JPH09284474A - Perfect contact type image sensor and its manufacture - Google Patents

Perfect contact type image sensor and its manufacture

Info

Publication number
JPH09284474A
JPH09284474A JP8096409A JP9640996A JPH09284474A JP H09284474 A JPH09284474 A JP H09284474A JP 8096409 A JP8096409 A JP 8096409A JP 9640996 A JP9640996 A JP 9640996A JP H09284474 A JPH09284474 A JP H09284474A
Authority
JP
Japan
Prior art keywords
guide means
mold
transparent substrate
image sensor
type image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8096409A
Other languages
Japanese (ja)
Other versions
JP2891170B2 (en
Inventor
利枝佳 ▲吉▼野
Rieka Yoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP8096409A priority Critical patent/JP2891170B2/en
Publication of JPH09284474A publication Critical patent/JPH09284474A/en
Application granted granted Critical
Publication of JP2891170B2 publication Critical patent/JP2891170B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To reduce a manufacturing cost for a perfect contact type image sensor with a guiding means having good wear resistance. SOLUTION: A photoelectric conversion element for reading a picture is formed at a slit provided for the guiding means 3 consisting of a thin and long corrosion resistance plate to which polyester is adhered at least on its rear face. A translucent substrate 1 thicker than the guiding means 3 is fitted so as to make its surface the same face as the surface of the guiding means 6o fix the guiding means 3 and the translucent substrate 1 within dies 6 and 7. Then a liquid crystal polymer 9 is made to flow into a gap surrounded by the rear face of the guiding means 3, a part projected from the guide means 3 at the side face of the translucent substrate 1 and the inner faces of the dies 6 and 7 and solidified.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明はファクシミリ、複写
機等の画像読みとり部に用いられる完全密着型イメージ
センサおよびその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a perfect contact type image sensor used in an image reading section of a facsimile, a copying machine or the like, and a manufacturing method thereof.

【0002】[0002]

【従来の技術】従来、ファクシミリ、複写機等の画像読
み取り装置に用いられるイメージセンサはレンズ系を有
するものであったため装置の大型化が避けられないとい
う欠点を持っていた。
2. Description of the Related Art Conventionally, since an image sensor used in an image reading apparatus such as a facsimile machine or a copying machine has a lens system, it has a drawback that the size of the apparatus is inevitable.

【0003】そのため、最近はレンズ系を用いずに原稿
を等倍で読み取ることができる完全密着型イメージセン
サの開発がなされている。完全密着型イメージセンサ
は、通常絶縁性の透光性記板上に、クロム、アルミニウ
ムなどの金属とアモルファスシリコンなどの半導体で形
成され、原稿を読み取るセンサ部である光電変換素子と
薄膜トランジスタからなる駆動回路とが一体に成形され
ている。この透光性基板を装置筐体に直接取り付けるの
は困難なので原稿の案内となるガイド手段と透光性記板
を一体化し、ガイド手段を介して透光性記板を装置筐体
等に固定し、透光性基板上の電気回路を外部の配線に接
続していた。
Therefore, recently, there has been developed a perfect contact type image sensor capable of reading a document at the same size without using a lens system. A perfect contact image sensor is usually a transparent transmissive recording plate made of metal such as chrome and aluminum and a semiconductor such as amorphous silicon. It is molded integrally with the circuit. Since it is difficult to attach this translucent substrate directly to the device casing, the translucent recording plate and the guide means for guiding the original are integrated, and the translucent recording plate is fixed to the device casing through the guide means. Then, the electric circuit on the transparent substrate was connected to the external wiring.

【0004】このような透光性基板とガイド手段とを一
体化した完全密着型イメージセンサとして特開平3−2
19759号公報には透光性基板の原稿給送側に可撓性
のガイド手段を有する技術が開示されている。次に、従
来の完全密着型イメージセンサの製造方法を図3に従っ
て説明する。
As a perfect contact type image sensor in which such a translucent substrate and guide means are integrated, it is disclosed in Japanese Patent Laid-Open No. 3-2.
Japanese Patent Publication No. 19759 discloses a technique in which a flexible guide means is provided on the original feeding side of a translucent substrate. Next, a method of manufacturing a conventional perfect contact type image sensor will be described with reference to FIG.

