JPH09314717A - Lid material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To have good electrostatic properties and to provide good adhesive and peeling properties by forming an oriented resin layer, a heat sealant layer which is placed on one side of the oriented resin layer through a thermoplastic resin layer composed of a self-adhesive thermoplastic resin, and a static electricity diffusion layer containing mainly a transparent crystalline organic semiconductor mounted on it. SOLUTION: A lid material 1 has an oriented resin layer 2, a heat sealant layer 4 which is laminated on one side of the layer 2 through a thermoplastic resin layer 3 of a self-adhesive thermoplastic resin, and a static electricity diffusion layer 5. The layer 2 is made by a process in which two or more layers 2 of the same or different kinds of thermoplastic resins are laminated. The self-adhesive thermoplastic resin which constitutes the layer 3 is made from linear saturated polyester obtained by the polycondensation of an esterified product of multivalent carboxylic acid and multivalent alcohol. The layer 5 contains mainly a transparent crystalline organic semiconductor and has surface resistivity of 10<5> -10<12> Ωand 99% electric charge attenuation time of not exceeding 2sec.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lid member, and more particularly to a lid member having an antistatic property for use in a synthetic resin container for storing electronic parts and the like as contents.

[0002]

2. Description of the Related Art Conventionally, various parts, solid or liquid foods, and the like are housed in a synthetic resin container, and the opening is sealed with a lid member for distribution and storage.

For example, an electronic component is housed in each embossed portion of a carrier tape on which a large number of embosses are formed, and a lid material (cover tape) is heat-sealed and sealed on the carrier tape so as to cover the embossed portion. Carrier type taping is used. The carrier tape used for such embossed carrier type taping is usually formed of a material such as polyvinyl chloride, polystyrene, polyester, or polycarbonate which is easy to form into a sheet. Further, the lid member is composed of a stretched resin film and a laminate including a heat sealant layer formed on one surface of the film. Then, in the electronic component mounting process, the lid member is required to be peelable in order to take out the electronic component housed in the embossed carrier type taping.

Further, in the embossed carrier type taping in which the lid material is heat-sealed, it is inspected at the final stage of shipment whether or not the electronic parts are filled, and the appearance and function of the electronic parts are defective (lead bending, bending, It is necessary to visually check the voids in the packaging part).

Further, the static electricity generated when the stored electronic components come into contact with the embossed portion of the carrier tape or the lid member and the static electricity generated when the lid member is peeled off may cause deterioration and destruction of the electronic components. Because of the danger, carrier tapes and lids are required to have a means for preventing this.

As a means for preventing the generation of static electricity in a carrier tape, conductive carbon fine particles, conductive powder such as metal oxide, and metal fine particles are kneaded or applied into the carrier tape. Further, as a means for preventing static electricity from being generated in the lid material, it has been practiced to include conductive fine powder in the heat sealant layer which is in direct contact with the electronic component (Japanese Patent Publication No. 7-67774). In particular, a heat sealant layer mixed with fine powder of conductive metal oxide (tin oxide, zinc oxide, etc.) is often used because it has relatively transparency.

[0007]

However, the heat-sealing of the lid member to the carrier tape is performed so that the lid member does not peel off during the transportation and storage of the embossed carrier type taping, and the electronic component does not drop off. , The predetermined strength is required, but if this heat fusion strength and the deflection of the heat fusion strength (the difference between the maximum value and the minimum value of the heat fusion strength, hereinafter referred to as zip-up) are too large, the electronic parts There has been a problem that the carrier tape vibrates and the electronic component pops out from the embossed portion of the carrier tape when the lid material is peeled off in the mounting process. Therefore, the lid material is required to be adhered to the carrier tape with sufficient strength and to have good releasability when electronic components are used. However, a lid in which conductive fine powder or the like is mixed in a conventional heat sealant layer is required. The material had a problem that good peelability could not be obtained.

Further, the lid material in which the conductive fine powder of the metal oxide is mixed in the heat sealant layer has relatively good transparency, but it is difficult to disperse the heat sealant layer at the time of forming the heat sealant layer, and thus the electronic component In order to obtain transparency that allows visual inspection, there is a problem that a skilled dispersion technique is required and an increase in manufacturing cost cannot be avoided.

Furthermore, when a surface-active agent is applied to the heat sealant layer, the surface condition of the heat sealant layer of the lid material is changed, and the sealing property becomes unstable, which may cause a seal failure and also cause static electricity diffusion. Since the effect is highly dependent on the temperature and humidity during storage, there is a problem that a stable antistatic effect cannot be obtained.

The present invention has been made in view of the above circumstances, and provides a lid member having excellent electrostatic properties and having both high adhesiveness to a synthetic resin container and good peelability. The purpose is to provide.

[0011]

In order to achieve such an object, the present invention provides a stretched resin layer and a thermoplastic resin layer made of a self-adhesive thermoplastic resin on one surface of the stretched resin layer. The heat sealant layer formed through the heat sealant layer and the static electricity diffusion layer having a transparent crystalline organic semiconductor as a main component formed on the heat sealant layer are provided.

Further, the lid material of the present invention has an antistatic layer on the other surface of the stretched resin layer.

Further, the lid material of the present invention is configured such that the stretched resin layer is formed by laminating two or more stretched resin layers of the same kind or different kinds made of a thermoplastic resin, and the stretched resin layer is made of polyester. Resin, polyamide resin, polycarbonate resin and polyolefin resin, wherein the self-adhesive thermoplastic resin is polycondensed after ester reaction of polyvalent carboxylic acid and polyhydric alcohol. A structure such that it is a linear saturated polyester resin obtained by, the heat sealant layer is at least polyester resin, polyurethane resin, vinyl chloride-vinyl acetate copolymer resin, acrylic resin and ethylene-vinyl acetate copolymer It was configured to contain one kind.

