JPH09283806A - Led display and display device using led display - Google Patents

Led display and display device using led display

Info

Publication number
JPH09283806A
JPH09283806A JP9229396A JP9229396A JPH09283806A JP H09283806 A JPH09283806 A JP H09283806A JP 9229396 A JP9229396 A JP 9229396A JP 9229396 A JP9229396 A JP 9229396A JP H09283806 A JPH09283806 A JP H09283806A
Authority
JP
Japan
Prior art keywords
light
light emitting
led chip
emitting diode
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9229396A
Other languages
Japanese (ja)
Other versions
JP3233335B2 (en
Inventor
Hideaki Yoneda
秀昭 米田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP9229396A priority Critical patent/JP3233335B2/en
Publication of JPH09283806A publication Critical patent/JPH09283806A/en
Application granted granted Critical
Publication of JP3233335B2 publication Critical patent/JP3233335B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00Illuminated signs; Luminous advertising
    • G09F13/20Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To improve visibility by using first and second coloring agents having a visible-light transmittance lower than that of a third coloring agent and providing a third light emitting diode at a position where light blocking efficiency is higher than the positions of first and second light emitting diodes. SOLUTION: A blue (B) coloring agent has a visible-light transmittance higher than that of green (G) and red (R) coloring agents. When a blue light emitting diode is partially irradiated with light, it shows remarkable reflection effect. A print substrate, where a plurality of light emitting diodes 102 are provided and electrically connected, is placed in a resin case as a box 104 and sealed by filling agent 103. Each light emitting diode 102 is colored at its mold member in correspondence with light emitted from an LED chip. A light blocking member 101 is formed on the upper end surface of the resin case. By providing the light emitting diode having the coloring agent with a high visible-light transmittance and short-wave side light-emission wavelength on the light blocking member side, light emitting characteristic is maintained and gold color balance is obtained, thus, visibility can be improved.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本願発明は、発光ダイオード
の発光効率が高く且つ、視認性に優れたLED表示器及
びそれを用いた表示装置に関し、特に、太陽光などの移
動に伴いLED表示器への照射量が部分的に変化しても
コントラストに優れたLED表示器及びそれを用いた表
示装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED display device having high luminous efficiency of a light emitting diode and excellent visibility, and a display device using the LED display device. The present invention relates to an LED display having excellent contrast even when the irradiation amount of the LED partially changes and a display device using the same.

【0002】[0002]

【従来の技術】今日、LSI等のシリコンテクノロジー
及び光通信技術等の発展により、大量の情報を処理及び
伝送することが可能となった。これに伴い、多量な画像
情報を処理可能なフルカラー化及び大型化した表示装置
に対する社会の要求が、ますます高まりを見せている。
2. Description of the Related Art Today, with the development of silicon technology such as LSI and optical communication technology, it has become possible to process and transmit a large amount of information. Along with this, social demands for full-color and large-sized display devices capable of processing a large amount of image information are increasing more and more.

【0003】特に、不特定多数の人々が視認する大型表
示装置については、極めて要求が高い。このような大型
表示装置としては、冷陰極管を多数組み合わせて表示す
るマルチビジョンや液晶フィルターを利用した液晶プロ
ジェクター等が知られている。しかしながら、前述の方
式は装置重量、装置体積が大きい。また、駆動のために
高電圧を使用するため保守点検がしにくい。或いは使用
環境が制限されるなどの問題がある。そのため、大型表
示装置が本格的に普及するまでには至っていない。
In particular, there is an extremely high demand for a large-sized display device that can be viewed by an unspecified number of people. As such a large-sized display device, there are known a multi-vision which displays a combination of many cold cathode tubes and a liquid crystal projector which uses a liquid crystal filter. However, the above-mentioned method has a large device weight and a large device volume. Moreover, since a high voltage is used for driving, maintenance and inspection is difficult. Alternatively, there is a problem that the usage environment is limited. For this reason, large-scale display devices have not come into widespread use.

【0004】一方、最近RGB(赤、緑、青)三原色が
それぞれ高輝度に発光可能な固体発光素子を利用した発
光ダイオード(以下、LEDとも呼ぶ)が開発された。
このLEDの開発にともない大型表示装置等としてにわ
かにLEDが注目されている。LEDを用いた表示装置
は、従来の表示装置と比べ装置体積、装置重量を極めて
小さくでき長寿命化も可能である。また、従来の冷陰極
管を使用したデイスプレイ等と比較して製造が比較的容
易であり、駆動電圧及び消費電力が極めて小さいために
大型表示装置などとして有望視されている。
On the other hand, recently, a light emitting diode (hereinafter, also referred to as an LED) using a solid-state light emitting device capable of emitting RGB (red, green, blue) three primary colors with high brightness has been developed.
With the development of the LED, the LED is suddenly attracting attention as a large display device and the like. A display device using an LED can have an extremely small device volume and device weight as compared with a conventional display device and can have a long life. In addition, it is relatively easy to manufacture as compared with a display using a conventional cold cathode fluorescent lamp, and has a very low driving voltage and power consumption, and thus is regarded as a promising large-sized display device.

【0005】このような発光ダイオードをRGBそれぞ
れ組み合わせマトリックス状などに配置させると共にそ
れぞれの発光色を組み合わせることによって、フルカラ
ー表示させることができる。具体的には、1絵素として
のRGBに対応するLEDを全て点灯させると白色にな
り、赤と緑でイエロー、緑と青でシアンとなる。さら
に、各LEDの輝度を調整して種々の発光色とすること
ができる。RGBの発光ダイオードは、導電パターンが
プリントされた基板上にマトリックス状など複数配置さ
れる。この基板上に配された発光ダイオードを筐体に配
し発光ダイオードと筐体間を充填材で保護することによ
ってLED表示器を構成してある。なお、直射日光など
の侵入を防ぎ視認性向上のために遮光部材としてフード
がエポキシ樹脂からなるきょう体と一体成形されてい
る。また、発光ダイオードは、半導体発光素子であるL
EDチップをリード端子先端上に配置しリード端子など
とそれぞれ電気的に接続させている。LEDチップ保護
のためにエポキシ樹脂などを用いてモールド部材として
利用してある。このようなモールド部材は発光特性向上
のためにRGBの発光ダイオードごとにモールド部材を
着色しフィルター効果を持たせている。
A full-color display can be achieved by arranging such light-emitting diodes in a combination of RGB and arranging them in a matrix form and combining the respective emission colors. Specifically, when all the LEDs corresponding to RGB as one picture element are turned on, it becomes white, red and green become yellow, and green and blue become cyan. Furthermore, the brightness of each LED can be adjusted to produce various emission colors. A plurality of RGB light emitting diodes are arranged in a matrix on a substrate on which a conductive pattern is printed. The LED display is constructed by arranging the light emitting diode arranged on this substrate in a housing and protecting the space between the light emitting diode and the housing with a filling material. A hood is integrally formed with a casing made of epoxy resin as a light shielding member to prevent intrusion of direct sunlight and improve visibility. The light emitting diode is a semiconductor light emitting element L
The ED chip is arranged on the tip of the lead terminal and electrically connected to the lead terminal and the like. Epoxy resin or the like is used as a molding member for protecting the LED chip. In order to improve the light emission characteristics of such a mold member, the mold member is colored for each of the RGB light emitting diodes to give a filter effect.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記の
LED表示器に太陽光などが照射される場合、たとえ遮
光部材を設けていたとしても視認性確保のために遮光部
材をある程度以上の長さ、厚み及び角度に設定すること
はできない。そのため遮光部材により外来光を均一に遮
光することはできない。特にLED表示器は一度所望の
位置に設置すると固定され照射光に応じて移動させるこ
とがないことが多い。LED表示を固定設置させると、
太陽光の一日の移動のみならず季節による照射角度の変
化に対応しきれない。
However, when the above-mentioned LED display is irradiated with sunlight or the like, even if a light-shielding member is provided, the light-shielding member is provided with a certain length or more in order to ensure visibility. The thickness and angle cannot be set. Therefore, external light cannot be uniformly blocked by the light blocking member. In particular, the LED display is often fixed once installed at a desired position and is not moved according to the irradiation light. When the LED display is fixedly installed,
Not only can the sunlight move for one day, but it can not cope with the change in the irradiation angle depending on the season.