【0005】光電変換素子(不図示)を半導体プロセ
スにより形成し、光電変換素子上に透明保護層2を設け
た透光性基板1をベースプレート10に固定する(図3
(a))。
A photoelectric conversion element (not shown) is formed by a semiconductor process, and a transparent substrate 1 having a transparent protective layer 2 provided on the photoelectric conversion element is fixed to a base plate 10 (FIG. 3).
(A)).

【0006】ベースプレート10を支持台13に取り
付ける(図3(b))。
The base plate 10 is attached to the support base 13 (FIG. 3 (b)).

【0007】ガイド手段形成用の型11を透光性基板
1上の透明保護層2の表面に直接接するように取り付け
る(図3(c))。なお、型11にはガイド手段を形成
する材料を注入するための注入口12を設けている。型
11の材料には弾性と離型を必要とし、シリコン、ゴム
等が好適にもちいられる。
A mold 11 for forming guide means is attached so as to be in direct contact with the surface of the transparent protective layer 2 on the transparent substrate 1 (FIG. 3 (c)). The mold 11 is provided with an injection port 12 for injecting the material forming the guide means. The material of the mold 11 needs elasticity and mold release, and silicon, rubber or the like is preferably used.

【0008】ガイド手段形成用の型11の注入口12
から注入器、たとえばディスペンサ14を用いて型1
1、ベースペプレート10基板1及び指示対13により
構成される空間にガイド手段を形成する材料4を充填す
る(図3(d))、 充填終了後、材料4を硬化させる。
Injection port 12 of mold 11 for forming guide means
From the mold 1 using an injector, eg dispenser 14.
1, the base plate 10 is filled with the material 4 forming the guide means in the space formed by the substrate 1 and the pointing pair 13 (FIG. 3D). After the filling is completed, the material 4 is cured.

【0009】材料4が硬化したあとに型11を取り除
く。このとき注入口12の影響でバリ15が生じる(図
3(e))。
After the material 4 has hardened, the mold 11 is removed. At this time, a burr 15 is generated due to the influence of the injection port 12 (FIG. 3 (e)).

【0010】バリ15を除去して、透光性基板1、ベ
ースプレート10およびガイド手段が一体化した完全密
着型イメージセンサが完成する。
The burr 15 is removed to complete a complete contact type image sensor in which the transparent substrate 1, the base plate 10 and the guide means are integrated.

【0011】また、摩耗対策のために、図3(f)に示
すように材料4が硬化し、バリ15を取り除いたガイド
手段18を100μm以下の厚みのコート材16により
覆っている。
As a countermeasure against wear, the material 4 is hardened and the guide means 18 from which the burrs 15 have been removed are covered with a coating material 16 having a thickness of 100 μm or less as shown in FIG. 3 (f).

【0012】[0012]

【発明が解決しようとする課題】上述した従来の完全密
着型イメージセンサの製造法では、透光性基板と一体化
する有機材料からなるガイド手段の成形のあとにガイド
手段に摩耗対策である、コート材で原稿給送側を覆う作
業がくるために製造コスト高になるという課題があっ
た。また、ガイド手段の成形工程でも、樹脂の硬化、樹
脂硬化後のバリ除去作業があることで、製造コストが下
げられないという課題があった。
In the above-mentioned conventional method for manufacturing a perfect contact type image sensor, after the guide means made of an organic material integrated with the translucent substrate is molded, the guide means is provided with a measure against wear. There is a problem that the manufacturing cost becomes high because it is necessary to cover the document feeding side with the coating material. Further, also in the molding step of the guide means, there is a problem that the manufacturing cost cannot be reduced because the resin is cured and the burr is removed after the resin is cured.

