CN109699127B - Modular fixing device - Google Patents

Modular fixing device Download PDF

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Publication number
CN109699127B
CN109699127B CN201711000575.3A CN201711000575A CN109699127B CN 109699127 B CN109699127 B CN 109699127B CN 201711000575 A CN201711000575 A CN 201711000575A CN 109699127 B CN109699127 B CN 109699127B
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CN
China
Prior art keywords
circuit board
electronic device
modular fixture
locking member
outer case
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Active
Application number
CN201711000575.3A
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Chinese (zh)
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CN109699127A (en
Inventor
代智勇
张丹丹
魯異
陈松平
侯祥友
曾庆龙
胡绿海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Ami Technology Co ltd
Tyco Electronics Shanghai Co Ltd
Measurement Specialties China Ltd
TE Connectivity Corp
Original Assignee
Shenzhen Ami Technology Co ltd
Tyco Electronics Shanghai Co Ltd
Measurement Specialties China Ltd
TE Connectivity Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Ami Technology Co ltd, Tyco Electronics Shanghai Co Ltd, Measurement Specialties China Ltd, TE Connectivity Corp filed Critical Shenzhen Ami Technology Co ltd
Priority to CN201711000575.3A priority Critical patent/CN109699127B/en
Publication of CN109699127A publication Critical patent/CN109699127A/en
Application granted granted Critical
Publication of CN109699127B publication Critical patent/CN109699127B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/168Wrong mounting prevention

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

The invention discloses a modular fixing device, which is suitable for fixing a single electronic device on a circuit board, and comprises: a locking member having at least two resilient snaps adapted to snap onto the circuit board; a pressing member adapted to press the electronic device on a surface of the circuit board; and a spring disposed between the locking member and the pressing member and adapted to apply a pressing force to the pressing member. When the locking member is latched to the circuit board, the electronic device is pressed against the circuit board by the pressing member. In the present invention, each of the modular fixing apparatuses is small in size, and thus, a soldering head does not interfere with the modular fixing apparatus when soldering an electronic device to a circuit board, thereby improving soldering efficiency.

