JPH09281352A - Formation of opto-electric transmission path and opto-electric wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming novel opto-electric transmission paths by optically and electrically connecting the opto-electric transmission paths, optical transmission paths, opto-electric elements, optical elements, etc., to each other with good coupling efficiency by a simple method and an opto- electric wiring board having overall efficiency. SOLUTION: This wiring board is formed by preparing two sheets of substrates 11, 11' forming respective core layers 12, 12' having optical junctures 16, 16' bearing incidence-exit of light on the respective substrates 11, 11', forming respective conductive layer 13, 13' stuck by adhesives 14, 14' consisting of material acting as clads to the respective core layers 12, 12' onto the substrates 11, 11', forming conductive projections 15 for electrical connection on the conductive layers 13 and sticking the substrates 11, 11' in such a manner that the optical junctures 16, 16' are optically connected to each other and that the respective conductive layers 13, 13' electrically connected to each other via the projections 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optoelectronic transmission line, an optical transmission line, an optoelectronic element, an optical element and the like which are optically and electrically connected to each other to form a new optoelectronic transmission line. The present invention relates to a method of forming a path and an optoelectronic wiring board formed by the method.

[0002]

2. Description of the Related Art Generally, an optical element such as a prism or a diffraction grating and a photoelectric element such as a laser diode or a photodiode are mounted on an optical circuit board or an optoelectronic wiring board to optically couple the optical element and the photoelectric element. Is performed by an optical fiber, an optical transmission line, or a combination of these two. In order to maximize the coupling efficiency of the optical element and the optical fiber or the optical transmission line as an optical circuit, it is necessary to accurately align the optical element and the optical fiber or the optical transmission line. It is also necessary to supply electric power and electric signals to the photoelectric device.

Conventionally, as a method of accurately aligning and mounting an optical element on an optical circuit board, for example, "" AuSn is used.
Self-aligned mounting of optical elements by bump bonding ”,
IEICE Technical Report, OQE93-145 (19
93-12) ", a self-alignment method utilizing the surface tension of molten solder is widely known. This method is used for bumps such as AuSn on a wiring pattern formed on an optical circuit board. (Solder ball) is placed, the wiring pattern of the substrate equipped with the optical element to be bonded is superposed on the bump, and the bump is heated and melted. The positional displacement between the substrates is corrected by the manual movement so that the two substrates are automatically aligned.

This method has the advantage that the bumps used for alignment can be used to supply power to the substrate and transmit electrical signals, but on the other hand, this method uses bumps. If the accuracy of the position is low, the light coupling efficiency of the two substrates may be reduced, and the flux for soldering tends to adhere to the optical element, and the surface of the optical element may be contaminated by the flux to couple the light. There is a problem that efficiency is likely to be lowered.

As another conventional technique, for example, in Japanese Unexamined Patent Publication No. 6-13601, a plurality of cavities for fitting optical elements are provided on the surface of an electronic substrate, and the optical elements to be fitted in the cavities are separated from each other. A method of forming an optical signal distribution system is disclosed which forms an alignment carrier structure having optical waveguides for connection. According to this method, since the space into which the optical element is fitted is accurately positioned in advance, there is no need for a positioning operation when fitting the optical element, and there is an advantage that the optical element can be easily attached and detached. Further, in this system, not only the distribution of optical signals but also the supply of electric power and electric signals can be performed on the electronic substrate.

However, according to this method, it is necessary to accurately position the cavities for fitting the optical elements and the optical waveguides connecting these cavities and then dispose them on the substrate.
The structure is complicated, and it is difficult to manufacture the alignment carrier structure with high accuracy. Further, this alignment carrier structure is easy to apply to an element of a type that receives and emits light at the end face because of its structure, but is difficult to apply to an element that receives and emits light at other than the end face such as a surface emitting laser. There is also.

[0007]

SUMMARY OF THE INVENTION In view of the above-mentioned circumstances, the present invention provides a simple method for efficiently coupling optical and electrical transmission lines, optical transmission lines, photoelectric elements, optical elements and the like with each other. It is an object of the present invention to provide a method for forming an opto-electrical transmission line that is connected to a substrate to form a new opto-electrical transmission line, and an opto-electrical wiring board with good coupling efficiency.

