JPH09316327A - Polyarylene sulfide resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polyarylene sulfide resin compsn. which is excellent in releasability from a metal surface during molding, is thermally and chemically stable without generating a decomposition gas, deos not exhibit the blooming of a mold release agent, and is excellent in appearance and mechanical strengths. SOLUTION: This compsn. comprises 100 pts.mass polyarylene sulfide, 0.1-5 pts.mass fatty acid ester represented by the formula (n is 1-6; at least one of X, Y, and Z is COOR and the rest are H, OH, or a 2-40C alkyl or aryl group; R is a 2-40C alkyl or alkenyl group; W is O, OCO, or H; and V is H or a 2-40C alkyl or alkenyl group provided when W is H, then V is not present), and 0.01-5 pts.mass epoxidized olefin resin having an epoxy content of 0.1-30 mass %.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a polyarylene sulfide resin composition.

[0002]

2. Description of the Related Art In recent years, high heat-resistant thermoplastic resins have been required for electric / electronic equipment parts materials, automobile equipment parts materials, chemical equipment parts materials and the like. Polyarylene sulfide is also one of the resins that meet this requirement, but polyarylene sulfide has a good affinity with metals, and many precision molded products are used, and many molds with complicated shapes are used. However, because of the low shrinkage ratio when solidifying from the molten state, mold releasability from the mold during molding is poor, stable continuous molding is difficult, molding speed (molding cycle) is slow, and productivity is low. Has a problem that is inferior.

For this reason, molding is generally performed by adding a release agent to the resin. Various types of release agents have been proposed, but each has its drawbacks. For example, the method of adding a certain type of fatty acid ester proposed in JP-A-63-289068 and JP-A-4-154867 has a problem in the surface property of a molded product. Especially when heat-treated, blooming of the added release agent occurs,
The appearance of the molded product is significantly impaired. Such a drawback of impairing the appearance is not only an aesthetic problem, but when used in precision machinery such as the electronic industry field, it leads to contamination of the precision machinery, resulting in a serious problem. is there.

[0004]

DISCLOSURE OF THE INVENTION The present invention has mold releasability from a metal surface at the time of molding, and is thermally and chemically stable without decomposing gas or blooming of a mold releasing agent. Another object of the present invention is to provide a polyarylene sulfide resin composition having excellent appearance and mechanical strength.

[0005]

The gist of the present invention is that (A) 100 parts by mass of polyarylene sulfide,
(B) 0.1 to 5 fatty acid ester represented by the following formula (1)
Mass part

Embedded image (However, n = 1 to 6; at least one of X, Y, and Z is
COOR group, the rest is H, OH or 2 to 2 carbon atoms
40, consisting of an alkyl group or an aryl group; R
Is an alkyl group or an alkenyl group having 2 to 40 carbon atoms;
W is O, OCO or H; V is H or 2 to 40 carbon atoms.
Of an alkyl group or an alkenyl group, but does not exist when W is H) and (C) the epoxy group content is 0.
A polyarylene sulfide resin composition comprising 0.01 to 5 parts by mass of an epoxy group-containing olefin resin of 1 to 30% by mass. Hereinafter, the present invention will be described in detail.

In the present invention, the base resin is (A)
Is a polyarylene sulfide. Here, the polyarylene sulfide refers to a structural formula — (Ar—S) — (however,
Ar is a polymer having 90 mol% or more of repeating units represented by an aryl group). Among them, polyphenylene sulfide is preferably used, and more preferably at a temperature of 310.
The melt viscosity under the conditions of ℃ and shear rate of 1200 / sec is 1 to
2000 Pa · s, particularly preferably 10-500 Pa · s
s is used.

The release agent added and blended as the component (B) of the composition of the present invention is effective as long as it is a fatty acid ester having the structure of the above formula 1, but especially in the formula 1, X, Y and Z are all COOR and W is OC
O and V are alkyl groups, n is 1, or X and Y are COO
It is preferable that R is R, W is OCO, V is an alkyl group, n is 1, and Z is H, OH, an alkyl group or an aryl group. R may be any alkyl group or alkenyl group having 2 to 40 carbon atoms, but an alkyl group having 8 to 27 carbon atoms is particularly preferable.

