JP2002203336A - Optical pickup and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize the packaging of an optical pickup. SOLUTION: The optical pickup is provided with a light source 1, an optical guide member 5 having a plurality of slopes 5a, 5b, and 5c inclined to the incidence direction of a light beam emitted from the light source 1, a light receiving element 13 to receive a light beam reflected from a recording medium 27 and convert the light beam into an electric signal, and a package 14 to house the light source 1, the optical guide member 5, and the light receiving element 13. The optical guide member 5 reflects the light beam from the light source 1 on the plurality of slopes 5a, 5b, and 5c, to guide it to the recording medium 27, and further guides the light beam reflected from the recording medium 27 to the light receiving element 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical pickup for recording or reproducing information on an optical element, an optical disk or the like, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, it has been desired to reduce the size of an optical disk device for recording and reproducing information using laser light, and attempts have been made to reduce the size and weight of an optical pickup by reducing the number of optical components. Have been done. Small optical pickup
The reduction in weight is advantageous not only for reducing the size of the entire apparatus, but also for improving the performance such as shortening the access time. In recent years, use of a hologram optical pickup has been cited as a means for reducing the size and weight of the optical pickup, and some of them have been put to practical use.

[0003]

However, in the above-mentioned conventional configuration, the distance from the light source to the recording medium is long, and a large number of independent optical members are provided therebetween, so that the miniaturization of the optical pickup packaging is limited. There was a problem that there is.

An object of the present invention is to reduce the size of an optical pickup packaging.

[0005]

In order to achieve this object, a light source, a light guide member having a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, and a light receiving member are provided. And a light receiving means for converting the received light signal into an electric signal, and a storage member for storing the light source, the light guide member and the light receiving means, wherein the light guide member reflects light from the light source on a plurality of inclined surfaces. In addition to guiding the light to the recording medium, the light reflected from the recording medium is guided to the light receiving unit.

With this configuration, it is possible to dramatically reduce the size of the optical pickup while maintaining the conventional performance.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The packaging of a first optical pickup according to an embodiment of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 are cross-sectional views each showing a packaging structure of an optical pickup according to an embodiment of the present invention.

Reference numeral 1 denotes a light source. As the light source 1, various lasers such as a semiconductor laser and a gas laser such as He-Ne can be considered. Here, it is preferable to use a semiconductor laser which is the smallest among these, can reduce the size of the entire device, and has a low unit cost and an output of several mW to several tens mW. Semiconductor lasers made of AlGaAs, InGaAsP, I
nGaAlP, ZnSe, GaN, and the like are conceivable. Here, AlGaAs, which is most commonly used and is inexpensive, is used. Furthermore, when performing high-density recording, the spot diameter on the recording medium can be made smaller, and
It is preferable to use a semiconductor laser such as InGaAlP or ZnSe having a shorter wavelength than s.

Reference numeral 2 denotes a submount. The submount 2 has a rectangular parallelepiped shape or a plate shape, and a light source 1 is mounted on an upper surface thereof. This submount 2 is a light source 1
And has the function of releasing the heat generated by the light source 1. For bonding the submount 2 and the light source 1, a method of bonding a foil (thickness of several μm to several tens of μm) of Au—Sn, Sn—Pb, In, or the like at a high temperature in consideration of thermal conductivity and the like is used. preferable. If the light source 1 and the submount 2 are not mounted substantially horizontally, aberrations of the optical system will be caused.
Therefore, at the time of joining, it is preferable that the light source 1 be mounted on the submount 2 at a predetermined position at a predetermined height and substantially horizontally. Further, an electrode surface 2a is provided on the upper surface of the submount 2 so as to make electrical contact with the lower surface of the light source 1. The electrode surface 2a is for supplying power to the light source 1, and the electrode surface 2a
It is preferable to use a thin Au film in consideration of conductivity and corrosion resistance as the metal film constituting a. Further, the submount 2 has high thermal conductivity and a linear expansion coefficient of that of the light source 1 (approximately 6.5 × 10 −6 / ° C.) due to problems such as heat generated from the light source 1 and attachment to the light source 1. Materials close to) are preferred.

Specifically, the coefficient of linear expansion is 3 to 10 × 10 -6
/ C, a substance having a thermal conductivity of 100 w / mK or more, for example, AlN, SiC, T-cBN, Cu / W, Cu / M
It is preferable to use diamond such as o, Si or the like, particularly when a high-power laser is used and the thermal conductivity must be very large. When the linear expansion coefficients of the light source 1 and the submount 2 are set to be equal or close to each other, the occurrence of distortion between the light source 1 and the submount 2 can be suppressed. It is possible to prevent inconveniences such as detachment of the attachment portion and cracking of the light source 1. However, if the distance is out of this range, a large distortion is generated between the light source 1 and the submount 2, and there is a possibility that a mounting portion between the light source 1 and the submount 2 is detached or a crack or the like occurs in the light source 1. Get higher. Further, by making the thermal conductivity of the submount 2 as large as possible, the heat generated in the light source 1 can be efficiently released to the outside. However, when the thermal conductivity is equal to or less than this limit, the heat generated by the light source 1 is difficult to escape to the outside, so that the temperature of the light source 1 increases, the output of the light source 1 decreases, and the life of the light source 1 is shortened. In the worst case, the light source 1 is likely to be broken. In the present embodiment, AlN which is relatively inexpensive and has excellent both of these two characteristics is used. Further, on the upper surface of the submount 2, Ti, Pt,
It is preferable to form a thin film in the order of Au.

Reference numeral 3 denotes a block. The block 3 is basically a rectangular parallelepiped and has a large projection 3a on a side surface thereof, and a submount 2 is mounted on an upper surface. Like the submount 2, the block 3 also has a high thermal conductivity and a material having a linear expansion coefficient close to that of the submount 2, for example, due to heat generated from the light source 1 and problems such as attachment to the submount 2. It is preferable to use Mo, Cu, Fe, Kovar, 42 alloy or the like other than those shown in the material examples of the submount 2. However, the requirements for these characteristic values are not so strict as compared with the submount 2, so that it is preferable to select them with emphasis on cost. Here, the block 3 is formed of a material such as Cu or Mo which is very inexpensive as compared with AlN and has relatively excellent characteristics. In consideration of the thermal conductivity and the like, the joining between the block 3 and the submount 2 is somewhat expensive, but also Au-Sn, Sn-Pb, I as in the case of the submount 2 and the light source 1.
It is preferable that a foil (thickness: several μm to several tens μm) of n or the like be pressed at high temperature.

Reference numeral 4 denotes a radiator plate. The radiator plate 4 has a function of releasing heat generated by the light source 1 and transmitted through the submount 2 and the block 3 to the outside.
Various members forming the optical pickup are mounted thereon, and serve as a packaging substrate. The block 3 is fixed to the upper surface of the heat sink 4 by brazing, cream soldering, or the like. The material of the heat sink 4 is C, which has high thermal conductivity.
u, Al, Fe and the like can be considered.

Here, the submount 2 and the block 3
Are formed separately, but when the output of the light source 1 is high and a higher thermal conductivity is required for these members, these members are integrally formed in order to improve the thermal conductivity. Is preferred. In this case, it is preferable to use those having extremely high thermal conductivity such as AlN.

It is desirable that the block 3 be larger than the submount 2 so as to have a large contact area with the heat sink 4.

Since the light source 1 is required to have high accuracy with respect to the optical axis, it is preferable that the upper surface of the submount 2 is horizontal with high accuracy. Therefore, it is preferable to pay close attention to the mounting of the submount 2, the block 3, and the heat sink 4.

Reference numeral 5 denotes a light guide member. The light guide member 5 has a rectangular parallelepiped shape. Inside the light guide member 5, a total of three slopes of a first slope 5a, a second slope 5b, and a third slope 5c are provided. 1
It has five V-shaped grooves 5d. The first slope 5a is provided with a reflection type diffraction grating 6 for separating the light emitted from the light source into a 0th-order diffracted light (hereinafter referred to as a main beam) and ± 1st-order diffracted light (hereinafter referred to as a side beam). Have been. However, when tracking is performed by a method other than the three-beam method (for example, a push-pull method), the diffraction grating 6 may be omitted. In addition, the second inclined surface 5b can freely convert the diffusion angle of the emitted light with respect to the diffusion angle of the incident light from the light source 1, and has a wavefront aberration that is integrated on the way of the emitted light. A diffusion angle conversion hologram 7 that can be removed as an ideal spherical wave, a reflection film 8 and a reflection film 126 that reflect the returned light to a predetermined position, and a main beam and a side beam from the diffraction grating 6 A first beam splitter film 9 that transmits or reflects light and an astigmatism generating hologram 10 formed by a reflection type hologram are formed. However, if the recording medium surface light quantity can be sufficiently obtained (for example, the output of the light source 1 is large, the rotational linear velocity of the recording medium is low), the diffusion angle conversion hologram 7 may be omitted. In this case, the diffraction grating 6 may be provided at a position where the diffusion angle conversion hologram 7 is located. The function of removing the wavefront aberration may be provided not on the diffusion angle conversion hologram 7 but on another optical member (for example, an objective lens). Like the first beam splitter film 9, the returned light is transmitted or reflected on the third inclined surface 5 c by a second beam splitter film 11 and a polarization separation film that reflects a light wave of a specific component. 12 and a reflection film 125 for reflecting the returned light and guiding it to a predetermined position. The light guide member 5 is adhered on its side to the projection 3a of the block 3. The bonding material used for this purpose must have conditions such as high adhesive strength, workability that can be fixed at any moment, small changes in volume due to changes in volume before and after curing and changes in temperature and humidity, that is, low shrinkage. It is required, and by satisfying these, workability and stability of the joint surface can be improved. Here, a UV adhesive which is instantly cured by irradiating ultraviolet rays is used as such a bonding material. Further, a moisture-absorbing and curing instant adhesive may be used. It is preferable that the contact area (S) between the block 3 and the light guide member 5 is S> 1 mm 2 in order to have a sufficient mounting strength.

