JPH0939009A - Hot press - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hot press reducing the in-plane irregularity of the heating and pressing to a base plate to be bonded to enhance the thickness accuracy of the base plate and capable of producing the base plate to be bonded with good workability. SOLUTION: One sides of two frames having membrane sheets 21, 26 respectively bonded thereto are mutually fixed in a freely openable and closable manner by a hinge 20 and a clamp mechanism 18 and an opening and closing protruding part are provided to one sides on the side opposite to the hinge attaching position of the frames to constitute a hermetically sealed member S and the operation mechanisms 6b, 5b of the clamp mechanism 18 and the opening and closing protruding part are provided to the upper part in a tank 2 and a heating medium vapor generation part 9 is provided to the lower part in the tank 2. The hermetically closed member is raised and lowered by the lift mechanism 4 provided to the tank 2 and the hermetically sealed member S in which a base plate 24 to be bonded is inserted is clamped, released, opened and closed in the upper part of the tank by an operation mechanism and heated in the lower part of the tank by the vapor of a heating medium 8 in the pressed state by the operation of a vacuum exhaust device 40.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot press for adhering a substrate to be adhered by heating, pressurizing and adhering it when manufacturing a thin printed circuit board or a liquid crystal glass substrate, and in particular, between two thin film sheets. At least two substrates to be adhered having substantially the same size are arranged at intervals of the thickness of the adhesive, the periphery of the thin film sheet is hermetically sealed and decompressed, and the differential pressure inside and outside the hermetically sealed sheet is used. The present invention relates to a hot press for adhering substrates to be adhered with a uniform pressure.

[0002]

2. Description of the Related Art Conventionally, a printed circuit board is manufactured as follows. That is, a printed circuit board of approximately the same size printed with a predetermined circuit pattern and a prepreg in which a cloth base material is impregnated with an adhesive resin are alternately laminated up to a required number of sheets, and the printed circuit board and the prepreg are laminated. The printed board material (substrate to be adhered) is heated and pressed by a hot plate. Then, the adhesive resin reaches the minimum viscosity from the softened and fluidized state at the same time as the temperature rises, and thereafter, the adhesive resin enters a stable curing state as the chemical reaction proceeds. As a result, the materials of the plurality of printed circuit boards are mutually adhered and integrated by the adhesive resin of the prepreg to form a printed circuit board. Then, in order to increase the density of the printed circuit board, a vacuum atmosphere is used until the adhesive resin of the prepreg is softened and flown, and the fluidized resin is pressed from all directions in a high-pressure gas atmosphere in the flow to curing step so that the pressure between the layers of the printed circuit board is increased. Hot presses have been proposed to achieve void removal and uniform thickness forming. As a technique for introducing heating and pressurizing using such a hot plate, for example, Japanese Patent Laid-Open No. 3-1
28195 and the like.

Further, after using a high-pressure container called an autoclave, a plurality of printed circuit board materials are covered with a film or a sheet to form a hermetically sealed body, the inside of the hermetically sealed body is decompressed, and then the hermetically sealed body is subjected to the above-mentioned autoclave. -There is a technique of heating and pressurizing with fluid pressure such as nitrogen gas or carbon dioxide gas in the tank, for example, Japanese Patent Laid-Open No.
It is introduced in Japanese Patent Publication No. 1-45343.

[0004]

In the above-described heating and pressing technique using a hot plate, it has been attempted to increase the surface accuracy of the pressing surface for pressurization in order to enable highly accurate uniform thickness forming. There is a limit in improving the surface accuracy, and the substrate to be adhered itself has irregularities and undulations, so that there is a limit in equalizing and pressing with this type of technique. In particular, when adhering a thin glass substrate, it is necessary to prevent damage to the glass substrate material and press while following the undulation of the glass substrate,
There is a problem that the expected accuracy cannot be obtained even though the apparatus for performing pressure equalization and pressing of the glass substrate material becomes complicated.

[0005] A thin glass substrate was bonded and attached by a technique of heating and pressurizing with fluid pressure using an autoclave. With this technique, it is possible to almost uniformly pressurize and pressurize the glass substrate, but it takes time and effort to cover the glass substrate with a film or a sheet so that the inside can be depressurized, and the productivity is very high. The low level may hinder the production of line work.

In view of the above-mentioned problems of the prior art, the object of the present invention is to produce a substrate with high workability and a small thickness variation of the substrate due to a small in-plane variation of heating and pressurization for the substrate. It is to provide a hot press that can.