【0007】RGBの発光ダイオードを配列したLED
表示器に不均一に光が照射されると非発光時のLED表
示器の表示面における表示色が異なりコントラストの低
下や色むらに伴う視認性が低下するという問題を生じ
る。野外などの明るい場所で用いられることが多いLE
D表示器のコントラストを向上させることは重要な課題
となる。特に、より視認性の向上が求められる今日にお
いては上記構成のLED表示器では十分ではなく、更な
る特性向上が求められる。本願発明は、かかる問題点に
かんがみ、設置場所や時間などによらず視認性の優れた
LED表示器を提供することにある。
LED in which RGB light emitting diodes are arranged
When the display is non-uniformly irradiated with light, the display color of the display surface of the LED display when the light is not emitted is different, which causes a problem that the contrast is lowered and the visibility due to the color unevenness is lowered. LE often used in bright places such as outdoors
Improving the contrast of the D display is an important issue. In particular, the LED display having the above-mentioned structure is not sufficient today, and further improvement in characteristics is required. In view of such problems, the present invention is to provide an LED display device having excellent visibility regardless of installation location, time, and the like.

【0008】[0008]

【課題を解決するための手段】本願発明は、第1のLE
Dチップと該第1のLEDチップが発光した光に対して
フィルターとして作用する第1の着色剤が含有されたモ
ールド部材とを有する第1の発光ダイオードと、前記第
1のLEDチップが発光した光の主発光波長よりも短波
長側で主発光波長を発光する第2のLEDチップと該第
2のLEDチップが発光した光に対しフィルターとして
作用する第2の着色剤が含有されたモールド部材とを有
する第2の発光ダイオードと、前記第2のLEDチップ
が発光した光の主発光波長よりも短波長側で主発光波長
を発光する第3のLEDチップと該第3のLEDチップ
が発光した光に対しフィルターとして作用する第3の着
色剤が含有されたモールド部材とを有する第3の発光ダ
イオードと、を基板上に配し、前記第1及び第2の着色
剤が第3の着色剤よりも可視光の透過率が少なく且つ、
前記第3の発光ダイオードが前記第1及び第2の発光ダ
イオードよりも遮光率の高い位置に設けられているLE
D表示器である。
The invention of the present application is based on the first LE.
A first light emitting diode having a D chip and a mold member containing a first colorant that acts as a filter for the light emitted by the first LED chip, and the first LED chip emitted light. A mold member containing a second LED chip that emits a main emission wavelength shorter than the main emission wavelength of light and a second colorant that acts as a filter for the light emitted by the second LED chip. A second light emitting diode having a light emitting diode, a third LED chip that emits a main emission wavelength on a shorter wavelength side than a main emission wavelength of light emitted by the second LED chip, and the third LED chip emits light. A third light emitting diode having a mold member containing a third colorant that acts as a filter against the generated light, and the first and second colorants have a third color. Agent Remote visible light transmittance is small and,
LE in which the third light emitting diode is provided at a position having a higher light blocking ratio than the first and second light emitting diodes
It is a D display.

【0009】また、本願発明は、第1のLEDチップと
該第1のLEDチップが発光した光に対してフィルター
として作用する第1の着色剤が含有されたモールド部材
とを有する第1の発光ダイオードと、前記第1のLED
チップが発光した光の主発光波長よりも短波長側で主発
光波長を発光する第2のLEDチップと該第2のLED
チップが発光した光に対しフィルターとして作用する第
2の着色剤が含有されたモールド部材とを有する第2の
発光ダイオードと、前記第2のLEDチップが発光した
光の主発光波長よりも短波長側で主発光波長を発光する
第3のLEDチップと該第3のLEDチップが発光した
光に対しフィルターとして作用する第3の着色剤が含有
されたモールド部材とを有する第3の発光ダイオード
と、を基板上に配し、該基板が遮光部材を有する筐体で
覆われると共に前記第1、第2及び第3の発光ダイオー
ドの少なくとも一部と前記筐体とを充填材で充填し、前
記第1及び第2の着色剤が第3の着色剤よりも可視光の
透過率が少なく且つ、前記第3の発光ダイオードが前記
第1及び第2の発光ダイオードよりも遮光部材側に設け
られているLED表示器である。
Further, the present invention provides a first light emitting device having a first LED chip and a mold member containing a first colorant which acts as a filter for the light emitted by the first LED chip. Diode and the first LED
A second LED chip that emits a main emission wavelength on a shorter wavelength side than a main emission wavelength of light emitted by the chip and the second LED
A second light emitting diode having a mold member containing a second colorant that acts as a filter for the light emitted by the chip, and a wavelength shorter than the main emission wavelength of the light emitted by the second LED chip. A third light emitting diode having a third LED chip that emits a main emission wavelength on the side and a mold member that contains a third colorant that acts as a filter for the light emitted by the third LED chip. Is disposed on a substrate, the substrate is covered with a casing having a light shielding member, and at least a part of the first, second and third light emitting diodes and the casing are filled with a filling material, The first and second colorants have a lower visible light transmittance than the third colorant, and the third light emitting diode is provided closer to the light shielding member than the first and second light emitting diodes. LED table It is a vessel.

【0010】さらに、前記第1のLEDチップが発光す
る光が600nmから700nmの範囲内にあり、前記
第2のLEDチップが発光する光が495nmから56
5nmの範囲内にあり、前記第3のLEDチップが発光
する光が430nmから490nmの範囲内にあるLE
D表示器であり、請求項2記載のLED表示器と、該L
ED表示器と電気的に接続された駆動回路と、を有する
表示装置でもある。
Further, the light emitted from the first LED chip is in the range of 600 nm to 700 nm, and the light emitted from the second LED chip is from 495 nm to 56 nm.
LE in the range of 5 nm and the light emitted by the third LED chip in the range of 430 nm to 490 nm
The LED display according to claim 2, which is a D display, and the L
It is also a display device including a drive circuit electrically connected to the ED display.

【0011】[0011]

【発明の実施の形態】本願発明者は種種の実験の結果、
LED表示器において発光特性、外来光の照射に伴う視
認性及びコントラストが、モールド部材中に含有された
着色剤の可視光透過率と発光ダイオードの特定の配置に
よって大きく改善できることを見出しこれに基づいて本
願発明を成すに至った。
BEST MODE FOR CARRYING OUT THE INVENTION As a result of various kinds of experiments,
Based on this, it was found that the light emission characteristics, the visibility and the contrast due to the irradiation of external light in the LED display can be greatly improved by the visible light transmittance of the colorant contained in the mold member and the specific arrangement of the light emitting diodes. The present invention has been accomplished.