In the cover material of the present invention, the surface resistivity of the electrostatic diffusion layer is within the range of 10 ⁵ to 10 ¹² Ω, and 99
The configuration was such that the% charge decay time was 2 seconds or less.

Further, the lid material of the present invention is constructed so that the total light transmittance is 80% or more and the haze value is 30% or less.

In the above-mentioned present invention, in the lid member, the heat sealant layer and the electrostatic diffusion layer are laminated on one surface of the stretched resin layer via the thermoplastic resin layer made of a self-adhesive thermoplastic resin, In the state where the lid member is heat-sealed in a synthetic resin container on the side of the electrostatic diffusion layer, cohesive failure in the thermoplastic resin layer, or peeling between the thermoplastic resin layer and the heat sealant layer is possible. Therefore, the lid material can be peeled off stably and reliably regardless of the heat seal strength, and the static electricity diffusion layer has a good antistatic property without the transparent crystalline organic semiconductor as the main component being dependent on humidity. Therefore, it imparts stable antistatic properties to the lid material, and this transparent crystalline organic semiconductor is colorless and transparent and does not affect the heat sealability of the heat sealant layer. Because the lid member is provided with visibility superior electrostatic characteristics and contents.

[0017]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic sectional view showing an embodiment of the lid member of the present invention. In FIG. 1, the lid member 1 is a stretched resin layer 2
And a heat sealant layer 4 and an electrostatic diffusion layer 5 which are laminated on one surface of the stretched resin layer 2 via a thermoplastic resin layer 3 made of a self-adhesive thermoplastic resin.

The stretched resin layer 2 is made of polyester resin such as polyethylene terephthalate (PET), polyamide resin such as nylon, polycarbonate resin, polyolefin resin such as polypropylene, polyimide (PI), polyether sulfone (PES), polyether ether ketone. (PEEK), polyetherimide (PEI), polyphenylene sulfide (PPS), polyarylate (PA), polyester ether (PEE), polyamide imide (PAI), wholly aromatic polyamide (APA),
Polyparabanic acid (PPA), polyoxadiazole (P
OD), polyhydantoin (PHY), or other uniaxially stretched film or biaxially stretched film.

The stretched resin layer 2 has a density of 0.915 to
0.940 g / cm ³ ethylene-α-olefin copolymer, styrene 50 to 90% by weight and butadiene 50 to 10
Styrene-butadiene block copolymer with 10% by weight, styrene 10-50% by weight and butadiene 90-50% by weight
A resin mixture consisting of three or more resins containing at least an ethylene-α-olefin copolymer and a styrene-butadiene block copolymer among high-impact polystyrene and a hydrogenated product of a styrene-butadiene block copolymer with It can be formed of a uniaxially stretched film or a biaxially stretched film.

In this case, the ethylene-α-olefin copolymer used is a copolymer of ethylene with, for example, butene, pentene, hexene, heptene, octene, 4-methylpentene-1 or the like. Such ethylene-
If the density of alpha · olefin copolymer exceeds 0.915 g / cm ³ less than, or 0.940 g / cm ^3, a styrene - film forming property of the oriented resin layer 2 in combination with butadiene block copolymer is lowered It is not preferable because it is lost.

If the amount of styrene constituting the styrene-butadiene block copolymer used for forming the stretched resin layer 2 is less than 50% by weight, the tackiness of the film is increased and the handling becomes difficult, and 90% by weight. If it exceeds, the adhesiveness to the thermoplastic resin layer 3 at low temperature deteriorates, which is not preferable.

Then, ethylene in the stretched resin layer 2
The mixing ratio of the α-olefin copolymer and the styrene-butadiene block copolymer is 10-90% by weight of the ethylene-α-olefin copolymer and 90-10% by weight of the styrene-butadiene block copolymer. When the amount of the ethylene-α / olefin copolymer is less than 10% by weight and the amount of the styrene-butadiene block copolymer is more than 90% by weight, the film forming property of the stretched resin layer 2 becomes low and the transparency of the lid material also decreases, which is preferable. Absent. On the other hand, when the amount of the ethylene-α / olefin copolymer exceeds 90% by weight and the amount of the styrene-butadiene block copolymer is less than 10% by weight, the adhesion between the stretched resin layer 2 and the thermoplastic resin layer 3 is small. Excessively, the peel strength of the lid material is lower than the proper strength, which is not preferable.

When the stretched resin layer 2 is formed of four kinds of resins using a hydrogenated product of a styrene-butadiene block copolymer and high impact polystyrene, the above-mentioned ethylene-α-olefin copolymers 10 to 90 are used. Wt% and styrene-butadiene block copolymer 90-
5 to 30 parts by weight of a hydrogenated product of a styrene-butadiene block copolymer of 10 to 50% by weight of styrene and 90 to 50% by weight of butadiene is added to 100 parts by weight of a resin composition of 10% by weight, It is preferable to add 5 to 50 parts by weight of high-impact polystyrene.

When the stretched resin layer 2 is formed of three kinds of resins using a hydrogenated product of a styrene-butadiene block copolymer, 10 to 90% by weight of the above ethylene-α-olefin copolymer is used. And a styrene-butadiene block copolymer 90 to 10 wt% resin composition 1
It is preferable to add 5 to 30 parts by weight of the hydrogenated product of the styrene-butadiene block copolymer to 00 parts by weight.

Further, when the stretched resin layer 2 is formed of three kinds of resins by using high impact polystyrene, the above ethylene-α / olefin copolymers 10 to 9 are used.
0% by weight of styrene-butadiene block copolymer 9
With respect to 100 parts by weight of the resin composition of 0 to 10% by weight,
It is preferable to add 5 to 50 parts by weight of high-impact polystyrene.

