JPH0963088A - Optical pickup device - Google Patents

Optical pickup device

Info

Publication number
JPH0963088A
JPH0963088A JP21199695A JP21199695A JPH0963088A JP H0963088 A JPH0963088 A JP H0963088A JP 21199695 A JP21199695 A JP 21199695A JP 21199695 A JP21199695 A JP 21199695A JP H0963088 A JPH0963088 A JP H0963088A
Authority
JP
Japan
Prior art keywords
optical pickup
package
light source
power supply
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21199695A
Other languages
Japanese (ja)
Inventor
Haruji Manabe
晴二 真鍋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21199695A priority Critical patent/JPH0963088A/en
Publication of JPH0963088A publication Critical patent/JPH0963088A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To reduce undesired radiation in a power source circuit of a device by covering a high frequency superimposition power source circuit attached to a housing member of an optical pickup with a shield member. SOLUTION: A flexible printed circuit board(FPC) 70 is attached to the package 60 of the optical pickup by soldering, and the frame part 61 of the package 60 is inserted along between guide parts 51a, 51b of an attaching part 50 of an optical pickup device of a carriage. Then, the cap of the package 60 is inserted into the recessed part 52 of the attaching part 50, and the frame part 61 is abutted on the opposite end surface of the attaching part 50 to be screwed through a leaf spring 80. After the package 60 is positioned in such a state, the package 60 is stuck and fixed. Finally, the terminals 20 of the package 60 are inserted into the holes of the terminals 91 of the high frequency superimposition power source circuit 90 to be attached, and a shield plate 100 is slidden so as to cover the circuit 90, and the holes 103a-103d are engaged with engagement parts 53a-53d. Thus, the undesired radiation is reduced, and a malfunction is prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光素子、光ディスク等
への情報の記録又は再生を行う光ピックアップ装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical pickup device which records or reproduces information on an optical element, an optical disc or the like.

【0002】[0002]

【従来の技術】従来、レーザ光を利用して情報の記録や
再生を行う光ディスク装置のアクセス時間の短縮等の性
能向上のため小型化が望まれており、光学部品点数の削
減等により光ピックアップの小型化及び軽量化の試みが
行われている。またレーザ光のの出力の増大が求められ
レーザ光を安定して出射するために、光ピックアップの
駆動電源に高周波重畳電源回路を用いた光ピックアップ
装置がある。
2. Description of the Related Art Conventionally, there has been a demand for downsizing of an optical disk device which records and reproduces information by using a laser beam in order to improve performance such as shortening access time, and an optical pickup by reducing the number of optical parts. Attempts have been made to reduce the size and weight of the. Further, there is an optical pickup device that uses a high frequency superposed power supply circuit as a drive power supply for an optical pickup in order to stably output the laser light in order to increase the output of the laser light.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、前記従
来の構成では、高周波重畳電源回路からの不要輻射がシ
ールドできないという問題点を有していた。
However, the above-mentioned conventional structure has a problem that unnecessary radiation from the high frequency superimposed power supply circuit cannot be shielded.

【0004】本発明は光ピックアップ装置の不要輻射を
低減することを目的としている。
An object of the present invention is to reduce unnecessary radiation of an optical pickup device.

【0005】[0005]

【課題を解決するための手段】この目的を達成するため
に、光ピックアップの収納部材に取り付けられた高周波
重畳電源回路を覆うシールド部材を設けた構成を有して
いる。
To achieve this object, a shield member is provided to cover a high frequency superposed power supply circuit attached to a housing member of an optical pickup.

【0006】[0006]

【作用】この構成により、光ピックアップ装置の高周波
重畳電源回路の不要輻射を低減することができる。
With this configuration, it is possible to reduce unnecessary radiation of the high frequency superimposed power supply circuit of the optical pickup device.

【0007】[0007]

【実施例】以下本発明の一実施例の光ピックアップのパ
ッケージングについて図を参照しながら説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The packaging of an optical pickup according to an embodiment of the present invention will be described below with reference to the drawings.

【0008】図1は本発明の一実施例における光ピック
アップ装置の光ピックアップのパッケージの構成図であ
る。
FIG. 1 is a block diagram of an optical pickup package of an optical pickup device according to an embodiment of the present invention.

【0009】1は光源で、光源1としては半導体レー
ザ,He−Ne等のガスレーザ等の各種レーザが考えら
れる。ここではこれらの中で最も小型で装置全体を小型
化でき、しかも単価の安く数mW〜数十mW程度の出力
を有する半導体レーザを用いる事が好ましい。半導体レ
ーザの材質としてはAlGaAs,InGaAsP,I
nGaAlP,ZnSe,GaN等が考えられ、ここで
は最も一般的に用いられており、安価なAlGaAsを
用いた。さらに高密度記録を行う場合には記録媒体上で
のスポット径をより小さくすることができ、AlGaA
sよりもさらに波長の短いInGaAlPやZnSe等
の半導体レーザを用いることが好ましい。
Reference numeral 1 denotes a light source. As the light source 1, various lasers such as a semiconductor laser and a gas laser such as He-Ne can be considered. Here, it is preferable to use a semiconductor laser which is the smallest in size among them and can be downsized as a whole and which has a low unit price and an output of several mW to several tens mW. Semiconductor lasers made of AlGaAs, InGaAsP, I
nGaAlP, ZnSe, GaN, and the like are conceivable. Here, AlGaAs, which is most commonly used and is inexpensive, is used. Furthermore, when performing high-density recording, the spot diameter on the recording medium can be made smaller, and
It is preferable to use a semiconductor laser such as InGaAlP or ZnSe having a shorter wavelength than s.