Reference numeral 13 denotes a light receiving element. The light receiving element 13 is composed of various electric circuits formed on a plate-shaped semiconductor wafer, and is attached to the bottom of the light guide member 5. As for the attachment of the light receiving element 13 and the light guide member 5, a large adhesive strength, workability that can be fixed in a short time, a change in volume before and after curing, and a small change in volume due to temperature and humidity, that is, a low shrinkage ratio, etc. Are required, and by satisfying these, workability and stability of the joint surface are improved. As such a bonding material, a UV adhesive having particularly good workability was used because it is instantaneously cured by irradiating ultraviolet rays. Note that a moisture-absorbing and curing instant adhesive may be used. The light receiving element 13 has a plurality of light receiving portions for receiving the light signal emitted from the light source 1 and reflected by the light guide member 5 and the recording medium and returned. The light signal detected by the light receiving unit is converted into an electric signal according to the light amount. This electric signal has the magnitude of the current value at the beginning of the conversion.
However, this current has the disadvantages that it is very weak and that noise is easily picked up. For this reason, it is preferable here to use, as the light receiving element 13, an element formed with an IV amplifier having a function of converting a current value to a correlated voltage value and amplifying it. However, it is required that the response of the output voltage be good with respect to the incident frequency of light.
By forming the IV amplifier in the light receiving element 13, the loss of the electric signal can be reduced, and it is not necessary to provide an external OP amplifier. Therefore, the number of parts can be reduced. A plurality of electrodes 13a made of a thin film of Al or the like for extracting received information as signals are provided.

Reference numeral 14 denotes a package.
On the upper surface of the heat radiating plate 4, the above-described block 3 and the light guide member 5,
It is provided so as to surround the light receiving element 13 and the like, and a lead frame 14a used for extracting an electric signal from the light receiving element 13, supplying power to the light source 1, and the like is molded therein. The shape of the package 14 is a rectangular parallelepiped shape with a hollow central portion.
The step 14 is formed on the inner surface of the package 14 on the side where the mold 4a is molded so as to expose the legs 14b of the lead frame.
c is provided. The outer peripheral shape of the package 14 may be a cylindrical shape or the like. And the light receiving element 13
Of the lead frame exposed on a step 14c provided in the package 14 for extracting an electric signal from the
4b and a plurality of electrodes 13a provided on the surface of the light receiving element 13 are connected by wire bonding with a wire 14d made of Au, Al, or the like. In order to supply power to the light source 1, the upper surface of the light source 1 and the foot 14 of the lead frame exposed to the step 14 c provided in the package 14 are provided.
b is bonded with a wire 14 d, and further, an electrode surface 2 a provided on the upper surface of the submount 2 so as to be in electrical contact with the lower surface of the light source 1 and a lead exposed on a step 14 c provided on the package 14. The legs 14b of the frame are similarly connected by wire bonding with wires 14d. The material of the package 14 is required to be excellent in low water absorption, low outgassing, and the like. Here, a thermosetting resin such as an epoxy resin, which is the most common, is used as the IC mold. The material of the lead frame 14a may be Cu, 42 alloy, F
In many cases, a metal such as e is plated with Ag, Au, or the like. Here, Cu is plated with Ni, and A
A u-plated one was used. Further, for attachment between the package 14 and the heat radiating plate 4, a bonding material having properties such as high adhesive strength, low water absorption, and high airtightness (low leak characteristics) is used. As a result, the stability of the bonding surface and bonding position can be improved, and impurities can be prevented from entering the inside of the packaging of the optical pickup. Here, although some time is required for adhesion, an epoxy adhesive excellent in these characteristics and inexpensive was used.

Reference numeral 15 denotes a shell. The shell 15 also has an outer shape penetrating the center of the rectangular parallelepiped similarly to the package 14, and its horizontal cross section has substantially the same shape as that of the package 14. . The material is required to have characteristics such as low water absorption and low outgassing in order to prevent impurities from being mixed into the interior of the packaging. Here, polybutylene terephthalate (hereinafter referred to as PBT) having excellent properties is used. However, in particular, when characteristics excellent in strength, dimensional accuracy, and the like are required, an LCP that is more expensive than PBT but has these characteristics may be used. And the adhesion between the shell 15 and the package 14 is
An epoxy adhesive was used for the same reason as the attachment of the package 14 and the heat sink 4 described above. This shell 1
Instead of using 5, the height of the side wall portion of the package 14 may be made higher than that of the light guide member 5.

Reference numeral 16 denotes a cover member. The cover member 16 prevents dust and dirt from adhering to the light guide member 5, the light receiving element 13, and the like, and is attached to the upper surface of the shell 15 with an epoxy-based adhesive. ing. Further, as the material of the cover member 16, it is preferable to use glass such as BK-7, FK-1, and K-3, or resin having high light transmittance such as urethane, polycarbonate, and acrylic.
In the case of reading a magneto-optical signal, it is not preferable to use a member having birefringence even if the light transmittance is high. Further, anti-reflection films 16a are formed on both upper and lower surfaces of the cover member 16 for anti-reflection. This antireflection film 16a is made of M
It is preferably formed of a material such as gF2. However, when reflection on the surface of the cover member 16 does not cause much problem, the antireflection film 16a may not be provided.

The positional relationship between the cover member 16 and the light guide member 5 can be considered when the two members are brought into contact with each other or when a space is provided between them. When the two are brought into contact, the light guide member 5 is attached to the bottom of the cover member 16 with an epoxy-based adhesive or a UV adhesive. At this time, the thickness (t1) of the cover member 16 is set to 0.3 ≦ t1 ≦ 3.0 (m
m) is preferable. The reason for this is that if the lower limit is made thinner than this, the cover member 16 may not be able to withstand the weight of the light guide member 5 or the like attached thereto or the tension when the adhesive is hardened, and may be damaged. As for the upper limit, since the cover member 16 has a higher refractive index than air, a converging action is generated on the light, and the light does not spread. As a result, the cover member 16 and the collimator lens (in the case of an infinite optical system) or an objective lens are obtained. This is because the distance to (in the case of a finite optical system) has to be increased, which is disadvantageous for miniaturization of the pickup unit.
By using such a configuration, the packaging height of the optical pickup can be further reduced, and the size of the pickup unit can be reduced while maintaining sufficient mounting strength.

On the other hand, when a space is provided between the two, the thickness (t2) of the cover member 16 is set to 0.1 ≦ t2 ≦
3.0 (mm), and the distance (d) between the cover member 16 and the light guide member 5 is also preferably 0.1 ≦ d ≦ 3.0 (mm). The reason for this is that the lower limit of t2 is different from the previous example in that the light guide member 5 is not attached, and it is only necessary to withstand external factors such as vibration. Also, as for d, the smaller the better, the better. However, there is a possibility that the accuracy error during assembly cannot be reduced to 0.1 mm or less. In this case, the cover member 16 comes into contact with the light guide member 5 during assembly and breaks. There is a risk that it will. By using such a configuration, the block 3 or the submount 2 is brought into thermal contact with another member while improving the relative positional accuracy between the light guide member 5 and the light source 1, the submount 2, and the block 3. Therefore, the heat generated in the light source 1 can be easily released to the outside.

The interior of the packaging of the optical pickup is designed to prevent the light source 1 and the light receiving element 13 from being oxidized.
Gases such as N2 and Ar, N
It is preferable to fill an inert gas such as e or He. In this case, the gap 17 existing between the heat radiating plate 4 and the light receiving element 13 is filled with a bonding material having characteristics such as a small shrinkage ratio, low water absorption, and high airtightness (excellent leak characteristics), for example, an epoxy potting agent. It is necessary to fill with solder or solder. Thereby, the inside airtightness can be improved. In this case, the cover member 16 also has a function of isolating the inside and outside of the packaging.

By using the configuration shown above,
The heat generated by the light source 1 can be easily released to the outside, and the antioxidant gas can be easily sealed by providing a total of two openings on both end surfaces of the packaging. Further, in the optical system, the relative positional relationship between the light source 1, the light guide member 5, and the light receiving element 13 can be correctly and firmly maintained. do not do.

Next, the operation of the optical pickup according to one embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a conceptual diagram of the operation of the optical pickup according to one embodiment of the present invention, and FIG. 4 is a plan view of the optical pickup according to one embodiment of the present invention.

In FIGS. 3 and 4, the laser light horizontally emitted from the light source 1 horizontally mounted on the heat sink 4 via the submount 2 and the block 3 is a light guide member having a plurality of parallel inclined surfaces. 5 is a reflection type which is incident on the light guide member 5 from the surface 5f of the light guide member 5 and has a function of converting the diffusion angle of the light to be emitted to the diffusion angle of the incident light formed on the second slope 5b of the light guide member 5. Reaches the diffusion angle conversion hologram 7. The diffusion angle conversion hologram 7 freely converts the diffusion angle of the reflected light from the diffusion angle conversion hologram 7 to the diffusion angle of the light beam that can be incident on the diffusion angle conversion hologram 7 out of the light emitted from the light source 1. can do. Further, the light can be converted into parallel light having no diffusion angle by the diffusion angle conversion hologram 7. Also, as shown in FIG. 3, the same divergence angle conversion hologram 7 becomes an ideal spherical wave 30 from which the light flux after exiting the light guide member 5 is removed from the wavefront aberration integrated on the intermediate path. Therefore, the light incident on the objective lens 26 becomes an ideal spherical wave 30, and the image spot formed on the recording medium 27 by the objective lens 26 has a size almost narrowed down to the diffraction limit, so that information can be recorded or reproduced reliably. Can be.

