate using an adhesive or the like. Next, the four piezoelectric unimorphs 6 to 9 are attached to the mounting portions 46 to
It is formed by adhering plate-shaped piezoelectric elements 6a to 9a to 49, of which the mounting portion 4 above the plate 3 is formed.
The piezoelectric unimorphs 6, 7 formed on the plates 6, 47 are used as driving piezoelectric unimorphs as a vibrating means for applying a driving force for torsional vibration to the connection portion 41 to cause the spring portion 35 to torsionally vibrate. The piezoelectric unimorphs 8 and 9 formed on the lower mounting portions 48 and 49 are used as sensor unimorphs for detecting the torsional vibration of the spring portion 37 via the connecting portion 43.

That is, in this embodiment, since the plate 3 is made of a spring material made of a conductive metal, if the plate-shaped piezoelectric elements 6a to 9a are adhered to the mounting portions 46 to 49, the plate 3 will be formed. Serves as a common electrode of each of the piezoelectric elements 6a to 9a. Then, as shown in FIG. 3A, the electrodes 2 are provided on the side surfaces of the respective piezoelectric elements 6a to 9a opposite to the mounting portions 46 to 49.
6 to 29 are provided and a voltage is applied between the electrodes 26 to 29 and the plate 3, the piezoelectric unimorphs 6 to 9 are displaced in a predetermined direction as shown in FIG. Two
If the voltage generated between 6 to 29 and the plate 3 is detected, the displacement amount of the piezoelectric unimorphs 6 to 9 can be detected.

Therefore, in this embodiment, each piezoelectric element 6a.about.
Conductive material for electrode formation on both sides of 9a (eg silver paste)
And the polarization directions of the pair of piezoelectric elements 6a, 7a and 8a, 9a forming the driving piezoelectric unimorphs 6 and 7 and the sensor piezoelectric unimorphs 8 and 9, respectively.
As indicated by the arrow in (a), the piezoelectric elements 6a are arranged so as to be orthogonal to the mounting portions 46 to 49 and opposite to each other.
9a to the mounting portions 46 to 49, and further, as shown in FIG.
As shown in FIG. 5, electrode patterns serving as electrodes 26 to 29 for voltage application are provided at positions corresponding to the piezoelectric elements 6a to 9a of the substrate 11, and the substrate 11 and the pressing plate 13 are screwed with screws 13a to 13a.
The outer end of each piezoelectric unimorph 6-9 is held between the substrate 11 and the pressing plate 13 by tightening at d.

Therefore, in the optical scanner device 1 of the present embodiment, as shown in FIG. 1A, the grounding lead wire 25a is connected to the grounding terminal 25 passed through the screw 13d by soldering or the like. The electrodes 26 and 27 formed on the substrate 11 are
The lead wires 26a and 27a for applying the drive voltage are connected by soldering or the like, and through the lead wires 26a and 27a, the electrodes 26 and 27 and the holding plate 13 (that is, the plate 3) serving as a common electrode are connected. If a high voltage for driving is applied between the driving piezoelectric unimorph 6, as shown by the arrow in FIG.
7 by displacing 7 in opposite directions centering on the fixed part,
Torque can be generated around the rotation axis Z of the connecting portion 41. Therefore, when the driving voltage is changed to an alternating current, a vibration torque is generated around the rotation axis Z of the connection portion 41, and the spring portion 35 and thus the reflection mirror 5 can be vibrated about the rotation axis Z. it can.

Further, as shown in FIG. 1A, the lead wires 2 for voltage detection are connected to the electrodes 28, 29 formed on the substrate 11.
8a and 29a are connected by soldering or the like, and the voltage generated between the electrodes 28 and 29 and the holding plate 13 serving as the common electrode is detected through the lead wires 28a and 29a.
The torsional vibration transmitted from the reflection mirror 5 side via the spring portion 37 and the connecting portion 43 can be detected.