【0010】2はブロックで、ブロック2は直方体形状
でその側面に突起部2aを有しており、上面には光源1
が取り付けられている。ブロック2は光源1を載置する
とともに、光源1で発生した熱を逃がす働きを有してい
る。ブロック2と光源1との接合には熱伝導率等を考慮
するとAu−Sn,Sn−Pb,In等の箔(厚さ数μ
m〜数十μm)を高温で圧着する方法を用いることが好
ましい。また光源1とブロック2は略水平に取り付けな
ければ光学系の収差の原因になる。従って接合の際には
光源1はブロック2に所定の位置に所定の高さで略水平
にマウントされることが好ましい。さらにブロック2の
上面には光源1の下面と電気的に接触するように電極面
3が設けられている。この電極面3は光源1の電源供給
用のもので、電極面3を構成する金属膜としては導電性
や耐食性を考慮してAuの薄膜を用いることが好まし
い。更にブロック2は、光源1で発生する熱や光源1と
の取付等の問題から、熱伝導性が高く、かつ、線膨張係
数が光源1のそれ(約6.5×10-6/℃)に近い材質
が好ましい。具体的には線膨張係数が3〜10×10 -6
/℃で、熱伝導率が100w/mK以上である物質、例
えばAlN,SiC,T−cBN,Cu/W,Cu/M
o,Si等を、特に高出力のレーザを用いる場合で熱伝
導率を非常に大きくしなければならないときにはダイア
モンド等を用いることが好ましい。また、特性値の要求
がさほど厳しくなくコストを重視して選択する場合は、
Mo,Cu,Fe,コバール,42アロイ等の材料を用
いることもできる。光源1とブロック2の線膨張係数が
同じか近い数値となるようにした場合、光源1とブロッ
ク2の間の歪みの発生を抑制することができるので、光
源1とブロック2との取付部分が外れたり、光源1にク
ラックが入る等の不都合を防止することができる。しか
しながら本範囲を外れた場合には、光源1とブロック2
の間に大きな歪みが生じてしまい、光源1とブロック2
との取付部分が外れたり、光源1にクラック等を生じる
可能性が高くなる。またブロック2の熱伝導率をできる
だけ大きく取ることにより、光源1で発生する熱を効率
よく外部に逃がすことができる。しかしながら熱伝導率
が本限定以下の場合には、光源1で発生した熱が外部に
逃げ難くなるため、光源1の温度が上昇し、光源1の出
力が低下したり、光源1の寿命が短くなったり、最悪の
場合には光源1が破壊されてしまう等の不都合が発生し
やすくなる。本実施例では比較的安価で、これらの2つ
の特性のどちらにも非常に優れたAlNを用いた。更に
ブロック2の上面には光源1との接合性を良くするため
に、ブロック2から光源1に向かってTi,Pt,Au
の順に薄膜を形成することが好ましい。
2 is a block, and the block 2 is a rectangular parallelepiped.
Has a protrusion 2a on its side surface, and has a light source 1 on its upper surface.
Is attached. The block 2 mounts the light source 1
At the same time, it has the function of releasing the heat generated by the light source 1.
You. Consider the thermal conductivity when joining the block 2 and the light source 1.
Then, foils such as Au-Sn, Sn-Pb, In (thickness μ
m to several tens of μm) is preferably used by pressure bonding at high temperature.
Good. Also, the light source 1 and the block 2 should not be installed substantially horizontally.
If so, it will cause aberration of the optical system. Therefore, when joining
The light source 1 is substantially horizontal at a predetermined position on the block 2 at a predetermined height.
It is preferably mounted on. Further in block 2
The upper surface has an electrode surface so as to make electrical contact with the lower surface of the light source 1.
3 are provided. The electrode surface 3 supplies power to the light source 1.
The metal film forming the electrode surface 3 is electrically conductive.
It is preferable to use a thin film of Au in consideration of corrosion resistance
Yes. Further, the block 2 includes heat generated by the light source 1 and the light source 1.
Due to problems such as mounting of the
The number is that of the light source 1 (about 6.5 × 10-6Material close to
Is preferred. Specifically, the coefficient of linear expansion is 3 to 10 × 10. -6
A substance with a thermal conductivity of 100 w / mK or more at / ° C, eg
For example, AlN, SiC, T-cBN, Cu / W, Cu / M
o, Si, etc., especially when a high-power laser is used,
When you need to increase the conductivity very much,
It is preferable to use mond or the like. Also, request for characteristic values
However, if you are not so strict and choose with a focus on cost,
Uses materials such as Mo, Cu, Fe, Kovar, 42 alloy
You can also The linear expansion coefficient of light source 1 and block 2 is
If the values are the same or close, light source 1 and block
It is possible to suppress the generation of distortion between
The mounting portion between the source 1 and the block 2 may come off or the light source 1 may
It is possible to prevent inconveniences such as a rack entering. Only
However, if it goes out of this range, the light source 1 and the block 2
Between the light source 1 and the block 2
The mounting part with and comes off, and the light source 1 is cracked.
The likelihood increases. Moreover, the thermal conductivity of the block 2 can be obtained.
The heat generated by the light source 1 can be efficiently
Can be easily escaped to the outside. However, thermal conductivity
If this is below this limitation, the heat generated by the light source 1
Since it is difficult to escape, the temperature of the light source 1 rises and the light source 1
The power is reduced, the life of the light source 1 is shortened,
In such a case, the inconvenience such as the light source 1 being destroyed may occur.
It will be easier. These two are relatively inexpensive in this embodiment.
AlN, which is very excellent in both of the above characteristics, was used. Further
To improve the bondability with the light source 1 on the upper surface of the block 2.
From the block 2 toward the light source 1, Ti, Pt, Au
It is preferable to form a thin film in this order.

