JPH0992422A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily install a by-pass capacitor and easily change it to the capacitor of optimal capacity in accordance with a circuit arrangement by internally connecting one of electrodes to a power source terminal and internally connecting the other electrode to a ground terminal. SOLUTION: A pair of electrodes 5a, 5b for installing a surface mounting type capacitor 9 are provided in the central part 4 of a socket main body which makes the lower part of an IC when the IC of an IC socket 1 is inserted. Also, a pair of electrodes 6a, 6b for installing a capacitor 10 which is not of a surface mounting type are provided in the side surface of one-side outer circumferential part in which a pin connector 2 is not provided. One-side electrodes 5a, 6a are connected internally in parallel with the pin contact constituting a power source terminal and the other-side electrodes 5b, 6b are connected internally in parallel with the pin contact constituting a ground terminal. Therefore, since a by-pass capacitor circuit can be constituted only by installing capacitors 9, 10 into a socket 1, the circuit arrangement of a printed circuit board can be simplified.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for mounting various integrated circuits on a printed wiring board, and more particularly to mounting a bypass capacitor and facilitating wiring.

[0002]

2. Description of the Related Art When mounting various integrated circuits (ICs) on a printed wiring board (printed circuit board), it is ideal to install a bypass capacitor for each IC. Therefore, conventionally, a pattern and a land dedicated to the bypass capacitor are provided on the printed circuit board, and the bypass capacitor is soldered and attached to each land. Further, as disclosed in, for example, Japanese Utility Model Laid-Open No. 57-119491, an IC socket in which an electric double layer capacitor is incorporated and integrated inside the IC socket body is also used.

[0003]

When the pattern dedicated to the bypass capacitor is provided on the printed circuit board and the bypass capacitor is soldered and attached as described above, when many ICs are used, the pattern of In addition to the complicated structure, the soldering work was not easy and required a lot of time.
Further, it is necessary to adjust the capacitance of the bypass capacitor according to the frequency of noise generated by the IC, peripheral circuit elements, etc. If the bypass capacitor is fixed by soldering, it is not easy to change it.

Further, as disclosed in Japanese Utility Model Laid-Open No. 57-119491, when the IC socket body and the capacitor are integrated, the capacitance cannot be variably adjusted, and in some cases, the optimum capacitance cannot be obtained. The capacitor could not be used.

The present invention has been made in order to improve such disadvantages, and provides an IC socket in which a bypass capacitor can be easily mounted and a capacitor having an optimum capacity according to a circuit configuration can be easily changed. The purpose is to do.

[0006]

An IC socket according to the present invention has a pair of electrodes for mounting a capacitor in a central portion or an outer peripheral portion of a socket body, and one electrode is internally provided in a power source terminal for connecting to a power source. And the other electrode is internally connected to a ground terminal connected to the ground.

An IC socket according to a second aspect of the present invention has a pair of electrodes for mounting a surface mounting type capacitor at a central portion or an outer peripheral portion of a socket body, and a pair of electrodes for mounting a non surface mounting type capacitor. It has on the outer periphery of the socket body, one electrode of each pair of electrodes is internally connected to the power supply terminal connected to the power supply, and the other electrode is internally connected to the ground terminal connected to the ground. Characterize.

It is desirable that the pair of electrodes for mounting the surface mounting type capacitor and the pair of electrodes for mounting the non-surface mounting type capacitor have attachment / detachment means.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, when the IC is inserted into the IC socket, the central part of the socket body which becomes the lower part of the IC or the outer peripheral part where the pin contacts to which each terminal of the IC is connected are not provided. A pair of electrodes for mounting a capacitor is provided. One electrode of the pair of electrodes is internally connected to a pin contact forming a power supply terminal connected to a power supply, and the other electrode is internally connected to a pin contact forming a ground terminal connected to the ground. A bypass capacitor circuit is constructed by simply mounting capacitors on a pair of electrodes for mounting capacitors while the IC socket is mounted on the printed circuit board, and it is not necessary to provide a pattern for mounting bypass capacitors on the printed circuit board. At the same time, there is no need for wiring when installing a bypass capacitor.

