JPH0985147A - Viscous body discharging device and viscous resin discharging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a viscous body discharging device capable of precisely discharging a fixed quantity of a viscous body to a fixed position of a body to be worked and capable of working with excellent productivity at high yield. SOLUTION: This viscous body discharging device is provided with a stage 9 having an inclined surface, on which the body 10 to be worked is placed, a viscous body discharging head 11 arranged to face the placing surface of the stage 9, a supporting body 12 supporting the viscous body discharging head 11 by a shaft so as to be capable of pendulum moving, an expansion/contraction body 13, which is in contact with the viscous body discharging head 11 at one end and for controlling the pendulum moving, and driving structures 14 and 15 for moving and controlling the stage 9 and the viscous body discharging head 11 relatively in the X-axis direction and the Z-axis direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a viscous material or viscous resin discharging device, and more particularly to a viscous member or a viscous resin discharging device which is divided into slits and arranged in a row and which has a required viscosity with high accuracy. The present invention relates to a discharge device capable of discharging a body or viscous resin.

[0002]

2. Description of the Related Art For example, a semiconductor device is known in which lead frame pieces are respectively connected and arranged on both main surfaces of a semiconductor chip, and a peripheral portion of the semiconductor chip sandwiched by the lead frame pieces is resin-sealed. . In this type of semiconductor device, the structure of the main part is shown in cross section in FIG.
As shown in plan view in FIG. 5 (b), a semiconductor chip is mounted on a predetermined lead frame, and this lead frame is used as a work piece. With a viscous (melting) resin discharge device, selective discharge sealing is performed.

In FIGS. 5B and 5B, 1 is a semiconductor chip, 2 is a lead frame for sandwiching the semiconductor chip 1, and 3 is another lead frame for similarly sandwiching the semiconductor chip 1. . And each lead frame 2, 3
Is a lead frame piece separated by slits 2a and 3a
The lead frame pieces 2b and 3b are provided as a pair, and the main surface of the semiconductor chip 1 is sandwiched between the lead frame pieces 2b and 3b.

Further, in FIG. 6, reference numeral 4 denotes a stage on which an object 5 to be processed, for example, a lead frame on which the semiconductor chip 1 is mounted is inclined, and 6 is opposed to the mounting surface of the stage 4. It is a viscous resin discharge head arranged. Here, the viscous resin discharge head 6 is composed of a viscous resin discharge nozzle portion (discharge needle) 6a and a syringe portion 6b for pressing and supplying the viscous resin, and is fixed to the support 7. Further, 8 is a drive mechanism for controlling the movement of the support body 7 which fixedly supports the viscous resin discharge head 6 in the X-axis direction and the Z-axis direction. Here, the drive mechanism 8 includes a mechanism 8a that uses a feed screw method that moves back and forth in the X-axis direction, and a guide shaft.
It is formed by a mechanism 8b that also uses a feed screw method or the like that advances and retreats in the Z-axis direction while being guided by 8b ₁ .

The viscous resin discharging device operates as follows. For example, a lead frame 5 as a workpiece on which the semiconductor chip 1 is mounted is first set on the mounting surface of the stage 4. Next, a mechanism 8b that moves back and forth in the Z-axis direction
To move the viscous resin discharge head 6 to the lead frame 5
While the syringe 6b is moved downward and positioned, the syringe 6b is pressed to start discharging and supplying the viscous resin from the discharging nozzle portion 6a to a predetermined position (region) of the lead frame 5. After the ejection of the viscous resin is completed, the mechanism 8b for advancing and retracting in the Z-axis direction is operated again to raise the viscous resin ejection head 6 to the escape position. After that, a mechanism 8a that moves back and forth in the X-axis direction
Is operated to move and position the viscous resin discharge head 6 to a predetermined position (area) next to the surface of the lead frame 5, and the above-mentioned viscous resin discharge operation and the position movement of the viscous resin discharge head 6 are sequentially repeated to read the lead. The viscous resin is selectively discharged and adhered over the entire required position on the surface of the frame 5.

[0006]

However, the viscous resin discharge device has the following problem. That is, even if the viscous resin ejection positions (locations) to the work piece 5 are in a fixed array state, in the case of the viscous resin ejection device, the ejection head 6 is provided at each ejection position.
Since it operates in the Z-axis direction-the X-axis direction-the Z-axis direction, there is a problem that the so-called index is slow and the productivity is poor. Further, following the slowness of the index, while the ejection head 6 moves in the Z-axis direction-X-axis direction-Z-axis direction, it adheres to and remains on the ejection nozzle portion (tip portion). However, there is a problem that the viscous resin is not constantly discharged, and the required viscous resin cannot be discharged reliably or accurately. That is, the conventional viscous resin discharging device has practical problems in productivity and quality of processed products, and an effective solution is desired.

