JPH0927140A - Optical pickup and manufacture therefor - Google Patents

Abstract

PURPOSE: To miniaturize the packaging of an optical pickup. CONSTITUTION: This pickup is provided with a light source 1, a light guiding member 5 having plural inclined surfaces 5a, 5b, 5c inclined with respect to the incident direction of a light irradiated from the light source 1, a light receiving element 13 receiving lights coming after being reflected from a recording medium 27 and also converting received optical signals into electric signals and a package housing the light source 1, the light guiding member 5, the light receiving element 13. The light guiding member 5 makes the light from the light source 1 reflect on the plural inclined surfaces 5a, 5b, 5c to guide them to the recording medium 27 and also guides lights coming by being reflected from the recording medium 27 to the light receiving element 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical pickup for recording or reproducing information on an optical element, an optical disk or the like, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, it has been desired to reduce the size of an optical disk device for recording and reproducing information by using a laser beam. Have been done. Small optical pickup
The reduction in weight is advantageous not only for downsizing the entire apparatus but also for improving performance such as shortening access time. In recent years, use of a hologram optical pickup has been cited as a means for reducing the size and weight of an optical pickup, and some of them have been put to practical use.

[0003]

However, in the above-described conventional structure, the distance from the light source to the recording medium is long, and a large number of independent optical members are provided between them, which limits the miniaturization of the packaging of the optical pickup. Had the problem that there is.

An object of the present invention is to reduce the packaging of an optical pickup.

[0005]

In order to achieve this object, a light source, a light guide member having a plurality of inclined surfaces inclined with respect to the incident direction of light emitted from the light source, and receiving light. A light receiving means for converting the received light signal into an electric signal together with a light source, a light guide member, and a housing member for housing the light receiving means are provided, and the light guide member reflects the light from the light source on a plurality of inclined surfaces. The structure is such that the light reflected from the recording medium is guided to the light receiving unit while being guided to the recording medium.

[0006]

With this structure, the packaging of the optical pickup can be dramatically reduced in size while maintaining the conventional performance.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The packaging of a first optical pickup according to an embodiment of the present invention will be described below with reference to the drawings.

1 and 2 are sectional views showing a packaging structure of an optical pickup according to an embodiment of the present invention.

Reference numeral 1 denotes a light source. As the light source 1, various lasers such as a semiconductor laser and a gas laser such as He-Ne can be considered. Here, it is preferable to use a semiconductor laser which is the smallest in size among them and can be downsized as a whole and which has a low unit price and an output of several mW to several tens mW. Semiconductor lasers made of AlGaAs, InGaAsP, I
nGaAlP, ZnSe, GaN, and the like are conceivable. Here, AlGaAs, which is most commonly used and is inexpensive, is used. Furthermore, when performing high-density recording, the spot diameter on the recording medium can be made smaller, and
It is preferable to use a semiconductor laser such as InGaAlP or ZnSe having a shorter wavelength than s.

