JPH09306359A - Manufacture of image display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simply form a spacer by forming an insulating spacer to be arranged between an element base board and a face plate by a sand blast method. SOLUTION: When an insulating spacer 36 is arranged on the face plate side, a transparent electrode 32 and a phosphor layer 33 are formed in layers on a base board 31 composed of a glass plate, and an insulator layer 34 to form the spacer 36 is formed on the layer 33, and a mask 35 for a sand blast is formed in a pattern shape on the layer 34. Next, when sand blast processing is performed through the mask 35, oblique injection of an abrasive material is successively performed from orthogonal four directions. After the sand blast processing is finished, the mask 35 is separated, the layer 34 is baked, and the spacer 36 is formed. Therefore, the spacer 36 is simply formed, and manufacturing cost can be sharply reduced, and the spacer 36 can be formed in a shape according to an emitting characteristic of an electron by adjusting the injecting direction of the abrasive material at sand blast time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image display device using a surface conduction electron-emitting device, and more particularly to an image display device provided with a spacer as an atmospheric pressure resistant supporting member between an element substrate and a face plate. The present invention relates to a manufacturing method.

[0002]

2. Description of the Related Art Conventionally, as an image display device using electron-emitting devices, one using a cathode ray tube and accelerating an electron beam emitted from the electron-emitting devices in a vacuum panel sandwiched between a device substrate and a face plate. Then, a thin type image display device has been proposed which irradiates the phosphor of the face plate and causes the phosphor to emit light to display an image. In an image display device provided with a plurality of surface conduction electron-emitting devices, in order to reduce the weight by keeping the inside of the peripheral device constituting the device under reduced pressure and reducing the thickness of the device substrate and face plate, An insulating spacer is used as an atmospheric pressure resistant supporting member between the face plate and the element substrate.

FIG. 1 shows an example of an element substrate and a spacer which constitute this type of image display device. In the figure,
Reference numeral 11 is an element substrate made of soda lime glass, 12 and 13 are element electrodes, 14 is a thin film including an electron emitting portion, and 15 is a spacer. A face plate (not shown) made of a phosphor, a transparent electrode, and a glass plate is arranged on the spacer 15 so as to face the element substrate 11 to form an image display device. About 1 × 10
Evacuated to a vacuum of ^-8 torr. And the element electrode 1
Electrons are emitted in the form of a beam from an electron-emitting device by applying a voltage to the electrodes 2 and 13, and the electrons are accelerated by a positive high voltage applied to the face plate to collide with a phosphor and emit light. To get the image.

[0004]

As a method of forming the spacer in the above-mentioned image forming apparatus, a method of forming a pattern by printing using an insulating material such as glass (see, for example, Japanese Patent Application Laid-Open No. 2-299136). ),
A method of patterning the photosensitive glass by a photolithographic etching method or the like (see, for example, JP-A-2-299136 and JP-A-4-132136), and an insulator such as the photosensitive glass is processed by an etching method or a mechanical polishing method. Used in a predetermined shape (thin plate shape, columnar shape, prismatic shape, cross shape, etc.) and fixing it with frit glass (for example, JP-A-6-342630, JP-A-7- No. 45221, etc.) has been proposed, but these methods have a problem that the steps are complicated.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of manufacturing an image display device in which spacer formation is simplified.

[0006]

In order to achieve the above object, the present invention provides an element substrate provided with a plurality of electron-emitting devices, and electrons emitted from the electron-emitting devices which are arranged to face the element substrate. In a method of manufacturing an image display device including a face plate having a phosphor that emits light when irradiated with, and an insulating spacer between the element substrate and the face plate, the spacer is formed by a sandblast method. It is characterized by that.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 2 is a process chart showing a procedure for manufacturing an element substrate when a spacer is provided on the element substrate side, which will be described step by step below.

