JPH09297906A - Production of thin-film magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a process for producing a thin-film magnetic head of a low production cost capable of efficiently and exactly obtaining the gap depths of plural thin-film magnetic head elements without deforming the blocks formed with the plural thinfilm magnetic head elements. SOLUTION: The plural thin-film magnetic head elements 2 are arrayed and formed longitudinally and laterally on a substrate 1 in such a manner that the gaps of the respective thin-film magnetic head elements 2 face one side 1a of this substrate 1. The formation of the depths of the respective thin- film magnetic head elements 2 is executed by each of columns (1A, 1B) by polishing the substrate 1 successively from the columns 1A on one side 1a of the substrate. The substrate is cut to the blocks aligned with the thin-film magnetic head elements 2 successively from the columns 1A with which the polishing ends.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thin film magnetic head for recording / reproducing on / from a magnetic recording medium such as a hard disk.

[0002]

2. Description of the Related Art For example, a thin-film magnetic head for recording / reproducing data on / from a hard disk or the like needs to be levitated and scanned with a minute gap on the disk surface.
Further, as shown in FIG. 6, the slider 102 and the thin film magnetic head element 103 are generally of a flying type in which they are integrally structured.

That is, in such a floating thin-film magnetic head, the gap of the thin-film magnetic head element 103 faces the hard disk surface, and for example, the tip of a head arm whose one end is a free end is elastically deformed. It is mounted via a possible head mounting plate. The thin-film magnetic head 101 attached in this way causes the slider 10 to generate an air flow when the hard disk rotates.
The surface 104 facing the hard disk surface of 2, that is, the air bearing surface (Air Bearing Sureface;
It will be levitated by the ABS so that the front part in the traveling direction is slightly higher than the rear part in the traveling direction.

As shown in FIG. 5, this thin-film magnetic head 101 has a slider groove 101a formed in the air bearing surface 101b by machining or etching, and the air bearing surface 101b is chamfered 101c. A magnetic layer to be the thin film magnetic head element 103 is formed by a vacuum thin film forming technique.

To make such a thin film magnetic head 101, as shown in FIGS. 7 and 8, a plurality of thin film magnetic heads are formed on a surface 102a of a hard substrate 102 which will be a slider by using a vacuum thin film forming technique. The head elements 103 are arranged vertically and horizontally.

Next, as shown in FIG. 9, this substrate 102 is cut in a state in which it is adhered to the above-mentioned processing jig 105 (indicated by a symbol "S" in the figure), and as shown in FIG. Thus, the state of the block 106 in which the plurality of thin film magnetic head elements 103 are formed is set.

Next, each block 106 is polished with the surface 106a on which the plurality of thin film magnetic head elements 103 are formed facing upward so that the gap g has a predetermined depth length d as shown in FIG.

After that, as shown in FIG. 5, the side surfaces 101a, 101b, 101c, etc. of the head are processed and cut into respective head chips to manufacture the thin film magnetic head 1.

[0009]

By the way, with the recent miniaturization of the drive, the head is also miniaturized, and the pitch interval of each head chip is narrowed to reduce the film thickness in order to improve the productivity. ing. That is, FIG. 8 and FIG.
Each of the inner pitches P1, P2 and P3 tends to become narrower.

Therefore, in the conventional method of manufacturing a thin film magnetic head, processing strain or adhesive strain is caused when the substrate 102 is cut into the block 106 or when the processing jig 105 is bonded to the block 106. However, there is a problem that the block 106 is deformed.

That is, FIG. 11 is a schematic diagram for explaining the processing strain and the adhesive strain, and FIG. 11A shows the case where the block 106 has no strain, and the depth of the thin film magnetic head element 103. The length d is the same. That is, the block 1 in which a plurality of thin film magnetic head elements 103 are arranged
Thin film magnetic head elements 103a and 103c on both end sides of 06.
And the depth length d of the thin film magnetic head element 103b at the center are formed to be the same.

However, as shown in FIG. 11B, when the block 106 is deformed into a convex state, the alignment state of the plurality of thin film magnetic head elements 103 becomes non-linear, and the depth length of each thin film magnetic head element 103 is increased. d is not constant. On the other hand, as shown in FIG. 11C, even when the block 106 is deformed into a concave state, the alignment state of each thin film magnetic head element 103 becomes non-linear, and the depth length d of each thin film magnetic head element 103 is constant. It does not become.

Thus, the plurality of thin film magnetic head elements 1
When deformation occurs in the block 106 in which 03 is formed,
The depth length d of each head chip on the block 106 is not constant, and as a result, the depth length d cannot be formed with high accuracy, which causes the disadvantages of deterioration of recording / reproducing characteristics and reduction of yield.

For this reason, processing jigs and reinforcing jigs for processing while correcting the deformation of the blocks have been developed.

