JPH09290334A - Paste transfer method to conductor - Google Patents

Paste transfer method to conductor

Info

Publication number
JPH09290334A
JPH09290334A JP8105072A JP10507296A JPH09290334A JP H09290334 A JPH09290334 A JP H09290334A JP 8105072 A JP8105072 A JP 8105072A JP 10507296 A JP10507296 A JP 10507296A JP H09290334 A JPH09290334 A JP H09290334A
Authority
JP
Japan
Prior art keywords
paste
conductor
transfer
bumps
transferring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8105072A
Other languages
Japanese (ja)
Other versions
JP3399225B2 (en
Inventor
Hideki Nagafuku
秀喜 永福
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10507296A priority Critical patent/JP3399225B2/en
Publication of JPH09290334A publication Critical patent/JPH09290334A/en
Application granted granted Critical
Publication of JP3399225B2 publication Critical patent/JP3399225B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To make paste transferable surely to a conductor, by relatively moving the conductor relating to the paste, and sticking it to the conductor by a plurality of times. SOLUTION: Bumps 11, 12 are lowered down just underneath, transfer of paste 2 to the bumps 11, 12 is tried. Here, dust 13 and a void are removed, in almost the case, so as to transfer the paste 2 to the bumps 11, 12. Next, the bumps 11, 12 are lifted and dislocated from the paste 2, to be moved further in a lateral direction, the bumps 11, 12 are lowered down, transfer in the second time is tried. Here, temporarily even when a transfer in the first time is in failure, recovery can be made by a second time transfer. As a result, the paste 2 can be surely transferred.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、バンプなどの導電
体にフラックスなどのペーストを転写する導電体へのペ
ースト転写方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of transferring a paste such as a flux onto a conductor such as a bump to transfer the paste onto the conductor.

【０００２】[0002]

【従来の技術】回路モジュールを製造する分野では、フ
リップチップの下面に形成されたバンプなどの導電体
に、フラックスや導電性接着剤などのペーストを転写す
るプロセスが行われる。2. Description of the Related Art In the field of manufacturing circuit modules, a process of transferring a paste such as a flux or a conductive adhesive to a conductor such as a bump formed on the lower surface of a flip chip is performed.

【０００３】図４（ａ），（ｂ）は、従来の導電体への
ペースト転写方法の工程説明図である。図４において、
１はペースト２をためた水平な容器、３，４はペースト
２をかき寄せて容器１中のペースト２が均一な液厚にな
るように調整するスキージである。スキージ３，４は、
図４（ａ）の左右方向に水平移動する移動ブロック５に
昇降自在に支持されており、６，７はスキージ３，４を
それぞれ昇降させるシリンダである。FIGS. 4A and 4B are process explanatory views of a conventional paste transfer method to a conductor. In FIG.
Reference numeral 1 is a horizontal container in which the paste 2 is stored, and 3 and 4 are squeegees for scraping the paste 2 and adjusting the paste 2 in the container 1 to have a uniform liquid thickness. Squeegees 3 and 4 are
It is supported by a moving block 5 that horizontally moves in the left-right direction in FIG. 4A so as to be able to move up and down.

【０００４】また、８は下部に半導体チップ１０の上面
を吸着する吸着ツール９を備えた移載ヘッドであり、移
載ヘッド８は図示しない移動手段によってＸＹＺ方向に
移動するようになっている。Reference numeral 8 is a transfer head having a suction tool 9 for sucking the upper surface of the semiconductor chip 10 at the bottom, and the transfer head 8 is moved in the XYZ directions by a moving means (not shown).

【０００５】そして、図４（ａ）の例では、移載ヘッド
８を移動させることにより、半導体チップ１０の下面に
突設されたバンプ１１，１２をペースト２に付着させ、
バンプ１１，１２にペースト２を転写するようになって
いる。In the example of FIG. 4 (a), the transfer head 8 is moved to attach the bumps 11 and 12 projecting from the lower surface of the semiconductor chip 10 to the paste 2.
The paste 2 is transferred to the bumps 11 and 12.

