JPH0964676A - Frequency adjusting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the capacity of adjusting processing for a crystal oscillator per batch time, to easily position between the oscillator and a mask and to prevent a mask hole from being easily blocked. SOLUTION: Plural recovery reels 73, 103 are simultaneously rotated, a carrier tape 6 and a mask tape 9 are simultaneously wound up, and when the crystal oscillator fitted to the tape 6 arrives at a position opposed to an evaporation source 8 to be a frequency adjusting position, the oscillator stops on the position. The oscillator is turned to an oscillation state on the adjusting position, the oscillation frequency is detected and silver is dispersed from the evaporation source 8 to the evaporation area of the oscillator through the mask tape 9 to evaporate the silver. Since positioning holes are formed on both the tapes 6, 9, positioning between the crystal oscillator fitted to the tape 6 and the mask hole of the tape 9 can be easily and accurately executed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a frequency adjusting device for adjusting the oscillation frequency of a crystal oscillator to a predetermined value by depositing a metal such as silver on the surface of the crystal oscillator in an oscillating state.

[0002]

2. Description of the Related Art Conventionally, so-called ring type batch type and load lock type are known as frequency adjusting devices of this type. The ring-type batch type device is a transfer device that transfers a crystal oscillator that is an object to be processed in a circular vacuum container, an evaporation source that vaporizes metal that deposits metal on the crystal oscillator, and a crystal oscillator. A mask or the like for vapor-depositing a metal from a vapor deposition source on a predetermined area is arranged at a predetermined position on the child.

In such a ring type batch type apparatus,
When the crystal unit is moved to the adjustment position by the carrier,
At this adjustment position, connect the probe to the test terminal of the crystal unit, put the crystal unit in the oscillating state and at the same time set the oscillation frequency to the detecting state, and set the surface of the crystal unit through the mask fixed from the vapor deposition source. Silver is scattered and deposited on the deposition area. When the oscillation frequency of the crystal unit reaches a specified value,
After re-driving the carrier device to move the adjusted crystal unit, the next crystal unit is moved to the adjustment position and the same process is performed. When such processing is completed for a predetermined unit such as 100 to 200,
Open the lid of the vacuum container and take out the processed crystal unit from the vacuum container.

On the other hand, the load-lock type apparatus is composed of three chambers: an inlet-side preparatory chamber, a main processing chamber following the preparatory chamber, and an outlet-side discharge processing chamber following the main processing chamber. , These three rooms are all vacuum chambers. In these three rooms, a common transfer device is installed to transfer pallets and magazines in which 10 to 20 crystal units are set, and the main processing chamber is equipped with a metal that is deposited on the surface of the crystal units. A vapor deposition source for vaporizing the is provided. Further, each crystal oscillator set on the pallet is covered with a mask in order to perform the above vapor deposition only on the vapor deposition region.

In such a load-lock type apparatus, when a pallet in which a predetermined number of crystal oscillators are set is transported by the transport device from the preparatory chamber to the adjustment position in the main processing chamber, the crystal vibrations occur at this adjustment position. A probe is connected to the test terminal of the child, and the oscillation frequency of the crystal oscillator is set to the detection state at the same time, and the oscillation frequency is set to the detection state. . When the oscillation frequency of the crystal unit reaches a specified value, after re-driving the carrier device to move the adjusted crystal unit,
The next crystal oscillator is moved to the adjustment position and the same processing is performed. Then, when such processing is completed for all the crystal oscillators set on the pallet, the pallet is transferred from the main processing device to the discharge processing chamber by the transfer device.

[0006]

By the way, in the ring type batch type apparatus, the number of processes per batch time is small and it is inconvenient to process a large amount. In addition, since the crystal unit side is moved by the transport device while the mask is fixed and the alignment with the mask is performed, when the crystal unit is small or high accuracy is required, it is difficult to perform the alignment. There is a problem that the accuracy is not good. Further, as the crystal unit becomes smaller, the holes in the mask become smaller and the holes tend to be clogged.