For example, as shown in FIG. 12, the slit 11 that is parallel to the bonding surface 112 of each block 106 is used.
3 is a processing jig 111 provided with the slit 11
3 causes the working jig 111 to bend (indicated by a symbol “R” in the drawing). In addition, as shown in FIGS. 13 and 14, the reinforcing jig 115 is provided with a convex fixing portion 116 having one surface serving as an adhesive surface 116a in the center.
In this state, one head surface 106b of each block 106 is bonded to the bonding surface 116a of the reinforcing jig 115, and polishing is performed so that the depth length d of each head chip becomes constant.

In these methods, considering that the deformation of the block 106 is caused by the decrease in rigidity due to the thinning of the block 106, the thin plate-shaped block 106.
Is adhered to a processing jig or the like, and bending is generated in the processing jig to correct the deformation of the block or to polish the reinforcing material through a reinforcing material.

However, when such a processing jig and a reinforcing jig are used, not only high precision is required for cutting and adhering blocks in consideration of the depth precision, but
Complex and expensive to manufacture.

Therefore, according to the present invention, the depth of the gap of the plurality of thin film magnetic head elements can be efficiently and accurately performed without causing deformation of the block in which the plurality of thin film magnetic head elements are formed. An object of the present invention is to provide a method of manufacturing a thin film magnetic head that is inexpensive to manufacture.

[0019]

In order to solve the above-mentioned problems, a method of manufacturing a thin film magnetic head according to the present invention is a thin film magnetic head for simultaneously performing gap depth formation of a plurality of thin film magnetic head elements formed on a substrate. A method of manufacturing a plurality of thin film magnetic head elements arranged vertically and horizontally on the substrate so that the gap of each thin film magnetic head element faces one side of the substrate; The method is characterized by including a step of polishing and performing depth formation of each thin film magnetic head element for each row, and a step of cutting the thin film magnetic head elements into aligned blocks in order from the row where polishing is completed.

In the method for manufacturing a thin film magnetic head of the present invention, the depth of each thin film magnetic head element is sequentially polished by polishing from one row of the substrate, and polishing is performed in a hard substrate state. To do. Therefore, unlike the conventional one in which the depth is obtained with a thin plate-shaped block, the block is not deformed.

Therefore, if the thin-film magnetic head element is cut into blocks in which the thin-film magnetic head elements are arranged in order from the row in which polishing is completed, and then this block is cut into each head chip,
A thin film magnetic head having an efficient and accurate depth length can be stably manufactured at a low manufacturing cost.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments to which the present invention is applied will be described below with reference to the drawings.

The thin film magnetic head manufactured according to the present invention is for performing recording and reproduction on a magnetic recording medium such as a hard disk, and is a flying type in which a slider and a thin film magnetic head element are integrally formed. It's a truck.

The method of manufacturing the thin film magnetic head is as follows.
As shown in FIG. 1, a plurality of thin-film magnetic head elements 2 are formed vertically and horizontally on a hard substrate 1 made of Al ₂ O ₃ —TiC according to the number of heads to be manufactured at predetermined intervals.

To form the thin film magnetic head element 2, the vacuum thin film forming technique which has been conventionally used is used. In addition, the thin film magnetic head element 2 formed here
The structure is not particularly limited, and any conventionally known structure can be applied, and the lower magnetic body and the upper magnetic body forming the magnetic circuit section, or the conductor coil and other constituent members are also the same. Any conventionally known material can be adopted.

In this thin film forming step, the thin film magnetic head elements 2 are arrayed and formed on one side 1a of the substrate 2 so that the gaps of the thin film magnetic head elements 2 face each other.

Next, the depth of the thin film magnetic head element 2 provided on the substrate 1 is determined. To perform this depth setting, a polishing device 5 as shown in FIG. 2 is used.

This polishing apparatus 5 presses the substrate 1 on a lapping plate 6 of an apparatus which is adapted to rotate in the direction of the arrow in FIG. 2, and polishes the substrate 1 together with the thin film magnetic head element 2. It is a polishing device 5 for performing depth setting.

Although not shown, the polishing apparatus 5 is provided with a fixing member which is vertically movable in a direction orthogonal to the lap surface 6a of the lapping machine 6 and which fixes the substrate 1.

In this embodiment, the depth of the thin film magnetic head element 2 provided on the substrate 1 is measured by using the polishing apparatus 5. That is, for the thin film magnetic head elements 2 arranged vertically and horizontally, one side 1a of the substrate 1 to the row 1A
The depth is obtained by polishing each.

Therefore, unlike the prior art, the depth is not obtained by a thin plate-shaped block, but the hard substrate 1 is used.
As is, row by row from one side 1a (eg row 1A)
By polishing to depth and performing depth measurement, it is possible to simultaneously perform depth measurement of the plurality of thin film magnetic head elements 2 arranged in the row 1A. Even if the depth is obtained in the state of the substrate 1 as described above, since the substrate 1 is made of a hard material, a stable depth length d (see FIG. 6) can be obtained without deformation.

In the present embodiment, the substrate 1 on which the plurality of thin film magnetic head elements 2 are formed is held as it is on the fixing member of the polishing apparatus. Then, the fixing member is lowered toward the lapping board 6 to bring the substrate 1 into contact with the lapping surface 6a. Then, the lapping machine 6 starts to rotate and polishing is started. In this case, in order to control the depth length d, the descending amount by the fixing member (indicated by the symbol "T" in the figure) is adjusted.