[0008]

The first method for forming an opto-electrical transmission line of the present invention which achieves the above-mentioned object, forms a core layer to be a transmission line of light, and acts as a clad for the core layer. Two substrates are prepared, and each of the two substrates has an optical connection part that extends in each predetermined direction and is provided at a position corresponding to each other for at least one of incidence and emission of light. Step of forming each core layer, and acting as a clad for each core layer along the upper surface of each core layer and each predetermined path on the surface of each of the two substrates on which the core layers are formed. The step of forming each conductive layer adhered by an adhesive made of a material for forming the conductive layer, and the conductive layers on the two substrates are mutually connected to at least one of the conductive layers formed on the two substrates. Conductive to electrically connect to And the step of forming the protrusions of the two substrates and the optical connection portions of the two substrates are optically connected to each other, and the conductive layers of the two substrates are electrically connected to each other through the protrusions. And a step of bonding these two substrates together as described above.

A second aspect of the present invention that achieves the above object.
In the method of forming an opto-electrical transmission line, a first substrate on which a core layer to be a light transmission line is formed and which acts as a clad for the core layer is prepared, and a predetermined direction is provided on the first substrate. Forming a core layer having an optical connection portion that extends at least to one of the entrance and the exit of light, and the core layer on the surface of the first substrate on which the core layer is formed. Forming a first conductive layer adhered by an adhesive made of a material acting as a clad to the core layer along the upper surface of the second substrate and a predetermined path; A light emitting element for emitting light incident on the optical connecting portion and a light receiving element for emitting light emitted from the optical connecting portion at a position of the substrate corresponding to the optical connecting portion of the core layer formed on the first substrate. If at least one of the light-receiving elements responsible for In a step of forming a second conductive layer along a predetermined path on the second substrate, at least one of said first conductive layer and the second conductive layer, first
The step of forming a conductive protrusion for electrically connecting the conductive layer and the second conductive layer, the optical connection portion and the element are optically connected, and the first conductive layer and The method further comprises the step of bonding the first substrate and the second substrate so that the second conductive layer is electrically connected via the protrusion.

Here, the first conductive layer is formed so as to surround the optical connection portion, the second conductive layer is formed so as to surround the element, and the protrusion is further formed. The protrusion may be formed so as to surround the optical connection portion and the element when the first substrate and the second substrate are bonded together. Further, the first opto-electrical wiring board of the present invention that achieves the above object acts as a clad for the core layer in which the core layer that serves as a light transmission path is formed.
Each of the cores is provided with two substrates, each of which has an optical connection portion that extends in a predetermined direction and that has an optical connection portion that performs at least one of incidence and emission of light at a position corresponding to each other. A step of forming layers, and a material acting as a clad for each core layer along the upper surface of each core layer and each predetermined path on the surface of the two substrates on which the core layers are formed. Forming a conductive layer adhered with an adhesive consisting of, and at least one of the conductive layers formed on the two substrates is electrically connected to each other. The step of forming conductive protrusions for electrically connecting the two optical substrates, the optical connecting portions on the two substrates are optically connected, and the conductive layers on the two substrates are connected to each other. To be electrically connected through the protrusion And characterized in that formed through a step of bonding two substrates.

A second aspect of the present invention that achieves the above object.
The opto-electrical wiring board is provided with a core layer that serves as a light transmission path, and acts as a clad for the core layer.
Preparing a substrate, and forming a core layer on the first substrate, the core layer extending in a predetermined direction and having an optical connection portion that takes at least one of incidence and emission of light; On the side on which the core layer is formed, along the upper surface of the core layer and a predetermined path, and is attached by an adhesive made of a material that acts as a clad for the core layer.
And the step of forming the conductive layer, and the second substrate is prepared, and the optical connection part is provided at a position of the second substrate corresponding to the optical connection part of the core layer formed on the first substrate. At least one of a light emitting element that emits light incident on the substrate and a light receiving element that receives light emitted from the optical connecting portion is arranged, and the light emitting element is provided along a predetermined path on the second substrate. Forming a second conductive layer, and forming a first conductive layer and a second conductive layer on at least one of the first conductive layer and the second conductive layer.
A step of forming a conductive protrusion for electrically connecting the conductive layers, the optical connection portion and the element are optically connected, and the first conductive layer and the second conductive layer are formed. Is formed through a step of bonding the first substrate and the second substrate so as to be electrically connected via the protrusion.