The stretched resin layer 2 as described above can impart heat resistance and transparency to the lid material 1, the transparency of the lid material 1 is such that the total light transmittance is 80% or more, and the haze value is Is 30
% Or less is preferable. The thickness of the stretched resin layer 2 is
The thickness can be appropriately set according to the purpose of use of the lid material, and can be, for example, about 6 to 100 μm. When the thickness of the stretched resin layer is less than 6 μm, the strength of the lid member 1 is weak and there is a possibility that cutting may occur during high-speed peeling from the synthetic resin container. On the other hand, if it exceeds 100 μm, the heat conductivity during heat sealing is low, and the temperature of the heat seal bar needs to be increased, which is not preferable. If necessary, the surface of the stretched resin layer 2 on which the thermoplastic resin layer 3 is formed is subjected to a surface treatment such as corona treatment, plasma treatment, sandblast treatment, etc., to obtain adhesiveness with the thermoplastic resin layer 3. May be increased.
In addition, a material that has been subjected to static electricity generation prevention processing as needed can also be used.

The self-adhesive thermoplastic resin constituting the thermoplastic resin layer 3 includes terephthalic acid, isophthalic acid, maleic acid, maleic acid derivative, polyvalent carboxylic acid such as succinic acid, adipic acid and sebacic acid, and ethylene. Polyhydric alcohols such as glycol, diethylene glycol, glycerin, trimethylolpropane, 1,2-propylene glycol, 1,4-butanediol, 1,5-pentadiol, 1,6-hexanediol, neopentyl glycol and polyethylene glycol After the ester reaction of
The linear polyester resin obtained by polycondensation comprises one kind or a combination of two or more kinds. Further, the thermoplastic resin layer 3 may be formed by combining two or more kinds of the self-adhesive thermoplastic resins having different glass transition points (Tg).

The content of the self-adhesive thermoplastic resin in the thermoplastic resin layer 3 is preferably about 20 to 100% by weight, and when the content is less than 20% by weight, the thermoplastic resin layer 3 and the thermoplastic resin layer 3 are stretched. The adhesive strength with the resin layer 2 or the heat sealant layer 4 becomes weak, which is not preferable. Further, the thickness of the thermoplastic resin layer 3 can be about 0.1 to 10 μm. When the thickness is less than 0.1 μm, the adhesive strength between the thermoplastic resin layer 3 and the heat sealant layer 4 becomes weaker, and when the thickness exceeds 10 μm, the thermoplastic resin layer is thermoplastic when heat-sealed with a synthetic resin container such as a carrier tape. The resin layer 3 may be squeezed out and interfere with the extraction of the electronic component, which is not preferable.

Further, in the present invention, a film in which a thermoplastic resin layer made of the above-mentioned self-adhesive thermoplastic resin is previously formed on one surface of a polyester resin film as a stretched resin layer may be used. it can.

Since the lid member 1 of the present invention is provided with the thermoplastic resin layer 3 made of the self-adhesive thermoplastic resin as described above, the lid member 1 thermally fused to the synthetic resin container is peeled off. At this time, delamination between the thermoplastic resin layer 3 and the heat sealant layer 4 (delamination) or cohesive failure in the thermoplastic resin layer 3 occurs. The peel strength in this case is weaker than the adhesive strength between the heat sealant layer 4 and the synthetic resin container via the electrostatic diffusion layer 5 described later, and is preferably in the range of 200 to 1200 g / 15 mm. If the peel strength is less than 200 g / 15 mm, peeling may occur between the thermoplastic resin layer 3 and the heat sealant layer 4 when the container after heat-sealing the lid material is transferred, and the contents may fall off. There is a nature. If the peel strength exceeds 1200 g / 15 mm, the synthetic resin container may vibrate when the lid material is peeled off, and the contents may pop out, which is not preferable. Further, the zip-up (difference between maximum and minimum values of peel strength) is preferably 50 g / 2 mm or less. If the zip-up exceeds 50 g / 2 mm, the synthetic resin container may vibrate when the lid material is peeled off and the contents may pop out, which is not preferable.

The above peel strength is 23 ° C., 40% R
180 ° peeling in H atmosphere (Peeling speed = 300m
m / min). In addition, zip up is 15m
The difference between the maximum value and the minimum value of the peel strength when a lid material that is heat-sealed to a synthetic resin container with a width of m is slit into a width of 2 mm and peeled. At this time, the peeling strength was measured at 23 ° C., 4
180 ° peeling in a 0% RH atmosphere (peel rate = 3
(00 mm / min) and the measurement length is 20 cm.

Heat sealant layer 4 of lid 1 of the present invention
Is ethylene-vinyl acetate-based, ethylene-vinyl acetate-
Acrylic type, olefin type, elastomer type (styrene-butadiene-styrene block copolymer, styrene-isobutylene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer), polyamide type, polyester type, copolyester type, polyurethane type And the like, and one or a combination of two or more of the thermoplastic resins and thermoplastic elastomers shown in Tables 1 to 3 below.