[0007]

SUMMARY OF THE INVENTION The above-mentioned object is to provide two thin films that form a hermetically sealed substrate with at least two substrates having substantially the same size and spaced by the thickness of the adhesive. The sealant composed of the two thin film sheets is inserted between the sheets, the sealant is placed in the tank, and the inside of the sealant is depressurized to apply the inserted substrate to be bonded due to the pressure difference from the outside of the sealant. In a hot press for pressing and heating by a heating means to bond substrates to be bonded, two frames to which the above-mentioned two thin film sheets are attached, and a hinge for fixing one side of the two frames to open and close freely An opening / closing projection provided on one side opposite to the hinge mounting position, a clamping mechanism for clamping the two frames to seal the inside, and the clamping mechanism provided on the upper part of the tank. And the operating mechanism of the opening / closing protrusion and the inside of the tank An internal heating mechanism, an elevating mechanism for elevating and lowering a sealed body composed of two thin film sheets attached to the two frames in the tank, and a vacuum for reducing the pressure inside the sealed body in the tank. An exhaust mechanism is provided, and the sealing mechanism is clamped, released and opened / closed by the operation mechanism in the upper part of the tank, and the sealed body is heated in a pressurized state in the lower part of the tank.

With the above structure, the sealing body can be clamped, released and opened / closed by the operating mechanism, so that the operator needs to take care of the insertion / removal of the substrate to be bonded into the sealing body and the sealing work. It can be performed easily and surely. Therefore, the exhaust gas pressure inside the sealed body is surely reduced, and the adherend substrate can be uniformly pressed by the pressure difference between the inside and the outside. Since the adherend substrate in the hermetically sealed body is heated through the thin film sheet, it is possible to reduce variations in temperature and obtain a highly accurate substrate. Since the thickness of the sealing body can be reduced by forming the sealing body with the inner frame and the outer frame, the number of sealing bodies housed in the same volume and simultaneously processed can be increased.

Further, after the cooling is completed, the clamp mechanism can be opened, the sealing body can be opened, and the operation of carrying out the substrate to be adhered can be started.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS.

In FIG. 1, 1 is a floor and 2 is a floor 1.
Installed on the bottom of the tank 2 and containing the heat medium 8 at the bottom, and the support base 3 of the sealed body S is provided at the top of the tank 2 with the driving rod 4a.
Drive device (elevation mechanism) 4 for vertically moving by, open / close drive device for opening and closing the sealed body S (operation mechanism of the opening / closing protrusion)
5. There is a clamp drive device (operation mechanism of the clamp mechanism) 6 that seals the sealing body S after closing it. Both drive devices 5,
Reference numeral 6 is for vertically driving hollow drive rods 5a, 6a, and holders 5b, 6b are attached to the drive rods 5a, 6a. Each drive rod 5a, 6a is rotated by the rotating device 7 shown in FIG. 2 as indicated by an arrow a. The rotating device 7 rotates both drive rods 5a and 6a simultaneously with the belt 7a.

FIG. 2 is a plan view, in which vertical drive devices 4 are provided at four corners, an opening / closing drive device 5 is arranged inside one side of the four corners, and a clamp drive device 6 is arranged outside thereof. Further, a rotating device 7 is arranged on the upper wall surface of the tank 2 on the side where both drive devices 5 and 6 are located.

What is shown by a dotted line in FIG. 2 is a drive rod 5a, 6
It is a belt 7a of the rotating device 7 for simultaneously rotating a.

At the inner bottom of the tank 2, an electric heater 9 for heating the liquid phase heat medium 8 having a large specific gravity with respect to air is provided.
A shutter 10 and an opening / closing device 11 for the shutter 10 are installed in the middle part of the. The shutter 10 has a drawstring 11a and a weight 11b of an opening / closing device at four corners of a deformable square member.
Is put in a tension relationship by. The upper and lower sides of the tank 2 can be blocked when the support base 3 of the sealed body S is placed above.

An example of the heating medium 8 is "GALDEN" sold by Montecatini Co., Ltd.
"HT" (trade name) is effective, and in this example, the product type record number HT135 was used. In addition, a product model number HT200 or the like can be used as the heat medium 8.
A header 14 having a nozzle 13 for injecting cold compressed air to the sealed body S, a vacuum exhaust pipe 15 for exhausting and decompressing the inside of the sealed body S, and a door 16 for carrying in / out are provided above the tank 2. 5) is provided.