The present invention has been made in consideration of the above circumstances, and provides a viscous material ejecting apparatus capable of precisely ejecting a required amount of viscous material to a predetermined position of a workpiece and performing machining with good productivity and yield. For the purpose of provision.

[0008]

According to a first aspect of the present invention, there is provided a stage in which a work piece mounting surface is inclined, a viscous body discharge head arranged to face the stage mounting surface, and the viscous body. A support body that supports the body discharge head so that it can perform a pendulum motion, an expandable body that has one end in contact with the viscous body discharge head to control the pendulum motion, and the stage and the viscous body discharge head relative to each other in the X-axis direction. It is a viscous body discharge device characterized by having a drive mechanism which controls movement in the Z-axis direction.

According to a second aspect of the present invention, the stage on which the work piece mounting surface is inclined, the viscous body discharge head arranged so as to face the stage mounting surface, and the viscous body discharge head are pendulum type. A support body that is operably supported, an elastic body that has one end contacting the viscous body discharge head and the other end contacting the support body to control the pendulum type operation of the viscous body discharge head, and the support body and the viscous body discharge head. Is a viscous body discharge device, characterized in that the viscous body discharge device has a drive mechanism for controlling movement of the X axis direction and the Z axis direction.

According to a third aspect of the present invention, the stage on which the work piece mounting surface is inclined, the viscous resin discharge head arranged so as to face the stage mounting surface, and the viscous resin discharge head are pendulum type. A support body that is operably supported, and an extendable body that has one end in contact with the viscous resin discharge head and the other end in contact with the support body and controls the pendulum type operation of the viscous resin discharge head,
A viscous resin ejecting apparatus comprising: a drive mechanism that controls movement of the support and the viscous resin ejecting head in the X-axis direction and the Z-axis direction.

That is, the present invention is an apparatus suitable for ejecting a desired viscous material and performing a coating process on an object to be processed having a viscous material ejected portion in a row or line at a predetermined pitch. Is. In other words, the viscous body discharge head is moved in the Z-axis direction-X-axis direction-Z-axis direction once (relative between the workpieces) and is set in a row or at a predetermined pitch on a line. The essential point is to continuously and selectively discharge a desired viscous material to the viscous material discharging part with high accuracy.

In the present invention, in order to continuously and selectively discharge the required viscous body with high precision, the viscous body ejection head having the ejection nozzle portion is supported by the support body so that the viscous body ejection head can be pendulum-shaped. The pendulum type operation of the viscous body discharge head is controlled by an elastic body which is supported by one end of the viscous body discharge head and the other end of which is connected to and fixed to a support or another structural member other than the support. Characterized by composition.
Here, the pivotal support by the support of the viscous body discharge head capable of pendulum operation is, as shown in the cross-sectional view of the main part configuration example in FIG. 1, the discharge nozzle section 11a and the sillidine section for pressing and discharging the contained viscous body. A viscous body discharge head 11 having a frame 11b is provided with a supporting shaft 11d rotatably mounted on a supporting body 12 on a frame 11c. In addition, control of the pendulum type operation of the viscous body ejection head, in other words, a stretchable body that functions to reduce or prevent stepwise fluctuations / displacements of the ejection nozzle due to the presence of slits and the like to maintain smooth movement is Although it is a spring, it may be a synthetic resin or rubber having elasticity. In the present invention, the stage on which the workpiece is placed and the viscous body discharge head are
It suffices that the movement control in the axial direction and the Z-axis direction is relative, and the stage or the viscous body discharge head is controlled to move in the X-axis direction and the Z-axis direction. In other words, the positional relationship of the ejection head with respect to the surface of the workpiece should be such that at least one of them is driven if the required Z-axis direction-X-axis direction-Z-axis direction is secured in one index. It will be good. And these X-axis directions,
Examples of the Z-axis direction k driving means include an air cylinder method, an oil cylinder method, and a feed screw method.

The viscous body discharged by the viscous body discharge device is
Examples include encapsulating resin, display paint, and adhesive. And, generally, it is preferable to have a viscosity of about 1 to 50 poises at room temperature, but for example, several tens of degrees Celsius
In the case where the discharge is performed in a state where the degree and the temperature are increased, the target is also a viscous substance that performs the required discharge at the discharge temperature.

