JPH0973027A - Assembling device and assembling method for optical element module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify the structure of an assembling device for an optical element module for executing mounting of the packages of optical elements, coupling of the optical elements and optical fibers, etc., to eliminate the need for assembly markers of parts and to improve the throughput of the module assembly. SOLUTION: This assembling device includes a parts placing table 9 on which plural members including the optical fibers, packages and substrates constituting the optical element module are placed, a positioning table 10 for adjusting the positions of these members, an assembling table 11 on which the plural members are placed and assembled, a fiber insertion stage 12 for inserting and placing the optical fibers from a predetermined direction onto the substrates on the assembling table 11 and collets 2, 3, 4, 13 for attracting and transporting the plural members among the parts placing table 9, the positioning table 10, the assembling table 11 and the fiber insertion stage 12 to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical element module assembling apparatus and method, and more particularly, to an optical element module mounting method for mounting an optical element package and coupling an optical element and an optical fiber. The present invention relates to an assembling apparatus and an assembling method.

[0002]

2. Description of the Related Art With the expansion and speeding up of information networks, the need for an optical subscriber fiber communication network that connects information stations and all households with optical fibers is increasing. In order to realize this, optical calculation processing is indispensable, and for that purpose, it is required to realize an optical semiconductor module as an optical calculation processing device, and to reduce the cost, downsize, and improve reliability.

Therefore, when coupling the optical semiconductor element and the optical fiber, it is necessary to fix them on a substrate and integrate them to form a module. Further, in order to further promote mass production and cost reduction of these, automatic assembly of modules is indispensable. When aligning and fixing each component such as a package, an optical semiconductor element, and an optical fiber that constitute a module to a desired position, for example, T. Kato, e
t al., IEEE Proc. 42nd Electronic Components and T
As described in echnology Conference pp.853-860, 1990, positioning and fixing are performed using an image recognition processing device.

[0004]

However, when the image recognition processing device is incorporated in the optical module assembling apparatus, the optical module assembling apparatus becomes complicated and large in size. Further, it is necessary to provide a positioning marker for image recognition on the component, which complicates the component manufacturing process.

Further, according to the image recognition processing, it takes time to position the parts, and the throughput of module assembly is lowered. By the way, at the time of assembling an optical module, a fiber support tool as shown in FIGS. 18 and 19 is used as a jig for conveying an optical fiber. A first fiber support tool 101 shown in FIG. 18 is for suspending an optical fiber F, and has a V groove for fiber positioning on the lower surface of its main body.
102, and a plurality of small holes 103 are formed in the V-shaped groove 102, and these small holes 103 are formed in the decompression chamber 10 in the support.
It extends to 4.

A second fiber support 111 shown in FIG.
Is a structure for mounting the optical fiber F, and a V-groove 112 for fiber positioning is formed on the upper surface of the main body, and a plurality of small holes 113 are formed in the V-groove 112. Small hole 113 extends to a decompression chamber 114 in the support. These fiber supports 101, 111 have a V-groove 10
The optical fiber F on 2, 112 is adsorbed by the suction force from the small holes 103, 113. After the decompression chambers 104, 114 are processed, the V-grooves 102, 112 are processed, and the small holes 103, 113 are processed. Although manufactured, the V-grooves 102 and 112 have fine small holes 103,
It is difficult to form 113, and the improvement of yield is an issue.

SUMMARY OF THE INVENTION An object of the present invention is to provide an automatic assembling apparatus and an assembling method for an optical element module, which simplifies the structure, does not require an assembly marker for parts, and can improve the throughput of module assembly.

[0008]

Means for Solving the Problems The above-mentioned problems are shown in FIG.
As illustrated in FIG. 10, a component mounting base 9 on which a plurality of members including an optical fiber 20, a package 21, and a substrate 24 that form an optical element module are mounted, and a positioning base 10 for adjusting the positions of the members. An assembly table 11 for mounting and assembling the plurality of members, and an optical fiber 20 for inserting and mounting the optical fiber 20 on the substrate 24 on the assembly table 11 from a predetermined direction. A fiber insertion stage 12, the component mounting table 9, the positioning table 10,
A collet 2 for sucking and transporting the plurality of members between the assembly table 11 and the fiber insertion stage 12
The problem is solved by an assembling apparatus for an optical element module, which has 3, 4, and 13.

Further, as illustrated in FIGS. 2 and 5, the collet 4 has a plurality of types for selecting the type of the member, which is solved by an assembling apparatus of the optical element module. Further, as illustrated in FIGS. 3 and 4, the collet 4 used for adsorbing the optical fiber 20 has first and second components, and is provided at an edge portion of the first component. Is a slope 4 which constitutes one surface of the V groove
f is formed and has a decompression chamber 4c inside, and the second
Is formed with an inclined surface 4g forming the other surface of the V groove, and has an air introduction groove 4h connected to the inclined surface 4g and connected to the decompression chamber 4c on the side. The optical element module assembling apparatus described above solves the problem.

