JPH09271935A - Intra-plane composition method of metallic plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize the intra-plane composition of a metallic plate in which the work is easy and the joined condition is excellent by flowing the pulse current between two metallic plates in contact with each other in the same plane. SOLUTION: A part of a metallic plate 1 is pressed to form a hole 3, and another metallic plate 2 is punched to form a blank 4 of the same shape as the hole 3. When the blank 4 is fitted to the hole 3 in the metallic plate 1, an electrode 5 is fitted to the blank 4, and an electrode 6 is fitted to the metallic plate 1 to flow the pulse current, both members are fused by the plasma discharge generated at the contact surfaces of the blank 4 with the metallic plate 1. A composite material in which the expensive material is used only at the necessary parts can be formed. Because both members are joined and integrated with each other through fusion or diffusion, they can withstand the large external force, and if the blank 4 of different electromagnetic characteristic is fitted, the material of different nature from that of the metallic plate l can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a composite material by joining two metal plates in the same plane.

[0002]

2. Description of the Related Art A composite material is a material in which two or more kinds of materials are combined to realize characteristic characteristics as compared with plain materials. Among the composite materials, two metal plates are joined in the same plane, and the two metal plates are formed by welding or using an adhesive.

[0003]

However, welding requires not only a large-scale apparatus but also the work of a skilled worker. Also, it is difficult to obtain sufficient bonding strength with an adhesive.

The present invention has been made in view of the above circumstances, and has as its object to provide an in-plane composite method of a metal plate capable of obtaining a good bonding state.

[0005]

SUMMARY OF THE INVENTION In accordance with this object, an in-plane composite method for a metal plate according to the present invention is provided between the two metal plates in a state where the two metal plates are brought into contact in the same plane. It is characterized by conducting a pulse current.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below with reference to the drawings showing one embodiment. When two metal plates are combined in the same plane, one metal plate 1 and the other metal plate 2 are prepared as shown in FIGS. A hole 3 is formed by punching a part of one metal plate 1 by press working. Further, a blank 4 having the same shape as the hole 3 is formed by punching the other metal plate 2. Next, the blank 4 is fitted into the hole 3 of the one metal plate 1. Next, the electrode 5 is attached to the fitted blank 4 and the electrode 6 is attached to one of the metal plates 1, and a pulse current is passed between the two materials. Plasma discharge is generated at the contact surface between the blank 4 and one of the metal plates 1, and the two materials are locally fused. With the passage of time, the fusion portion increases and the joining of the two materials is completed. The electrodes 5 and 6 are graphite electrodes, and especially the electrode 6 is a cylindrical electrode.

Next, if the combination of the materials is inappropriate or the melting point is high and the joining cannot be performed, the ultrathin third metal plate 7 having a low melting point is used for both materials, ie, the blank 4.
And one of the metal plates 1. One of the methods of fitting the extremely thin third metal plate 7 between the two materials is to fit the blank 4 into the hole 3 of one metal plate 1 as shown in FIGS. Then, the third metal plate 7 is sandwiched between the blank 4 and one of the metal plates 1, and is inserted between the blanks 4 while being punched by the blank 4. By doing so, the third metal plate 7 made of an extremely thin plate having a low melting point is interposed between the contact surfaces of the two materials, albeit in a small amount. These inclusions dissolve faster than the other materials by the pulse current, and connect the two materials.

[0008]

【Example】

(1) When a pulse current of 1000 A was conducted between the two materials in a state where the copper plate and the copper plate were brought into contact with each other, the two materials were joined well. (2) When an ultra-thin aluminum plate was interposed between the copper plate and the iron plate and a pulse current of 1000 A was conducted between the two materials, the two materials were joined well.

[0009]

As described above, according to the present invention, a composite material can be easily formed, and it becomes possible to use an expensive material only at a necessary portion of an inexpensive material. In the present invention, since both materials are joined by fusion or diffusion, both materials are integrated. Therefore, it can withstand a strong external force, and if a member having a different electromagnetic property is fitted, a material having a property different from that of the base material can be obtained. Since the plate thickness can be made the same, it can be used as a material for continuous press working.
Thus, according to the present invention, it is possible to obtain an in-plane composite method of a metal plate that does not require a large-scale device, is easy to operate, and can obtain a good bonding state.

[Brief description of drawings]

FIG. 1 is a process explanatory view showing a state in which an in-plane composite method of a metal plate is carried out.

FIG. 2 is a cross-sectional explanatory view showing an embodiment of an in-plane composite method of a metal plate.

FIG. 3 is a process explanatory view showing a state of carrying out another in-plane composite method of a metal plate.

FIG. 4 is an explanatory cross-sectional view showing an embodiment of another in-plane compounding method for a metal plate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 One metal plate 2 The other metal plate 3 Hole 4 Blank 5 Electrode 6 Electrode 7 Third metal plate

Claims (4)

[Claims] 1. An in-plane composite method of a metal plate, wherein a pulse current is conducted between the two metal plates in a state where the two metal plates are brought into contact in the same plane. 2. The method according to claim 1, wherein a low melting point metal is interposed between the two metal plates. 3. A part of one metal plate is punched by press working, a blank formed by punching the other metal plate is fitted into the formed hole, and a pulse current is applied between the one metal plate and the blank. The method for in-plane compounding of a metal plate, characterized in that: 4. The in-plane composite method for a metal plate according to claim 3, wherein a low melting point metal is interposed between the one metal plate and the blank.