In the present invention, the viscous body discharge head, which is arranged to face the surface of the workpiece placed on the inclined stage surface, is controlled to move relatively in the X-axis direction and the Z-axis direction. , The viscous body is intermittently discharged on a certain line.
Moreover, the viscous body discharge head is rotatably supported by the support body so as to be capable of pendulum movement (oscillation), and the pendulum movement is controlled by the elasticity of the telescopic body. Therefore, the viscous body discharge head can be smoothly moved / moved in the X-axis direction and the Z-axis direction, and even if a step such as a slit exists on the surface on which the tip of the discharge nozzle slides, the step can be changed. Easily absorb and mitigate fluctuations based on
It is possible to accurately perform the required ejection to each of the ejection target portions that are arranged on a line or in a row through slits having a constant pitch. That is, it is possible to provide a viscous body ejecting apparatus which has a significantly improved and improved index, a high ejection (coating) accuracy, and a stable function.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 2, 3 (a) to 3 (c) and FIG. FIG. 2 is a perspective view showing the configuration of the main part of one embodiment. Reference numeral 9 is a surface on which a frame 10 having a body to be processed, for example, semiconductor chips arranged in a row and sandwiched between frame pieces having a constant pitch is placed. Is an inclined stage, and by rotating the stage 9, the inclination direction and the inclination angle of the inclined surface can be appropriately selected and set. 11 is the stage 9
The viscous body discharge head is arranged so as to face the surface on which the workpiece 10 is placed. Here, the workpiece 10 is the same as that shown in FIG.
It has the same configuration as the case illustrated in (a) and (b),
Further, the viscous body discharge head 11 has a discharge nozzle portion (for example, an injection needle) 11a and a sillidine portion 11b for pressing and discharging the contained viscous body, and has a pendulum shape as shown in FIG. Is rotatably supported by the support body 12. Further, 13 is one end of the viscous discharge head 11,
The other end is in contact with the support 12 and is a spring spring for controlling the pendulum type operation of the viscous body discharge head 11. Furthermore, 14 is a drive mechanism (for example, a sliding system using a speed control motor as a drive source) that controls movement of the support 12 that supports the viscous body discharge head 11 in the X-axis direction, and 15 is the viscous body discharge head 11 This is a drive mechanism (for example, a cylinder) that controls the movement of the support 12 that has been moved in the Z-axis direction.

The drive mechanisms 14 and 15 will be described in detail below.
The operation of the speed control motor 14a causes the first sliding body 14b to move back and forth in the X-axis direction.
The second sliding body 15b, which operates by using the cylinder 15a as a drive source, moves forward and backward in the Z-axis direction. In other words, the speed control motor 14a and the cylinder 15a are used as drive sources to move forward or backward simultaneously or separately in the X-axis direction and the Z-axis direction.

Next, with reference to FIGS. 3 (a), 3 (b), 3 (c) and FIG. 4, an example of operation and use of the viscous body discharge device will be described.

First, as the object 10 to be processed, there was prepared a frame 10 in which semiconductor chips were mounted in a row at a constant pitch, as shown in FIG. In FIG. 3A, 10a is a semiconductor chip and 10b is the semiconductor chip.
One lead frame 10a holds the semiconductor chip 10a and the other lead frame 10c holds the semiconductor chip 10a. And each lead frame 10b, 10c has a slit 1
Lead frame pieces 10b ', 10c' separated by 0d
And the lead frame pieces 10b 'and 10c' are paired to sandwich the main surface of the semiconductor chip 10a.

Next, as shown in a sectional view in FIG. 3 (b), the workpiece 10 was set on a preset inclined surface of the stage 9. Then, the cylinder 15a is operated to lower the ejection nozzle portion 11a of the viscous body ejection head 11 (arrow),
As shown in the enlarged sectional view of FIG.
The semiconductor chip 10a on one end side of 10 is clamped and positioned. In addition, at this stage,
A required pressure is applied in advance to the liquid resin (viscous body) contained in 1b, and the discharge of the liquid resin from the discharge nozzle portion 11a is started.

When the discharge of the liquid resin is started, the speed control motor 14a is operated to move the viscous material discharge head 11 discharging the liquid resin in the X-axis direction. That is, as shown by the arrow in FIG. 3A, the viscous material ejection head 11 is moved in the Z-axis direction-X-axis direction-Z-axis direction, and with respect to the ejection position on the line (semiconductor chip sandwiching portion), The liquid resin is continuously discharged. In the discharge of the liquid resin, the moving speed of the viscous material discharge head 11 in the X-axis direction is appropriately set according to the viscosity of the liquid resin, the discharge amount at one location, the pitch of the discharge positions, and the like.

FIG. 4 schematically shows the continuous liquid resin discharge mode. When the viscous material discharge head 11 moves in the X-axis direction while continuously discharging the liquid resin, The viscous body discharge head 11 itself is swingable, and the elastic body 13
By the buffering action of the above, even when passing through the slits between the frame pieces 10b 'or between the frame pieces 10c', they move smoothly (without being subjected to a stepwise impact). And
The discharged liquid resin 16 easily permeates and adheres to the peripheral portion of the semiconductor chip 10a sandwiched between the frame pieces 10b 'and 10c' by the so-called capillary phenomenon. That is,
The liquid resin 16 is easily separated between the frame pieces 10b 'and 10c' due to the capillary phenomenon and penetrates into the peripheral portion of the semiconductor chip 10a which is sandwiched and arranged accurately, reliably and with good appearance. Put on. In the case of this embodiment, since the ejected portions arranged on the line of the workpiece are symmetrical in two rows, the stage 9 is reversed at the point when the ejection on one row side is completed, By changing the direction of the workpiece 10,
The required liquid resin discharge can be continued.