Further, a pair of electrodes for mounting a surface mount type capacitor are provided on the central portion below the inserted IC of the IC socket body or on the outer peripheral portion where no pin contact is provided, and the pin contact of the socket body is provided. A pair of electrodes for mounting a non-surface mount type capacitor is provided on the outer peripheral part, one electrode of each pair of electrodes is internally connected in parallel to the pin contact that constitutes the power supply terminal, and the other electrode is grounded. Internally connected in parallel to the pin contacts that make up the terminals. In this way, the pair of electrodes for mounting the surface-mounting type capacitor and the pair of electrodes for mounting the non-surface-mounting type capacitor are provided, and the capacitors are connected in parallel to adjust the capacitance when the frequency band is adjusted.

Further, attaching / detaching means is provided on the pair of electrodes for mounting each capacitor to facilitate mounting or changing the capacitor.

[0012]

1 is a perspective view showing an embodiment of the present invention. As shown in the figure, the IC socket 1 has a pin contact 2 into which each terminal of the IC is inserted on the upper surface of the outer periphery in the longitudinal direction, and the pin 3 of the pin contact 2 is provided so as to project on the lower surface of the outer periphery in the longitudinal direction. The pin 3 is mounted on a printed circuit board (not shown), and an IC is inserted into the pin contact 2 to form a circuit. In this IC socket 1, a pair of electrodes 5a and 5b for mounting a surface mount type capacitor are provided in a central portion 4 of the socket body which is a lower part of the IC when the IC is inserted, and no pin contact is provided. A pair of electrodes 6a and 6b for mounting a non-surface mounting type capacitor are provided on the side surface of one outer peripheral portion.

The pair of electrodes 5a, 5b for mounting the surface mount type capacitor and the pair of electrodes 6a, 6b for mounting the non-surface mount type capacitor are as shown in the internal connection diagram of FIG.
One electrode 5a, 6a is internally connected in parallel to the pin contact 2a constituting the power supply terminal, and the other electrode 5b, 6a.
b is internally connected in parallel to the pin contact 2b forming the ground terminal. In FIG. 2, 2c-
2i is a pin contact connected to the IC signal pin, 3
c to 3i are signal pins connected to the printed circuit board.

The electrodes 5a and 5b are composed of leaf springs 7 biased in opposite directions, as shown in the side sectional view of FIG. 3, or one of the electrodes 5a, 5b, as shown in the side sectional view of FIG. The electrode 5b is sandwiched between the springs 11 and slidably attached,
The other side of the electrode 5 is biased by the coil spring 8 so that the surface mount type capacitor 9 is held by the elastic force of the leaf spring 7 and the coil spring 8 and the surface mount type capacitor 9 is detachable. ing. The electrodes 6a and 6b are also connected to the electrodes 5a and 5b and the terminals 1 of the non-surface-mount type capacitor 10.
It is constructed so that it can be attached and detached only by inserting 0a and 10b.

After mounting the IC socket 1 configured as described above on a printed circuit board, the surface mount type capacitor 9 is inserted into the electrodes 5a and 5b and mounted, and the terminals 10a and 10b of the non-surface mount type capacitor 10 are connected. Insert and attach the electrodes 6a and 6b. When the surface mount type capacitor 9 and the non-surface mount type capacitor 10 are attached to the IC socket in this way, the electrodes 5a, 5b to which the surface mount type capacitor 9 is attached are attached.
And electrodes 6a, 6 to which the non-surface mount type capacitor 10 is attached
Since each b is connected to the pin contact 2a forming the power supply terminal and the pin contact 2b forming the ground terminal, a bypass capacitor circuit is immediately formed. Therefore, it is not necessary to provide a pattern or the like for mounting the surface mount type capacitors 9 and the non-surface mount type capacitors 10 on the printed circuit board, the structure of the printed circuit board can be simplified, and the surface mount type capacitor 9 can be used.
The non-surface mount type capacitor 10 can be easily attached.

