JPH09275171A - Semiconductor cooling equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the cooling effect of a high heating element put in a fine space, by forming the blade of an impeller in such a manner that air is discharged upward or obliquely upward or sideward by rotating the impeller. SOLUTION: A base 2 composed of material whose thermal conductivity is comparatively high is connected with the upper surface of a semiconductor module 1, and a motor 4 and an impeller 3 are installed on the base 2. In this case, for example, the gap between the impeller 3 and the base 2 is very small. In this constitution, the impeller 3 rotates synchronously with the rotation of the motor 4. The impeller 3 strips off a temperature boundary layer formed on the base 2, and discharges warm air upward. As a result, cool air in the peripheral part flows into the base 2, so that the heat conduction performance on the surface of the base 2 becomes very excellent. Since warm air is discharged upward, the cooling performance is not largely deteriorated as compared with the atmosphere, when the semiconductor module is used in a narrow space.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a semiconductor cooling device.

[0002]

2. Description of the Related Art As the performance of personal computers has improved in recent years, the amount of heat generated by the CPUs used therein has increased. To cool such a CPU, for example, the actual Kaihei 6-552
A heat sink with a fan is used as seen in Japanese Patent Publication No. 66. However, when this is applied to a small electronic device having a small space such as a notebook type, the following problems occur. That is, it is difficult to reduce the thickness of the conventional heat sink with a fan because the fan is provided above the heat sink.

Since the conventional heat sink with a fan has a structure in which air is taken in from above and exhausted from the side of the heat sink, a short path of cooling air in which the exhausted air is again taken in by the fan is likely to occur. This phenomenon is more remarkable when a heat sink with a fan is placed in a smaller space. When a short path of the cooling air is generated, the cooling performance of the heat sink with a fan is significantly lower than the measured value such as the catalog value when the short path is not generated.

Many heat sinks with a fan require a large amount of air flow, and therefore, the number of rotations of the fan is high and the noise is large. This tendency is remarkable when a fan having a small diameter is used.

In the conventional heat sink with a fan, the means for improving the cooling performance is to increase the cooling air volume, thereby increasing the wind speed around the heat sink to thin the boundary layer and increase the turbulence. As a result, methods have been taken to increase the heat transfer around the heat sink. However, when the fan is brought close to the heat sink, the flow resistance of the cooling air there greatly increases, so that the performance of the fan cannot be fully utilized in many cases, which also causes an increase in noise.

Further, conventionally, a cooling fan has been used on the exhaust side as shown in FIG. 9 in order to uniformly cool the inside of the housing. In this case, although the cooling air flows all over the housing 8, the wind speed around the high heat generating element 16 cannot be sufficiently obtained, so that a cooling problem often occurs. Furthermore, the exhaust port has a micro slit or micro hole at the opening for the purpose of preventing electromagnetic radiation noise from leaking out of the housing. The flow rate of is not sufficient. There were problems such as loud fan noise.

[0007]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor cooling device which is effective for cooling a high heat generating element placed in a minute space and has low noise.

[0008]

To achieve the above object, the present invention has a structure for moving an object near the surface of a heat sink. Further, the structure is such that the air inside the housing is vibrated. Further, the entire surface of the cooling fan is made of metal or metal plating.

When an object is moved near the heat sink surface, the object destroys the boundary layer at the heat sink surface, causing cool air to flow into the immediate vicinity of the heat sink instead of loose air around the heat sink. The heat transfer coefficient at is higher. Further, when the air in the housing vibrates, cold air intermittently flows in through the opening and quickly diffuses in the housing, so that the cooling performance inside the housing becomes good. Furthermore, since the fan itself can prevent leakage of electromagnetic radiation noise at the opening,
The need for minute slits and holes is eliminated, and the load on the fan can be greatly reduced.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will now be described with reference to FIGS.
This will be described with reference to FIG. FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 is a side view thereof. Semiconductor module 1
A base 2 made of a material having a relatively high thermal conductivity is connected to the upper surface of the motor 2, and the motor 4 and the impeller 3 are provided on the base 2. That is, in this case, the heat sink is composed of the base 2, the impeller 3, and the motor 4. In the embodiment, the gap between the impeller 3 and the base 2 is very small. With such a configuration, the motor 4
The impeller 3 rotates in synchronization with the rotation of. At this time, the impeller 3 strips off the temperature boundary layer formed on the base 2 and releases warm air upward. Since the cool air around the base 2 flows into the base 2 in a linked manner, the base 2
The heat transfer performance on the surface of is very good. In addition, as the warmed air is discharged upward as described above, the short path of the cooling air described in the conventional example does not occur, so even when used in a narrow space, the cooling performance is significantly lower than in the atmosphere. There is nothing to do. Further, in the present embodiment, since it is not necessary to increase the air volume unlike the heat sink with a fan, the rotation speed of the impeller 3 can be reduced correspondingly, which is effective in reducing noise.