Description

Modular fixing device
Technical Field
The present invention relates to a modular fixing device suitable for fixing a single electronic device on a circuit board.
Background
In the prior art, it is sometimes necessary to solder a plurality of electronic devices, for example, a plurality of LEDs (light emitting diodes), on a circuit board. To improve welding efficiency, a vision-assisted robotic welding system may be employed to perform welding tasks. However, before soldering, it is necessary to fix a plurality of electronic components on a circuit board to prevent the electronic components from moving at the time of soldering, thereby affecting the quality and accuracy of soldering. In the prior art, a fixing device capable of fixing a plurality of electronic components on a circuit board at the same time includes a plurality of cross members and longitudinal members, which occupy a large amount of space, resulting in a soldered joint, such as a soldering iron, easily interfering with the fixing device. To avoid interference, the soldering head needs to be tilted at an angle, for example, 60 degrees, with respect to the surface of the circuit board, which undoubtedly increases the difficulty of soldering and reduces soldering efficiency.
Disclosure of Invention
An object of the present invention is to solve at least one of the above problems and disadvantages in the prior art.
According to one aspect of the present invention, there is provided a modular fixture adapted to secure a single electronic device to a circuit board, the modular fixture comprising: a locking member having at least two resilient snaps adapted to snap onto the circuit board; a pressing member adapted to press the electronic device on a surface of the circuit board; and a spring disposed between the locking member and the pressing member and adapted to apply a pressing force to the pressing member. When the locking member is latched to the circuit board, the electronic device is pressed against the circuit board by the pressing member.
According to an exemplary embodiment of the present invention, the lock member includes a body portion, and each of the elastic catches includes an elastic arm portion extending downward from the body portion and a catch portion at a tip end of the elastic arm portion.
According to another exemplary embodiment of the present invention, a spring accommodation chamber in which the spring is accommodated is formed in the body portion of the lock member; the pressing piece comprises a columnar main body part and a flange plate formed at the lower end part of the columnar main body part; the spring is sleeved on the columnar main body part of the pressing piece and is positioned between the flange of the pressing piece and the top wall of the spring accommodating chamber.
According to another exemplary embodiment of the present invention, a positioning hole is formed on a top wall of the spring accommodating chamber, and an upper end of the cylindrical body portion of the pressing member is accommodated in the positioning hole.
According to another exemplary embodiment of the present invention, when the locking member is latched to the circuit board, the spring is compressed between the flange of the pressing member and the top wall of the spring accommodation chamber, and the lower end of the cylindrical body portion of the pressing member is pressed against the electronic device to prevent the electronic device from moving in the vertical direction.
According to another exemplary embodiment of the present invention, the modular fixing device further includes an outer housing, and the locking member is assembled into the receiving cavity of the outer housing such that the outer housing can be locked to the circuit board by the locking member.
According to another exemplary embodiment of the present invention, a positioning wall is formed at a lower portion of the outer case, and the body portion of the electronic device is adapted to be positioned between the positioning walls of the outer case.
According to another exemplary embodiment of the present invention, when the locking member is latched to the circuit board, the body portion of the electronic device is positioned between the positioning walls of the outer case to prevent the electronic device from moving in a horizontal direction.
According to another exemplary embodiment of the present invention, a first insertion hole is formed on the outer case, and a second insertion hole corresponding to the first insertion hole is formed on the locking member; inserting a plug into the first and second insertion holes to assemble the outer case and the locking member together.
According to another exemplary embodiment of the present invention, a vertically extending side plate portion is formed on the body portion of the lock member, and a vertically extending receiving groove is formed on a side wall of the outer housing, the side plate portion of the lock member being received in the receiving groove of the outer housing.
According to another exemplary embodiment of the present invention, a side plate portion extending vertically is formed on the body portion of the lock; the outer case is composed of two half cases between which the side plate portion of the locking piece is sandwiched; the two half-shells and the locking piece are assembled to each other by means of a plug inserted in the first and second receptacles.
According to another exemplary embodiment of the invention, the resilient catch extends downwardly from the side plate portion of the locking member and beyond the lower edge of the outer housing.
According to another exemplary embodiment of the present invention, the second insertion hole is formed on a side plate portion of the lock piece.
According to another exemplary embodiment of the present invention, a mounting opening is formed on the circuit board, a body portion of the electronic device is received in the mounting opening, and the soldering leg of the electronic device is supported on an upper surface of the circuit board.