On the other hand, the load-lock type device has a problem that the size of the entire device is increased and the production cost is increased because it is necessary to secure a vacuum in each room, which is composed of three rooms.
Also, 10 to 2 masks for each crystal unit
Since 0 crystal units are housed in pallets or magazines one by one and transported by the transport device, there is a problem that running costs are high and tooling jigs are expensive. Furthermore, since it is necessary to carry in the pallet with the crystal oscillator set in the preparation spare room and the work to carry out the pallet from the discharge processing room,
There is a problem that workers are always needed.

Therefore, a first object of the present invention is to provide a frequency adjusting device which is small in size and low in price and capable of improving the processing capacity per batch time and saving labor. A second object of the present invention is to provide a frequency adjusting device capable of preventing the mask from clogging holes.

A third object of the present invention is to facilitate the alignment of the crystal oscillator to be adjusted with the mask and to improve the accuracy, and also to easily deal with the change of the type of the crystal oscillator. It is to provide a frequency adjusting device.

[0010]

According to a first aspect of the present invention, there is provided a vacuum processing chamber, and carrier tape winding means arranged in the vacuum processing chamber for winding a carrier tape having a plurality of crystal oscillators mounted thereon. A vapor deposition source that is disposed in the vacuum processing chamber and that vaporizes metal that is deposited on a crystal oscillator that is mounted on the carrier tape; and a crystal oscillator that is mounted on a carrier tape that is wound by the carrier tape winding means. In order to achieve the first object, the frequency adjusting device is provided with mask means for covering the area other than the vapor deposition area and frequency measuring means for measuring the oscillation frequency of the crystal unit.

According to a second aspect of the present invention, in the frequency adjusting apparatus according to the first aspect, the mask means has a plurality of mask holes corresponding to a vapor deposition region of a crystal oscillator mounted on the carrier tape in a longitudinal direction. The second object is achieved by comprising a mask tape provided and having a mask tape winding means for winding the mask tape.

According to a third aspect of the present invention, in the frequency adjusting apparatus according to the second aspect, the crystal oscillator mounted on the carrier tape and the mask hole of the mask tape have the same pitch, and the crystal vibration is generated. The alignment between the child and the mask hole is performed by the alignment holes provided at the same pitch on the carrier tape and the mask tape, respectively, and the alignment projections provided on the carrier tape winding means. By the third
Achieve the objectives.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to FIGS. FIG. 1 is a front view of a frequency adjusting device according to an embodiment of the present invention.
FIG. 2 shows a plane of a device body of the frequency adjusting device.

This frequency adjusting device comprises an apparatus main body 1 having a window 1A, and a computer 2 for controlling each part as will be described later when the apparatus main body 1 adjusts the frequency. It is annexed. Device body 1
Is a carrier tape winding mechanism 7 for winding a carrier tape 6 in which a plurality of crystal oscillators 5 (see FIG. 3), which are objects to be adjusted, are mounted at equal intervals in a vacuum processing chamber 4, and the carrier tape 6 Of the crystal oscillator 5 installed between the vapor deposition source 8 and the carrier tape winding mechanism 7 for vaporizing the metal to be deposited on the crystal oscillator 5 mounted on the carrier tape 6. A mask tape winding mechanism 10 for winding a mask tape 9 for covering a region other than the vapor deposition region, and a frequency measuring device (not shown) for measuring the oscillation frequency of the crystal oscillator 5 when adjusting the frequency of the crystal oscillator 5.
And

The vacuum processing chamber 4 is constructed so that when the frequency of the crystal oscillator 5 is adjusted, the interior of the vacuum processing chamber 4 is evacuated by a vacuum pump (not shown) to obtain a vacuum state. The carrier tape winding mechanism 7 includes a rotatable supply reel shaft 72 for mounting a supply reel 71 on which the carrier tape 6 on which the crystal resonator 5 before frequency adjustment is mounted is mounted, and the crystal resonator 5 for which frequency adjustment has been completed. A rotatable collection reel shaft 74 for mounting a collection reel 73 for collecting the carrier tape 6 mounted with, and two rotatable sprockets 7 for aligning the carrier tape 6 and the mask tape 9 with each other.
5, 76, two tension rollers 77 and 78 for keeping the tension of the carrier tape 6 constant, and the crystal oscillator 5 during frequency adjustment by pressing the back surface of the carrier tape 6.
It is composed of a jig 79 and the like for improving the posture. The recovery reel shaft 74 is connected to a motor (not shown), and is configured to rotate the recovery reel 73 and wind the carrier tape 6 by driving the motor. Also, jig 7
9 can be moved forward and backward by appropriate means not shown,
In addition, the carrier tape 6 shown in FIG. 2 can be positioned at a position different from the pressing position and this position.