Further, as illustrated in FIGS. 6 and 7, the fiber insertion stage 12 is provided with a collet 13 for adsorbing an optical fiber having first and second parts, and
13e has an inclined surface 13e forming one surface of the V groove at the edge thereof.
Is formed and has an air introducing groove 13c connected to the slope 13e on the side, and a slope 13h forming the other surface of the V groove is formed on the inside of the edge of the second component and is formed inside. Is provided with a decompression chamber 13g facing the air introduction groove, which is solved by the apparatus for assembling the optical element module.

Further, the optical device module assembling apparatus is characterized in that a reference surface for adjusting the position of the package 21 is formed on the assembling table 11. Further, as illustrated in FIG. 12A, the package 21 conveyed to the assembly table 11 has a hole 21c for inserting the optical fiber 20 therein. The device solves it.

Further, as illustrated in FIG. 12B, the substrate 24 conveyed to the assembly table 11 has a groove 24b for inserting an optical fiber, and the groove 24b on the optical fiber inserting side is provided. This is solved by the assembling apparatus for the optical element module, wherein the width of the end portion is widened. in this case,
As illustrated in FIG. 14, a solution of the optical element module assembling apparatus is characterized in that a fiber stopper for positioning an optical fiber is formed at an end of the groove 23b near the center of the substrate 21. To do.

Using the above-described optical element module assembling apparatus, the substrate on which the optical element is mounted is sucked by the collet and conveyed from the component mounting table to the positioning table, and the substrate is mounted on the positioning table. Positioned at a specific position above, the substrate is placed on the assembly stage by the collet, the optical fiber is conveyed and placed on the fiber insertion stage by the collet, and the optical fiber is moved by moving the fiber insertion stage. Is inserted into the substrate to optically couple with the optical element, which is solved by an assembling method of an optical element module.

(Operation) According to the optical element module assembling apparatus of the present invention, in addition to the assembly table for assembling the parts,
A component positioning table for adjusting the position of the component and a fiber insertion stage for inserting the optical fiber in a predetermined direction are provided. As a result, the substrate whose position has been adjusted accurately in advance on the assembly table is conveyed to the assembly table by the collet while maintaining the state as it is, and moreover, on the assembly table in a predetermined direction by the fiber insertion stage. Since the optical fiber is introduced onto the substrate, the optical fiber and the optical element on the substrate are optically coupled accurately without using a microscope or an assembly marker for the parts, and the time required for positioning is short, so that the assembly throughput is high. Is improved. Further, the structure of the assembling device is simple, the mass productivity of the device is improved, and the cost is reduced.

Further, the collet used for attracting the optical fiber is composed of the first and second parts, and the edge part of the first part is formed with an inclined surface forming one surface of the V groove and side. While an air introduction groove connected to the slope is provided in the portion, a slope forming the other surface of the V groove is formed at the edge of the second component, and a decompression chamber facing the air introduction groove is provided inside. ing.

In such a collet, the V groove is formed by chamfering the first and second parts, and
Of the air introduction groove formed by grinding on the side surfaces of the first and second components, the portion exposed from the V groove is used as a suction hole. This collet has higher work efficiency in the manufacturing process, higher yield, and easier maintenance and inspection than the conventional structure in which the suction holes are drilled.

When an optical element and an optical fiber are optically coupled on a substrate, if a groove for inserting the optical fiber is provided in the substrate and the width of the tip portion is widened, even if there is a slight deviation in the insertion of the optical fiber, The insertion position of the optical fiber is corrected by the groove, and the optical fiber is surely inserted toward the optical element. Further, by providing a fiber stopper on the substrate, the distance between the optical fiber and the optical element can be set to a desired size.

By providing a fiber hole for inserting the optical fiber in the package for accommodating the substrate, the optical fiber is supported by the fiber hole before the optical fiber reaches the substrate. It is accurately inserted on the board.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. 1 (a) to 1 (c) are a plan view, a front view and a side view showing an outline of an optical element module automatic assembling apparatus according to an embodiment of the present invention. 1 in FIG.
Is the first to third suction collets 2, 3, which can move up and down.
4 is a collet support portion that supports 4, and has a structure that moves on a rail portion 5 that extends in the X-axis direction. The collet support portion 1 is configured to perform an operation described later according to a signal from the control portion 6.

Both ends of the rail portion 5 supporting the first to third suction collets 2, 3 and 4 are supported above the vibration-proof table 8 by columns 7. Below the orbits along which the first to third suction collets 2, 3, 4 move, a component mounting table 9 movable along the Y-axis direction (direction orthogonal to the X-axis direction).
A component positioning table 10 for component position adjustment and an assembly table 11 with a built-in heater are attached in order along the X-axis direction. The upper portions of the component mounting table 9, the component positioning table 10, and the assembly table 11 are arranged in such a range that the respective tips of the first to third suction collets 2, 3 and 4 can be reached by their vertical movement. There is.