The third aspect of the present invention which achieves the above object.
In the method for forming an opto-electrical transmission line, the two layers of the substrate on which a core layer to be the optical transmission line is formed and which act as a clad for the core layer are prepared. A step of forming core layers each having an optical connection portion that extends in the direction and that corresponds to at least one of the incidence and the emission of light at positions corresponding to each other, and the core layers of the two substrates are On the surface of the formed side,
The step of forming each clad layer made of a material that acts as a clad for each core layer so as to surround the optical connection part, and at least one of the clad layers formed on the two substrates, When the two substrates are bonded together, the step of forming a protrusion surrounding the optical coupling portion between the optical connecting portions of these two substrates, and the step of optically connecting the optical connecting portions on the two substrates optically And connecting these two substrates so that the optical coupling portions on the two substrates are optically shielded from the outside by the protrusions while being connected.

The fourth aspect of the present invention which achieves the above object.
In the method for forming an opto-electrical transmission line, a first substrate is formed on which a core layer to be a light transmission line is formed, which acts as a clad for the core layer, and a predetermined direction is provided on the first substrate. Forming a core layer having an optical connection part that extends into the core and has at least one of incidence and emission of light; and the core on the surface of the first substrate on which the core layer is formed. Forming a first clad layer of a material that acts as a clad for the layer, and preparing a second substrate, the light of the core layer of the second substrate being formed on the first substrate. At least one of a light emitting element for emitting the light incident on the optical connecting portion and a light receiving element for receiving the light emitted from the optical connecting portion is arranged at a position corresponding to the connecting portion, and the second element is provided. Of forming a second cladding layer on the substrate of , To at least one of the first cladding layer and said second cladding layer, when the first substrate and the second substrate is bonded, said first
Forming a protrusion surrounding an optical coupling part of the optical connection part of the substrate of the second substrate and one of the light emitting element and the light receiving element of the second substrate; A step of adhering the first substrate and the second substrate so that the element is optically connected and the optical coupling portion is optically shielded from the outside by the protrusion. Characterize.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. FIG. 1 is a process diagram showing a first half of a process of forming a first substrate in an embodiment of a method for forming a first optoelectronic transmission line of the present invention, and FIG. FIG. 6B is a process diagram showing a latter half of the process of forming the first substrate in the embodiment of the method for forming the optoelectronic transmission line of FIG.

Below, referring to FIG. 1 and FIG.
The process of forming the substrate will be described. First, a substrate 11 which also functions as a clad layer of an optical transmission line is prepared (FIG. 1A), and a groove 11a for forming a core layer which becomes an optical transmission line is formed on the substrate 11 by an isotropic etching method. Are formed (FIG. 1B). Next, the core layer material is poured into the groove 11a to form the core layer 12 (FIG. 1C). Core layer 12
Is formed in a shape that is curved to the right in the drawing starting from an optical connection portion 16 that is responsible for the incidence or emission of light, which will be described later, and then extends further to the right. Next, the core layer 12 of the substrate 11
An adhesive is applied to the upper surface of the core layer 12 on the surface on which the conductive layer 13 is formed, and a metal film is further attached thereon to form the conductive layer 13. This metal film is formed in a pattern corresponding to the electric wiring path formed on the substrate 11,
By sticking this metal film on the substrate 11, the conductive layer 13 is formed along the path of the desired electric wiring.
As the adhesive, the formed adhesive layer 14 is the core layer 12.
Using a material that acts as a cladding for
(D)). Next, the resist 10 is applied on the conductive layer 13 and anisotropic etching is performed to remove the conductive layer 13 and the adhesive layer 14 where the conductive layer 13 is unnecessary and where optical connection is made (see FIG. 1 (e) and FIG. 1 (f)). next,
Hole 10a formed by anisotropic etching (see FIG.
In (f), an optical connection portion 16 made of the same material as the core layer 12 is formed by a CVD method (Chemical Vapor D).
growth by using the Eposition method),
The resist 10 is peeled off, and the formed optical connection portion 16 is heated to be shaped into a lens-shaped optical connection portion 16 (FIG. 2A). Further, a resist 10 is applied on the conductive layer 13 and a hole 10b for forming a bump is opened (FIG. 2B), and then a bump 15 is grown in the hole 10b by a metal plating method (FIG. 2B). 2 (c)). Next, the resist 10 is peeled off, and the bumps 15 are heated to shape the bumps 15 into a hemispherical shape (FIG. 2D). In this way, the first substrate for forming a new optoelectronic transmission line is completed.