FIG. 3 shows a second embodiment of the present invention. In the present embodiment, the blades of the impeller 3 are arranged to be perpendicular to the moving direction. Also in this embodiment, the impeller 3 rotates in synchronization with the rotation of the motor 4. The boundary layer near the base 2 is destroyed by the impeller 3 and the loosened air is expelled around and above, instead cold air flows in. In addition, even if the shape of the impeller is curved as shown in FIG. 4, the same effect can be obtained.
Moreover, there is an advantage that the rotational resistance of the impeller 3 is reduced.

In the embodiments shown in FIGS. 3 and 4, since the wind can be excited not only upward but also laterally, there is some effect in cooling the elements around the semiconductor module 1. Further, the embodiment shown in FIGS. 3 and 4 has an advantage that the total thickness can be reduced as compared with the embodiments shown in FIGS.

FIG. 5 shows a third embodiment of the present invention. In this embodiment, a cooling device including a belt 5 and two wheels 7 is provided above the semiconductor module 1.
The belt 5 is provided with a large number of rib-shaped projections 6.
At least one wheel 7 is connected to a rotating means such as a motor. Also in this embodiment, the gap between the rib-shaped protrusion 6 and the semiconductor module 1 is very small. In addition,
The cooling device described above may be connected so as to be integrated with the semiconductor module 1 or may be a separate body. In such a configuration, the belt 5 rotates as the wheeled vehicle 7 rotates, whereby the protrusions 6 move on the semiconductor module 1 from the left to the right in FIG. As a result, the boundary layer near the semiconductor module 1 is scraped. The loosened air is discharged from the right side of FIG. 5, and the cold air flows from the left side.

In the embodiment shown in FIG. 5, the belt 5 and the protrusions 6 are made of metal so that the cooling performance can be further improved.

FIG. 6 shows another embodiment of the present invention. Case 8
There is a substrate 13 in which a large number of electronic components 14 are mounted. The housing 8 has a first opening 11 and a second opening 12.
The elastic chamber 9 is attached to the inside of the housing 8 of the first opening 11 so as to cover the first opening 11. Further, movable means 10 is attached to the elastic chamber 9. Although the moving means of this embodiment is composed of a motor and a cam, the moving means is not limited to this, and any means that moves the elastic chamber 9 may be used.

In such a structure, the elastic chamber 9 periodically expands and contracts as the cam of the movable means 10 moves. When the elastic chamber 9 contracts, the air in the elastic chamber 9 flows out of the housing 8 through the first opening 11, and the surrounding cool air is supplied through the second opening 12 so as to compensate for this. 8
Flows into. On the contrary, when the elastic chamber 9 extends, the air flows into the elastic chamber 9 through the first opening 11, and at the same time, the loose air in the housing 8 flows through the second opening 12 to the housing 8. Is discharged to the outside. Due to such vibration of the air in the housing 8, the heat generated in the electronic component 14 is
Is efficiently discharged to the outside of the housing 8 from the opening 12.
Further, the vibration of the air in the housing 8 greatly promotes the heat transfer on the inner wall side of the housing 8, so that there is an advantage that the heat is efficiently radiated through the wall surface of the housing 8. Although the first opening 11 and the second opening 12 are provided one by one in the above description, the present invention is also applicable to the case where each has a plurality of openings.

