JPH09321404A - Printed-wiring board - Google Patents
Printed-wiring boardInfo
- Publication number
- JPH09321404A JPH09321404A JP16119296A JP16119296A JPH09321404A JP H09321404 A JPH09321404 A JP H09321404A JP 16119296 A JP16119296 A JP 16119296A JP 16119296 A JP16119296 A JP 16119296A JP H09321404 A JPH09321404 A JP H09321404A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductive paste
- wiring board
- insulating substrate
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は各種電子機器に用い
られるプリント配線板で、特に導電性ペーストを用いる
プリント配線板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board used in various electronic devices, and more particularly to a printed wiring board using a conductive paste.
【０００２】[0002]
【従来の技術】近年の電子機器分野において、プリント
配線板に対する要求も多様化し、特に微細回路の高密度
化が望まれている。以下に図４（ａ）〜（ｌ）に基づ
き、従来の導電性ペースト１５を用いたプリント配線板
の製造工程順に示した断面図に基づいて説明する。表裏
面に銅箔層１１が形成された紙フェノール樹脂銅張積層
板からなる絶縁基板１２を用い（ａ図）、この絶縁基板
１２をエッチング法によって、所望する銅箔回路１７を
両面に形成し（ｂ図）、次に所定の位置に貫通孔１４を
設ける（ｃ図）。さらに、この貫通孔１４孔内に導電性
ペースト１５を充填する（ｄ図）。さらに、オーバーコ
ート１６を塗布し（ｅ図）、導電性ペースト１５による
両面スルーホールプリント配線板が得られる。2. Description of the Related Art In the field of electronic equipment in recent years, demands for printed wiring boards have diversified, and in particular, high density of fine circuits has been desired. Hereinafter, description will be given based on FIGS. 4A to 4L based on cross-sectional views shown in the order of steps of manufacturing a printed wiring board using the conventional conductive paste 15. An insulating substrate 12 made of a paper phenol resin copper clad laminate having copper foil layers 11 formed on the front and back surfaces is used (Fig. A), and a desired copper foil circuit 17 is formed on both surfaces by an etching method. Next, the through hole 14 is provided at a predetermined position (FIG. 2B) (FIG. 3C). Further, the conductive paste 15 is filled into the through holes 14 (FIG. D). Further, an overcoat 16 is applied (Fig. E) to obtain a double-sided through-hole printed wiring board with the conductive paste 15.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来のプリン
ト配線の構造では、以下の如く問題を有していた。従来
の導電性ペースト１５を用いたプリント配線板は、図４
に示す如く、絶縁基板の表裏面に銅箔１１を有している
ために、回路１７を形成する工程において、エッチング
工程が必須であった。このエッチング液は、一般的に
は、塩化第２鉄（Ｆｅｃｌ2）を水に溶解した塩化第２
鉄溶液と、塩化第２銅溶液（Ｃｕｃｌ2・ＺＨ2Ｏ）を水
に溶解し塩酸を加えた塩化第２銅溶液が用いられる。こ
の工程及び廃液に対する管理コストがかかり、また薬品
を使用するため、薬品の保管等は注意を要するという問
題点があった。The structure of the conventional printed wiring described above has the following problems. A conventional printed wiring board using the conductive paste 15 is shown in FIG.
Since the insulating substrate has the copper foils 11 on the front and back surfaces as shown in FIG. 3, an etching step was essential in the step of forming the circuit 17. This etching solution is generally a ferric chloride obtained by dissolving ferric chloride (Fecl 2 ) in water.
A cupric chloride solution prepared by dissolving an iron solution and a cupric chloride solution (Cucl 2 · ZH 2 O) in water and adding hydrochloric acid is used. There is a problem that management costs are required for this process and waste liquid, and because chemicals are used, care must be taken when storing chemicals.