A fiber mounting stage 1 is mounted on the assembly table 11.
2 are adjacent to each other, and a fourth suction collet 13 is mounted on the upper part of the fiber mounting stage 12 so as to be movable along the Y-axis direction. The vertical movement of the first to fourth suction collets 2, 3, 4, 13 and the movement of the component mounting table 9 are controlled by the control unit 6 in terms of timing, direction, and movement amount. Further, the first to fourth suction collets 2, 3, 4, 13 and the component positioning base 10 are connected to the decompression device 14 and are in a state of being able to suction the components. It is controlled by the control unit 6.

The first to third suction collets 2,
The elements 3, 4 are configured so as not to rotate on the surfaces of the X axis and the Y axis. Next, the first to fourth suction collets 2,
3, 4, and 13 will be described. Although not particularly shown, the first and second suction collets 2 and 3 attached to the collet support portion 1 have a general suction structure in which the suction port at the bottom portion is widened, and the first suction collet 2 is larger than the second suction collet.

The third suction collet 4 is shown in FIG.
It has a front, side and bottom structure as shown in (c), and the first structure as shown in FIGS. 3 (a) to (c) and FIGS. 4 (a) to (c).
And second parts 4a and 4b. The substantially cubic first part 4a is, as shown in FIGS. 3 (a) to (c),
A deep recess (decompression chamber) 4c formed by a drill to the bottom is formed in the center thereof, and a notch 4d is formed in the lower back surface so that a part of the recess 4c is exposed. On the bottom surface of the remaining first component 4a, which is below the recess 4c, one slope 4f of the V groove 4e is formed.
Are formed.

As shown in FIGS. 4 (a) to 4 (c), the second component 4b has a shape that closes the notch 4d of the first component 4a. The other slope g of the V-groove 4e is formed on the edge of the bottom surface on the side aligned with 4a,
In addition, a concave air introduction groove 4h is formed in a portion of the first component 4a facing the concave portion 4c up to a region reaching the slope 4g.

The first part 4a and the second part 4 as described above
The fixed third suction collet 4 which is fixed by screwing b on both sides of the recess 4c has a V groove 4e at the bottom thereof as shown in FIGS. 2 (a) to 2 (c), and The V groove 4e has an air introducing groove 4h connected to the recess 4c. The pressure reducing device 14 is connected to the concave portion 4c of the third suction collet 4, and the optical fiber F that has entered the V groove 4e is sucked and hung by the suction force of the air introduction groove 4h. Reference numeral 4i indicates a screw hole, and 4j indicates a screw.

The fourth suction collet 13 is shown in FIGS.
It has a front, side and bottom structure as shown in (c), and the first structure as shown in FIGS. 6 (a) to (c) and FIGS. 7 (a) to (c).
And second parts 13a and 13b. As shown in FIGS. 6 (a) to 6 (c), the first component 13a is provided with a concave air introduction groove 13c in the width direction on the front surface thereof.
Further, the V groove 1 is provided on one edge including the air introduction groove 13c.
A first sloped surface 13e that is 3d is formed. In addition,
Reference numeral 13f indicates a screw hole.

The second component 13b is closely fitted to the first component 13a as shown in FIGS. 7 (a) to 7 (c), and is located in an area of the first component 13a facing the air introduction groove 13c. A gas pipe connection hole (decompression chamber) 13g is formed so as to penetrate therethrough,
Further, a second slope 13h forming a V groove 13d is formed at an edge portion of the first component 13a adjacent to the first slope 13d.

As shown in FIG. 5, the fourth suction collet 13 constructed by screwing the first component 13a and the second component 13b in the vicinity of the gas pipe connecting hole 13g is constructed as shown in FIG. It has a V groove 13d on the upper surface, and also has an air introduction groove 1
The tip of 3c is exposed from the V groove 13d. The gas pipe connection hole 13g of the fourth suction collet 13 is connected to the decompression device 14 through the gas pipe, and the optical fiber F placed in the V groove 13d has a suction force in the air introduction groove 13c. Adsorbed and supported by. Reference numeral 13i indicates a screw and 13j indicates a screw hole.

According to the third suction collet 4 and the fourth suction collet 13 as described above, the V grooves 4e and 13d are formed by chamfering the first and second parts,
Moreover, in order to use the portions of the air introduction grooves 4h, 13c formed by grinding on the side surfaces of the first and second parts as exposed from the V grooves 4e, 13d as suction holes, the conventional suction holes are drilled. Compared with the structure, the work efficiency of collet production is improved, and the yield is improved,
The maintenance and inspection becomes easy.