【0013】[0013]

【課題を解決するための手段】本発明の完全密着型イメ
ージセンサは、少くとも裏面にポリエステルが付着され
た薄く細長い耐腐食性板金からなるガイド手段と、前記
ガイド手段に設けられたスリットに表面を前記ガイド手
段の表面と同一面にしてはめ込まれ画像読み取りのため
の光電変換素子が形成され前記ガイド手段より厚い透光
性基板と、前記ガイド手段の裏面と前記透光性基板の側
面とに密着する液晶ポリマーとを備えている。
A perfect contact type image sensor of the present invention comprises a guide means composed of a thin and elongated corrosion-resistant sheet metal having a polyester attached to at least a back surface, and a surface provided in a slit provided in the guide means. A translucent substrate having a photoelectric conversion element for reading an image formed on the same surface as the front surface of the guide means and thicker than the guide means; and a back surface of the guide means and a side surface of the translucent substrate. It is provided with a liquid crystal polymer that adheres closely.

【0014】本発明の完全密着型イメージセンサの製造
方法は、少くとも裏面にポリエステルが付着された薄く
細長い耐腐食性板金からなるガイド手段に設けられたス
リットに画像読み取りのための光電変換素子が形成され
前記ガイド手段より厚い透光性基板を表面が前記ガイド
手段の表面と同一面となるようにはめ込んで前記ガイド
手段および前記透光性基板を金型内に固定し、液晶ポリ
マーを前記ガイド手段の裏面、前記透光性基板の側面の
前記ガイド手段から突出した部分および前記金型の内面
で囲まれた間隙に流し込んで固化させることを特徴と
し、望ましくは、ガイド手段の表面に粘着テープを貼り
付け透光性基板をガイド手段のスリットにはめ込んで前
記透光性基板の表面を前記粘着テープに貼り付けたもの
を金型内に固定し、ガイド手段および透光性基板が金型
内に固定された時に前記金型に設けられた入れ子が前記
透光性記板の裏面を押圧するようにする。
According to the method of manufacturing a perfect contact type image sensor of the present invention, a photoelectric conversion element for reading an image is provided in a slit provided in a guide means made of a thin and long corrosion-resistant sheet metal having a polyester attached to the back surface. The translucent substrate which is formed and is thicker than the guide means is fitted so that the surface thereof is flush with the surface of the guide means, and the guide means and the translucent substrate are fixed in a mold, and the liquid crystal polymer is guided by the guide. The adhesive tape is preferably applied to the surface of the guide means by pouring into a gap surrounded by the back surface of the means, the side surface of the transparent substrate protruding from the guide means and the inner surface of the mold. Affixing the translucent substrate to the slit of the guide means and fixing the translucent substrate surface affixed to the adhesive tape in a mold, Nested id means and the transparent substrate is provided in said mold when it is fixed in the mold so as to press the rear surface of the translucent Symbol plate.

【0015】[0015]

【発明の実施の形態】次に、本発明の実施の形態の完全
密着型イメージセンサの製造方法について図面を参照し
て詳細に説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Next, a method for manufacturing a perfect contact type image sensor according to an embodiment of the present invention will be described in detail with reference to the drawings.

【0016】図1(a)〜(f)は本発明の実施の形態
の製造方法を示す図である。
1A to 1F are views showing a manufacturing method according to an embodiment of the present invention.

【0017】予め裏面にポリエステルを静電塗装しス
リットを設けた細長い形状の耐腐食性板金(厚さ0.2
mm)からなるガイド手段3の表面(図1(a)におけ
る上面)に耐熱性の粘着テープ5をガイド手段3に設け
たスリットを塞ぐように貼付け、次にガイド手段3のテ
ープ5を貼付けた面を下に向けて透光性基板1をガイド
手段3のスリットにはめ込み、テープ5の粘着側に貼り
付けて固定する。これを反転させた状態が図1(a)で
ある。ガイド手段3のスリットの寸法を透光性基板1の
外形寸法プラス0.02mm程度とすることにより透光
性基板1のスリットへのはめ合い作業が容易にできる。
また、粘着テープ5は後の工程ではがしてしまうので位
置決め等の複雑な作業は必要としない。ここで、透光性
基板1は材質がホウ系酸ガラスで上面にセンサ部等が形
成され側辺がダイヤモンドカッタで切断されたものであ
り、ガイド手段3を構成する耐腐食性板金の材質はSU
304である。
A slender shape corrosion-resistant sheet metal (thickness 0.2
mm) is attached to the surface of the guide means 3 (the upper surface in FIG. 1A) so as to cover the slit provided in the guide means 3, and then the tape 5 of the guide means 3 is attached. The light-transmissive substrate 1 is fitted into the slit of the guide means 3 with the surface facing downward, and is attached and fixed to the adhesive side of the tape 5. FIG. 1A shows a state in which this is reversed. By setting the size of the slit of the guide means 3 to the outer size of the transparent substrate 1 plus about 0.02 mm, the work of fitting the transparent substrate 1 into the slit can be facilitated.
Further, since the adhesive tape 5 is peeled off in a later process, complicated work such as positioning is not required. Here, the light-transmissive substrate 1 is made of boro-acid glass and has a sensor portion formed on the upper surface and a side edge cut by a diamond cutter. The material of the corrosion-resistant sheet metal forming the guide means 3 is SU
304.

