JPH0994965A - Manufacture of ink jet recording head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to largely miniaturize an ink pressurizing chamber without lowering ink discharge characteristics and without raising the piezoelectric element driving voltage by reducing the thickness of a bimorph mechanism. SOLUTION: The method for manufacturing an ink jet recording head comprises the steps of electrostatically connecting a channel board 1 made of silicon formed with an ink nozzle 2 and a groove to become an ink channel 11 containing a pressurizing chamber 4 to a borosilicate glass plate, then forming a diaphragm 8 by polishing the glass plate to a predetermined thickness, and forming a conductive layer on the surface as required. The method further comprises the steps of adhering a piezoelectric element plate to the surface of the layer, then polishing the element plate to a predetermined thickness, forming a conductive layer on the surface, and removing an unnecessary part to segment the element plate to the shape corresponding to the chamber 4, cutting to separate it to the individual recording heads.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an ink jet recording head used in an ink jet recording system in which ink is ejected as small droplets from a nozzle for recording.

[0002]

2. Description of the Related Art A method of ejecting ink from minute nozzle holes and attaching the ink onto a recording medium such as paper for recording is known as an ink jet recording method. As one of the methods, there is an on-demand type ink jet recording head (hereinafter abbreviated as recording head). This type of recording head was proposed by Mr. Kaiser of the United States in 1970, and is published in Japan by Japanese Patent Publication No. 53-12138.

The recording head of this system generally has a structure as shown in FIG. 5 which is a plan view thereof and FIG. 6 which is a side sectional view thereof, and is manufactured by a process shown in FIG. Manufactured. That is, the flow path substrate 1 made of a silicon wafer, glass, a metal plate, a plastic material, or the like.
In addition, by a method such as etching, machining or molding, a plurality of ink flow paths 11 including an ink nozzle 2, a nozzle flow path 3, an ink pressurizing chamber 4, an ink supply path 5 and a throttle flow path 6 and these are provided. The ink reservoir 7 and the ink injection port 12 which are connected to the flow path are formed in a groove shape (step A). After finishing the surface of the flow path substrate 1 in the surface finishing step B1,
Laminate the vibrating plate 8 (glass plate in FIG. 7) on which a conductive layer is formed (process B2) by a method such as vapor deposition or sputtering.
Integration (in the case of FIG. 7, shown as electrostatic bonding step C)
After that, it is cut into chips by a dicer or the like (step D), and although not shown, the peripheral portion of the ink nozzle is subjected to a water-repellent treatment. Next, a piezoelectric element 9 which is an electromechanical conversion element is adhered to the opposite surface of the vibration plate 8 at a position corresponding to the ink pressurizing chamber 4 via an adhesive layer 10 (piezoelectric element adhering step E). The structure shown in FIG.

When the vibrating plate 8 is a metal plate, the process
It goes without saying that the step of forming the conductive layer of B2 can be omitted. In a two-layer structure (hereinafter referred to as a bimorph mechanism) configured by bonding the piezoelectric element 9 and the diaphragm 8 to each other, when a pulsed voltage is applied to the piezoelectric element 9, the diaphragm 8 is deformed. When displaced to the ink pressurizing chamber 4 side, the volume thereof is sharply reduced, and the ink corresponding to the reduced volume is pushed out to the nozzle flow path 3 and ejected from the ink nozzles 2 and onto a recording medium (not shown). It is recorded in the form of dots.

The target of such a recording head is as follows. Improving ink ejection performance: Stable ejection of a predetermined amount of ink droplets at high speed and high frequency. This is a basic requirement for recording heads. Reduction of drive voltage: If the drive voltage of the piezoelectric element is high, the power consumption increases and the temperature rises during continuous printing,
To make the ink ejection unstable, it is necessary to lower the drive voltage. Further, a low operating voltage is preferable from the viewpoint of safety measures for an apparatus using the recording head, and the driving circuit becomes simple.

Miniaturization: In the ink jet recording apparatus, since the recording head is used by being moved by the carriage,
It is desirable to be as small and lightweight as possible. Also, the recording device
In general, miniaturization is progressing, and from this aspect as well, miniaturization of the recording head is desired. Multiple nozzles: It is desired to increase the number of nozzles per recording head to improve the overall printing speed.

Cost reduction: A cheaper recording head is desired, and a recording head suitable for mass production with good mass productivity and high yield rate is desirable. FIG. 8 shows a specific example of a recording head according to the related art, which is manufactured with these goals in mind. 8, parts having the same functions as those in FIGS. 5 and 6 are denoted by the same reference numerals.