First, as shown in FIG. 2A, an electrode 22 is formed on a substrate 21 made of a glass plate. The electrodes may be formed by any conventional method. Then
As shown in FIG. 2B, an insulator layer 23 for forming spacers is formed by applying an insulator paste on the substrate 21 so as to cover the electrodes 22 and drying it. A flat blade coater may be used to apply the insulating paste. Next, as shown in FIG. 2C, after forming a photosensitive resin film 24 as a mask material on the insulating layer 23, the photosensitive resin film 24 is exposed through a mask having a desired pattern and further developed. By removing the unexposed portion of the photosensitive resin film 24 in the process, a sandblasting mask 25 is formed as shown in FIG. The sandblasting mask 25 may be patterned by screen printing.

Then, as shown in FIG. 2 (e), sandblasting is performed through the mask 25 to remove unnecessary portions of the insulator layer 23 as shown in FIG. 2 (f). Subsequently, as shown in FIG. 2G, the sandblasting mask 25 is peeled off, and then the insulator layer 23 is baked to form the spacer 26. Then, as shown in FIG.
An electron emitting portion forming thin film 27 is formed between the electrodes 22 using an electron emitting material.

An electron emitting portion is formed on the electron source substrate manufactured as described above by an energization heat treatment called forming to manufacture an element substrate. That is, a voltage is applied between the element electrodes 22 and 22 to energize the thin film 27, and the Joule heat generated thereby locally destroys, deforms, or alters the thin film 27 to make it an electrically high resistance electron. Form the emission part. As described above, it is desirable that the formation of the electron emission portion forming thin film 27 and the forming treatment thereof be performed after the spacer 26 is formed.

A spacer 26 is provided facing the element substrate.
An image display device is formed by arranging a face plate made of a phosphor, a transparent electrode, and a glass plate on the above. And
By applying a voltage to the device electrodes 22 and 22, electrons are emitted from the electron-emitting device in a beam shape, and the electrons are accelerated by the positive high voltage applied to the face plate to collide with the phosphor and emit light. By doing so, an image is obtained.

The above electron-emitting device has a characteristic that electrons fly obliquely with respect to the electrodes. That is, with respect to the normal line of the electron emitting portion, the electric potential applied to the element shifts to the positive electrode side and flies. The radiation characteristic (deflection characteristic) is
This is a characteristic peculiar to the surface conduction electron-emitting device in which the potentials are not symmetrical in the same plane including the above device. Therefore, in some cases, the spacer has a structure in which the flight trajectory of electrons is blocked. In order to avoid this, it is necessary to incline the spacer obliquely. In such a case, as shown in FIG. 3A, by shifting the spraying direction of the polishing agent used during sandblasting from an axis perpendicular to the substrate in an oblique direction, as shown in FIG.
As shown in (b), a spacer having a structure that does not block the flight trajectory can be formed.

The spacer can also be formed on the face plate side. When the flight trajectory of the electrons from the electron-emitting device is long, the electron beam spreads, so that the spacer may have a structure that becomes thinner as it approaches the face plate. In this case, the polishing can be performed by obliquely spraying the abrasive onto the insulating layer formed on the face plate side from different directions.

FIG. 4 and FIG. 5 are process drawings showing the manufacturing procedure of the face plate when the spacer is provided on the face plate side, which will be described step by step below.

First, as shown in FIG. 4A, a transparent electrode 32 and a phosphor layer 33 are formed on a substrate 31 made of a glass plate in an overlapping manner, and a spacer is formed on the phosphor layer 33. Then, an insulating layer 34 is formed, and a sandblasting mask 35 is formed in a pattern on the insulating layer 34. The insulating layer 34 can be formed by applying an insulating paste with a flat blade coater. The sandblasting mask 35 can be formed by forming a photosensitive resin film as a mask material and subjecting it to pattern exposure and development. Alternatively, it can be formed by screen printing.