The supporting bodies 3 have supporting bases 17 for the number of insertion stages of the sealing bodies S, and a clamping device (clamping mechanism) 18 for the sealing bodies S is provided on each supporting base 17. As shown in FIGS. 3 and 4, the clamp device 18 is composed of a lever 18a, a stopper 18b and a toggle mechanism 18c, and the lever 18a is vertically operated by a holder 6b of the drive rod 6a. The sealing body S includes a lower inner frame 19 having a rectangular frame shape, a thin film sheet 21 attached to an upper surface of the lower inner frame 19, and an upper outer frame 2 having a rectangular frame shape.
9, a thin film sheet 26 attached to the lower surface of the upper outer frame 29, and a hinge (hinge) 20 (shown in FIG. 1) for connecting both frames 19, 29 on the opposite side of the clamp device 18. The upper outer frame 29 on the side of the clamp device 18 has a protrusion 29a,
The holder 5b of the drive rod 5a is operated up and down, and the upper outer frame 29 is operated in a direction indicated by an arrow b (shown in FIG. 3) with the hinge 20 as a fulcrum to open and close the sealed body S.

A lower thin film sheet 21 is provided on the upper surface of the lower inner frame 19 so as to enclose the frame 19 with a holding plate 22 and a holding screw 2.
3 is attached and fixed to the outer peripheral side of the lower inner frame 19, and the upper thin film sheet is attached.
The boot 26 is fixed to the upper outer frame 29 by a pressing plate 27 and a pressing screw 28. Further, the upper portion of the lower thin film sheet 21 is slightly larger than the outer shape of the substrate to be adhered 24 placed on the sheet 21, and has substantially the same shape as the lower inner frame 19 and has an exhaust groove 25a on the side of the substrate to be adhered 24. An elastic seal material 25 having a certain shape is adhered or placed, and the exhaust groove 25a communicates with the exhaust port 19a of the lower inner frame 19. The exhaust port 19a is connected to a vacuum exhaust device 40 via a vacuum exhaust pipe 15, an exhaust passage 30 (shown in FIG. 5) provided in one drive rod 4a, and a main exhaust pipe 31.

Outside the tank 2, a temperature controller 37 for controlling the temperature of the electric heater 9 and a pressure reducing valve 3 for adjusting the pressure of the compressed air obtained from the compressed air source 36 and blown out from the nozzle 13.
8, a supply switching valve 39 and a pipe 42 are installed.

Next, the operation of the apparatus of this embodiment having the above structure will be described.

First, as shown in FIG. 1, the adhered substrate 24 is attached to the lower thin film sheet 21 and the upper thin film sheet 26 by a loader / unloader (not shown) from the open door 16. The elastic seal material 25 is inserted in the middle position of the lower thin film sheet 21.
To position and load. The door 16 is closed after the insertion.

Here, the adhered substrate 24 to be adhered is a liquid crystal in which two glass substrates in which TFTs and the like necessary for display are formed in advance are kept at a distance by the thickness of the liquid crystal sealing sealant. A glass substrate is used. A spacer slightly thinner than the thickness of the sealant may be dispersed between the two glass substrates, but the presence of the spacer is not essential. The sealant serves as an adhesive for the two glass substrates, but at this point, it is semi-cured, that is, the two glass substrates are temporarily attached with the sealant.

Next, when the opening / closing drive device 5 is driven from the state shown in FIG. 3 to lower the drive rod 5a, the holder 5b supported by the drive rod 5a starts to descend, and the hinge 20 is used as a fulcrum to move upward. As shown in FIG. 4, the protruding portion 29a of the outer frame 29 is lowered until the upper thin film sheet 26 comes into contact with the elastic seal material 25, whereby the adhered substrate 24 is moved to the upper and lower thin film sheets 26, 21. Surround with.

Then, the clamp driving device 6 is driven to
When the drive rod 6a is lowered, the holder 6b supported by the drive rod 6a starts to descend, and the lever of the clamp device 18 is moved downward.
18a is lowered and the stopper 18b is lowered to move the upper outer frame 29
Is pressed against the elastic seal member 25 and clamped by the toggle mechanism 18c, and the adhered substrate 24 is moved to the upper and lower thin film sheets 26,
21 and the elastic seal material 25 are hermetically sealed.

Next, the vacuum exhaust device 40 is operated to exhaust the exhaust groove 25a of the elastic seal member 25 and the exhaust port 19 of the lower inner frame 19.
The inside of the sealed body S is depressurized to a required (desired) degree of vacuum through a, the vacuum exhaust pipe 15, the exhaust passage 30 in the drive rod 4a, and the main exhaust pipe 31.