【0018】テープ5に固定した透光性基板1とガイ
ド手段3とを可動側金型7の凹部19にはめ込んでから
固定側金型6と可動側金型7とを閉じ合わせる(図1
(b))。この時、透光性基板1は可動側金型7に設け
たスプリング機構8により固定側金型6に押圧されて保
持されている。スプリング機構8は図3のように透光性
基板1の厚みの±0.1mmのばらつきを吸収するため
に透光性基板1が接する可動側金型7の入れ子17をば
ね20によって固定側金型6に向けて押圧しているもの
で、透光性基板1が厚い方へばらついた時はばね20は
下方向に縮んで透光性基板1が破損しないようにし、薄
い方へばらついた時は上方向に伸びて透光性基板1をが
たの生じないように確実に保持する。透光性基板1の耐
圧縮荷重が500kgfであるため、ばね20は耐荷重
165kgfのものを3本使用している。
The transparent substrate 1 and the guide means 3 fixed to the tape 5 are fitted into the recesses 19 of the movable mold 7 and then the fixed mold 6 and the movable mold 7 are closed (see FIG. 1).
(B)). At this time, the translucent substrate 1 is pressed and held by the fixed-side mold 6 by the spring mechanism 8 provided in the movable-side mold 7. As shown in FIG. 3, the spring mechanism 8 uses a spring 20 to fix the insert 17 of the movable mold 7 in contact with the transparent substrate 1 to absorb the variation of the thickness of the transparent substrate 1 of ± 0.1 mm. It is pressed against the mold 6, and when the transparent substrate 1 is scattered to the thick side, the spring 20 shrinks downward so that the transparent substrate 1 is not damaged, and when it is scattered to the thin side. Extends upward and securely holds the transparent substrate 1 so that it does not rattle. Since the compressive load resistance of the transparent substrate 1 is 500 kgf, three springs 20 having a load resistance of 165 kgf are used.

【0019】金型6,7を閉じ合わせる前に入れ子17
はばね20に押されて先端が凹部19の底面より突出す
るが、入れ子の段差部21が可動側金型7の穴に設けら
れた段差部に突き当たり入れ子17の先端の凹部22の
底面からの突出量を最大で0.1mm程度となるように
してあるため、透光性基板1およびガイド手段を凹部1
9にはめ込む時に入れ子17が邪魔になることはない。
Before closing the molds 6 and 7, the nest 17
Is pushed by the spring 20 and the tip projects from the bottom surface of the recess 19, but the step 21 of the insert collides with the step provided in the hole of the movable mold 7 from the bottom of the recess 22 of the tip of the insert 17. Since the protrusion amount is about 0.1 mm at the maximum, the translucent substrate 1 and the guide means are formed in the concave portion 1.
Nesting 17 does not get in the way when it is fitted in 9.

【0020】凹部19の中央部に入れ子17が位置し、
ガイド手段3の側辺が、はめ込まれる周縁部および入れ
子17の部分を除き凹部19の底面ははめ込まれたガイ
ド手段3との間に間隙22が生じるように形成されてい
る。
The nest 17 is located at the center of the recess 19,
The side of the guide means 3 is formed so that a gap 22 is formed between the side of the guide means 3 and the guide means 3 in which it is fitted, except for the peripheral edge portion and the portion of the insert 17.