According to another exemplary embodiment of the present invention, the resilient catch of the locking member is adapted to snap onto a lower edge portion of the mounting opening of the circuit board.
According to another exemplary embodiment of the present invention, the positioning wall of the outer case is located between the soldering legs of the electronic device and inserted into the mounting opening of the circuit board, thereby positioning the body portion of the electronic device in the mounting opening.
According to another exemplary embodiment of the present invention, the electronic device is a light emitting diode.
In the foregoing various exemplary embodiments according to this invention, each electronic device is secured using a separate modular fixture. The volume of each modular fixture is small. Therefore, when the electronic device is soldered to the circuit board, the soldering head does not interfere with the modular fixing device, and thus, soldering efficiency is improved.
Other objects and advantages of the present invention will become apparent from the following description of the invention which refers to the accompanying drawings, and may assist in a comprehensive understanding of the invention.
Drawings
FIG. 1 shows an exploded schematic view of a modular fixture according to an exemplary embodiment of the present invention;
FIG. 2 shows an assembled schematic view of a modular fixture according to an example embodiment of the invention;
FIG. 3 shows a cross-sectional view of the modular fixture of FIG. 2;
FIG. 4 shows a schematic view of a circuit board and an electronic device placed on the circuit board;
FIG. 5 shows a schematic view of an electronic device being mounted on a circuit board using the modular mounting apparatus of FIG. 2;
fig. 6 shows a cross-sectional view of the modular fixture and electronic device shown in fig. 5.
Detailed Description
The technical scheme of the invention is further specifically described by the following embodiments and the accompanying drawings. In the specification, the same or similar reference numerals denote the same or similar components. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the general inventive concept of the present invention and should not be construed as limiting the invention.
Furthermore, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the disclosure. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in schematic form in order to simplify the drawing.
According to one general technical concept of the present invention, there is provided a modular fixing apparatus adapted to fix a single electronic device on a circuit board, the modular fixing apparatus including: a locking member having at least two resilient snaps adapted to snap onto the circuit board; a pressing member adapted to press the electronic device on a surface of the circuit board; and a spring disposed between the locking member and the pressing member and adapted to apply a pressing force to the pressing member. When the locking member is latched to the circuit board, the electronic device is pressed against the circuit board by the pressing member.
FIG. 4 shows a schematic view of a circuit board and an electronic device placed on the circuit board; FIG. 5 shows a schematic view of an electronic device being secured to a circuit board using a modular securing apparatus; fig. 6 shows a cross-sectional view of the modular fixture and electronic device shown in fig. 5.
As shown in fig. 4, 5 and 6, in the illustrated embodiment, the modular fixture is adapted to secure a single electronic device 20 to a circuit board 10. Each modular fixture may secure one electronic device 20 to the circuit board 10. As shown in fig. 5 and 6, after the electronic device 20 is fixed on the circuit board 10 by the modular fixture, the soldering pins 21 of the electronic device 20 are located outside the modular fixture and are positioned at predetermined positions on the circuit board 10. The solder feet 21 of the electronic device 20 can then be soldered to the circuit board 10 by means of a solder head.
FIG. 1 shows an exploded schematic view of a modular fixture according to an exemplary embodiment of the present invention; FIG. 2 shows an assembled schematic view of a modular fixture according to an example embodiment of the invention; fig. 3 shows a cross-sectional view of the modular fixture of fig. 2.
As shown in fig. 1 to 6, in the illustrated embodiment, the modular fixing apparatus mainly includes a locking member 200, a pressing member 300, and a spring 400. The locking member 200 has at least two resilient latches 212 adapted to latch onto the circuit board 10. The pressing member 300 is adapted to press the electronic device 20 on the surface of the circuit board 10. The spring 400 is disposed between the locking member 200 and the pressing member 300 and adapted to apply a pressing force to the pressing member 300.
As shown in fig. 1 to 6, in the illustrated embodiment, when the locking member 200 is latched to the circuit board 10, the spring 400 is compressed between the locking member 200 and the pressing member 300 and applies a predetermined vertical downward pressing force to the pressing member 300. Thus, the electronic device 20 is reliably pressed against the circuit board 10 by the pressing member 300.
As shown in fig. 1 to 6, in the illustrated embodiment, the lock 200 includes a body portion 210, and each of the elastic catches 212 includes an elastic arm portion extending downward from the body portion 210 of the lock 200 and a catch portion at a tip end of the elastic arm portion.
As shown in fig. 4 to 6, in the illustrated embodiment, the hook portion of the elastic catch 212 of the lock member 200 is adapted to be caught to the lower edge portion of the mounting opening 11 of the circuit board 10.