Then, the sandblasting process is carried out through the mask 35. In this case, the oblique spraying of the polishing agent is carried out sequentially from four directions orthogonal to each other. Specifically, first, as shown in FIG. 4B, the first sandblasting process is performed so that the direction of the abrasive spray is from upper right to lower left. Next, as shown in FIG. 4C, the second sandblasting process is performed so that the spraying direction of the polishing agent is from the upper left to the lower right. Further, as shown in FIG. 5A, the third sandblasting process is performed so that the abrasive is sprayed from the upper rear side toward the lower front side. Finally, as shown in FIG. 5B, the fourth sandblasting treatment is performed so that the abrasive is sprayed from the upper front to the lower rear. After finishing the sandblasting process, see FIG.
As shown in (c), the sandblasting mask 35 is peeled off, and the insulator layer 34 is baked to form the spacer 36.

FIG. 6 shows an image display device in which a face plate having a spacer thus produced and an element substrate produced separately are combined. In the figure, 41 is an element substrate, 42
Is an electrode, 43 is an electron emission portion forming thin film, and 44 is a sealing agent for sealing. In this image display device, the spacer 3
Since 5 has a trapezoidal cross section, the trajectory of the electron beam from the electron emitting portion is secured.

[0018]

EXAMPLE A Cr layer having a film thickness of 3 μm was deposited by a sputtering method on a substrate made of a clean quartz glass plate having a thickness of 3 mm. Then, a resist agent (“ORM85” manufactured by Tokyo Ohka Kogyo Co., Ltd.) was spin-coated thereon with a spinner, and left to dry in an oven at 80 ° C. for 30 minutes. After air-cooling, exposure was carried out in a desired pattern, followed by development, followed by washing with water, and leaving in an oven at 135 ° C. for 30 minutes.
After air cooling, Cr etching solution (“MR- manufactured by Tokyo Ohka Kogyo Co., Ltd.
Cr was etched using DS ") and washed with water. Next, after leaving the substrate in the resist stripping solution (“Clean Stop” manufactured by Tokyo Ohka Kogyo Co., Ltd.) kept at 120 ° C. for 5 minutes, soak it in a strip rinse solution at room temperature for 1 minute and isopropyl alcohol at room temperature for 1 minute. Then, the resist was peeled off. Then, this substrate was washed with water and then dried. The patterning of electrodes on the substrate was completed as described above.

Next, a glass paste is applied to a thickness of 7 mm with a flat blade coater, and after the application is completed,
An insulator layer was formed by drying in an oven at 150 ° C. for 20 minutes. Next, a dry film resist with a thickness of 50 μm (“Nihon Alpho NEF1” manufactured by Nippon Synthetic Chemical Industry Co., Ltd.
50 ") was laminated by a heat laminating method and exposed through a mask having a desired pattern using a parallel light printer using an ultrahigh pressure mercury lamp as a light source. Exposure conditions are wavelength 265n
m intensity at 3200 μW / cm ² , irradiation dose at 120 mJ / m
cm ² . Thereafter, spray development was performed at room temperature using a 1% aqueous sodium carbonate solution. A sandblasting mask having a desired pattern was obtained by the above method.

Then, brown fused alumina # is used as an abrasive.
Using No. 400, sandblasting was performed at a jet pressure of 3 kg / cm ² to remove unnecessary portions of the insulating layer and form contact holes at desired positions. In this case, the underlying electrode is sufficiently hard compared to the insulator layer before firing,
Almost no damage from sandblasting. Next, with a 0.2 wt% anhydrous sodium carbonate aqueous solution, the liquid temperature is 30 to 5
Spray development was performed at 0%. Then, the peak temperature 58
Firing was performed under the conditions of 5 ° C. and a holding time of 10 to 20 minutes to form a spacer having a film thickness of 3.2 mm.