The substance represented by the formula 1 is, for example, a fatty acid ester of neopentyl polyol (having 3 or 4 hydroxyl groups); pentaerythritol tristearic acid, pentaerythritol tetrastearic acid, pentaerythritol tetraoleic acid, and other pentaesters. Esters of erythritol and higher fatty acids; stearic acid esters or montanic acid esters of 2- to 4-substituted pentaerythritol such as dipentaerythritol hexamontanate, polypentaerythritol stearate, and montanic acid esters are particularly preferred.

The fatty acid ester used in the present invention is based on 100 parts by mass of the polyarylene sulfide resin.
It is used in an amount of 0.01 to 5 parts by mass, preferably 0.1 to 2 parts by mass. If it is less than 0.01 parts by mass, the releasability from the metal surface will be impaired, and if it is more than 5 parts by mass, mechanical properties will deteriorate, which is not preferable.

As the epoxy group-containing olefin resin to be added and blended as the component (C) of the composition of the present invention, any epoxy resin containing an epoxy group can be used, but α-olefin and α, A copolymer of β-unsaturated glycidyl ester is preferably used. Examples of the α-olefin include ethylene, propylene and 1-butene, and ethylene is preferable, and α, β-unsaturated glycidyl ester is preferably glycidyl methacrylate or glycidyl ethacrylic acid. Is illustrated as. Further, as the vinyl polymer, polymethyl methacrylate, polystyrene, poly (styrene-acrylonitrile), polymethyl acrylate and the like are exemplified as preferable ones.

The epoxy group content in the epoxy group-containing olefin resin is 0.1 to 30% by mass, particularly 0.2.
-20 mass% is preferable. This is because if it is less than 0.1% by mass, blooming of the release agent will occur, impairing the appearance of the molded product, and if it exceeds 30% by mass, problems such as gelation will occur during melt kneading with the polyarylene sulfide, which is not preferable. .

The epoxy group-containing olefin resin is 0.0 per 100 parts by mass of the polyarylene sulfide resin.
1 to 5 parts by mass, preferably 0.1 to 2 parts by mass, and more preferably 0.2 to 0.5 parts by mass are used. When the amount is less than 0.01 parts by mass, blooming of the release agent occurs and the appearance of the molded product is impaired, and when the amount is more than 5 parts by mass, the flexural modulus decreases, which is not preferable.

In the resin composition of the present invention, one kind or two or more kinds of other thermoplastic resins can be supplementarily used together in a small amount. Any other thermoplastic resin may be used as long as it is stable during molding and use. For example, an aromatic polyester such as polyethylene terephthalate, polybutylene terephthalate, a copolymer of oxybenzoic acid and oxynaphthoic acid and an aromatic polyester such as diol or oxycarboxylic acid, polyacetal, polystyrene, polyamide, polycarbonate, polyphenylene oxide, polyalkyl Examples thereof include acrylates and fluororesins.

In addition, the resin composition of the present invention is a known substance generally added to thermoplastic resins and thermosetting resins, for example, inorganic filler such as glass fiber, carbon fiber, glass beads, talc, mica and titanium oxide. Material; antioxidant,
A stabilizer such as an ultraviolet absorber, an antistatic agent, a flame retardant, a coloring agent such as a dye or a pigment, a lubricant and a crystallization accelerator (nucleating agent), etc. can be appropriately added as necessary.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION The resin composition of the present invention does not require a special kneading method and can be adjusted by a known method generally used for preparing a synthetic resin composition. The resin composition of the present invention thus obtained, by a known molding method,
It is used for various applications such as electric / electronic equipment parts materials, automobile equipment parts materials, and chemical equipment parts materials, among which it is preferably used in the field of precision molded articles in which contamination from the surface of the molded article is a problem.