The light whose diffusion angle has been converted and reflected by the diffusion angle conversion hologram 7 is divided into a main beam and a side beam by a reflection type diffraction grating 6 formed on the first slope 5a. The main beam and the side beam generated by the diffraction grating 6 are incident on a first beam splitter film 9 (first beam splitter film having polarization selectivity). Of the light incident on the first beam splitter film 9, the light transmitted through the first beam splitter film 9 is used as power monitor light of the light emitted from the light source 1. Further, the main beam and the side beam reflected by the first beam splitter film 9 are applied to the surface 5 of the light guide member 5.
e and a cover glass (not shown), enter the objective lens 26, and form an image on the information recording surface 27 a of the recording medium 27 by the condensing action of the objective lens 26. At this time,
On the information recording surface 27a, the beam spots 29a and 29c of the two side beams are imaged at positions substantially symmetric about the beam spot 29b of the main beam. The information recording / reproducing signal and the tracking / focusing so-called servo signal are read out from the information recording surface 27a by the beam spots 29b and 29a and 29c of the main beam and the side beam.

The return light of the main beam and the side beam reflected by the information recording surface 27a of the recording medium 27 receives the objective lens 26, the cover glass, and the surface 5e of the light guide member 5.
Again, and again enters the first beam splitter film 9 formed on the second slope 5 b of the light guide member 5.
The first beam splitter film 9 has light having a vibration component perpendicular to the light incident surface (hereinafter simply referred to as S-polarized light component).
, And has a transmittance of almost 100% for a parallel vibration component (hereinafter simply referred to as a P-polarized component).

The light transmitted through the first beam splitter film 9 among the return light from the recording medium 27 is the second light formed on the third inclined surface 5c parallel to the first inclined surface 5a of the light guide member 5. The light is incident on the beam splitter film 11 (second beam splitter film having polarization selectivity). Like the first beam splitter film 9, the second beam splitter film 11 has a constant reflectance for the S-polarized light component and has a transmittance of almost 100% for the P-polarized light component.

Here, the transmitted light 117 of the light beam incident on the second beam splitter film 11 will be described. The transmitted light 117 is transmitted to the V-groove substrate 3 stacked on the third slope 5c.
Incident on 1. FIG. 5 is a perspective view of a V-shaped groove substrate of an optical pickup according to one embodiment of the present invention. V-groove substrate 3
1 has a V-shaped groove (hereinafter referred to as a V-shaped groove) 5d formed by molding or cutting, etc., and is laminated on the third slope 5c. The transmitted light 117 from the second beam splitter film 11 is reflected by the reflecting surface 31a of the V-groove substrate 31 on which the reflecting film of the groove is formed.

FIG. 6 is a diagram showing the arrangement of light receiving portions and signal processing of an optical pickup according to an embodiment of the present invention.
The reflected light 120 from the reflection surface 31a of the V-groove substrate 31 is incident on the polarization separation film 12 formed on the third slope 5c. The P-polarized light component of the reflected light 120 is transmitted by the polarization splitting film 12 at almost 100%, and the second inclined surface 5 of the light guide member 5 is further transmitted.
b, the light is reflected by the reflective film 8 formed on the
The light reaches the upper light receiving unit 170. On the other hand, the S-polarized light component of the reflected light 120 from the reflection surface 31 a of the V-groove substrate 31 is reflected almost 100% by the polarization separation film 12 and reaches the light receiving section 171 on the light receiving element 13.

Next, the reflected light 123 of the light beam incident on the second beam splitter film 11 will be described. The reflected light 123 is incident on the astigmatism generating hologram 10 formed of a reflection type hologram on the second inclined surface 5b. Here, the reflected light 123 is reflected while generating astigmatism, is further reflected by the reflection film 125 on the third slope 5c, is reflected by the reflection film 126 on the second slope 5b, and then returns to the main beam. The light is transmitted to the light receiving section 172 on the light receiving element 13, and the return light of the side beam is transmitted to the light receiving sections 176 and 17 on the light receiving element 13.
Reach 7

Next, the reflected light 123 of the light beam incident on the second beam splitter film 11 will be described. The reflected light 123 is incident on the astigmatism generating hologram 10 formed of a reflection type hologram on the second inclined surface 5b. Here, the reflected light 123 is reflected while generating astigmatism, is further reflected by the reflection film 125 on the third slope 5c, is reflected by the reflection film 126 on the second slope 5b, and then returns to the main beam. The light is transmitted to the light receiving section 172 on the light receiving element 13 and the return light of the side beam is transmitted to the light receiving sections 176 and 17 on the light receiving element 13.
Reach 7

Hereinafter, the operation of the light guide member 5 having a structure different from that of the above-described embodiment will be described with reference to the drawings. FIG. 7 is a side view of an optical pickup according to one embodiment of the present invention, and FIG. 8 is a plan view of the optical pickup according to one embodiment of the present invention.

The optical pickup according to the present embodiment includes a block 301, a submount 302, a light source 303, a divergence angle conversion hologram 306, a diffraction grating 307, an objective lens 309, a first beam splitter film 308, and a second beam splitter film 316. , The light receiving element 319 and the like are the same, but a fourth slope 305d parallel to the first slope 305a, the second slope 305b, and the third slope 305c instead of the V-groove substrate of the above-described embodiment. The half-wave plate 318 is laminated on the substrate.

In this embodiment, the light path from the light source 303 to the recording medium 310 and the path from the recording medium 310 to the second beam splitter film 316 are the same as those in the above-described embodiment. FIG. 9 is a diagram showing the arrangement of light receiving units and signal processing of the optical pickup according to one embodiment of the present invention. The transmitted light 317 from the second beam splitter film 316 is a half of the light 317 laminated on the fourth slope 305d.
The light enters the wave plate 318. The transmitted light 317 has its polarization direction rotated by 45 degrees by the half-wave plate 318, and has a fifth slope 305e parallel to the first slope 305a, the second slope 305b, the third slope 305c, and the fourth slope 305d. Is incident on the polarization splitting film 321 formed in the above as linearly polarized light of 45 degrees with respect to the plane of incidence, and the P-polarized component is transmitted and the S-polarized component is reflected by the action of the polarized light splitting film 321. The P-polarized light component transmitted through the polarization separation film 321 reaches the light receiving unit 370. On the other hand, the reflected light 320 as the S-polarized light component reflected by the polarization separation film 321 is reflected by the reflection film 322 on the third inclined surface 305c, further passes through the half-wave plate 318, and reaches the light receiving unit 371.

Next, the reflected light 323 of the light beam incident on the second beam splitter film 316 will be described.
The reflected light 323 is incident on the astigmatism generating hologram 324 formed of a reflective hologram on the second inclined surface 305b. Here, the reflected light 323 is reflected while generating astigmatism, further reflected by the reflection film 325 on the third slope 305c, and reflected by the reflection film 326 on the second slope 305b, and then returned to the main beam. The light reaches the light receiving section 372 on the light receiving element 319, and the return light of the side beam reaches the light receiving sections 376 and 377 on the light receiving element 319.

Next, the configuration of the packaging of the second optical pickup in one embodiment of the present invention will be described with reference to the drawings. FIGS. 10 to 12 are views showing the configuration of the optical pickup packaging according to one embodiment of the present invention. However, as for members having the same names as those of the first packaging, only portions having configurations different from those of the first embodiment will be described.

Reference numeral 18 denotes a ceramic package, and the ceramic package 18 is the package 14 in the first embodiment.
And the function of the heat sink 4. Therefore, it is preferable to use a material having a high thermal conductivity, such as AlN or Al2O3, because heat can be efficiently released. In the present embodiment, AlN having a particularly high thermal conductivity is used. However, when it is necessary to give priority to cost, it is preferable to use Al2O3 because it is inexpensive.

The structure is such that three ceramic substrates are laminated, and the substrates 18a, 18b, 1
8c. Each substrate 18a, 18b, 1
On 8c, a pattern used for supplying an electric signal from the light receiving element 13 and power supply of the light source 1 and the like is printed on the upper surface, the bottom surface, and the side surfaces (through holes and the like). An electrode 18e for bonding a wire for guiding an electric signal from the light receiving element 13 is exposed on the upper surface of the substrate 18b, and the block 3 is fixed with cream solder or the like. Further, through holes 19a, 19b, 19c are formed in the substrates 18a, 18b, 18c, respectively. These through holes 19a, 19b, 19c may be arranged in series as long as they are electrically connected, or may be discrete. On the inner surfaces of the through holes 19a, 19b, and 19c, a thin film made of a conductive material such as Au is formed for power supply.
8c is electrically connected to the lower surface. In addition, as a method of electrically connecting the upper surface of the substrate 18a and the lower surface of the substrate 18c, a paste of tungsten or the like may be poured into the through hole 19 and fired together with the ceramic package 18. Also, a through hole or the like formed at the time of manufacturing may be used on the side surface of the ceramic package 18 without providing the through hole 19. When this method is used, the step of providing the through hole 19 can be omitted. After the various formations described above are completed, the ceramic package 18 is manufactured by firing at a high temperature.

Reference numeral 20 denotes a terminal, and the terminal 20 supplies power to the light source 1. The two terminals 20 are soldered to the electrodes on the lower surface of the substrate 18c, and are connected to the electrodes 18d formed on the upper surface of the substrate 18a via the Au surface on the inner surface of the through hole 19, pins or through holes, or the like. It is electrically connected. The other end of the terminal 20 is connected to a high-frequency power supply circuit 21 when the light source 1 emits light with high output.

Power is supplied to the light source 1 by an electrode 18d formed on the substrate 18a, an electrode (not shown) formed on the upper surface of the light source 1, and a sub-electrode electrically connected to the bottom surface of the light source 1. This is performed by wire bonding the electrode 2a formed on the upper surface of the mount 2.