As shown in fig. 3, in the illustrated embodiment, a spring accommodation chamber 201 is formed in the body portion 210 of the lock member 200, and the spring 400 is accommodated in the spring accommodation chamber 201. The pressing member 300 includes a cylindrical body portion 310 and a flange 311 formed at a lower end portion of the cylindrical body portion 310. The spring 400 is fitted over the cylindrical body portion 310 of the pressing member 300 and is located between the flange 311 of the pressing member 300 and the top wall of the spring accommodating chamber 201.
As shown in fig. 3, in the illustrated embodiment, one positioning hole 202 is formed in the top wall of the spring accommodating chamber 201, and the upper end of the columnar body portion 310 of the pressing member 300 is accommodated in the positioning hole 202.
As shown in fig. 3 and 6, in the illustrated embodiment, when the locking member 200 is latched to the circuit board 10, the spring 400 is compressed between the flange 311 of the pressing member 300 and the top wall of the spring receiving chamber 201, and the lower end of the cylindrical body portion 310 of the pressing member 300 is pressed against the electronic device 20 to prevent the electronic device 20 from moving in the vertical direction.
As shown in fig. 1-6, in the illustrated embodiment, the modular fixture further includes an outer housing 100. The locking member 200 is assembled into the receiving cavity 110 of the outer housing 100 so that the outer housing 100 can be locked to the circuit board 10 by the locking member 200.
As shown in fig. 1 to 6, in the illustrated embodiment, a positioning wall 112 is formed at a lower portion of the outer case 100, and the body portion of the electronic device 20 is adapted to be positioned between the positioning walls 112 of the outer case 100.
As shown in fig. 1 to 6, in the illustrated embodiment, when the locking member 200 is latched to the circuit board 10, the body portion of the electronic device 20 is positioned between the positioning walls 112 of the outer case 100 to prevent the electronic device 20 from moving in the horizontal direction.
As shown in fig. 1 to 3, in the illustrated embodiment, a first insertion hole 113 is formed in the outer case 100, and a second insertion hole 213 corresponding to the first insertion hole 113 is formed in the locking member 200. The insert pin 120 is inserted into the first and second insertion holes 113 and 213 so that the outer case 100 and the locking member 200 are assembled together.
In one embodiment of the present invention, as shown in fig. 1 to 3, a side plate portion 211 extending vertically is formed on the body portion 210 of the locking member 200, a receiving groove 111 extending vertically is formed on a side wall of the outer case 100, and the side plate portion 211 of the locking member 200 is received in the receiving groove 111 of the outer case 100.
In another embodiment of the present invention, as shown in fig. 1 to 3, a side plate portion 211 extending vertically is formed on the body portion 210 of the locking member 200. The outer case 100 is composed of two half cases between which the side plate portion 211 of the locking piece 200 is sandwiched. The two half-shells and the locking member 200 are assembled to each other by means of the latch 120 inserted into the first and second receptacles 113 and 213.
As shown in fig. 1 to 3, in the illustrated embodiment, the second insertion hole 213 is formed on the side plate portion 211 of the locking member 200. The resilient catch 212 extends downwardly from the side plate portion 211 of the lock 200 and beyond the lower edge of the outer housing 100.
As shown in fig. 4 to 6, in the illustrated embodiment, a mounting opening 11 is formed on the circuit board 10. The body portion of the electronic device 20 is accommodated in the mounting opening 11, and the soldering legs 21 of the electronic device 20 are supported on the upper surface of the circuit board 10.
As shown in fig. 4 to 6, in the illustrated embodiment, when the elastic catch 212 of the lock member 200 is caught to the lower edge portion of the mounting opening 11 of the circuit board 10, the electronic device 20 is fixed to the circuit board 10.
As shown in fig. 4 to 6, in the illustrated embodiment, the positioning wall 112 of the outer case 100 is located between the soldering legs 21 of the electronic device 20, and is inserted into the mounting opening 11 of the circuit board 10, thereby positioning the body portion of the electronic device 20 in the mounting opening 11.
In an exemplary embodiment of the present invention, the aforementioned electronic device 20 may be a light emitting diode. The light emitting diode has a flat body portion and a plurality of bonding legs 21 extending from both sides of the body portion. After the LED is secured to the circuit board by the modular fixture, the solder tails of the LED are soldered to the circuit board using solder joints. When welding, because the space that modularization fixing device occupy is very little, the soldered connection can not take place to interfere with modularization fixing device to can improve welding efficiency.
It will be appreciated by those skilled in the art that the embodiments described above are exemplary and can be modified by those skilled in the art, and that the structures described in the various embodiments can be freely combined without conflict in structure or principle.
Although the present invention has been described in connection with the accompanying drawings, the embodiments disclosed in the drawings are intended to be illustrative of preferred embodiments of the present invention and should not be construed as limiting the invention.
Although a few embodiments of the present general inventive concept have been shown and described, it will be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the general inventive concept, the scope of which is defined in the appended claims and their equivalents.
It should be noted that the word "comprising" does not exclude other elements or steps, and the words "a" or "an" do not exclude a plurality. Furthermore, any reference signs in the claims shall not be construed as limiting the scope of the invention.

