JPH0969716A - Production of chip antenna - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip antenna which has plural mounting surfaces and can prevent deterioration of the antenna characteristic. SOLUTION: The sheet layers 11a to 11d of rectangular shapes consist of a dielectric material containing mainly barium oxide, aluminum oxide and silica. Each of layers 11a to 11d has the 1st via holes 13 at the positions corresponding to a feeding terminal 12a and a fixing terminal 12b respectively. At the same time, the meandering copper conductors 15 having 10 corners are bonded by printing or vapor deposition or formed by plating on the layer 11b. The holes 13 are also formed on the layer 11b at the positions corresponding to both terminals 12a and 12b. Then the layers 11a to 11d are laminated together into a mother layered product. Finally, this layered product is cut along a cutting line and calcined. Thus a chip antenna 10 is obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip antenna, and more particularly to a method for manufacturing a chip antenna for mobile communication and local area network (LAN).

[0002]

2. Description of the Related Art FIG. 9 is a perspective view of a microstrip line antenna 1 which is a conventional chip antenna. In manufacturing this microstrip line antenna 1, a meandering strip conductor 3 is formed on one main surface of a planar dielectric substrate 2, and a metal conductor 5 is further formed on the other main surface of the dielectric substrate 2. Is being manufactured.

[0003]

However, in the above-mentioned conventional microstrip line antenna 1, one main surface of the dielectric substrate 2 on which the strip conductor 3 is formed is exposed, and the strip conductor 3 is damaged. However, there is a problem in that corrosion and the like occur over time and antenna characteristics deteriorate. Further, since the strip conductor 3 is formed on one main surface of the dielectric substrate 2, there is a problem that the mounting surface is only the other main surface of the dielectric substrate 2 on which the metal conductor 5 is formed.

The present invention has been made in order to solve the above problems and prevents deterioration of antenna characteristics.
An object of the present invention is to provide a method for manufacturing a chip antenna having a plurality of mounting surfaces.

[0005]

In order to solve the above-mentioned problems, the present invention comprises a step of forming a substrate made of at least one of a dielectric material and a magnetic material, and a meandering shape having at least one corner. A method of manufacturing a chip antenna, comprising: a step of providing at least one conductor inside the base; and a step of providing at least one power supply terminal for applying a voltage to the conductor on a surface of the base, It is characterized in that the step of forming the substrate comprises a step of laminating a plurality of sheet layers.

Further, the step of providing the power supply terminal on the surface of the base body comprises the step of forming at least one of a first via hole and a first through hole provided inside the base body. .

Further, the step of providing the conductor inside the base body includes at least two of the plurality of sheet layers forming the base body.
A line is provided on the layer, and the line is connected to at least one of the second via hole and the second through hole.

Thus, according to the method of manufacturing the chip antenna of the first aspect, the step of forming the base body having the meander-shaped conductor provided therein includes the step of laminating a plurality of sheet layers, so that a plurality of conductors are formed. It can be sandwiched between the sheet layers. Therefore, the conductor is not exposed on the surface of the substrate.

According to the chip antenna manufacturing method of the second aspect, the step of providing the power supply terminal on the surface of the base body is performed by forming at least one of the first via hole and the first through hole provided inside the base body. Since the above process is performed, the power supply terminal can be formed at the same time as the second via hole or the second through hole for connecting the line formed on the sheet layer.

According to the method of manufacturing the chip antenna of the third aspect, the step of providing the conductor inside the base body includes the line provided on the plurality of sheet layers at least one of the second via hole and the second through hole. Since the step of connecting the conductors is performed, the total length of the conductor can be further increased.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In each embodiment, the same or equivalent parts are designated by the same reference numerals, and detailed description thereof will be omitted.

FIG. 1 is an exploded perspective view showing a first embodiment of a method of manufacturing a chip antenna according to the present invention.
3 is a perspective view showing a mother laminated body manufactured by the manufacturing method of FIG. 1, and FIG. 3 is a chip antenna manufactured by the manufacturing method of FIG. 1. The manufacturing method of FIG. 1 shows a case where four chip antennas 10 are manufactured at the same time.

First, barium oxide, aluminum oxide,
Rectangular shaped sheet layers 11a to 11d made of a dielectric material containing silica as a main component are prepared. Sheet layer 11
A first via hole 13 is formed in each of a, 11b, and 11d at a position corresponding to the power supply terminal 12a and the fixing terminal 12b.

On the sheet layer 11c, a meandering conductor 15 made of copper or a copper alloy and having 10 corners is formed by printing, vapor deposition, laminating, or plating. Fixing terminal 1
A first via hole 13 is formed at a position corresponding to 2b.