Next, a process of forming a new optoelectronic transmission line by bonding this first substrate to another substrate will be described. FIG. 3 is an explanatory diagram of a process of forming a new optoelectronic transmission line by bonding the first substrate formed by the above embodiment to another substrate. On the first substrate 11 shown in FIG. 2 (d), as shown in FIG. 3 (a), the core layer 12 'is provided on the substrate 11',
The second substrate 11 ′ on which the adhesive layer 14 ′, the conductive layer 13 ′, and the electrode 17 are formed is placed, and the electrode 17 of the second substrate 11 ′ and the bump 15 of the first substrate 11 are aligned with each other. . Next, TA, which is one of the LSI packaging technologies
B (Tape Automated Bonding)
These two substrates 11 and 11 'are pressure-bonded to each other by a technique. The electrode 17 of the second substrate 11 'is formed by the TAB technique.
And the bumps 15 of the first substrate 11 are firmly bonded at the molecular level. In this way, as shown in FIG. 3B, the opto-electrical wiring board 10 for forming a new opto-electrical transmission line is formed.
0 is completed. In this way, the two substrates 11 and 11 ′ are pressure-bonded to each other by the TAB technique, so that the optical connecting portions 16 formed at the tips of the core layers 12 and 12 ′ of the two substrates 11 and 11 ′ are joined together. , 16 'and lenses 16a, 16
The a's are automatically aligned with each other. The bump 15 and the electrode 17 are firmly bonded and integrated at the molecular level by the TAB technique, and the conductive layers 13 and 13 'on the two substrates 11 and 11' are connected to each other by the bump 15 and the electrode 17.
Are electrically connected to each other via two substrates 11,
The core layers 12 and 12 ′ formed on 11 ′ are optically connected to each other to form the optoelectronic wiring board 100.

Next, another embodiment using a method different from the method for forming the first substrate shown in FIGS. 1 and 2 will be described. FIG. 4 is a process diagram showing the first half of the process of forming the second substrate in another embodiment of the first optical / electrical transmission line forming method of the present invention, and FIG. FIG. 8 is a process diagram showing a second half of the process of forming the second substrate in the other embodiment of the method of forming the optical-electrical transmission line of No. 1.

The second part will be described below with reference to FIGS. 4 and 5.
The process of forming the substrate will be described. 4 (a) to 4
1 (a) to FIG. 1 (f) are merely upside down, and the description is omitted because they are essentially the same process. In FIG. 5A, FIG. 4A to FIG.
The 2nd board | substrate 21 manufactured by the process shown to (f) is shown. A lens 26 a formed on the core layer 22, the adhesive layer 24, the conductive layer 23, and the optical connection portion 26 is formed on the surface of the second substrate 21. Next, a third substrate is prepared separately from the second substrate 21. That is, as shown in FIG. 5A, first, the glass-made third
The electrode 38 is formed on the surface of the substrate 31 of FIG. 3, the resist 10 is applied on the electrode 38 and the third substrate 31, and then the holes 10 a and 10 b are formed in the resist 10 applied on the electrode 38. A metal layer is grown in 10a and 10b by metal plating to form conductive protrusions 35 (FIG. 5).
(B)). Next, the protrusions 35 and the conductive layer 23 are firmly bonded at the molecular level by pressing the third substrate 31 and the above-mentioned second substrate 21 by the TAB technique. Protrusion 3
5 is attached to the conductive layer 23, and then the third substrate 31 is
The protrusion 35 is transferred to the second substrate 21 by peeling it from the substrate 21 (FIG. 5C). At the time of this peeling, since the adhesion area between the protrusion 35 and the conductive layer 23 is larger than the adhesion area between the protrusion 35 and the electrode 38, the adhesion surface between the protrusion 35 and the conductive layer 23 is not separated and the protrusion 35 Is peeled off at the bonding surface between the electrode 38 and the electrode 38. In this way, the second substrate 21 for forming a new optoelectronic transmission line is completed.

By bonding this second substrate to another substrate, a new opto-electrical transmission line can be formed. The structure of the opto-electrical wiring board formed as a result is almost the same as the structure of the opto-electrical wiring board (see FIG. 3) formed from the above-mentioned first substrate 11 (see FIGS. 1 and 2), and therefore is described. Is omitted. Next, an embodiment of the second method for forming an optoelectronic transmission line of the present invention will be described.