With this pressure reduction control, the upper and lower thin film sheets 26, 21
Adheres to the upper and lower glass substrates constituting the adhered substrate 24 while following the undulations of the glass substrate and slowly and evenly presses the upper and lower surfaces of the glass substrate by the pressure difference from the atmospheric pressure. In this case, since the upper and lower glass substrates of the adherend substrate 24 are temporarily attached with the sealant, the upper and lower glass substrates can be pressure-equalized without causing displacement.

Next, as shown in FIG. 5, the holder-rotating device 7 is driven to drive the holders 5b and 6 of the drive rods 5a and 6a.
Rotate b, holder and lever 18a and protrusion 29
Disengage from a.

Then, the shutter opening / closing device is driven to open the shutter 10, and the vertical driving device 4 is driven to drive the driving rod 4.
a is lowered, and the support 3 on which the sealing body S is placed is lowered to a position slightly above the upper surface of the heat medium 8. on the other hand,
The heat medium 8 is heated by the electric heat heater 9 and the temperature controller 37 to generate steam of the heat medium 8, and the sealed body S is heated in the steam of the heat medium 8. Steam heating by the heat medium 8 and pressurization by the depressurizing force act on the sealed body S for a required (desired) time. In this case, the steam surface of the heat medium 8 is controlled by the temperature controller 37 so as not to exceed the position where the shutter 10 was, even though the whole sealed body S was wrapped with steam.

After the required processing time by heating and pressurization,
The vertical drive device 4 is driven to raise the support 3 on which the sealing body S is placed, and the shutter opening / closing device 11 is driven to close the shutter 10.

Next, as shown in FIG. 6, the compressed air cooled by exciting the switching valve 39 is reduced to a required pressure by the pressure reducing valve 38, and the nozzle 13 transfers from the nozzle 13 to the sealed body S via the pipe 42 and the header 14. Inject for a desired time. By this cooling, the bonding work of the bonded substrate 24 is completed.

The heat medium 8 condensed by cooling does not drip to the lower part of the inside of the tank due to the closing of the shutter 10, but receives the dew drop at the flange portion 2a inside the tank and goes through a recovery part (not shown). By heating appropriately, it is returned to the lower part in the tank.

When the bonding work is completed by the desired cooling,
By the operation reverse to that at the time of clamping, the rotating device 7 drives the drive rod 5a,
The holders 5b and 6b of 6a are rotated to engage the holders 5b and 6b with the lever 18a and the protrusion 29a. Next, when the holder 6b is raised by the clamp driving device 6 to raise the stopper 18b, and then the opening / closing driving device 5 is driven to raise the holder 5b, the upper outer frame 29 is raised as shown in FIG. The sealed state is released by the upper and lower membrane sheets 26, 21.

Therefore, the adhered substrate 24 is ready to be carried out, and the door 16 can be opened to carry out the adhered substrate 24 after completion of the bonding work by a loader / unloader (not shown).

Next, a second embodiment of the present invention will be described with reference to FIG. In the figure, the same types and functions as those in FIGS. 1 to 6 are denoted by the same reference numerals.

In this embodiment, the sealing body S can be formed in a vertical shape inclining at an angle of 10 to 15 degrees from the vertical when the substrate 24 to be adhered is delivered or heated and pressed by a loader / unloader (not shown). It has a structure.

In this case, when the support body 3 is lowered, the holders 5b and 6b are automatically disengaged from the lever 18a and the protrusion 29a, so that the rotating device 7 shown in FIG. Become. Further, since the connecting portion of the vacuum passage 30 communicating with the vacuum exhaust pipe 15 is biased to the upper portion of the drive rod 4a, the exhaust capacity is reduced accordingly, so that the sealed body S completes the sealed depressurization earlier than in the previous embodiment. However, the processing time can be shortened.

According to both embodiments of the present invention, since the upper outer frame 29 is inclined or vertical in the open state, the liquid-phase heat medium condensed in the cooling process is placed on the upper thin film sheet 26. Run down without stopping. The internal heating mechanism can use a heating element such as a heater or a high frequency element using gas as a heat medium.

Further, since the formation of the sealed body S and the release of the clamp (vacuum release) by the clamp operation are realized by the machine operation and do not require the labor of the operator, not only can the work be advanced in a short time, but also a plurality of simultaneous operations can be performed. The adherend substrate 24 can be handled, the productivity is high, and there is no fear of obstructing the flow work. Since the clamp mechanism and its operating mechanism are separable from each other, the moving weight of the support body 3 is reduced and the vertical drive unit 4 can be small in size.