As the vapor deposition source 8, there is used one that heats a metal such as silver in a crucible (not shown) by heating with a heater, or one that melts a metal in the crucible (not shown) by an electron beam. Mask tape winding mechanism 10
Is a supply reel 101 on which the mask tape 9 before use is wound.
, A rotatable supply reel shaft 102 for mounting, a rotatable collection reel shaft 104 for mounting a recovery reel 103 for collecting the used mask tape 9, and two sprockets 75 also used as the carrier tape winding mechanism 7. , 76
Etc. The collection reel shaft 104 is connected to a motor (not shown), and is configured to rotate the collection reel 103 and wind the mask tape 9 by driving the motor.

Next, the carrier tape 6, the mask tape 9, and the relationship between these tapes will be described with reference to FIGS. 3 shows the front surface of the carrier tape 6, FIG. 4 shows the front surface of the mask tape 9, and FIG.
Represents a cross section of the relationship between both tapes near the vapor deposition source 8.

The carrier tape 6 has a predetermined thickness, is flexible and can be wound, and is made of, for example, aluminum or the like. A large number of alignment holes 61 and alignment holes 62 are formed at symmetrical positions on both ends in the width direction of the carrier tape 6 at a constant pitch P1 in the length direction of the carrier tape 6. . The both alignment holes 61 and 62 are used for aligning the carrier tape 6 and the mask tape 9, in other words, aligning the crystal oscillator 5 mounted on the carrier tape 6 and the mask tape 9. . On the straight line connecting the alignment holes 61 and the alignment holes 62 at the symmetrical position of the carrier tape 6 and toward the upper part of the carrier tape 6 in the width direction, the pitch P1 of 2 is provided in the length direction. Square through holes 63 for accommodating the main body of the crystal unit 5 are formed at a double pitch P2.

On the surface side of the carrier tape 6, thousands of crystal oscillators 5 are mounted at equal intervals by an appropriate means such as an adhesive tape (not shown), and at the time of mounting, as shown in FIGS. 3 and 5. In addition, the main body of the crystal unit 5 is located in the center of the through hole 63 so that it can freely vibrate during frequency adjustment. Land patterns (adjustment terminals) 51, 51 are connected to both electrodes of the crystal unit 5.
A convex spacer 64 is formed integrally with the carrier tape 6 between the through holes 63 on the front surface side of the carrier tape 6 and the through holes 63. As shown in FIG. 5, the spacer 64 has a function of securing a constant space between the spacer 64 and the mask tape 9 and, at the same time, enhancing the adhesion to the mask tape 9.

The mask tape 9 is mounted on the carrier tape 6 in order to vapor deposit metal only on the vapor deposition region of the crystal oscillator 5 when the frequency of the crystal oscillator 5 is adjusted.
It covers the area other than the vapor deposition area. For this reason, mask holes 93 are formed at the same pitch as the through holes 63 of the carrier tape 6 in the length direction of the mask tape 9 and at positions corresponding to the vapor deposition regions of the crystal oscillator 5.

The mask tape 9 has the same width as the carrier tape 6, and the alignment hole 61 of the carrier tape 6 is formed.
And the alignment hole 62 at the same position, the same pitch P
1, a large number of alignment holes 91 and alignment holes 92 are formed respectively. Both of these alignment holes 91, 92
Is used for aligning the mask tape 9 and the carrier tape 6, in other words, for aligning the crystal oscillator 5 mounted on the carrier tape 6 and the mask tape 9. The mask tape 9 can be reused by recovering the original state of the mask hole 93 by cleaning when the mask hole 93 is clogged due to use as will be described later.

The sprocket 75 has a cylindrical main body, and the alignment holes 61 of the carrier tape 6 and the alignment holes 91 of the mask tape 9 are formed at both ends of the outer peripheral surface of the main body.
And a projection 752 for simultaneously inserting the alignment hole 62 of the carrier tape 6 and the alignment hole 92 of the mask tape 9 are provided at the pitch P1. Sprocket 1
6 is similarly configured.