Claims (17)

1. A modular fixture adapted to secure a single electronic device (20) to a circuit board (10), the modular fixture comprising:
a locking member (200) having at least two resilient snaps (212) adapted to snap onto the circuit board (10);
a pressing piece (300) adapted to press the electronic device (20) on a surface of the circuit board (10); and
a spring (400) disposed between the locking member (200) and the pressing member (300) and adapted to apply a pressing force to the pressing member (300),
when the locking member (200) is latched to the circuit board (10), the electronic device (20) is pressed on the circuit board (10) by the pressing member (300), and the soldering leg (21) of the electronic device (20) is located outside the modular fixture.
2. The modular fixture of claim 1, wherein:
the lock (200) includes a body portion (210), and each of the elastic catches (212) includes an elastic arm portion extending downward from the body portion (210) and a catch portion at a tip end of the elastic arm portion.
3. The modular fixture of claim 2, wherein:
a spring accommodation chamber (201) is formed in the body portion (210) of the lock member (200), and the spring (400) is accommodated in the spring accommodation chamber (201);
the pressing piece (300) comprises a columnar main body part (310) and a flange (311) formed at the lower end part of the columnar main body part (310);
the spring (400) is sleeved on the columnar main body part (310) of the pressing piece (300) and is positioned between the flange (311) of the pressing piece (300) and the top wall of the spring accommodating chamber (201).
4. The modular fixture as recited in claim 3, wherein:
a positioning hole (202) is formed in the top wall of the spring accommodating chamber (201), and the upper end of a cylindrical body portion (310) of the pressing member (300) is accommodated in the positioning hole (202).
5. The modular fixture as recited in claim 4, wherein:
when the locking member (200) is latched to the circuit board (10), the spring (400) is compressed between the flange (311) of the pressing member (300) and the top wall of the spring accommodating chamber (201), and the lower end of the cylindrical body portion (310) of the pressing member (300) is pressed against the electronic device (20) to prevent the electronic device (20) from moving in the vertical direction.
6. The modular fixture of claim 1, wherein:
the modular fixing device further includes an outer case (100), and the locking member (200) is assembled into the receiving cavity (110) of the outer case (100) such that the outer case (100) can be locked to the circuit board (10) by the locking member (200).
7. The modular fixture of claim 6, wherein:
a positioning wall (112) is formed at a lower portion of the outer case (100), and a body portion of the electronic device (20) is adapted to be positioned between the positioning walls (112) of the outer case (100).
8. The modular fixture of claim 7, wherein:
when the locking member (200) is latched to the circuit board (10), a body portion of the electronic device (20) is positioned between the positioning walls (112) of the outer case (100) to prevent the electronic device (20) from moving in a horizontal direction.
9. The modular fixture of claim 6, wherein:
a first insertion hole (113) is formed in the outer case (100), and a second insertion hole (213) corresponding to the first insertion hole (113) is formed in the lock member (200);
inserting a plug (120) into the first insertion hole (113) and the second insertion hole (213) to assemble the outer case (100) and the locking member (200) together.
10. The modular fixture of claim 9, wherein:
a side plate part (211) extending vertically is formed on the body part (210) of the locking piece (200), an accommodating groove (111) extending vertically is formed on the side wall of the outer shell (100), and the side plate part (211) of the locking piece (200) is accommodated in the accommodating groove (111) of the outer shell (100).
11. The modular fixture of claim 9, wherein:
a side plate part (211) extending vertically is formed on the main body part (210) of the locking piece (200);
the outer case (100) is composed of two half cases between which the side plate portion (211) of the locking piece (200) is clamped;
the two half-shells and the locking member (200) are assembled to each other by means of a plug (120) inserted into the first receptacle (113) and the second receptacle (213).
12. The modular fixture of claim 10 or 11, wherein:
the elastic catch (212) extends downward from the side plate portion (211) of the lock (200) and beyond the lower edge of the outer case (100).
13. The modular fixture of claim 10 or 11, wherein:
the second insertion hole (213) is formed in the side plate portion (211) of the locking member (200).
14. The modular fixture of claim 8, wherein:
a mounting opening (11) is formed in the circuit board (10), a body portion of the electronic component (20) is accommodated in the mounting opening (11), and the soldering legs (21) of the electronic component (20) are supported on an upper surface of the circuit board (10).
15. The modular fixture of claim 14, wherein:
the elastic catch (212) of the lock (200) is adapted to be caught to a lower edge portion of the mounting opening (11) of the circuit board (10).
16. The modular fixture of claim 14 or 15, wherein:
the positioning wall (112) of the outer case (100) is located between the soldering legs (21) of the electronic device (20) and inserted into the mounting opening (11) of the circuit board (10), thereby positioning the body portion of the electronic device (20) in the mounting opening (11).
17. The modular fixture of claim 1, wherein: the electronic device is a light emitting diode.
CN201711000575.3A 2017-10-24 2017-10-24 Modular fixing device Active CN109699127B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201711000575.3A CN109699127B (en) 2017-10-24 2017-10-24 Modular fixing device