【0021】金型6,7を閉じ合わせてから、間隙2
2に流動性の良い熱可塑性液晶ポリマー(三菱エンジニ
アリングプラスチックス(株)製造のノバキュレートE
322G30)9を流し込み、透光性基板1のガイド手
段3より下に突出した部分の側面に側面の面粗さを利用
して密着させ、ガイド手段3は裏面に静電塗装したポリ
エステルが300度以上で溶融した液晶ポリマーにより
表面が溶融され、ポリエステルと液晶ポリマー9が溶着
することでこの液晶ポリマーと一体化される。また、液
晶ポリマー9は、ポリエステルの成分が含まれるため、
溶着以上に良好にガイド手段3に密着される(図1
(c))。
After closing the molds 6 and 7, the gap 2
2. Thermoplastic liquid crystal polymer with good fluidity (Novaculate E manufactured by Mitsubishi Engineering Plastics Co., Ltd.)
322G30) 9 is poured, and the side surface of the translucent substrate 1 protruding below the guide means 3 is brought into close contact with the side surface using the surface roughness of the side surface. The surface is melted by the liquid crystal polymer melted as described above, and the polyester and the liquid crystal polymer 9 are fused to be integrated with the liquid crystal polymer. Further, since the liquid crystal polymer 9 contains a polyester component,
It adheres to the guide means 3 better than welding (FIG. 1).
(C)).

【0022】完全密着型イメージセンサは等倍で読み込
むため、透光性基板1の長さが読み取る用紙の幅とほぼ
同じかそれ以上になるためかなり長くなる。透光性基板
1の厚みより、ガイド手段3の板金と保持する液晶ポリ
マー9との厚みを薄く抑える構造のため、液晶ポリマー
9を間隙22に注入する時の樹脂の流動断面の厚みは
0.8mm以下程度となる。A4サイズを読み取る完全
密着型イメージセンサでは、透光性基板1の長さは約2
90mm程度となり、0.8mm以下の可動側金型7と
ポリエステルを裏面に蒸着した耐腐食性板金からなるガ
イド手段3により構成される間隙22に樹脂を流動させ
なければならない。これにはL/T(流動長さ/肉厚)
>360の樹脂を選択する必要があり、この樹脂として
液晶ポリマーを用いている。
Since the perfect contact type image sensor reads at the same size, the length of the translucent substrate 1 is substantially the same as or longer than the width of the sheet to be read, which is considerably long. Since the thickness of the sheet metal of the guide means 3 and the liquid crystal polymer 9 to be held is kept smaller than the thickness of the translucent substrate 1, the thickness of the resin flow cross section when the liquid crystal polymer 9 is injected into the gap 22 is 0. It will be about 8 mm or less. In the case of a perfect contact image sensor that reads A4 size, the length of the transparent substrate 1 is about 2
The resin has to be made to flow to the gap 22 which is about 90 mm and is 0.8 mm or less, and the guide means 3 which is made of the corrosion-resistant sheet metal having the back surface vapor-deposited with polyester. This is L / T (flow length / wall thickness)
It is necessary to select a resin of> 360, and a liquid crystal polymer is used as this resin.

【0023】間隙22内に流し込んだ液晶ポリマー9
は直ちに固化する。液晶ポリマー9の固化後、移動側金
型7から固定側金型6を取り外し、液晶ポリマー9が成
型され一体化した透光性基板1およびガイド手段3を離
型する(図1(d))。
Liquid crystal polymer 9 poured into the gap 22
Solidifies immediately. After the liquid crystal polymer 9 is solidified, the fixed side mold 6 is removed from the moving side mold 7, and the transparent substrate 1 and the guide means 3 in which the liquid crystal polymer 9 is molded and integrated are released (FIG. 1 (d)). .