Since the substrate 11 holds the entire optical scanner device 1, a hard insulating substrate such as glass epoxy resin is used for this. Further, as is apparent from FIGS. 1 and 2, in the plate 3, the connecting portions 41 and 43 are narrower than the widths of the mounting portions 46 to 49, which means that the connecting portions 41 and 43 are deformed (in other words, This is to make it easier to expand and contract). That is, by doing so, the driving force from the driving piezoelectric unimorphs 6 and 7 can be efficiently transmitted to the spring portion 35, and the vibration of the spring portion 37 can be efficiently transmitted to the sensor piezoelectric unimorphs 8 and 9. I am doing it.

Next, FIG. 4 shows an optical scanner device 1 of this embodiment.
The structure of the drive circuit 50 for actually operating the is shown. The drive circuit is a so-called self-excited oscillation circuit that vibrates the optical scanner device 1 at its resonance frequency. As shown in FIG. 4, the detection signals (voltages) from the sensor piezoelectric unimorphs 8 and 9 taken out by the lead wires 28a and 29a are combined by the common signal line 51 and guided to the drive circuit 50. Then, in the drive circuit 50, the combined detection signal is branched into two systems.

One of the branched detection signals passes through the amplifier 53, the rectifying circuit 55, and the smoothing circuit 57 to be converted into a DC voltage corresponding to the amplitude of the vibration waveform of the optical scanner device 1. . Then, this DC voltage is input to the differential amplifier 59, and is converted in the differential amplifier 59 into a DC voltage corresponding to the difference from the reference voltage output from the reference voltage generation source 61. The other of the branched detection signals passes through the amplifier 63, the phase shifter 65, the low-pass filter 67, and the amplifier 69 to remove harmonic components, and the drive circuit 50 causes the optical scanner device 1 to operate. It is converted into a vibration signal for generating a drive signal that is in phase with the actual vibration.

The vibration signal and the output signal (DC voltage) from the differential amplifier 59 are input to the multiplier 71 and converted into a signal corresponding to the product of these signals.
This signal is also sent to the transformer 7 via the amplifier 73.
5 and the piezoelectric unimorph 6,
7 is boosted to a voltage capable of driving 7 (AC approximately 35 V). The boosted voltage signal (alternating current) is led to the lead wires 26a and 27a of the driving piezoelectric unimorphs 6 and 7 through the signal line 77, and is applied to each piezoelectric unimorph 6 and 7 as a driving signal. To be done.

As a result, the optical scanner device 1 self-oscillates at its own resonance frequency, and its scanning angle is regulated to a constant scanning angle by the reference voltage. Then, if a terminal 79 is connected to the signal line 51 and the detection signals from the sensor piezoelectric unimorphs 8 and 9 are taken out from this terminal 79, the vibration state of the optical scanner device 1 and eventually the scanning of the reflection mirror 5 is performed. The position can be monitored, and for example, when the optical scanner device 1 is used as a bar code reader, it can be used for detection of decoding timing when reading a bar code.

The reason why the drive circuit 50 is the self-excited oscillation circuit is that the optical scanner device 1 is of the resonance type and its resonance frequency changes due to changes in ambient temperature. That is, if the optical scanner device 1 is driven by a drive signal having a preset resonance frequency, the frequency of the drive signal will deviate from the resonance frequency of the optical scanner device 1 due to changes in the surrounding environment, and the optical scanner device 1 In this embodiment, the drive circuit 5 cannot be driven well.
By setting 0 as the self-excited oscillation circuit, the drive signal can be made to follow the change in the resonance frequency of the optical scanner device 1 so that the optical scanner device 1 can always vibrate at the resonance frequency.

As described above, in the optical scanner device 1 of this embodiment, in the plate 3 which constitutes the optical deflecting element, the spring portion 35 as a torsional vibration portion is provided on both sides of the mirror portion 33 which forms the reflection mirror 5. , 37, and
The spring portions 35 and 37 are formed in a rectangular wave shape, and further, the spring portion 3
The vibrating means is configured by forming piezoelectric unimorphs 6 and 7 on the mounting portions 47 and 46 that form a part of the connecting portion that connects the outer frame 31 and the outer frame 31.