FIG. 6 is a schematic view showing the structure of the first substrate in one embodiment of the method for forming the second optoelectronic transmission line of the present invention, and FIG. 7 is the first diagram shown in FIG. Substrate, second
FIG. 3 is a schematic view showing a structure of an optoelectronic wiring substrate formed by bonding the same to the substrate of FIG. The structure of the first substrate 41 shown in FIG. 6 is similar to that of the second substrate shown in FIG.
The structure is the same as that of the substrate 21. That is, the substrate 41 acting as a clad of the light transmission path, the core layer 42 serving as the light transmission path having the optical connection portion 46 for inputting or emitting the light, and the side of the substrate 41 on which the core layer 42 is formed. An adhesive layer 44 made of a material which acts as a clad for the core layer 42 formed on the surface of the conductive layer 43, a conductive layer 43 formed on the adhesive layer 44 along the path of the electric wiring, and the conductive layer 43.
The conductive layer 43 is formed on the conductive projections 45 for electrically connecting the conductive layer 43 to the conductive layer of the connection partner. A convex lens-shaped lens 46a is formed at the tip of the optical connecting portion 46 of the core layer 42 in order to enhance the efficiency of light incidence or emission.

FIG. 7 shows the second substrate 49 connected to the first substrate 41 shown in FIG. 6 in the lower part of the drawing. The second substrate 49 is provided with a laser diode 47 and an electrode 48. The laser diode 47 is installed in a recess 49a formed in the surface layer of the second substrate 49, and its output is connected to an electronic circuit (not shown) provided on the second substrate 49. The electrode 48 is formed on the second substrate 49, and an electric signal input / output via the electrode 48 is connected to an electronic circuit (not shown) provided on the second substrate 49.

The first substrate 41 described above is placed on the second substrate 49, and the electrodes 48 of the second substrate 49 and the conductive protrusions 45 of the first substrate 41 are accurately aligned. After that, the two substrates 41 and 49 are pressure-bonded to each other by the TAB technique, so that the optical connection portion 46 formed at the tip of the core layer 42 of the first substrate 41 and the laser diode 47 of the second substrate 49 are separated from each other. The alignment is automatically performed, and the protrusion 45 and the electrode 48 are firmly joined to each other as shown in FIG.
The substrate 41 and the second substrate 49 are integrated and
The conductive layer 43 of the first substrate 41 and the electrode 4 of the second substrate 49
8 is electrically connected via the protrusion 45, and
Optical connection part 4 formed at the tip of the core layer 42 of the substrate 41 of
6 and the laser diode 47 of the second substrate 49 are optically connected, and the optoelectronic wiring substrate 400 is completed.

The method of forming the first substrate 41 is as shown in FIG.
This is the same as the method of forming the second substrate 21 shown in FIGS. The second substrate 49, as shown in FIG.
A recess 49a is formed in the surface layer of the substrate 49, a laser diode 47 is installed in the recess 49a, and the electrode 4 is formed on the substrate 49.
Manufactured by forming 8. Next, another embodiment of the second method for forming an optical / electrical transmission line of the present invention will be described.

FIG. 8 is a schematic view of an embodiment in which the structure of the optoelectronic wiring board shown in FIG. 7 is slightly modified. As shown in FIG. 8, in this embodiment, the laser diode 47 is mounted on the surface of the second substrate 49, and the tip of the laser diode 47 has a core layer 42 formed on the first substrate 41. It is located at a position close to the optical connecting portion 46 of the above. In this embodiment, the convex lens as in FIG. 7 is not formed.

FIG. 9 is a perspective view showing another embodiment of the arrangement of the core layer, the adhesive layer, the conductive layer, the protrusions, and the optical connecting portion on the first substrate shown in FIG. FIG. 9 is a cross-sectional view showing another embodiment of the arrangement of the core layer, the adhesive layer, the conductive layer, the protrusions, and the optical connection portion on the first substrate shown in FIG. 6. 9 shows a perspective view of the whole, and FIG.
(A)-(c) of FIG. 10 are respectively shown in FIG.
A cross-sectional view taken along the dotted line aa ', bb', cc 'is shown.

As shown in FIGS. 9 and 10A to 10C, a core layer 42 extending in the direction of arrow A is formed on the first substrate 41, and a core layer 42 extending in the direction of arrow A is also formed. The conductive layer 43 is formed on the adhesive layer 44 of the book. A protrusion 45 is formed on each of the two conductive layers 43. A lens-shaped optical connection portion 46 is formed at one end of the core layer 42.