[0034]

[Table 1]

[0035]

[Table 2]

[0036]

[Table 3] Further, the heat sealant layer 4 can be formed by one kind or a combination of two or more kinds of the following pressure sensitive adhesives (pressure sensitive adhesives). (Adhesive) ・ Rubber system: Natural rubber system, styrene-butadiene system, polyisobutylene system, isoprene system ・ Acrylic system ・ Silicone system ・ Emulsion system: Acrylic emulsion system, natural rubber latex system, styrene-butadiene latex system ・ Hot melt System: Styrene-isoprene block copolymer system, styrene-butadiene block copolymer system, styrene-ethylene-butylene block copolymer system, ethylene-vinyl acetate thermoplastic elastomer system-Water system: polyvinyl alcohol system, polyacrylamide system, polyvinyl methyl ether System, polyacrylic acid-containing polymer system, dextrin system, polyvinylpyrrolidone system The heat sealant layer 4 is preferably polyester resin, polyurethane resin, vinyl chloride-vinyl acetate copolymer resin, acrylic resin. It is formed of a thermoplastic resin including at least one kind of resin. As a combination of two or more kinds of thermoplastic resins, for example, a mixed resin of polyurethane resin and vinyl chloride-vinyl acetate copolymer resin (mixing ratio is preferably in the range of 9: 1 to 4: 6), polyester resin and Mixed resin of vinyl chloride-vinyl acetate copolymer resin (mixing ratio is preferably in the range of 1: 1 to 9.5: 0.5), mixed resin of acrylic resin and vinyl chloride-vinyl acetate copolymer resin (The mixing ratio is 1: 1 to 9.5: 0.5.
Is preferable).

The thickness of the heat sealant layer 4 is 0.5 to 5
μm is preferred. The thickness of the heat sealant layer 4 is 0.5
If it is less than μm, the heat sealability with the synthetic resin container may be insufficient, and if it exceeds 5 μm,
When the lid material is peeled from the synthetic resin container, cohesive failure occurs in the heat sealant layer 4, and the heat seal agent is pulled while being adhered to the lid material and the synthetic resin container. There is a risk of getting caught when taking out.

The static electricity diffusion layer 5 of the lid member 1 of the present invention is a layer containing a transparent crystalline organic semiconductor as a main component. This static electricity diffusion layer 5 is a thermoplastic resin such as polyester resin, polyurethane resin, vinyl chloride-vinyl acetate copolymer resin, acrylic resin, ethylene-vinyl acetate type, ethylene-vinyl acetate-acrylic type, olefin type, elastomer type. (Styrene-butadiene-styrene block copolymer, styrene-isobutylene-styrene block copolymer, styrene-ethylene-styrene block copolymer), polyamide-based, polyester-based, copolyester-based, polyurethane-based hot-melt adhesives, Tables 1 to 1 above. One of the thermoplastic resins and thermoplastic elastomers shown in Table 3 or a combination of two or more thereof is used as a binder, and a transparent crystalline organic semiconductor is kneaded or dispersed in the binder, or a transparent crystalline organic semiconductor is used. solution( / Isopropyl alcohol) using what is dispersed in, extrusion coating, melt extrusion coating method, a calender method, a roll coating method, it is formed on the heat sealant layer 4 by a spray method or the like.

Examples of the transparent crystalline organic semiconductor material used in the present invention include bisammonium-based organic sulfur semiconductors represented by the following general formula (1).

[0040]

Embedded image More specifically, the substances shown in the following conjugates 1 to 29 can be used.

[0041]

Embedded image

[0042]

Embedded image

[0043]

Embedded image

[0044]

Embedded image

[0045]

[Chemical 6] Such an electrostatic diffusion layer 5 has a thickness of 0.05 to 2 μm.
It is preferable that the surface resistivity is 22
Within the range of 10 ⁵ to 10 ¹² Ω at 40 ° C. and 40% RH, and at 23 ± 5 ° C. and 12 ± 3% RH,
The charge decay time required to decay from 5000 V to 99% is 2 seconds or less, and it has excellent electrostatic characteristics. When the surface resistivity of the exceeding 10 ¹² Omega, static dissipative effect is extremely poor, the electronic component becomes difficult to protect from electrostatic breakdown, and if less than 10 ⁵ Omega, the lid member from outside Electricity may be applied to the electronic component through the electronic component, and there is a risk that the electronic component may be electrically damaged. On the other hand, if the charge decay time, which is a measure of the diffusion rate of charges generated by static electricity, exceeds 2 seconds, the electrostatic diffusion effect becomes extremely poor, and it becomes difficult to protect electronic components from electrostatic breakdown. The surface resistivity and the charge decay time can be measured according to MIL-B-81705C, which is a US military standard.

If necessary, the static electricity diffusion layer 5 may contain additives such as a dispersion stabilizer and an antiblocking agent.

In the above embodiment, the stretched resin layer has a single layer structure, but the lid material of the present invention may have a stretched resin layer having a multilayer structure. FIG. 2 is a schematic cross-sectional view showing another embodiment of the lid member of the present invention. In FIG. 2, a lid material 11 is a stretched resin layer 12 having a multilayer structure, and a thermoplastic resin layer 13 made of a self-adhesive thermoplastic resin on one surface of the stretched resin layer 12.
The heat sealant layer 14 and the static electricity diffusion layer 15 which are laminated via The thermoplastic resin layer 13, the heat sealant layer 14, and the static electricity diffusion layer 15 which compose the lid member 11 are the same as the thermoplastic resin layer 3, the heat sealant layer 4, and the static electricity diffusion layer 5 which compose the lid material 1. Since they can be the same, description thereof is omitted here.

The stretched resin layer 12 is formed by laminating a stretched resin layer 12A and a stretched resin layer 12B via an adhesive layer 12a, and the thermoplastic resin layer 3 is formed on the stretched resin layer 12B side. As the stretched resin layers 12A and 12B constituting such a stretched resin layer 12, a uniaxially stretched film or a biaxially stretched film similar to the above-mentioned stretched resin layer 2 can be used, and therefore the description thereof is omitted here.