【0011】5は光ガイド部材で、光ガイド部材5は直
方体形状をしており、その内部には複数の斜面及びそれ
らの斜面上に形成された各種膜よりなる光素子を有して
おり、光源1から射出された光が入射し光素子を経由し
て出射するとともに、戻ってきた光を所定の位置に導く
働きを有している。また光ガイド部材5はその側面でブ
ロック2の突起部2aに接着されている。これに用いら
れる接合材には大きな接着強度,任意の瞬間に固定でき
る作業性,硬化前と硬化後の体積の変化や温度・湿度の
変化による体積の変化が小さい即ち低収縮率等の条件が
要求され、これらを満たすことにより作業性及び接合面
の安定性等を向上させることができる。この様な接合材
としてここでは紫外線を照射することにより瞬時に硬化
するUV接着剤を用いた。また吸湿硬化型の瞬間接着剤
を用いても良い。更に十分な取り付け強度を持つように
するためにブロック2と光ガイド部材5の間の接触面積
(S)はS>1mm2とすることが好ましい。
Reference numeral 5 is a light guide member, and the light guide member 5 has a rectangular parallelepiped shape, and has therein an optical element having a plurality of slopes and various films formed on the slopes. The light emitted from the light source 1 enters and is emitted via the optical element, and has a function of guiding the returned light to a predetermined position. Further, the light guide member 5 is adhered to the protrusion 2a of the block 2 on its side surface. The bonding material used for this purpose must have conditions such as high adhesive strength, workability that can be fixed at any moment, small changes in volume due to changes in volume before and after curing and changes in temperature and humidity, that is, low shrinkage. It is required, and by satisfying these, workability and stability of the joint surface can be improved. Here, a UV adhesive which is instantly cured by irradiating ultraviolet rays is used as such a bonding material. Further, a moisture-absorbing and curing instant adhesive may be used. Further, in order to have sufficient attachment strength, the contact area (S) between the block 2 and the light guide member 5 is preferably S> 1 mm 2 .

【0012】13は受光素子で、受光素子13は板形状
の半導体ウェハーに形成された各種の電気回路で構成さ
れており、光ガイド部材5の底面に取り付けられてい
る。受光素子13と光ガイド部材5との取り付けについ
ては、大きな接着強度,任意の瞬間に固定できる作業
性,硬化前と硬化後の体積の変化や温度・湿度による体
積の変化が小さい即ち低収縮率等の条件が要求され、こ
れらを満たすことにより、作業性、接合面の安定性が向
上する。この様な接合材としてここでは紫外線を照射す
ることにより瞬時に硬化するため特に作業性が良好なU
V接着剤を用いた。なお吸湿硬化型の瞬間接着剤を用い
ても良い。また受光素子13は光源1から出射され、光
ガイド部材5や記録媒体等を経由してきた光信号を受光
する受光部を複数有している。この受光部で検知された
光信号は、その光量に応じて電気信号に変換される。こ
の電気信号は変換当初は電流値の大きさである。しかし
ながらこの電流は非常に微弱であり、かつノイズを拾い
やすいという性質がある。このためここでは受光素子1
3として、電流値を相関する電圧値に変換して増幅する
働きを持つI−Vアンプが形成されているものを用いる
ことが好ましい。ただし光の入射周波数に対して出力電
圧の応答が良好であることが要求される。更に受光素子
13の表面には受光した情報を信号として取り出すため
のAl等の薄膜で構成された複数の電極(図示せず)が
設けてある。
Reference numeral 13 denotes a light receiving element, which is composed of various electric circuits formed on a plate-shaped semiconductor wafer, and is attached to the bottom surface of the light guide member 5. Regarding attachment of the light receiving element 13 and the light guide member 5, there is a large adhesive strength, workability that can be fixed at an arbitrary moment, change in volume before and after curing and change in volume due to temperature and humidity are small, that is, low shrinkage rate Conditions such as the above are required, and by satisfying these conditions, workability and stability of the joint surface are improved. As such a bonding material, U which has particularly good workability because it is instantly cured by being irradiated with ultraviolet rays.
V adhesive was used. Note that a moisture-absorbing-curing instant adhesive may be used. Further, the light receiving element 13 has a plurality of light receiving portions for receiving the optical signal emitted from the light source 1 and passing through the light guide member 5 and the recording medium. The light signal detected by the light receiving unit is converted into an electric signal according to the light amount. This electric signal has the magnitude of the current value at the beginning of the conversion. However, this current is very weak and has a property of easily picking up noise. Therefore, here, the light receiving element 1
As 3, it is preferable to use an IV amplifier having a function of converting a current value into a correlated voltage value and amplifying it. However, it is required that the response of the output voltage be good with respect to the incident frequency of light. Further, the surface of the light receiving element 13 is provided with a plurality of electrodes (not shown) made of a thin film of Al or the like for taking out the received information as a signal.

【0013】4は基台で、基台4は光源1で発生し伝導
によりブロック2を通って伝わってきた熱を外部に放出
する働きを有するとともに、光ピックアップを形成する
ブロック2や光ガイド部材5,受光素子13等の種々の
部材が配設される。ブロック2と光ガイド部材5との配
設面を囲う略長方形の長軸方向を基台4の部材配設平面
の長軸A方向と略平行に配設する。ブロック2は半田箔
の使用、ロウ付け等により基台4の上面に固定される。
基台4の材質としては、熱伝導性が高いセラミック系と
して例えばAlNやAl23等で形成される。本実施例
では特に熱伝導率の高いAlNを用いたが、コストを優
先させる必要がある場合にはAl23を用いることが安
価であるので好ましい。またその構造はセラミックの基
板を3枚張り合わせたもので、上から順に基板4a,4
b,4cとなっている。それぞれの基板4a,4b,4
cには、受光素子13からの電気信号や光源1の電源の
供給等に用いるパターンが上面,底面及び側面(スルー
ホール等)にプリントされている。基台4の底面には受
光素子13の位置合わせ用の孔4dが設けられている。
Reference numeral 4 denotes a base, and the base 4 has a function of releasing the heat generated in the light source 1 and transmitted through the block 2 by conduction to the outside, and at the same time, the block 2 and an optical guide member forming an optical pickup. 5, various members such as the light receiving element 13 are provided. The long-axis direction of the substantially rectangular shape surrounding the arrangement surface of the block 2 and the light guide member 5 is arranged substantially parallel to the long-axis A direction of the member arrangement plane of the base 4. The block 2 is fixed to the upper surface of the base 4 by using solder foil or brazing.
The base 4 is made of, for example, AlN or Al 2 O 3 which is a ceramic material having high thermal conductivity. In this embodiment, AlN having a particularly high thermal conductivity is used, but when cost needs to be prioritized, it is preferable to use Al 2 O 3 because it is inexpensive. The structure is made by laminating three ceramic substrates, and the substrates 4a, 4
b and 4c. Each substrate 4a, 4b, 4
In c, a pattern used for supplying an electric signal from the light receiving element 13 and the power supply of the light source 1 is printed on the top surface, bottom surface and side surface (through hole etc.). A hole 4d for positioning the light receiving element 13 is provided on the bottom surface of the base 4.

