JPH0976681A - Card type electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain card type electronic equipment which is thin typed and low costed, and has high reliability against impact from an outside. SOLUTION: Card type electronic equipment has features on a fixed structure of a rock crystal vibrator. A substrate is so arranged as to be put between cases 11 composed of a metallic member or the like. A hole provided for arranging the rock crystal vibrator 13 is provided at a specific position of the substrate. The rock crystal vibrator, especially a cylinder part of the rock crystal vibrator is arranged and mounted so as to be dropped into the hole. Then, filler 14 such as silicone or the like is applied so as to cover the rock crystal vibrator 13 arranged in the hole and a part of the substrate 12. At that time, the reliability may be also raised by piling the filler so as to cover the whole of the cylinder. Further, material 15 performing a role of a cushion such as a pressure sensitive adhesive double coated tape or the like are arranged between the rock crystal vibrator 13 and the case 11. As the materials performing the role of the cushion, a silicone made board, a rubber made board, etc., can be considered excepting the pressure sensitive adhesive double coated tape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card type electronic device in which a cylinder type crystal unit is internally mounted,
For example, it is suitable for a card-type electronic device including an oscillation circuit such as an IC card, an IC memory card, an I / O card, and an electronic notebook.

[0002]

2. Description of the Related Art An IC memory card will be described below as an example of a card type electronic device. FIG. 2 shows a structure of a conventional IC memory card, particularly including a crystal oscillator and its periphery. In FIG. 2, reference numeral 21 is a case that is an exterior of the IC memory card, 22 is a printed wiring board (hereinafter referred to as a substrate) on which circuit blocks are formed, and 23 is a crystal oscillator. Reference numeral 24 is a filling material for fixing the crystal unit 23. As shown in FIG. 2, the case 21 is arranged on both sides of the substrate 22 so as to protect the substrate 22. The lead terminals of the crystal unit 23 are formed so that they can be connected to the substrate 22, and the cylinder portion of the crystal unit 23 is mounted on the substrate 2.
Placed and fixed so as to be parallel to 2. In the crystal unit 23, the crystal unit 23 is fixed by filling a filler so as to cover a part of the cylinder, in particular, the tip of the cylinder on the side opposite to the lead terminal and a part of the substrate. The reason for adopting such a structure is that when a crystal unit is included in the IC memory card as a component, a cylinder-type crystal unit is not susceptible to external shocks, for example, when the IC memory card is dropped. When the crystal unit vibrates, it becomes easier to contact the case.On the other hand, when the crystal unit is not fixed to the board, the vibration from the board directly transmits an external impact to the crystal unit and destroys it. This is to avoid such a situation as

[0003]

However, the conventional I
In the fixed structure of the crystal unit in the C memory card,
It had the following problems. When a cylinder type crystal oscillator is used, the cylinder diameter (size) of the crystal oscillator differs depending on the frequency used, and the higher the frequency, the larger the cylinder diameter. In the fixing structure shown in FIG. 2, the crystal unit is arranged and fixed on the substrate. Therefore, if a crystal unit having a frequency higher than a certain frequency is to be mounted, it cannot be stored with the current card thickness. As a result, there is a problem that the IC memory card has to be made thicker and a certain standard thickness cannot be maintained. Further, when a high-frequency crystal unit has to be used, there is no choice but to use an expensive crystal unit of a package type instead of a cylinder type, which raises a problem of high cost.

Therefore, the present invention has a high reliability against shock, is versatile without being influenced by the size of the crystal unit, and has a mounting structure capable of maintaining the conventional thickness. Intended to provide equipment.

[0005]

In order to solve the above-mentioned problems, a card type electronic device according to claim 1 of the present invention has a printed wiring board having a space at a desired position and a cylinder arranged in the space. A crystal resonator in which the substrate and the lead terminal are connected and the cylinder is located at the center of the card in the thickness direction, a case provided at a position facing the substrate, and a case disposed in the space And a filling material applied so as to cover a part of the substrate. In this way, since there is a space for arranging a part of the crystal unit at a desired position on the substrate, and the cylinder is arranged so as to be located in the center of the thickness direction of the card in the space, It has versatility without being affected by the size of the crystal unit, can maintain the same thickness as before, and since the filler is applied to the crystal unit, high reliability against shock can be obtained.