Adhesive layer 12a constituting the stretched resin layer 12
As the resin, a curing reaction type adhesive made of polyester resin, polyether resin, polyurethane resin, ethylene / vinyl acetate copolymer, acrylic resin, epoxy resin, or modified products thereof can be used. By stacking the stretched resin layers 12A and 12B via the adhesive layer 12a to form the stretched resin layer 12, the rigidity of the lid can be increased without impairing transparency.

The adhesive layer 1 constituting the stretched resin layer 12
As 2a, ethylene-α-olefin copolymer and ethylene-acrylic acid copolymer, ion-crosslinked olefin copolymer, maleic anhydride grafted polyethylene, maleic anhydride grafted polypropylene, acrylic acid grafted polyolefin, ethylene-vinyl acetate copolymer The stretched resin layer 12 may be formed by sandwich lamination of the stretched resin layer 12A and the stretched resin layer 12B using an adhesive agent such as coalesced, copolyester, or copolyamide. The stretched resin layer 12 as described above is provided with cushioning properties by the adhesive layer 12a without impairing transparency, and thus the cover material 11
The heat sealability to the synthetic resin container is further improved.

The thickness of the stretched resin layer 12 can be appropriately set according to the purpose of use of the lid material, and the above-mentioned lid material 1 is used.
Similarly to the stretched resin layer 2 constituting the
m. Further, the stretched resin layers 12A and 12B constituting the stretched resin layer 12 each have a thickness of 3 to 80.
The thickness can be set in the range of μm. Further, the thickness of the adhesive layer 12a constituting the stretched resin layer 12 is 1 to 1
It can be set in the range of 0 μm.

In the above embodiment, the stretched resin layer is 2
Although the cover material of the present invention has a layered structure, the stretched resin layer may have a laminated structure of three or more layers.

The cover material of the present invention may have an embodiment having an antistatic layer or an antireflection layer and an antistatic layer on the stretched resin layer, in addition to the above-mentioned embodiment. FIG.
And FIG. 4 is a schematic sectional view showing another example of such a lid member of the present invention. In FIG. 3, the lid member 21 includes a stretched resin layer 22, a heat sealant layer 24 laminated on one surface of the stretched resin layer 22 via a thermoplastic resin layer 23 made of a self-adhesive thermoplastic resin, and a static electricity layer. Diffusion layer 2
5 and the antistatic layer 26 is provided on the other surface of the biaxially stretched resin layer 22. Further, in FIG. 4, an antireflection layer 27 is further provided on the antistatic layer 26.

The antistatic layer 26 is formed for the purpose of preventing dust from adhering to the surface of the lid member 21 due to static electricity. The antistatic layer 26 is an anionic type, a cationic type, a nonionic type, or an antistatic agent.
Conductivity of any amphoteric surfactant, fatty acid derivative, tetrafunctional silicon partial hydrolyzate, or fine metal powder, metal oxide system, metal sulfide system, or sulfate system that has been subjected to a conductive treatment. It is a layer containing at least one kind of conductive fine powder and conductive carbon.

As the above-mentioned anionic surfactant, sulfated oil, soap, sulfated ester oil, sulfated amide oil, sulfate ester salts of olefin, fatty alcohol sulfate ester salt, alkyl sulfate ester salt, fatty acid ethyl sulfonic acid. Examples thereof include salts, alkyl sulfonates, alkyl benzene sulfonates, mixtures of naphthalene sulfonic acid and formalin, succinic acid ester sulfonic acid salts, and phosphoric acid ester salts.

Examples of cationic surfactants include primary amine salts, tertiary amine salts, quaternary ammonium compounds, pyridine derivatives and the like.

As the nonionic surfactant, a partial fatty acid ester of polyhydric alcohol, ethylene oxide adduct of fatty alcohol, ethylene oxide adduct of fatty acid, ethylene oxide adduct of fatty amino or fatty acid amide, alkylphenol. And ethylene oxide adduct of alkyl naphthol, ethylene oxide adduct of partial fatty acid ester of polyhydric alcohol, and the like.

Furthermore, examples of the amphoteric surfactant include carboxylic acid derivatives and imidazoline derivatives.

The antistatic layer 26 can be formed on the stretched resin layer 22 by using the above antistatic agent alone. Alternatively, it may be formed by applying an ink in which an antistatic agent is dispersed to a thermoplastic resin that can be used in forming the antireflection layer 27 described later. The thickness of such antistatic layer 26 is preferably about 0.2 to 20 μm.

The antistatic layer 26 has a surface resistivity in the range of 10 ⁵ to 10 ¹² Ω at 22 ° C. and 40% RH, and at 23 ± 5 ° C. and 12 ± 3% RH. The charge decay time required to decay from 5000 V to 99% is 2 seconds or less, and has an excellent antistatic effect.

Further, the antireflection layer 27 is intended to suppress diffused reflection on the lid member or the reflection of light from the light source to make it easier to visually observe the inside of the container. Such an antireflection layer 27 includes calcium fluoride, sodium fluoride, lithium fluoride, magnesium fluoride, lanthanum fluoride, neodymium fluoride, cerium fluoride, silicon dioxide, aluminum oxide, magnesium monoxide, thorium oxide, One or more of lanthanum oxide, silicon monoxide, yttrium oxide, zirconium oxide, titanium oxide, cerium oxide, zinc oxide, bismuth oxide, cadmium sulfide, etc. may be formed using an ink dispersed in a thermoplastic resin. It is possible to directly form a film. As the thermoplastic resin, polyester-based, polyurethane-based, acrylic-based, vinyl chloride-vinyl acetate copolymer-based, polyvinyl acetate-based,
Phenol type, xylene type, urea resin type and melanin type, ketone type, coumarone / indene type, petroleum resin type, terpene type, cyclized rubber type, chlorinated rubber type, alkyd type, polyamide type, polyvinyl alcohol type, polyvinyl butyral type , Chlorinated polypropylene type, styrene type, epoxy type, cellulose derivative and the like. As a method for forming the antireflection layer 27 by applying ink, an air doctor coating method, a blade coating method, a knife coating method,
Rod coating method, roll coating method, gravure coating method,
A screen method, a kiss coating method, a bead coating method, a slot orifice coating method, a spray method and the like can be mentioned, and in the case of directly forming a film, a vacuum vapor deposition method, a sputtering method and the like can be mentioned. The antireflection layer 27 may have a single-layer structure or a multi-layer structure, and the film thickness is preferably about 0.01 to 0.5 μm.