【0014】20は端子で、端子20は光源1への電源
を供給するものである。2本の端子20は基板4cの下
面の電極にロウ付けされたものであり、基板4a,4
b,4cに設けられたピン若しくはスルーホール等を経
由して基板4aの上面に形成された電極と電気的につな
がり、さらに光源1への電源供給は、基板4a上に形成
された電極と、光源1の上面に形成された電極(図示せ
ず)及び光源1の底面と電気的に接続しているブロック
2の上面に形成された電極面3とをワイヤボンディング
することにより行われる。
Reference numeral 20 denotes a terminal, and the terminal 20 supplies power to the light source 1. The two terminals 20 are brazed to the electrodes on the lower surface of the substrate 4c, and
b, 4c are electrically connected to the electrodes formed on the upper surface of the substrate 4a through pins or through holes provided on the substrates 4c, and the power supply to the light source 1 is performed by the electrodes formed on the substrate 4a. This is performed by wire bonding an electrode (not shown) formed on the upper surface of the light source 1 and an electrode surface 3 formed on the upper surface of the block 2 electrically connected to the bottom surface of the light source 1.

【0015】また光源1には光軸に関して高い精度が要
求されるので、ブロック2の上面は高い精度で水平であ
ることが好ましい。従ってブロック2及び基台4の取り
付けについても細心の注意を払うことが好ましい。
Since the light source 1 is required to have high accuracy with respect to the optical axis, the upper surface of the block 2 is preferably horizontal with high accuracy. Therefore, it is preferable to pay close attention to the attachment of the block 2 and the base 4.

【0016】22はキャップで、キャップ22は光ガイ
ド部材5を覆うように設けられ、光ガイド部材5から出
た光が出射しそして光ディスクで反射した戻り光が入射
する開口部22aが設けられており、パッケージングの
内部にごみやほこり等が入り、光ガイド部材5や受光素
子13等に問題が発生するのを防止する働きがある。キ
ャップ22の材質としては金属系若しくは樹脂等で、基
台4との接合が容易にでき、形状が安定しているもので
あればどのようなものでも構わない。特にキャップ22
を金属製とした場合には、高周波重畳電源回路等が発す
る不要輻射を抑える働きが期待されるので、キャップ2
2はFe・Ni・Co合金,42アロイ,Cu等の金属
で形成することが好ましい。本実施例では、Fe・Ni
・Co合金を用い、シームウェルドにより基台4上のリ
ング4eに溶接される。
Reference numeral 22 denotes a cap, which is provided so as to cover the light guide member 5 and has an opening 22a through which the light emitted from the light guide member 5 is emitted and the return light reflected by the optical disk is incident. Therefore, it has a function of preventing dust and the like from entering the inside of the packaging and causing a problem in the light guide member 5, the light receiving element 13, and the like. The cap 22 may be made of any material such as metal or resin as long as it can be easily joined to the base 4 and has a stable shape. Especially the cap 22
When the metal is made of metal, it is expected that the unnecessary radiation generated by the high frequency superposed power supply circuit will be suppressed.
2 is preferably formed of a metal such as Fe / Ni / Co alloy, 42 alloy, or Cu. In this embodiment, Fe.Ni
-Co alloy is welded to the ring 4e on the base 4 by seam welding.

【0017】16はカバー部材で、カバー部材16はガ
ラス材よりなりキャップ22の開口部22aを塞ぎ、光
ガイド部材5や受光素子13等にごみ,ほこり等が付着
するのを防止するもので、ガラス接着剤によりキャップ
22に取り付けられている。更にカバー部材16の上下
両面には反射防止のためにMgF2等の材質で反射防止
膜を形成している。ただしカバー部材16の表面での反
射があまり問題にならない場合には、反射防止膜は設け
なくとも良い。
Reference numeral 16 denotes a cover member, which is made of a glass material and closes the opening 22a of the cap 22 so as to prevent dust and the like from adhering to the light guide member 5 and the light receiving element 13. It is attached to the cap 22 with a glass adhesive. Further, an antireflection film made of a material such as MgF 2 is formed on both upper and lower surfaces of the cover member 16 to prevent reflection. However, if the reflection on the surface of the cover member 16 does not matter so much, the antireflection film may not be provided.

【0018】カバー部材16と光ガイド部材5との位置
関係は、両者を接触させる場合と両者の間に空間を設け
る場合とが考えられる。両者を接触させる場合、光ガイ
ド部材5はカバー部材16の底部にエポキシ系の接着剤
やUV接着剤等で取り付けられる。この時のカバー部材
16の厚さ(t1)を0.3≦t1≦3.0(mm)と
することが好ましい。この理由は、下限についてはこれ
以上薄くすると取り付けられている光ガイド部材5等の
重さや、接着剤が固まる際の張力等にカバー部材16が
耐えられず破損する恐れがあるためである。また上限に
ついては、カバー部材16は空気に比べて屈折率が大き
いため光に収束作用が生まれ、光が広がらないので、結
果としてカバー部材16とコリメータレンズ(無限系光
学系の場合)或いは対物レンズ(有限系光学系の場合)
との距離を長くせざるを得ないくなってしまい、ピック
アップユニットの小型化に不利になるからである。この
様な構成を用いることにより光ピックアップのパッケー
ジングの高さをより低くでき、十分な取付強度を保ちな
がらもピックアップユニットを小型化することができ
る。
As for the positional relationship between the cover member 16 and the light guide member 5, it is considered that the cover member 16 and the light guide member 5 are brought into contact with each other and a space is provided between them. When the two are brought into contact, the light guide member 5 is attached to the bottom of the cover member 16 with an epoxy-based adhesive or a UV adhesive. At this time, the thickness (t1) of the cover member 16 is preferably 0.3 ≦ t1 ≦ 3.0 (mm). The reason for this is that if the lower limit is made thinner than this, the cover member 16 may not be able to withstand the weight of the light guide member 5 or the like attached thereto or the tension when the adhesive is hardened, and may be damaged. Regarding the upper limit, since the cover member 16 has a larger refractive index than air, a converging action is generated on the light and the light does not spread. As a result, the cover member 16 and the collimator lens (in the case of an infinite optical system) or the objective lens (In case of finite optical system)
This is because there is no choice but to lengthen the distance between and, which is disadvantageous for downsizing the pickup unit. By using such a structure, the height of the packaging of the optical pickup can be further reduced, and the pickup unit can be downsized while maintaining sufficient mounting strength.