Next, the mother layers 16 are formed by laminating the sheet layers 11a to 11d. Finally,
The chip laminate 10 is completed by cutting the mother laminated body 16 along the cutting line 17 and baking it.

The chip antenna 1 is manufactured by the above manufacturing method.
The conductor 0 is provided inside the rectangular parallelepiped base body 18 having the mounting surface 181, and the conductors 15 are provided from one side surface to the other side surface of the base body 18. Further, one end of the conductor 15 forms a power feeding end 15a that is drawn out to the surface of the base body 18 and is connected to a power feeding terminal 12a formed on the surface of the base body 18 for applying a voltage to the conductor 15. Forms a free end 15b inside the substrate 18.

As described above, according to the method of manufacturing the chip antenna of the first embodiment, since the base 18 is formed by laminating the sheet layers 11a to 11d, the meandering conductor 15 is formed on the sheet. It can be sandwiched between the layers 11b and 11c. Therefore, the conductor 15 can be provided inside the base body 18. As a result, the conductor 15 is not damaged or corroded, and the antenna characteristics of the chip antenna 10 are not deteriorated.

Further, the conductor 15 is provided inside the substrate 18,
The power supply terminal 12a and the fixing terminal 12 are provided on the surface of the conductor 18.
Since b is provided, any surface of the base 15 can be a mounting surface.

Further, since the power supply terminal 12a and the fixing terminal 12b are formed in the first via hole 13, a step of forming the power supply terminal 12a and the fixing terminal 12b after cutting the mother laminated body is required. do not do. Therefore, the manufacturing process can be shortened and the cost can be reduced.

FIG. 4 is an exploded perspective view showing a second embodiment of the method of manufacturing a chip antenna according to the present invention, and FIG.
FIG. 6 is a perspective view showing a mother laminated body manufactured by the manufacturing method of FIG. 4, and FIG. 6 is a chip antenna manufactured by the manufacturing method of FIG. And the manufacturing method of FIG. 1 is a case where four chip antennas 20 are included.

First, a rectangular shaped sheet layer 21 made of a dielectric material containing titanium oxide or barium oxide as a main component.
Prepare a to 21d. First via holes 13 are formed in the sheet layer 21d at positions corresponding to the power supply terminals 12a and the fixing terminals 12b. Further, on the sheet layer 21a, a bent line 22a made of an Ag-Pd alloy is provided.
It is formed by printing, vapor deposition, laminating, or plating, and the first via hole 13 is formed at a position corresponding to the power supply terminal 12a and the fixing terminal 12b.

Further, a bent line 22b is formed on the sheet layer 21b so that one end corresponds to one end of the line 22a, and a second line is formed at a position corresponding to one end of the line 22b, that is, one end of the line 22a. The via hole 23a is located at a position corresponding to the power supply terminal 12a and the fixing terminal 12b.
Via hole 13 is formed. Similarly, the sheet layer 21c
A bent line 22c is formed on the top so that one end corresponds to the other end of the line 22b, and a second via hole 23b is provided at a position corresponding to one end of the line 22c, that is, the other end of the line 22b. First via holes 13 are formed at positions corresponding to the terminals 12a and the fixing terminals 12b.

Next, the mother layers 24 are formed by laminating the sheet layers 21a to 21d. Finally,
The chip laminate 20 is completed by cutting the mother laminated body 24 along the cutting line 17 and firing it.

The chip antenna 2 is manufactured by the above manufacturing method.
Reference numeral 0 denotes a conductor 2 provided inside the rectangular parallelepiped base body 25 from one side surface to the other side surface of the base body 25 facing each other.
6 is provided. Further, one end of the conductor 26 (the other end of the line 22a) is drawn to the surface of the base 25 and is connected to a power supply terminal 12a formed on the surface of the base 25 to apply a voltage to the conductor 26. 26 a is formed, and the other end (the other end of the line 22 c) has the free end 2 inside the base body 25.
6b is formed.

As described above, according to the method of manufacturing the chip antenna of the second embodiment, since the lines are connected by the via holes to form the conductors, the method of manufacturing the chip antenna of the first embodiment is different from the method of manufacturing the chip antenna of the first embodiment. In addition to the same effect, the total length of the conductor can be further increased. Therefore, the band width of the chip antenna can be further narrowed and the band can be increased.

FIG. 7 is a perspective view showing a third embodiment of the method of manufacturing a chip antenna according to the present invention, which is a case where four chip antennas 30 are included.

This is different from the first and second embodiments in that the shape of the first via hole 32 for forming the power supply terminal 12a and the fixing terminal 12b is rectangular, and the mother is different. After forming the laminated body 31, the chip antenna 30 is formed by cutting along the cutting line 17.