【0012】本願発明の構成によって特性向上の理由は
定かではないが、非点灯LED表示器への部分的な光照
射下では、発光時の色バランスを考慮した着色剤の可視
光透過率がLED表示器の色バランスに大きく関係する
ためと考えられる。即ち、染料及び/又は顔料などの着
色剤は発光ダイオードを点灯させフルカラー表示とさせ
たときに発光効率や色純度などの発光特性の優れたLE
D表示器とすべくRGBの発光ダイオードごとに種々決
定される。LED表示器を照射する外来光がない或いは
少ない夜間などの場合は、RGBの発光ダイオードごと
の光透過率の変化はLED表示器の使用に特に問題とな
ることはない。
Although it is not clear why the characteristics of the present invention are improved by the configuration of the present invention, the visible light transmittance of the colorant in consideration of the color balance at the time of light emission of the LED under the partial light irradiation of the non-lighted LED display. It is considered that this is largely related to the color balance of the display. That is, a coloring agent such as a dye and / or a pigment is an LE having excellent emission characteristics such as emission efficiency and color purity when a light emitting diode is turned on for full color display.
Various determinations are made for each of the RGB light emitting diodes to be a D display. In the case of nighttime when there is no or little extraneous light illuminating the LED display, the change in the light transmittance of each of the RGB light emitting diodes does not cause any particular problem in using the LED display.

【0013】しかし、LED表示器の表示面に照射され
る光量が多く均一でない場合、光照射されたモールド部
材と光照射されていないモールド部材との色の加法混色
によって非発光時の表示面の色が決定されるされるため
表示面全体として大きな変色を生ずる。具体的には、L
ED表示装置の発光特性向上などのために青色の着色剤
を緑色や赤色と比較して可視光透過率を高くする。この
ようなRGBの発光ダイオードを配列したLED表示器
の青色の発光ダイオードに部分的に光が照射されると光
照射によって反射の影響などが顕著にあらわれる。特
に、LEDチップがリード端子のカップ内に収容されて
いる場合、LEDチップからの光は、着色剤の影響を一
度しか受けないがカップに反射される外来光は着色剤の
影響を二度受けることとなる。このため表示面全体とし
ては赤みをおびたり、或いは青白っぽく見えたり、緑ぽ
く変色して見えることがある。一方、光透過率の低い緑
色、赤色などに光が照射され青色に光が照射されない場
合は、RGBの加法混色は表示面全体として黒ぽく見え
る。そのため透過率と遮光率(発光ダイオードの特定配
置)によってコントラストや色バランスが変化すると考
えられる。
However, when the amount of light applied to the display surface of the LED display device is large and not uniform, the additive effect of the colors of the light-irradiated mold member and the light-unirradiated mold member causes the display surface to be in a non-light emitting state. Since the color is determined, a large discoloration occurs on the entire display surface. Specifically, L
In order to improve the light emitting characteristics of the ED display device, the blue colorant is made to have a higher visible light transmittance than green or red. When the blue light emitting diodes of the LED display in which the RGB light emitting diodes are arranged as described above are partially irradiated with light, the influence of reflection appears remarkably due to the light irradiation. In particular, when the LED chip is housed in the cup of the lead terminal, the light from the LED chip is affected by the colorant only once, but the external light reflected by the cup is twice affected by the colorant. It will be. For this reason, the entire display surface may appear reddish, bluish-white, or greenish-colored. On the other hand, when light is radiated to green, red or the like having low light transmittance and blue is not radiated, the additive color mixture of RGB appears blackish on the entire display surface. Therefore, it is considered that the contrast and the color balance change depending on the transmittance and the light blocking ratio (specific arrangement of the light emitting diodes).

【0014】表示面への光量の部分変化が直射日光の場
合は、遮光部材によってある程度遮ることができる。し
かしながら、遮光部材は視認性確保のためにある程度以
上の長さ、厚み及び角度に設定することはできず遮光部
材により全てを均等に外来光から遮光することはできな
い。特にLED表示器は一度所望の位置に設置すると固
定され照射光に応じて移動させることがないため、太陽
光の一日の移動のみならず季節による照射角度の変化な
どに対応しきれない。
When the partial change in the amount of light on the display surface is direct sunlight, it can be blocked to some extent by a light blocking member. However, the light-shielding member cannot be set to have a length, thickness, and angle greater than a certain amount in order to ensure visibility, and the light-shielding member cannot uniformly shield all from external light. In particular, the LED indicator is fixed once installed at a desired position and is not moved according to the irradiation light, so that it cannot cope with not only the movement of sunlight for one day but also the change of the irradiation angle due to the season.

【0015】そこで、本願発明は着色剤の光透過率の高
いLEDを外来光の影響がより少ない位置に配置するこ
とによって、発光特性を維持させつつ、色バランスの優
れたLED表示器とするものである。以下、図を用いて
本願発明を詳細に説明する。図1は、本願発明の種々の
LED表示器の概略平面図であり、図1(A)はR(赤
色)G(緑色)B(青色)の発光ダイオードを1個ずつ
用い1絵素としたものである。図1(B)は、1つのL
ED表示器に2つの遮光部材とRGBの発光ダイオード
がそれぞれ4個ずつ用い4つの絵素を構成したものであ
る。図1(C)は、RGの発光ダイオードをBに対して
対角線状に配置しRG2個に対してBを1個用いて1絵
素を構成してある。図3は、本願発明に用いられるLE
D表示装置の概略断面図である。筐体104である樹脂
ケース中には、LEDチップが発光した光に応じてモー
ルド部材が着色された発光ダイオード102を複数配置
しそれぞれ電気的に接続させたプリント基板をシリコン
樹脂などの充填材103で封入させてある。樹脂ケース
の上端面には遮光部材101が形成されている。以下本
願発明の各構成について説明する。
In view of this, the present invention provides an LED display having excellent color balance while maintaining the light emission characteristics by arranging the LED having a high light transmittance of the colorant at a position where the influence of external light is smaller. Is. Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic plan view of various LED displays of the present invention, and FIG. 1A shows one pixel using R (red) G (green) B (blue) light emitting diodes one by one. It is a thing. FIG. 1B shows one L
In the ED display, four pixel elements are formed by using two light shielding members and four RGB light emitting diodes, respectively. In FIG. 1C, light emitting diodes of RG are arranged diagonally with respect to B, and one B is used for two RGs to form one pixel. FIG. 3 is an LE used in the present invention.
It is a schematic sectional drawing of a D display device. In the resin case, which is the housing 104, a plurality of light emitting diodes 102 each having a molded member colored according to the light emitted from the LED chip are arranged and a printed circuit board electrically connected to each other is filled with a filler 103 such as a silicon resin. It is enclosed in. A light shielding member 101 is formed on the upper end surface of the resin case. Each component of the present invention will be described below.

【0016】(遮光部材101)遮光部材101は、外
来光の照射によって発光ダイオード102が視認しにく
くなることを防止するためにもちいられる。したがっ
て、設置場所や設定視認距離を考慮して遮光部材の長
さ、厚み及び角度を決定する。遮光部材は、視認距離に
合わせてその角度を変更させることができることが好ま
しい。遮光部材101の筐体104に対する設置角度
は、視認距離や筐体の設置角度などによって所望に選択
できるが、好ましくは表示面の垂直方向に対して0度か
ら10が好ましい。また、遮光効率を向上させる目的で
遮光部材101を黒色などに着色させてもよい。
(Light-shielding member 101) The light-shielding member 101 is used to prevent the light-emitting diode 102 from becoming difficult to be visually recognized by the irradiation of external light. Therefore, the length, thickness, and angle of the light blocking member are determined in consideration of the installation location and the set viewing distance. It is preferable that the angle of the light shielding member can be changed according to the viewing distance. The installation angle of the light blocking member 101 with respect to the housing 104 can be selected as desired depending on the viewing distance, the installation angle of the housing, and the like, but is preferably 0 degrees to 10 with respect to the vertical direction of the display surface. Further, the light blocking member 101 may be colored in black or the like for the purpose of improving the light blocking efficiency.