Next, another embodiment of the second method for forming an optical / electrical transmission line of the present invention will be described. FIG. 11 shows the core layer, the adhesive layer, the conductive layer, the protrusions of the first substrate in the second embodiment of the method for forming an optoelectronic transmission line according to the present invention.
FIG. 12 is a perspective view showing the arrangement of the optical connection part and FIG. 12 is a core layer, an adhesive layer, a conductive layer, and a core layer of the first substrate shown in FIG.
It is sectional drawing which shows arrangement | positioning of a protrusion and an optical connection part.

FIG. 11 shows a perspective view of the entire first substrate, and FIGS. 12 (a) to 12 (e) respectively show FIG.
1 indicated by a chain line aa ', bb', cc ',
The cross-sectional view cut along d-d ', e-e', and f-f 'is shown. As shown in FIGS. 11 and 12A to 12E, the core layer 5 extending in the arrow A direction on the first substrate 51.
2 is formed, and a convex lens-shaped lens 56a is formed at the tip of the optical connecting portion 56 at the end of the core layer 52 located substantially in the center of FIG. An adhesive layer 54 and a conductive layer 53 are formed around a lens 56a formed on the tip of the optical connecting portion 56 on the surface of the substrate 51, and the tip of the optical connecting portion 56 is formed on the conductive layer 53. An annular conductive protrusion 55 formed surrounding the lens 56a formed on the
Are formed. In this way, the conductive protrusion 55 is
By forming the optical connecting portion 56 and the optical coupling portion between the optical connecting portion of the connection partner in a ring shape so as to surround the optical connecting portion, when the two substrates are bonded to each other to form a new opto-electric wiring board, a conductive material is formed. The space surrounded by the protrusions 55 is shielded from external light and electromagnetic waves, and the S / N ratio of light entering and exiting between the optical connecting portions can be improved.

Next, a method for forming the third opto-electrical transmission line of the present invention and a method for forming the fourth opto-electrical transmission line of the present invention will be described. The third and fourth opto-electrical transmission line forming methods of the present invention are similar to the above-described first and second opto-electrical transmission line forming methods of the present invention.
The embodiment will be described by diverting No. 2. In the above-described first and second methods for forming an opto-electric transmission line of the present invention (see FIGS. 11 and 12), the adhesive layer 54 and the conductive layer 53 are formed on the substrate 51, and the conductive layer is formed on the adhesive layer 54. The projection 55 is formed. In the third and fourth methods of forming an opto-electrical transmission line of the present invention, a clad layer is formed on the substrate 51, and the projection is formed thereon. This clad layer corresponds to the adhesive layer 54 in FIGS. 11 and 12, and acts as a clad for the core layer 52. The conductive layer 53 is not necessarily formed on the clad layer.
Need not be formed. When the conductive layer 53 is not formed on the clad layer, the protrusion does not necessarily have to be formed of a conductive material. Third and fourth aspects of the present invention
In the case of the method for forming an opto-electrical transmission line, the projection is formed for the purpose of aligning with the mating substrate to be bonded and for optically shielding the optical coupling portion from the outside. It is not necessary to make an electrical connection via.

In each of the above-mentioned embodiments, the second opto-electrical transmission line forming method according to the present invention and the fourth opto-electrical transmission line forming method according to the present invention are described below.
The case where the element arranged at the position corresponding to the optical connection portion of the core layer formed on the first substrate of the substrate of 1 is a laser diode has been described as an example, but the element is limited to the laser diode. However, the light emitting element is responsible for emitting the light incident on the optical connecting portion of the first substrate, or the light receiving element is responsible for receiving the light emitted from the optical connecting portion of the first substrate. Alternatively, any type of element having both functions of a light emitting element and a light receiving element may be used.

[0031]

As described above, according to the present invention,
Optical alignment and electrical connection are performed by a simple method to form an optical transmission line and an electrical transmission line with good coupling efficiency.

[Brief description of drawings]

FIG. 1 is a process diagram showing a first half part of a process of forming a first substrate in an embodiment of the method for forming a first optoelectronic transmission line of the present invention.

FIG. 2 is a process drawing showing a second half of the process of forming the first substrate in the embodiment of the method for forming the first optoelectronic transmission line of the present invention.