As described above, according to the method of manufacturing the chip antenna of the third embodiment, since the feeding terminal 12a and the fixing terminal 12b are formed by the via hole 32 having a rectangular shape, the soldering area becomes large. The solder fixing strength is improved.

In the above first to third embodiments, the case where the power supply terminal and the fixing terminal are formed by the via holes has been described. However, after cutting the mother laminated body to form the base body, the base body is formed. It may be formed by printing on the side surface of the.

In the above first to third embodiments, the case where the power supply terminal and the fixing terminal are formed by the via hole has been described, but the power supply terminal and the fixing terminal are formed by the through holes. Good.

Furthermore, in the above second embodiment, the via hole is used to connect the line, but the line may be connected by a through hole.

Further, in the above-mentioned first to third embodiments, the power supply terminal and the fixing terminal formed by the via hole or the through hole are arranged such that one side of the side surface of the base body is opposite to the other side, that is, the side on the lower surface side. Although the case where it is formed from the side to the side on the upper surface side has been described, it may be formed up to the middle of the side surface of the base body as shown in FIG. Is not a condition of.

Further, in the above-mentioned first to third embodiments,
Although the case where one conductor is provided on the substrate has been described, two or more conductors may be formed.

Further, in the above-mentioned first to third embodiments, the case where there is one power supply terminal has been described, but there may be a plurality of power supply terminals if necessary.

Further, although the case of using a dielectric material as the material of the sheet layer forming the substrate has been described, a magnetic material or a combination of a dielectric material and a magnetic material may be used.

[0036]

According to the chip antenna manufacturing method of the first aspect of the present invention, since the base is formed by laminating a plurality of sheet layers, the conductor can be sandwiched between the plurality of sheet layers. Therefore, the conductor can be provided inside the base body, and as a result, the conductor is not damaged or corroded,
The antenna characteristics of the chip antenna do not deteriorate.

Since the conductor is formed inside the substrate and the power supply terminal and the fixing terminal are formed on the surface of the base, any surface of the base can be used as the mounting surface.

According to the chip antenna manufacturing method of the second aspect, since the feeding terminal is formed in at least one of the via hole and the through hole, a step of forming the feeding terminal after cutting the mother laminated body is required. do not do. Therefore, the manufacturing process can be shortened and the cost can be reduced.

According to the chip antenna manufacturing method of the third aspect, since the conductors are formed by connecting the lines with via holes, the total length of the conductors can be further increased. Therefore, the band width of the chip antenna can be further narrowed and the band can be increased.

[Brief description of drawings]

FIG. 1 is a first method of manufacturing a chip antenna according to the present invention.
FIG. 3 is an exploded perspective view showing the embodiment of FIG.

FIG. 2 is a perspective view of a mother laminated body manufactured by the manufacturing method of FIG.

FIG. 3 is a perspective view of a chip antenna manufactured by the manufacturing method of FIG.

FIG. 4 is a second method of manufacturing a chip antenna according to the present invention.
FIG. 3 is an exploded perspective view showing the embodiment of FIG.

5 is a perspective view of a mother laminate manufactured by the manufacturing method of FIG.

FIG. 6 is a perspective view of a chip antenna manufactured by the manufacturing method of FIG.

FIG. 7 is a third method of manufacturing a chip antenna according to the present invention.
It is a perspective view of the mother laminated body produced in the Example of.

FIG. 8 is a fourth method for manufacturing a chip antenna according to the present invention.
It is a perspective view of the mother laminated body produced in the Example of.

FIG. 9 is a perspective view of a conventional chip antenna.

[Explanation of symbols]

 10, 20, 30, 40 Chip antennas 11a to 11d, 21a to 21d Sheet layer 12a Feeding terminal 13 First via hole 23a, 23b First via hole 15, 26 Conductor 18, 25 Substrate

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kenji Asakura Inventor Kenji Ara 226-10 Tenjin, Nagaokakyo City, Kyoto Murata Manufacturing Co., Ltd.

Claims (3)

[Claims] 1. A step of forming a base made of at least one of a dielectric material and a magnetic material, a step of providing at least one meander-shaped conductor having at least one corner inside the base, and the conductor. And a step of providing at least one power supply terminal for applying a voltage to the surface of the base body, wherein the step of forming the base body comprises a step of laminating a plurality of sheet layers. A method of manufacturing a chip antenna, comprising: 2. The step of providing the power supply terminal on the surface of the base body comprises the step of forming at least one of a first via hole and a first through hole provided inside the base body. The method for manufacturing the chip antenna according to claim 1. 3. The step of providing the conductor inside a substrate,
A line is provided on at least two layers of a plurality of sheet layers forming the base, and the lines are connected to each other by at least one of a second via hole and a second through hole. A method of manufacturing a chip antenna according to claim 1 or 2.