In the lid member 21, the stretched resin layer 22, the thermoplastic resin layer 23, the heat sealant layer 24, and the static electricity diffusion layer 25 are the same as the corresponding layers constituting the lid member 11 described above. , Description is omitted.

Further, the antistatic layer and the antireflection layer as described above can be similarly formed in the lid member including the stretched resin layer having a single layer structure as shown in FIG.

Next, taking the lid member 21 shown in FIG. 3 as an example, the peeling operation of the lid member of the present invention will be described with reference to FIGS. First, as shown in FIG. 5 and FIG. 6, for example, a carrier tape 31 as a synthetic resin container having an embossed portion 32 is provided with a lid member 21 as shown in FIG.
Are heat-sealed. This heat fusion is performed in a line shape with a predetermined width on both ends of the embossed portion 32. In the illustrated example, the line-shaped heat-sealing portion H is shown by a shaded portion. In this state, the adhesive strength between the thermoplastic resin layer 23 of the lid member 21 and the heat sealant layer 24 is in the range of 200 to 1200 g / 15 mm, and the adhesive strength between the heat sealant 24 and the electrostatic diffusion layer 25 or the electrostatic diffusion layer 25. It is smaller than the heat fusion strength between the carrier tape 31 and the carrier tape 31. Next, when the lid member 21 is peeled off from the carrier tape 31, the heat sealant layer 24 and the electrostatic diffusion layer 25 are still heat-sealed to the carrier tape 31 in the line-shaped heat-sealed portion H, and the thermoplastic resin Peeling occurs between the layers 23 and the heat sealant layer 24 (FIG. 7). Therefore, the lid member 21 is peeled off with the line-shaped heat-sealed portion H of the heat sealant 24 and the electrostatic diffusion layer 25 left on the carrier tape. Alternatively, cohesive failure occurs in the thermoplastic resin layer 23 at the line-shaped heat-sealed portion H, and a part of the thermoplastic resin layer 23, the heat sealant layer 24, and the electrostatic diffusion layer 25 heat the carrier tape 31. The lid member 21 is peeled off while being fused (FIG. 8). That is, the lid member 21 of the present invention has the contradictory characteristics of high heat-sealing property to the carrier tape 31 and easy peeling property at the time of peeling, and has sufficient heat-sealing strength to the synthetic resin container. It can be peeled from the synthetic resin container with a low zip-up after being raised and heat-sealed.

Whether the above-described peeling between the thermoplastic resin layer 23 and the heat sealant layer 24 (delamination) or the cohesive failure in the thermoplastic resin layer 23 is caused depends on the heat-sealing condition. Can be appropriately selected by controlling. That is, by deteriorating the conditions at the time of heat sealing (higher heating temperature, longer heating time, stronger pressure), delamination between the thermoplastic resin 23 and the heat sealant layer 24 can be caused, and the heat By loosening the sealing condition, cohesive failure in the thermoplastic resin layer 23 can be caused. As a specific example of the above heat-sealing conditions, in the case of delamination, heating temperature = 120 to 200 ° C, heating time = 0.3 to 2.0 seconds, pressurization = 0.7 to 3.0 kg.
f / cm ² and in case of cohesive failure, heating temperature = 9
0 to 150 ° C, heating time = 0.1 to 0.5 seconds, pressurization =
It is about 0.3 to 1.2 kgf / cm ² .

As the synthetic resin container to which the lid material of the present invention as described above is applied, polyvinyl chloride (PV
C), polystyrene (PS), polyester (A-PE
T, PEN, PET-G, PCTA), polypropylene (PP), polycarbonate (PC), polyacrylonitrile (PAN), acrylonitrile-butadiene-styrene copolymer (ABS), etc. As conductive carbon fine particles, metal fine particles, conductive fine powder obtained by adding conductivity to metal oxides such as tin oxide, zinc oxide, and titanium oxide, Si-based organic compounds, surfactants, transparent crystalline organic semiconductors, and ultraviolet curing Examples thereof include those obtained by kneading or coating a mold-type or electron beam-curing type antistatic agent. Further, a PS-based resin sheet or ABS-based resin sheet having a composite plastic sheet formed by integrally co-extruding a PS-based or ABS-based resin film or sheet containing carbon black on one or both sides is also exemplified. To be Alternatively, as the conductive treatment, a plastic film having a conductive polymer formed on its surface can be used.

[0067]

EXAMPLES Next, the lid member of the present invention will be described in more detail with reference to examples. (Example 1) Sample 1 A biaxially stretched polyethylene terephthalate (PET) film (Spetet 6140, manufactured by Toyobo Co., Ltd., thickness: 50 μm) having one surface subjected to corona treatment was prepared. Next, a linear saturated polyester resin composed of terephthalic acid and ethylene glycol was used as a solvent (toluene / methyl ethyl ketone = 1
The coating solution dissolved in / 1) is applied to the corona-treated surface of the PET film (stretched resin layer) by the gravure reverse coating method (coating thickness = 2 μm) and dried to form a heat of a self-adhesive thermoplastic resin. A plastic resin layer was formed.