【0017】LED表示器の遮光は、LED表示器の設
置角度、遮光部材の長さや厚み、遮光部材の筐体に対す
る角度などで種々変化する。LED表示器は、その使用
環境を考慮し接地面に対して0から10度傾けて接地し
たり遮光部材の長さを長くしたりして30度から45度
の太陽光線が直接照射されないように配置しコントラス
トの向上を図る。表示面への光量の部分的変化が直射日
光の場合は、遮光部材101によってある程度遮ること
ができる。しかしながら、遮光部材101は視認性確保
のためにある程度以上の長さ、厚み及び角度に設定する
ことはできず遮光部材により全てを均等に外来光から遮
光することはできない。つまり、コントラスト向上のた
めに遮光部材の角度、長さ、厚み及びLED表示器の設
置角度などは、視認位置や距離によって設計せざるを得
ず自由度が少なくなる。特にLED表示器は一度所望の
位置に設置すると固定され照射光に応じて移動させるこ
とがなく、上記角度に設定していたとしても太陽光の一
日の移動のみならず季節による照射角度の変化などに対
応しきれない。そのため、設定値からずれコントラスト
が大幅に低下する場合が生じる。したがって本願発明が
特に有効に働くこととなる。
The shading of the LED display varies depending on the installation angle of the LED display, the length and thickness of the shading member, the angle of the shading member with respect to the housing, and the like. Considering the usage environment, the LED display should be tilted from 0 to 10 degrees with respect to the ground plane and grounded, or the length of the light shielding member should be increased so that sunlight rays of 30 to 45 degrees are not directly irradiated. Arrange them to improve the contrast. When the partial change in the amount of light on the display surface is direct sunlight, it can be blocked to some extent by the light blocking member 101. However, the light-shielding member 101 cannot be set to have a length, thickness, and angle greater than a certain amount in order to ensure visibility, and the light-shielding member cannot uniformly shield all from external light. That is, in order to improve the contrast, the angle, length, thickness of the light-shielding member, the installation angle of the LED display, and the like have to be designed according to the visual recognition position and the distance, which reduces the degree of freedom. In particular, the LED indicator is fixed once installed at a desired position and does not move according to the irradiation light. Even if the above-mentioned angle is set, not only the movement of sunlight for one day but also the change of the irradiation angle depending on the season. It is not possible to cope with such. Therefore, there is a case where the contrast deviates from the set value and the contrast significantly decreases. Therefore, the present invention works particularly effectively.

【0018】本願発明は、着色剤の可視光透過率が高く
発光波長が短波長側の発光ダイオードを可視光透過率が
低く発光波長が長波長側の発光ダイオードよりも遮光部
材側に設けてある。この場合においても全ての照射光を
均一に遮光することは難しいが、太陽光が水平線などに
沈む時間帯近傍はLED表示器に照射される確率が高く
なるかわりに、太陽光の光力が弱っておりさほどコント
ラストに影響がない場合もある。したがって、太陽光の
入射角度が水平0度から約26度、より好ましくは水平
0度から約15度の範囲であれば比較的入射光に対する
遮光を考慮する必要はなく、26度の角度で遮光部材1
01などにより遮光される位置に可視光透過率の高い短
波長の発光ダイオードを配置することが好ましい。
In the present invention, the light emitting diode having a high visible light transmittance of the colorant and having a short emission wavelength is provided closer to the light shielding member than the light emitting diode having a low visible light transmittance and having a long emission wavelength. . Even in this case, it is difficult to uniformly block all the irradiation light, but in the vicinity of the time period when the sun sets on the horizon, etc., the probability that the LED display will be irradiated is high, but the light power of the sun is weak. In some cases, the contrast is not so affected. Therefore, if the incident angle of sunlight is in the range of 0 ° to about 26 ° horizontally, and more preferably 0 ° to about 15 ° horizontally, it is not necessary to consider the shielding of incident light relatively. Member 1
It is preferable to dispose a short wavelength light emitting diode having a high visible light transmittance at a position shielded by 01 or the like.

【0019】(発光ダイオード102)本願発明に用い
られる発光ダイオード102は、種種の半導体を用いた
LEDチップ203を各発光色に対応して着色させた樹
脂でモールドし形成した発光素子が用いられる。具体的
には、液相成長法やMOCVD法により基体上にGaA
lN、ZnS、ZnSe、SiC、GaP、GaAlA
s、AlInGaP、InGaN、GaN、AlInG
aN等の半導体を発光層として形成させた物が用いられ
る。半導体の構造としては、MIS接合やPN接合を有
したホモ構造、ヘテロ構造あるいはダブルへテロ構成の
ものが挙げられる。半導体層の材料やその混晶度によっ
て発光波長を紫外光から赤外光まで種種選択することが
できる。さらに、量子効果を持たせるため発光層を単一
量子井戸構造、多重量子井戸構造とさせても良い。野外
など比較的外来光が強い場所でLED表示器を使用する
場合、緑色系及び青色系として窒化ガリウム系化合物半
導体を用いることが好ましく、また、赤色系ではガリウ
ム、アルミニウム、砒素系の半導体やアルミニウム、イ
ンジュウム、ガリウム、燐系の半導体を用いることが好
ましい。このような半導体を持つLEDチップ203を
金線やアルミニウム線などの電気的接続部材202によ
りリード端子204などと電気的に接続させモールド部
材201で被覆することによって発光ダイオードを形成
させることができる。また、基板上にLEDチップ20
3を導電性ペーストなどで固着させると共に電気的接続
を取った後モールド部材で被覆させ発光ダイオードを形
成させても良い。なお、フルカラー表示器としてLED
を利用するためには赤色の発光波長が600nmから7
00nm、緑色が495nmから565nm、青色の発
光波長が430nmから490nmの半導体を用いたL
EDチップ203を使用することが好ましい。
(Light-Emitting Diode 102) As the light-emitting diode 102 used in the present invention, a light-emitting element formed by molding an LED chip 203 using various kinds of semiconductors with a resin colored corresponding to each emission color is used. Specifically, GaA is formed on the substrate by liquid phase epitaxy or MOCVD.
1N, ZnS, ZnSe, SiC, GaP, GaAlA
s, AlInGaP, InGaN, GaN, AlInG
A material in which a semiconductor such as aN is formed as a light emitting layer is used. Examples of the semiconductor structure include a homo structure, a hetero structure, and a double hetero structure having a MIS junction and a PN junction. The emission wavelength can be selected from ultraviolet light to infrared light depending on the material of the semiconductor layer and its degree of mixed crystal. Furthermore, in order to have a quantum effect, the light emitting layer may have a single quantum well structure or a multiple quantum well structure. When an LED display is used in a place where external light is relatively strong, such as outdoors, it is preferable to use gallium nitride-based compound semiconductors for green and blue, and for red, gallium, aluminum, arsenic-based semiconductors and aluminum. It is preferable to use an indium, gallium, or phosphorus-based semiconductor. A light emitting diode can be formed by electrically connecting the LED chip 203 having such a semiconductor to the lead terminal 204 and the like by an electrical connecting member 202 such as a gold wire or an aluminum wire and covering it with the molding member 201. In addition, the LED chip 20 on the substrate
3 may be fixed with a conductive paste or the like, and after electrically connecting, a mold member may be covered to form a light emitting diode. In addition, LED as a full-color display
In order to utilize, the red emission wavelength is from 600 nm to 7
00nm, green 495nm to 565nm, and blue emission wavelength 430nm to 490nm
It is preferable to use the ED chip 203.