【０００４】また、銅箔回路１７形成後、導電性ペース
ト１５と銅箔回路１７と電気的に接続させるために、導
電性ペースト１５は貫通孔１４孔内へ充填するととも
に、銅箔回路１７上にも塗布する必要があった。従っ
て、貫通孔１４部分の銅箔ランド１８は基本的φ２．０
mm以上の大きさが必須であった。近年の高密度化が進む
中でこの寸法が大きいことが高密度化への問題点になっ
ていた。After the copper foil circuit 17 is formed, the conductive paste 15 is filled in the through hole 14 and electrically connected to the copper foil circuit 17 in order to electrically connect the conductive paste 15 and the copper foil circuit 17. It had to be applied to. Therefore, the copper foil land 18 in the through hole 14 is basically φ2.0.
A size of mm or more was essential. As the density has been increasing in recent years, the large size has been a problem for increasing the density.
【０００５】また、導電性ペースト１５に銀ペーストを
用いたプリント配線板の場合には、銀マイグレーション
が発生し易いことから、貫通孔１４上及び銅箔ランド１
８上の銀ペーストをマイグレーション防止のために例え
ば、エポキシ樹脂を主成分とする保護被膜を形成する必
要があり、高密度化への問題となっていた。そこで、本
発明の目的は、導電性ペーストを用いるプリント配線板
において、簡単に低コストで製造ができ、配線密度を向
上できるプリント配線板を提供することを目的とするも
のである。Further, in the case of a printed wiring board using a silver paste as the conductive paste 15, silver migration is likely to occur, and therefore, on the through hole 14 and the copper foil land 1.
In order to prevent migration of the silver paste on No. 8 for example, it is necessary to form a protective film containing an epoxy resin as a main component, which has been a problem for increasing the density. Therefore, an object of the present invention is to provide a printed wiring board that uses a conductive paste, can be easily manufactured at low cost, and can improve wiring density.
【０００６】[0006]
【課題を解決するための手段】本発明の目的はかかる従
来の問題点を解決した構造を有する両面スルーホールプ
リント配線板を提供することにある。本発明は、
（イ）、表裏に銅箔が形成されていない絶縁基板２を用
い、この絶縁基板２の所定の位置に貫通孔４を設け、こ
の貫通孔４の孔内に第１の導電性ペースト７を充填して
スルーホールを形成し、前記絶縁基板２の表裏面にこの
スルーホールを接続し回路８となる第２の導電性ペース
ト８で形成されていることを特徴とする両面プリント配
線板である。（ロ）、貫通孔４孔内に充填される第１導
電性ペースト７がカーボン樹脂からなり、スルーホール
がカーボン樹脂７からなる抵抗体であることを特徴とす
る両面プリント配線板である。（ハ）、表裏回路８を形
成する第２の導電性ペースト８は、半田付が可能なフェ
ノール樹脂からなり、銅粉が含有されていることを特徴
とする両面プリント配線板である。従って、導電性ペー
ストのみを用い、高密度の回路８を形成しようとするも
のである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a double-sided through-hole printed wiring board having a structure that solves the conventional problems. The present invention
(A) Using an insulating substrate 2 having no copper foil formed on the front and back, a through hole 4 is provided at a predetermined position of the insulating substrate 2, and a first conductive paste 7 is provided in the through hole 4. A double-sided printed wiring board is characterized in that a through hole is formed by filling, and the through hole is connected to the front and back surfaces of the insulating substrate 2 by a second conductive paste 8 to form a circuit 8. . (B), The double-sided printed wiring board is characterized in that the first conductive paste 7 filled in the four through-holes 4 is made of carbon resin, and the through-hole is a resistor made of carbon resin 7. (C) The second conductive paste 8 forming the front and back circuits 8 is a double-sided printed wiring board characterized by being made of solderable phenol resin and containing copper powder. Therefore, it is intended to form the high-density circuit 8 using only the conductive paste.