Reference numeral 2 denotes a submount, and the submount 2 has a rectangular parallelepiped shape or a plate shape, and the light source 1 is attached to the upper surface thereof. This submount 2 is a light source 1
And has the function of releasing the heat generated by the light source 1. In consideration of thermal conductivity and the like, a method of press-bonding a foil (thickness of several μm to several tens of μm) of Au—Sn, Sn—Pb, In or the like at high temperature is used for joining the submount 2 and the light source 1. preferable. If the light source 1 and the submount 2 are not mounted substantially horizontally, they will cause aberrations of the optical system.
Therefore, at the time of joining, it is preferable that the light source 1 be mounted on the submount 2 at a predetermined position at a predetermined height and substantially horizontally. Further, an electrode surface 2a is provided on the upper surface of the submount 2 so as to make electrical contact with the lower surface of the light source 1. This electrode surface 2a is for supplying power to the light source 1,
As the metal film forming a, it is preferable to use a thin film of Au in consideration of conductivity and corrosion resistance. Further, the submount 2 has a high thermal conductivity and a coefficient of linear expansion of that of the light source 1 (about 6.5 × 10 ⁻⁶ / ° C.) due to heat generated by the light source 1 and mounting problems with the light source 1. A material close to () is preferable. Specifically, a substance having a linear expansion coefficient of 3 to 10 × 10 ⁻⁶ / ° C. and a thermal conductivity of 100 w / mK or more, such as AlN or Si.
It is preferable to use C, T-cBN, Cu / W, Cu / Mo, Si, etc., and especially diamond, etc., when the thermal conductivity must be extremely high when a high-power laser is used. When the linear expansion coefficients of the light source 1 and the submount 2 are set to be the same or close to each other, it is possible to suppress the occurrence of distortion between the light source 1 and the submount 2, so that The mounting part comes off,
It is possible to prevent inconveniences such as cracking of the light source 1. However, if the distance is out of this range, a large distortion is generated between the light source 1 and the submount 2, and there is a possibility that the attachment portion between the light source 1 and the submount 2 is detached, and a crack or the like occurs in the light source 1. Get higher. Further, by making the thermal conductivity of the submount 2 as large as possible, the heat generated in the light source 1 can be efficiently released to the outside. However, when the thermal conductivity is equal to or less than this limit, the heat generated by the light source 1 is difficult to escape to the outside, so that the temperature of the light source 1 increases, the output of the light source 1 decreases, and the life of the light source 1 is shortened. In the worst case, the light source 1 is likely to be broken. In this example, AlN was used because it is relatively inexpensive and has excellent properties for both of these two characteristics. Further, it is preferable to form a thin film on the upper surface of the submount 2 in order of Ti, Pt, and Au from the submount 2 toward the light source 1 in order to improve the bonding property with the light source 1.

Reference numeral 3 is a block, and the block 3 is basically rectangular parallelepiped and has a large protrusion 3a on its side surface, and the submount 2 is attached to the upper surface thereof. Like the submount 2, the block 3 also has a high thermal conductivity and a material having a linear expansion coefficient close to that of the submount 2, for example, due to heat generated from the light source 1 and problems such as attachment to the submount 2. It is preferable to use Mo, Cu, Fe, Kovar, 42 alloy or the like other than those shown in the material examples of the submount 2. However, the requirements for these characteristic values are not so strict as compared with the submount 2, so that it is preferable to select them with emphasis on cost. Here, the block 3 is formed of a material such as Cu or Mo which is very inexpensive as compared with AlN and has relatively excellent characteristics. Further, in consideration of thermal conductivity and the like in joining the block 3 and the submount 2, Au-Sn, Sn-Pb, I, although slightly expensive, is also used, as in the case of the submount 2 and the light source 1.
It is preferable to press-bond a foil such as n (thickness several μm to several tens μm) at high temperature.

A heat radiating plate 4 serves to radiate the heat generated by the light source 1 and transmitted through the submount 2 and the block 3 by conduction to the outside.
Various members forming the optical pickup are mounted thereon, and serve as a packaging substrate. The block 3 is fixed to the upper surface of the heat dissipation plate 4 by brazing, cream soldering or the like. As the material of the heat dissipation plate 4, C having high thermal conductivity is used.
u, Al, Fe, etc. are considered.

The submount 2 and the block 3 are shown here.
Are formed separately, but when the output of the light source 1 is high and a higher thermal conductivity is required for these members, these members are integrally formed in order to improve the thermal conductivity. Is preferred. In this case, it is preferable to use those having extremely high thermal conductivity such as AlN.

It is desirable that the block 3 is larger than the submount 2 so that the contact area with the heat sink 4 is large.

Since the light source 1 is required to have high accuracy with respect to the optical axis, the upper surface of the submount 2 is preferably horizontal with high accuracy. Therefore, it is preferable to pay close attention to the mounting of the submount 2, the block 3, and the heat sink 4.