The suction force is adjusted by adjusting the air introduction groove 4h,
This is performed by changing the width of 13c or changing the number. Next, the structure of the component positioning table 10 will be described. The component positioning base 10 has two orthogonal component positioning reference surfaces 10a and 10b on its side portions, and a suction hole 10c for preventing components from falling is formed on the upper surface. Two parts reference surfaces 10a and 10b for positioning parts such as a package and an optical device mounting board are provided.
It is configured so that the positions of the parts are aligned with a predetermined position by simultaneously abutting against each other. Note that reference numeral 10
Reference numerals d and 10e respectively indicate passages for moving the two component pressing jigs.

When the element mounting board 24, which will be described later, is positioned on the component positioning base 10, as shown in FIG. 9, the element mounting board 24 is placed on the suction hole 10c, and two component positionings are performed. The device mounting board 24 is positioned at a predetermined position by simultaneously pressing the device mounting board 24 against the reference surfaces 10a and 10b. Such two orthogonal reference planes for positioning are also formed on the assembly table 11.

Next, a process of optically coupling the laser diode and the optical fiber by using the above-mentioned automatic assembly device for the optical element module will be described. First, work to align the parts before operation. That is, as shown in FIG. 10, a fiber tray 30 containing a plurality of optical fibers 20 and a package tray 31 containing a plurality of packages 21.
A first solder tray 32 containing a plurality of first solder sheets 22, a second solder tray 33 containing a plurality of second solder sheets 23, and a plurality of laser diodes mounted thereon. A substrate tray 34 containing a silicon element mounting substrate 24 and a lid tray 35 containing a plurality of silicon lids 25 are placed at predetermined positions on the component mounting table 9.

As shown in FIG. 12 (a), the package 21 has a recess 21a for accommodating a substrate formed in the center, and a lead terminal 21b on one of a pair of opposing reference surfaces. Are pierced and attached, and a fiber through hole 21c is formed in the other reference surface. When the package 21 is placed on the component mounting table 9, the fiber through hole 21c is placed so as to face the fiber mounting stage 12 side and the optical axis of the fiber through hole 21c is substantially in the Y-axis direction.

As shown in FIG. 12 (b), the element mounting board 24 has an element mounting area and an optical fiber mounting area separated by a groove, and the first area is provided in the center of the element mounting area.
The laser diode LD is attached via the electrode 24a. In addition, a fiber mounting groove 24b extending in the light traveling direction of the laser diode LD is formed in the optical fiber mounting region, and the fiber mounting groove 24b is formed in a fan shape that becomes wider as the distance from the laser diode LD increases. There is. Further, in the element mounting board 24, the lateral groove 24c that divides the element mounting region and the optical fiber mounting region is formed deeper than the fiber mounting groove 24b. Further, the metal second electrode 24d extends from the periphery of the laser diode LD to the fiber attachment region.
Is formed, and the second electrode 24d and the laser diode LD are connected by wire bonding.

After the above work is completed, a series of operations for optically coupling the laser diode LD and the optical fiber 20 in the package 21 are performed by a signal from the controller 6. The flowchart is shown in FIG.
First, based on a heating signal from the controller 6, the upper surface of the assembly table 11 is heated to about 200 ° C. by an internal heater (not shown), and this state is maintained. The heating temperature is detected by a thermocouple on the assembly table 11.

Then, a package movement signal is output from the control unit 6 to the drive mechanism of the component mounting table 9, the component mounting table 9 is moved in the Y-axis direction, and the package tray 31 orbits the first suction collet 2. Located below. At the same time, the collet support 1 is moved to the X position based on the package movement command signal.
After moving in the axial direction to position the first suction collet 2 above the package tray 31, the first suction collet 2 is lowered to suck one package 21 and lift it, and then The collet support 1 is moved in the X-axis direction and stopped on the assembly table 11, and the first suction collet 2 is lowered to mount the package 21 on the assembly table 11. Then, the suction of the suction collet 2 is released and the package 21 is opened on the assembly table 11.

Then, the positioning pin on the side of the assembly table 11 is pushed out on the basis of the package positioning signal from the control section 6, whereby two adjacent reference planes (not shown) facing the X-axis direction and the Y-axis direction. ) Is pressed against the package 21 to adjust the position of the package 21. Package 21
Is left on the assembly table 11 until the optical coupling between the optical fiber 20 and the laser diode LD is completed.

Next, the collet support portion 1 is moved to the component mounting table 9 by the first solder position return signal from the control portion.
And when the second suction collet 3 moves to the solder supply position of the component mounting table 9, the collet support portion 1 is stopped. At the same time, the component mounting table 9 is moved in the Y-axis direction to position the first solder sheet 22 under the track of the second suction collet 3.