Next, the operation of the embodiment configured as described above will be described. First, the supply reel 71 wound with the carrier tape 6 having the crystal unit 5 mounted thereon is mounted on the supply reel shaft 72, and the tip of the carrier tape 6 is collected by the collection reel 73 mounted on the collection reel shaft 74. As possible, it is wound around the recovery reel 73 via the tension roller 77, the sprocket 75, the sprocket 76, and the tension roller 78. On the other hand, the supply reel 101 wound with the mask tape 9 is mounted on the supply reel shaft 102, and the tip of the mask tape 9 is mounted on the recovery reel shaft 104.
It is wound around the recovery reel 103 via the sprocket 75 and the sprocket 76 so as to be collected by.

As a result, the protrusion 75 of the sprocket 75 is
1, the alignment hole 61 of the carrier tape 6 and the alignment hole 91 of the mask tape 9 are simultaneously inserted, and the projection 752 of the sprocket 75 is aligned with the alignment hole 62 of the carrier tape 6 and the alignment of the mask tape 9. Hole 92
And are inserted at the same time. Further, the projections (not shown) of the sprocket 76 are in the same state. Therefore, the alignment between the carrier tape 6 and the mask tape 9, in other words, the alignment between the crystal unit 5 mounted on the carrier tape 6 and the mask hole 93 of the mask tape 9 as shown in FIG. And easy to do.

Next, when the vacuum processing chamber 3 is evacuated and the adjustment of the frequency of the crystal oscillator 5 is started, a motor (not shown) connected to the recovery reel shaft 74 and a recovery reel shaft 74 are recovered in response to a command from the computer 2. A motor (not shown) connected to the reel shaft 104 is simultaneously driven, and the recovery reel 73 and the recovery reel 103 rotate simultaneously. As a result, the carrier tape 6 and the mask tape 9 are simultaneously wound, and the first crystal unit 5 mounted on the carrier tape 6 is
As shown in (3), when it comes to the position facing the vapor deposition source 8 which is the frequency adjustment position, the driving of both motors described above is stopped. At this time, the jig 79 that has moved backward moves forward in response to a command from the computer 2, and as shown in FIG. 5, the jig 22 makes contact with the back surface side of the carrier tape 6 to make the posture of the carrier tape 6 vertical. The crystal oscillator 5 is in a vertical posture, and the contact state between the carrier tape 6 and the mask tape 9 is improved.

Next, the land pattern 5 of the crystal unit 5
A probe (not shown) is connected to Nos. 1 and 51 to bring the crystal resonator 5 into an oscillating state, and at the same time, the oscillation frequency is started to be measured by a frequency measuring device (not shown). During the measurement of this frequency, silver scattered from the vapor deposition source 8 is vapor deposited on the vapor deposition region on the surface of the crystal resonator 5 through the mask hole 93 of the mask tape 9. Then, when the computer 2 determines that the oscillation frequency of the crystal unit 5 has reached the predetermined value, the jig 22 is retracted by the instruction of the computer 2, and then both the above-mentioned motors are simultaneously driven, The collecting reel 73 and the collecting reel 103 are simultaneously rotated by a predetermined amount. As a result, the carrier tape 6 and the mask tape 9 are simultaneously wound, and the next crystal oscillator 5 mounted on the carrier tape 6 comes to the frequency adjustment position. Then, when the jig 79 moves forward again, vapor deposition is performed while measuring the oscillation frequency of the crystal unit 5 as described above.

In this way, when the frequencies of all the crystal oscillators 5 mounted on the carrier tape 6 are adjusted, the carrier tape 6 on which the adjusted crystal oscillators 5 are mounted is wound up. The recovery reel 73 is taken out from the vacuum processing chamber 4, and the baking furnace 3 is in a vacuum high temperature state.
It will be housed for a predetermined time. This improves the adhesive strength of the deposited metal.

According to the embodiment described above, the crystal oscillators 5 are mounted on the carrier tape 6 at equal intervals,
Since the frequency is adjusted while being wound on the recovery reel 13, the frequency can be adjusted by mounting a corresponding number of crystal oscillators on the carrier tape 6. Therefore, it is possible to improve the processing capacity per batch time at a small size and at a low price, and to save labor.