Reference numeral 5 is a light guide member, and the light guide member 5 has a rectangular parallelepiped shape, and inside thereof, there are a total of three slopes including a first slope 5a, a second slope 5b and a third slope 5c. 1
It has one V-shaped groove 5d. A reflection type diffraction grating 6 for separating the light emitted from the light source into 0th-order diffracted light (hereinafter referred to as main beam) and ± 1st-order diffracted light (hereinafter referred to as side beam) is provided on the first slope 5a. Has been. However, if the tracking is performed by a method other than the three-beam method (for example, push-pull method), the diffraction grating 6 may be omitted. In addition, the second slope 5b can freely convert the diffusion angle of the emitted light with respect to the diffusion angle of the incident light from the light source 1, and has a wavefront aberration that integrates the emitted light in the middle path. The divergence angle conversion hologram 7 that can be removed as an ideal spherical wave, the reflection film 8 and the reflection film 126 that reflect the returning light and guide it to a predetermined position, the main beam and the side beam from the diffraction grating 6. A first beam splitter film 9 that transmits or reflects light and an astigmatism generation hologram 10 formed of a reflection hologram are formed. However, when the amount of light on the surface of the recording medium is sufficient (for example, the output of the light source 1 is large, the rotational linear velocity of the recording medium is low, etc.), the diffusion angle conversion hologram 7 may be omitted. Further, in this case, the diffraction grating 6 may be provided at a position where the diffusion angle conversion hologram 7 is present. Further, the function of removing the wavefront aberration may be provided not in the diffusion angle conversion hologram 7 but in another optical member (for example, an objective lens). On the third slope 5c, a second beam splitter film 11 that transmits or reflects the returned light and a polarization separation film that reflects a light wave of a specific component, like the first beam splitter film 9. A reflecting film 125 that reflects the light 12 and the returning light and guides the light to a predetermined position is formed. Further, the light guide member 5 is adhered to the protrusion 3a of the block 3 on its side surface. The bonding material used for this purpose must have conditions such as high adhesive strength, workability that can be fixed at any moment, small changes in volume due to changes in volume before and after curing and changes in temperature and humidity, that is, low shrinkage. It is required, and by satisfying these, workability and stability of the joint surface can be improved. Here, a UV adhesive which is instantly cured by irradiating ultraviolet rays is used as such a bonding material. Further, a moisture-absorbing and curing instant adhesive may be used. It is preferable that the contact area (S) between the block 3 and the light guide member 5 is S> 1 mm ² in order to have a sufficient mounting strength.

Reference numeral 13 is a light receiving element, and the light receiving element 13 is composed of various electric circuits formed on a plate-shaped semiconductor wafer, and is attached to the bottom surface of the light guide member 5. Regarding the attachment of the light receiving element 13 and the light guide member 5, there is a large adhesive strength, workability that can be fixed in a short time, a change in volume before and after curing and a change in volume due to temperature and humidity are small, that is, a low shrinkage ratio, etc. Is required, and by satisfying these conditions, workability and stability of the joint surface are improved. As such a bonding material, a UV adhesive having particularly good workability was used because it is instantaneously cured by irradiating ultraviolet rays. Note that a moisture-absorbing-curing instant adhesive may be used. The light receiving element 13 has a plurality of light receiving portions for receiving the light signal emitted from the light source 1 and reflected by the light guide member 5 and the recording medium and returned. The light signal detected by the light receiving unit is converted into an electric signal according to the light amount. This electric signal has the magnitude of the current value at the beginning of the conversion.
However, this current has the disadvantages that it is very weak and that noise is easily picked up. For this reason, it is preferable here to use, as the light receiving element 13, an element formed with an IV amplifier having a function of converting a current value to a correlated voltage value and amplifying it. However, it is required that the response of the output voltage be good with respect to the incident frequency of light.
By forming this IV amplifier in the light receiving element 13, it is possible to reduce the loss of electric signals and it is not necessary to provide an OP amplifier outside, so that the number of parts can be reduced and the surface of the light receiving element 13 can be further reduced. A plurality of electrodes 13a composed of a thin film of Al or the like for extracting the received information as a signal are provided.

