JPH09306374A - Preventive method of floating electron emission from first control electrode of cathode-ray tube and first control electrode - Google Patents

Preventive method of floating electron emission from first control electrode of cathode-ray tube and first control electrode

Info

Publication number
JPH09306374A
JPH09306374A JP14782296A JP14782296A JPH09306374A JP H09306374 A JPH09306374 A JP H09306374A JP 14782296 A JP14782296 A JP 14782296A JP 14782296 A JP14782296 A JP 14782296A JP H09306374 A JPH09306374 A JP H09306374A
Authority
JP
Japan
Prior art keywords
cathode
control electrode
substance
ray tube
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14782296A
Other languages
Japanese (ja)
Inventor
Koichiro Sumi
紘一郎 住
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP14782296A priority Critical patent/JPH09306374A/en
Publication of JPH09306374A publication Critical patent/JPH09306374A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To prevent emission of a floating electron, reduce floating capacity between electrodes, and improve an image quality by covering a part where a first control electrode is opposed to a cathode substance covering surface with a substance such as gold which has a high work function and is low in reactivity with a cathode substance. SOLUTION: A part where a plate-like first control electrode G1 of a cathode-ray tube is opposed to a cathode substance covering surface (a) of a cathode K, is covered with a substance such as Au, Ni and Co which has a high work function and is low in reactivity with a cathode substance (a) by a method such as ion sputtering, evaporation and plating. Therefore, even if barium (b) sticks to a surface where the first control electrode G1 is opposed to the cathode and exists as a barium oxide by oxidizing gas in the cathode-ray tube, reaction with a reducing agent contained in a raw material of the G1 is restrained by an inactive metallic coating film, and generation of a floating electron is restrained, and an image quality in a dark image screen can be improved. An evil influence by discharge of the floating electron generated by the G1 at operating time of the cathode-ray tube can also be restrained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、陰極線管の第一
制御電極の改良に係り、詳しくは、第一制御電極のカソ
ード対向面に不活性の金属被膜を形成することによっ
て、電子ビームがカットオフ時の暗い画面における画質
を向上させた陰極線管の第一制御電極からの浮遊電子放
出防止方法および第一制御電極に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a first control electrode of a cathode ray tube, and more particularly, to forming an inert metal coating on the cathode facing surface of the first control electrode to cut an electron beam. The present invention relates to a method for preventing floating electron emission from a first control electrode of a cathode ray tube and a first control electrode, which have improved image quality in a dark screen when turned off.

【0002】[0002]

【従来の技術】従来から、陰極線管の電子銃を構成する
第一制御電極(以下、適宜G1電極と略称する)として
は、例えばSUS402のような非磁性の金属を加工し
て、板状あるいはカップ状に形成した電極が使用されて
いる。このG1電極は、カソードに近接して配置されて
おり、電子放射性物質が塗布されたカソードの電界強度
を制御して、電子ビームをオンオフするよう機能してい
る。ところで、近年、陰極線管は、コンピュータのディ
スプレイ用として使用されるため、高解像度が求められ
ている。そして、このような要請に応じるためには、G
1電極の孔径を小さくすると共に、カソードとG1電極
との距離も小さくする必要が生じている。ところが、G
1電極の孔径を小さくしたり、カソードとG1電極との
距離を小さくすると、浮遊電子が発生して画質に悪影響
を与える。この状態を図で説明する。
2. Description of the Related Art Conventionally, as a first control electrode (hereinafter, abbreviated as a G1 electrode as appropriate) which constitutes an electron gun of a cathode ray tube, a non-magnetic metal such as SUS402 is processed into a plate shape or A cup-shaped electrode is used. The G1 electrode is arranged in the vicinity of the cathode and functions to control the electric field intensity of the cathode coated with the electron emissive material to turn on / off the electron beam. By the way, in recent years, a cathode ray tube is used for a display of a computer, and thus a high resolution is required. And in order to meet such a request, G
It is necessary to reduce the hole diameter of one electrode and also reduce the distance between the cathode and the G1 electrode. However, G
If the hole diameter of one electrode is reduced or the distance between the cathode and the G1 electrode is reduced, floating electrons are generated, which adversely affects the image quality. This state will be described with reference to the drawing.