【0019】これに対して両者の間に空間を設ける場合
は、カバー部材16の厚さ(t2)を0.1≦t2≦
3.0(mm),カバー部材16と光ガイド部材5との
間の距離(d)を同じく0.1≦d≦3.0(mm)と
することが好ましい。この理由はt2の下限については
前例とは違って光ガイド部材5が取り付けられておら
ず、ただ振動等の外部要因にさえ耐えられればよいから
である。またdについては、小さければ小さい程良いの
だが、組立時の精度の誤差を0.1mm以下にできない
可能性があり、この場合組立時にカバー部材16が光ガ
イド部材5に接触し、破損してしまう恐れがある。この
様な構成を用いることにより光ガイド部材5と、光源
1,ブロック2の間の取り付け相対位置精度を向上させ
つつブロック2を他の部材に熱的に接触させることが可
能であり、これにより光源1で発生する熱を外部に容易
に放出することができる。
On the other hand, when a space is provided between the two, the thickness (t2) of the cover member 16 should be 0.1≤t2≤.
3.0 (mm), and the distance (d) between the cover member 16 and the light guide member 5 is also preferably 0.1 ≦ d ≦ 3.0 (mm). The reason for this is that the lower limit of t2 is different from the previous example in that the light guide member 5 is not attached, and it is only necessary to withstand external factors such as vibration. Also, as for d, the smaller the better, the better. However, there is a possibility that the accuracy error during assembly cannot be reduced to 0.1 mm or less. In this case, the cover member 16 comes into contact with the light guide member 5 during assembly and breaks. There is a risk that it will. By using such a configuration, it is possible to bring the block 2 into thermal contact with other members while improving the mounting relative position accuracy between the light guide member 5 and the light source 1 and the block 2. The heat generated by the light source 1 can be easily released to the outside.

【0020】なお光ピックアップのパッケージの内部は
光源1及び受光素子13の酸化防止等の観点から、酸化
防止ガスとして乾燥したN2等のガスやAr,Ne,H
e等の不活性ガスを充填してもよい。
From the viewpoint of preventing oxidation of the light source 1 and the light receiving element 13, the inside of the package of the optical pickup is dry gas such as N 2 or Ar, Ne, H as an antioxidant gas.
An inert gas such as e may be filled.

【0021】以上示してきた構成を用いることにより、
光源1で発生する熱を容易に外部に放出することがで
き、光源1及び受光素子13等の酸化防止を行うことが
でき長期間安定して動作させることができる。また光学
系においては光源1,光ガイド部材5及び受光素子13
の相対的な位置関係を正しくかつ強固に保持することが
できるので、それらの位置のずれによる誤動作や余分な
光学的収差等が発生しない光ピックアップのパッケージ
ができる。
By using the configuration shown above,
The heat generated by the light source 1 can be easily released to the outside, the light source 1 and the light receiving element 13 can be prevented from being oxidized, and stable operation can be achieved for a long period of time. In the optical system, the light source 1, the light guide member 5, and the light receiving element 13
Since the relative positional relationship of the optical pickups can be held correctly and firmly, it is possible to provide an optical pickup package in which malfunctions due to the displacement of the positions and extra optical aberration do not occur.

【0022】図2は本発明の一実施例における光ピック
アップ装置の組立斜視図、図3は本発明の一実施例にお
ける光ピックアップ装置のシールド要部拡大組立図で、
図2、図3により光ピックアップ装置の組立構造を説明
する。
FIG. 2 is an assembly perspective view of an optical pickup device according to one embodiment of the present invention, and FIG. 3 is an enlarged assembly view of a shield main part of the optical pickup device according to one embodiment of the present invention.
The assembly structure of the optical pickup device will be described with reference to FIGS.