【０００６】[0006]

【発明が解決しようとする課題】しかしながら、ペース
ト２にはゴミ１３やボイド１４（この部分にはペースト
２がない）が存在していることがあり、従来の導電体へ
のペースト転写方法では、ゴミ１３やボイド１４のため
に、バンプの一部（図４（ｂ）ではバンプ１１）にペー
スト２が転写されないことがあった。However, dust 13 and voids 14 (there is no paste 2 in this portion) may be present in the paste 2, and in the conventional paste transfer method to a conductor, Due to the dust 13 and the voids 14, the paste 2 may not be transferred to a part of the bump (the bump 11 in FIG. 4B).

【０００７】そこで本発明は、導電体に確実にペースト
を転写できる導電体へのペースト転写方法を提供するこ
とを目的とする。Therefore, it is an object of the present invention to provide a method of transferring a paste onto a conductor, which can reliably transfer the paste onto the conductor.

【０００８】[0008]

【課題を解決するための手段】本発明の導電体へのペー
スト転写方法は、導電体をペーストに対して相対的に移
動させ複数回導電体にペーストを付着させる。In the method of transferring a paste to a conductor of the present invention, the conductor is moved relative to the paste and the paste is attached to the conductor a plurality of times.

【０００９】[0009]

【発明の実施の形態】請求項１に記載の導電体へのペー
スト転写方法では、導電体をペーストに対して相対的に
移動させ複数回導電体にペーストを付着させるので、一
回目の付着動作時に運悪く導電体が接触する箇所にゴミ
やボイドなどが存在していても、複数回の付着動作を行
うことでリカバリーすることができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the method of transferring a paste to a conductor according to the first aspect of the invention, the conductor is moved relative to the paste and the paste is attached to the conductor a plurality of times. Even if dust or voids are present at locations where the conductors are sometimes unlucky to contact, they can be recovered by performing the attaching operation a plurality of times.

【００１０】次に図面を参照しながら、本発明の実施の
形態について説明する。なお図中、従来の導電体へのペ
ースト転写方法を示す図４と同様の構成要素について
は、同一符号を付すことにより構成の説明を省略する。Next, an embodiment of the present invention will be described with reference to the drawings. In the figure, the same components as those in FIG. 4 showing the conventional method of transferring a paste to a conductor are designated by the same reference numerals, and the description of the configuration is omitted.

【００１１】本形態では、転写を行う直前にスキージ３
を下降させ、図１の矢印Ｎ３で示すように、ペースト２
のかき寄せ動作を行う。これにより、ペースト２中に含
まれるボイド１４は消失するし、ゴミ１３はスキージ３
と共に転写に関係しない隅の方へ移動する。In this embodiment, the squeegee 3 is used immediately before the transfer.
And lower the paste 2 as indicated by arrow N3 in FIG.
Perform a scraping operation. As a result, the voids 14 contained in the paste 2 disappear and the dust 13 is removed by the squeegee 3.
Along with that, it moves to the corner that is not related to transfer.

【００１２】また、従来の導電体へのペースト転写方法
で行っていた半導体チップ１０の下降動作を場所をずら
して２回行う。即ち、まず矢印Ｎ１で示すように、バン
プ１１，１２を真下に下降させてバンプ１１，１２への
ペースト２の転写を試みる。ここで、上述したように、
ゴミ１３、ボイド１４は取除かれているから、通常ほと
んどの場合、バンプ１１，１２にはペースト２が転写さ
れる。Further, the lowering operation of the semiconductor chip 10, which has been performed by the conventional method of transferring a paste to a conductor, is performed twice at different positions. That is, first, as shown by an arrow N1, the bumps 11 and 12 are moved down to try to transfer the paste 2 to the bumps 11 and 12. Here, as described above,
Since the dust 13 and the void 14 are removed, the paste 2 is usually transferred to the bumps 11 and 12 in most cases.