Further, in the card type electronic device according to claim 2, the lead terminal of the crystal unit is provided on the surface of the filling material opposite to the surface of the substrate to which the lead terminal is connected. It is characterized in that it is applied to the tip end surface of the cylinder which is the opposite side to the open side. With such a configuration, the directions of pressing the substrate from both the lead terminal side and the cylinder side are opposite to each other on the lead terminal side and the cylinder side. This means that they can be fixed securely.

Further, in the card-type electronic device according to claim 3, the filling material is applied so as to cover the entire front end surface of the cylinder located on the opposite side of the lead terminal of the crystal unit, and the substrate. It is characterized in that it is applied so as to further cover both surfaces of. By adopting such a configuration, the crystal unit can be more firmly fixed and protected, and a card type electronic device with higher reliability can be provided.

According to a fourth aspect of the card type electronic device, the filling material is applied so as to cover the entire cylinder of the crystal unit.

Since the filler covers the entire cylinder, the cylinder can be protected and securely fixed.

Further, in the card type electronic device according to the fifth aspect, it is preferable that a silicone resin is used as the filling material.

According to a sixth aspect of the card type electronic device, an elastic material is arranged between the crystal unit and the case. With such a configuration, the elastic material between the case and the crystal resonator plays a role of absorbing an external shock, and the shock can be prevented from being directly transmitted to the crystal resonator. This makes it possible to prevent the crystal unit from being destroyed.

According to a seventh aspect of the present invention, in the card type electronic device, the elastic material is joined to the case.

Further, in the card-type electronic device according to the present invention, the elastic material has an area larger than a cross-sectional area of the crystal unit. By adopting such a configuration, at least the cylinder portion of the crystal unit can be protected more reliably, and a card-type electronic device with increased reliability can be provided.

Further, in the card-type electronic device according to claim 9, the elastic substance is an adhesive layer, a non-adhesive layer, an adhesive layer,
It is composed of a long member composed of three layers, and the elastic material and the cylinder are joined together. By adopting such a configuration, the crystal unit is fixed to the case via the elastic material by the long member including the three layers of the adhesive layer, the non-adhesive layer and the adhesive layer, which is easy to assemble. It is possible to prevent the crystal oscillator from being destroyed.

According to a tenth aspect of the present invention, in the card-type electronic device, the elastic material has a structure in which it is in close contact with the cylinder. By narrowing the moving area of the cylinder, it becomes a structure that can sufficiently cope with external load such as impact.

According to the eleventh aspect of the card-type electronic device, an elastic material is wound around the cylinder portion of the crystal unit. By adopting such a configuration, it is possible to easily provide the elastic substance when arranging it, and it is possible to minimize the number of parts.

Further, in the card type electronic device according to claim 12, the elastic substance is in close contact with the case and the crystal oscillator only on one side, and the case, the elastic substance, the crystal oscillator,
It is characterized in that the filling material is filled so as to cover the crystal unit and a part of the substrate from the side where they are not in close contact with each other.
By adopting such a configuration, the reliability against external impact is ensured regardless of which side of the crystal resonator and the elastic material, the case is in close contact with the case, and which side is filled with the filler. Since it does not change, it is possible to select the side that is easier to work in the process.

Further, in the card type electronic device according to claim 13, a hole for disposing a crystal oscillator is provided in the substrate, and the cylinder part of the crystal oscillator is disposed so as to be dropped into the hole. A cushioning material is arranged in the immediate vicinity of the hole. With such a configuration, a space is maintained by the pair of cases, the crystal unit is placed in the space, and the crystal unit is fixed to the substrate by the filler, so it is not affected by external impact. It is possible to prevent the crystal unit itself from vibrating and prevent it from coming into contact with the case.

[0019]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described below with reference to the drawings. In this example, an IC memory card is used as a card-type electronic device in which a cylinder-type crystal unit is internally mounted. In addition, IC card and I
It is suitable for use in a card-type electronic device such as a / O card, an electronic notebook, or the like, which has a cylinder-type crystal oscillator, that is, an oscillation circuit, and which requires a certain degree of thickness accuracy.