【0023】50は光ピックアップ装置の取付部で、取
付部50は光ディスク装置のキャリッジの一部に設けら
れ、取付部50の両端部には端面に沿ってガイド部51
a、51bが設けられ、ガイド部51aとガイド部51
bとの間の端部の中央部に切り欠かれた凹部52が設け
られ、凹部52の両端部の端面にはネジ孔(図示せず)
が設けられ、取付部50の上下面に突起状の係止部53
a、53b、53c、53dが設けられている。60は
光ピックアップのパッケージで、パッケージ60の中に
は光源1、光ガイド部材5、受光素子13等が収納さ
れ、底面には光源1に電源を供給する端子20と光ピッ
クアップの信号の入出力用の端子(図示せず)が設けら
れ、両端部には鍔部61が設けられている。70はFP
Cで、FPC70はパッケージ60の端子と接続し光ピ
ックアップと光ディスク装置の駆動部及び制御部等とを
パッケージ60の端子を介して電気的に接続する。80
は板バネで、板バネ80の両端には孔を有する取付部8
1a、81bが設けられ、中央部には取付部81a、8
1bとスリットによって区分された略くの字状の舌部8
2が設けられている。板バネ80はステンレス鋼、りん
青銅等の弾性部材よりなり、本実施例ではステンレス鋼
を用いた。85a、85bは板バネ80の取り付け用の
ネジである。90は高周波重畳電源回路で、高周波重畳
電源回路90にはパッケージ60の端子20が挿入され
接続される孔あきの電源供給用の端子91とFPC70
と接続され信号等の入出力用の端子92が設けられてい
る。100はシールド板で、シールド板100は折曲げ
られ略コの字状をし上面101、下面102には取付部
50の係止部53a、53b、53c、53dと係合す
る孔103a、103b、103c、103dが設けら
れ、上面101、下面102の開放端側の中央部には凸
部104、105が形成されている。シールド板100
の材料はシールド効果のある銅、ステンレス鋼、鉄等の
金属材料が用いられるが、弾性をもつ金属材料がなお望
ましい、本実施例ではステンレス鋼を用いた。
Reference numeral 50 denotes a mounting portion of the optical pickup device. The mounting portion 50 is provided on a part of the carriage of the optical disk device, and both end portions of the mounting portion 50 have guide portions 51 along the end faces.
a and 51b are provided, and the guide portion 51a and the guide portion 51 are provided.
A notched concave portion 52 is provided at the center of the end portion between the concave portion 52b and b, and screw holes (not shown) are provided at the end faces of both end portions of the concave portion 52.
Is provided, and the projection-like locking portions 53 are provided on the upper and lower surfaces of the mounting portion 50.
a, 53b, 53c, 53d are provided. Reference numeral 60 denotes an optical pickup package, in which the light source 1, the light guide member 5, the light receiving element 13 and the like are housed in the package 60, and the terminal 20 for supplying power to the light source 1 and the input / output of signals of the optical pickup are provided on the bottom surface. Terminals (not shown) are provided, and flange portions 61 are provided at both ends. 70 is FP
At C, the FPC 70 is connected to the terminal of the package 60, and the optical pickup and the drive unit and control unit of the optical disk device are electrically connected via the terminal of the package 60. 80
Is a leaf spring, and the mounting portion 8 having holes at both ends of the leaf spring 80.
1a and 81b are provided, and the mounting portions 81a and 8 are provided at the center.
1b and slit-shaped tongue portion 8 divided by a slit
2 are provided. The leaf spring 80 is made of an elastic member such as stainless steel or phosphor bronze, and stainless steel is used in this embodiment. Reference numerals 85a and 85b are screws for mounting the leaf spring 80. Reference numeral 90 denotes a high frequency superposed power supply circuit. The high frequency superposed power supply circuit 90 has a perforated power supply terminal 91 to which the terminal 20 of the package 60 is inserted and connected, and the FPC 70.
A terminal 92 for inputting / outputting signals and the like is provided. Reference numeral 100 denotes a shield plate, and the shield plate 100 is bent to have a substantially U-shape, and the upper surface 101 and the lower surface 102 have holes 103a, 103b for engaging with the locking portions 53a, 53b, 53c, 53d of the mounting portion 50, respectively. 103c and 103d are provided, and convex portions 104 and 105 are formed at the central portions of the upper surface 101 and the lower surface 102 on the open end side. Shield plate 100
Although a metal material having a shielding effect, such as copper, stainless steel, and iron, is used as the material of (1), a metal material having elasticity is still preferable. In this embodiment, stainless steel was used.

【0024】つぎに光ピックアップ装置の組立について
説明する。FPC70を光ピックアップのパッケージ6
0の所定の位置に半田付け、クリーム半田付け等で取り
付け、光ピックアップのパッケージ60の鍔部61をキ
ャリッジの光ピックアップ装置の取付部50のガイド部
51a、51bの間に沿して挿入し、パッケージ60の
キャップ22を取付部50の凹部52に挿入し、鍔部6
1を取付部50の対向端面に当接させる。つぎに板バネ
80の舌部82はFPC70を介してパッケージ60の
底面を押圧し、ネジ85a、85bを板バネ80の取付
部81a、81bに設けられている孔に挿入しキャリッ
ジの取付部50に設けられたネジ孔に締め付け板バネ8
0をキャリッジに取り付ける。この状態で実際に光ディ
スクのデータを読み、再生信号の出力値、品質等により
パッケージ60を位置決めする。その後パッケージ60
と取付部50とを接着固定する。最後に高周波重畳電源
回路90の電源供給用の端子91の孔にパッケージ60
の端子20を挿入し半田付けで取り付ける。つぎにシー
ルド板100を高周波重畳電源回路90を覆うようにス
ライドさせキャリッジの突起状の係止部53a、53
b、53c、53dにシールド板100の孔103a、
103b、103c、103dを係合させシールド板1
00の弾性力によりキャリッジの取付部50の所定の位
置に取り付けられる。本実施例においてシールド板10
0は凸部104、105を設け高周波重畳電源回路90
及びパッケージ60もを覆うことで光ピクアップをもシ
ールドした。
Next, the assembly of the optical pickup device will be described. FPC70 optical pickup package 6
It is attached to a predetermined position of 0 by soldering, cream soldering or the like, and the flange portion 61 of the optical pickup package 60 is inserted along the guide portions 51a and 51b of the attachment portion 50 of the optical pickup device of the carriage, Insert the cap 22 of the package 60 into the recess 52 of the mounting portion 50, and
1 is brought into contact with the opposite end surface of the mounting portion 50. Next, the tongue portion 82 of the leaf spring 80 presses the bottom surface of the package 60 via the FPC 70, and the screws 85a and 85b are inserted into the holes provided in the attachment portions 81a and 81b of the leaf spring 80 to attach the carriage attachment portion 50. The leaf spring 8 tightened in the screw hole provided in
Attach 0 to the carriage. In this state, the data on the optical disk is actually read, and the package 60 is positioned according to the output value, quality, etc. of the reproduction signal. Then package 60
And the attachment portion 50 are adhesively fixed. Finally, the package 60 is placed in the hole of the power supply terminal 91 of the high frequency superimposed power supply circuit 90.
Insert the terminal 20 and attach it by soldering. Next, the shield plate 100 is slid so as to cover the high frequency superimposed power supply circuit 90, and the protrusion-shaped locking portions 53a, 53 of the carriage are provided.
b, 53c, 53d, the holes 103a of the shield plate 100,
Shield plate 1 by engaging 103b, 103c, 103d
The elastic force of 00 causes the carriage to be mounted at a predetermined position on the mounting portion 50. In this embodiment, the shield plate 10
0 is provided with the convex portions 104 and 105, and the high frequency superimposed power supply circuit 90
Also, the package 60 is covered to shield the light pick-up.