【０００７】[0007]
【発明の実施の形態】本発明によるプリント配線板に於
ては、表裏面に銅箔を有さない絶縁基板を用い、第１導
電性ペースト７によってスルーホール抵抗体７を形成す
る。次に、第２導電性ペースト８により配線回路８を形
成し、前記のスルーホール抵抗体７層を相互に電気的に
接続することができ、スルーホール上の回路８にもチッ
プ部品をマントでき、さらに、スルーホールの直径を小
さくできるように構成したものであり、これにより、高
密度ができるプリント配線板となるものである。BEST MODE FOR CARRYING OUT THE INVENTION In the printed wiring board according to the present invention, an insulating substrate having no copper foil on the front and back surfaces is used, and the through-hole resistor 7 is formed by the first conductive paste 7. Next, the wiring circuit 8 is formed by the second conductive paste 8 and the above-mentioned through-hole resistor 7 layers can be electrically connected to each other, and chip parts can be mounted on the circuit 8 on the through-hole. Moreover, the diameter of the through holes can be made smaller, and by doing so, the printed wiring board can have a high density.
【０００８】また、めっきを施こさなくエッチング工程
も行なわないために、製造工程の工数低減が図れ、又ス
ルーホール銅箔ランドも必要としないため、設計の工数
低減も図れ、低コストのプリント配線板が得られるもの
である。Further, since the plating process is not performed and the etching process is not performed, the man-hours of the manufacturing process can be reduced, and since the through-hole copper foil land is not necessary, the man-hours of the design can be reduced and the cost of the printed wiring can be reduced. The plate is obtained.
【０００９】[0009]
【実施例】本発明の実施例を示す図面に基づいて詳細に
説明する。Embodiments of the present invention will be described in detail with reference to the drawings.
【実施例１】図１（ａ）〜（ｅ）は本発明によるプリン
ト配線板の実施例を製造工程順に示す断面図である。ま
ず、図１（ａ）に示すように表裏に銅箔を形成しない厚
さ約１．０mmは例えば、紙基材にフェノール樹脂を含浸
して積層接着したものから成る絶縁基板２である。この
ような絶縁基板２としては、紙、ガラスクロス、アラミ
ド繊維などにフェノール、エポキシ、ポリイミドなどの
有機樹脂を含浸して積層接着したものなど挙げられ、本
発明はそのいずれに限定されるものではない。次に図１
（ｂ）に示すように必要位置に例えばφ０．２mmドリル
を使い貫通孔４をあける。前記の絶縁基板２に貫通孔４
をあける手段は、プレス、ドリル、プラズマ、レーザー
など公知の手段を、絶縁基板の種類と目的とする貫通孔
４径に応じて適用できる。次に図１（ｃ）に示すよう
に、この貫通孔４内へ例えば、カーボン粉末入りフェノ
ール樹脂等の第１導電性ペースト７をスクリーン印刷法
により充填し、スルーホール抵抗体７（面積抵抗値２０
〜４０Ω／□・１５μｍ）を形成する。前記の導通接続
孔７に充填する導電性樹脂は例えば、フェノール系、エ
ポキシ系、メラミン系、ポリエステル系等の有機樹脂
で、若干の溶媒により、粘液状になり、金属粉末を団粒
化させたり、もしくは、熱によって塑性変形して、結合
を発揮する熱可塑性、または、熱硬化樹脂であればよ
い。前記の有機樹脂粉と混合する導電粉末は例えば、
銅、炭素、銀、ニッケル、金、スズ、鉛、コバルト、タ
ングステン、モリブデン、パラジウム及びこれらの合金
が挙げられる。更に、図１（ｄ）に示すように、貫通孔
４のスルーホール抵抗体７上に接続できる配線回路８を
例えば、銅粉イリフェノール樹脂等の第２導電性ペース
ト８をスクリーン印刷法による形成する。前記の回路８
を形成する金属は銅、ニッケル、金、白金、スズ、鉛、
コバルト、タングステン、モリブデン、パラジウム、及
びこれらの合金が挙げられ、有機樹脂は、図１（ｃ）例
で示したものと同様であればよい。また、回路８上に直
接半円付できるものであればよい。最後に、図１（ｅ）
に示すように、ソルダーレジスト３を塗布し所望のプリ
ント配線板９を得る。Embodiment 1 FIGS. 1A to 1E are sectional views showing an embodiment of a printed wiring board according to the present invention in the order of manufacturing steps. First, as shown in FIG. 1 (a), an insulating substrate 2 having a thickness of about 1.0 mm without copper foil formed on the front and back is, for example, a paper base material impregnated with a phenol resin and laminated and bonded. Examples of such an insulating substrate 2 include those obtained by impregnating paper, glass cloth, aramid fiber or the like with an organic resin such as phenol, epoxy or polyimide, and laminating and adhering the same, and the present invention is not limited thereto. Absent. Next, FIG.
