JPH0964412A - Holding member for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holding member for an electronic component that no floating or inclination of the component occurs at the time of a solder dipping method in the holding member for holding the component in a predetermined height to be mounted on a printed circuit board. SOLUTION: The holding member for an electronic component comprises a holder 15 that the lead terminal 2 of the component is passed perpendicularly through the holding member 11, a receiver 16 for receiving the protrusion 5 of the terminal 2, an elastic pawl 17 for pressing the side of the terminal 2 from the lateral direction, and a locking pawl 20 inserted to the hole 22 of the board 21 to be elastically locked to the peripheral edge. Thus, the terminal 2 can be effectively held from the lateral direction without holding the component body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is mainly for mounting a light emitting / receiving element such as a pin photodiode on a wiring board while holding the light receiving / emitting element above a certain height from the wiring board. The present invention relates to a holding member for an electronic component used.

[0002]

2. Description of the Related Art FIGS. 6 and 7 show a holding member for an electronic component used for mounting a conventional light emitting / receiving element, and FIG. 6 is a perspective view showing a state before mounting the light receiving / emitting element. , Fig. 7
FIG. 4 is a perspective view showing a state after the mounting.

In FIG. 1, reference numeral 1 denotes a pin photodiode (hereinafter referred to as a light emitting / receiving element), which is arranged so as to have an angle (α = 40 °) in order to secure directivity in a designated direction. There is. Reference numeral 3 denotes a holding member, which is provided with a hole 4 through which the lead terminal 2 of the light emitting / receiving element 1 penetrates, and the lead terminal 2 has a convex portion 5 formed therein.
When the lead terminal 2 is inserted into the hole 4, it can be inserted only up to the position of the convex portion 5, and the position is determined at a certain height h.

Therefore, the light receiving portion of the circuit is configured by soldering the inserted lead terminal 2 to a land (not shown) formed on the back surface of the printed wiring board 6.

[0005]

However, in the above-mentioned conventional holding member for electronic parts, a gap is required between the hole 4 of the holding member 3 and the lead terminal 2 for insertion, and for this reason, the light emitting / receiving element 1 is provided. Was in a state where it could easily rattle. Therefore, if the dip method is used for soldering the printed wiring board 6, there is a problem that the light emitting / receiving element 1 is lifted or tilted due to buoyancy with respect to the solder or vibration in the process. Therefore, after inserting the light emitting / receiving element 1, the lead terminal 2 is bent on the back surface of the printed wiring board 6 so that the lead terminal 2 does not float up, another component is provided on the light emitting / receiving element 1, or the holding member 3 is provided.
Although a method of enlarging the shape and pressing the light emitting and receiving element 1 so as to cover it is conceivable, this has a problem that the cost becomes high.

The present invention solves such a conventional problem, and is an excellent electronic component capable of preventing the light emitting / receiving element from rising or tilting at the time of mounting with a compact shape without increasing the cost. The object of the present invention is to provide a holding member for the.

[0007]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a contact portion having contact surfaces for contacting two side surfaces of a lead terminal of an electronic component, at least above and below the main body. At the same time, a holding portion is formed by providing a cantilever-like elastic claw having elasticity in the direction of pressing the lead terminal that abuts against the two contact portions between the two contact portions. A guide projection for positioning and engaging the holding member with the wiring board and a locking claw having elasticity are provided on the lower surface of the main body.

[0008]

Therefore, according to the present invention, since the holding member is provided with the elastic claw for laterally pressing the side surface of the lead terminal, the lead terminal is pressed after the electronic component is inserted, and the elastic member after the electronic component is mounted is mounted. There is no play, and there is an effect that no floating occurs at the time of soldering in the dip method.

[0009]

1 to 5 show a holding member for an electronic component according to an embodiment of the present invention, and FIG. 1 is a perspective view showing a state before mounting a light emitting and receiving element using this holding member. 2, FIG. 2 is a perspective view showing a state after mounting the same, FIG. 3 is an enlarged perspective view of a main part of the holding member, and FIG. 4 is a plan view showing a portion into which the lead terminal of the light emitting / receiving element is inserted into the holding member. 5 and 5 show a state in which the lead terminals of the light emitting and receiving element are inserted into the holding member,
It is the top view which showed only the lead terminal in the cross section.

In FIG. 1, reference numeral 1 denotes a light emitting / receiving element, which is an angle (α = 40 °) for ensuring directivity in a designated direction.
It is arranged to have. Reference numeral 11 is a holding member for the electronic component according to the present invention, and the contact surfaces 12, 13, 14 are arranged so that the lead terminals 2 of the light emitting and receiving element 1 penetrate vertically.
The holding unit 15 is provided. Since the lead terminal 2 is formed with the convex portion 5, the holding portion 15
When the lead terminal 2 is inserted into the support member 11, the receiving portion 16 on the upper surface of the holding member 11 comes into contact with the protruding portion 5, so that it can be inserted only up to the position of the protruding portion 5, and the light emitting / receiving element 1 is positioned at a certain height h. Is configured.