【0003】図2は、陰極線管内のカソードとG1電極
において、浮遊電子の発生状態を説明するための模式図
である。図の符号において、G1はG1電極、Kはカソ
ード、aはカソード物質、bはバリウム、cは浮遊電
子、dKGはカソードK面とG1電極との距離を示す。
FIG. 2 is a schematic diagram for explaining the generation state of floating electrons in the cathode and the G1 electrode in the cathode ray tube. In the figure, G1 is a G1 electrode, K is a cathode, a is a cathode material, b is barium, c is a floating electron, and dKG is a distance between the cathode K surface and the G1 electrode.

【0004】この図2に示すように、G1電極G1は、
カソードKに塗布されたカソード物質aと対向して配置
されている。そして、先に述べたように、G1電極G1
の孔径が小さくされたり、カソードK面とG1電極G1
との距離dKGが小さくされると、陰極線管(CRT)
の製造時におけるカソードKの活性工程や動作中に、カ
ソード物質aを構成するバリウムbが管内に放出され、
G1電極G1のカソードKとの対向面に付着される。こ
のバリウム(Ba)bは、陰極線管内に存在する例えば
炭酸ガス(CO2 )のような酸化性のガスと結合して、
酸化バリウム(BaO)が生成される。
As shown in FIG. 2, the G1 electrode G1 is
The cathode material a is applied so as to face the cathode K. Then, as described above, the G1 electrode G1
The hole diameter of G1 electrode G1
When the distance dKG from and is reduced, the cathode ray tube (CRT)
During the activation process and operation of the cathode K during the manufacture of, barium b, which constitutes the cathode substance a, is released into the tube,
The G1 electrode G1 is attached to the surface facing the cathode K. The barium (Ba) b is combined with an oxidizing gas such as carbon dioxide (CO 2 ) existing in the cathode ray tube,
Barium oxide (BaO) is produced.

【0005】この酸化バリウム(BaO)は、G1電極
G1の素材金属中に含まれている例えばマンガン(M
n)のような微量の還元剤によって、電子の放出され易
すい状態となり、浮遊電子cが発生される原因となる。
このようにして発生された浮遊電子cは、カソードK面
に塗布されたカソード物質aから放射される正規の電子
が抑制されている状態、いわゆるカットオフ状態にあっ
ても発生され、この浮遊電子cの存在が画質を著しく劣
化させる原因となる。
This barium oxide (BaO) is contained in the material metal of the G1 electrode G1 such as manganese (M).
With a small amount of reducing agent as in n), electrons are easily released, which causes floating electrons c.
The stray electrons c thus generated are generated even when the regular electrons emitted from the cathode substance a applied to the cathode K surface are suppressed, that is, in the so-called cut-off state. The presence of c causes a significant deterioration in image quality.

【0006】[0006]

【発明が解決しようとする課題】この発明では、従来の
陰極線管において、画質低下の一因となる浮遊電子cの
発生を抑制することにより、高画質の画像表示が得られ
るようすることを課題とする。具体的にいえば、高解像
度が要求される陰極線管において、G1電極G1の孔径
を小さくしたり、カソードK面とG1電極G1との距離
dKGを小さくする必要性から、単に浮遊電子cだけで
なく、電極間の浮遊容量が増加することに伴う影響によ
って、電子ビームがカットオフ状態の暗い画面における
画質低下を改善させることを課題とする。さらに、この
ような課題を解決したG1電極を提供する。
SUMMARY OF THE INVENTION It is an object of the present invention to obtain a high-quality image display in a conventional cathode ray tube by suppressing generation of stray electrons c which causes deterioration of image quality. And Specifically, in a cathode ray tube that requires high resolution, it is necessary to reduce the hole diameter of the G1 electrode G1 and the distance dKG between the cathode K surface and the G1 electrode G1. It is another object of the present invention to improve the image quality deterioration in a dark screen in which the electron beam is cut off due to the influence of the increase in stray capacitance between the electrodes. Furthermore, the G1 electrode which solved such a subject is provided.