FIG. 7 shows another embodiment of the present invention. In this embodiment, there is a fan 15 having a swinging mechanism at the first opening 11 on the inlet side of the housing 8,
A high heat generating element 16 is provided near the swinging fan 15, and a low heat generating element 17 is provided apart from the swinging fan 15. The second opening 12 on the exhaust side is provided on the wall surface facing the first opening.

In such a structure, the high heat generating element 16 is effectively cooled by the high speed and large turbulent flow from the swinging fan 15, and the low heat generating element 17 is also appropriately cooled because the cooling air blows periodically. It

In the present embodiment, one centralized cooling fan 15 is used for local concentrated cooling for the high heat generating element 16 and overall cooling for the other elements in the housing 8 shown by the low heat generating element 17.
Can be done at the same time.

FIG. 8 shows another embodiment of the present invention. The entire surface of the fan 18 is not made of metal or is metal-plated. The side wall of the housing 8 is provided with a first opening 11 having substantially the same size as the fan 18. The first opening is provided with a coarse mesh 19 that does not allow fingers to enter. In the present embodiment, the fan 18 is attached so as to be in close contact with the mesh 19 provided in the first opening 11. In this embodiment, the first opening 1
1 may be on the intake side or the exhaust side.

In such a structure, since the flow resistance of the mesh 19 attached to the first opening 11 is very small, the performance of the fan 18 can be sufficiently brought out,
A large cooling air volume and low fan noise can be realized. In addition,
Despite the large opening area in the first opening 11,
Electromagnetic radiation noise generated by the electronic components inside the housing 8 is shielded by the fan 18 and therefore does not leak outside the housing. In this embodiment, since the side wall of the housing 8 and the fan 18 can be brought into close contact with each other, there is an advantage that the space inside the housing 8 can be effectively used.

[0022]

According to the present invention, the structure for moving an object near the surface of a heat sink capable of improving the heat transfer performance without increasing noise and the structure for vibrating the air in the housing, or the electromagnetic shielding property. By using a fan structure having a surface made of metal or plated with metal, it is possible to provide a semiconductor cooling device which is effective for cooling a high heat generating element placed in a narrow space and has low noise.

[Brief description of drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention.

FIG. 2 is a side view of the first embodiment of the present invention.

FIG. 3 is an explanatory diagram of a second embodiment of the present invention.

FIG. 4 is a top view of a second embodiment of the present invention.

FIG. 5 is a side view of the third embodiment of the present invention.

FIG. 6 is a side sectional view of another embodiment of the present invention.

FIG. 7 is a top sectional view of still another embodiment of the present invention.

FIG. 8 is a perspective view of another embodiment of the present invention.

FIG. 9 is a top cross-sectional view of a conventional electronic device housing.

[Explanation of symbols]

1 ... Semiconductor module, 2 ... Base, 3 ... Impeller, 4 ...
motor.

Claims (5)

[Claims] 1. A semiconductor cooling device comprising a motor, an impeller, and a base portion that holds them and is connected to an upper surface of a semiconductor module, wherein the impeller has a bottom portion which is substantially in contact with the base portion. The semiconductor cooling device according to claim 1, wherein the blade shape of the impeller is formed so that air is discharged upward and obliquely upward or laterally by rotation of the impeller. 2. A semiconductor comprising a plurality of wheels, at least one of which is connected to a rotating means, and a belt, which is provided between the wheels and has a plurality of protrusions on the outside, mounted above a semiconductor module. Cooling system. 3. A housing having a substrate and the like on which electronic components are mounted, wherein a plurality of openings are provided on an outer wall of the housing,
A semiconductor cooling device, wherein an elastic chamber having a movable means is attached to one of the opening groups inside the housing so as to cover the opening group. 4. A housing having a substrate or the like on which electronic components are mounted, wherein a plurality of openings are provided on the outer wall of the housing, and a fan having a swinging mechanism is attached to the opening-side opening group. A semiconductor cooling device. 5. A casing having a substrate or the like on which electronic components are mounted, wherein a plurality of openings are provided on the outer wall of the casing, and a mesh having a degree of roughness such that a finger cannot be inserted into one opening group. And a fan whose surface is metallic or plated is closely attached to the opening group.