FIG. 3 is an explanatory diagram of a process of forming a new opto-electrical transmission line by bonding the first substrate formed by the above embodiment to another substrate.

FIG. 4 is a process diagram showing a first half part of a process of forming a second substrate in another embodiment of the method for forming a first optical / electrical transmission line of the present invention.

FIG. 5 is a process drawing showing a latter half of the process of forming the second substrate in another embodiment of the method for forming the first optoelectronic transmission line of the present invention.

FIG. 6 is a schematic view showing a structure of a first substrate in an embodiment of the method for forming a second optical / electrical transmission line of the present invention.

FIG. 7 is a schematic diagram showing a structure of an opto-electrical wiring substrate formed by bonding the first substrate shown in FIG. 6 to a second substrate.

FIG. 8 is a schematic view when the structure of the opto-electrical wiring board shown in FIG. 7 is slightly changed.

9 is a perspective view showing an example of the arrangement of a core layer, an adhesive layer, a conductive layer, protrusions, and an optical connection portion on the first substrate shown in FIG.

10 is a core layer of the first substrate shown in FIG.
It is sectional drawing which shows an example of arrangement | positioning of an adhesive bond layer, a conductive layer, a protrusion, and an optical connection part.

FIG. 11 shows a core layer, an adhesive layer, of a first substrate in another embodiment of the method for forming a second optoelectronic transmission line of the present invention.
It is a perspective view showing arrangement of a conductive layer, a projection, and an optical connection part.

12 is a cross-sectional view showing an arrangement of a core layer, an adhesive layer, a conductive layer, protrusions, and an optical connecting portion of the first substrate shown in FIG.

[Explanation of symbols]

 11 substrate 11 12 core layer 13 conductive layer 14 adhesive layer 15 bump 16 optical connection part 17 electrode 21 substrate 22 core layer 23 conductive layer 24 adhesive layer 26 optical connection part 31 substrate 35 protrusion 41 substrate 42 core layer 43 conductive layer 44 Adhesive layer 45 Protrusion 46 Optical connection portion 47 Laser diode (light receiving / light emitting element) 49,51 Substrate 52 Core layer 53 Conductive layer 54 Adhesive layer 55 Protrusion 56 Optical connection portion 100,400 Photoelectric wiring board

Front page continuation (72) Inventor Junji Okada 2274 Hongo, Ebina City, Kanagawa Prefecture Fuji Xerox Co., Ltd.Ebina Works (72) Inventor Masanori Hirota 2274, Hongo, Ebina City, Kanagawa Fuji Xerox Co., Ltd. Ebina Office (72) ) Inventor Kenji Kono 430 Sakai, Nakai-cho, Ashigarakami-gun, Kanagawa Prefecture Green Tech Nakai Fuji Xerox Co., Ltd.

Claims (7)