Reference numeral 22 denotes a cap. The cap 22 is provided so as to cover the light guide member 5, and dust or the like may enter the inside of the packaging, causing problems in the light guide member 5, the light receiving element 13, and the like. There is a function to prevent. The cap 22 may be made of any material, such as metal or resin, which can be easily joined to the ceramic package 18 and has a stable shape.
In particular, when the cap 22 is made of metal, the function of suppressing unnecessary radiation generated by the high frequency superimposed power supply circuit 21 and the like is expected. Therefore, the cap 22 is made of Kovar, 42 alloy, Cu
And the like.

When purging the inside of the packaging to prevent the light source 1 from being oxidized, the gap between the light guide member 5 and the ceramic package 18 is sealed in advance with a potting agent, solder, or the like. This is done by attaching the cap 22 in an antioxidant gas atmosphere.

Next, attachment of the ceramic package 18 and the cap 22 will be described. The ceramic package 18 and the cap 22 may be attached directly by using an epoxy-based adhesive or by soldering. However, sufficient airtightness cannot be obtained, or the ceramic package 18 and the cap 22 cannot be used internally. In many cases, the used UV adhesive is adversely affected by heat during soldering. Therefore, in the present embodiment, it is preferable to sandwich the ring 23 between the ceramic package 18 and the cap 22. With this configuration, electric welding can be performed between the ceramic package 18 and the cap 22. By using this method, the sealing performance of the joint is improved, and the temperature of the joint is not increased during the joining. Get better. The ring 23 is provided on the uppermost substrate 18a of the ceramic package 18, has a substantially rectangular ring shape, and has a rectangular cross section. It is preferable to use a metal such as Kovar, 42 alloy, or Cu. Attachment between the ceramic package 18 and the ring 23 is performed first by using the ring 23 of the ceramic package 18.
A thin film of metallized tungsten is formed on the surface facing the substrate, and nickel plating is applied thereon, and the nickel plated surface and the ring 23 are joined by Ag brazing or the like. Further, nickel plating is performed on the ring 23 bonded as described above, and an Au surface is formed thereon. Further, the surface of the cap 22 facing the ring 23 is also plated with nickel, and then the ring 23 and the cap 22 are connected with a seam welder (a type of electric resistance welder) or the like.
The attachment between the ring 23 and the cap 22 is performed.

The ceramic package 1 described above
In the case of using the package 8, the heat generated from the light source 1 and the like can be more efficiently released to the outside by using the ceramic package 18 which also functions as a heat radiating plate. Since the terminals 20 are arranged below the ceramic package 18, the distance required for connection between the light source 1 and the high-frequency superimposed power supply circuit 21 can be shortened.
Unnecessary radiation emitted from the high-frequency superimposed power supply circuit 21 due to the wiring of the power supply line, the signal line, and the like can be suppressed. Furthermore, unnecessary radiation can be further suppressed by using metal for the cap 22.

Although the block 3 and the light guide member 5 are bonded and integrated in the present embodiment, they may be separately provided on the ceramic package 18. In this case, positioning between the light guide member 5 and the light receiving element 13 is facilitated. Further, the light receiving element 13 is mounted on the bottom of the light guide member 5, but may be mounted on the ceramic package 18 as long as there is no problem in optical characteristics. Also ceramic package 1
Here, 8 is formed by laminating three ceramic substrates (three-layer structure), but may have two layers or one layer instead of the three-layer structure. It is also conceivable that the number of layers may be four or more due to manufacturing reasons.

Next, the configuration of the packaging of the third optical pickup in one embodiment of the present invention will be described with reference to the drawings. FIGS. 13 to 15 are views showing a configuration of packaging of an optical pickup according to an embodiment of the present invention. However, regarding members having the same names as the first and second packagings, FIGS.
Only the parts different from the embodiment shown in FIG.

Reference numeral 24 denotes a stem. The stem 24 mounts or holds the light source 1, the submount 2, the light guide member 5, and the like. The stem 24 is formed of a material having high thermal conductivity, and is generated by the light source 1 and the like. Heat can be released very efficiently. As such a material, it is preferable to use a metal such as Kovar or 42 alloy, or a ceramic such as Al2O3 or AlN. In the present embodiment, Kovar is used. The light guide member 5 is provided on the side surface 24a of the stem 24.
Is attached. If this member is attached at an angle, the optical aberration increases, and a normal optical pickup cannot be performed. Therefore, the side portion 24a is required to have high perpendicularity and flatness. Here, the inclination of the side portion 24a is set to 90 ° ± 0.5 °. In this embodiment, the side surface 24a of the stem 24 is precisely machined by an end mill or the like in order to realize this more precise machining. Further, the contact area (S) between the stem 24 and the light guide member 5 is preferably set to S> 1 mm2. With such a configuration, the stem 24 and the light guide member 5 can be sufficiently firmly bonded to each other, and the light guide member 5 does not come off even if a large vibration is transmitted from the stem 24. The light guide member 5
May be joined to the side surface of the block 3 placed on the stem 24.

A step 24b is formed on the outer peripheral portion of the upper surface of the stem 24.
Is provided, and a cap 22 is fitted so as to follow the side wall of the step 24b. The method of attaching them depends on the material of the stem 24, but generally, the metals are electrically resistance-welded as described in the connection between the ring 23 and the cap 22 in the embodiment shown in FIG. It is conceivable to use an adhesive such as, or a method using brazing, soldering, or the like.

Reference numeral 25 denotes a package. The package 25 includes a lead frame 14a, a light receiving element 13, and a light receiving element 13.
An Au wire or the like which wire-bonds the lead frame 14a to the lead frame 14a is molded. For the package 25, the light receiving element 13 made of Si is molded, and the light passing through the light guide
Taking into account what must be led to
It is desired that the coefficient of linear expansion is close to that of Si, the water absorption rate is low, the optical properties such as transmittance and refractive index are stable and transparent. As such a material, a urethane resin is used here. Then, the package 25 and the stem 24 are attached. At this time, due to optical requirements, the error in the distance between the light guide member 5 and the light receiving element 13 needs to be 50 μm or less. This adjustment is performed by placing the light guide member 5 directly on the package 25. Or by adjusting the height of the side wall 25a of the package 25. Installation is epoxy adhesive or U
V-adhesive may be used, or bonding may be performed using cream solder or the like.

As described above, in this embodiment,
By using the stem 24 and mounting the submount 2 directly on the stem 24, heat transmitted by conduction from the light source 1 can be efficiently released to the stem 24, and a thermal problem can be solved. Further, the light receiving element 13 is package 2
By molding into 5, the light receiving element 13 can be prevented from being oxidized by contacting with air, or from deteriorating the light receiving characteristics due to the attachment of dust or the like.

The light receiving element 13 may be mounted and fixed on the package 25, as shown in the first embodiment, without molding the light receiving element 13 in the package 25. It can be attached to the bottom. In this case, as the material of the package 25, a colored material may be used, so that an inexpensive epoxy resin or the like may be used. When purging the inside of the packaging to prevent the light source 1 from being oxidized, the gap between the light guide member 5 and the stem 24 is sealed in advance with a sealant, and then the atmosphere is kept in an atmosphere of an antioxidant gas such as N2 gas. By attaching the cap 22.

The structures shown in the above three embodiments are combined, for example, in the first embodiment, the light receiving element 13
13 to 1 are not bonded to the light guide member 5.
As a matter of course, as in the embodiment shown in FIG. In this case, deterioration of the characteristics of the light receiving element 13 can be prevented. Metal stem 24
If the entire packaging is included as in the embodiments shown in FIGS. 10 to 12 by the metal cap 22 and the unnecessary radiation generated by the high-frequency superimposing circuit can be largely suppressed.

Next, a method of manufacturing a packaging for an optical pickup having the above-described configuration will be described in order from the first embodiment.

FIGS. 16 to 20 are views showing a manufacturing procedure of the optical pickup packaging in one embodiment of the present invention. First, the light source 1, the submount 2, and the block 3 (hereinafter, referred to as an LD block) are assembled.
Before assembling, it is particularly necessary to properly process the side surface portion 3b of the projection 3a of the block 3 so as to be perpendicular to the heat sink 4. The submount 2 and the block 3 are manufactured by punching out a pre-plated AlN plate, or cutting out the plate using a dicing saw or the like. At that time, if the surface roughness, flatness, and verticality are not sufficiently obtained, lapping or the like may be performed. The light source 1 is mounted on a predetermined position of the submount 2. Mounting is Au-S
This is performed by using a foil having a thickness of several μm to several tens μm of n, Sn—Pb, In, or the like, and pressing the foil at a high temperature. Usually, at the same time, the submount 2 and the block 3 are mounted in the same manner. However, when the light source 1 and the submount 2 are mounted and the submount 2 and the block 3 are mounted by different methods, it is necessary to mount the light sources 1 in ascending order of temperature. It is preferable to form a Ti or Pt film on the joining surface of these members, further form an Au film thereon, and join them there. In particular, it is very preferable to use this method for the attachment between the light source 1 and the submount 2 because it leads to an improvement in the reliability of the light source 1. When assembling these members, the light emitting surface of the light source 1 and the side surface portions 3b of the protrusions 3a of the block 3 are particularly set so as not to increase the aberration of light.
Must be taken care that the distance between the two is substantially parallel and the error in the distance between the two surfaces is 10 μm or less. By setting the value of the error in this way, it is possible to suppress variations in product characteristics.

Next, the LD block assembled in this manner is attached to a predetermined position of the heat sink 4 in a predetermined state. Although methods such as soldering are used for attachment,
At this time, care must be taken so that the bonding material used for assembling the LD block does not melt and the assembling accuracy is degraded. Only by preventing melting, it is possible to maintain the assembly accuracy and to produce an optical pickup unit without malfunction. At this time, a Ti film is similarly formed on the bonding surface, and Ni or P is further formed thereon.
forming a film of t, further forming a film of Au thereon,
Therefore, it is preferable to join them. However, since a very large bonding strength is not required here, Ti-Au, Ti
It may be joined by a film of -Ni.