In FIG. 3, reference numeral 31 denotes an outer case, which protects the inner part. Specifically, it is provided so as to cover the positions facing the board mounting surface so as to protect the mounting surface of the board 32 forming the circuit block. The case 11 used for the IC memory card is generally made of a metal member, and two cases are used. 3
Reference numeral 3 is a crystal oscillator mounted on the substrate 32, and 34 is a filling material 34 for fixing the crystal oscillator. As shown in FIG. 3, a hole serving as a space is provided in the substrate 32, and the crystal oscillator, here, a cylinder portion is arranged so as to be dropped into the hole. It should be noted that the space portion into which the crystal oscillator is dropped may be provided with not only holes but also cutouts. The formed lead terminals of the crystal unit are connected to the substrate by a joining means such as soldering. A filler such as a silicone resin is laid and fixed so as to cover the tip portion of the cylinder corresponding to the position opposite to the position where the lead terminal is provided. Further, the filler is applied so as to further cover a part of the substrate in order to fix the crystal unit to the substrate. Although FIG. 3 shows a state in which a part of the front end portion of the cylinder is covered, it may be provided so as to cover the entire front end portion of the cylinder as necessary. Further, as a position of disposing the crystal unit, it is preferable that the center portion of the crystal unit is disposed at the center of the thickness of the card from the viewpoint of suppressing the thickness of the card.

When the crystal oscillator fixing and mounting method shown in FIG. 3 is used, the crystal oscillator is mounted so as to be dropped into a hole (or a cutout) provided in the substrate, so that an IC memory card of a certain specific thickness is obtained. In the above, it becomes possible to mount a crystal resonator having a cylinder diameter larger than the thickness corresponding to the thickness of the substrate in the card, and it is possible to solve the problem of increasing the size of the card.

Although not shown, if a filler is applied from the surface of the substrate opposite to the surface to which the lead terminals are connected, the direction of pressing the substrate from the lead side and the direction of pressing the substrate from the cylinder side are opposite. Therefore, it is possible to securely fix the substrate in any of the upper and lower directions.

FIG. 1 shows another embodiment of the present invention. FIG.
In particular, the fixed structure of the crystal unit is shown. 11 is a case,
Reference numeral 12 is a substrate, 13 is a crystal oscillator, and 14 is a filler such as silicon resin, and the structure thereof is the same as that described in FIG. This example is different from the above examples in that an elastic material 15 is arranged between the crystal unit 13 and the case 11. Particularly, in this example, it is provided so as to be in contact with the case 11. The elastic material has an area larger than at least the cross-sectional area of the cylinder so that at least the cylinder of the crystal unit is protected. Further, when the elastic material is provided with the adhesive layer, it becomes extremely easy to install. This elastic substance plays a role of a cushion for the crystal unit. In the embodiment, a long member having a two-layer structure of an adhesive layer and a non-adhesive layer is used as a cushion,
As will be described later, a long member having three layers of an adhesive layer, a non-adhesive layer and an adhesive layer may be used. In this case, not only the cushion but also the case and the crystal unit can be fixed. As the elastic substance, in addition to the flexible tape-shaped member, a plate-shaped member having a certain thickness and a material made of silicon or rubber can be considered.

An application example of the embodiment of the present invention will be described below with reference to the drawings.

First, the characteristic part of FIG. 5 is a view in which the filler for filling the quartz oscillator and a part of the substrate is filled not only from one side of the substrate but also from both sides. is there. Reference numeral 51 is a case, 52 is a substrate, and 53 is a crystal oscillator. 54 is a filler and 55 is an elastic substance, which are the same as those described in the above example.

The characteristic portion of FIG. 6 is a diagram in which the case, the crystal unit, and the elastic material arranged between them are in close contact with each other. In this case, the respective elements may simply be in contact with each other, or may be adhered by using a long member composed of three layers of the adhesive layer, the non-adhesive layer and the adhesive layer described in FIG. Good. If the structure in which the positional relationship between the substrate and the pair of cases provided at the position opposite to the substrate (almost parallel to each other) does not change significantly inside the electronic device, crystal vibration will occur. The child is mounted side by side with the board and the case in the horizontal direction, and the crystal unit is fixed by being sandwiched by an elastic material arranged between the case and the crystal unit. 61 is a case, 62
Is a substrate, 63 is a crystal oscillator, and 65 is an elastic substance.