【0007】[0007]

【課題を解決するための手段】請求項1の浮遊電子放出
防止方法では、第一制御電極(G1)のカソード物質被
覆面に対向する部分に、仕事関数が高く、カソード物質
との反応性の低いAu(金)等の物質をイオンスパッタ
ー、蒸着、鍍金等の方法で被覆している。
According to the method for preventing floating electron emission of claim 1, the portion of the first control electrode (G1) facing the cathode material coating surface has a high work function and is highly reactive with the cathode material. A material such as low Au (gold) is coated by a method such as ion sputtering, vapor deposition, and plating.

【0008】請求項2の浮遊電子放出防止方法では、請
求項1の浮遊電子放出防止方法における仕事関数が高
く、カソード物質との反応性の低い物質に、Ni(ニッ
ケル),Co(コバルト),Cd(カドミウム),Sb
(アンチモニ),Cu(銅),Pb(鉛),Bi(ビス
マス),Tl(タリウム),Ag(銀),Pd(パラジ
ウム),Pt(プラチナ),Ru(ルテニウム),Rh
(ロジウム),Os(オスミウム),Ir(イリジウ
ム)などを使用している。
In the method for preventing floating electron emission according to claim 2, a material having a high work function and a low reactivity with the cathode material in the method for preventing floating electron emission according to claim 1 is Ni (nickel), Co (cobalt), Cd (Cadmium), Sb
(Antimony), Cu (copper), Pb (lead), Bi (bismuth), Tl (thallium), Ag (silver), Pd (palladium), Pt (platinum), Ru (ruthenium), Rh
(Rhodium), Os (osmium), Ir (iridium), etc. are used.

【0009】請求項3の浮遊電子放出防止方法では、請
求項1の浮遊電子放出防止方法における仕事関数が高
く、カソード物質との反応性の低い物質を被覆する厚さ
を、少なくとも10μmに設定している。
In the method for preventing floating electron emission according to claim 3, the thickness for coating a material having a high work function and a low reactivity with the cathode material in the method for preventing floating electron emission according to claim 1 is set to at least 10 μm. ing.

【0010】請求項4の第一制御電極は、カソード物質
被覆面に対向する部分に、仕事関数が高く、カソード物
質との反応性の低いAu(金),Ni(ニッケル),C
o(コバルト),Cd(カドミウム),Sb(アンチモ
ニ),Cu(銅),Pb(鉛),Bi(ビスマス),T
l(タリウム),Ag(銀),Pd(パラジウム),P
t(プラチナ),Ru(ルテニウム),Rh(ロジウ
ム),Os(オスミウム),Ir(イリジウム)などの
物質がイオンスパッター、蒸着、鍍金等によって被覆さ
れている。
In the first control electrode of claim 4, Au (gold), Ni (nickel), C having a high work function and a low reactivity with the cathode material is provided in a portion facing the cathode material coating surface.
o (cobalt), Cd (cadmium), Sb (antimony), Cu (copper), Pb (lead), Bi (bismuth), T
l (Thallium), Ag (Silver), Pd (Palladium), P
Substances such as t (platinum), Ru (ruthenium), Rh (rhodium), Os (osmium) and Ir (iridium) are coated by ion sputtering, vapor deposition, plating or the like.

【0011】[0011]

【発明の実施の形態】この発明の陰極線管の第一制御電
極からの浮遊電子放出防止方法および第一制御電極につ
いて、その実施の形態を図で説明する。この実施の形態
は、請求項1から請求項4の発明に対応している。この
発明では、図2に関連して従来の技術で説明したよう
に、浮遊電子cが発生する原因は、カソード物質が付着
した第一制御電極(G1)の素材金属中に含まれている
マンガン(Mn)のような微量の還元剤が存在している
ためである、という点に着目し、多くの実験を重ねた結
果、第一制御電極(G1)のカソード物質被覆面と対向
する部分に、仕事関数が高く、カソード物質との反応性
の低い物質による被膜を形成することにより、浮遊電子
cの発生を抑制した点に特徴を有している。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a method for preventing floating electron emission from a first control electrode of a cathode ray tube and a first control electrode of the present invention will be described with reference to the drawings. This embodiment corresponds to the inventions of claims 1 to 4. In the present invention, as described in the related art with reference to FIG. 2, the cause of the floating electrons c is manganese contained in the material metal of the first control electrode (G1) to which the cathode material is attached. Focusing on the fact that a small amount of reducing agent such as (Mn) is present, many experiments were repeated, and as a result, it was found that a portion of the first control electrode (G1) facing the cathode material coated surface was The feature is that the generation of the stray electrons c is suppressed by forming a film of a substance having a high work function and a low reactivity with the cathode substance.