As another assembling method, the above-mentioned various thin films are formed in advance on the block 3 and the heat radiating plate 4 and then the A 3
It is also conceivable that the block 3 and the heat radiating plate 4 are attached by glow or the like, then the submount 2 is attached by cream solder or the various foils described above, and finally the light source 1 is attached by the various foils described above.

Next, the radiator plate 4 incorporating the LD block
The package 14 is mounted on a predetermined position. An epoxy adhesive is used for attachment. And light receiving element 1
3 is placed in a package 14, and each signal extraction electrode of the light receiving element 13 is wire-bonded to a corresponding lead frame foot 14b with a wire 14d. At this time, the length of the wire 14d used for wire bonding is preferably set to be slightly longer because the position of the light receiving element 13 is finely adjusted later. At this time, at the same time, for the power source of the light source 1, the electrode surface 2a of the submount 2 which is in contact with the bottom surface of the light source 1 via the upper surface of the light source 1 and the Au surface.
And the lead 14b of the lead frame and the wire 14d
And wire bonding is performed. At this time, the light receiving element 13 is only attached by wire bonding and is not attached to the heat sink 4 or the light guide member 5 and is not fixed.

Next, the light guide member 5 is attached to the side surface 3b of the block 3. Since very high accuracy is required for this mounting, the method will be described in detail with reference to the drawings. FIG. 21 is a conceptual diagram showing the mismatch between the 0th-order light and the 1st-order light observed by the CCD according to the embodiment of the present invention, and FIG. FIG. 23 is a conceptual diagram showing the coincidence with the primary light, and FIG. 23 is a conceptual diagram of an observation experiment in one embodiment of the present invention. First, the light guide member 5 held by air tweezers or the like is moved along the side surface portion 3b of the block 3 to roughly perform alignment. At this time, a UV adhesive is applied to at least one of the side surface of the light guide member 5 and the side surface 3b of the block 3.
Thereafter, power is supplied to the light source 1 to emit light, and light is introduced into the light guide member 5. The light introduced into the light guide member 5 is separated into the 0th-order diffracted light and the 1st-order diffracted light by the divergence angle conversion hologram 7 and thereafter emitted from the surface 5e of the light guide member 5 to the outside. The emitted light passes through a collimator lens (not shown) and an objective lens 26 to form an image at a position where the recording medium 27 should be. At this time, if the relative position between the light source 1 and the light guide member 5 is correct, the 0th-order diffracted light and the 1st-order diffracted light converted by the divergence angle conversion hologram 7 are different from each other only in the depth of focus. On the recording medium 27, it looks concentric as shown in FIG. If the relative positions of the light source 1 and the light guide member 5 are not correct, the 0th-order diffracted light and the 1st-order diffracted light converted by the diffusion angle conversion hologram 7 have different focal depths and focus points. Then, two different circles are formed as shown in FIG. Utilizing this, the charge-coupled device camera 32 (hereinafter referred to as CCD) is set at the recording medium position, the deviation between the 0th-order diffracted light and the 1st-order diffracted light is measured, and the deviation width and the direction of the deviation are fed back. ,
The light guide member 5 was viewed by the CCD 32 according to the amount.
The light components of the two components are moved so as to form a concentric circle.
Thereby, the position of the light guide member 5 with respect to the light source 1 can be determined very accurately. After the positioning of the light guide member 5 in this manner, ultraviolet light is irradiated to solidify the UV adhesive.

For fixing, a method of applying an instant adhesive after positioning, instead of using a UV adhesive, is also conceivable. In this case, a type that does not whiten during drying is used so as not to block light. When this adhesive is used, the step of irradiating ultraviolet rays can be omitted.

As a positioning method, a method of measuring the optical aberration of the first-order diffracted light using a wavefront aberration measuring device or the like and positioning the optical element so as to minimize the aberration is also conceivable. However, when the three-beam method is used as the tracking signal detection method, the side beam also enters the wavefront aberration measuring device, so that three different lights are measured at the same time, so that it is difficult to use this method. .

Next, the light receiving element 13 is attached to a predetermined position of the heat sink 4.

Also in this case, since the light reflected by the recording medium 27 must be correctly guided to each light receiving portion of the light receiving element 13, precise relative positioning between the light receiving element 13 and the light guide member 5 is required. is necessary. Before describing this alignment method, the focus error signal detection by the astigmatism method in the light receiving element 13 and the state of astigmatism in the present embodiment will be described with reference to the drawings.

FIGS. 24 to 26 show one embodiment of the present invention when the recording medium 27 is at the in-focus position, when the recording medium 27 is closer to the in-focus position, and when the recording medium 27 is far from the in-focus position. It is an external view of the astigmatism light flux in the form of. 27 to 29 show light receiving portions 172a, 172b, and 172 provided on the light receiving element 13 for the light generated by the astigmatism generating hologram 10 in the cases of FIGS.
It is the figure which showed the spot shape in 172c, 172d.

The astigmatism generating hologram 10 is
7 is at the in-focus position, the first focal point 178 is upstream of the light receiving unit 172, and the second focal point 1 is downstream of the light receiving unit 172.
When 79 is generated and the x-axis direction and the y-axis direction are taken as shown in FIGS. 27 to 29, a line image in the y-axis direction is formed at the position of the first focal point 178 and the x-axis is formed at the position of the second focal point 179. Will be connected. When the recording medium 27 is at the in-focus position, the astigmatism-generating hologram 10 is designed at a position where the spot diameters in the x-axis and y-axis directions generated by the astigmatism become equal and a circular spot shape is formed.

The focus error signal is transmitted to the light receiving section 172a,
172b, 172c, and 172d.
The voltage converted by the V amplifier) is I172
a, I172b, I172c, and I172d, FIG.
As can be seen from the circuit diagram of FIG.

F. E. FIG. = (I172a + I172c)-
(I172b + I172d) When the recording medium 27 is at the in-focus position, as can be seen from FIGS. 24 and 27, the spot diameters in the x-axis and y-axis directions are equal and a substantially circular spot shape is obtained.
Since the total amount of received light at 172c and 172c is equal to the total amount of received light at 172b and 172d, the focus error signal is given by the following equation.

F. E. FIG. = 0 When the recording medium 27 is closer than the in-focus position, the first focal point 178 and the second focal point 179 generated by the astigmatism generating hologram 10 move away from the focus error detecting element as shown in FIG. 172b, 172c, 172
The spot shape on d becomes an elliptical light beam having a long axis in the y-axis direction as shown in FIG. 28, and the light receiving sections 172a and 172c
Is larger than the light receiving amounts of the light receiving units 172b and 172d, and the focus error signal is expressed by the following equation.

F. E> 0 When the recording medium 27 is away from the in-focus position, the first focal point 178 and the second focal point 179 generated by the astigmatism generating hologram 10 as shown in FIG.
172a, 172b, 172c, 1
The spot shape on 72d becomes an elliptical light beam having a long axis in the x-axis direction as shown in FIG.
The light receiving amount of 2d is larger than the light receiving amounts of the light receiving units 172a and 172c, and the focus error signal is expressed by the following equation.

F. E <0 The focus error signal detection method described above is known as an astigmatism method.

Therefore, in this embodiment, the light receiving element 13 is positioned using this principle. That is, the light receiving element 13 is held by some method (in this case, air tweezers for sucking the back surface of the light receiving element 13 from the hole provided in the heat sink 4), and the installation position can be finely adjusted.
Further, a reflection plate (not shown) is provided at the position of the recording medium 27. At this time, a UV adhesive is applied to the bottom surface of the light guide member 5 or the top surface of the light receiving element 13 in advance. Then, first, the intensity of the light reflected by the reflector and returned is monitored by the light receiving units 170 and 171 of the light receiving element 13, and the like.
The rough optimal position is determined. Then, the respective light receiving units 172a, 172 of the light receiving unit 172 divided into four parts are next.
While monitoring the current or voltage (proportional to the amount of received light) from 72b, 172c, and 172d, respectively, the reflector is intentionally vibrated parallel to the optical axis using a piezo element or the like. As a result, the reflector approaches or moves away from the light receiving element 13. At this time, the light receiving section 17
If the light receiving element 13 is moved so that the light amounts of the light receiving elements 2a, 172b, 172c, and 172d become substantially equal, precise positioning of the light receiving element 13 with respect to the light guide member 5 becomes possible. FIGS. 30 and 31 show the states of signals from light receiving sections 172a and 172b at this time. After the positioning of the light receiving element 13 in this manner, ultraviolet rays are irradiated to solidify the UV adhesive. Then, the gap 17 is closed by using an epoxy potting agent or solder to seal the air tweezers hole.

As a fixing method, an instant adhesive may be used in addition to the UV adhesive. In this case, an instant adhesive is applied after positioning. It is preferable to use an instant adhesive that does not whiten during drying. When a UV adhesive is used for both the adhesion between the block 3 and the light guide member 5 and the adhesion between the light guide member 5 and the light receiving element 13, the distance between the light source 1 and the light guide member 5 is reduced. After both the positioning of the light guide member 5 and the light receiving element 13 are completed, the ultraviolet irradiation is performed, or after the UV bonding of the block 3 and the light guide member 5 is completed,
A UV adhesive is applied between the light guide member 5 and the light receiving element 13.

Note that the recording medium 2 is actually
7 may be arranged, and the recording medium 27 may be rotated to generate surface runout, thereby performing position adjustment. Further, here, the method of positioning the light source 1 and the light guide member 5 and the method of positioning the light guide member 5 and the light receiving element 13 by making the light source 1 emit light has been described. A method is also conceivable in which the image is recognized using a CCD or the like, the components and a reference position are recognized, and the relative position is set to a predetermined size.