Then, polishing is carried out for a certain time in this state, and when the target depth length d is reached, the polishing is terminated.
As a result, as shown in FIG. 3, the depth length d of each thin film magnetic head element 2 formed on one side 1a of the substrate 1 is increased.
Are all uniform and their accuracy is extremely high.

Next, the thin film magnetic head elements 2 are cut into blocks 3 arranged in order from the row 1A where polishing is completed.

That is, in the present embodiment, the depth is obtained by sequentially polishing from one side 1a of the substrate 1 for each row 1A. After the polishing is completed, as shown in FIG. The row 1A, which is the one side 1a, which has been completely polished, is arranged in order from the row 1A, 1B, 1C to the block 3,
Cut into 3 and 3 states.

After the cutting is completed,
After the depths of the gaps of the plurality of thin film magnetic head elements in the next row 1B of the substrate 1 are simultaneously obtained by the polishing apparatus 5, the row 1B is cut into the block 3. In the present embodiment, such an operation is repeated.

Here, in order to cut each block 3 into a state, as shown in FIG. 4, by rotating the disc-shaped lapping plate 8 to which the diamond slurry is supplied,
The row 1A after polishing is divided.

After that, the plurality of thin film magnetic head elements 2 arranged in the block 3 are cut into each head chip to form a thin film magnetic head. After that, although not specifically shown, lead wires are soldered to the head terminal electrodes and sliders are attached to the suspension mechanism to complete the process.

As described above, in the present embodiment, the block 3 in which a plurality of thin film magnetic head elements 2 are arranged is not deformed, and a complicated and expensive reinforcing jig or processing jig is not required. , Depth is stable.

[0040]

The method of manufacturing a thin film magnetic head according to the present invention comprises:
The depth of a plurality of thin-film magnetic head elements is polished row by row from one side of the substrate, and is cut into blocks in order from the row where polishing has been completed. Unlike the case where the block is put out, the block is not deformed.

Therefore, the thin-film magnetic head manufactured as described above has good depth accuracy, and can improve the recording / reproducing characteristics and the yield.

Further, in the method of manufacturing the thin film magnetic head of the present invention, since the depth is produced in the state of the hard substrate, the equipment for the processing and the reinforcing jig are separately provided, and the reinforcing jig is used. It is possible to reduce the manufacturing cost because the step of accurately adhering to is unnecessary.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing a substrate on which a plurality of thin film magnetic head elements are formed, showing a manufacturing process of a thin film magnetic head according to an embodiment of the present invention.

FIG. 2 shows a manufacturing process of the thin film magnetic head,
It is a perspective view showing a state where a substrate on which a plurality of thin film magnetic head elements are formed is polished.

FIG. 3 shows a manufacturing process of the thin film magnetic head,
FIG. 6 is a perspective view showing a state in which one side of a substrate on which a plurality of thin film magnetic head elements are formed is polished and depth is obtained for each row.

FIG. 4 shows a manufacturing process of the thin film magnetic head,
It is a perspective view showing a process of cutting a plurality of thin film magnetic head elements into aligned blocks.

FIG. 5 is a perspective view showing a configuration example of a thin film magnetic head.

FIG. 6 is an enlarged perspective view showing a magnetic gap portion of the thin film magnetic head.

FIG. 7 is a perspective view showing a manufacturing process of a conventional thin-film magnetic head, showing a state in which a substrate is bonded to a processing jig.

FIG. 8 is a perspective view schematically showing a plurality of thin film magnetic head elements vertically and horizontally arranged on the substrate.

FIG. 9 is a perspective view showing a process of manufacturing a conventional thin film magnetic head, showing a state in which the substrate is cut into blocks.

FIG. 10 is a perspective view showing a manufacturing process of a conventional thin film magnetic head, showing a state in which the substrate is cut into blocks.

FIG. 11 is a schematic diagram for explaining processing strain and adhesive strain of the block.

FIG. 12 is a perspective view showing a processing jig used in a conventional method of manufacturing a thin film magnetic head.

FIG. 13 is a perspective view showing a reinforcing jig and blocks used in a conventional method of manufacturing a thin film magnetic head.

FIG. 14 is a perspective view showing a state in which the reinforcing jig and the block are bonded together.

[Explanation of symbols]

1 substrate (slider), 1a one side of substrate, 1A, 1
B substrate row, 2 thin film head elements, 3 blocks, 5
Polishing device, d depth length

Claims (1)

[Claims] 1. A method of manufacturing a thin film magnetic head in which the depths of the gaps of a plurality of thin film magnetic head elements formed on a substrate are simultaneously obtained, wherein the gap of each thin film magnetic head element faces one side of the substrate. , A step of forming a plurality of thin film magnetic head elements on a substrate vertically and horizontally, a step of sequentially polishing from one side row of the substrate to perform depth-deposition of each thin film magnetic head element, and polishing is completed. And a step of cutting the thin film magnetic head elements into blocks in which the thin film magnetic head elements are arranged in order from the row.