A silicon wafer is used as the flow path substrate 1, and the ink flow path is formed by photolithography and plasma etching or wet etching. Borosilicate glass is used as the material of the diaphragm 8, and after polishing to a mirror-finished state of a predetermined thickness, it is integrated with the flow path substrate 1 by electrostatic bonding, and has high rigidity, high dimensional accuracy, and stability. Achieves a recording head that achieves high performance.

The electrostatic bonding technique used here is disclosed in Japanese Patent Publication No. 58785/1983 in which a flow path substrate (substrate in the publication) and a diaphragm (cover plate in the publication) of an ink jet recording head are used. It has been announced that it will be applied to joining.
The above-described conventional recording head is provided with 24 ink pressurizing chambers 4 on one side and 48 on both sides, and these are arranged in two rows in a fan shape. This arrangement makes the distance from each ink pressurizing chamber 4 to the ink nozzle 2 as short as possible, and
It was designed to be as equidistant as possible. On each ink pressurizing chamber 4, a piezoelectric element 9 processed to have a size substantially the same as that of the ink pressurizing chamber 4 is adhered. The piezoelectric element 9 has a size of about 1.5 mm × 3 mm and a thickness of 0.15 mm, the flow path substrate 1 has a size of about 30 mm × 45 mm, a thickness of 0.76 mm, and the diaphragm 8 has a thickness of 0.2. mm. The ink ejection performance of this recording head depends on the drive voltage applied to the piezoelectric element.
At V, the ink discharge amount is about 0.25 μcc (this is 200
The amount of ink is suitable for dot / inch recording density),
The discharge speed is about 10 m / sec and the maximum discharge frequency is about 5 kHz.

When this conventional example is compared with the above-mentioned target, the discharge amount and the discharge speed almost meet the target in the improvement of the ink discharge performance, but the discharge frequency is further increased. desired. For this purpose, it is necessary to reduce the size of the ink pressurizing chamber and shorten the flow path to the ink nozzles, and increase the mechanical resonance frequency of the ink drive system. In order to downsize the ink pressurizing chamber without lowering the ejection performance, the diaphragm and the piezoelectric element must be thinned in response to downsizing.
It is necessary to increase the amount of deformation of the bimorph mechanism during driving to secure the volume change amount of the ink pressurizing chamber.

In order to reduce the driving voltage, it is sufficient to enlarge the pressurizing chamber and the piezoelectric element corresponding thereto, and increase the area of the bimorph mechanism portion, but this is contrary to the requirement of the item. In order to increase the amount of deformation per drive voltage without increasing the area of the pressurizing chamber, it is necessary to reduce the thickness of the piezoelectric element, and thus the thickness of the bimorph mechanism, as in the above item.

In order to reduce the size, it is necessary to reduce the width of the ink pressurizing chamber and further shorten the length of the flow path to the ink nozzle, as can be easily understood from FIG. For multiple nozzles as well, it is necessary to reduce the width of the ink pressurizing chamber and increase the number of pressurizing chambers that can be arranged in a unit area, as in the case described above. In order to reduce the cost, we have adopted a silicon wafer.
High mass productivity can be secured by the method of applying the C technology to build the recording head, and by using the bonding of the silicon wafer and the borosilicate glass by electrostatic bonding, the manufacturing accuracy is high, There is little variation, stable performance is obtained, and a high yield rate can be secured. However, in order to significantly reduce the cost, the current shape is too large, so it is indispensable to greatly reduce the size and to increase the number of wafers taken from one wafer. It is necessary to miniaturize the shape centered on.

In order to achieve the above five goals, it is necessary to reduce the size of the pressurizing chamber. To this end, the vibrating plate and the piezoelectric element should be as thin as possible so that the bimorph mechanism is easy to deform. Is required. In the current recording head shown in FIG. 8, of the mechanical kinetic energy generated by the piezoelectric element 9, only a small amount of energy is used for ink movement, and most of it is the vibration plate 8 and the piezoelectric element 9 itself. It is consumed due to the transformation of. Therefore, in manufacturing, if the bimorph mechanism can be thinned, the pressurizing chamber 4 can be downsized, and the above-mentioned target can be realized.

However, in the present manufacturing method, if the thickness of the vibration plate 8 or the piezoelectric element 9 is made thinner than the above-mentioned thickness, handling in manufacturing, for example, a washing process with water pressure or a bonding process with pressing pressure, However, the thickness of the diaphragm 8 and the piezoelectric element 9 that can be adopted during mass production is the limit, and this limit determines the lower limit of the thickness of the bimorph mechanism.