Finally, in a separate step, a cover member 16 is attached to the upper surface of the shell 15 using an epoxy-based adhesive, and the bottom surface of the integrated member is attached to the package 14.
Mount on top of An epoxy adhesive is mainly used for attachment. Further, this work is performed on N2, He, Ne, Ar
By performing in a dry antioxidant gas atmosphere such as
The inside of the packaging of the optical pickup can be purged.

According to the manufacturing method described above,
The optical pickup packaging is completed. By using such a manufacturing method, the packaging of the optical pickup having the light guide member 5 having such a shape can be performed more easily and precisely, and the yield can be improved.

Next, a method of manufacturing an optical pickup package according to an embodiment of the present invention will be described with reference to FIG.
12 to FIG. 12 will be described. However, description of the same parts as those in the above-described embodiment will be omitted.

FIGS. 32 to 36 are views showing a manufacturing procedure of the optical pickup packaging in one embodiment of the present invention. First, the LD block will be described. This LD block is mounted on the substrate 18 of the ceramic package 18.
b. A method such as cream soldering is used for the attachment. At this time, care must be taken so that the bonded portion of the LD block does not melt and shift.
The submount 2 is directly mounted on the substrate 1 without using the block 3.
Mounting on the upper surface of 8a or 18b is also conceivable. In this case, the flatness, parallelism, and the like of the contact surface of the ceramic package 18 with the light guide member 5 must be high.

Next, the procedure for manufacturing the ceramic package 18 will be described. First, the three substrates 18a, 18b, which have been pressed and formed into a predetermined shape but not yet sintered,
An electrode (not shown) for supplying power, a pattern electrode (not shown) for extracting a signal detected by the light receiving element 13 to the outside, and a ring 23 Form a pattern. Further, a through hole 19 (shown in FIG. 10) is provided so that the terminal 20 and the light source 1 are electrically connected, and a pattern is formed on the inner surface thereof or a metal paste such as W is embedded therein. Each pattern basically metalizes a metal film such as W. Further, an Au surface is formed at a portion where electrical contact is required. And these three substrates 18a, 18b,
18c are stacked and fired to form a Ni-plated layer thereon, and the terminals 20 are soldered to the electrode surfaces provided on the through holes 19 for taking in power or Ag
The ring 23 is mounted on the substrate 18a by soldering or Ag brazing or the like, and Ni plating is again performed thereon, followed by Au plating to complete the ceramic package 18.

Thereafter, wire bonding is performed in the same manner as in the above-described embodiment, the light guide member 5 is positioned, and then mounted on the block 3. The light receiving element 13 is also positioned, and then mounted on the bottom surface of the light guide member 5. Also, the substrate 18
The gap 17 between the opening c and the light receiving element 13 is also sealed with an epoxy potting agent or the like. Thereafter, the cap 22 is placed on the ring 23 and attached by electric resistance welding, cold pressure welding, soldering, or the like. The packaging of the optical pickup is completed by the above manufacturing procedure. When the cap 22 is made of metal and the cover member 16 is made of glass, the bonding method between the cap 22 and the cover member 16 may be glass bonding.
It is preferable from the viewpoint of low water absorption.

According to the manufacturing method described above,
The optical pickup packaging is completed. By using such a manufacturing method, the packaging of the optical pickup having the light guide member 5 having such a shape can be performed more easily and precisely, and the yield can be improved.

Next, a method of manufacturing an optical pickup package according to an embodiment of the present invention will be described with reference to FIG.
15 to FIG. 15 will be described.
However, description of the same parts as those of the above-described embodiment will be omitted.

FIG. 37 to FIG. 41 are views showing the procedure for manufacturing the packaging of the optical pickup in one embodiment of the present invention. First, an LD block including the light source 1 and the submount 2 is attached to a predetermined position of the stem 24. At this time, care must be taken that the light emitting surface of the light source 1 and the inner wall of the stem 24, which is the mounting surface of the light guide member 5, are parallel and the error in the distance between the two surfaces is 10 μm. Then, the light guide member 5 is attached to the side surface portion 24a of the stem 24 after the positioning thereof is performed in the same manner as in the above-described embodiment. In addition, a terminal 20 for power supply is attached to a predetermined position on the stem 24 in advance. Attachment of the terminal 20 is performed by providing a hole through the stem 24 at a predetermined position of the stem 24, and at the center of the hole,
The terminal 20 is set up so that the end of the terminal 20 extends slightly above the upper surface of the stem 24, and then an insulator such as glass whose linear expansion coefficient is close to that of the material of the stem 24 is poured around the terminal 20 to insulate and fix it. Do it. Further, the light guide member 5
Except for the mounting surface between the stem 24 and the stem 24
Since this portion is not in contact with the resin, an epoxy resin or the like is poured into the portion to make it easier to purge later, and the portion is sealed so that airtightness can be completely maintained.

Next, the package 25 is attached to the stem 24. The light receiving element 13 and the lead frame 14a are molded in the package 25 in advance. In the manufacturing procedure of the package 25, first, an adhesive such as Ag epoxy is applied to a predetermined position on the lead frame 14a in advance, and the light receiving element 13 is mounted and fixed thereon. Then, wire bonding is performed between the electrode surface of the light receiving element 13 and the leg 14b of the lead frame using the wire 14d. In this case, unlike the previous embodiment, it is not necessary to use a longer Au wire. Thereafter, the lead frame 14a is put into a molding machine, and transfer molding is performed with a resin such as urethane having a high light transmittance and a stable transmittance and refractive index.
Becomes Here, since the urethane resin or the like used in the package 25 is transparent, light other than the component to be detected may enter the light receiving element 13. Therefore, here, a surface other than the entrance of the reflected light is subjected to stray light processing such as satin finish processing so as to prevent light outside the detection target from entering the light receiving element 13. Further, a through hole is provided in the package 25 so that the terminal 20 can be taken out of the package 25. An epoxy-based adhesive, a UV adhesive, or the like is applied in advance to at least one of the surface of the package 25 facing the stem 24 or the surface of the stem 24 facing the package 25. After adjusting the position while moving the entire package 25 by the method shown, the stem 24 and the package 25 are adhered, and the cap 22 to which the cover member 16 is attached is attached to the stem 24 in a nitrogen gas atmosphere. Is completed.

According to the manufacturing method described above,
The optical pickup packaging is completed. By using such a manufacturing method, the packaging of the optical pickup having the light guide member 5 having such a shape can be performed more easily and precisely, and the yield can be improved.

In the manufacturing method described in the above three embodiments, when the structures are used in combination, for example, as shown in FIG.
In the first embodiment shown in FIG. 1, instead of bonding the light receiving element to the light guide member, the light receiving element is molded in a package as in the embodiment shown in FIGS. Naturally, the manufacturing methods are also used in combination.

[0088]

According to the present invention, the volume ratio of the optical pickup to the conventional optical pickup can be reduced by using a light source, an optical guide member, a light receiving element, and a storage member as the packaging of the optical pickup. The size was reduced to 1/50. Furthermore, since the heat generated in the light source can be efficiently released to the outside by using the base and the holding member, malfunction and destruction of the light source can be prevented.
In addition, by covering the top of the package with a cover member, it is possible to reduce the adhesion of dust and the like inside the package, prevent unnecessary refraction of light, malfunction and deterioration of the light receiving element, and easily purge the inside of the package. Will be able to do it. Further, since a part of the storage member is made of a light-transmitting material and the inside of the storage container is sealed, it is possible to prevent dust and the like from adhering to the inside of the package and also prevent deterioration of optical characteristics. By sealing the space between the through hole of the base and the light receiving means, the airtightness inside the packaging can be enhanced, and the invasion of dust and dust and the oxidation and deterioration of each member can be prevented. Further, by setting the thermal conductivity of the holding member to 100 w / mK or more, heat generated in the light source can be efficiently released, so that the light source 1 is not adversely affected by heat.

Further, the base on which the light source and the holding member are mounted and the storage member molded with the connection member are joined, the light receiving means and the storage member are arranged in a predetermined positional relationship, and the connection member and the light reception means are wire-bonded. Then, the light guide member is disposed in the storage member, joined to the holding member and the light receiving unit, and the storage member and the cover member are joined to each other. The packaging of the optical pickup on which the guide member is mounted can be performed more easily and precisely, and the yield can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing the configuration of the optical pickup packaging according to the embodiment of the present invention;

FIG. 3 is a conceptual diagram of an operation of the optical pickup according to the embodiment of the present invention;

FIG. 4 is a plan view of an optical pickup according to an embodiment of the present invention.

FIG. 5 is a perspective view of a V-shaped groove substrate of the optical pickup according to the embodiment of the present invention.

FIG. 6 is a diagram showing a light receiving unit arrangement and signal processing of the optical pickup according to one embodiment of the present invention;

FIG. 7 is a side view of an optical pickup according to an embodiment of the present invention.

FIG. 8 is a plan view of an optical pickup according to an embodiment of the present invention.

FIG. 9 is a diagram showing a light receiving unit arrangement and signal processing of the optical pickup according to one embodiment of the present invention;

FIG. 10 is a diagram showing a configuration of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 11 is a diagram showing a configuration of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 12 is a diagram showing a packaging configuration of an optical pickup according to an embodiment of the present invention.

FIG. 13 is a diagram showing a configuration of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 14 is a diagram showing a configuration of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 15 is a diagram showing a configuration of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 16 is a diagram showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 17 is a diagram showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 18 is a diagram showing a manufacturing procedure of the optical pickup packaging according to the embodiment of the present invention;

FIG. 19 is a diagram showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 20 is a diagram showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 21 is a conceptual diagram showing a mismatch between zero-order light and primary light observed by a CCD according to an embodiment of the present invention.

FIG. 22 is a conceptual diagram showing coincidence between zero-order light and primary light observed by a CCD according to an embodiment of the present invention.

FIG. 23 is a conceptual diagram of an observation experiment according to an embodiment of the present invention.

FIG. 24 is an external view of an astigmatic light beam according to an embodiment of the present invention.