【0020】各発光ダイオード102をマトリックス状
や、ちどり状さらには、図1の如く左右或いは上下から
の視認性向上のためにとびとびに発光ダイオードを配置
したものなど所望の形状に基板上に配置し電気的に接続
する。図1の如く各発光ダイオード102から見て各々
がRGBの絵素を構成するように組み合わせ配置すると
より少ないLEDの個数で混色性を高く発光効率を向上
させることができる。発光ダイオードを配置する基体と
しては、発光ダイオードの配置のみならず駆動回路用の
基板と兼用しても良い。基板は、機械的強度が高く熱変
形の少ないものが好ましい。具体的には銅箔などの導電
体が形成されたセラミックス、ガラス等を用いた基板が
好適に利用できる。発光ダイオードが実装される基板表
面はLED表示器の表示面と一致するためコントラスト
向上のために暗褐色や黒色などに着色してあることが好
ましい。また、充填材との密着性向上のために凹凸加工
させても良い。
The respective light emitting diodes 102 are arranged on the substrate in a desired shape such as a matrix shape, a dotted shape, or a discontinuous arrangement of the light emitting diodes for improving the visibility from the left and right or the top and bottom as shown in FIG. Connect electrically. As shown in FIG. 1, when the LEDs are combined and arranged so as to form RGB picture elements as viewed from the respective light emitting diodes 102, the color mixing property can be increased and the light emission efficiency can be improved with a smaller number of LEDs. The substrate on which the light emitting diodes are arranged may be used not only for the arrangement of the light emitting diodes but also for the substrate for the driving circuit. The substrate is preferably one having high mechanical strength and low thermal deformation. Specifically, a substrate using ceramics, glass, or the like on which a conductor such as a copper foil is formed can be suitably used. Since the surface of the substrate on which the light emitting diodes are mounted coincides with the display surface of the LED display, it is preferable that the surface be colored dark brown or black to improve the contrast. In addition, unevenness may be applied to improve the adhesion to the filler.

【0021】(充填材103)充填材103としては、
発光ダイオード102、きょう体104、発光ダイオー
ドが配置された基板及び遮光部材101などとの密着性
がよいことが求められる。また、発光ダイオード102
が接続された電気回路を保護するために機械的強度及び
耐候性が要求される。このような充填材102として具
体的には、エポキシ樹脂、ウレタン樹脂、シリコン樹脂
などが挙げられる。また、充填材102は、LED表示
器の表示面側に設けられる。そのためコントラスト向上
の向上を目的として充填材中に暗褐色や黒色などの染料
及び/又は顔料を含有させても良い。さらに、発光ダイ
オード102からの熱を放熱させる目的で熱伝導部材を
充填材中に含有させても良い。熱伝導部材としては発光
ダイオード102間にも配されることから電気電導しな
いことが求められる。具体的には酸化銅、酸化銀が挙げ
られる。
(Filler 103) As the filler 103,
It is required that the light emitting diode 102, the housing 104, the substrate on which the light emitting diode is arranged, the light shielding member 101, and the like have good adhesion. In addition, the light emitting diode 102
Mechanical strength and weather resistance are required to protect the electric circuit connected to the. Specific examples of the filler 102 include epoxy resin, urethane resin, and silicone resin. Further, the filler 102 is provided on the display surface side of the LED display device. Therefore, a dye and / or a pigment such as dark brown or black may be contained in the filler for the purpose of improving the contrast. Further, a heat conductive member may be included in the filler for the purpose of radiating heat from the light emitting diode 102. Since the heat conducting member is also arranged between the light emitting diodes 102, it is required not to conduct electricity. Specific examples thereof include copper oxide and silver oxide.

【0022】(筐体104)本願発明に用いられる筐体
104としては、基板上にマトリックス状など所望の形
状に配置した各発光ダイオード102を外部から機械的
に保護する物であって、所望の大きさ及び形状に種々形
成させることができる。したがって、1つの筐体で1絵
素を構成しても多数の絵素を構成してもよい。筐体は発
光ダイオードに照射される外来光の影響を少なくさせる
ための遮光部材101と一体成形させても良いし、作業
性の観点から遮光部材101と筐体104とを別々に分
離して形成させ筐体104を設置した後に遮光部材10
1を合体させ生産性を向上させても良い。また、遮光部
材101の角度を種々に変更させ視認性を向上させるこ
とができる。さらに遮光部材101を筐体104と異な
る材質、例えば遮光部材を熱伝導率の高いアルミニウム
や銅などの金属、筐体をポリカーボネート樹脂などを用
いることによって発光ダイオードの放熱性を向上させ発
光特性を安定化させることもできる。
(Case 104) The case 104 used in the invention of the present application is one that mechanically protects each light emitting diode 102 arranged in a desired shape such as a matrix on a substrate from the outside and has a desired shape. It can be formed in various sizes and shapes. Therefore, one picture element may be constituted by one housing or a large number of picture elements may be constituted. The housing may be integrally formed with the light shielding member 101 for reducing the influence of external light applied to the light emitting diode, or the light shielding member 101 and the housing 104 may be separately formed from the viewpoint of workability. After installing the housing 104, the light blocking member 10
1 may be combined to improve productivity. Further, the angle of the light blocking member 101 can be changed variously to improve the visibility. Further, the light-shielding member 101 is made of a material different from that of the housing 104, for example, the light-shielding member is made of a metal having high thermal conductivity such as aluminum or copper, and the housing is made of a polycarbonate resin or the like to improve the heat dissipation of the light-emitting diode and stabilize the light-emitting characteristics. It can also be turned into.

【0023】筐体104は発光ダイオード102などか
らの熱の影響をうけるため、充填材103との密着性を
考慮して熱膨張率の小さい物が好ましい。筐体104の
内部表面は、エンボス加工させて接着面積を増やした
り、プラズマ処理して充填材103との密着性を向上さ
せることもできる。また、所望の形状に形成させること
から成形のしやすいものが望ましい。このような筐体1
04の材料として具体的には、ポリカーボネート樹脂、
ABS樹脂、エポキシ樹脂、フエノール樹脂等が好まし
い。
Since the housing 104 is affected by heat from the light emitting diode 102 and the like, it is preferable that the housing 104 has a small coefficient of thermal expansion in consideration of the adhesiveness with the filler 103. The inner surface of the housing 104 can be embossed to increase the adhesion area, or plasma-treated to improve the adhesion to the filler 103. In addition, it is desirable to use a material that is easy to mold because it is formed into a desired shape. Such a case 1
Specifically, as the material of 04, polycarbonate resin,
ABS resin, epoxy resin, phenol resin and the like are preferable.

【0024】(モールド部材201)本願発明に用いら
れるモールド部材201は、各LEDチップ203やそ
の電気的接続のための金属ワイヤー等を外部力や水分な
どから保護するために設けられる。また、本願発明に用
いられる着色剤と共に樹脂モールドに拡散剤を含有させ
ることができる。これによってLEDチップ203から
の指向性を緩和させ視野角を増やすこともできる。更
に、樹脂モールドを所望の形状にすることによってLE
Dチップ203が発光した光を集束させたり拡散させた
りするレンズ効果を持たせることができる。従って、樹
脂モールドは複数積層した構造でもよい。具体的には、
猫目形状、凸レンズ形状、凹レンズ形状やそれらを複数
組み合わせたものなどである。上記モールド部材201
の材料としては、エポキシ樹脂、ユリア樹脂などの耐候
性に優れた透明樹脂が好適に用いられる。また、拡散剤
としては、チタン酸バリウム、酸化チタン、酸化アルミ
ニウム、酸化珪素等が好適に用いられる。
(Molding Member 201) The molding member 201 used in the present invention is provided to protect the LED chips 203 and the metal wires for electrical connection thereof from external force and moisture. Further, the resin mold may contain a diffusing agent together with the colorant used in the present invention. This can reduce the directivity from the LED chip 203 and increase the viewing angle. In addition, the resin mold can be made into a desired shape by using LE
A lens effect of converging or diffusing the light emitted by the D chip 203 can be provided. Therefore, the resin mold may have a laminated structure. In particular,
It has a cat's eye shape, a convex lens shape, a concave lens shape, or a combination thereof. The mold member 201
As the material of (1), a transparent resin having excellent weather resistance such as epoxy resin and urea resin is preferably used. As the diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide and the like are preferably used.