Next, an organic solvent ink containing an organopalladium compound (“Katapaste CC” manufactured by Okuno Chemical Industries Co., Ltd.)
P ") was sprayed in place between the electrodes and left for 15 minutes. Then, it was baked at about 200 ° C. for 20 minutes to obtain an electron emitting portion made of Pb fine particles. An element substrate having an electron-emitting device was produced by the above method, and good electron emission characteristics were obtained.

On the other hand, an ITO film having a thickness of 1 μm was formed by sputtering on a substrate made of a clean quartz glass plate having a thickness of 3 mm.
The layers were deposited to form a transparent electrode. Then E on it
A phosphor (ZnO: Zn) was vapor-deposited by the B vapor deposition method to form a phosphor layer having a film thickness of 20 μm. A face plate having a transparent electrode and a phosphor layer was produced by the above method.

Then, a glass paste (“PLS manufactured by Nippon Electric Glass Co., Ltd.” is applied to the outer peripheral portion of the face plate manufactured as described above.
-0206/150 ") was applied to a desired shape using an XY plotter. This substrate is left for 30 minutes in an oven kept at 170 ° C. After cooling to room temperature, a sealed tube is pasted with glass paste in accordance with a ventilation hole that has been opened in advance at a predetermined position of the face plate, and left in an oven kept at 170 ° C. for 30 minutes. After cooling to room temperature,
This substrate and the device substrate with a spacer prepared previously were bonded together, and this was left in a baking furnace kept at 400 ° C. for 2 hours, and sealed to form a panel. After air cooling, the sealed tube of the produced panel is connected to a vacuum pump, a vacuum is drawn until the degree of vacuum in the panel reaches 10 ⁻¹⁰ Pa, and when the predetermined degree of vacuum is reached, the glass is melted and sealed. When the image display device produced by the above method was made to emit light, it was confirmed that the light emission had good color purity. In addition, the decrease in the gap in the center of the glass observed before the introduction of the spacer was eliminated.

[0024]

As described above, according to the present invention, an element substrate provided with a plurality of electron-emitting devices, and fluorescent light emitted by irradiation of electrons emitted from the electron-emitting devices which are arranged so as to face the element substrate. In a method of manufacturing an image display device including a face plate having a body, and an insulating spacer between the element substrate and the face plate,
By forming the spacers by the sandblast method, the spacers can be formed easily and the manufacturing cost can be significantly reduced.

Further, by adjusting the spraying direction of the abrasive during sandblasting, the spacer can be formed in a shape that matches the electron emission characteristic (deflection characteristic) that is a characteristic peculiar to the surface conduction electron-emitting device. it can.

[Brief description of drawings]

FIG. 1 is a perspective view showing an example of an element substrate and a spacer that form an image display device.

FIG. 2 is a process drawing showing a procedure for manufacturing an element substrate when a spacer is provided on the element substrate side.

FIG. 3 is an explanatory diagram when a spacer is inclined.

FIG. 4 is a process diagram of the first half showing a manufacturing procedure of the face plate when a spacer is provided on the face plate side.

FIG. 5 is a process diagram of the latter half of FIG.

FIG. 6 is a cross-sectional view showing an image display device in which a face plate provided with spacers and an element substrate manufactured separately are combined.

[Explanation of symbols]

 11 Substrate 12, 13 Element Electrode 14 Thin Film 15 Spacer 21 Substrate 22 Electrode 23 Insulator Layer 24 Photosensitive Resin Film 25 Sandblast Mask 26 Spacer 27 Thin Film 31 Substrate 32 Transparent Electrode 33 Fluorescent Layer 34 Insulator Layer 35 Sandblast Mask 36 Spacer 41 Substrate 42 Electrode 43 Thin film 44 Sealant

Claims (1)

[Claims] 1. An element substrate provided with a plurality of electron-emitting devices, a face plate disposed facing the element substrate and having a phosphor that emits light when irradiated with electrons emitted from the electron-emitting device, and these element substrates. A method of manufacturing an image display device comprising an insulating spacer between a face plate and a face plate, wherein the spacer is formed by a sandblast method.