As shown in (b), a through hole 4 is formed at a required position by using, for example, a φ0.2 mm drill. The through hole 4 is formed in the insulating substrate 2.
As a means for opening, a known means such as a press, a drill, a plasma, and a laser can be applied depending on the type of the insulating substrate and the intended diameter of the through hole 4. Next, as shown in FIG. 1C, the through hole 4 is filled with a first conductive paste 7 such as a phenol resin containing carbon powder by a screen printing method, and the through hole resistor 7 (area resistance value 20
˜40 Ω / □ · 15 μm) is formed. The conductive resin to be filled in the conductive connection hole 7 is, for example, an organic resin such as phenol-based, epoxy-based, melamine-based, polyester-based, etc., which becomes a viscous liquid with a slight amount of solvent to aggregate the metal powder. Alternatively, a thermoplastic or thermosetting resin that plastically deforms by heat and exerts a bond may be used. The conductive powder mixed with the organic resin powder is, for example,
Examples include copper, carbon, silver, nickel, gold, tin, lead, cobalt, tungsten, molybdenum, palladium and alloys thereof. Further, as shown in FIG. 1D, a wiring circuit 8 that can be connected to the through-hole resistor 7 of the through-hole 4 is formed by screen-printing a second conductive paste 8 such as copper powder iriphenol resin. To do. Circuit 8 above
The metals forming are copper, nickel, gold, platinum, tin, lead,
Examples thereof include cobalt, tungsten, molybdenum, palladium, and alloys thereof, and the organic resin may be the same as that shown in the example of FIG. Further, it is sufficient that the semicircle can be directly attached on the circuit 8. Finally, Fig. 1 (e)
As shown in, the solder resist 3 is applied to obtain a desired printed wiring board 9.
【００１０】[0010]
【実施例２】本発明の図１（ａ）〜（ｅ）において、回
路８形成の信頼性を確保するため、実施例１における貫
通孔４形成前に、ソルダーレジスト３を形成する実施例
２を説明する。図２（ａ）〜（ｅ）は本発明によるプリ
ント配線板の実施例２を製造工程順に示す断面図であ
る。まず、実施例１に用いた絶縁基板２を用い、所定の
位置に、ソルダーレジストからなる絶縁層３を形成す
る。次に、図２（ｃ）に示すように、所定の位置に、非
貫通スルーホール用の貫通孔４を例えば、φ０．２０mm
ドリルで孔明けする。更に、図２（ｄ）に示すように、
この貫通孔４内へ例えば、カーボン粉末入りフェノール
樹脂等の第１導電性ペースト７を用い、充填し、スルー
ホール抵抗体７を形成する。最後に、図２（ｅ）に示す
ように、貫通孔４のスルーホール抵抗体７上に接続でき
る配線回路８を例えば、銅粉入りフェノール樹脂等の第
２導電性ペースト８を用い、塗布形成し、所望のプリン
ト配線板９を得る。Embodiment 2 In FIGS. 1A to 1E of the present invention, in order to secure the reliability of the formation of the circuit 8, an embodiment 2 in which the solder resist 3 is formed before the formation of the through hole 4 in the embodiment 1. Will be explained. FIGS. 2A to 2E are cross-sectional views showing a printed wiring board according to a second embodiment of the present invention in the order of manufacturing steps. First, using the insulating substrate 2 used in Example 1, an insulating layer 3 made of a solder resist is formed at a predetermined position. Next, as shown in FIG. 2C, a through hole 4 for a non-through hole is formed at a predetermined position, for example, φ0.20 mm.