【0024】離型後、ガイド手段3と透光性基板1か
らテープ5を剥がし、(図1(e)),図1(f)に示
す完全密着型イメージセンサを得る。
After the mold release, the tape 5 is peeled off from the guide means 3 and the transparent substrate 1 to obtain the perfect contact type image sensor shown in FIG. 1 (e) and FIG. 1 (f).

【0025】なお、ガイド手段3にポリエステルを付着
させる方法は、静電塗装に限られず、蒸着などでも可能
である。
The method of attaching the polyester to the guide means 3 is not limited to electrostatic coating, but vapor deposition or the like is also possible.

【0026】[0026]

【発明の効果】本発明によれば、ガイド手段が耐腐食性
板金であるため耐摩耗対策であるコート材で原稿給送面
を覆う作業が省ける。
According to the present invention, since the guide means is made of corrosion-resistant sheet metal, the work of covering the document feeding surface with a coating material, which is a measure against wear, can be omitted.

【0027】本発明で透光性基板と板金製ガイド手段と
に密着して一体化させる有機材量に熱可塑性樹脂の液晶
ポリマーを使用することにより300mm以上の長さで
も有機材料を流動させることが可能となり、さらに、液
晶ポリマーは金型内に充填直後に固化するために特に樹
脂の硬化時間を設定する必要がない。
In the present invention, the liquid crystal polymer of the thermoplastic resin is used for the amount of the organic material which is closely adhered to and integrated with the translucent substrate and the sheet metal guide means, so that the organic material can be flowed even in a length of 300 mm or more. Further, since the liquid crystal polymer is solidified immediately after being filled in the mold, it is not necessary to set the curing time of the resin.

【0028】また、金型内への液晶ポリマーの流し込み
方向が透光性基板の長手方向となり、液晶ポリマーの流
動方向に圧力が掛かりやすい性質から平滑性が要求され
る透光性基板およびガイド手段の表面すなわち原稿を案
内するガイド面にはバリは発生せず、バリ除去作業が省
ける。以上より製造工程の短縮により大幅なコスト削減
が可能となり、完全密着性イメージセンサの大量生産が
可能となる。
Further, the liquid crystal polymer is poured into the mold in the longitudinal direction of the light transmissive substrate, and pressure is easily applied to the flow direction of the liquid crystal polymer so that smoothness is required and the guide means. No burr is generated on the surface of the sheet, that is, the guide surface for guiding the document, and the burr removal work can be omitted. As described above, it is possible to significantly reduce the cost by shortening the manufacturing process, and it is possible to mass-produce the perfect adhesion image sensor.

【0029】また、透光性基板とガイド手段とを粘着テ
ープに貼り付けておくことにより、これらを金型に取り
付ける作業が容易になる。
By attaching the transparent substrate and the guide means to the adhesive tape in advance, the work of attaching them to the mold becomes easy.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態の完全密着型イメージセン
サの製造方法を示す図である。
FIG. 1 is a diagram showing a method for manufacturing a perfect contact image sensor according to an embodiment of the present invention.

【図2】図1中のスプリング機構の詳細を示す断面図で
ある。
FIG. 2 is a sectional view showing details of a spring mechanism in FIG.

【図3】従来の完全密着型イメージセンサの製造方法を
示す図である。
FIG. 3 is a diagram showing a method for manufacturing a conventional perfect contact type image sensor.

【符号の説明】[Explanation of symbols]

1 透光性基板 2 保護層 3 ガイド手段 4 可撓性材料 5 テープ 6 固定側金型 7 可動側金型 8 スプリング機構 9 液晶ポリマー 10 ベースプレート 11 型 12 注入口 13 支持体 14 ディスペンサ 15 バリ 16 コート材 17 入れ子 18 ガイド手段 20 ばね 1 Translucent Substrate 2 Protective Layer 3 Guide Means 4 Flexible Material 5 Tape 6 Fixed Side Mold 7 Movable Side Mold 8 Spring Mechanism 9 Liquid Crystal Polymer 10 Base Plate 11 Type 12 Injection Port 13 Support 14 Dispenser 15 Burr 16 Coat Material 17 Nesting 18 Guide means 20 Spring