【００１３】次に、矢印Ｎ２で示すように、バンプ１
１，１２を上昇させてペースト２から外し、さらに横方
向へ移動して、バンプ１１，１２を下降させ、２回目の
転写を試みる。ここで、仮に１回目の転写に失敗したと
しても、２回目の転写でリカバリーすることができる。Next, as shown by the arrow N2, the bump 1
1 and 12 are lifted to be removed from the paste 2, and further moved in the lateral direction to lower the bumps 11 and 12 to try the second transfer. Here, even if the first transfer fails, it can be recovered by the second transfer.

【００１４】その結果、図２に示すように、確実にペー
スト２の転写を行える。また、図１の矢印Ｎ２で示すよ
うに、バンプ１１，１２の位置を変更しなくとも、図３
に示すように、バンプ１１，１２をペースト２に接触さ
せた状態で、バンプ１１，１２をペースト２に対して相
対的に振動させてもよい。このとき、万一バンプ１１，
１２の付近にゴミ１３やボイド１４が存在していたとし
ても、バンプ１１，１２の振動によって、ゴミ１３やボ
イド１４はバンプ１１，１２から外れてしまい問題なく
転写を行うことができる。As a result, as shown in FIG. 2, the paste 2 can be reliably transferred. Further, as shown by the arrow N2 in FIG. 1, even if the positions of the bumps 11 and 12 are not changed, as shown in FIG.
As shown in, the bumps 11 and 12 may be vibrated relative to the paste 2 while the bumps 11 and 12 are in contact with the paste 2. At this time, bump 11
Even if the dust 13 and the void 14 exist near the dust 12, the vibration of the bumps 11 and 12 causes the dust 13 and the void 14 to be separated from the bumps 11 and 12, so that the transfer can be performed without any problem.

【００１５】ここで、特許請求の範囲において、複数個
の導電体が「水平面内に配置」されている旨記述してい
るが、その意味するところは、本実施の形態において述
べているように、複数個のバンプ１１，１２が半導体チ
ップ１０の下面に形成され、この半導体チップ１０が水
平に保持されてバンプ１１，１２が水平面内に位置して
いる状態だけでなく、複数個の導電性ボール（図示せ
ず）の上部を保持できるヘッド（図示せず）が導電性ボ
ールを水平面内に保持している状態も含むものである。Here, although it is stated in the claims that a plurality of conductors are "arranged in a horizontal plane", the meaning thereof is as described in this embodiment. , A plurality of bumps 11 and 12 are formed on the lower surface of the semiconductor chip 10, the semiconductor chip 10 is held horizontally, and the bumps 11 and 12 are located in a horizontal plane. The head (not shown) capable of holding the upper portion of the ball (not shown) also holds the conductive balls in the horizontal plane.

【００１６】[0016]

【発明の効果】本発明の導電体へのペースト転写方法
は、導電体をペーストに対して相対的に移動させ複数回
導電体にペーストを付着させるので、リカバリー動作を
行うことで、導電体に確実にペーストを転写できる。According to the method of transferring a paste to a conductor of the present invention, the conductor is moved relative to the paste and the paste is attached to the conductor a plurality of times. The paste can be transferred reliably.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施の形態における導電体へのペー
スト転写方法の工程説明図FIG. 1 is a process explanatory diagram of a paste transfer method onto a conductor according to an embodiment of the present invention.

【図２】本発明の一実施の形態における導電体へのペー
スト転写方法の工程説明図FIG. 2 is a process explanatory view of a paste transfer method to a conductor according to an embodiment of the present invention.

【図３】本発明の一実施の形態における導電体へのペー
スト転写方法の工程説明図FIG. 3 is a process explanatory diagram of a paste transfer method to a conductor according to an embodiment of the present invention.

【図４】（ａ）従来の導電体へのペースト転写方法の工
程説明図 （ｂ）従来の導電体へのペースト転写方法の工程説明図4A is a process explanatory diagram of a conventional paste transfer method to a conductor; FIG. 4B is a process explanatory diagram of a conventional paste transfer method to a conductor.