FIGS. 7 (a) and 7 (b) are views showing a structure in which the case, the crystal unit, and the elastic material arranged between them are in close contact with each other only on one side. Both figures are characterized in that the crystal oscillator, the case, and the elastic material are filled with a filler so as to cover a part of the crystal oscillator and the substrate from the side where they are not in intimate contact with each other. 71 is a case, 7
Reference numeral 2 is a substrate, and 73 is a crystal oscillator. 74 is a filler, 7
5 is an elastic substance.

FIG. 8 is a diagram showing a method of arranging the elastic substance arranged between the crystal unit and the case. In this example, the crystal unit is not arranged in the hole but is arranged in a cut provided at the end of the substrate. The crystal unit is arranged by winding one elastic material around the cylinder part of the crystal unit. In the above-described embodiments, since the elastic material provided between the crystal unit and the case is arranged on the crystal unit and the upper case side and the lower case side respectively, two plates of the elastic material are provided. It is necessary, and also the step of arranging the elastic substance is required twice, that is, the step of arranging on the upper case side and the step of arranging on the lower case side. It is configured. Reference numeral 81 is a case, 82 is a substrate, and 83 is a crystal oscillator. 84 is a filler and 85 is an elastic substance.

FIG. 9 shows an application example of still another embodiment in which the crystal oscillator described above is fixed to the substrate, and measures are taken to prevent an external impact from being directly transmitted to the crystal oscillator. is there. In particular, this is an example of a structure in which a shock is not transmitted to the crystal unit. The substrate is provided with a hole (or a cutout) for arranging the crystal oscillator, and the cylinder portion of the crystal oscillator is dropped and arranged in the hole. A case is provided at a position facing the substrate, and a cushioning material (spacer) is provided at a position near the hole in the substrate where the crystal oscillator is disposed so as not to impair the positional relationship between the case and the substrate. If there is no problem in the arrangement of the substrate, it is preferable to provide this spacer in an integral shape so as to surround the crystal unit, but it goes without saying that the same effect can be obtained by disperse it at appropriate places. Absent. Adhesive members are formed on both surfaces of the spacer to fix the case and the substrate. A filler is filled so as to cover the crystal unit and a part of the substrate. 91 is a case,
Reference numeral 92 is a substrate, and 93 is a crystal oscillator. 94 is a filler,
Reference numeral 95 is a spacer.

Further, as shown in FIG. 4 (a) and FIG. 4 (b), the reliability can be effectively enhanced by arranging the filler so as to cover the entire cylinder of the crystal unit. . In the examples, silicone resin was used as the filler.

In this embodiment, the cylinder diameter is 3.1 m.
Although the crystal oscillator of m is used, if the diameter is larger than that, the IC memory card itself becomes thick and it becomes impossible to realize a thin IC memory card. If a small crystal oscillator is used, the crystal oscillator shown in the embodiment is shown. On the other hand, the price becomes high and it becomes impossible to realize a low-priced IC card. From the above, by adopting the configuration of this embodiment, a thin type and a low price are realized.

[0032]

As described above, according to the present invention, FIG.
By disposing an elastic material between the crystal unit and the case as described above, it is possible to provide a card-type electronic device that is thinner than the structure of the conventional crystal unit as shown in FIG. Further, according to the fixing structure of the present invention, it is possible to obtain higher reliability than before with respect to external impact. Further, since it becomes possible to use a large-sized and low-priced crystal unit, the cost of the card type electronic device itself can be reduced, and a thinner card type electronic device can be realized.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of another fixing structure for a crystal unit according to the present invention.

FIG. 2 is a diagram showing a conventional fixing structure for a crystal unit.

FIG. 3 is a diagram showing a structure for fixing a crystal unit according to the present invention.

FIG. 4 (a) is a top view showing an area in which a filling material is filled when the whole crystal unit of the present invention is fixed with the filling material. (B) It is the figure seen from the side which showed the area which fills up with the filler in the case of fixing the whole crystal oscillator of the present invention with the filler.