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CN109699127B true CN109699127B (en) 2020-12-01

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3031516A1 (en) * 1980-08-21 1982-03-11 Hans Josef 8202 Bad Aibling Gärtner Dual in line component insertion and withdrawal tool - having thin gripping jaws backed up by spring clip
JPH0220095A (en) * 1988-07-08 1990-01-23 Oki Electric Ind Co Ltd Method and structure for attaching part using shape memory alloy
US5060846A (en) * 1990-04-23 1991-10-29 Motorola, Inc. Integrated load compensation device
JPH08195557A (en) * 1995-01-18 1996-07-30 Takaoka Electric Mfg Co Ltd Relay device for printed circuit board
US5566445A (en) * 1994-10-24 1996-10-22 Piao; Tseng S. IC mounting tool
JPH0964412A (en) * 1995-08-25 1997-03-07 Matsushita Electric Ind Co Ltd Holding member for electronic component
JPH09246798A (en) * 1996-03-08 1997-09-19 Hitachi Ltd Device for inserting or drawing out pin in or from connector without bending pin
JP2001127113A (en) * 1999-10-26 2001-05-11 Nec Corp Mounting structure for surface mount semiconductor device
CN201107329Y (en) * 2007-09-28 2008-08-27 全智科技股份有限公司 Contact chucking appliance of integrated circuit sorting machines
CN204994087U (en) * 2015-09-14 2016-01-20 天合汽车零部件(上海)有限公司 Circuit board electronic components mounting

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3031516A1 (en) * 1980-08-21 1982-03-11 Hans Josef 8202 Bad Aibling Gärtner Dual in line component insertion and withdrawal tool - having thin gripping jaws backed up by spring clip
JPH0220095A (en) * 1988-07-08 1990-01-23 Oki Electric Ind Co Ltd Method and structure for attaching part using shape memory alloy
US5060846A (en) * 1990-04-23 1991-10-29 Motorola, Inc. Integrated load compensation device
US5566445A (en) * 1994-10-24 1996-10-22 Piao; Tseng S. IC mounting tool
JPH08195557A (en) * 1995-01-18 1996-07-30 Takaoka Electric Mfg Co Ltd Relay device for printed circuit board
JPH0964412A (en) * 1995-08-25 1997-03-07 Matsushita Electric Ind Co Ltd Holding member for electronic component
JPH09246798A (en) * 1996-03-08 1997-09-19 Hitachi Ltd Device for inserting or drawing out pin in or from connector without bending pin
JP2001127113A (en) * 1999-10-26 2001-05-11 Nec Corp Mounting structure for surface mount semiconductor device
CN201107329Y (en) * 2007-09-28 2008-08-27 全智科技股份有限公司 Contact chucking appliance of integrated circuit sorting machines
CN204994087U (en) * 2015-09-14 2016-01-20 天合汽车零部件(上海)有限公司 Circuit board electronic components mounting

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