Subsequently, based on the first solder sheet movement signal from the control section 6, the second suction collet 3 is lowered to suck one first solder sheet 22 and lift it. Then, the collet support portion 1 is moved in the X-axis direction to move the second suction collet 3 to the package 21 on the assembly table 11.
The movement of the collet support portion 1 is stopped when the collet support portion 1 is positioned above, and then the second suction collet 3 is lowered to move the first solder sheet 22 onto the package 21 as shown in FIG. 12 (a). The first solder sheet 22 is placed on the concave portion 21a, the suction is released in this state, and the first solder sheet 22 is released from the second suction collet 3.

Next, based on the board position return signal from the control section 6, the collet support section 1 is so arranged that the second suction collet 3 is stopped at the board supply position of the component mounting table 9.
Is moved in the X-axis direction, and at the same time, the component mounting table 9 is moved in the Y-axis direction so that the element mounting substrate 24 is located under the trajectory of the second suction collet 3. Then, the control unit 6
After the second suction collet 3 is positioned above the substrate tray 34 based on the substrate transport signal from, the second suction collet 3 is lowered to suck one element mounting substrate 24. This is lifted, the collet support 1 is further moved in the X-axis direction and stopped on the component positioning base 10, and the second suction collet 3 is lowered to move the component positioning base as shown in FIG. 12 (b). The device mounting board 24 is opened by releasing the adsorption in this state.

After that, as shown in FIG. 9, in response to a position adjustment signal from the control section 6, the element mounting board 24 is set on the component positioning base 10 using the pins 15 and 16 to set two component positioning references. It is pressed against the surfaces 10a and 10b (X-axis direction and Y-axis direction), and thereby the position of the element mounting board 24 is adjusted. Next, based on the substrate movement signal from the control unit 6, the second suction collet 3 is used for the element mounting substrate 24.
Is picked up again and lifted, and then the collet support 1 is moved in the X-axis direction to position the second suction collet 3 on the package 21 on the assembly table 11, and the collet support 1 Is stopped, and then the second suction collet 3 is lowered to mount the element mounting substrate 24 on the first solder 22 in the approximate center of the package 21, and in this state, the element is moved by the second suction collet 3. The mounting substrate 24 is pressed against the package 21 with a load of about 10 to 100 g to maintain this state.

The reference surfaces 10a, 10 for positioning the parts
b is arranged slightly closer to the center side of the package 21 than the side wall of the recess 21a of the package 21 on the assembly table 11, whereby the element mounting board 24 whose position is adjusted on the component positioning table 10 is provided. Recess 21 of package 21
It is designed to be stored in a. After that, the temperature of the heater in the assembly table 11 is raised based on the temperature rise signal from the control unit 6, and the package 21, the first solder sheet 22, and the element mounting board 24 are heated at 250 ° C. for 20 seconds. After melting the first solder sheet 22, the assembly table 11
Nitrogen is supplied from a side nitrogen supply nozzle (not shown) to cool the package 21 and the element mounting substrate 24 to 200 ° C. or lower. By this heating and cooling, the element mounting substrate 24 is fixed on the recess 21 a of the package 21 via the solder sheet 22.

After that, the collet support 1 is moved in the X-axis direction so that the third suction collet 4 is stopped at the optical fiber supply position of the component mounting table 9 by the fiber position return signal from the controller 6. The component mounting table 9 is moved in the Y-axis direction so that the optical fiber 20 is located below the trajectory of the third suction collet 1. Then, based on the fiber supply signal from the control unit 6, the third suction collet 4 is lowered to move one optical fiber 20 to the V
After sucking in the groove 4e and lifting it, the collet support 1 is moved in the X-axis direction to move the fiber insertion stage 12
The third suction collet 4 is lowered and placed on the V groove 13d of the fourth suction collet 13, and in this state, the suction of the third suction collet 4 is released, and
The optical fiber 20 is adsorbed and supported by the adsorbing collet 13. The third suction collet 4 and the fourth suction collet 13 are arranged in the same direction in which the V grooves 4e and 13d extend so that they can face each other.

Then, based on the fiber insertion signal from the control unit 6, the fiber insertion stage 12 is mounted on the assembly table 1.
13A, the tip of the optical fiber 20 thereon is moved to the package 2 on the assembly table 11 as shown in FIG. 13 (a).
It projects through the fiber insertion hole 21c of No. 1 into the fiber introduction groove 24b on the element mounting substrate 24. In this case, since the tip of the fiber introduction groove 24b spreads out in a substantially fan shape,
Even if the position of the optical fiber 20 is slightly displaced, the tip of the optical fiber 20 approaches the laser diode LD while being corrected in position by the fiber introduction groove 24b as it is pushed, and hits the wall surface of the lateral groove 24c of the element mounting substrate 24. Stop moving.