【0012】図1は、この発明の陰極線管の第一制御電
極からの浮遊電子放出防止方法を説明する図で、電子銃
の組立て時の処理を示す工程図である。図の符号におい
て、1は保持体、2は金属被膜、3aと3bはスペーサ
ー、4はスリーブ、5はカソードホルダー、G1はG1
電極、G2はG2電極、S1〜S8は工程を示す。
FIG. 1 is a view for explaining a method for preventing floating electron emission from the first control electrode of the cathode ray tube according to the present invention, and is a process chart showing a process at the time of assembling the electron gun. In the figure, 1 is a holder, 2 is a metal coating, 3a and 3b are spacers, 4 is a sleeve, 5 is a cathode holder, and G1 is G1.
Electrodes, G2 is a G2 electrode, and S1 to S8 are processes.

【0013】この図1では、中央に工程S1〜S8を示
し、左側に各工程において組立てられる電子銃の側面
図、右側に各工程で使用する部品を示している。この図
1において、工程S1で、例えば鉄ニッケル合金や鉄コ
バルト合金からなる板状のG1電極G1について、少な
くともそのカソード側の一面に、少なくとも10μmの
厚さの金(Au)を蒸着して、金属被膜2を形成する
(G1電極被覆処理)。次の工程S2とS3はロウ付け
工程であり、まず、工程S2では、絶縁物よりなる保持
体1の片方(予めメタライズ処理が施されている)に、
2枚のスペーサー3a,3bと、金蒸着を行った板状の
G1電極G1とを、図示しない治具を用いてセットして
ロウ付けを行う(第1のロウ付け処理)。工程S3で、
カソードを保持するカソードホルダー5を、G1電極G
1およびスペーサー3a,3bと反対側の面にロウ付け
する(第2のロウ付け処理)。
In FIG. 1, steps S1 to S8 are shown in the center, a side view of an electron gun assembled in each step is shown on the left side, and parts used in each step are shown on the right side. In FIG. 1, in step S1, for a plate-shaped G1 electrode G1 made of, for example, an iron-nickel alloy or an iron-cobalt alloy, gold (Au) having a thickness of at least 10 μm is vapor-deposited on at least one surface on the cathode side, The metal coating 2 is formed (G1 electrode coating treatment). The next steps S2 and S3 are brazing steps. First, in step S2, one of the holders 1 made of an insulating material (preliminarily metallized) is
The two spacers 3a and 3b and the plate-shaped G1 electrode G1 on which gold has been vapor-deposited are set using a jig (not shown) to perform brazing (first brazing process). In step S3,
The cathode holder 5 holding the cathode is attached to the G1 electrode G
1 and the spacers 3a and 3b are brazed to the opposite surface (second brazing process).

【0014】その後、工程S4で、スリーブ4にカソー
ド物質の吹き付けを行い、工程S5で、カソード物質を
被覆したスリーブ4を、G1電極G1とカソード面との
距離(図2のdKG)を所定の寸法に合わせてカソード
ホルダー5と溶接する(スリーブ付け処理)。工程S6
で、G2電極(第二制御グリッド)G2の孔部の中心
と、G1電極G1の孔部の中心とを一致させて、スリー
ブ付け済み部品(工程S5が終了した部品)をスペーサ
ー3a,3bとG2電極G2で溶接して固定する(第2
グリッド付け処理)。工程S7で、第2グリッド付け品
(工程S6が終了した部品)を、図示しない第3制御グ
リッドから第5制御グリッドと共に、マルチフォームガ
ラスで固定、いわゆるビーディングする(ビーディング
処理)。その後、工程S8で、ヒーター挿入、各グリッ
ドからのリード線とステムとを溶接して、電子銃が完成
される(電子銃の組み立て)。
Thereafter, in step S4, the cathode material is sprayed onto the sleeve 4, and in step S5, the sleeve 4 coated with the cathode material is moved to a predetermined distance (dKG in FIG. 2) between the G1 electrode G1 and the cathode surface. The cathode holder 5 is welded according to the size (sleeve attachment process). Step S6
Then, the center of the hole of the G2 electrode (second control grid) G2 and the center of the hole of the G1 electrode G1 are made to coincide with each other, and the sleeved parts (parts after the step S5) are replaced with the spacers 3a and 3b. Welding and fixing with G2 electrode G2 (second
Grid processing). In step S7, the second grid-attached product (the part for which step S6 has been completed) is fixed with multiform glass, so-called beading (beading process) together with the third to fifth control grids (not shown). Then, in step S8, the heater is inserted, the lead wire from each grid and the stem are welded, and the electron gun is completed (assembly of the electron gun).