Drill a hole. Further, as shown in FIG.
The through hole 4 is filled with, for example, a first conductive paste 7 such as phenol resin containing carbon powder to form a through hole resistor 7. Finally, as shown in FIG. 2E, a wiring circuit 8 that can be connected to the through-hole resistor 7 of the through-hole 4 is formed by applying a second conductive paste 8 such as phenol resin containing copper powder. Then, the desired printed wiring board 9 is obtained.
【００１１】[0011]
【発明の効果】以上説明したように、本発明によれば、
導電性ペーストのみを用い、スルーホール抵抗体及び高
密度化が形成できるために、以下に記載するような特有
な効果を奉する。 本発明によれば、第１導電性ペーストを用い、スル
ーホール抵抗体が形成されたこの抵抗体の上に第２導電
性ペーストを用い、同径の回路を形成できるため、ラン
ドを設けることなく該スルーホール抵抗体上の回路に、
直接部品を固定できる。 本発明によれば、φ０．２mm以下の導通接続孔も可能
であり、前記小径孔の場合、従来は回路幅は０．２mm、
間隔は０．１５mmであったが本発明によると、回路幅は
０．１mm、間隔は０．１mmとなる。従って、微細回路の
高密度化及び高密度面実装部品用のプリント配線板がで
きる。 本発明の製造工程によれば、めっき、エッチング工程
が必要ないため、工数低減及び低コストとで製造できる
プリント配線板ができる。As described above, according to the present invention,
Since only the conductive paste can be used to form the through-hole resistor and the high density, a unique effect as described below is exerted. According to the present invention, a circuit having the same diameter can be formed by using the first conductive paste and the second conductive paste on the resistor having the through-hole resistor formed thereon, and therefore, without providing the land. In the circuit on the through-hole resistor,
Parts can be fixed directly. According to the present invention, a conductive connection hole with a diameter of 0.2 mm or less is also possible. In the case of the small diameter hole, the circuit width is 0.2 mm in the past,
Although the distance was 0.15 mm, according to the present invention, the circuit width is 0.1 mm and the distance is 0.1 mm. Therefore, it is possible to provide a printed circuit board for high density of fine circuits and high density surface mount components. According to the manufacturing process of the present invention, since the plating and etching processes are not required, a printed wiring board that can be manufactured with reduced man-hours and low cost can be obtained.
【図１】（ａ）〜（ｅ）は、本発明の導電性ペーストを
用いたプリント配線板の製造工程を示す断面図である。1A to 1E are cross-sectional views showing a manufacturing process of a printed wiring board using the conductive paste of the present invention.
【図２】（ａ）〜（ｅ）は、本発明の導電性ペーストを
用いたプリント配線板の製造工程に於いて、貫通孔を設
ける前に絶縁層を形成しようとする製造工程を示す断面
図である。2A to 2E are cross-sectional views showing a manufacturing process for forming an insulating layer before providing a through hole in a manufacturing process of a printed wiring board using the conductive paste of the present invention. It is a figure.
【図３】（ａ）〜（ｂ）は本発明の一実施例のプリント
配線板の接続方法を示す要部平面図である。3 (a) and 3 (b) are main-portion plan views showing a method for connecting a printed wiring board according to an embodiment of the present invention.