In the above, the case where the frame on which the semiconductor chip is mounted is used as an object to be processed has been illustrated, but the present invention is not limited to this example, and various modifications can be made without departing from the spirit of the invention. Can be taken. For example, in the above, the viscous body discharge head side is set in the X-axis direction and Z direction.
Although it is an axially movable type, the stage side is in the X-axis direction and Z
It may be an axially movable type or a combination of both.

[0023]

According to the viscous body discharging device of the present invention,
The viscous body discharge head, which is arranged so as to face the workpiece surface placed on the inclined stage surface, is controlled to move relatively in the X-axis direction and the Z-axis direction, and is highly accurate on a certain line. The viscous body can be continuously discharged. That is, the viscous body discharge head can perform a pendulum-type operation (swing), and the pendulum-type operation or swing is controlled by the elasticity of the expandable / contractible body to easily ensure smooth movement. More specifically, even if the stage or the viscous material discharge head is smoothly moved / moved in the X-axis direction, and there is a step due to a slit or the like on the surface on which the tip of the discharge nozzle slides, Since the variation due to the step is easily absorbed and alleviated, the required viscous body can be accurately ejected onto a predetermined region located on a certain line. Therefore,
Since the index can be greatly improved, a viscous body discharge device suitable for mass production is provided from the above-mentioned highly accurate discharge (coating) and stability.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration example of a main part of a viscous body discharging device according to the present invention.

FIG. 2 is a perspective view showing a configuration example of a main part of a viscous body discharge device according to the present invention.

3A and 3B are explanatory views of an operation example of the viscous body discharge device according to the present invention, in which FIG. 3A is a perspective plan view showing a main part configuration of a workpiece, and FIG. A side sectional view showing a state where a body is placed, (c) is a side sectional view showing a state where the viscous body discharge head is moved down in the Z-axis direction.

FIG. 4 is an explanatory diagram of an operation example of the viscous body discharge device according to the present invention, and is a schematic diagram of a permeation / movement state of the discharged viscous body.

5A and 5B show an example of a main part configuration of a frame in which a semiconductor cup is sandwiched between lines, (a) is a sectional view, and (b) is a plan view.

FIG. 6 is a perspective view showing a configuration of a main part of a conventional viscous material discharge device.

[Explanation of symbols]

 1, 10a ... Semiconductor chip 2, 10b ... One lead frame 3, 10c ... Other lead frame 2a, 3a, 10d ... Slits 2b, 3b, 10b ', 10c' ... Lead frame piece 4, 9 …… Stage 5, 10 …… Workpiece 6,11 …… Viscous material discharge head 6a, 11a …… Discharge nozzle part 6b, 11b …… Syringe part 11c …… Frame 11d …… Spindle (viscous body discharge head (For rocking) 7,12 ...... Support 8a, 14 ...... Drive mechanism that moves back and forth in the X-axis direction 8b, 15 ...... Drive mechanism that moves back and forth in the Z-axis direction 13 ...... Telescopic body

Claims (3)

[Claims] 1. A stage in which a work piece mounting surface is inclined, a viscous body discharge head arranged so as to face the stage mounting surface, and the viscous body discharge head that is pivotally supported so as to be capable of pendulum type operation. A support body, an elastic body having one end in contact with the viscous body discharge head to control a pendulum type operation, and a drive mechanism for relatively controlling movement of the stage and the viscous body discharge head in the X-axis direction and the Z-axis direction. A viscous-body discharging device having. 2. A stage in which a work piece mounting surface is inclined, a viscous body discharge head arranged so as to face the stage mounting surface, and the viscous body discharge head which is pivotally supported so as to be capable of pendulum type operation. And one end of the viscous body discharge head,
It has an extendable body for controlling the pendulum type operation of the viscous body discharge head, the other end of which is in contact with the support body, and a drive mechanism for controlling the movement of the support body and the viscous body discharge head in the X-axis direction and the Z-axis direction. Characteristic viscous body discharge device. 3. A stage on which a work piece mounting surface is inclined, a viscous resin discharge head arranged to face the stage mounting surface, and the viscous resin discharge head that is pivotally supported so as to perform a pendulum type operation. A support body, one end of the viscous resin discharge head and the other end of the support body, respectively, for controlling the pendulum movement of the viscous resin discharge head; and the support body and the viscous resin discharge head in the X-axis direction. A viscous resin discharge device, comprising: a drive mechanism for controlling movement in the Z-axis direction.