FIG. 25 is an external view of an astigmatic light beam according to an embodiment of the present invention.

FIG. 26 is an external view of an astigmatic light beam according to an embodiment of the present invention.

FIG. 27 is a diagram showing a beam spot shape on a light receiving sensor according to one embodiment of the present invention.

FIG. 28 is a diagram showing a beam spot shape on a light receiving sensor according to an embodiment of the present invention.

FIG. 29 is a diagram showing a spot shape of a beam on a light receiving sensor according to an embodiment of the present invention.

FIG. 30 is a diagram showing a sensor light amount on a light receiving sensor in one embodiment of the present invention.

FIG. 31 is a diagram showing a sensor light amount on a light receiving sensor in one embodiment of the present invention.

FIG. 32 is a diagram showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 33 is a diagram showing a manufacturing procedure of the optical pickup packaging according to the embodiment of the present invention;

FIG. 34 is a diagram showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 35 is a diagram showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 36 is a diagram showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 37 is a diagram showing a manufacturing procedure of the optical pickup packaging according to the embodiment of the present invention;

FIG. 38 is a diagram showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 39 is a view showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 40 is a view showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

FIG. 41 is a view showing a manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Light source 2 Submount 2a Electrode surface 3 Block 3a Projection part 3b Side surface part 4 Heat sink 5 Light guide member 5a First slope 5b Second slope 5c Third slope 5d V-shaped groove 5e surface 5f surface 6 Diffraction grating 7 Diffusion angle conversion hologram 8 Reflection film 9 First beam splitter film 10 Astigmatism generation hologram 11 Second beam splitter film 12 Polarization separation film 13 Light receiving element 13a Electrode 14 Package 14a Lead frame 14b Lead frame foot 14c Step 14d Wire Reference Signs List 15 shell 16 cover member 16a antireflection film 17 gap 18 ceramic package 18a, 18b, 18c substrate 18d electrode 18e electrode 19, 19a, 19b, 19c through hole 20 terminal 21 high frequency superimposed power supply circuit 22 cap 23 ring 24 stem 24a side surface Part 24b step 25 package 25a side wall part 26 objective lens 27 recording medium 27a information recording surface 28 second beam splitter film 29a, 29b, 29c beam spot 30 ideal spherical wave 31 V-groove substrate 31a reflection surface 32 CCD 117 transmitted light 119 sensor Substrate 120 Reflected light 121 Polarization separating film 122 Reflecting film 123 Reflected light 125 Reflecting film 126 Reflecting film 170, 171, 172, 172a, 172b, 172
c, 172d, 176, 177 Light receiving unit 301 Block 302 Submount 303 Light source 304 Light guide member 305a First slope 305b Second slope 305c Third slope 305d Fourth slope 305e Fifth slope 306 Diffusion angle conversion hologram 307 Diffraction grating 308 First beam splitter film 309 Objective lens 310 Recording medium 316 Second beam splitter film 317 Transmitted light 318 1/2 wavelength plate 319 Light receiving element 320 Reflected light 321 Polarized light separating film 322 Reflected film 323 Reflected light 324 Non Point aberration generating hologram 325, 326 Reflective film 370, 371, 372, 376, 377 Light receiving unit

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Mikio Tomisaki 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. 72) Inventor Kazuyuki Nakajima 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term (reference) 2H038 AA12 BA03 5D117 AA02 CC07 KK02 KK14 KK20 5D119 AA01 BA01 FA35 JA34 MA01 NA01 5F073 AB25 AB29 BA04

Claims (75)