Next, a heat sealant having the following composition was applied (coating thickness = 3 μm) on the thermoplastic resin layer by a gravure reverse coating method and dried to form a heat sealant layer.

(Composition of heat sealing agent) Urethane resin 70 parts by weight Vinyl chloride-vinyl acetate copolymer 30 parts by weight Next, a bisammonium-based organic sulfur semiconductor is gravure reverse coated on the heat sealant layer. Was applied (application thickness = 1 μm) and dried to form an electrostatic diffusion layer. As a result, a lid member (Sample 1) having the structure shown in FIG. 1 was produced. Sample 2 Biaxially stretched PET film (thickness 12 μm) with corona treatment on one side and biaxially stretched PE with corona treatment on both sides
A T-film (thickness: 16 μm) was dry-laminated on the corona-treated surface side with a urethane adhesive to prepare a film having a two-layer structure (stretched resin layer).

Thickness of this film (stretched resin layer): 16μ
On the corona-treated surface of mPET, a thermoplastic resin layer, a heat sealant layer, and an electrostatic diffusion layer were sequentially laminated in the same manner as in Sample 1, and a lid member (Sample 2) having a structure as shown in FIG.
Was produced. Sample 3 was prepared in the same manner as in Sample 2 except that a biaxially stretched nylon film (thickness 15 μm) having corona treatment on both sides was used in place of the biaxially stretched PET film having one surface treated with corona. A lid member (Sample 3) having a structure as shown in was prepared. Sample 4 Biaxially stretched PET film (thickness 12 μm) with corona treatment on one side and biaxially stretched PE with corona treatment on both sides
After AC treatment with the T film (thickness 12 μm), sandwich lamination (adhesion layer = 20 μm) was performed on the corona-treated surface side with a low-density polyethylene adhesive to prepare a film having a two-layer structure (stretched resin layer).

On the corona-treated surface of this film (stretched resin layer), a thermoplastic resin layer, a heat sealant layer and an electrostatic diffusion layer were sequentially laminated in the same manner as in Sample 1, and a lid having a structure as shown in FIG. A material (Sample 4) was produced. Sample 5 A lid member (Sample 5) having a structure as shown in FIG. 2 was prepared in the same manner as Sample 4, except that sandwich lamination was performed using an ethylene-acrylic acid copolymer instead of the low-density polyethylene adhesive. It was made. Sample 6 Sample 2 except that a biaxially stretched film (thickness 30 μm) prepared by using a mixed resin having the following composition was used in place of the biaxially stretched PET film (thickness 16 μm) that was subjected to corona treatment on both sides. A lid member (Sample 6) having the structure shown in FIG. 2 was prepared in the same manner as in.

(Composition of mixed resin) Linear low density polyethylene: 70 parts by weight Styrene-butadiene block copolymer: 20 parts by weight High impact polystyrene: 10 parts by weight Comparative sample 1 Line composed of terephthalic acid and ethylene glycol The same procedure as in Sample 1 except that a thermoplastic resin layer was formed by using a mixed resin of 30 parts by weight of vinyl chloride-vinyl acetate copolymer and 70 parts by weight of nitrified cotton instead of the saturated polyester resin in the form of a sample. A lid member (Comparative Sample 1) having the structure shown in FIG. Comparative Sample 2 A lid material (Comparative Sample 2) was prepared in the same manner as Sample 1 except that the static electricity diffusion layer made of a bisammonium-based organic sulfur semiconductor was not formed. Comparative Sample 3 As shown in FIG. 1, except that a surfactant type antistatic agent (Staticide manufactured by Takihara Sangyo Co., Ltd.) was used instead of the bisammonium-based organic sulfur semiconductor. A lid material (Comparative Sample 3) having various configurations was produced. Comparative Sample 4 Without forming a thermoplastic resin layer using a linear saturated polyester resin composed of terephthalic acid and ethylene glycol,
A lid member (Comparative Sample 4) was prepared in the same manner as Sample 1 except that the heat sealant layer was directly formed on the corona-treated surface of the PET film (stretched resin layer). Comparative sample 5 A lid member having the structure shown in FIG. 2 (comparative sample) was prepared in the same manner as sample 6 except that a biaxially stretched film (thickness 30 μm) prepared by using a mixed resin having the following composition was used. 5) was produced.

(Composition of mixed resin) Linear low density polyethylene: 40 parts by weight Styrene-butadiene block copolymer: 5 parts by weight High impact polystyrene: 55 parts by weight Next, each of the above lid materials (Sample 1) .About.6, Comparative Samples 1 to 5), the haze degree, total light transmittance, surface resistivity, and charge decay time were measured under the following conditions. Further, each of the above-mentioned lid materials is attached to a conductive polyvinyl chloride resin base material (XEG47 manufactured by Taihei Chemical Co., Ltd.) using a heat seal bar at 160 ° C.
Heat fusion was performed under the conditions of 3.0 kgf / cm ² for 5 seconds, and then the peel strength was measured under the following conditions to obtain zip-up.

(Measurement Conditions of Haze Degree and Total Light Transmittance) Suga Test Instruments Co., Ltd. color computer SM-5SC was used for measurement.

(Conditions for measuring surface resistivity) 22 ° C., 40%
Under RH, it was measured by Hiresta IP manufactured by Mitsubishi Petrochemical Co., Ltd.

(Measurement condition of charge decay time) 23 ± 5 ° C.,
The time required to attenuate 99% from 5000 V under 12 ± 3% RH is based on MIL-B-81705C and manufactured by ETS (Electro-Tech Systems, Inc).
Measured with STATIC DECAY METER-406C.