【図３】（ｃ）は本発明の一実施例のプリント配線板の
高密度部品を搭載可能とする接続方法を示す要部平面図
である。FIG. 3C is a plan view of relevant parts showing a connection method capable of mounting high-density components on a printed wiring board according to an embodiment of the present invention.
【図３】（ｄ）は本発明の一実施例のプリント配線板の
スルーホール抵抗体孔部分の回路の平面図であり、ま
た、孔と孔との間隔を狭めることが可能となるものであ
る。FIG. 3 (d) is a plan view of a circuit of a through hole resistor hole portion of a printed wiring board according to an embodiment of the present invention, and also makes it possible to reduce the distance between holes. is there.
【図４】（ａ）〜（ｅ）は、従来の導電性ペーストを用
いた、プリント配線板の製造工程を示す断面図である。4A to 4E are cross-sectional views showing a manufacturing process of a printed wiring board using a conventional conductive paste.
【符号の説明】 ２…絶縁基板 ３…絶縁樹脂層 ４…貫通孔 ７…第１導電性ペースト ８…第２導電性ペースト ９…プリント配線板 １１…銅箔 １２…フェノール樹脂銅張
積層板 １４…貫通孔 １５…導電性ペースト １６…オーバコート １７…銅箔回路 １８銅箔ランド[Description of Reference Signs] 2 ... Insulating substrate 3 ... Insulating resin layer 4 ... Through hole 7 ... First conductive paste 8 ... Second conductive paste 9 ... Printed wiring board 11 ... Copper foil 12 ... Phenolic resin copper clad laminate 14 … Through hole 15… Conductive paste 16… Overcoat 17… Copper foil circuit 18 Copper foil land
【手続補正書】[Procedure amendment]
【提出日】平成８年９月１０日[Submission date] September 10, 1996
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００２[Name of item to be corrected] 0002
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００２】[0002]
【従来の技術】近年の電子機器分野において、プリント
配線板に対する要求も多様化し、特に微細回路の高密度
化が望まれている。以下に図４（ａ）〜（ｅ）に基づ
き、従来の導電性ペースト１５を用いたプリント配線板
の製造工程順に示した断面図に基づいて説明する。表裏
面に銅箔層１１が形成された紙フェノール樹脂銅張積層
板からなる絶縁基板１２を用い（ａ図）、この絶縁基板
１２をエッチング法によって、所望する銅箔回路１７を
両面に形成し（ｂ図）、次に所定の位置に貫通孔１４を
設ける。（ｃ図）。さらに、この貫通孔１４孔内に導電
性ペースト１５を充填する（ｄ図）。さらに、オーバー
コート１６を塗布し（ｅ図）、導電性ペースト１５によ
る両面スルーホールプリント配線板が得られる。2. Description of the Related Art In the field of electronic equipment in recent years, demands for printed wiring boards have diversified, and in particular, high density of fine circuits has been desired. Hereinafter, description will be given based on FIGS. 4A to 4E based on cross-sectional views shown in the order of steps of manufacturing a printed wiring board using the conventional conductive paste 15. An insulating substrate 12 made of a paper phenol resin copper clad laminate having copper foil layers 11 formed on the front and back surfaces is used (Fig. A), and a desired copper foil circuit 17 is formed on both surfaces by an etching method. Next, the through hole 14 is provided at a predetermined position (FIG. 6B). (Figure c). Further, the conductive paste 15 is filled into the through holes 14 (FIG. D). Further, an overcoat 16 is applied (Fig. E) to obtain a double-sided through-hole printed wiring board with the conductive paste 15.
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００９[Correction target item name] 0009
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００９】[0009]
【実施例】本発明の実施例を示す図面に基づいて詳細に
説明する。Embodiments of the present invention will be described in detail with reference to the drawings.