[Claims] 1. A light source, a light guide member having a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, and receiving light and converting a received optical signal into an electric signal. Light receiving means, and a storage member for storing the light source, the light guide member, and the light receiving means, wherein the light guide member reflects light from the light source on the plurality of inclined surfaces and guides the light to an optical medium. An optical pickup for guiding light reflected from the optical medium to the light receiving means. 2. The light guide member according to claim 1, wherein an opposing portion of the storage member that opposes an input / output portion that emits light to the optical medium or receives reflected light from the optical medium is made of a light transmitting material. 2. The optical pickup according to claim 1, wherein the optical pickup is sealed. 3. The optical pickup according to claim 2, wherein an antioxidant gas is sealed inside the closed storage container. 4. The incident direction of light emitted from a light source of the light guide member, and the incidence of light emitted from the light guide member to the optical medium and light reflected by the optical medium and returned to the light guide member. 4. The optical pickup according to claim 1, wherein the direction is substantially perpendicular. 5. A light source, a light guide member having a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, and receiving light and converting a received optical signal into an electric signal. A light receiving unit, a storage member that stores the light source, the light guide member, and the light receiving unit and has an opening, and a cover member that covers the opening of the storage member, wherein the light guide member is provided from the light source. An optical pickup, wherein the light reflected by the plurality of inclined surfaces is guided to the optical medium via the cover member, and the light reflected from the optical medium is guided to the light receiving means. 6. An optical guide member, wherein a facing portion of a storage member that faces light input / output portions for emitting light to an optical medium and for entering reflected light from the optical medium is formed of a light-transmitting material. 6. The optical pickup according to claim 5, wherein the optical pickup is sealed. 7. The optical pickup according to claim 6, wherein an antioxidant gas is sealed inside the closed storage container. 8. An incident direction of light emitted from a light source of the light guide member, and an incident direction of light emitted from the light guide member to the optical medium and light reflected by the optical medium and returned to the light guide member. Are substantially perpendicular to each other.
An optical pickup according to any one of claims 6 and 7. 9. The optical pickup according to claim 5, wherein the cover member and the light guide member are brought into contact with each other. 10. The thickness (t1) of the cover member is set to 0.3 ≦ t.
The optical pickup according to claim 9, wherein 1 ≦ 3.0 (mm). 11. The optical pickup according to claim 5, wherein a gap is provided between the cover member and the light guide member. 12. The thickness (t2) of the cover member is set to 0.1 ≦ t.
12. The lens system according to claim 11, wherein 2 ≦ 3.0 (mm).
Optical pickup as described. 13. The light according to claim 11, wherein a distance (d) between the cover member and the light guide member is 0.1 ≦ d ≦ 3.0 (mm). pick up. 14. A light source, a holding member for holding the light source, a light guide member having a plurality of inclined surfaces inclined with respect to the incident direction of the light emitted from the light source, and a light receiving and receiving light. Light receiving means for converting the converted light signal into an electric signal, and a housing member for housing the light source, the light guide member and the light receiving means and having an opening, wherein the holding member has a thermal conductivity (w) w ≧ 100 (w / mK), and the light guide member reflects the light from the light source on the plurality of inclined surfaces to guide the light from the light source to the optical medium through the cover member, and also through the cover member. An optical pickup for guiding light reflected from the optical medium to the light receiving means. 15. An opposing portion of a storage member, which opposes an input / output portion of the light guide member which emits light to an optical medium or receives reflected light from the optical medium, is made of a light-transmitting material, and the inside of the storage portion is formed. The optical pickup according to claim 14, wherein the optical pickup is sealed. 16. An optical pickup according to claim 15, wherein an antioxidant gas is sealed inside the closed storage container. 17. An incident direction of light emitted from a light source of the light guide member, and an incidence of light emitted from the light guide member to the optical medium and light reflected by the optical medium and returned to the light guide member. 17. The optical pickup according to claim 14, wherein the direction is substantially perpendicular. 18. The optical pickup according to claim 14, wherein the holding member is composed of a plurality of members, and the size of the member increases as the distance from the light source increases. 19. The optical pickup according to claim 14, wherein the holding member and the light guide member are in contact with each other. 20. The apparatus according to claim 14, wherein the holding member and the storage member are brought into contact with each other.
9. The optical pickup according to any one of 9 above. 21. A holding member having a linear expansion coefficient (k) of 3 × 10 -6.
14. The apparatus according to claim 14, wherein a condition of .ltoreq.k.ltoreq.10.times.10 @ -6 (/ DEG C.) is satisfied.
0. The optical pickup according to any one of 1. 22. A light source, a light guide member having a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, and receiving light and converting a received optical signal into an electric signal. A light receiving unit, a storage member that stores the light source, the light guide member, and the light reception unit, and a base on which the storage member is mounted, wherein the light guide member transmits light from the light source to the plurality of light sources. An optical pickup, wherein the light is reflected by an inclined surface and guided to an optical medium, and the light reflected from the optical medium is guided to the light receiving means. 23. An opposing portion of a storage member, which opposes an input / output portion of the light guide member which emits light to an optical medium or receives reflected light from the optical medium, is made of a light-transmitting material, and the inside of the storage portion is formed. 3. The container is sealed.
2. The optical pickup according to item 2. 24. The optical pickup according to claim 23, wherein an antioxidant gas is sealed inside the closed storage container. 25. An incident direction of light emitted from a light source of the light guide member, and an incident direction of light emitted from the light guide member to the optical medium and light reflected by the optical medium and returned to the light guide member. Are substantially perpendicular to each other.
The optical pickup according to any one of 2, 23, and 24. 26. An optical pickup according to claim 22, wherein a light source is mounted on a base. 27. A light source, a holding member for holding the light source, a light guide member having a plurality of inclined surfaces inclined with respect to the incident direction of the light emitted from the light source, and receiving and receiving light. Light receiving means for converting the converted optical signal into an electric signal, the light source, the holding member, the light guide member, and the light receiving means are housed, and the light guide member emits light to or from the optical medium. A storage member having an opening at a portion facing the incident / emission portion for receiving the reflected light; and a cover member covering the opening, wherein the holding member has a thermal conductivity (w) w ≧ 100 (w / mK), and the light guide member reflects light from the light source on the plurality of inclined surfaces to guide the light from the optical medium to the optical medium through the cover member. Light receiving means The optical pick-up, characterized in that lead. 28. The optical pickup according to claim 27, wherein the inside of the storage member is sealed. 29. The optical pickup according to claim 28, wherein an antioxidant gas is sealed inside the closed storage container. 30. The incident direction of light emitted from the light source of the light guide member, and the light emitted from the light guide member to the optical medium and the light reflected by the optical medium and returned to the light guide member. 30. The optical pickup according to claim 27, wherein the incident direction is substantially perpendicular. 31. The optical pickup according to claim 27, wherein the cover member and the light guide member are brought into contact with each other. 32. The thickness (t1) of the cover member is set to 0.3 ≦ t.
32. The condition of 1 ≦ 3.0 (mm) is set.
Optical pickup as described. 33. A gap is provided between a cover member and a light guide member.
An optical pickup according to any one of the above. 34. The thickness (t2) of the cover member is set to 0.1 ≦ t
34. The lens system according to claim 33, wherein 2 ≦ 3.0 (mm).
Optical pickup as described. 35. The optical pickup according to claim 33, wherein a distance (d) between the cover member and the light guide member is set to 0.1 ≦ d ≦ 3.0 (mm). 36. The holding member is divided into two or more members, and the members are arranged so that the cross-sectional area of the members increases in the order from a member closer to the light source to a member farther from the light source. 35. The optical pickup according to any one of 35. 37. The light guide member according to claim 27, wherein the light guide member is mounted in contact with the holding member.
Optical pickup as described. 38. The optical pickup according to claim 27, wherein the holding member and the storage member are mounted in contact with each other. 39. A holding member having a linear expansion coefficient (k) of 3 × 10 -6.
The optical pickup according to any one of claims 27 to 38, wherein a condition of ≤ k ≤ 10 x 10-6 (/ ° C) is satisfied. 40. A light source, a light guide member having a plurality of inclined surfaces inclined with respect to the incident direction of light emitted from the light source, and receiving light and converting the received optical signal into an electric signal. A light receiving unit, which accommodates the light source, the light guide member, and the light receiving unit, and faces an input / output portion of the light guide member which emits light to an optical medium or receives reflected light from the optical medium. A storage member having an opening in a portion, a cover member covering the opening, and a base on which the storage member is placed, wherein the light guide member transmits light from the light source on the plurality of inclined surfaces. An optical pickup, wherein the light is reflected and guided to the optical medium via the cover member, and the light reflected from the optical medium is guided to the light receiving means. 41. A light source, a holding member for holding the light source, a light guide member having a plurality of inclined surfaces inclined with respect to the incident direction of the light emitted from the light source, and a light receiving and receiving light. Light receiving means for converting the optical signal into an electric signal, a light receiving member, a holding member for holding the light guide member and the light receiving means, and a base for mounting the light receiving member, Holding member has thermal conductivity (w) w
≧ 100 (w / mK), and the light guide member reflects light from the light source on the plurality of inclined surfaces, guides the light from the light source to the optical medium through the cover member, and reflects the light from the optical medium. An optical pickup for guiding the received light to the light receiving means. 42. A light source, a holding member for holding the light source, a light guide member having a plurality of inclined surfaces inclined with respect to the incident direction of the light emitted from the light source, and a light receiving and receiving light. Light receiving means for converting the converted optical signal into an electric signal, and housing the light source, the holding member, the light guide member, and the light receiving means, and emitting light to the optical medium in the light guide member or from the optical medium. A storage member having an opening at a portion opposite to an incident / emission portion that receives reflected light, a cover member that covers the opening, and a base on which the storage member is placed, wherein the holding member is In addition to satisfying a condition of thermal conductivity (w) w ≧ 100 (w / mK), the light guide member reflects light from the light source on the plurality of inclined surfaces to the optical medium via the cover member. Guide and light medium An optical pickup characterized in that leads to the light receiving means the light reflected from. 43. A light emitting surface of a light source and a surface of the light guide member facing the light source are substantially parallel to each other.
42. The optical pickup according to any one of items 42. 44. The optical pickup according to claim 1, wherein the light guide member and the light receiving means are brought into close contact with each other. 45. An optical pickup according to any one of claims 1 to 13, 22 to 26, and 40 to 42, wherein the light source and the housing member are in close contact with each other. 46. A light-receiving device according to claim 1, wherein the light-receiving means is molded on the storage member, and all surfaces of the storage member facing the light-receiving means are formed of a light-transmitting substance. 1. The optical pickup according to 1. 47. A light source, a holding member for holding the light source, and a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, wherein the plurality of inclined surfaces are substantially parallel to each other. A light guide member arranged and various optical elements formed on the plurality of inclined surfaces, a light receiving unit for converting light transmitted through the light guide member into an electric signal, and an electric signal converted by the light receiving unit. A connection member to be taken out,
A housing member that houses the light source, the holding member, the light guide member, the light receiving unit, and the connection member, has a storage member having an opening, and a cover member that covers the opening of the storage member. Optical pickup. 48. The optical pickup according to claim 47, wherein the light guide member and the holding member are brought into contact. 49. The optical pickup according to claim 47, wherein the light receiving means and the light guide member are brought into contact with each other. 50. The optical pickup according to claim 47, wherein the holding member is mounted on the storage member. 51. The apparatus according to claim 47, wherein said cover member and said storage member are joined via a mounting ring.
The optical pickup according to any one of 9,50. 52. An optical pickup according to claim 47, wherein said housing member is made of a ceramic material. 53. The optical pickup according to claim 47, wherein the connection member is molded on the housing member. 54. A light source, a holding member for holding the light source, and a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, wherein the plurality of inclined surfaces are substantially parallel to each other. A light guide member arranged and various optical elements formed on the plurality of inclined surfaces, a light receiving unit for converting light transmitted through the light guide member into an electric signal, and an electric signal converted by the light receiving unit. A connection member to be taken out,
The light source, the holding member, the light guide member, the light receiving means, and the connection member are housed, and a storage member having an opening, a cover member covering the opening of the storage member, and the storage member are mounted. An optical pickup, comprising: a base; 55. The optical pickup according to claim 54, wherein the light guide member and the holding member are brought into contact with each other. 56. An optical pickup according to claim 54, wherein said holding member is mounted on a base. 57. An optical pickup according to claim 54, wherein said light receiving means is in contact with said light guide member. 58. The optical pickup according to claim 54, wherein the light receiving means is molded in the housing member. 59. The optical pickup according to claim 54, wherein the connection member is molded on the housing member. 60. A base on which a light source and a holding member are mounted and a storage member molded with a connection member are joined, and a light receiving means and the storage member are arranged in a predetermined positional relationship. A wire bonding method, a light guide member is disposed in the storage member, the storage member and the light receiving unit are joined, and the storage member and the cover member are joined. 61. The method of manufacturing an optical pickup according to claim 60, wherein a UV adhesive is used in joining the light guide member to the light receiving means and the holding member. 62. The method for manufacturing an optical pickup according to claim 60, wherein an instant adhesive is used in joining the light guide member to the light receiving means and the holding member. 63. An apparatus according to claim 60, wherein a through-hole is provided in the base, and an adjustment jig is inserted from said through-hole in fine adjustment to a position to be performed when the light receiving means and the light guide member are joined. 61. The method for manufacturing an optical pickup according to any one of claims 61 to 62. 64. The fine adjustment of the position at the time of joining the light receiving means and the light guide member is performed based on the amount of light emitted from the light source and returned to the light receiving means. 63. The method of manufacturing an optical pickup according to any one of 63. 65. The fine adjustment of the position performed when the holding member and the light guide member are joined is performed based on the deviation of the image formed at the position of the optical medium caused by the difference in the components of the light emitted from the light source. The method for manufacturing an optical pickup according to any one of claims 60 to 64, characterized in that: 66. A connecting member is molded, a storage member which has been subjected to a predetermined treatment in advance and an LD block having a light source and a holding member are joined, and a light receiving means and the storage member are arranged in a predetermined positional relationship. A light bonding method, wherein a connection member and the light receiving unit are wire-bonded, a light guide member is arranged in the storage member, the LD block and the light receiving unit are bonded, and the storage member and the cover member are bonded. Pickup manufacturing method. 67. The method of manufacturing an optical pickup according to claim 66, wherein an ultraviolet-curing adhesive is used in joining the optical guide member and the LD block. 68. A moisture absorbing adhesive is used for joining the light guide member and the LD block.
A manufacturing method of the optical pickup according to the above. 69. The method of manufacturing an optical pickup according to claim 66, wherein the joining of the storage member and the cover member is performed via a ring. 70. A base on which a light source and a holding member are mounted and a light guide member are joined, and the base and a storage member in which light receiving means and connection means are molded are joined in a predetermined positional relationship. A method of manufacturing an optical pickup, comprising joining the base and a cover member. 71. The method of manufacturing an optical pickup according to claim 70, wherein an ultraviolet-curing adhesive is used in joining the optical guide member and the base. 72. A moisture absorbing adhesive is used for joining the light guide member and the LD block.
A manufacturing method of the optical pickup according to the above. 73. A light source, a holding member for holding the light source, and a plurality of inclined surfaces inclined with respect to the incident direction of the light emitted from the light source, wherein the plurality of inclined surfaces are substantially parallel to each other. A light guide member arranged and various optical elements formed on the plurality of inclined surfaces, a light receiving unit for converting light transmitted through the light guide member into an electric signal, and an electric signal converted by the light receiving unit. A connection member to be taken out,
The light source, the holding member, the light guide member, the light receiving means, and the connection member are housed, and a storage member having an opening, a cover member covering the opening of the storage member, and the storage member are mounted. And a base having a through-hole and sealing between the through-hole of the base and the light receiving means. 74. An optical pickup characterized in that an epoxy potting agent is used as a sealant for sealing between the through hole of the base and the light receiving means. 75. An optical pickup characterized in that solder is used as a sealant for sealing between the through hole of the base and the light receiving means.