Further, according to the above-described embodiment, the mask tape 9 is formed in a tape shape and is wound up each time it is used, so that the mask hole 93 of the mask tape 9 is not easily clogged and repeated use is possible. it can. Further, according to the above-described embodiment, since the carrier tape 6 and the mask tape 9 are provided with the alignment holes, the crystal resonator 5 mounted on the carrier tape 6 and the mask hole 93 of the mask tape 9 are thereby provided. Positioning can be performed easily and accurately. Then, when the type of the crystal unit 5 to be adjusted is changed, the mask tape 9 can be swiftly and easily dealt with only by replacing the mask tape 9 with a type suitable for the type.

In the above embodiment, the mask tape 9 is wound around the carrier tape 6 and the collecting reel 104 each time the frequency adjustment of the crystal oscillator 5 is completed. The collecting reel 104 may be wound up every time the frequency adjustment of 5 is completed.

[0031]

As described above, according to the first aspect of the invention, a plurality of crystal oscillators are mounted on a carrier tape, and the frequency is adjusted while winding the carrier tape. The frequency can be adjusted by mounting a number of crystal units. Therefore, according to the first aspect of the invention, the processing capacity per batch time can be improved with a small size and low price, and labor saving can be realized.

Further, according to the second aspect of the present invention, since the mask tape is used as the mask and is wound, the clogging of the mask can be prevented. Furthermore, in the invention of claim 3, the crystal oscillator mounted on the carrier tape and the mask hole of the mask tape have the same pitch, and the alignment of the crystal oscillator and the mask hole is the same for the carrier tape and the mask tape, respectively. Since the alignment holes provided at the pitch and the alignment protrusions provided on the carrier tape winding means are used, it is easy to align the crystal unit mounted on the carrier tape with the mask holes on the mask tape. And it can be performed accurately. Furthermore, when changing the type of the crystal unit to be adjusted, it is possible to respond quickly and easily simply by replacing the mask tape with a type suitable for the type.

[Brief description of drawings]

FIG. 1 is a front view of a frequency adjusting device according to an embodiment of the present invention.

FIG. 2 is a plan view of a device body of the frequency adjusting device.

FIG. 3 is a front view of a carrier tape.

FIG. 4 is a front view of a mask tape.

FIG. 5 is a cross-sectional view of a carrier tape and a mask tape near a vapor deposition source.

FIG. 6 is a perspective view showing an example of a sprocket.

[Explanation of symbols]

 1 Device Main Body 2 Computer 3 Baking Furnace 4 Vacuum Processing Chamber 5 Crystal Resonator 6 Carrier Tape 7 Carrier Tape Winding Mechanism 8 Vapor Deposition Source 9 Mask Tape 10 Mask Tape Winding Mechanism 61, 62, 91, 92 Positioning Hole 63 Through Hole 71 supply reel 72 supply reel shaft 73 recovery reel 74 recovery reel shafts 75, 76 sprocket 93 mask hole 101 supply reel 102 supply reel shaft 103 recovery reel 104 recovery reel shaft

Claims (3)

[Claims] 1. A vacuum processing chamber, a carrier tape winding device that is disposed in the vacuum processing chamber and that winds a carrier tape having a plurality of crystal oscillators mounted thereon, and the carrier tape is disposed in the vacuum processing chamber. A vapor deposition source for vaporizing a metal to be vapor deposited on the crystal oscillator mounted on the carrier, and a mask means for covering a region other than the vapor deposition region of the crystal oscillator mounted on the carrier tape wound on the carrier tape winding means; A frequency adjusting device comprising: a frequency measuring unit that measures an oscillation frequency of a crystal unit. 2. The mask means comprises a mask tape having a plurality of mask holes corresponding to a vapor deposition region of a crystal resonator mounted on the carrier tape, the mask tape being wound up. The frequency adjusting device according to claim 1, further comprising a winding means. 3. The crystal oscillator mounted on the carrier tape and the mask hole of the mask tape are arranged at the same pitch, and the crystal oscillator and the mask hole are aligned by the carrier tape and the mask tape. 3. The frequency adjusting device according to claim 2, wherein the adjustment is performed by the alignment holes provided at the same pitch on the mask tape and the alignment protrusions provided on the carrier tape winding means.