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 少くとも裏面にポリエステルが付着され
た薄く細長い耐腐食性板金からなるガイド手段と、前記
ガイド手段に設けられたスリットに表面を前記ガイド手
段の表面と同一面にしてはめ込まれ画像読み取りのため
の光電変換素子が形成され前記ガイド手段より厚い透光
性基板と、前記ガイド手段の裏面と前記透光性基板の側
面とに密着する液晶ポリマーとを含むことを特徴とする
完全密着型イメージセンサ。
1. A guide means made of a thin and slender corrosion-resistant sheet metal having a polyester attached to at least a back surface, and a slit provided in the guide means, and a surface of the guide means is flush with the surface of the guide means. A complete contact, which comprises a transparent substrate on which a photoelectric conversion element for reading is formed and which is thicker than the guide means, and a liquid crystal polymer which adheres to the back surface of the guide means and the side surface of the transparent substrate. Type image sensor.
【請求項2】 少くとも裏面にポリエステルが付着され
た薄く細長い耐腐食性板金からなるガイド手段に設けら
れたスリットに画像読み取りのための光電変換素子が形
成され前記ガイド手段より厚い透光性基板を表面が前記
ガイド手段の表面と同一面となるようにはめ込んで前記
ガイド手段および前記透光性基板を金型内に固定し、液
晶ポリマーを前記ガイド手段の裏面、前記透光性基板の
側面の前記ガイド手段から突出した部分および前記金型
の内面で囲まれた間隙に流し込んで固化させることを特
徴とする完全密着型イメージセンサの製造方法。
2. A light transmissive substrate having a photoelectric conversion element for image reading formed in a slit provided in a guide means made of a thin and long thin corrosion-resistant sheet metal having a polyester attached to at least a back surface thereof, and being thicker than the guide means. The guide means and the transparent substrate are fixed in a mold by fitting the surface so that the surface is flush with the surface of the guide means, and the liquid crystal polymer is the back surface of the guide means, the side surface of the transparent substrate. 2. A method for manufacturing a perfect contact type image sensor, comprising pouring into a gap surrounded by a portion protruding from the guide means and an inner surface of the mold to solidify.
【請求項3】 ガイド手段の表面に粘着テープを貼り付
け透光性基板をガイド手段のスリットにはめ込んで前記
透光性基板の表面を前記粘着テープに貼り付けたものを
金型内に固定することを特徴とする請求項2記載の完全
密着型イメージセンサの製造方法。
3. An adhesive tape is attached to the surface of the guide means, a transparent substrate is fitted into a slit of the guide means, and the transparent substrate having the surface attached to the adhesive tape is fixed in a mold. The method for manufacturing a perfect contact image sensor according to claim 2, wherein
【請求項4】 ガイド手段および透光性基板が金型内に
固定された時に前記金型に設けられた入れ子が前記透光
性記板の裏面を押圧することを特徴とする請求項2また
は3記載の密着型イメージセンサの製造方法。
4. The mold according to claim 2, wherein when the guide means and the transparent substrate are fixed in the mold, a nest provided in the mold presses the back surface of the transparent recording plate. 3. The method for manufacturing the contact image sensor according to 3.
JP8096409A 1996-04-18 1996-04-18 Complete contact image sensor and method of manufacturing the same Expired - Lifetime JP2891170B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8096409A JP2891170B2 (en) 1996-04-18 1996-04-18 Complete contact image sensor and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8096409A JP2891170B2 (en) 1996-04-18 1996-04-18 Complete contact image sensor and method of manufacturing the same

Publications (2)

Publication Number Publication Date
JPH09284474A true JPH09284474A (en) 1997-10-31
JP2891170B2 JP2891170B2 (en) 1999-05-17

Family

ID=14164179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8096409A Expired - Lifetime JP2891170B2 (en) 1996-04-18 1996-04-18 Complete contact image sensor and method of manufacturing the same

Country Status (1)

Country Link
JP (1) JP2891170B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3922255B2 (en) 2003-06-30 2007-05-30 ブラザー工業株式会社 Solid-state imaging device, manufacturing method thereof, and mounting method

Also Published As

Publication number Publication date
JP2891170B2 (en) 1999-05-17

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