Therefore, according to the present embodiment, it is not necessary to support the vibrating means (coil) for generating vibration by the spring portions 35 and 37 as in the conventional device, and the spring portions 35 and 37 are not required.
Can be reduced. Further, particularly in this embodiment, the spring portions 35,
Since 37 is formed in a rectangular wave shape, the spring portions 35, 37
It is possible to shorten the entire length of the spring portions 35 and 37 while ensuring the substantial length of. Therefore, according to this embodiment, it is possible to reduce the size of the plate 3, and thus the optical scanner device 1, while ensuring the scanning angle.

Further, the spring portions 35 and 37 have a width B of a portion parallel to the rotation axis Z with respect to a width A of a portion orthogonal to the rotation axis Z.
Is large, the strength of the spring portions 35, 37 can be increased, and the spring portions 35, 37 are connected to the mirror surface of the mirror portion 33 and the inner frame 39 at diagonal positions. Therefore, the mirror portion 33 and the inner frame 39 can be connected without providing the spring portions 35 and 37 with unnecessary folding back. Therefore, according to the present embodiment, even with such a configuration, the spring portions 35 and 37 can be made small while ensuring the strength and vibration characteristics of the spring portions 35 and 37, and the plate 3 and thus the optical scanner device 1 can be provided. Can be miniaturized.

Further, since the spring portions 35 and 37 are formed in a rectangular wave shape, they are easily deformed when an external force is applied, but in the present embodiment, the entire plate 3 is surrounded by the outer frame 31, and further the spring portion 35 is formed. , 37 and the mirror section 33, the inner frame 39
Since it is surrounded by, it is possible to prevent the plate 3 itself from buckling and the spring portions 35 and 37 from being deformed by an external force when the optical scanner device 1 is assembled. Therefore,
The plate 3 can be easily handled at the time of assembling and the workability can be improved.

Furthermore, in this embodiment, since the piezoelectric unimorphs 6 and 7 formed on the mounting portions 47 and 46 of the plate 3 are used as the vibrating means, the vibration is separately generated like the conventional device using the coil. Since it is not necessary to provide any member, the device configuration can be simplified and the size can be reduced. And
In particular, in this embodiment, not only the driving piezoelectric unimorphs 6 and 7 constituting the vibrating means but also the sensor piezoelectric unimorphs 8 and 9 as the detecting means for detecting the vibration state of the optical scanner device 1 are provided on the plate 3. Since the optical scanner device 1 is provided with the self-excited oscillation circuit as the drive circuit as described above, not only the optical scanner device 1 can be self-oscillated but also the vibration state of the optical scanner device 1 is monitored to scan the same. It is also possible to detect a position, operation abnormality, and the like.

Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment.
Various aspects can be taken. For example, in the above-described embodiment, the spring portions 35 and 37 have a rectangular wave-like folded shape. However, as shown in FIG. 5A, the entire corner portion of the rectangular wave is rounded to form a sine wave shape (in the above-described embodiment, Similar to the above, since there are two folds, it is S-shaped). In this case, the stress applied to each corner at the folded portions of the spring portions 35 and 37 can be further reduced,
The strength of the spring portions 35 and 37 can be further increased.

Further, in the above embodiment, the inner frame 39
Is provided to reinforce the spring portions 35 and 37. However, if there is no particular problem in handling, the inner frame 39 is removed as shown in FIG.
You may make it connect with the connection parts 41 and 43. In this case, in order to rotate the mirror part 33 with the central axis thereof as the rotation axis Z, the connecting position of the spring parts 35 and 37 to the mirror part 33 and the connecting parts 41 and 43 is determined by the central axis of the mirror part 33 ( In other words, it is necessary to set the position on the rotation axis).