【0025】本願発明に用いられる着色剤としては、モ
ールド部材に含有されLEDチップ203が発光した光
のうち所望外の波長をカットして発光特性を向上させる
フィルター効果を持たせるためのものである。したがっ
て、発光ダイオード102の発光色(発光光の主ピーク
である主発光波長)に応じて種々の染料及び顔料が種々
選択される。また、着色剤は、所望に応じてモールド部
材中に種々の割合で分散させて形成させても良い。すな
わち、LEDチップ203に近づくにつれ含有濃度を増
やしたり或いは減少させたり種々選択することができ
る。
The colorant used in the present invention is to have a filter effect for improving the light emission characteristics by cutting out an unwanted wavelength of the light emitted by the LED chip 203 contained in the mold member. . Therefore, various dyes and pigments are variously selected according to the emission color of the light emitting diode 102 (main emission wavelength which is the main peak of emitted light). Further, the colorant may be dispersed and formed at various ratios in the mold member as desired. That is, the content concentration can be increased or decreased as it approaches the LED chip 203, and various selections can be made.

【0026】着色剤のモールド部材への混入はモールド
部材201の原材料中に着色剤を混合撹拌などさせたの
ち、砲弾状など所望のモールド部材の形状に形成できる
型にLEDチップなどと共に入れ硬化させることによっ
て形成することができる。
To mix the colorant into the mold member, after mixing and stirring the colorant in the raw material of the mold member 201, the colorant is put into a mold that can be formed into a desired mold member shape such as a shell shape and is cured together with an LED chip or the like. Can be formed by

【0027】なお、本願発明の可視光透過率とは、着色
剤の可視光帯域における透過スペクトルの平均透過率の
ことである。この可視光透過率は、モールド部材に含有
させる着色剤及びその含有量によって変化する。
The visible light transmittance of the present invention is the average transmittance of the transmission spectrum of the colorant in the visible light band. The visible light transmittance changes depending on the colorant contained in the mold member and its content.

【0028】(駆動装置301)本願発明に用いられる
駆動装置301としては、点灯回路などを有し発光ダイ
オード102を複数個配置した本願発明のLED表示器
と電気的に接続されるものである。具体的には、駆動回
路からの出力パルスによってマトリックス状などに配置
したLED表示器を駆動する。駆動回路としては、入力
される表示データを一時的に記憶させるRAM(Ran
dom、Access、Memory)と、該RAMに
記憶されるデータから発光ダイオードを所定の明るさに
点灯させるための階調信号を演算する階調制御回路と、
階調制御回路の出力信号でスイッチングされて、発光ダ
イオード102を点灯させるドライバーとを備える。階
調制御回路は、RAMに記憶されるデータから発光ダイ
オード102の点灯時間を演算してパルス信号を出力す
る。階調制御回路から出力されるパルス信号である階調
信号は、発光ダイオード102のドライバーに入力され
てドライバをスイッチングさせる。ドライバーがオンに
なると発光ダイオードが点灯され、オフになると消灯さ
れる。以下、本願発明の具体的実施例について説明する
が、本願発明はこれのみに限定されるものではないこと
は言うまでもない。
(Driving Device 301) The driving device 301 used in the present invention is a device that has a lighting circuit and the like and is electrically connected to the LED display of the present invention in which a plurality of light emitting diodes 102 are arranged. Specifically, an LED display arranged in a matrix or the like is driven by an output pulse from a driving circuit. As the drive circuit, a RAM (Ran) that temporarily stores input display data is used.
Dom, Access, Memory), and a gradation control circuit that calculates a gradation signal for lighting the light emitting diode to a predetermined brightness from the data stored in the RAM.
A driver for switching on the output signal of the gradation control circuit to turn on the light emitting diode 102 is provided. The gradation control circuit calculates the lighting time of the light emitting diode 102 from the data stored in the RAM and outputs a pulse signal. A gradation signal which is a pulse signal output from the gradation control circuit is input to the driver of the light emitting diode 102 to switch the driver. The light emitting diode is turned on when the driver is turned on, and is turned off when the driver is turned off. Hereinafter, specific examples of the present invention will be described, but it goes without saying that the present invention is not limited to these.

【0029】[実施例1]RGBが発光可能な発光素子
として各LEDチップをそれぞれ形成させる。具体的に
はR(赤色)が発光可能なLEDチップとしてP型Ga
As基板上に温度差液晶成長法を用いてP型及びN型の
GaAlAsを形成させた後、電極を形成し660nm
の発光波長を有するLEDチップを形成させた。一方、
G(緑色)が発光可能なLEDチップとしてサファイヤ
基板上にMOCVD法を用いてSiドープのInGaN
を半導体発光層として形成させた後、電極を形成し52
5nmの発光波長を有するLEDチップを形成させた。
同様に、B(青色)が発光可能なLEDチップとしてサ
ファイヤ基板上にMOCVD法を用いてSiの含有量を
変えたSiドープのInGaNを半導体発光層として形
成させた後、電極を形成し470nmの発光波長を有す
るLEDチップを形成させた。これらのLEDチップを
それぞれのリードフレームと金線を用いてワイヤーボン
ディングし電気的に接続させた。
[Embodiment 1] Each LED chip is formed as a light emitting element capable of emitting RGB light. Specifically, P-type Ga is used as an LED chip capable of emitting R (red) light.
After forming P-type and N-type GaAlAs on the As substrate using the temperature difference liquid crystal growth method, an electrode was formed and 660 nm was formed.
An LED chip having an emission wavelength of was formed. on the other hand,
As an LED chip capable of emitting G (green) light, a Si-doped InGaN is formed on a sapphire substrate by MOCVD.
Is formed as a semiconductor light emitting layer, and then an electrode is formed.
An LED chip having an emission wavelength of 5 nm was formed.
Similarly, as an LED chip capable of emitting B (blue), Si-doped InGaN having a different Si content was formed as a semiconductor light emitting layer on a sapphire substrate by using a MOCVD method, and then an electrode was formed to form an electrode having a thickness of 470 nm. An LED chip having an emission wavelength was formed. These LED chips were electrically connected by wire bonding using respective lead frames and gold wires.

【0030】次に、これらを各LEDチップごとにキャ
スティングケース内に挿入固定しR、G、Bそれぞれの
着色剤含有量を変えて混合撹拌させたエポキシ樹脂をキ
ャスティングケースの中にそれぞれ流し込み硬化させの
ち、取り出して発光ダイオードを形成させた。なお、左
右あるいは上下からの混色性を考慮して発光ダイオード
のモールド樹脂は正面から見て楕円形に形成してある。
RGBそれぞれの可視光透過率の平均はR=44%、G
=35%、B=71%である。
Next, these LED chips are inserted and fixed into the casting case for each LED chip, and epoxy resins mixed and stirred while changing the contents of the colorants of R, G and B are poured into the casting case and cured. After that, it was taken out to form a light emitting diode. The molding resin of the light emitting diode is formed in an elliptical shape when viewed from the front in consideration of color mixing from the left and right or from the top and bottom.
The average of visible light transmittance of each RGB is R = 44%, G
= 35% and B = 71%.