【0015】なお、この実施の形態では、G1電極被覆
処理(工程S1)において、仕事関数が高く、カソード
物質との反応性の低い物質として、金(Au)を蒸着す
る場合を説明したが、Au(金)に限らず、Ni(ニッ
ケル),Co(コバルト),Cd(カドミウム),Sb
(アンチモニ),Cu(銅),Pb(鉛),Bi(ビス
マス),Tl(タリウム),Ag(銀),Pd(パラジ
ウム),Pt(プラチナ),Ru(ルテニウム),Rh
(ロジウム),Os(オスミウム),Ir(イリジウ
ム)などを使用しても、同様の効果が得られる。また、
蒸着の代りに、イオンスパッター、鍍金などによって金
属被膜を形成しても、同様の効果が得られる。さらに、
これらの金属被膜の厚さは、少なくとも10μmであれ
ば、浮遊電子の発生を確実に抑制することができる。
In this embodiment, the case where gold (Au) is vapor-deposited as a substance having a high work function and a low reactivity with the cathode substance in the G1 electrode coating treatment (step S1) has been described. Not limited to Au (gold), Ni (nickel), Co (cobalt), Cd (cadmium), Sb
(Antimony), Cu (copper), Pb (lead), Bi (bismuth), Tl (thallium), Ag (silver), Pd (palladium), Pt (platinum), Ru (ruthenium), Rh
The same effect can be obtained by using (rhodium), Os (osmium), Ir (iridium), or the like. Also,
Similar effects can be obtained by forming a metal film by ion sputtering, plating, etc. instead of vapor deposition. further,
If the thickness of these metal coatings is at least 10 μm, the generation of stray electrons can be reliably suppressed.

【0016】[0016]

【発明の効果】請求項1の陰極線管の第一制御電極から
の浮遊電子放出防止方法では、第一制御電極(G1)の
カソード物質被覆面に対向する部分を、仕事関数が高
く、カソード物質との反応性の低い金(Au)等の物質
をイオンスパッター、蒸着、鍍金等の方法で被覆してい
る。そのため、第一制御電極(G1)のカソードとの対
向面にバリウムが付着し、陰極線管内の酸化性ガスによ
り酸化バリウムとなって存在しても、そこに被覆されて
いる不活性の金属被膜によって第一制御電極(G1)の
素材中に含まれている還元剤との反応が抑制され、浮遊
電子の発生が抑えられ、暗い画面における画質を向上す
ることができる。また、第一制御電極(G1)から発生
する浮遊電子は、陰極線管の動作時において放電を誘発
する原因になるが、放電による弊害も抑制される。
In the method for preventing floating electron emission from the first control electrode of the cathode ray tube according to the first aspect of the present invention, the portion of the first control electrode (G1) facing the cathode material coating surface has a high work function and a high cathode function. A material such as gold (Au) having a low reactivity with is coated by a method such as ion sputtering, vapor deposition, and plating. Therefore, even if barium adheres to the surface of the first control electrode (G1) facing the cathode and becomes barium oxide due to the oxidizing gas in the cathode ray tube, the inert metal film coated on the barium oxide causes barium oxide to exist. The reaction with the reducing agent contained in the material of the first control electrode (G1) is suppressed, the generation of floating electrons is suppressed, and the image quality on a dark screen can be improved. Further, the floating electrons generated from the first control electrode (G1) cause discharge during operation of the cathode ray tube, but adverse effects due to discharge are also suppressed.