14 is a package, and the package 14 is
On the upper surface of the heat radiating plate 4, the above-described block 3 and the light guide member 5,
It is provided so as to surround the light receiving element 13 and the like, and a lead frame 14a used for extracting an electric signal from the light receiving element 13, supplying power to the light source 1, and the like is molded therein. The shape of the package 14 is a rectangular parallelepiped shape with a hollow central portion.
The step 14 is formed on the inner surface of the package 14 on the side where the mold 4a is molded so as to expose the legs 14b of the lead frame.
c is provided. The outer peripheral shape of the package 14 may be cylindrical or the like. And the light receiving element 13
1 of the lead frame exposed on the step 14c provided on the package 14 for extracting the electric signal from the lead frame 1.
4b and a plurality of electrodes 13a provided on the surface of the light receiving element 13 are connected by wire bonding with a wire 14d formed of Au, Al or the like. Further, in order to supply power to the light source 1, the legs 14 of the lead frame exposed at the step 14c provided on the upper surface of the light source 1 and the package 14.
b is bonded to the lower surface of the light source 1 on the upper surface of the submount 2 so as to be in electrical contact with the lower surface of the light source 1 and the lead exposed on the step 14c provided on the package 14. The legs 14b of the frame are also connected by wire bonding with wires 14d. The material of the package 14 is required to be excellent in low water absorption, low outgassing, and the like. Here, a thermosetting resin such as an epoxy resin, which is the most common, is used as the IC mold. The material of the lead frame 14a is Cu, 42 alloy, F
In many cases, a metal such as e is plated with Ag or Au. Here, Cu is plated with Ni, and A is applied on top of it.
A u-plated product was used. Further, for attachment between the package 14 and the heat radiating plate 4, a bonding material having properties such as high adhesive strength, low water absorption, and high airtightness (low leak characteristics) is used. As a result, the stability of the bonding surface and bonding position can be improved, and impurities can be prevented from entering the inside of the packaging of the optical pickup. Here, although it takes some time to bond, an inexpensive epoxy adhesive excellent in these properties was used.

Reference numeral 15 denotes a shell, and the shell 15 also has an outer shape like a hollowed-out rectangular parallelepiped like the package 14, and its horizontal cross section is substantially the same as that of the package 14. . The material is required to have characteristics such as low water absorption and low outgassing in order to prevent impurities from being mixed into the interior of the packaging. Here, polybutylene terephthalate (hereinafter referred to as PBT) having excellent properties is used. However, in particular, when characteristics excellent in strength, dimensional accuracy, and the like are required, an LCP that is more expensive than PBT but has these characteristics may be used. And the adhesion between the shell 15 and the package 14 is
An epoxy adhesive was used for the same reason as the attachment of the package 14 and the heat sink 4 described above. This shell 1
Instead of using 5, the height of the side wall portion of the package 14 may be made higher than that of the light guide member 5 for substitution.

Reference numeral 16 is a cover member, and the cover member 16 prevents dust and dirt from adhering to the light guide member 5, the light receiving element 13 and the like, and is attached to the upper surface of the shell 15 with an epoxy adhesive. ing. Further, as the material of the cover member 16, it is preferable to use glass such as BK-7, FK-1, and K-3, or resin having high light transmittance such as urethane, polycarbonate, and acrylic.
When reading a magneto-optical signal, it is not preferable to use a member having birefringence even if the light transmittance is high. Further, an antireflection film 16a is formed on both upper and lower surfaces of the cover member 16 to prevent reflection. This antireflection film 16a is M
It is preferably formed of a material such as gF ₂ . However, if reflection on the surface of the cover member 16 does not pose a problem, the antireflection film 16a may not be provided.

As for the positional relationship between the cover member 16 and the light guide member 5, it is considered that the cover member 16 and the light guide member 5 are in contact with each other and a space is provided between them. When the two are brought into contact, the light guide member 5 is attached to the bottom of the cover member 16 with an epoxy-based adhesive or a UV adhesive. At this time, the thickness (t1) of the cover member 16 is set to 0.3 ≦ t1 ≦ 3.0 (m
m) is preferable. The reason for this is that if the lower limit is made thinner than this, the cover member 16 may not be able to withstand the weight of the light guide member 5 or the like attached thereto or the tension when the adhesive is hardened, and may be damaged. Regarding the upper limit, since the cover member 16 has a larger refractive index than air, a converging action is generated on the light and the light does not spread. As a result, the cover member 16 and the collimator lens (in the case of an infinite optical system) or the objective lens This is because there is no choice but to increase the distance from (in the case of a finite optical system), which is disadvantageous for downsizing the pickup unit.
By using such a structure, the height of the packaging of the optical pickup can be further reduced, and the pickup unit can be downsized while maintaining sufficient mounting strength.