As described above, the IC is inserted into the pin contact 2 and attached with the surface mount type capacitor 9 and the non-surface mount type capacitor 10 attached to the IC socket 1. When it is necessary to adjust the capacitance according to the frequency of noise generated by the IC or peripheral circuit elements, the surface mount type capacitor 9 and the non-surface mount type capacitor 10 attached to the IC socket 1 are changed to capacitors having different capacities. Replace with. When replacing the surface mount type capacitor 9 or the non-surface mount type capacitor 10, the electrodes 5a and 5b and the electrode 6 are replaced.
Since a and 6b are detachable, they can be easily replaced. For example, when the surface mount type capacitor 9 is replaced, the electrode 5b is spread to the side opposite to the electrode 5a,
It is sufficient to take out the capacitors with tweezers and insert capacitors with different capacities.

As described above, the electrodes 5a and 5b for mounting the surface mount type capacitor 9 and the electrodes 6a, 6b for mounting the non-surface mount type capacitor 10 are connected in parallel inside the socket body to function as a bypass capacitor. When adjusting the frequency band, a large-capacity capacitor can be easily connected in parallel in addition to a small-capacity capacitor.

In the above embodiment, the case where both the surface-mounting type capacitor 9 and the non-surface-mounting type capacitor 10 are mounted has been described, but either the surface-mounting type capacitor 9 or the non-surface-mounting type capacitor 10 is mounted. May be.

In the above embodiment, the electrodes 5a and 5b for mounting the surface mount type capacitor 9 are provided in the central portion of the socket body. However, the electrodes 5a and 5b are provided on the outer peripheral portion of the socket body without the pin contact 2. It may be provided in.

[0020]

As described above, according to the present invention, a pair of electrodes for mounting a capacitor are provided in an IC socket, and one electrode of the pair of electrodes is internally connected to a pin contact which constitutes a power supply terminal for connecting to a power supply. However, since the other electrode is internally connected to the pin contact that constitutes the ground terminal that is connected to the ground, a bypass capacitor circuit can be configured by simply mounting a capacitor in the IC socket, and bypassing the printed circuit board. Pattern for mounting capacitors
It is not necessary to provide a circuit, and the circuit configuration of the printed circuit board can be simplified. In addition, since the bypass capacitor circuit can be configured only by mounting the capacitor in the IC socket, the wiring work at the time of mounting the bypass capacitor is not required, and the circuit element mounting time can be shortened.

Further, the IC socket is provided with a pair of electrodes for mounting a surface mounting type capacitor and a pair of electrodes for mounting a non-surface mounting type capacitor, and one electrode of each pair of electrodes constitutes a power supply terminal. By connecting in parallel to the contact internally and connecting the other electrode in parallel to the pin contact that forms the ground terminal, the capacitor can be connected in parallel to easily adjust the capacitance when adjusting the frequency band. can do.

Further, by providing the pair of electrodes for attaching and detaching each capacitor with the attaching / detaching means, it is possible to easily attach or change the capacitors in a short time, and it is possible to adjust all the bypass capacitors to the optimum capacitance. it can.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is an internal connection diagram of the IC socket of the above embodiment.

FIG. 3 is a side sectional view showing a configuration of an electrode for mounting a capacitor.

FIG. 4 is a side sectional view showing the configuration of another electrode for mounting a capacitor.

[Explanation of symbols]

 1 IC Socket 2 Pin Contact 3 Pin 5a, 5b Electrode 6a, 6b Electrode 7 Leaf Spring 8 Coil Spring 9 Surface Mounted Capacitor 10 Non Surface Mounted Capacitor

Claims (4)

[Claims] 1. A pair of electrodes for mounting a capacitor is provided in a central portion or an outer peripheral portion of a socket body, one electrode is internally connected to a power supply terminal for connecting to a power source, and the other electrode is connected to ground. An IC socket characterized by being internally connected to the ground terminal. 2. A pair of electrodes for mounting a surface mount type capacitor is provided on a central portion or an outer peripheral portion of the socket body, and a pair of electrodes for mounting a non-surface mount type capacitor is provided on an outer peripheral portion of the socket body. An IC socket, wherein one electrode of a pair of electrodes is internally connected to a power supply terminal connected to a power supply, and the other electrode is internally connected to a ground terminal connected to ground. 3. The IC socket according to claim 2, wherein the pair of electrodes for mounting the surface mount type capacitor have attachment / detachment means. 4. The IC socket according to claim 2, wherein the pair of electrodes for mounting the non-surface-mounting type capacitor have attachment / detachment means.