【0017】請求項2の陰極線管の第一制御電極からの
浮遊電子放出防止方法では、仕事関数が高く、カソード
物質との反応性の低い物質として、Ni(ニッケル),
Co(コバルト),Cd(カドミウム),Sb(アンチ
モニ),Cu(銅),Pb(鉛),Bi(ビスマス),
Tl(タリウム),Ag(銀),Pd(パラジウム),
Pt(プラチナ),Ru(ルテニウム),Rh(ロジウ
ム),Os(オスミウム),Ir(イリジウム)などを
使用している。このような物質を用いても、請求項1の
陰極線管の第一制御電極からの浮遊電子放出防止方法と
同様の効果が得られる。
In the method for preventing floating electron emission from the first control electrode of the cathode ray tube according to the second aspect of the present invention, Ni (nickel), which has a high work function and a low reactivity with the cathode substance,
Co (cobalt), Cd (cadmium), Sb (antimony), Cu (copper), Pb (lead), Bi (bismuth),
Tl (thallium), Ag (silver), Pd (palladium),
Pt (platinum), Ru (ruthenium), Rh (rhodium), Os (osmium), Ir (iridium), etc. are used. Even if such a substance is used, the same effect as the method for preventing floating electron emission from the first control electrode of the cathode ray tube according to claim 1 can be obtained.

【0018】請求項3の陰極線管の第一制御電極からの
浮遊電子放出防止方法では、仕事関数が高く、カソード
物質との反応性の低い物質を被覆する厚さは、少なくと
も10μmに設定している。したがって、請求項1の陰
極線管の第一制御電極からの浮遊電子放出防止方法と同
様の効果が、確実に得られる。
In the method for preventing floating electron emission from the first control electrode of the cathode ray tube according to the third aspect of the present invention, the thickness of a material having a high work function and a low reactivity with the cathode material is set to at least 10 μm. There is. Therefore, the same effect as that of the method for preventing floating electron emission from the first control electrode of the cathode ray tube according to claim 1 can be reliably obtained.

【0019】請求項4の第一制御電極は、カソード物質
被覆面に対向する部分に、仕事関数が高く、カソード物
質との反応性の低いAu(金),Ni(ニッケル),C
o(コバルト),Cd(カドミウム),Sb(アンチモ
ニ),Cu(銅),Pb(鉛),Bi(ビスマス),T
l(タリウム),Ag(銀),Pd(パラジウム),P
t(プラチナ),Ru(ルテニウム),Rh(ロジウ
ム),Os(オスミウム),Ir(イリジウム)などの
物質がイオンスパッター、蒸着、鍍金等によって被覆さ
れている。したがって、請求項1の陰極線管の第一制御
電極からの浮遊電子放出防止方法と同様の効果が得られ
る。
According to a fourth aspect of the present invention, in the first control electrode, Au (gold), Ni (nickel), C having a high work function and a low reactivity with the cathode substance is provided in a portion facing the cathode substance coating surface.
o (cobalt), Cd (cadmium), Sb (antimony), Cu (copper), Pb (lead), Bi (bismuth), T
l (Thallium), Ag (Silver), Pd (Palladium), P
Substances such as t (platinum), Ru (ruthenium), Rh (rhodium), Os (osmium) and Ir (iridium) are coated by ion sputtering, vapor deposition, plating or the like. Therefore, the same effect as the method for preventing floating electron emission from the first control electrode of the cathode ray tube according to claim 1 can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の陰極線管の第一制御電極からの浮遊
電子放出防止方法を説明する図で、電子銃の組立て時の
処理を示す工程図である。
FIG. 1 is a diagram illustrating a method of preventing floating electron emission from a first control electrode of a cathode ray tube according to the present invention, and a process diagram showing a process at the time of assembling an electron gun.

【図2】陰極線管内のカソードとG1電極において、浮
遊電子の発生状態を説明するための模式図である。
FIG. 2 is a schematic diagram for explaining a generation state of floating electrons in a cathode and a G1 electrode in a cathode ray tube.