【符号の説明】[Explanation of symbols]

１ 容器 ２ ペースト ３ スキージ ８ 移載ヘッド ９ 吸着ツール １０ 半導体チップ １１ バンプ １２ バンプ １３ ゴミ １４ ボイド 1 Container 2 Paste 3 Squeegee 8 Transfer Head 9 Adsorption Tool 10 Semiconductor Chip 11 Bump 12 Bump 13 Dust 14 Void

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】水平面内に配置された複数個の導電体に一
括してペーストを転写する導電体へのペースト転写方法
であって、前記導電体を前記ペーストに対して相対的に
移動させ複数回前記導電体に前記ペーストを付着させる
ことを特徴とする導電体へのペースト転写方法。1. A method of transferring a paste to a conductor, wherein the paste is collectively transferred to a plurality of conductors arranged in a horizontal plane, wherein the conductor is moved relative to the paste. A method of transferring a paste to a conductor, wherein the paste is attached to the conductor. 【請求項２】水平面内に配置された複数個の導電体に一
括してペーストを転写する導電体へのペースト転写方法
であって、前記導電体を前記ペーストに付着させる前
に、前記ペーストをスキージでかき寄せて前記ペースト
に含まれるゴミ又はボイドを取除くことを特徴とする導
電体へのペースト転写方法。2. A paste transfer method to a conductor, wherein the paste is collectively transferred to a plurality of conductors arranged in a horizontal plane, wherein the paste is applied before the conductor is attached to the paste. A method for transferring a paste to a conductor, which comprises scraping with a squeegee to remove dust or voids contained in the paste. 【請求項３】水平面内に配置された複数個の導電体に一
括してペーストを転写する導電体へのペースト転写方法
であって、前記導電体を前記ペーストに付着させる際、
前記導電体を前記ペーストに対して相対的に振動させる
ことを特徴とする導電体へのペースト転写方法。3. A paste transfer method to a conductor, wherein the paste is collectively transferred to a plurality of conductors arranged in a horizontal plane, wherein the conductor is attached to the paste.
A method of transferring a paste onto a conductor, wherein the conductor is vibrated relative to the paste. 【請求項４】前記ペーストは、フラックス、銀ペースト
あるいは接着剤のうちから任意に選択したものであるこ
とを特徴とする請求項１から３に記載の導電体へのペー
スト転写方法。4. The method of transferring a paste to a conductor according to claim 1, wherein the paste is arbitrarily selected from a flux, a silver paste or an adhesive. 【請求項５】前記導電体は、半導体チップの下面に形成
されたバンプであることを特徴とする請求項１から３に
記載の導電体へのペースト転写方法。5. The method of transferring paste to a conductor according to claim 1, wherein the conductor is a bump formed on the lower surface of the semiconductor chip.
JP10507296A 1996-04-25 1996-04-25 Paste transfer method to conductor Expired - Fee Related JP3399225B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10507296A JP3399225B2 (en) 1996-04-25 1996-04-25 Paste transfer method to conductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10507296A JP3399225B2 (en) 1996-04-25 1996-04-25 Paste transfer method to conductor

Publications (2)

Publication Number Publication Date
JPH09290334A true JPH09290334A (en) 1997-11-11
JP3399225B2 JP3399225B2 (en) 2003-04-21

Family

ID=14397749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10507296A Expired - Fee Related JP3399225B2 (en) 1996-04-25 1996-04-25 Paste transfer method to conductor

Country Status (1)

Country Link
JP (1) JP3399225B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8551275B2 (en) 2005-03-30 2013-10-08 Brother Kogyo Kabushiki Kaisha Adhesive application method and terminal joining method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8551275B2 (en) 2005-03-30 2013-10-08 Brother Kogyo Kabushiki Kaisha Adhesive application method and terminal joining method

Also Published As

Publication number Publication date
JP3399225B2 (en) 2003-04-21

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