On the other hand, when a space is provided between the two, the thickness (t2) of the cover member 16 is set to 0.1≤t2≤.
3.0 (mm), and the distance (d) between the cover member 16 and the light guide member 5 is also preferably 0.1 ≦ d ≦ 3.0 (mm). The reason for this is that the lower limit of t2 is different from the previous example in that the light guide member 5 is not attached, and it is only necessary to withstand external factors such as vibration. Also, as for d, the smaller the better, the better. However, there is a possibility that the accuracy error during assembly cannot be reduced to 0.1 mm or less. In this case, the cover member 16 comes into contact with the light guide member 5 during assembly and breaks. There is a risk that it will. By using such a configuration, the block 3 or the submount 2 is brought into thermal contact with another member while improving the relative positional accuracy between the light guide member 5 and the light source 1, the submount 2, and the block 3. Therefore, the heat generated in the light source 1 can be easily released to the outside.

From the viewpoint of preventing oxidation of the light source 1 and the light receiving element 13, the inside of the packaging of the optical pickup is
A dry antioxidant gas such as N ₂ gas or Ar, N
It is preferable to fill an inert gas such as e or He. In this case, the gap 17 existing between the heat radiating plate 4 and the light receiving element 13 is filled with a bonding material having characteristics such as a small shrinkage ratio, low water absorption, and high airtightness (excellent leak characteristics), for example, an epoxy potting agent. It is necessary to fill with solder or solder. Thereby, the inside airtightness can be improved. Further, in this case, the cover member 16 also has a function of separating the inside and the outside of the packaging.

By using the configuration shown above,
The heat generated by the light source 1 can be easily released to the outside, and the antioxidant gas can be easily sealed by providing a total of two openings on both end surfaces of the packaging. Further, in the optical system, the relative positional relationship between the light source 1, the light guide member 5, and the light receiving element 13 can be correctly and firmly maintained. do not do.

Next, the operation of the optical pickup according to the embodiment of the present invention will be described with reference to the drawings. FIG. 3 is a conceptual diagram of the operation of the optical pickup in one embodiment of the present invention, and FIG. 4 is a plan view of the optical pickup in one embodiment of the present invention.

In FIGS. 3 and 4, the laser light emitted horizontally from the light source 1 mounted horizontally on the heat sink 4 via the submount 2 and the block 3 has a plurality of parallel inclined surfaces. A reflection type which is incident on the light guide member 5 from the surface 5f of the light guide member 5, is formed on the second inclined surface 5b of the light guide member 5, and has a function of converting the diffusion angle of the emitted light with respect to the diffusion angle of the incident light. To reach the diffusion angle conversion hologram 7. The diffusion angle conversion hologram 7 freely converts the diffusion angle of the reflected light from the diffusion angle conversion hologram 7 with respect to the diffusion angle of the light beam that can be incident on the diffusion angle conversion hologram 7 among the light emitted from the light source 1. can do. Further, the light can be converted into parallel light having no diffusion angle by the diffusion angle conversion hologram 7. Further, as shown in FIG. 3, the same divergence angle conversion hologram 7 forms an ideal spherical wave 30 from which the wavefront aberration that the light flux emitted from the light guide member 5 is integrated in the midway path is removed. Therefore, the incident light on the objective lens 26 becomes an ideal spherical wave 30, and the image formation spot on the recording medium 27 by the objective lens 26 has a size narrowed down to about the diffraction limit, so that information recording or reproduction can be performed reliably. You can

The light whose diffusion angle is converted by the diffusion angle conversion hologram 7 and reflected is divided into a main beam and a side beam by a reflection type diffraction grating 6 formed on the first slope 5a. The main beam and the side beam generated by the diffraction grating 6 enter the first beam splitter film 9 (first beam splitter film having polarization selectivity). Of the light that enters the first beam splitter film 9, the light that passes through the first beam splitter film 9 is used as the power monitor light of the light emitted from the light source 1. Further, the main beam and the side beam reflected by the first beam splitter film 9 are the surface 5 of the light guide member 5.
After passing through e and a cover glass (not shown), the light enters the objective lens 26 and is focused on the information recording surface 27a of the recording medium 27 by the condensing action of the objective lens 26. This time,
On the information recording surface 27a, the beam spots 29a and 29c of the two side beams are imaged at positions substantially symmetrical with respect to the beam spot 29b of the main beam. Information recording or reproduction signals, tracking, and focusing, so-called servo signals are read from the information recording surface 27a by beam spots 29b, 29a, and 29c of main beams and side beams.