【符号の説明】[Explanation of symbols]

1 保持体、2 金属被膜、3aと3b スペーサー、
4 スリーブ、5 カソードホルダー、G1 G1電
極、G2 G2電極
1 holder, 2 metal coating, 3a and 3b spacers,
4 sleeve, 5 cathode holder, G1 G1 electrode, G2 G2 electrode

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 第一制御電極(G1)のカソード物質被
覆面に対向する部分に、仕事関数が高く、カソード物質
との反応性の低いAu(金)等の物質をイオンスパッタ
ー、蒸着、鍍金等の方法で被覆することを特徴とする浮
遊電子放出防止方法。
1. A material, such as Au (gold), having a high work function and a low reactivity with the cathode material, is ion-sputtered, vapor-deposited, plated at a portion of the first control electrode (G1) facing the cathode material-coated surface. A method for preventing floating electron emission, which is characterized in that coating is performed by a method such as.
【請求項2】 仕事関数が高く、カソード物質との反応
性の低い物質は、Ni(ニッケル),Co(コバル
ト),Cd(カドミウム),Sb(アンチモニ),Cu
(銅),Pb(鉛),Bi(ビスマス),Tl(タリウ
ム),Ag(銀),Pd(パラジウム),Pt(プラチ
ナ),Ru(ルテニウム),Rh(ロジウム),Os
(オスミウム),Ir(イリジウム)などであることを
特徴とする上記請求項1記載の浮遊電子放出防止方法。
2. A substance having a high work function and a low reactivity with a cathode substance is Ni (nickel), Co (cobalt), Cd (cadmium), Sb (antimony), Cu.
(Copper), Pb (lead), Bi (bismuth), Tl (thallium), Ag (silver), Pd (palladium), Pt (platinum), Ru (ruthenium), Rh (rhodium), Os
The method for preventing floating electron emission according to claim 1, wherein the method is (osmium), Ir (iridium), or the like.
【請求項3】 仕事関数が高く、カソード物質との反応
性の低い物質を被覆する厚さは、少なくとも10μmで
あることを特徴とする上記請求項1記載の浮遊電子放出
防止方法。
3. The method of preventing stray electron emission according to claim 1, wherein a material having a high work function and a low reactivity with the cathode material is coated with a thickness of at least 10 μm.
【請求項4】 カソード物質被覆面に対向する部分に、
仕事関数が高く、カソード物質との反応性の低いAu
(金),Ni(ニッケル),Co(コバルト),Cd
(カドミウム),Sb(アンチモニ),Cu(銅),P
b(鉛),Bi(ビスマス),Tl(タリウム),Ag
(銀),Pd(パラジウム),Pt(プラチナ),Ru
(ルテニウム),Rh(ロジウム),Os(オスミウ
ム),Ir(イリジウム)などの物質がイオンスパッタ
ー、蒸着、鍍金等によって被覆されたことを特徴とする
第一制御電極。
4. The portion facing the cathode material coated surface,
Au, which has a high work function and low reactivity with cathode materials
(Gold), Ni (nickel), Co (cobalt), Cd
(Cadmium), Sb (antimony), Cu (copper), P
b (lead), Bi (bismuth), Tl (thallium), Ag
(Silver), Pd (palladium), Pt (platinum), Ru
A first control electrode, wherein a substance such as (ruthenium), Rh (rhodium), Os (osmium), Ir (iridium) is coated by ion sputtering, vapor deposition, plating or the like.
JP14782296A 1996-05-20 1996-05-20 Preventive method of floating electron emission from first control electrode of cathode-ray tube and first control electrode Pending JPH09306374A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14782296A JPH09306374A (en) 1996-05-20 1996-05-20 Preventive method of floating electron emission from first control electrode of cathode-ray tube and first control electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14782296A JPH09306374A (en) 1996-05-20 1996-05-20 Preventive method of floating electron emission from first control electrode of cathode-ray tube and first control electrode

Publications (1)

Publication Number Publication Date
JPH09306374A true JPH09306374A (en) 1997-11-28

Family

ID=15439022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14782296A Pending JPH09306374A (en) 1996-05-20 1996-05-20 Preventive method of floating electron emission from first control electrode of cathode-ray tube and first control electrode

Country Status (1)

Country Link
JP (1) JPH09306374A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000046830A1 (en) * 1999-02-08 2000-08-10 Daiwa Tecthno Systems Co., Ltd. Diaphragm plate and its processing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000046830A1 (en) * 1999-02-08 2000-08-10 Daiwa Tecthno Systems Co., Ltd. Diaphragm plate and its processing method

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