【0031】このRGBそれぞれの発光ダイオードの混
色性が高まるよう近接させて図1(A)の如く正三角形
の頂点の位置にそれぞれの発光ダイオードをプリント基
板上に配置した。エポキシ樹脂によって形成された遮光
部材と一体のきょう体内部に発光ダイオードが配置され
たプリント基板を挿入固定させた。次に耐候性向上のた
めに発光ダイオードの発光先端部を除いてきょう体内部
にシリコンゴムを充填させ、120℃、5時間で硬化し
LED表示器を構成させた。このLED表示器を駆動回
路と電気的に接続させ図3に示したLED表示装置を形
成させた。
The respective light emitting diodes of the RGB light emitting diodes are arranged close to each other so as to enhance the color mixing property, and the light emitting diodes are arranged on the printed circuit board at the positions of the vertices of the equilateral triangle as shown in FIG. 1 (A). A printed circuit board on which a light emitting diode was arranged was inserted and fixed inside a housing integrated with a light shielding member made of epoxy resin. Next, in order to improve the weather resistance, silicone rubber was filled inside the casing excluding the light emitting tip of the light emitting diode and cured at 120 ° C. for 5 hours to form an LED display. The LED display was electrically connected to a drive circuit to form the LED display device shown in FIG.

【0032】LED表示装置、発光光源401及び光計
測機器402を図4の如く配置し、発光光源401であ
るハロゲンランプ(200W)を10mの距離からLE
D表示装置に照射すると共にハロゲンランプを移動させ
つつ光計測機器(TOPUKON社製BMー7)で色度
・輝度・コントラストを測定した。角度90度即ち、L
ED表示装置に発光光源401からの光が垂直に入射し
たときのLED表示装置の平均値がx・y色度図(Ke
ll Chart)において白色時(x=0.31、y
=0.31)の輝度を及び消費電力を測定した。
The LED display device, the light emitting light source 401 and the optical measuring device 402 are arranged as shown in FIG. 4, and the halogen lamp (200 W) which is the light emitting light source 401 is LE from a distance of 10 m.
While illuminating the D display device and moving the halogen lamp, the chromaticity, brightness, and contrast were measured with an optical measuring device (BM-7 manufactured by TOPUKON). 90 degree angle, that is, L
The average value of the LED display device when the light from the light emitting source 401 is vertically incident on the ED display device is the xy chromaticity diagram (Ke).
ll Chart) when white (x = 0.31, y
= 0.31) and the power consumption were measured.

【0033】この時の消費電力は、約20Wであった。
LED表示装置を消灯させて同様に測定した場合、a*
b*マクロ図において(a*=0.3、b*=0.3、
c*=200cd/m2)であった。次に発光光源を0
度から90度まで徐々に移動させた。移動角45度まで
は遮光部材により発光ダイオード全てが陰になってお
り、黒く見えた。さらに、移動角が約70度まではほぼ
同様の色度を有していた。移動角が73度を越えBの発
光ダイオードに光が照射されて初めてコントラストの低
下と共に色度が大きく変化した。
The power consumption at this time was about 20 W.
When the LED display is turned off and the same measurement is performed, a *
In the b * macro diagram (a * = 0.3, b * = 0.3,
c * = 200 cd / m 2 ). Next, set the emission light source to 0
It was gradually moved from 90 degrees to 90 degrees. Up to a moving angle of 45 degrees, all of the light emitting diodes were shaded by the light shielding member and looked black. Further, it had almost the same chromaticity up to a moving angle of about 70 degrees. Only when the light-emitting diode of B having a movement angle of more than 73 degrees was irradiated with light, the contrast decreased and the chromaticity changed significantly.

【0034】[比較例1]発光ダイオードを配置した基
板と遮光部材を有する筐体の取り付けを実施例1と逆に
し遮光部材に近い側をR、Gとした以外は実施例1と同
様にしてLED表示器及びLED表示装置を形成させ
た。このLED表示装置を実施例1と同様にして測定し
た。発光時の消費電力は、実施例1と同様であった。移
動角が45度までは、実施例1と同様に遮光部材が陰を
形成し同様の色度であったが、45度を越えBの発光ダ
イオードに光が照射されると青白っぽく見え実施例1の
同角度と比較してコントラストが約17%低下した。
[Comparative Example 1] The same procedure as in Example 1 was carried out except that the substrate having the light emitting diode and the casing having the light shielding member were attached in the opposite manner to Example 1 except that the side closer to the light shielding member was set to R and G. An LED indicator and an LED display device were formed. This LED display device was measured in the same manner as in Example 1. The power consumption during light emission was the same as in Example 1. Up to a movement angle of 45 degrees, the shading member formed a shade and had the same chromaticity as in Example 1, but when it exceeded 45 degrees and the light emitting diode of B was irradiated with light, it looked bluish. Compared to the same angle of 1, the contrast was reduced by about 17%.

【0035】以上の結果より本願発明は発光特性を維持
しつつ比較例と比較して明らかに外来光の移動による視
認性低下を大幅に低減しコントラストの優れたLED表
示装置とすることができる。
From the above results, according to the present invention, it is possible to provide an LED display device which has an excellent contrast by significantly reducing the deterioration of visibility due to the movement of external light while maintaining the light emission characteristics, as compared with the comparative example.

【0036】[0036]

【発明の効果】本願発明のLED表示器及びそれを用い
た表示装置は、発光特性を維持させつつ、色バランスの
優れたLED表示器及びそれを用いた表示装置を提供す
ることができる。具体的には、本願発明の請求項1の構
成とすることによりLED表示器の発光時の発光効率や
色バランスなどの特性を維持しつつ、光の部分的な照射
時においてもよりコントラストなどの視認性に優れたL
ED表示器とすることができる。特に遮光部材による視
野角が狭くなるのを防止つつコントラストの向上を図る
ことができる。
The LED display device and the display device using the same according to the present invention can provide an LED display device excellent in color balance and a display device using the same while maintaining the light emission characteristics. Specifically, by adopting the constitution of claim 1 of the present invention, while maintaining characteristics such as light emission efficiency and color balance at the time of light emission of the LED display, it is possible to improve contrast even at the time of partial irradiation of light. L with excellent visibility
It can be an ED display. In particular, it is possible to improve the contrast while preventing the viewing angle from being narrowed by the light shielding member.

【0037】本願発明の請求項2の構成とすることによ
りLED表示器の発光時の発光効率や色バランスなどの
特性を維持しつつ、野外など外来光の部分的な照射時に
おいてもよりコントラストなどの視認性に優れたLED
表示器とすることができる。特に遮光部材による視野角
が狭くなるのを防止つつコントラストの向上を図ること
ができる。
With the configuration of claim 2 of the present invention, while maintaining the characteristics such as the luminous efficiency and the color balance when the LED display emits light, the contrast and the like can be improved even when the external light is partially irradiated such as outdoors. LED with excellent visibility
It can be an indicator. In particular, it is possible to improve the contrast while preventing the viewing angle from being narrowed by the light shielding member.

【0038】本願発明の請求項3の構成とすることによ
り外来光の照射によっても発光ダイオードの発光効率及
び特性を維持しつつコントラストなどの視認性に優れた
フルカラーLED表示器とすることができる。
With the configuration of claim 3 of the present invention, it is possible to provide a full-color LED display which is excellent in visibility such as contrast while maintaining the light emission efficiency and characteristics of the light emitting diode even when irradiated with external light.