【0025】尚、本実施例ではパケージ60を板バネ8
0で取り付けたが、ネジ等他の手段を用いてもよいこと
は言うまでもない。また、シールド板100はシールド
板100の弾性力と孔103a、103b、103c、
103dとでキャリッジに係合したが、接着剤、ネジ等
他の手段を用いてもよく、本発明は上記した実施例に限
定されるものではない。
In this embodiment, the package 60 is replaced by the leaf spring 8.
Although it was attached at 0, it goes without saying that other means such as screws may be used. Further, the shield plate 100 has the elastic force of the shield plate 100 and the holes 103a, 103b, 103c,
Although the carriage is engaged with 103d, other means such as an adhesive or a screw may be used, and the present invention is not limited to the above embodiment.

【0026】本実施例では、光ピックアップの電源供給
用の端子20を基台4の下部に配したことにより、光源
1と高周波重畳電源回路90との間の接続に要する距離
を短くでき、電源線や信号線等の引き回しにより高周波
重畳電源回路90から発せられる不要輻射を抑制でき、
そして一つのシールド板100で一度に高周波重畳電源
回路90と光ピックアップとをシールドすることができ
るので高周波重畳電源回路90から発せられる不要輻射
をさらに抑制でき、シールド効果が向上するとともに、
他装置からの不要輻射による受光素子13の誤動作を抑
制でき、光ピックアップ装置の動作の信頼性が向上し、
かつ光ピックアップ装置の組立が容易になる。
In this embodiment, the terminal 20 for supplying power to the optical pickup is arranged at the bottom of the base 4, so that the distance required for connection between the light source 1 and the high frequency superposed power supply circuit 90 can be shortened, and the power supply can be shortened. Unnecessary radiation emitted from the high frequency superimposed power supply circuit 90 can be suppressed by arranging wires and signal lines,
Since one shield plate 100 can shield the high-frequency superposed power supply circuit 90 and the optical pickup at a time, unnecessary radiation emitted from the high-frequency superposed power supply circuit 90 can be further suppressed, and the shield effect is improved.
Malfunction of the light receiving element 13 due to unnecessary radiation from other devices can be suppressed, and reliability of operation of the optical pickup device is improved,
In addition, the assembly of the optical pickup device becomes easy.

【0027】[0027]

【発明の効果】本発明は、高周波重畳電源回路をシール
ド板で覆う構成をとることで、高周波重畳電源回路のシ
ールド効果が向上し不要輻射が減るので、電気信号にノ
イズがのるの防ぐことができ光ディスク装置の誤動作を
防ぐとともに、他の電気製品の誤動作を防ぐことのでき
る、さらに光ピックアップのパッケージをもシールド板
で覆う構成をとることで、光ッピクアップの誤動作を抑
制することができ、信頼性の高い優れた光ピックアップ
装置を実現できるものである。
According to the present invention, by covering the high frequency superposed power supply circuit with a shield plate, the shielding effect of the high frequency superposed power supply circuit is improved and unnecessary radiation is reduced, so that noise is prevented from being added to an electric signal. It is possible to prevent the malfunction of the optical disk device and prevent malfunction of other electric products.Furthermore, by taking the configuration of covering the package of the optical pickup with the shield plate, it is possible to suppress the malfunction of the optical pickup. It is possible to realize an excellent optical pickup device with high reliability.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例における光ピックアップ装置
の光ピックアップのパッケージの構成図
FIG. 1 is a configuration diagram of an optical pickup package of an optical pickup device according to an embodiment of the present invention.

【図2】本発明の一実施例における光ピックアップ装置
の組立斜視図
FIG. 2 is an assembled perspective view of an optical pickup device according to an embodiment of the present invention.

【図3】本発明の一実施例における光ピックアップ装置
のシールド要部拡大組立図
FIG. 3 is an enlarged assembly view of a shield main part of an optical pickup device according to an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 光源 2 ブロック 2a 突起部 3 電極面 4 基台 4a、4b、4c 基板 4d 孔 4e リング 5 光ガイド部材 13 受光素子 16 カバー部材 20 端子 22 キャップ 22a 開口部 50 取付部 51a、51b ガイド部 52 凹部 53a、53b 係止部 60 パッケージ 61 鍔部 70 FPC 80 板バネ 81a、81b 取付部 82 舌部 85a、85b ネジ 90 高周波重畳電源回路 91、92 端子 100 シールド板 101 上面 102 下面 103a、103b、103c 孔 104、105 凸部 1 light source 2 block 2a protrusion 3 electrode surface 4 base 4a, 4b, 4c substrate 4d hole 4e ring 5 light guide member 13 light receiving element 16 cover member 20 terminal 22 cap 22a opening 50 mounting portion 51a, 51b guide portion 52 concave portion 53a, 53b Locking part 60 Package 61 Collar part 70 FPC 80 Leaf spring 81a, 81b Attachment part 82 Tongue part 85a, 85b Screw 90 High frequency superposed power circuit 91, 92 Terminal 100 Shield plate 101 Upper surface 102 Lower surface 103a, 103b, 103c Hole 104, 105 convex