[Claims] 1. A core layer serving as a light transmission path is formed,
Two substrates acting as clads for the core layer are prepared, and at least one of light incidence and emission of light is respectively provided at positions corresponding to each other while extending in respective predetermined directions on the two substrates. A step of forming each core layer having each optical connection part to be carried, along the upper surface of each core layer and each predetermined path on the surface of the two substrates on which the core layers are formed. A step of forming each conductive layer adhered by an adhesive made of a material that acts as a clad for each core layer, and at least one of the conductive layers formed on the two substrates. Forming conductive protrusions for electrically connecting the conductive layers on the two substrates to each other; and the optical connecting portions on the two substrates are optically connected to each other. The conductive layer on a single substrate As cows are electrically connected via the protrusion these 2
A method of forming an opto-electrical transmission line, which comprises a step of adhering a plurality of substrates. 2. A core layer serving as a light transmission path is formed,
A first substrate that acts as a clad for the core layer is prepared, and a core layer that extends in a predetermined direction on the first substrate and that has an optical connection portion that performs at least one of incidence and emission of light is provided. On the surface of the first substrate on which the core layer is formed,
A step of forming a first conductive layer adhered by an adhesive made of a material acting as a clad for the core layer along the upper surface of the core layer and a predetermined path, and preparing a second substrate. A light emitting element responsible for emitting light incident on the optical connection portion, at a position of the second substrate corresponding to the optical connection portion of the core layer formed on the first substrate,
Arranging at least one of the light-receiving elements for receiving the light emitted from the optical connection part, and forming a second conductive layer along a predetermined path on the second substrate, Forming a conductive protrusion on at least one of the first conductive layer and the second conductive layer for electrically connecting the first conductive layer and the second conductive layer; While the optical connection portion and the element are optically connected,
The first substrate and the second substrate so that the first conductive layer and the second conductive layer are electrically connected via the protrusions.
And a step of adhering the substrates together. 3. The first conductive layer is formed so as to surround the optical connection portion, the second conductive layer is formed so as to surround the element, and the protrusion is further formed.
3. The method of forming an optoelectronic transmission line according to claim 2, wherein the protrusion is formed so as to surround the optical connection portion and the element when the first substrate and the second substrate are bonded together. . 4. A core layer serving as a light transmission path is formed,
Two substrates acting as clads for the core layer are prepared, and at least one of light incidence and emission of light is respectively provided at positions corresponding to each other while extending in respective predetermined directions on the two substrates. A step of forming each core layer having each optical connection part to be carried, along the upper surface of each core layer and each predetermined path on the surface of the two substrates on which the core layers are formed. A step of forming each conductive layer adhered by an adhesive made of a material that acts as a clad for each core layer, and at least one of the conductive layers formed on the two substrates. Forming conductive protrusions for electrically connecting the conductive layers on the two substrates to each other; and the optical connecting portions on the two substrates are optically connected to each other. The conductive layer on a single substrate As cows are electrically connected via the protrusion these 2
An opto-electrical wiring board formed through a process of laminating two substrates. 5. A core layer serving as a light transmission path is formed,
A first substrate that acts as a clad for the core layer is prepared, and a core layer that extends in a predetermined direction on the first substrate and that has an optical connection portion that performs at least one of incidence and emission of light is provided. On the surface of the first substrate on which the core layer is formed,
A step of forming a first conductive layer adhered by an adhesive made of a material acting as a clad for the core layer along the upper surface of the core layer and a predetermined path, and preparing a second substrate. A light emitting element responsible for emitting light incident on the optical connection portion, at a position of the second substrate corresponding to the optical connection portion of the core layer formed on the first substrate,
Arranging at least one of the light-receiving elements for receiving the light emitted from the optical connection part, and forming a second conductive layer along a predetermined path on the second substrate, Forming a conductive protrusion on at least one of the first conductive layer and the second conductive layer for electrically connecting the first conductive layer and the second conductive layer; While the optical connection portion and the element are optically connected,
The first substrate and the second substrate so that the first conductive layer and the second conductive layer are electrically connected via the protrusions.
Opto-electrical wiring substrate formed through the step of adhering the substrates. 6. A core layer serving as a light transmission path is formed,
Two substrates acting as clads for the core layer are prepared, and at least one of light incidence and emission of light is respectively provided at positions corresponding to each other while extending in respective predetermined directions on the two substrates. A step of forming each core layer having each optical connection portion to be carried out, and a step for forming each core layer so as to surround the optical connection portion on the surface of the two substrates on which the core layers are formed. A step of forming each clad layer that acts as a clad, and when these two substrates are bonded to at least one of the clad layers formed on the two substrates, Forming a projection surrounding the optical coupling portions of the optical connecting portions, and optically connecting the optical connecting portions on the two substrates, and the optical coupling portions on the two substrates. Before Method of forming an optical electrical transmission path, characterized in that a step of bonding two substrates as closed shielding and optically outside by protrusions. 7. A core layer serving as a light transmission path is formed,
A first substrate that acts as a clad for the core layer is prepared, and a core layer that extends in a predetermined direction on the first substrate and that has an optical connection portion that performs at least one of incidence and emission of light is provided. And a step of forming, on the surface of the first substrate on which the core layer is formed,
A step of forming a first clad layer made of a material that acts as a clad for the core layer; a second substrate prepared; and a core layer of the second substrate formed on the first substrate A light emitting element responsible for emitting light incident on the optical connection portion at a position corresponding to the optical connection portion of
Arranging at least one of the light-receiving elements for receiving the light emitted from the optical connection part, and forming a second clad layer on the second substrate; and the first clad layer. When the first substrate and the second substrate are bonded to at least one of the second substrate and the second cladding layer, the optical connection part of the first substrate and the second substrate A step of forming a projection surrounding an optical coupling portion with one of the light emitting element and the light receiving element, and the optical connection portion and the element are optically connected,
And a step of bonding the first substrate and the second substrate so that the optical coupling portion is optically shielded from the outside by the protrusion. .