On the other hand, in the above embodiment, the substrate 11
By forming electrodes 26 to 29 for applying a driving voltage or detecting voltage to each of the piezoelectric unimorphs 6 to 9 and connecting lead wires 26a to 29a to the electrodes 26 to 29, the respective lead wires 26a to 29a are used. The piezoelectric unimorphs 6 to 9 and the drive circuit 50 are connected to each other, as shown in FIG.
As shown in FIG. 5, wiring patterns 25a'-29a 'corresponding to the lead wires 25a-29a and an electrode pattern 25' corresponding to the ground terminal 25 are formed on the back surface of the substrate 11 on which the electrodes 26-29 are formed. , The electrode patterns 25b to 29b serving as connection terminals to the respective wiring patterns 25a 'to 29a' are concentrated under the substrate 11,
As shown in FIG. 6 (b), the ground terminal 25
By forming the electrode pattern 25 ″ connected to the electrode pattern 25 ′ as a component, the connection between the piezoelectric unimorphs 6 to 9 and the drive circuit 50 is concentrated on the lower side of the substrate 11 via the electrode patterns 25 b to 29 b. You may do it by doing.

That is, when the board 11 is constructed as a printed board in which the lead wires 25a to 29a are formed by the printed wiring, the board 11 and the pressing member are pressed as shown in FIGS. 7 (a) and 7 (b). Electrode patterns 25 ′ and 25 ″ serving as ground terminals 25 by sandwiching the plate 3 with the plate 13.
At multiple points (two points in the figure), including the part where
From the board 11 side through the conductive screws 11a and 11b,
If the substrate 11 and the pressing plate 13 are clamped and fixed, the electrode patterns 26b to 29b concentrated under the substrate 11 can be connected to the surface side of the piezoelectric unimorphs 6 to 9, and the electrode pattern 25b for grounding can be connected. And the holding plate 13 which is a common terminal of the piezoelectric unimorphs 6 to 9 can be connected via the screw 11a, the electrode patterns 25 "and 25 ', and the wiring pattern 25a'.

In this case, for example, as shown in FIG. 7B, a connector 80 having terminals 85 to 89 connected to the electrode patterns 25b to 29b is provided on the lower surface side of the substrate 11, As shown in FIG. 8, if the connector 80 is connected to the connector 90 fixed to the printed circuit board 91 side on which the drive circuit 50 is formed, the connection between the optical scanner device 1 and the drive circuit 50 is lead. This can be easily performed without using wires, and the number of manufacturing steps can be reduced, and the reliability of wiring can be improved.

In this case, the connector 80 is not provided on the substrate 11, but the printed circuit board 91 on which the drive circuit 50 is formed or the connector provided at an arbitrary mounting position of the optical scanner device 1 is connected to the electrode patterns 25b to 25b of the substrate 11. The 29b side may be directly inserted to connect the drive circuit 50 and each of the electrode patterns 25b to 29b via the connector.

Next, in the above embodiment, the plate 3 constituting the light deflection element is formed of a spring material made of a conductive metal. However, as the spring material, a semiconductor material such as silicon may be used. it can. In this way, it becomes possible to form a drive circuit on the plate, and the entire optical scanner device including the drive circuit can be made smaller. Further, in this case, the plate 3 can be mass-produced and the manufacturing cost thereof can be reduced by utilizing the etching. However, in this case, the mounting portions 46 to 49 forming the piezoelectric unimorphs 6 to 9 need to be coated with a conductive metal (for example, silver paste or the like).

Furthermore, in the above embodiment, the description has been made assuming that the reflecting mirror 5 made of silicon is provided in the mirror portion 33 of the plate 3, but the reflecting mirror 5 is as follows.
You may use the thing which mirror-finished glass or resin. Alternatively, the reflection mirror may be formed by subjecting the mirror portion 33 itself to a mirror surface treatment and directly applying a high reflection coating thereto by aluminum vapor deposition or the like.

Further, in the above embodiment, the mounting portions 46 to 4 of the plate 3 are used as the vibrating means and the detecting means for detecting the vibration.
The piezoelectric unimorphs 6 to 9 formed by adhering the piezoelectric elements 6a to 9a on one surface of the plate 9 have been described as being used. However, these means include, for example, the mounting portions 46 to 49.
A piezoelectric bimorph that can be formed by bonding piezoelectric elements to both surfaces of the above may be used. In this case, the polarization direction of each piezoelectric element may be the same as in the above embodiment.