[0016]

【Example】

[Examples 1 to 15 and Comparative Examples 1 to 6] As the release agent, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate or pentaerythritol tetrastearate (in the table, mono, di and tri, respectively). Alternatively, it is polyphenylene sulfide (trade name “Fortron KPS”, manufactured by Kureha Chemical Industry Co., Ltd.) and has a melt viscosity of 140 Pa · s under the conditions of a temperature of 310 ° C. and a shear rate of 1200 / sec. ) Ethylene 88 per 100 parts by mass
A random copolymer composed of 10% by mass of glycidyl methacrylate and 12% by mass of glycidyl methacrylate (expressed as EGMA in the table) and a releasing agent were added in the amounts shown in Table 1. These were premixed for 5 minutes with a Henschel mixer. Further, commercially available glass fiber (diameter 13 μm, length 3 mm: indicated as “GF” in the table)
Was added in an amount shown in Table 1 and mixed for 2 minutes, and this was put into an extruder at a cylinder temperature of 310 ° C. to form pellets. Next, an ASTM test piece was molded with an injection molding machine at a cylinder temperature of 320 ° C. and a mold temperature of 150 ° C., and the physical property values were measured. In addition, at the time of molding, use a box-shaped molded product mold equipped with a pressure sensor for the protruding pin of the mold, and perform injection molding at a mold temperature of 150 ° C to release the required pressure of the protruding pin when releasing the molded product. It was measured as a mold resistance. Furthermore, the injection-molded product for physical property measurement was heated at 200 ° C. in an air convection oven for 1 hour.
It heat-treated for time and observed the state of the surface. The results are shown in Table 1.

[Comparative Example 7] The same procedure as in Example 2 was repeated except that nylon 66 (manufactured by Polyplastics Co., Ltd.) was used instead of the polyphenylene sulfide of Example 2. The results are shown in Table 1. Table 1 is shown at the end of the specification.

[0018]

EFFECTS OF THE INVENTION Excellent releasability from a metal surface during molding, thermal and chemical stability, no generation of decomposed gas, and no blooming of the release agent.
A polyarylene sulfide resin composition excellent in appearance and mechanical strength can be obtained.

[0019]

[Table 1]

Claims (7)

[Claims] 1. (A) Polyarylene sulfide 100
Parts by mass, (B) 0.1 to 5 parts by mass of fatty acid ester represented by the following formula (1) (However, n = 1 to 6; at least one of X, Y, and Z is
COOR group, the rest is H, OH or 2 to 2 carbon atoms
40, consisting of an alkyl group or an aryl group; R
Is an alkyl group or an alkenyl group having 2 to 40 carbon atoms;
W is O, OCO or H; V is H or 2 to 40 carbon atoms.
An alkyl group or an alkenyl group, provided that when W is H, V does not exist) and (C) an epoxy group-containing olefin resin having an epoxy group content of 0.1 to 30% by mass. A polyarylene sulfide resin composition comprising 5 parts by mass. 2. The polyarylene sulfide resin composition according to claim 1, wherein X, Y and Z are all COOR, W is OCO, V is an alkyl group and n is 1. 3. X and Y are COOR, and W is OC
The polyarylene sulfide resin composition according to claim 1, wherein O and V are alkyl groups, n is 1, and Z is H, OH, an alkyl group or an aryl group. 4. The polyarylene sulfide resin composition according to claim 1, wherein R is an alkyl group having 8 to 27 carbon atoms. 5. The polyarylene sulfide resin composition according to claim 1, wherein the epoxy group-containing olefin resin is a copolymer of α-olefin and α, β-unsaturated glycidyl ester. 6. The polyarylene sulfide resin composition according to claim 1, wherein the epoxy group-containing olefin resin has an epoxy group content of 0.2 to 20 mass%. 7. The polyarylene sulfide resin composition according to claim 1, wherein the polyarylene sulfide is polyphenylene sulfide.