JPH09321429A - Manufacture of multilayer wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method wherein a large formation area of a conductor circuit can be obtained while ensuring reliability in a manufacturing method wherein an insulation resin layer is formed after a reference hole is stopped up by using an adhesive tape, a reference hole is exposed and then a conductor circuit is formed by using a reference hole as a reference for positioning. SOLUTION: In this method, a projection part 11 enclosing a reference hole 3 is provided to a core board 2 before an insulation resin layer is formed and a reference hole is stopped up by an adhesive tape put within a range which is enclosed with the projection part 11. Or the projection part 11 enclosing the reference hole 3 with an edge of the core board 2 is provided in the core board 2 before an insulation resin layer is formed and a reference hole is stopped up by an adhesive tape put within a range enclosed with an edge of the core board 2 and the projection part 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer wiring board used for electronic and electric equipment, and more particularly to a method for manufacturing a stacked type multilayer wiring board in which a conductor circuit is formed on an insulating resin layer. Regarding

[0002]

2. Description of the Related Art In recent years, as electronic and electric devices have become smaller and lighter, there has been a demand for thinner multilayer wiring boards. In order to meet this demand, a stack-type multilayer wiring board in which a conductor circuit is formed on an insulating resin layer is receiving attention. As a manufacturing method thereof, a method of sequentially performing the following steps is known. An insulating resin layer is formed on one surface of a core substrate (including a multi-layered substrate) on which a conductor circuit has been formed. A via hole is formed in the obtained insulating resin layer. A conductor circuit is formed on the insulating resin layer by a method such as copper plating. At this time, a conductor is also provided in the via hole, and the conductor circuit of the core substrate and the conductor circuit on the insulating resin layer are electrically connected by this conductor. Hereinafter, the above-mentioned steps are repeated to manufacture a desired multilayer wiring board.

In the above-mentioned stacking type multilayer wiring board manufacturing method, as shown in FIG. 4, a core substrate 2 having a conductor circuit 1 and a plurality of reference holes 3 formed therein is prepared [FIG. 4 (a)],
After closing the reference hole 3 with an adhesive tape 4 [Fig.
(B)], the insulating resin layer 5 is formed by covering the reference hole 3 [FIG. 4 (c)], and then the insulating resin layer 5 and the tape 4 on the reference hole 3 are removed by using, for example, a knife. Reference hole 3
Conventionally, a new conductor circuit is formed on the insulating resin layer 5 by using the exposed reference hole 3 as a reference for positioning for forming a conductor circuit.

However, in the above-mentioned conventional method, when the insulating resin layer 5 is formed, the adhesive component of the adhesive tape 4 exudes to the surroundings, and the film thickness of the insulating resin layer 5 at the exuded portion is reduced. There have been problems that the reliability of the multilayer wiring board is impaired, such as the problem of non-uniformity and the problem that the insulating resin layer 5 is easily peeled off.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an adhesive tape having a plurality of reference holes formed in a core substrate. After covering with the insulating resin layer, the insulating resin layer is formed by covering the reference hole, exposing the reference hole, and then using the exposed reference hole as a positioning reference for forming a conductor circuit. A method for manufacturing a multilayer wiring board in which a conductor circuit is formed on an insulating tape, which can reduce the exudation range of the adhesive component of an adhesive tape, and as a result, can form a new conductor circuit while ensuring reliability. An object of the present invention is to provide a manufacturing method capable of taking a large area on the resin layer.

[0006]

According to a first aspect of the present invention, there is provided a method for manufacturing a multilayer wiring board, wherein a reference hole is formed on a core substrate having a plurality of reference holes to form an insulating resin layer. After that, the insulating resin layer covering the reference hole is removed to expose the reference hole, and then the exposed reference hole is used as a positioning reference for forming the conductor circuit to form a conductor circuit on the remaining insulating resin layer. In the method for manufacturing a stacked-type multi-layer wiring board for forming a wiring board, a protrusion that surrounds the reference hole is provided on the core substrate before the insulating resin layer is formed, and an adhesive that is housed within a range surrounded by the protrusion is It is characterized in that the reference hole is closed with a sex tape.