The depressurizing process of the sealed body S sealed by the clamp mechanism by vacuum evacuation is such that vacuum evacuation can be performed at any of the upper and lower positions in the tank.
In the heating / pressurizing process, the sealed body S may be lowered to perform depressurization / pressurization in the lower part of the tank.

[0039]

As described above, according to the present invention, it is possible to produce a substrate to be adhered with good workability, because the in-plane variation of the heating and pressurization to the substrate to be adhered is small, the thickness accuracy of the substrate is high. it can.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a hot press according to a first embodiment of the present invention.

FIG. 2 is a plan view seen from above the hot press shown in FIG.

FIG. 3 is a partially enlarged view of the sealed body of the hot press shown in FIG. 1 in an open state.

FIG. 4 is a partially enlarged view of the sealed body of the hot press shown in FIG. 1 in a closed state.

5 is a vertical cross-sectional view showing a heat treatment state of the hot press shown in FIG.

FIG. 6 is a vertical cross-sectional view showing a cooling treatment state of the hot press shown in FIG.

FIG. 7 is a vertical sectional view showing a hot press according to a second embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Floor, 2 ... Tank, 3 ... Support body, 4 ... Vertical drive device, 4a, 5a, 6a ... Drive rod, 5 ... Opening / closing drive device, 5b, 6b ... Holder, 6 ... Clamp driving device, 7 ... Rotating device, 7a ... Belt, 8 ... Heat medium, 9 ...
..Electric heaters, 10 ... Shutters, 11 ... Opening / closing devices,
11a ... towline, 11b ... weight, 13 ... nozzle, 1
4 ... Header, 15 ... Vacuum exhaust pipe, 16 ... Door, 17 ...
..Supports, 18 ... Clamping devices, 18a ... Lever, 1
8b ... stopper, 18c ... toggle mechanism, 19 ... lower inner frame, 19a ... exhaust port, 20 ... hinge, 21, 26 ...
Thin film sheet, 22, 27 ... Holding plate, 23, 28 ... Screw, 24 ... Adhering substrate, 25 ... Elastic sealing material, 25a
... Exhaust groove, 29 ... Upper outer frame, 29a ... Projection part, 30 ...
Exhaust passage, 31 ... Main exhaust pipe, 36 ... Compressed air source, 37
... Temperature controller, 38 ... Pressure reducing valve, 39 ... Switching valve, 40 ... Vacuum exhaust device, 42 ... Piping, S ... Sealing body.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Akemi Miyashita 2-4-4 Jinritsu Higashi 2-chome, Tsuchiura City, Ibaraki Prefecture Hitachi Techno Engineering Co., Ltd. Tsuchiura Office (72) Inventor Mitsuo Fukuda 5-2 Koyodai, Ryugasaki City, Ibaraki Prefecture Ban Hitachi Techno Engineering Co., Ltd.

Claims (4)

[Claims] 1. A substrate to be adhered, which is composed of at least two substrates of approximately the same size and spaced by the thickness of the adhesive, is inserted between two thin film sheets constituting a hermetically sealed body, A sealed body composed of the two thin film sheets is placed in a tank, and the inside pressure is reduced to pressurize the inserted substrate to be bonded by a pressure difference from the outside of the sealed body and heat it by a heating means to bond the substrate. In a hot press for adhering, two frames to which the above-mentioned two thin film sheets are attached, a hinge for freely opening and closing one side of the two frames, and one side opposite to the hinge mounting position. The opening / closing protrusion provided on the
A clamp mechanism that clamps the individual frames together to seal the inside, a clamp mechanism and an operation mechanism of the opening / closing protrusion provided in the upper part of the tank, and an internal heating mechanism provided in the lower part of the tank. And an elevating mechanism for elevating and lowering a sealed body composed of two thin film sheets attached to the two frames in the tank, and a vacuum exhaust mechanism for depressurizing the inside of the sealed body in the tank. A hot press, characterized in that the above-mentioned operating mechanism clamps and releases and opens and closes the sealed body in the inner upper portion, and heats the sealed body in a pressurized state in the lower inner portion of the tank. 2. The hot press according to claim 1, wherein the elevating mechanism supports and elevates the sealed body in either a horizontal or vertical posture. 3. The hot press according to claim 1, wherein the internal heating mechanism generates and heats a heating medium vapor. 4. The hot press according to claim 1, wherein the thin film sheet is attached to opposing surfaces of two frames, an inner frame and an outer frame.