[0015]

By lowering the lower limit of the thickness of the bimorph mechanism as described above, the ink pressurizing chamber can be significantly downsized without lowering the ink ejection performance or increasing the piezoelectric element driving voltage. It is an object of the present invention to provide a method of manufacturing an ink jet recording head that can be used.

[0016]

In order to solve this problem, according to the present invention, a silicon flow path substrate is provided with a communicating groove corresponding to a plurality of ink flow paths.
Electrostatically bond a borosilicate glass plate with a thickness that will not damage it during handling, and polish the electrostatically bonded borosilicate glass plate to a specified thickness to form a vibration plate. A conductive layer is formed on the piezoelectric element, and a piezoelectric element having a thickness that does not cause damage during handling is bonded onto the conductive layer, and the bonded piezoelectric element is polished to a predetermined thickness, and the piezoelectric element is polished. By forming a conductive layer on the surface of the, the piezoelectric element with the conductive layer formed on the surface is subdivided by removing unnecessary parts according to the position of the ink pressurizing chamber, and then cut into individual recording heads. A recording head is manufactured.

In the above steps, the step of forming the conductive layer on the vibration plate can be omitted by utilizing the conductive layer previously formed on the piezoelectric element. Also,
If the thickness of the piezoelectric element before bonding is a predetermined thickness, the step of polishing to a predetermined thickness after bonding and the step of forming a conductive layer on the surface are naturally unnecessary.

Silicon and borosilicate glass have almost the same coefficient of thermal expansion, and even if they are electrostatically bonded to each other, deformation such as warpage hardly occurs. In addition, since electrostatic bonding is a direct chemical bonding, extremely strong bonding can be achieved. Therefore, by electrostatically bonding the borosilicate glass plate to the silicon flow path substrate, and then using the method of polishing this borosilicate glass plate, it is less likely to be damaged as compared with the case of polishing alone, and the conventional It was possible to realize a diaphragm of 0.1 mm or less, which was difficult with technology, at the mass production level. Similarly, in the case of a piezoelectric element, by bonding the piezoelectric element to the integrated flow path substrate and vibration plate, it became possible to polish to a thickness of 0.1 mm or less, which was difficult with the conventional technology. Of. As a result, the pressurizing chamber can be significantly reduced and the driving voltage of the piezoelectric element can be reduced without lowering the ejection performance. It is also possible to adopt a method suitable for mass production, in which a piezoelectric element is attached to a vibrating plate with a large plate, polished to a predetermined thickness, and then subdivided according to each pressurizing chamber. Of.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION As described in the section of the means for solving the problems, the present invention is concerned that the flow path substrate made of silicon in the form of a wafer and the material of the vibration plate may be damaged during handling. A borosilicate glass plate of no thickness is joined and integrated by electrostatic bonding, the borosilicate glass plate is thinned to a predetermined thickness to form a vibration plate, and on the surface of this vibration plate, if necessary. , Forming a conductive layer, adhering to the surface of the vibration plate a piezoelectric element plate having a thickness that does not damage the handle, and thinning the piezoelectric element plate to a predetermined thickness. Forming a conductive layer on the surface, subdividing the piezoelectric element having the conductive layer formed on the surface by removing unnecessary portions in accordance with the position of the ink pressurizing chamber, and the above steps The wafer-like structure created by It is the cross-sectional, in which established.

A more specific description will be given below with reference to examples.

[0021]

[First Embodiment] A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a manufacturing process diagram thereof, and FIG. 4 is a structural diagram of a recording head manufactured in the process. The flow path substrate 1 is made of a 0.76 mm-thick double-sided mirror-polished silicon wafer, and has groove portions for forming the ink nozzles 2, the ink pressurizing chambers 4, and the throttle flow paths 6 on both sides thereof. Then, they are formed on both surfaces by photolithography and plasma etching or wet etching (step A). As shown in FIG. 4, the pattern to be formed has a shape in which the pitch of the ink nozzles 2 is narrowed as much as possible, and moreover, the piezoelectric elements are arranged in a horizontal row so as to facilitate the step of subdividing the piezoelectric elements described later. The size of the ink pressurizing chamber 4 in this case is 0.5 mm × 3 mm. The entire surface of both sides of this flow path substrate 1 was surface-finished in the surface finishing step B1,
Electrostatically bond a 0.2 mm thick borosilicate glass plate (process C1). This thickness of 0.2 mm is a thickness that will not be damaged by handling during electrostatic bonding.