【実施例１】図１（ａ）〜（ｅ）は本発明によるプリン
ト配線板の実施例を製造工程順に示す断面図である。ま
ず、図１（ａ）に示すように表裏に銅箔を形成しない厚
さ約１．０ｍｍは例えば、紙基材にフェノール樹脂を含
浸して積層接着したものから成る絶縁基板２である。こ
のような絶縁基板２としては、紙、ガラスクロス、アラ
ミド繊維などにフェノール、エポキシ、ポリイミドなど
の有機樹脂を含浸して積層接着したものなど挙げられ、
本発明はそのいずれに限定されるものではない。次に図
１（ｂ）に示すように必要位置に例えばφ０．２ｍｍド
リルを使い貫通孔４をあける。前記の絶縁基板２に貫通
孔４をあける手段は、プレス、ドリル、プラズマ、レー
ザーなど公知の手段を、絶縁基板の種類と目的とする貫
通孔４径に応じて適用できる。次に図１（ｃ）に示すよ
うに、この貫通孔４内へ例えば、カーボン粉末入りフェ
ノール樹脂等の第１導電性ペースト７をスクリーン印刷
法により充填し、スルーホール抵抗体７（面積抵抗値２
０〜４０Ω／□・１５μｍ）を形成する。前記の導通接
続孔７に充填する導電性樹脂は例えば、フェノール系、
エポキシ系、メラミン系、ポリエステル系等の有機樹脂
で、若干の溶媒により、粘掖状になり、金属粉末を団粒
化させたり、もしくは、熱によって塑性変形して、結合
を発揮する熱可塑性、または、熱硬化樹脂であればよ
い。前記の有機樹脂粉と混合する導電粉末は例えば、
銅、炭素、銀、ニッケル、金、スズ、鉛、コバルト、タ
ングステン、モリブデン、パラジウム及びこれらの合金
が挙げられる。更に、図１（ｄ）に示すように、貫通孔
４のスルーホール抵抗体７上に接続できる配線回路８を
例えば、銅粉イリフェノール樹脂等の第２導電性ペース
ト８をスクリーン印刷法による形成する。前記の回路８
を形成する金属は綱、ニッケル、金、白金、スズ、鉛、
コバルト、タングステン、モリブデン、パラジウム、及
びこれらの合金が挙げられ、有機樹脂は、図１（ｃ）例
で示したものと同様であればよい。また、回路８上に直
接半田付できるものであればよい。最後に、図１（ｅ）
に示すように、ソルダーレジスト３を塗布し所望のプリ
ンEmbodiment 1 FIGS. 1A to 1E are sectional views showing an embodiment of a printed wiring board according to the present invention in the order of manufacturing steps. First, as shown in FIG. 1 (a), an insulating substrate 2 having a thickness of about 1.0 mm without copper foil formed on the front and back is, for example, a paper base material impregnated with a phenol resin and laminated and bonded. Examples of such an insulating substrate 2 include those obtained by impregnating paper, glass cloth, aramid fiber or the like with an organic resin such as phenol, epoxy, or polyimide, and laminating and adhering the same.
The present invention is not limited to any of them. Next, as shown in FIG. 1 (b), a through hole 4 is formed at a required position by using, for example, a φ0.2 mm drill. As the means for forming the through hole 4 in the insulating substrate 2, known means such as press, drill, plasma, and laser can be applied depending on the type of the insulating substrate and the intended diameter of the through hole 4. Next, as shown in FIG. 1C, the through hole 4 is filled with a first conductive paste 7 such as a phenol resin containing carbon powder by a screen printing method, and the through hole resistor 7 (area resistance value Two
0-40Ω / □ · 15 μm) is formed. The conductive resin with which the conductive connection hole 7 is filled is, for example, phenol-based resin,
Epoxy-based, melamine-based, polyester-based organic resins, with some solvents, become viscous, agglomerate the metal powder, or plastically deform by heat, thermoplasticity to exert a bond, Alternatively, a thermosetting resin may be used. The conductive powder mixed with the organic resin powder is, for example,
Examples include copper, carbon, silver, nickel, gold, tin, lead, cobalt, tungsten, molybdenum, palladium and alloys thereof. Further, as shown in FIG. 1D, a wiring circuit 8 that can be connected to the through-hole resistor 7 of the through-hole 4 is formed by screen-printing a second conductive paste 8 such as copper powder iriphenol resin. To do. Circuit 8 above
The metals that form are steel, nickel, gold, platinum, tin, lead,
Examples thereof include cobalt, tungsten, molybdenum, palladium, and alloys thereof, and the organic resin may be the same as that shown in the example of FIG. Also, directly on the circuit 8.