The lateral groove 24c of the device mounting board 24 is shown in FIG.
As shown in (b) and FIG. 14, the end of the optical fiber 20 is formed to stop at the end of the active layer AC of the laser diode LD at a position where the distance x is 0.02 to 0.05 mm. There is. When the fiber insertion stage 12 further moves while the movement of the optical fiber 20 is stopped, the optical fiber 20 slides in the V groove 13d of the fourth suction collet 13, which is impossible for the optical fiber 20. No load is applied.

Next, based on the second solder position return signal from the control section 6, the collet support section 1 is moved to the X-axis so that the second suction collet 3 stops at the solder supply position of the component mounting table 9. And the component mounting table 9 is moved in the Y-axis direction so that the second solder sheet 23 is located below the track of the second suction collet 3. Subsequently, based on the second solder sheet supply signal from the control unit 6, after the second suction collet 3 is positioned above the second solder sheet tray 33, the second suction collet 3 is moved. It is lowered to adsorb one second solder sheet 23 and lift it.

Then, based on the second solder sheet movement signal from the control section 6, the collet support section 1 is moved in the X-axis direction and stopped on the element mounting board 24 on the assembly table 11, and thereafter. To lower the second suction collet 3 to the second
The solder sheet 23 is placed on the optical fiber mounting area of the element mounting substrate 24 to cover a part of the optical fiber 20. Further, the suction of the second suction collet 3 is released, and the second solder sheet 23 is opened.

Next, based on the substrate position return signal from the control unit 6, the collet supporting unit 1 causes the second suction collet 3 to stop at the lid supply position of the component mounting table 9.
Is moved in the X-axis direction, and at the same time, the component mounting table 9 is moved in the Y-axis direction so that the lid 25 made of silicon is located under the track of the second suction collet 3. Subsequently, based on the lid supply signal from the control unit 6, the second suction collet 3 is positioned above the lid tray 35, and then the second suction collet 3 is lowered to move one lid 25. Is picked up and lifted, then the collet support 1 is moved in the X-axis direction and stopped on the component positioning base 10, and the second suction collet 3 is lowered to be placed on the component positioning base 10. After mounting, the suction is released and the lid 25 is opened.

Thereafter, similarly to the position adjustment of the element mounting board 24, based on the position adjustment signal from the control unit 6,
The lid 2 is mounted on the component positioning table 10 by using the pins 15 and 16.
5 is pressed against the two component positioning reference surfaces 10a and 10b (X-axis direction and Y-axis direction) to adjust the position of the lid 25. Then, based on the lid movement signal from the controller 6, the second suction collet 3 causes the lid 25 to be sucked again and lifted, and subsequently the collet support 1 is moved in the X-axis direction to move the assembly table. When the second suction collet 3 is located on the element mounting substrate 24 on 11, the movement of the collet support portion 1 is stopped, and thereafter, as shown in FIG.
Of the suction collet 3 is lowered to place the lid 25 on the second solder 23 in the optical fiber mounting region of the element mounting substrate 24, and in this state, the lid 25 is closed by the second suction collet 3.
Is pressed against the element mounting substrate 24 with a load of about 10 to 100 g, and this state is maintained.

After that, the temperature of the heater in the assembly table 11 is raised on the basis of the temperature rise signal from the control section 6, and the lid 25, the second solder sheet 23, and the element mounting board 24 are moved to 25 degrees.
After heating the second solder sheet 23 by heating at 0 ° C. for 20 seconds, nitrogen is supplied from the nitrogen supply nozzle to cool the element mounting substrate 24 and the lid 26 to 150 ° C. or lower. Due to this heating and cooling, the lid 25 allows the element mounting substrate 2 to be soldered through.
4 is fixed in the peripheral region of the fiber introduction groove 24b of No. 4 and the optical fiber 20 is soldered to the fiber introduction groove 2b.
It is fixed in 4b.

The lid 25 is made of a silicon substrate,
A groove 25a for preventing the lid 25 from being lifted is formed in a region of the lower surface facing the fiber mounting groove 24b of the element mounting substrate 24, so that the lid 25 and the element mounting substrate 24 are in surface contact with each other. Composed. With the above, the optical coupling between the optical fiber 20 and the laser diode LD is completed, and the device mounting board 2 incorporated in the package 21 is completed.
4. The optical fiber 20 and the lid 25 are used as an optical semiconductor device module.

Then, after the lid 25 is cooled, when the first suction collet 2 sucks and lifts the lid 25 based on the module return signal from the control unit 6, the entire optical element module is lifted. The part 1 is moved to move the optical element module onto the package tray 31 to be opened. By repeating the series of operations described above, the optical element module can be assembled accurately in a short time. In addition, the package 21 and the device mounting board 2
4. Since the positioning of the optical fiber 20 and the like is performed by abutting against the reference surface, the time required for positioning is short, and the man-hours for module assembly per unit time are large,
Throughput is improved. Moreover, the structure of the assembly device is simple, the device is easy to manufacture, and the cost thereof is low.