Next, the borosilicate glass plates on both sides of the joined flow path substrate are subjected to a double-sided polishing machine and polished to a predetermined thickness to form the vibration plate 8 (step C2). In this example, the thickness is 30 μm. Then, an ITO film (not shown) is formed on the polished front and back borosilicate glass surfaces by sputtering (step C3, a conductive layer forming step on the glass plate surface in FIG. 1). This serves as a common electrode of the piezoelectric element 9 adhered on this.

Next, on the ITO film, a portion corresponding to 24 pressurizing chambers for forming the piezoelectric element 9 by applying an adhesive to a portion corresponding to the 24 pressurizing chambers. The piezoelectric element plate with a thickness (0.2 mm) that does not have a risk of being damaged during handling during bonding is firmly bonded (step E1). Next, the piezoelectric element plate of the wafer including the integrated flow path substrate is polished to a predetermined thickness by a double-side polishing machine as in the case of the borosilicate glass plate (step E2). In this example,
Its thickness is 30 μm. Next, an electrode is formed by sputtering on the surface of the polished piezoelectric element plate (step E3, a step of forming a conductive layer on the surface of the piezoelectric element plate in FIG. 1). In this example, a three-layer electrode of chromium, nickel and gold was used.

Next, the piezoelectric element plate on which the electrodes are formed is aligned with the position of the pressurizing chamber 4 and subdivided by a dicer as shown in FIG. 4 to form the piezoelectric element 9 (step E4). This is because the electrodes of the piezoelectric element are divided so that they can be driven for each individual pressurizing chamber, and at the same time, there is no problem of mutual interference even with the bimorph mechanism, and the deformation of the bimorph mechanism is facilitated. In this step, the depth of cut of the dicer is made somewhat smaller than the thickness of the piezoelectric element plate. Usually, it is 80 to 99% of the thickness of the piezoelectric element. When the thickness of the remaining portion exceeds 20%, the influence of the deformation of the bimorph mechanism to which a voltage is applied affects the adjacent bimorph mechanism, which becomes a problem. On the contrary, when the thickness of the remaining portion becomes too thin, the ITO film which is the common electrode formed on the surface of the diaphragm 8 and the electrode layer previously formed on the surface of the piezoelectric element plate on the diaphragm side are cut, This is because the drive voltage cannot be applied to the piezoelectric element.

After that, the individual recording head chips are separated by a dicer (step D), and necessary processing is performed to complete the recording head. In this embodiment, the size of the ink pressurizing chamber 4 is 0.5 mm × 3 mm, but the piezoelectric element 9
A sufficient discharge performance was obtained with a driving voltage of 50V. In addition, the frequency characteristics could be improved up to 10KHz. Moreover, the size of the silicon substrate could be reduced to 7 mm × 18 mm.
Comparing the number of 4-inch wafers taken, the number of chips in the prior art was 4 chips, which was 40 chips, an increase of one digit.

In the embodiment, the thickness of the vibration plate and the piezoelectric element is
Although it has been explained in the case of 30 μm, there is a prospect that each can be thinned to 10 μm, so it is thought that it is possible to further reduce the pressure chamber width to about 0.3 mm, and the chip size is about 6 mm × 11 mm, It is thought that it is possible to obtain up to about 64 chips with a 4-inch wafer. Although the above description has been made for the case of the single-sided 24 ink nozzle,
Since the ink nozzle spacing can be reduced to 0.6 mm in the example, and 0.35 mm for the smallest possible one, 128
Ink nozzles, and a print head with 256 ink nozzles on both sides can be fully manufactured.

Incidentally, in order to make the borosilicate glass plate and the piezoelectric element plate thin, a single-sided polishing machine or a grinding machine can be adopted in addition to the double-sided polishing machine. In addition to the sputtering, a technique such as vapor deposition or plating can be used to form the conductive layer on the vibration plate or the piezoelectric element plate after polishing. A forming machine may be used in addition to the dicer in the process of subdividing the piezoelectric element plate and forming the wafer into chips.

Further, in the embodiment, the example in which the ink nozzles are formed on both sides has been described, but it goes without saying that the invention can be applied to one side.

[0029]

[Second Embodiment] A second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a manufacturing process diagram thereof. The difference from the first embodiment is that the conductive layer forming step C3 on the surface of the glass plate in the first embodiment is omitted.