FIG. 3 is an enlarged view of a main part of the holding member 11. When the lead terminal 2 is inserted, the contact surface 13 is arranged at a height approximately midway between the contact surface 12 and the contact surface 14.
Moreover, since it is provided on the side surface of the elastic claw 17, the lead terminal 2 is pressed from the lateral direction, and the lead terminal 2 of the light emitting and receiving element 1 is fixed by elasticity and frictional force.

FIG. 4 is a plan view showing a state before the lead terminal 2 of the light emitting / receiving element 1 is inserted into the holding portion 15 of the holding member 11, and the width d1 of the holding portion 15 is the terminal width d2 of the lead terminal 2. The width d1 is made smaller by 0.1 mm to 0.4 mm, and the width d1 is made larger than the width d3 by about 0.1 mm in order to uniformly press the two lead terminals 2 in the widths d1 and d3. Further, after the lead terminals 2 of the light emitting / receiving element 1 are inserted into the holding portion 15, the widths d1 and d3 and the terminal width d2 coincide with each other, so that the lead terminals 2 are bent with a deflection amount of 0.1 mm to 0.4 mm. It is being pressed. At this time, the inserted light emitting / receiving element 1 can be held without being pulled out even if it is pressed vertically with a load of about 100 g.

Further, a chamfered portion 18 of about 0.5 mm is formed on the insertion side of the contact surfaces 12, 13, 14 of the lead terminal 2 so that the lead terminal 2 can be smoothly inserted.

Further, locking claws 20 are formed at the lower ends of both side surfaces of the holding member 11, are fitted and held in the square holes 22 provided in the printed wiring board 21, and the holding member 1 is provided.
The convex portion 19 of No. 1 and the round hole 23 of the printed wiring board 21 are used for accurate positioning.

Therefore, even if the light emitting / receiving element 1 is assembled to the printed wiring board 21 using the holding member 11 and soldering is performed by the dipping method, the light emitting / receiving element 1 does not float or tilt, so that the light emitting element 1 is slightly lifted. In this case, the manufacturing quality can be stabilized when the positional accuracy of the light emitting and receiving element 1 is important, such as when the light emitting and receiving performance is significantly changed due to the contact with other parts. In particular, since the holding member 11 does not require a height higher than the h dimension, it can be downsized and does not press the main body portion 24 of the light emitting / receiving element 1.
The light emitting / receiving element 1 after soldering also has excellent thermal cycle resistance.

Further, the hole 4 of the holding member 3 shown in the conventional example.
Is as thin as φ0.8 mm, so if the height h increases,
Due to the structure of the mold, the mold pins are easily broken, which makes it difficult to manufacture the mold. However, as in this embodiment, if the gap is widened and the holding portion 15 is composed of the contact surfaces 12, 13, and 14. Also, even if the dimension h on the die becomes high, there is no thinning portion, the die durability is improved, and the die can be constructed in two directions, so the die cost can be reduced.

Further, the material of the holding member 11 is A
Although it can be made of BS resin or POM resin, the use of PBT resin containing 10% glass improves the heat resistance while ensuring the flexural elastic modulus when inserting the locking claw 20 into the printed wiring board 21. Thus, it is possible to prevent the locking claws 20 from melting and coming off during soldering by the dip method.

Although the above embodiment has been described as having the advantage that the light emitting and receiving element 1 does not float or tilt during the dipping method, it can be mounted even when soldering is performed manually. Even if the entire device is turned upside down, the light emitting / receiving element 1 does not fall out at all, which has an advantage of improving workability.

[0019]

As is apparent from the above embodiment, the present invention has a structure in which the lead terminals are laterally pressed after the insertion of the electronic component, so that there is no play in the attachment, and there is no floating during soldering in the dipping method. Since no tilt occurs,
This has the effect of improving the mounting quality of electronic components.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state before a light emitting / receiving element is mounted using a holding member for an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state after mounting the same.

FIG. 3 is an enlarged perspective view of a main part of the holding member.

FIG. 4 is a plan view showing a portion where lead terminals of a light emitting / receiving element are inserted into the holding member.

FIG. 5 is a plan view showing a state in which the lead terminals of the light emitting / receiving element are inserted in the holding member, with only the lead terminals shown in cross section

FIG. 6 is a perspective view showing a state before a light emitting / receiving element is mounted using a conventional holding member for an electronic component.

FIG. 7 is a perspective view showing a state after the same mounting.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Light emitting / receiving element 2 Lead terminal 5 Convex part 11 Holding member 12, 13, 14 Contact surface 15 Holding part 16 Receiving part 17 Elastic claw 18 Chamfer part 19 Convex part 20 Locking claw 21 Printed wiring board 22 Square hole 23 Round hole 24 Body

Claims (1)

[Claims] 1. A holding member for holding and mounting an electronic component mounted on a wiring board at a predetermined height from the wiring board, wherein a contact surface that abuts two side surfaces of a lead terminal of the electronic component is formed. The contact portions are provided at least above and below the main body portion, and the cantilever-like elastic claws for urging the lead terminals that contact the two contact portions are pressed in the two contact portions. An electronic component which is provided between the two to form a holding portion, and which is provided with a guide projection and an elastic locking claw for positioning and engaging the holding member with the wiring board on the lower surface of the main body portion. Holding member.