According to a second aspect of the present invention, there is provided a method of manufacturing a multilayer wiring board, wherein a reference hole is formed on a core substrate having a plurality of reference holes by covering the reference holes with an insulating resin layer. The stacked insulating resin layer is removed to expose the reference hole, and the exposed reference hole is used as a positioning reference for forming a conductor circuit to form a conductor circuit on the remaining insulating resin layer. In the method for manufacturing a multilayer wiring board, a protrusion that surrounds the reference hole with the edge of the core substrate is provided on the core substrate before forming the insulating resin layer, and a range surrounded by the edge and the protrusion of the core substrate. It is characterized in that the reference hole is closed with an adhesive tape housed inside.

[0008]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the invention according to claim 1 will be described with reference to the drawings. FIG. 1 is a plan view for explaining the embodiment, and FIG. 2 is a sectional view. FIG.
As shown in (a), the core substrate 2 is provided with the conductor circuit 1 and the reference hole 3, and the protrusion 11 surrounding the reference hole 3. The protrusion 11 is provided around the reference hole 3 so as to surround the reference hole 3 as shown in FIG. 1. However, the method of forming the protrusion 11 is not particularly limited.
A metal foil may be provided on the surface of, and the projection 11 may be formed by etching the metal foil. As the core substrate 2, for example, a glass cloth base material epoxy resin laminated plate having a copper foil adhered to its surface can be used, but a simple insulating substrate on which the conductor circuit 1 is not formed can also be used. The number of reference holes 3 may be two or more, and the necessary number may be provided. Then, the reference hole 3 is closed with an adhesive tape 4, as shown in FIG.
As shown in, the tape 4 is adhered so that it is housed within the range surrounded by the protrusion 11. Next, as shown in FIG. 2C, the reference hole 3 is covered to form the insulating resin layer 5,
Then, as shown in FIG. 2D, the insulating resin layer 5 and the tape 4 on the reference hole 3 are removed by using, for example, a knife to expose the reference hole 3, and then the exposed reference hole 3
Is used as a positioning reference for forming a conductor circuit,
A new conductor circuit is formed on the insulating resin layer 5. As described above, in the embodiment shown in FIGS. 1 and 2, since the tape 4 is housed within the range surrounded by the protrusions 11, the adhesive tape 4 is adhered when the insulating resin layer 5 is formed. Even if the agent component oozes out to the surroundings, it stops within the range surrounded by the protrusions 11 and the adhesive component does not spread outside the range surrounded by the protrusions 11. Therefore, the range in which the adhesive component exudes is only a narrow range (the range surrounded by the protrusions 11), and the problem that the film thickness of the insulating resin layer 5 becomes uneven and the insulating resin layer 5 easily peels The area where problems occur can be reduced. Therefore, it is possible to increase the area on the insulating resin layer where a new conductor circuit can be formed while ensuring reliability. That is, it is possible to increase the effective area in which the conductor circuit can be formed.

Next, an embodiment of the invention according to claim 2 will be described with reference to the drawings. FIG. 3 is a plan view for explaining the embodiment. As shown in FIG. 3, the core circuit board 2 is provided with the conductor circuit 1 and the reference hole 3, and the projecting portion 11 that surrounds the reference hole 3 with the edge 12 of the core circuit board 2. Method of forming protrusion 11 and core substrate 2 used
Is the same as that of the embodiment of the invention according to claim 1. Next, the reference hole 3 is closed with an adhesive tape, and the adhesive tape is adhered so as to be housed within the range surrounded by the edge 12 of the core substrate 2 and the protrusion 11. The subsequent steps are the same as those in the embodiment of the invention according to claim 1. As described above, in this embodiment, since the tape is accommodated within the range surrounded by the edge 12 of the core substrate 2 and the protrusion 11, the adhesive of the adhesive tape is used when the insulating resin layer is formed. Even if the component exudes to the surroundings, it stops within the range surrounded by the edge 12 and the protrusion 11, and the adhesive component does not spread in the range beyond that. Therefore, the range in which the adhesive component exudes is only a narrow range (the range surrounded by the edge 12 and the protrusion 11), and the film thickness of the insulating resin layer 5 at the position where a new conductor circuit is formed becomes uneven. It is possible to reduce an area in which a problem or a problem that the insulating resin layer 5 at a position where a new conductor circuit is formed is easily separated is generated. Therefore, it is possible to increase the area on the insulating resin layer where a new conductor circuit can be formed while ensuring reliability. That is, it is possible to increase the effective area in which the conductor circuit can be formed.