The piezoelectric element plate which is usually obtained has electrodes on both sides thereof. Of the electrodes, the electrode formed on the diaphragm side is not removed by the manufacturing method according to the present invention. Therefore, when this electrode is used as a common electrode, the electrode is previously formed on the surface of the diaphragm 8. It is not necessary to form it, and the manufacturing process in that case is as shown in FIG.

[0031]

[Third Embodiment] A third embodiment of the present invention will be described with reference to FIG. FIG. 3 is a manufacturing process drawing thereof. The difference from the first embodiment is that the step E2 of polishing the piezoelectric element plate and the step E3 of forming a conductive layer on the surface of the piezoelectric element plate in the first example are omitted.

As can be seen from the first embodiment, since the size of the piezoelectric element plate is considerably smaller than the size of the flow path substrate 1, it can be thinned to a predetermined thickness even if it is individually polished. In some cases, it is possible, and if the one having that thickness can be handled in the step E1, the steps E2 and E3 can be omitted.

[0033]

[Fourth Embodiment] The fourth embodiment of the present invention is a combination of the second embodiment and the third embodiment, and includes steps C3, E2 and E3 of the first embodiment. It is omitted.
An explanation that these steps can be omitted will be apparent from the second and third embodiments.

[0034]

As described in the above embodiments, according to the present invention, the thickness of the vibrating plate and the piezoelectric element can be made significantly smaller than that of the prior art. As a result,
The pressurizing chamber can be greatly reduced and the driving voltage of the piezoelectric element can be reduced without lowering the ejection performance. It is also possible to adopt a method suitable for mass production, in which a piezoelectric element is attached to a vibrating plate with a large plate, polished to a predetermined thickness, and then subdivided according to each pressurizing chamber. Of.

As described above, according to the present invention,
It is possible to provide an inexpensive inkjet recording head that is small and lightweight and has excellent mass productivity.

[Brief description of drawings]

FIG. 1 is a manufacturing process chart showing a first embodiment of a method of manufacturing a recording head according to the present invention.

FIG. 2 is a manufacturing process diagram showing a second embodiment of the recording head manufacturing method according to the present invention.

FIG. 3 is a manufacturing process diagram showing a third embodiment of the recording head manufacturing method according to the present invention;

FIG. 4 is a structural diagram showing a structure of a recording head manufactured according to a first embodiment of a method of manufacturing a recording head according to the present invention.

FIG. 5 is a plan view showing a conceptual structure of a flow path substrate used in a recording head according to a conventional technique.

FIG. 6 is a side sectional view showing a conceptual structure of an ink flow path portion of a recording head according to a conventional technique.

FIG. 7 is a manufacturing process diagram showing a method of manufacturing a recording head according to a conventional technique.

FIG. 8 is a plan view showing a structure of a specific example of a recording head manufactured by a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 flow path substrate 2 ink nozzle 3 nozzle flow path 4 ink pressurizing chamber 5 ink supply path 6 throttle flow path 7 ink reservoir 8 vibrating plate 9 piezoelectric element 10 adhesive layer 11 ink flow path 12 ink injection port

Claims (6)