It may be a shall be contact with solder. Finally, Fig. 1 (e)
Apply solder resist 3 and apply the desired
Claims (4)
を用い、この絶縁基板の所定の位置に貫通孔を設け、こ
の貫通孔の孔内に第１の導電性ペーストを充填してスル
ーホールを形成し、前記絶縁基板の表裏面であって、か
つこのスルーホール上下と接続し、回路となる第２の導
電性ペーストを形成することを特徴とするプリント配線
板。1. An insulating substrate having no copper foil formed on the front and back is used, a through hole is provided at a predetermined position of the insulating substrate, and the first conductive paste is filled in the hole of the through hole to form a through hole. A printed wiring board, wherein a second conductive paste that forms a circuit is formed by forming a hole and connecting to the front and back surfaces of the insulating substrate and above and below the through hole.
トがカーボン粉であることを特徴とするプリント配線
板。2. The printed wiring board according to claim 1, wherein the first conductive paste is carbon powder.
トが銅粉入りであることを特徴とするプリント配線板。3. The printed wiring board according to claim 1, wherein the second conductive paste contains copper powder.
縁基板を用い、この絶縁基板の所定の位置に貫通孔を設
け、この貫通孔の孔内に第１の導電性ペーストを充填し
てスルーホールを形成し、前記絶縁基板の表裏面であっ
て、かつこのスルーホール上下と接続し、回路となる第
２の導電性ペーストを形成することを特徴とするプリン
ト配線板。4. An insulating substrate having insulating layers formed on the front and back at predetermined positions is used, a through hole is provided at a predetermined position of the insulating substrate, and the first conductive paste is filled in the hole of the through hole. A through hole is formed as a circuit, and a second conductive paste to be a circuit is formed on the front and back surfaces of the insulating substrate and above and below the through hole to form a second conductive paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16119296A JPH09321404A (en) | 1996-05-31 | 1996-05-31 | Printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16119296A JPH09321404A (en) | 1996-05-31 | 1996-05-31 | Printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09321404A true JPH09321404A (en) | 1997-12-12 |
Family
ID=15730342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16119296A Pending JPH09321404A (en) | 1996-05-31 | 1996-05-31 | Printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09321404A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100476285B1 (en) * | 2000-11-24 | 2005-03-16 | 히다치 가세고교 가부시끼가이샤 | Through-Hole Wiring Board |
| JP2005251871A (en) * | 2004-03-02 | 2005-09-15 | Ibiden Co Ltd | Printed wiring board |
| US8166653B2 (en) | 2006-11-13 | 2012-05-01 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing printed circuit board having embedded resistors |
-
1996
- 1996-05-31 JP JP16119296A patent/JPH09321404A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100476285B1 (en) * | 2000-11-24 | 2005-03-16 | 히다치 가세고교 가부시끼가이샤 | Through-Hole Wiring Board |
| JP2005251871A (en) * | 2004-03-02 | 2005-09-15 | Ibiden Co Ltd | Printed wiring board |
| JP4540365B2 (en) * | 2004-03-02 | 2010-09-08 | イビデン株式会社 | Printed wiring board |
| US8166653B2 (en) | 2006-11-13 | 2012-05-01 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing printed circuit board having embedded resistors |
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