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】光源と光学素子を有する光ガイド部材と受
光した光信号を電気信号に変換する受光手段とを有する
光ピックアップと、前記光ピックアップを収容し前記光
ピックアップの信号の入出力用の端子を有する収納部材
と、前記収納部材の端子と接続する高周波重畳電源回路
と、前記高周波重畳電源回路を覆い不要輻射を防ぐシー
ルド部材とを有することを特徴とする光ピックアップ装
置。
1. An optical pickup having an optical guide member having a light source and an optical element, and a light receiving means for converting a received optical signal into an electric signal, and an optical pickup for accommodating the optical pickup and for inputting / outputting signals of the optical pickup. An optical pickup device comprising: a housing member having a terminal, a high-frequency superimposed power supply circuit connected to a terminal of the housing member, and a shield member that covers the high-frequency superimposed power supply circuit and prevents unnecessary radiation.
【請求項2】シールド部材は弾性を有する金属材料の平
板よりなり略コの字状に成形され、前記シールド部材の
略コの字状の溝部分で高周波重畳電源回路を覆うことを
特徴とする請求項1記載の光ピックアップ装置。
2. The shield member is made of a flat plate made of a metallic material having elasticity and is formed into a substantially U shape, and the high frequency superimposed power supply circuit is covered by the substantially U shape groove portion of the shield member. The optical pickup device according to claim 1.
【請求項3】光源と光学素子を有する光ガイド部材と受
光した光信号を電気信号に変換する受光手段とを有する
光ピックアップと、前記光ピックアップを収容し前記光
ピックアップの信号の入出力用の端子を有する収納部材
と、前記収納部材の端子と接続する高周波重畳電源回路
と、前記収納部材と前記高周波重畳電源回路とを覆い不
要輻射を防ぐシールド部材とを有することを特徴とする
光ピックアップ装置。
3. An optical pickup having a light guide member having a light source and an optical element, and a light receiving means for converting a received optical signal into an electric signal, and an optical pickup for accommodating the optical pickup and for inputting / outputting signals of the optical pickup. An optical pickup device comprising: a housing member having a terminal, a high-frequency superimposed power supply circuit connected to a terminal of the housing member, and a shield member that covers the housing member and the high-frequency superimposed power supply circuit to prevent unnecessary radiation. .
【請求項4】シールド部材は弾性を有する金属材料の平
板よりなり略コの字状に成形され、前記シールド部材の
略コの字状の溝部分で収納部材と高周波重畳電源回路と
を覆うことを特徴とする請求項3記載の光ピックアップ
装置。
4. The shield member is formed of a flat plate made of a metallic material having elasticity and is formed into a substantially U-shape. The substantially U-shaped groove portion of the shield member covers the housing member and the high frequency superposed power supply circuit. The optical pickup device according to claim 3, wherein
【請求項5】シールド部材は、弾性を有する金属材料よ
りなり、略コの字の形状をなし、両端平面に孔を有する
ことを特徴とする請求項1叉は請求項3記載の光ピック
アップ装置。
5. The optical pickup device according to claim 1 or 3, wherein the shield member is made of a metallic material having elasticity, has a substantially U shape, and has holes on both end planes. .
JP21199695A 1995-08-21 1995-08-21 Optical pickup device Pending JPH0963088A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21199695A JPH0963088A (en) 1995-08-21 1995-08-21 Optical pickup device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21199695A JPH0963088A (en) 1995-08-21 1995-08-21 Optical pickup device

Publications (1)

Publication Number Publication Date
JPH0963088A true JPH0963088A (en) 1997-03-07

Family

ID=16615175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21199695A Pending JPH0963088A (en) 1995-08-21 1995-08-21 Optical pickup device

Country Status (1)

Country Link
JP (1) JPH0963088A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6078483A (en) * 1998-05-14 2000-06-20 Hewlett-Packard Co. Flexible circuit support structure and head carrier
US6563659B1 (en) 2000-03-08 2003-05-13 Hewlett-Packard Development Company, L.P. Method and apparatus for servo code based tape tension measurement
US6693870B2 (en) 1999-12-21 2004-02-17 Funai Electric Co., Ltd. Optical pickup device with high-frequency superposition circuit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6078483A (en) * 1998-05-14 2000-06-20 Hewlett-Packard Co. Flexible circuit support structure and head carrier
US6693870B2 (en) 1999-12-21 2004-02-17 Funai Electric Co., Ltd. Optical pickup device with high-frequency superposition circuit
US6563659B1 (en) 2000-03-08 2003-05-13 Hewlett-Packard Development Company, L.P. Method and apparatus for servo code based tape tension measurement

Similar Documents

Publication Publication Date Title
US20060078021A1 (en) Semiconductor laser unit and optical pickup device including the semiconductor laser unit
JPH0963088A (en) Optical pickup device
JPH09198689A (en) Optical pickup device and its production
JP2007019077A (en) Semiconductor laser unit and optical pickup equipment
JP2007318075A (en) Optical device, method for manufacturing the same, optical pickup device, and optical disk drive device
EP0577197B1 (en) Optoelectronic device and method of manufacturing same
US5350916A (en) Optoelectronic device and method of manufacturing same with an electrically insulating medium having a strip-shaped flexible foil
JP3379292B2 (en) Optical pickup and optical disk device
JP3536438B2 (en) Optical pickup and optical guide member
JP2006040933A (en) Semiconductor laser device
JP3536485B2 (en) Optical pickup and optical guide member
JP3417156B2 (en) Optical pickup and pickup for phase change optical disk
JP3477910B2 (en) Optical guide member and optical pickup
JP3536496B2 (en) Optical pickup
JP3482747B2 (en) Optical pickup
JP3509314B2 (en) Optical pickup
JP3166560B2 (en) Optical disk device and electronic equipment
JP3399174B2 (en) Optical pickup and optical guide member
JP3284833B2 (en) Optical pickup and optical guide member
JP4349137B2 (en) Optical pickup and optical disc apparatus
JP2006048804A (en) Light-receiving circuit mount
JP3536473B2 (en) Optical pickup
JP2002203336A (en) Optical pickup and method for manufacturing the same
JP3846884B2 (en) Semiconductor laser device mounting frame, semiconductor laser device, optical pickup device, and method of manufacturing semiconductor laser device
JP3480159B2 (en) Optical pickup and optical guide member