FIG. 5 is a diagram showing an embodiment in which the crystal resonator of the present invention and a part of the substrate are covered with a filler from both sides.

FIG. 6 is a diagram showing a structure in which the case of the present invention, an elastic material, and a crystal unit are in close contact with each other.

FIG. 7 (a): The case of the present invention, the elastic material, and the crystal unit are in close contact with each other only on one side.
It is the figure which showed the structure which filled the filler from the side where the crystal oscillator did not contact closely. (B) shows a structure in which the case of the present invention, the elastic material, and the crystal unit are in close contact with each other only on one side, and the filler is filled from the side where the case, the elastic material, and the crystal unit are not in close contact with each other. It is a figure.

FIG. 8 is a diagram showing a method of arranging an elastic substance arranged between the case and the crystal resonator of the present invention.

FIG. 9 is a diagram showing a structure in which a spacer is arranged in the immediate vicinity of a substrate on which a crystal resonator of the present invention is arranged.

[Explanation of symbols]

 11 Case 12 Substrate 13 Crystal Resonator 14 Filler 15 Elastic Material 21 Case 22 Substrate 23 Crystal Resonator 24 Filler 31 Case 32 Substrate 33 Crystal Resonator 34 Filler 41 Case 42 Substrate 43 Crystal Resonator 44 Filler 51 Case 52 Substrate 53 Crystal oscillator 54 Filler 55 Elastic substance 61 Case 62 Substrate 63 Crystal oscillator 65 Elastic substance 71 Case 72 Substrate 73 Crystal oscillator 74 Filler 75 Elastic substance 81 Case 82 Substrate 83 Crystal oscillator 84 Filler 85 Elastic substance 91 Case 92 Substrate 93 Crystal Unit 94 Filling Material 95 Spacer

Claims (13)

[Claims] 1. A crystal vibration in which a printed wiring board having a space at a desired position, a cylinder arranged in the space, the substrate and a lead terminal are connected to each other, and the cylinder is positioned at a center of a card in a thickness direction. A case, a case provided at a position opposed to the substrate, and a filling material applied so as to cover a part of the substrate and the crystal resonator arranged in the space. Characteristic card type electronic equipment. 2. A front end surface of a cylinder, which is the surface of the substrate opposite to a surface of the substrate to which the lead terminals are connected, and opposite to a side of the crystal oscillator on which the lead terminals are provided. The card-type electronic device according to claim 1, wherein the card-type electronic device is applied to the card-type electronic device. 3. The filling material is applied so as to cover the entire front end surface of the cylinder located on the opposite side of the crystal resonator from the lead terminal, and is further applied so as to further cover both surfaces of the substrate. The card-type electronic device according to claim 1, wherein: 4. The card type electronic device according to claim 1, wherein the filling material is applied so as to cover the entire cylinder of the crystal unit. 5. The card type electronic device according to claim 1, wherein the filling material is made of silicone resin. 6. The card-type electronic device according to claim 1, wherein an elastic material is arranged between the crystal unit and the case. 7. The card type electronic device according to claim 6, wherein the elastic material is bonded to the case. 8. The elastic material has an area larger than a cross-sectional area of the crystal unit.
Alternatively, the card-type electronic device according to claim 7. 9. The elastic material comprises a long member composed of three layers of an adhesive layer, a non-adhesive layer, and an adhesive layer, and the elastic material and the cylinder are joined together. The card type electronic device according to claim 7. 10. The structure according to claim 7, wherein the elastic material is further in close contact with the cylinder.
A card-type electronic device according to claim 9. 11. The card type electronic device according to claim 1, wherein an elastic material is wound around a cylinder portion of the crystal unit. 12. The elastic material is in contact with the case and the crystal resonator only on one side, and covers the crystal resonator and a part of the substrate from the side where the case, the elastic material and the crystal resonator are not in contact with each other. The card type electronic device according to claim 6, wherein the card type electronic device is filled with a filling material. 13. A substrate is provided with a hole for arranging a crystal oscillator, the cylinder part of the crystal oscillator is arranged to be dropped into the hole, and a cushioning material is arranged in the vicinity of the hole. The card-type electronic device according to claim 6, further comprising: