JPH09277455A - Conductive laminated film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To keep the intrinsic merits of a structural molding such as a polyester film and to give it an antistatic property enough to overcome electrostatic troubles which is its defect. SOLUTION: At least on one side of a thermoplastic film is laminated a conductive layer comprising 100 pts.wt. of sulfonated polyaniline containing alkoxy-group-substituted aminobenzene sulfonic acid as a main component, 10-2000 pts.wt. of water soluble or water-dispersed copolyester incorporated with a sulfonic acid group and/or its alkali metal salt group, and 0.001-1000 pts.wt. of a nonionic surfactant.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a conductive laminated film, and more particularly to a thermoplastic resin film excellent in antistatic property and conductivity even under low humidity, and particularly to a polyester film,
Specifically, magnetic tapes, OHPs, shield materials, industrial films such as LCD conductive layers; carrier tapes, trays,
Examples include packaging films such as magazines and IC / LSI packages.

[0002]

2. Description of the Related Art Conventionally, thermoplastic films such as polyester and nylon are excellent in heat resistance, dimensional stability, mechanical strength, etc., and are therefore widely used in a large amount as packaging films and industrial films. . Polyethylene, polypropylene, polyvinyl chloride and the like are generally used as packaging materials because of their low heat resistance but good moldability and low cost. Since synthetic resin is generally hydrophobic, static electricity is easily generated on the surface of the structure forming body made of synthetic resin, and dust and the like are easily attached to the surface, causing various troubles. Generally, a surfactant is used as an antistatic agent for films, packaging materials, etc. However, the surfactant has a surface resistance (10 ¹⁰ Ω / □ or less) sufficient to suppress the adhesion of dust and dust. In addition to not being obtained, the antistatic ability is likely to change due to the influence of ambient humidity and moisture. In particular, there is a disadvantage that the surface resistance of the film, which has been reduced by the surfactant, is significantly increased under low humidity, and the desired antistatic ability cannot be obtained. as a result,
Dust adheres to the surface of films and packaging materials, causing various problems. Today, with higher technology,
There is a demand for a film free from static electricity damage in a low humidity environment, and for that purpose, the emergence of an antistatic agent that gives a surface resistance value of 10 ¹⁰ Ω / □ or less in a low humidity is desired. Conductive polymers such as polyaniline and polypyrrole are known as materials that give such low surface resistance.
Both of them are soluble in a specific organic solvent, but water and water /
Since it was insoluble or non-dispersible in the alcohol mixed solvent system, a method of bonding a sulfonic acid group to the aromatic ring was performed, and sufficient film properties were not obtained by itself, so mixing a water-soluble or water-dispersible resin The way to do has been done. However, when a resin having good compatibility with sulfonated polyaniline is used, a predetermined surface resistance value is not obtained. On the contrary, when a predetermined surface resistance value is obtained, the surface becomes cloudy and the original transparency of the film is impaired. The problem had arisen.

[0003]

DISCLOSURE OF THE INVENTION The present invention has been made as a result of earnest research focusing on the above problems, and the purpose thereof is to provide an excellent point of a structure forming body such as an original thermoplastic film. It is an object of the present invention to provide an inexpensive thermoplastic film which has sufficient antistatic ability to overcome electrostatic damage even under low humidity and does not lose transparency while taking advantage of the above.

[0004]

According to the present invention, 100 parts by weight of a sulfonated polyaniline containing an alkoxy group-substituted aminobenzenesulfonic acid as a main component, a sulfonic acid group and / or an alkali metal base thereof is provided on at least one surface of a thermoplastic film. A conductive layer comprising 10 to 2000 parts by weight of a water-soluble or water-dispersible copolyester having a bonded structure and 0.001 to 1000 parts by weight of a nonionic surfactant. It relates to a laminated film.

The thermoplastic film in the present invention may be made of a single polymer such as polyester, nylon, polypropylene, polyethylene or polystyrene, or a mixture or a laminate of these. Further, a void-containing film obtained by at least uniaxially stretching a sheet obtained by mixing an incompatible thermoplastic resin with the thermoplastic film may be used.

As the sulfonated polyaniline in the present invention, a sulfonated aniline copolymer having an alkoxy group-substituted aminobenzenesulfonic acid as a main component is suitable as a basic material for the conductive composition of the present invention, and aminoanisole is particularly preferable. Sulfonic acid is preferred. Further, from the viewpoint of improving the coatability, spreadability, and hardness of the coated body of the conductive composition of the present invention, the co-use of the copolymerized polyester containing 5-sulfoisophthalic acid unit in an amount of 4 mol% to 10 mol% is further preferred. It is suitable. Here, specific examples of aminoanisolesulfonic acids include 2-aminoanisole-3-sulfonic acid, 2-aminoanisole-4-sulfonic acid, 2-aminoanisole-5-sulfonic acid, and 2-aminoanisole-6-sulfone. Acid, 3-aminoanisole-2-sulfonic acid, 3-aminoanisole-4-sulfonic acid, 3-aminoanisole-5-sulfonic acid, 3-aminoanisole-6-sulfonic acid, 4-aminoanisole-2-sulfone Acid, 4-aminoanisole-3-sulfonic acid, etc. can be mentioned. It is also possible to use a compound in which the methoxy group of anisole is substituted with an alkoxy group such as an ethoxy group or an iso-propoxy group. However, 2-aminoanisole-3-sulfonic acid 2-aminoanisole-
4-sulfonic acid, 2-aminoanisole-5-sulfonic acid, 2-aminoanisole-6-sulfonic acid, 3-aminoanisole-2-sulfonic acid, 3-aminoanisole-4-sulfonic acid, 3-aminoanisole- 6-sulfonic acid is preferably used. A sulfonated polyaniline copolymer containing aminoanisolesulfonic acid as a main component is used as one component of the laminated film of the present invention. As described above, in the sulfonated polyaniline copolymer used in the present invention, the sulfonic acid group accounts for 70% or more, preferably 80% or more, and more preferably 100%, based on the aromatic ring. In addition, there is no problem for the purpose of the present invention, even if aromatic rings containing a sulfonic acid group and aromatic rings not containing a sulfonic acid group are mixed or alternately arranged. If the sulfonic acid group content of the sulfonated polyaniline copolymer is less than 70%, the solubility or dispersibility of the copolymer in water, alcohol or a mixed solvent system thereof becomes insufficient, and as a result, The applicability and spreadability to the substrate deteriorate, and the conductivity of the resulting applied film tends to be significantly reduced. The number average molecular weight of the sulfonated polyaniline copolymer used in the present invention is 300 to 50.
0000 and 1000 or more are preferable from the viewpoint of solubility in the solvent and strength of the coating film. The use ratio of the sulfonated polyaniline copolymer is 0.01 to 100 parts by weight of the solvent.
-10 parts by weight, preferably 0.1-2 parts by weight. When the use ratio of the sulfonated polyaniline copolymer is less than 0.01 part by weight, the long-term storage property of the solution is deteriorated, pinholes are easily generated in the surface coat layer, and the conductivity of the coated surface is extremely poor. On the other hand, if the proportion used exceeds 10 parts by weight, the solubility and dispersibility of the copolymer in water or a water / organic solvent system and the coatability of the coat layer tend to deteriorate, such being undesirable. As the solvent, any organic solvent can be used as long as it does not dissolve or swell a substrate such as a polyester film, but it is preferable to use a mixed solvent with water or an organic solvent such as water / alcohol in terms of use environment. In addition, the coatability to the support and the conductivity may be improved. Organic solvents include alcohols such as methanol, ethanol, propanol and isopropyl alcohol, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, cellosolves such as methyl cellosolve and ethyl cellosolve, propylene glycols such as methyl propylene glycol and ethyl propylene glycol. Amides such as dimethylformamide and dimethylacetamide, and pyrrolidones such as N-methylpyrrolidone and N-ethylpyrrolidone are preferably used. These are used by mixing with water at an arbitrary ratio. As examples of this, specifically, water / methanol, water /
Ethanol, water / propanol, water / isopropanol, water / methyl propylene glycol, water / ethyl propylene glycol and the like can be mentioned. The ratio used is preferably water / organic solvent = 1/10 to 10/1.

The copolyester to which at least one group selected from the group consisting of a sulfonic acid group and its alkali metal base used in the present invention (hereinafter referred to as a sulfonic acid group-containing copolyester) is a dicarboxylic acid. A polyester in which at least one group selected from the group consisting of a sulfonic acid group and its alkali metal base is bonded to a part of the acid component and / or glycol component, and among them, it is composed of a sulfonic acid group and its alkali metal base An aromatic dicarboxylic acid component containing at least one group selected from the group from 4 to 1 with respect to the total acid component.
Copolymerized polyester prepared and used at a ratio of 0 mol% is preferred in that the conductive laminated film of the present invention has a high surface hardness. As an example of such a dicarboxylic acid, 5-sodium sulfoisophthalic acid is preferred.

Other dicarboxylic acid components include terephthalic acid, isophthalic acid, phthalic acid, p-β-oxyethoxybenzoic acid, 2,6-naphthalenedicarboxylic acid, 4,
4'-dicarboxydiphenyl, 4,4'-dicarboxybenzophenone, bis (4-carboxyphenyl) ethane, adipic acid, sebacic acid, cyclohexane-1,
4-dicarboxylic acid etc. are mentioned. From the viewpoint of improving the surface hardness of the conductive laminated film of the present invention, terephthalic acid and isophthalic acid are preferred.

As a glycol component for preparing the copolyester, ethylene glycol is mainly used. In addition to this, propylene glycol, butanediol, neopentyl glycol, diethylene glycol, cyclohexanedimethanol, and an ethylene oxide adduct of bisphenol A. , Polyethylene glycol,
Polypropylene glycol, polytetramethylene glycol and the like can be used. Among them, the use of ethylene glycol, propylene glycol, butanediol, neopentyl glycol, diethylene glycol, cyclohexane dimethanol, or the like as a copolymer component is preferred in that compatibility with the sulfonated polyaniline is improved.

In addition to this, a dicarboxylic acid component or a glycol component containing a small amount of an amide bond, a urethane bond, an ether bond, a carbonate bond or the like may be contained as a copolymerization component. Further to improve the surface hardness of the coating film obtained by applying the obtained conductive layer of the present invention to the substrate, trimellitic acid, trimesic acid, pyromellitic acid, trimellitic anhydride, such as pyromellitic anhydride It is also possible to use a polycarboxy group-containing monomer in a proportion of 5 mol% or less as a copolymer component of the polyester. If it exceeds 5 mol%, the resulting sulfonic acid group-containing copolymerized polyester becomes thermally unstable and easily gelates,
It is not preferable as a component of the conductive layer of the present invention.

The above-mentioned sulfonic acid group-containing copolyester is obtained, for example, by a conventional method using the above-mentioned dicarboxylic acid component, the above-mentioned glycol component and, if necessary, the above-mentioned polycarboxylic acid group-containing monomer, transesterification reaction and polycondensation. It can be obtained by carrying out a reaction or the like. The obtained sulfonic acid group-containing copolyester is, for example, heated and stirred with a solvent such as n-butyl cellosolve, and water is gradually added with stirring to form an aqueous solution or an aqueous dispersion. Can be used.

The content ratio of the sulfonic acid group-containing copolyester is preferably 50 to 2000 parts by weight, more preferably 100 parts by weight of the sulfonated polyaniline, in view of the electrical conductivity and mechanical properties of the resulting electroconductive laminate film. Is from 100 to 1500 parts by weight, most preferably 2
It is from 00 to 1000 parts by weight.

The conductive layer of the present invention is usually dissolved or dispersed in a solvent and applied on the desired substrate surface. As the solvent used here, any organic solvent can be used as long as it does not dissolve or swell the substrate (eg, a polyester film or the like). The use of water or a mixed solvent of water and an organic solvent is not only preferable in terms of use environment but also sometimes improves the antistatic property of the obtained conductive laminated film of the present invention.

Examples of the organic solvent include alcohols such as methanol, ethanol, propanol and isopropanol, ketones such as acetone, methyl ethyl ketone and methyl isobutyl ketone, cellosolves such as methyl cellosolve and ethyl cellosolve, methyl propylene glycol and ethyl. Propylene glycols such as propylene glycol, amides such as dimethylformamide and dimethylacetamide, and pyrrolidones such as N-methylpyrrolidone and N-ethylpyrrolidone are preferably used. These organic solvents can be used by being mixed with water at an arbitrary ratio. Examples of mixing include water / methanol,
Water / ethanol, water / propanol, water / isopropanol, water / methylpropylene glycol, water / ethylpropylene glycol, and the like. The mixing ratio is preferably water / organic solvent = 1/10 to 10/1.

The proportion of the solvent used is not particularly limited, but is usually 10 per 100 parts by weight of the sulfonated polyaniline.
It is 00 to 20000 parts by weight. When the amount of the solvent used is extremely large, the applicability of the obtained conductive laminated film of the present invention may be deteriorated. Therefore, pinholes are likely to occur in the conductive layer, and the conductivity of the conductive laminated film may be significantly reduced, that is, the antistatic property may be reduced. When the amount of the solvent used is extremely small, the solubility or dispersibility of the sulfonated polyaniline in the solvent may be insufficient, and the surface of the obtained conductive layer may not be easily flat.

The conductive layer of the present invention is excellent in coatability and spreadability even with only the above-mentioned components, and the surface hardness of the obtained conductive layer is good, but a surfactant and / or a solvent soluble in the above solvent is used. By additionally using a polymer compound, it is possible to apply it to a thermoplastic film having poor wettability.

Examples of the above surfactant include nonionic surfactants such as polyoxyethylene octyl phenyl ether, polyoxyethylene alkyl ether, polyoxyethylene sorbitan fatty acid ester, and fluoroalkylcarboxylic acid, perfluoroalkylcarboxylic acid, Fluorine-based surfactants such as perfluoroalkylbenzenesulfonic acid, perfluoroalkyl quaternary ammonium and perfluoroalkyl polyoxyethylene ethanol are used.

The amount of the surfactant used in the present invention is 0.00 based on 100 parts by weight of the sulfonated polyaniline.
It is 1 part by weight or more and 1000 parts by weight or less.

When the amount of the surfactant exceeds 10 parts by weight, the surfactant in the coat layer is set off on the non-coated surface, which causes a problem in secondary processing.

The polymer compound that can be contained in the conductive layer of the conductive laminated film of the present invention is, for example, a water-soluble resin such as polyacrylamide or polyvinylpyrrolidone, a water-soluble or water-dispersible resin containing a hydroxyl group or a carboxylic acid group. Acrylic resin such as copolyester, polyacrylic acid, polymethacrylic acid, acrylic ester resin such as polyacrylic acid ester polymethacrylic acid ester,
Ester resins such as polyethylene terephthalate and polybutylene terephthalate, polystyrene, poly-α-
Methyl styrene, polychloromethyl styrene, polystyrene sulfonic acid, styrene resin such as polyvinyl phenol, polyvinyl ether such as polyvinyl methyl ether, polyvinyl ethyl ether, polyvinyl alcohol such as polyvinyl alcohol, polyvinyl formal, polyvinyl butyral, novolac, resole, etc. Phenolic resins and the like can be used. Among them, water-soluble or water-dispersible copolymerized polyesters containing a hydroxyl group or a carboxylic acid group and polyvinyl alcohols are preferred from the viewpoint of compatibility with the above-mentioned sulfonated polyaniline, and from the viewpoint of adhesion to a substrate made of polyester or the like. .

The amount of the polymer compound is preferably 0-100 with respect to 100 parts by weight of sulfonated polyaniline.
0 parts by weight, and more preferably 0 to 500 parts by weight. When the amount of the polymer compound is 1000 parts by weight or more, the conductivity of the sulfonated polyaniline does not appear, and the original antistatic function is not exhibited.

For the conductive layer of the conductive laminated film of the present invention
In addition to the above, various additives may be included. like this
As an additive, TiO_Two, SiO_Two, Kaolin, C
aCO _Three, Al_TwoO_Three, BaSO_Four, ZnO, talc,
Inorganic particles such as mica and composite particles; polystyrene, poly
Organic composed of acrylates or their cross-linked products
Examples include particles. Aiming to further improve conductivity
And SnO_Two, (Tin oxide), ZnO (zinc oxide)
Powder, inorganic particles coated with them (TiO 2_Two, BaSO
_FourEtc.), carbon black, graphite, carbon fiber, etc.
It is also possible to add a carbon-based conductive filler, etc.
It is. The content of the above additives is sulfonated polyaniline
Less than 4000 parts by weight per 100 parts by weight
Preferably, there is. Conductivity when exceeding 4000
Increased layer viscosity may cause uneven coating.
You.

As a method for laminating the conductive layer on the surface of the thermoplastic film, there are a gravure roll coating method, a reverse roll coating method, a knife coater method, a dip coating method, a spin coating method and the like, and a coating suitable for the conductive composition is used. The law is not particularly limited. There are an in-line coating method in which application to a film is performed simultaneously in a film-forming step and an offline coating method in which coating is independently performed after the production of a film-forming roll. The sulfonated polyaniline used in the present invention is 25
Although it is unstable at high temperature of 0 ° C or higher, it has good thermal stability even at 200 ° C for about 3 minutes, so it is usually heated for a short time at 200 ° C depending on the type of coexisting polymer compound and additives. In that case, the conductivity is not adversely affected. Rather, from the viewpoint of improving conductivity, it is preferable to heat at around 200 ° C. for 30 seconds or less.

[0024]

When the conductive laminated film of the present invention is used as an industrial or packaging film, the antistatic property can be provided even under low humidity while maintaining strong surface strength and transparency.

Examples Next, examples and comparative examples of the present invention will be shown, but the present invention is not limited thereto. . The evaluation method used in the present invention is shown below.

1) Presence or absence of whitening of conductive layer The surface of the conductive layer was irradiated with light using bromlite, and the presence or absence of whitening was evaluated as follows. -There is no whitening part on the conductive layer surface. : A part of the surface of the conductive layer is whitened. : ×

2) Surface resistance value Takeda Riken's surface resistance measuring device applied voltage of 500 V, 2
It was measured under the conditions of 5 ° C. and 15% RH.

3) Evaluation of Adhesion of Conductive Layer to Thermoplastic Film The cellophane tape was peeled from the surface of the conductive layer, and whether or not the conductive layer was peeled from the thermoplastic film was evaluated as follows. -The conductive layer does not peel off and does not adhere to the cellophane tape at all. : ○-The conductive layer slightly peeled off and adhered to the cellophane tape. : △ ・ The conductive layer is completely peeled off and adheres to cellophane tape. : ×

4) Scratch resistance With a load of 200 g, the conductive layer surface was rubbed 10 times with gauze,
The degree of scratching on the surface of the conductive layer was evaluated as follows. -There is no scratch on the conductive layer surface. : ○ ・ Several small scratches on the conductive layer surface. : △ ・ The surface of the conductive layer has scratches that are clearly visible. : ×

5) Set-off property The surface of the conductive layer and the opposite surface of the thermoplastic film are overlapped,
After applying a load of 170 kg / cm ² for 10 minutes at room temperature, whether or not a part of the conductive layer was offset to the opposite surface was evaluated by visual observation and surface resistance value.

6) Water resistance Using a commercially available tissue paper moistened with water, the surface of the conductive layer was wiped 10 times at a constant pressure. When the conductive layer was not wiped off at all, ○ was used. △, × when completely wiped off.

(Synthesis Example 1) Preparation of Sulfonic Acid Group-Containing Polyester and Aqueous Dispersion Liquid First, a sulfonic acid group-containing polyester was synthesized by the following method, and the dispersion liquid was further prepared. Dimethyl terephthalate 46 mol%, dimethyl isophthalate 47 mol% and sodium 5-sulfoisophthalate 7 mol% are used as dicarboxylic acid components, and ethylene glycol 50 mol% and neopentyl glycol 5 are used as glycol components.
Using 0 mol%, a transesterification reaction and a polycondensation reaction were carried out by a conventional method. The glass transition temperature of the obtained sulfonic acid group-containing polyester was 69 ° C. The sulfonic acid group-containing polyester (300 parts) and n-butyl cellosolve (150 parts) were heated and stirred to form a viscous solution, and 550 parts of water was gradually added with further stirring to obtain a solid content of 3 parts.
A 0% by weight uniform light white aqueous dispersion was obtained. This dispersion is further added to an equal volume mixture of water and isopropanol,
A sulfonic acid group-containing polyester aqueous dispersion having a solid content of 8% by weight was prepared.

(Synthesis example 2) Preparation of sulfonic acid group-containing polyaniline coating solution 2-aminoanisole-4-sulfonic acid 100 mmol
Was stirred and dissolved in a 4 mol / l aqueous ammonia solution at 23 ° C., and ammonium peroxodisulfate (100 mmol) was dissolved.
l of aqueous solution was added dropwise. After the dropwise addition was completed, the mixture was further stirred at 23 ° C. for 10 hours, and then the reaction product was washed by filtration and dried to obtain 13 g of a powdery copolymer. The volume resistivity value of this copolymer was 12.3 Ωcm. 3 parts by weight of the above polymer was stirred and dissolved at room temperature in 100 parts by weight of a 0.3 mol / l sulfuric acid aqueous solution to prepare a conductive composition. At this time, the sulfonic acid group content of the sulfonated polyaniline is 100.
%Met. 2.0 parts by weight of the sulfonated polyaniline was dissolved in 50 parts by weight of water and 50 parts by weight of isopropanol. A liquid obtained by mixing this liquid with the dispersion liquid shown in Synthesis Example 1 was applied to one surface of the thermoplastic film. This coating solution was dark yellow and no insoluble matter was observed in appearance.

(Preparation of substrate film) Average particle size 0.5 μ
Polyethylene terephthalate having 4,000 m of calcium carbonate fine particles dispersed therein was melt extruded at 290 ° C and cooled with a cooling roll at 30 ° C to give a thickness of about 180.
A μm unstretched film was obtained. This unstretched film,
The film was stretched 3.5 times in the machine direction between a pair of rolls heated to 85 ° C. and having different peripheral speeds to obtain a substrate film.

(Preparation of Laminated Film) Obtained thickness of about 5
2. A coating solution having a solid content concentration of 4% was applied to a 0 μm base material (PET) film to a thickness of about 10 μm, and further in the lateral direction.
The film was stretched 5 times to prepare a conductive laminated film of the present invention.

(Example 1) The coating solution was prepared so that the solid content ratio of sulfonated polyaniline and polyester having sulfonic acid group was 30.
/ 70, and further, the surfactant Emulgen 810 (manufactured by Kao) was added so that the ratio with the sulfonated polyaniline was 8/100.

(Example 2) 47 mol% of dimethyl terephthalate, 47 mol% of dimethyl isophthalate and 6 mol% of sodium 5-sulfoisophthalate in Synthesis Example 1
And the same procedure as in Example 1 except that the concentration of the aqueous sulfuric acid solution was changed to 0.25 mol / liter in Synthesis Example 2.

Example 3 Example 3 was repeated except that the solid content ratio of the sulfonated polyaniline and the sulfonic acid group-containing polyester was 20/80 and the addition ratio of the surfactant was 40/100. .

Example 4 In Synthesis Example 1, dimethyl terephthalate was 48 mol%, dimethyl isophthalate was 47 mol%, and sodium 5-sulfoisophthalate was 5%.
In Synthesis Example 2, the concentration of the sulfuric acid aqueous solution was 0.2 mol / liter, the solid content ratio of the sulfonated potianiline and the sulfonic acid group-containing polyester was 10/90, and the addition ratio of the surfactant was 50/100. The procedure was the same as in Example 1 except for the above.

Comparative Example 1 In Synthesis Example 1, dimethyl terephthalate was 49 mol%, dimethyl isophthalate was 49 mol%, and sodium 5-sulfoisophthalate was 2%.
Further, the same procedure as in Example 1 was carried out except that the addition ratio of the surfactant was 40/100.

(Comparative Example 2) The same procedure as in Example 1 was carried out except that stirring in an aqueous sulfuric acid solution was not performed in Synthesis Example 2.

Comparative Example 3 The procedure of Example 1 was repeated except that the concentration of the aqueous sulfuric acid solution was changed to 0.18 mol / liter and the addition ratio of the surfactant was changed to 600/10.

Comparative Example 4 The procedure of Example 1 was repeated except that the solid content ratio of the sulfonated polyaniline and the sulfonic acid group-containing polyester was changed to 100/0.

The above results are shown in Table 1. As shown in Table 1, all of the examples were excellent in whitening property, surface resistance value, adhesiveness, scratch resistance, set-off property, and water resistance. On the other hand, Comparative Examples 1 and 2 had a whitened portion, and the transparency was impaired. In Comparative Example 3, settling occurred because the amount of the surfactant added was large. Further, in Comparative Example 4, only the sulfonated polyaniline was used and the sulfonic acid group-containing polyester was not included, so the adhesion, scratch resistance and water resistance were insufficient.

[0045]

As is clear from the above description, the conductive laminated film of the present invention has excellent transparency and excellent antistatic property even under low humidity. The conductive laminated film of the present invention includes a magnetic tape, a film for OHP, a shield material,
It is suitable for various industrial films such as LCD conductive layers; various packaging films for carrier tapes, trays, magazines, IC / LSI packages, and the like.

[0046]

[Table 1]

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical indication C09D 179/00 PLT C09D 179/00 PLT // C09D 5/24 PQW 5/24 PQW (72) Invention Atsushi Hoshio 2-1-1 Katata, Otsu City, Shiga Prefecture, Toyobo Co., Ltd.

Claims (5)

[Claims] 1. The method according to claim 1, wherein at least one side of the thermoplastic film has
100 parts by weight of sulfonated polyaniline having alkoxy group-substituted aminobenzenesulfonic acid as a main component, 10 to 2000 parts by weight of a water-soluble or water-dispersible copolyester having a sulfonic acid group and / or its alkali metal base bonded thereto, nonionic A conductive laminated film, wherein a conductive layer containing 0.001 to 1000 parts by weight of a surfactant is laminated. 2. The water-soluble or water-dispersible copolymeric polyester according to claim 1, wherein the 5-sulfoisophthalic acid unit has 4 to 5 units.
A conductive laminated film comprising 10 mol%. 3. A conductive laminated film, wherein the alkoxy-substituted aminobenzenesulfonic acid according to claim 1 is aminoanisolesulfonic acid. 4. The conductive laminated film according to claim 1, wherein the nonionic surfactant is a fluorine-based surfactant. 5. The surface resistance value of the laminated film conductive layer according to claim 1, which is 10 ⁶ to 10 ¹² Ω / at 25 ° C. and 15% RH.
A conductive laminated film characterized by being □.