[Brief description of drawings]

1A and 1B are schematic configuration diagrams showing the overall configuration of an optical scanner device of an embodiment, in which FIG. 1A is a rear view thereof and FIG. 1B is a front view thereof.

2A and 2B are explanatory views for explaining the shape of the plate of the optical scanner device of the embodiment, FIG. 2A is an overall view thereof, and FIG. 2B is an enlarged view of a spring portion.

FIG. 3 is an explanatory diagram illustrating a configuration (a) and an operation (b) of the piezoelectric unimorph of the example.

FIG. 4 is a block diagram illustrating a configuration of a drive circuit according to an example.

FIG. 5 is an explanatory diagram illustrating another configuration example of a plate that configures a light deflection element.

6A and 6B show a configuration example of a printed wiring board, in which FIG. 6A is a rear view thereof, and FIG. 6B is a front view thereof.

7 is a schematic configuration diagram showing an overall configuration of an optical scanner device using the substrate of FIG. 6, (a) is a rear view thereof,
(B) is the surface view.

FIG. 8 is an explanatory diagram when the optical scanner device shown in FIG. 7 and a drive circuit are connected via a connector.

[Explanation of symbols]

1 ... Optical scanner device 3 ... Plate (optical deflection element)
5 ... Reflective mirror 6, 7 ... Piezoelectric unimorph (for driving) 8, 9 ... Piezoelectric unimorph (for sensor) 6a-9a ... Piezoelectric element 11 ... Substrate 13 ... Press plate 25 ... Ground terminal 26-29 ... Electrode 31 ... Outer frame 33 ... Mirror section
35, 37 ... Spring part 39 ... Inner frame 41, 43 ... Connection part 46-49 ... Mounting part 50 ... Drive circuit 80 ... Connector

Claims (7)

[Claims] 1. A mirror part having a reflecting surface for reflecting light, a pair of torsional vibration parts supporting the mirror part from both sides, an outer frame surrounding the mirror part and the torsional vibration part, and each of the torsion parts. An optical deflecting element is formed by forming an end portion of the vibrating portion on the side opposite to the mirror portion and the outer frame with a single plate material, and by the torsional vibration of the torsional vibrating portion, An optical scanner device that scans light by rotating the mirror section about a rotation axis that connects a connection point between each torsional vibration section and a coupling section, wherein each torsional vibration section includes: And a vibrating means for vibrating the torsional vibrating portion is provided at one connecting portion connecting the torsional vibrating portion and the outer frame. Optical scanner device. 2. The optical scanner device according to claim 1, wherein each of the torsional vibration portions is formed in a sinusoidal folded shape in which corners of the rectangular wave are rounded. 3. The torsion oscillating portion is formed such that a width of a portion parallel to the rotation axis is larger than a width of a portion orthogonal to the rotation axis. Alternatively, the optical scanner device according to claim 2. 4. The light deflection element further comprises an inner frame which is coupled to a coupling portion between each torsional vibration portion and a coupling portion and surrounds each torsional vibration portion and the mirror portion. The optical scanner device according to claim 1. 5. The both ends of each of the torsional vibration parts are respectively coupled to diagonal positions of the facing part of the mirror part and the inner frame, respectively. Optical scanner device. 6. The connecting portion projects from the inner side of the outer frame toward the rotating shaft, connects a pair of mounting portions for mounting the vibrating means, and connects both ends of the mounting portion and is substantially A connecting portion to which the torsional vibration portion is coupled at a central position, at least the surfaces of the pair of mounting portions are electrically conductive, and the vibrating means is provided on one surface or both surfaces of the pair of mounting portions, respectively. 6. The optical scanner according to claim 1, wherein the optical scanner is composed of a plate-shaped piezoelectric element that is bonded and that constitutes a piezoelectric unimorph or a piezoelectric bimorph that displaces the respective mounting portions in different directions when a voltage is applied. apparatus. 7. The outer frame side end of the piezoelectric unimorph or piezoelectric bimorph is sandwiched between a substrate on which wiring for voltage application is patterned and a conductive metal plate. The optical scanner device described.