Further, in the assembly table 11, the package is also heated by the reference surface, so that the thermal fluctuation due to the outside air is small and the heating control of the parts is facilitated. The positions of the parts positioned by the positioning table 9 are not changed in the X-axis direction and the Y-axis direction in the process of being conveyed to the assembly table 11. The element mounting substrate 24 described above is formed through the following steps.

First, as shown in FIG. 16 (a), a SiO ₂ film 40 having a stripe-shaped opening 41 with a fan-shaped tip is formed on the surface of a silicon substrate 42 in a specific plane orientation. Next, when the silicon substrate 42 is etched by using the SiO ₂ film 40 as a mask, the etching rate of the (331) plane is small, so that the surface of the silicon substrate 42 is shown in FIG.
As shown in (b), the (331) planes with different angles are exposed to form a fiber attachment groove 24b having a fan-shaped portion having two spread angles and a stripe portion connected to the fan-shaped portion.

After removing the SiO ₂ film 40, in the region near the center of the silicon substrate 42, as shown in FIG.
Deep lateral groove 24c orthogonal to the fiber mounting groove 24
Are formed by dicing. The lateral groove 24c is formed by tilting the end of the fiber mounting groove 24b.
It is formed to prevent the distance between 0 and the laser diode LD from becoming too large.

Further, a first electrode 24a for connecting the laser diode LD is formed on the surface of the silicon substrate 42, which is an extension of the fiber mounting groove 24b, and further the first electrode near the lateral groove 24c. 24a is shown in FIG.
Solder 43 for connecting a laser diode as shown in (b) is attached. When the laser diode LD is connected onto the solder 43 after the second electrode 24d is formed,
The element mounting board 24 is completed.

When the fan-shaped opening angle of the opening 41 of the SiO ₂ film 40 on the silicon substrate 42 is set to 53.14 degrees as shown in FIG. 17 (a), it is shown in FIG. 17 (b). As described above, both side surfaces of the fan-shaped portion of the fiber mounting groove 24b are each constituted by one (331) surface.

[0058]

As described above, according to the present invention, in addition to the assembly stand for assembling the parts, the part positioning stand for adjusting the position of the parts and the optical fiber are inserted in a predetermined direction. Since a fiber insertion stage is provided for this purpose, the substrate whose position has been adjusted accurately in advance on the assembly table is conveyed to the assembly table by the collet while maintaining the state as it is. Then, the optical fiber can be introduced onto the substrate in a predetermined direction by the fiber insertion stage, and the optical fiber and the optical element on the substrate can be optically coupled with high precision without using a microscope or an assembly marker of parts. Since the time required for positioning is short, the assembly throughput can be improved. Further, the structure of the assembling apparatus is simple and the mass productivity of the apparatus can be improved.

Further, the collet used for attracting the optical fiber is composed of the first and second parts, and an inclined surface which constitutes one surface of the V groove is formed at the edge of the first part and the side thereof. While an air introduction groove connected to the slope is provided in the portion, a slope forming the other surface of the V groove is formed at the edge of the second component, and a decompression chamber facing the air introduction groove is provided inside. ing.

In such a collet, the V groove is formed by chamfering the first and second parts, and
Of the air introduction groove formed by grinding on the side surfaces of the first and second components, the portion exposed from the V groove is used as a suction hole. This collet has higher work efficiency in the manufacturing process than the conventional structure in which the suction holes are drilled, improves the yield, and facilitates maintenance and inspection.

When the optical element and the optical fiber are optically coupled on the substrate, if a groove for inserting the optical fiber is provided in the substrate and the width of the tip portion is widened, even if there is a slight deviation in the insertion of the optical fiber, The optical fiber can be surely inserted toward the optical element by correcting the insertion position by the groove. Further, by providing a fiber stopper on the substrate, the distance between the optical fiber and the optical element can be set to a desired size.

By providing a fiber hole for inserting the optical fiber in the package accommodating the substrate, the optical fiber is supported by the fiber hole before the optical fiber reaches the substrate. Can be inserted on the board with high accuracy.

[Brief description of drawings]

FIG. 1 is a plan view, a front view and a side view showing a schematic configuration of an optical module assembling apparatus according to an embodiment of the present invention.

FIG. 2 is a front view, a side view, and a bottom view showing an example of a collet used in the optical module assembling apparatus according to the embodiment of the present invention.

3A and 3B are a front view, a side view, and a bottom view of a first part constituting the collet shown in FIG.

4A and 4B are a front view, a side view, and a bottom view of a second part that constitutes the collet shown in FIG.

FIG. 5 is a bottom view, a front view, and a side view showing an example of a collet used for inserting an optical fiber in the optical module assembling apparatus according to the embodiment of the present invention.

6A and 6B are a bottom view, a front view, and a side view of a first part constituting the collet shown in FIG.