[0010]

In the method for manufacturing a multilayer printed wiring board according to the first aspect of the present invention, the projecting portion surrounding the reference hole is provided on the core substrate and is surrounded by the projecting portion before the insulating resin layer is formed. Since the reference hole is closed with the adhesive tape that is stored within the range, the area where the adhesive component of the adhesive tape leaks out can be reduced, and as a result, a new conductor circuit is formed while ensuring reliability. It is possible to increase the area of the insulating resin layer that can be formed.

In the method for manufacturing a multilayer printed wiring board according to the second aspect of the present invention, before forming the insulating resin layer, the core board is provided with a protrusion that surrounds the reference hole with the end edge of the core board. Since the reference hole is closed by the adhesive tape that is stored within the area surrounded by the edge of the board and the protrusion, the area where the adhesive component of the adhesive tape exudes can be reduced, resulting in reliability. It is possible to secure a large area on the insulating resin layer where a new conductor circuit can be formed.

[Brief description of drawings]

FIG. 1 is a plan view illustrating an embodiment of a method for manufacturing a multilayer wiring board according to the first aspect of the invention.

FIG. 2 is a cross-sectional view illustrating an embodiment of a method for manufacturing a multilayer wiring board according to the first aspect of the invention.

FIG. 3 is a plan view illustrating an embodiment of a method for manufacturing a multilayer wiring board according to the second aspect of the invention.

FIG. 4 is a cross-sectional view illustrating a conventional method for manufacturing a multilayer wiring board.

[Explanation of symbols]

 1 Conductor Circuit 2 Core Board 3 Reference Hole 4 Tape 5 Insulating Resin Layer 11 Protrusion 12 Edge

Front page continuation (72) Inventor Shingo Yoshioka 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Ltd. (72) Inventor Eiichiro Saito 1048, Kadoma, Kadoma City, Osaka Matsushita Electric Works Ltd. (72) Invention Person Shinichi Iketani 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Inventor Hiroaki Fujiwara 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Inventor, Katsuhiko Ito Kadoma City, Osaka Prefecture 1048 Kadoma Matsushita Electric Works Co., Ltd.

Claims (2)

[Claims] 1. A core substrate having a plurality of reference holes formed thereon, the reference holes being covered to form an insulating resin layer, and the insulating resin layer covering the reference holes being removed to expose the reference holes. Then, using the exposed reference hole as a positioning reference for forming the conductor circuit, in the method for manufacturing a stacked-type multilayer wiring board in which the conductor circuit is formed on the remaining insulating resin layer, the insulating resin layer is formed. Prior to manufacturing, a multilayer wiring board characterized in that a protrusion surrounding the reference hole is provided on the core substrate, and the reference hole is closed with an adhesive tape accommodated in the area surrounded by the protrusion. Method. 2. A core substrate having a plurality of reference holes formed thereon, the reference holes being covered to form an insulating resin layer, and the insulating resin layer covering the reference holes being removed to expose the reference holes. Then, using the exposed reference hole as a positioning reference for forming the conductor circuit, in the method for manufacturing a stacked-type multilayer wiring board in which the conductor circuit is formed on the remaining insulating resin layer, the insulating resin layer is formed. Before, the protrusion is formed on the core substrate so as to surround the reference hole with the edge of the core substrate, and the reference hole is closed with the adhesive tape housed within the range surrounded by the edge of the core substrate and the protrusion. A method for manufacturing a multilayer wiring board, characterized in that