[Claims] 1. An ink pressurizing chamber for pressurizing ink,
An ink supply path for supplying ink to the ink pressurizing chamber and a communicating groove corresponding to a plurality of ink flow paths formed of ink nozzles for ejecting ink pressurized in the ink pressurizing chamber are formed. An ink flow path is formed by the flow path substrate and the vibration plate joined to the flow path substrate, and the ink is formed on the surface of the vibration plate at a position corresponding to the ink pressure chamber on the opposite side of the ink pressure chamber. A method for manufacturing an ink jet recording head in which a piezoelectric element for applying pressure to ink in a pressure chamber is provided, which is made of silicon in which communicating grooves corresponding to the plurality of ink flow paths are formed. The process of electrostatically bonding the borosilicate glass plate to the flow path substrate, the process of polishing the electrostatically bonded borosilicate glass plate to form the vibration plate, and the conductive film on the formed vibration plate. The step of forming the layer and the conductive layer formed The step of adhering the piezoelectric element to the substrate, the step of polishing the adhered piezoelectric element, the step of forming the conductive layer on the surface of the polished piezoelectric element, and the step of ink-forming the piezoelectric element having the conductive layer formed on the surface. The step of removing unnecessary parts according to the position of the pressurizing chamber and subdividing it into pieces, and the member manufactured by the above steps in which the flow path substrate, the vibration plate, and the piezoelectric element are integrated is used as an individual recording head. A method for manufacturing an inkjet recording head, comprising the steps of: 2. An ink pressurizing chamber for pressurizing ink,
An ink supply path for supplying ink to the ink pressurizing chamber and a communicating groove corresponding to a plurality of ink flow paths formed of ink nozzles for ejecting ink pressurized in the ink pressurizing chamber are formed. An ink flow path is formed by the flow path substrate and the vibration plate joined to the flow path substrate, and the ink is formed on the surface of the vibration plate at a position corresponding to the ink pressure chamber on the opposite side of the ink pressure chamber. A method for manufacturing an ink jet recording head in which a piezoelectric element for applying pressure to ink in a pressure chamber is provided, which is made of silicon in which communicating grooves corresponding to the plurality of ink flow paths are formed. The step of electrostatically bonding the borosilicate glass plate to the flow path substrate, the step of polishing the electrostatically bonded borosilicate glass plate to form the vibration plate, and the piezoelectric element on the formed vibration plate. The process of bonding the The step of polishing, the step of forming a conductive layer on the surface of the polished piezoelectric element, and the step of dividing the piezoelectric element with the conductive layer formed on the surface into the ink pressurizing chamber by removing unnecessary parts Inkjet recording, characterized by comprising: a step of forming the recording medium, and a step of separating the member having the flow path substrate, the vibration plate, and the piezoelectric element manufactured by the above steps into individual recording heads. Head manufacturing method. 3. An ink pressurizing chamber for pressurizing ink,
An ink supply path for supplying ink to the ink pressurizing chamber and a communicating groove corresponding to a plurality of ink flow paths formed of ink nozzles for ejecting ink pressurized in the ink pressurizing chamber are formed. An ink flow path is formed by the flow path substrate and the vibration plate joined to the flow path substrate, and the ink is formed on the surface of the vibration plate at a position corresponding to the ink pressure chamber on the opposite side of the ink pressure chamber. A method for manufacturing an ink jet recording head in which a piezoelectric element for applying pressure to ink in a pressure chamber is provided, which is made of silicon in which communicating grooves corresponding to the plurality of ink flow paths are formed. The process of electrostatically bonding the borosilicate glass plate to the flow path substrate, the process of polishing the electrostatically bonded borosilicate glass plate to form the vibration plate, and the conductive film on the formed vibration plate. The step of forming the layer and the conductive layer formed The step of adhering the piezoelectric element to the substrate, the step of adhering the adhered piezoelectric element to the position of the ink pressurizing chamber to remove unnecessary parts, and subdividing it, and the flow path substrate and diaphragm manufactured in the above steps. A method of manufacturing an ink jet recording head, comprising: separating a member in which the piezoelectric element and the piezoelectric element are integrated into individual recording heads. 4. An ink pressurizing chamber for pressurizing ink,
An ink supply path for supplying ink to the ink pressurizing chamber and a communicating groove corresponding to a plurality of ink flow paths formed of ink nozzles for ejecting ink pressurized in the ink pressurizing chamber are formed. An ink flow path is formed by the flow path substrate and the vibration plate joined to the flow path substrate, and the ink is formed on the surface of the vibration plate at a position corresponding to the ink pressure chamber on the opposite side of the ink pressure chamber. A method for manufacturing an ink jet recording head in which a piezoelectric element for applying pressure to ink in a pressure chamber is provided, which is made of silicon in which communicating grooves corresponding to the plurality of ink flow paths are formed. A step of electrostatically bonding a borosilicate glass plate to the flow path substrate, a step of polishing the electrostatically bonded borosilicate glass plate, and a step of adhering a piezoelectric element onto the polished diaphragm. Position the bonded piezoelectric element in the ink pressure chamber And a step of separating unnecessary parts into individual recording heads, and a step of separating the member, which is manufactured by the above steps, in which the flow path substrate, the diaphragm and the piezoelectric element are integrated, into individual recording heads. A method for manufacturing an inkjet recording head, comprising: 5. The method for manufacturing an ink jet recording head according to claim 1, wherein in the step of removing unnecessary parts and subdividing the piezoelectric elements according to the position of the ink pressurizing chamber, the unnecessary parts are removed. A method for manufacturing an ink jet recording head, wherein the depth of the cut made in the piezoelectric element for removing is 80 to 99% of the thickness of the piezoelectric element. 6. The method for manufacturing an ink jet recording head according to claim 1, wherein the piezoelectric element adhered onto the polished diaphragm or the conductive layer formed on the diaphragm is used for recording. A method for manufacturing an ink jet recording head, which is a flat plate-shaped member having a shape and size capable of including a pressure chamber region portion of the head.