7A and 7B are a bottom view, a front view, and a side view of a second component that constitutes the collet shown in FIG.

FIG. 8 is a plan view, a front view and a side view showing an example of a component positioning base of the optical module assembling apparatus according to the embodiment of the present invention.

9A and 9B are a plan view, a front view, and a side view showing a component positioning operation state using the component positioning base shown in FIG.

FIG. 10 is a plan view showing a component mounting base of the optical module according to the embodiment of the present invention and members mounted thereon.

FIG. 11 is a flowchart showing an assembling process using the optical module assembling apparatus according to the embodiment of the present invention.

FIG. 12 is a perspective view (part 1) showing an assembled state using the optical module assembling apparatus according to the embodiment of the present invention.

FIG. 13 is a perspective view (No. 2) showing an assembled state using the optical module assembling apparatus according to the embodiment of the present invention.

FIG. 14 is a sectional view showing an assembled state using the optical module assembling apparatus according to the embodiment of the present invention.

FIG. 15 is a perspective view (No. 3) showing an assembled state using the optical module assembling apparatus according to the embodiment of the present invention.

FIG. 16 is a perspective view showing a first example of a manufacturing process of an element mounting substrate which is applied to the assembly by the assembly apparatus of the optical module according to the embodiment of the present invention.

FIG. 17 is a perspective view showing a second example of the manufacturing process of the element mounting substrate applied to the assembly by the optical module assembling apparatus according to the embodiment of the present invention.

FIG. 18 is a side view, a front view and a bottom view showing a first example of a collet used in assembling a conventional optical module.

FIG. 19 is a side view, a bottom view and a front view showing a second example of the collet used in the assembly of the conventional optical module.

[Explanation of symbols]

 1 Collet Support 2 First Adsorption Collet 3 Second Adsorption Collet 4 Third Adsorption Collet 5 Rail 6 Control Part 7 Strut 8 Vibration Isolator 9 Component Placement Table 10 Component Positioning Table 11 Assembly Table 12 Fiber Insertion stage 13 Fourth suction collet 20 Optical fiber 21 Package 22 First solder sheet 23 Second solder sheet 24 Element mounting substrate 25 Lid

Front page continued (72) Inventor Kazunori Miura 1015 Kamiodanaka, Nakahara-ku, Kawasaki, Kanagawa, Fujitsu Limited (72) Inventor, Mitsuhiro Yano 1015, Uedota, Nakahara-ku, Kawasaki, Kanagawa (72) Invention Michio Tamano 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Inventor, Koji Nagata, 1015, Kamikodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited (72) Etsuko Onuma, Nakahara, Kawasaki, Kanagawa 1015 Kamiodanaka, Ku within Fujitsu Limited (72) Inventor Norio Ogawara 1015, Kamiodanaka within Nakahara, Kawasaki, Kanagawa Within Fujitsu Limited

Claims (5)

[Claims] 1. An optical fiber constituting an optical element module,
A component mounting base for mounting a plurality of members including a substrate, a positioning base for adjusting the position of the member, an assembly base for mounting and assembling the plurality of members, and from a predetermined direction A fiber insertion stage for inserting and mounting the optical fiber on the substrate on the assembling table, and the plurality of parts between the component mounting table, the positioning table, the assembly table, and the fiber insertion stage. An optical element module assembling apparatus, comprising: a collet for sucking and transporting a member. 2. A collet used for adsorbing the optical fiber among the collets has first and second parts, and an edge of the first part has one of the V grooves. A slope forming a surface is formed and has a decompression chamber inside, a slope forming the other surface of the V groove is formed at the edge of the second component, and the side is connected to the slope. The apparatus for assembling an optical element module according to claim 2, further comprising an air introduction groove 4h connected to the decompression chamber. 3. The fiber insertion stage comprises a collet for adsorbing an optical fiber, which has first and second components, and an edge portion of the first component is provided with an inclined surface constituting one surface of a V groove. The second part has an air introduction groove formed on its side and connected to the slope, a slope forming the other surface of the V groove is formed on the edge of the second component, and the air introduction groove is formed inside. The optical device module assembling apparatus according to claim 1, further comprising a decompression chamber facing the groove. 4. The optical element module according to claim 1, wherein the member includes a package, and a reference surface for adjusting the position of the package is formed on the assembly table. Assembly equipment. 5. The apparatus for assembling an optical element module according to claim 1, wherein the substrate on which an optical element is mounted is sucked by the collet and conveyed from the component mounting table to a positioning table, Is positioned at a specific position on the positioning table, the substrate is placed on the assembly stage by the collet, the optical fiber is transported and placed on the fiber insertion stage by the collet, and the fiber insertion stage is moved. Then, the optical fiber is inserted into the substrate and optically coupled with the optical element, and an optical element module assembling method.