【0039】本願発明の請求項4の構成とすることによ
って、発光ダイオードの発光効率及び発光特性を維持し
つつコントラストなどの視認性に優れたLED表示装置
とすることができる。
With the structure according to claim 4 of the present invention, it is possible to provide an LED display device excellent in visibility such as contrast while maintaining the light emission efficiency and light emission characteristics of the light emitting diode.

【図面の簡単な説明】[Brief description of drawings]

【図1】本願発明のLED表示器の概略平面図である。FIG. 1 is a schematic plan view of an LED display device of the present invention.

【図2】本願発明に用いられる発光ダイオードの概略断
面図である。
FIG. 2 is a schematic sectional view of a light emitting diode used in the present invention.

【図3】本願発明のLED表示装置の概略斜視図であ
る。
FIG. 3 is a schematic perspective view of an LED display device of the present invention.

【図4】発光ダイオードの特定配置によるコントラスト
を測定する測定方法を示した模式的断面図である。
FIG. 4 is a schematic cross-sectional view showing a measuring method for measuring contrast according to a specific arrangement of light emitting diodes.

【図5】本願発明に用いられるRGBそれぞれの着色剤
の可視光透過率である。
FIG. 5 is the visible light transmittance of each of the RGB colorants used in the present invention.

【符号の説明】[Explanation of symbols]

101・・・遮光部材 102・・・発光ダイオード 103・・・充填材 104・・・筐体 201・・・着色剤が含有されたモールド部材 202・・・電気的接続部材 203・・・LEDチップ 204・・・リード端子 301・・・駆動回路 401・・・光源 402・・・光測定装置 101 ... Shading member 102 ... Light emitting diode 103 ... Filling material 104 ... Housing 201 ... Mold member containing colorant 202 ... Electrical connection member 203 ... LED chip 204 ... Lead terminal 301 ... Driving circuit 401 ... Light source 402 ... Optical measuring device

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】第1のLEDチップと該第1のLEDチッ
プが発光した光に対してフィルターとして作用する第1
の着色剤が含有されたモールド部材とを有する第1の発
光ダイオードと、前記第1のLEDチップが発光した光
の主発光波長よりも短波長側で主発光波長を発光する第
2のLEDチップと該第2のLEDチップが発光した光
に対しフィルターとして作用する第2の着色剤が含有さ
れたモールド部材とを有する第2の発光ダイオードと、
前記第2のLEDチップが発光した光の主発光波長より
も短波長側で主発光波長を発光する第3のLEDチップ
と該第3のLEDチップが発光した光に対しフィルター
として作用する第3の着色剤が含有されたモールド部材
とを有する第3の発光ダイオードと、を基板上に配し、 前記第1及び第2の着色剤が第3の着色剤よりも可視光
の透過率が少なく且つ、前記第3の発光ダイオードが前
記第1及び第2の発光ダイオードよりも遮光率の高い位
置に設けられていることを特徴とするLED表示器。
1. A first LED chip and a first LED chip which acts as a filter for the light emitted by the first LED chip.
And a second LED chip that emits a main light emission wavelength on a shorter wavelength side than the main light emission wavelength of the light emitted by the first LED chip. And a second light emitting diode having a mold member containing a second colorant that acts as a filter for the light emitted by the second LED chip,
A third LED chip emitting a main emission wavelength on a shorter wavelength side than a main emission wavelength of the light emitted by the second LED chip and a third LED chip acting as a filter for the light emitted by the third LED chip. A third light emitting diode having a mold member containing the colorant of No. 3, and the first and second colorants have a visible light transmittance lower than that of the third colorant. Further, the LED display is characterized in that the third light emitting diode is provided at a position having a higher light blocking rate than the first and second light emitting diodes.
【請求項2】第1のLEDチップと該第1のLEDチッ
プが発光した光に対してフィルターとして作用する第1
の着色剤が含有されたモールド部材とを有する第1の発
光ダイオードと、前記第1のLEDチップが発光した光
の主発光波長よりも短波長側で主発光波長を発光する第
2のLEDチップと該第2のLEDチップが発光した光
に対しフィルターとして作用する第2の着色剤が含有さ
れたモールド部材とを有する第2の発光ダイオードと、
前記第2のLEDチップが発光した光の主発光波長より
も短波長側で主発光波長を発光する第3のLEDチップ
と該第3のLEDチップが発光した光に対しフィルター
として作用する第3の着色剤が含有されたモールド部材
とを有する第3の発光ダイオードと、を基板上に配し、
該基板が遮光部材を有する筐体で覆われると共に前記第
1、第2及び第3の発光ダイオードの少なくとも一部と
前記筐体とを充填材で充填し、前記第1及び第2の着色
剤が第3の着色剤よりも可視光の透過率が少なく且つ、
前記第3の発光ダイオードが前記第1及び第2の発光ダ
イオードよりも遮光部材側に設けられていることを特徴
とするLED表示器。
2. A first LED chip and a first LED chip which acts as a filter for the light emitted from the first LED chip.
And a second LED chip that emits a main light emission wavelength on a shorter wavelength side than the main light emission wavelength of the light emitted by the first LED chip. And a second light emitting diode having a mold member containing a second colorant that acts as a filter for the light emitted by the second LED chip,
A third LED chip emitting a main emission wavelength on a shorter wavelength side than a main emission wavelength of the light emitted by the second LED chip and a third LED chip acting as a filter for the light emitted by the third LED chip. A third light emitting diode having a mold member containing the colorant of
The substrate is covered with a casing having a light shielding member, and at least a part of the first, second and third light emitting diodes and the casing are filled with a filler, and the first and second colorants are provided. Has less visible light transmittance than the third colorant, and
An LED display, wherein the third light emitting diode is provided closer to the light shielding member than the first and second light emitting diodes.
【請求項3】前記第1のLEDチップが発光する光が6
00nmから700nmの範囲内にあり、前記第2のL
EDチップが発光する光が495nmから565nmの
範囲内にあり、前記第3のLEDチップが発光する光が
430nmから490nmの範囲内にある請求項2記載
のLED表示器。
3. The light emitted from the first LED chip is 6
In the range of 00 nm to 700 nm, and the second L
The LED display according to claim 2, wherein the light emitted by the ED chip is in the range of 495 nm to 565 nm, and the light emitted by the third LED chip is in the range of 430 nm to 490 nm.
【請求項4】請求項2記載のLED表示器と、該LED
表示器と電気的に接続された駆動回路と、を有する表示
装置。
4. The LED display according to claim 2, and the LED.
A display device, comprising: a driving circuit electrically connected to the display.
JP9229396A 1996-04-15 1996-04-15 LED display and display device using the same Expired - Lifetime JP3233335B2 (en)

Priority Applications (1)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1109147A1 (en) * 1999-12-17 2001-06-20 Nokia Mobile Phones Ltd. System for colour illumination of a display
JP2002232014A (en) * 2001-02-05 2002-08-16 Seiwa Electric Mfg Co Ltd Light emitting diode lamp
JP2014107464A (en) * 2012-11-29 2014-06-09 Mitsubishi Electric Corp Display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1109147A1 (en) * 1999-12-17 2001-06-20 Nokia Mobile Phones Ltd. System for colour illumination of a display
JP2002232014A (en) * 2001-02-05 2002-08-16 Seiwa Electric Mfg Co Ltd Light emitting diode lamp
JP2014107464A (en) * 2012-11-29 2014-06-09 Mitsubishi Electric Corp Display device

Also Published As

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