(Peeling strength measurement conditions) 23 ° C., 40% R
Under H, the measurement was performed using a Tensilon universal testing machine HTH-100 manufactured by Toyo Baldwin Co., Ltd. (Peeling speed = 300
mm / min, 180 ° peeling) The measurement results and peeling form of the above items for each lid material are shown in Table 4 below.

[0078]

[Table 4] As is clear from Table 4, Samples 1 to 6 all showed low surface resistivity (within the range of 10 ⁵ to 10 ¹² Ω) and charge decay time (2 seconds or less), and also had peel strength of 700 to 900 g / 1.
The zip-up was 50 g / 2 mm or less in the range of 5 mm. Further, Samples 1 to 5 using a polyester resin film or a polyamide resin film as the stretched resin layer,
Especially excellent transparency.

On the other hand, the lid materials (Comparative Samples 1 and 4) not provided with the thermoplastic resin layer made of linear saturated polyester, which is a self-adhesive thermoplastic resin, have surface resistivity,
Although it was good in terms of charge decay time and transparency, it had a low peel strength (less than 200 g / 15 mm) and could not be put to practical use as a lid material.

Further, the lid materials (Comparative Samples 2 and 3) not provided with the static electricity diffusion layer made of the bisammonium-based organic sulfur semiconductor are both large in surface resistivity and charge decay time, and can be practically used as a lid material. It was not there. Further, the lid material (comparative sample 5) using the biaxially stretched film prepared by using the mixed resin having a high content of high-impact polystyrene was not practically usable as a lid material in terms of transparency. .

[0081]

As described above in detail, according to the present invention, the stretched resin layer is transparent to the heat sealant layer formed on one surface of the stretched resin layer via the thermoplastic resin layer made of a self-adhesive thermoplastic resin. Since a lid member is formed by laminating an electrostatic diffusion layer containing a crystalline organic semiconductor as a main component in this order, the thermoplastic resin in the state where the lid member is heat-sealed in a synthetic resin container on the side of the electrostatic diffusion layer is used. Cohesive failure in layers,
Alternatively, it becomes possible to peel between the thermoplastic resin layer and the heat sealant layer, it is easy to control the peel strength of the lid material regardless of the heat seal strength, and high adhesion of the lid material to the synthetic resin container. The lid material can be peeled off stably with a low zip-up while maintaining the above, and excellent electrostatic characteristics are given to the electrostatic diffusion layer, and
A lid material with excellent visibility of the contents. Furthermore, by making the stretched resin layer from at least one of polyester resin, polyamide resin, polycarbonate resin and polyolefin resin, the transparency of the lid material is further improved and the visibility of the contents is further improved. Become.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an embodiment of a lid member of the present invention.

FIG. 2 is a schematic cross-sectional view showing another embodiment of the lid member of the present invention.

FIG. 3 is a schematic cross-sectional view showing another embodiment of the lid member of the present invention.

FIG. 4 is a schematic cross-sectional view showing another embodiment of the lid member of the present invention.

FIG. 5 is a perspective view showing a state in which the lid member of the present invention is heat-sealed on a carrier tape.

FIG. 6 is a sectional view taken along line VI-VI of FIG. 5;

FIG. 7 is a view corresponding to FIG. 6 showing a state in which the lid member is peeled off from the carrier tape.

FIG. 8 is a view corresponding to FIG. 6 showing a state in which the lid member is peeled off from the carrier tape.

[Explanation of symbols]

 1,11,21 ... Lid material 2,12,22 ... Stretched resin layer 12A, 12B ... Stretched resin layer 12a ... Adhesive layer 3,23,23 ... Thermoplastic resin layer 4,14, 24 ... Heat sealant layer 5,15 , 25 ... Electrostatic diffusion layer 26 ... Antistatic layer 27 ... Antireflection film 31 ... Carrier tape 32 ... Embossed portion

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location B32B 27/28 101 B32B 27/28 101 27/30 27/30 A 101 101 27/32 27/32 Z 27/34 27/34 27/36 27/36 B65D 77/20 B65D 77/20 M

Claims (8)

[Claims] 1. A stretched resin layer, a heat sealant layer formed on one surface of the stretched resin layer via a thermoplastic resin layer made of a self-adhesive thermoplastic resin, and a heat sealant layer formed on the heat sealant layer. A lid member comprising an electrostatic diffusion layer containing the transparent crystalline organic semiconductor as a main component. 2. The lid member according to claim 1, further comprising an antistatic layer on the other surface of the stretched resin layer. 3. The cover material according to claim 1, wherein the stretched resin layer is a laminate of two or more stretched resin layers of the same kind or different kinds made of a thermoplastic resin. . 4. The stretched resin layer is a polyester resin,
The lid material according to any one of claims 1 to 3, which is made of at least one of a polyamide resin, a polycarbonate resin, and a polyolefin resin. 5. The self-adhesive thermoplastic resin is a linear saturated polyester resin obtained by subjecting a polyvalent carboxylic acid and a polyhydric alcohol to an ester reaction and then polycondensation. The lid member according to any one of claims 1 to 4. 6. The heat sealant layer contains at least one of a polyester resin, a polyurethane resin, a vinyl chloride-vinyl acetate copolymer resin, an acrylic resin and an ethylene-vinyl acetate copolymer. The lid member according to any one of claims 1 to 5. 7. The electrostatic diffusion layer has a surface resistivity of 10
Within the range of ⁵ to 10 ¹² Ω, 99% charge decay time is 2
The lid member according to any one of claims 1 to 6, which is not more than a second. 8. The lid material according to claim 1, wherein the total light transmittance is 80% or more and the haze value is 30% or less.