The return light of the main beam and the side beam reflected by the information recording surface 27a of the recording medium 27 is the surface 5e of the objective lens 26, the cover glass, and the light guide member 5.
And again enters the first beam splitter film 9 formed on the second slope 5b of the light guide member 5.
The first beam splitter film 9 is light having an oscillating component perpendicular to the light incident surface (hereinafter simply referred to as S-polarized component).
And has a constant reflectance, and has a transmittance of almost 100% for a parallel vibration component (hereinafter simply referred to as a P-polarized component).

Of the return light from the recording medium 27, the light passing through the first beam splitter film 9 is the second light formed on the third slope 5c parallel to the first slope 5a of the light guide member 5. The light enters the beam splitter film 11 (the second beam splitter film having polarization selectivity). The second beam splitter film 11 has a constant reflectance for the S-polarized component and a transmittance of almost 100% for the P-polarized component, like the first beam splitter film 9.

Here, the transmitted light 117 of the light flux incident on the second beam splitter film 11 will be described. The transmitted light 117 is emitted from the V-groove substrate 3 stacked on the third slope 5c.
Incident on 1. FIG. 5 is a perspective view of a V-shaped groove substrate of an optical pickup according to an embodiment of the present invention. A V-shaped groove portion (hereinafter referred to as a V-shaped groove) 5d is formed on the V-shaped groove substrate 31 by molding or cutting, and the third slope 5 is formed.
It is laminated on c. Second beam splitter film 1
The transmitted light 117 from No. 1 is reflected by the reflecting surface 31 a of the V-groove substrate 31 on which the reflecting film of the groove portion is formed.

FIG. 6 is a diagram showing the arrangement of the light receiving portion and the signal processing of the optical pickup in one embodiment of the present invention. The reflected light 120 from the reflecting surface 31a of the V-groove substrate 31 enters the polarization separation film 12 formed on the third slope 5c. The P-polarized component of the reflected light 120 is almost 10 due to the polarization separation film 12.
The light is transmitted by 0%, is further reflected by the reflection film 8 formed on the second inclined surface 5b of the light guide member 5, and reaches the light receiving portion 170 on the light receiving element 13. On the other hand, the S-polarized component of the reflected light 120 from the reflecting surface 31a of the V-groove substrate 31 is the polarization separation film 1
Almost 100% of the light is reflected by 2 and reaches the light receiving portion 171 on the light receiving element 13.

Next, the reflected light 123 of the light beam incident on the second beam splitter film 11 will be described. The reflected light 123 is incident on the astigmatism generation hologram 10 formed of a reflection type hologram on the second slope 5b. Here, the reflected light 123 is reflected while generating astigmatism, further reflected by the reflective film 125 on the third slope 5c, reflected by the reflective film 126 on the second slope 5b, and then returned by the main beam. The light is received by the light receiving section 172 on the light receiving element 13, and the return light of the side beam is received by the light receiving sections 176 and 17 on the light receiving element 13.
Reach 7.

Next, the reflected light 123 of the light beam incident on the second beam splitter film 11 will be described. The reflected light 123 is incident on the astigmatism generation hologram 10 formed of a reflection type hologram on the second slope 5b. Here, the reflected light 123 is reflected while generating astigmatism, further reflected by the reflective film 125 on the third slope 5c, reflected by the reflective film 126 on the second slope 5b, and then returned by the main beam. The light is received by the light receiving section 172 on the light receiving element 13, and the return light of the side beam is received by the light receiving sections 176 and 17 on the light receiving element 13.
Reach 7.

The operation of the light guide member 5 having a structure different from that of the above embodiment will be described below with reference to the drawings. FIG. 7 is a side view of the optical pickup according to the embodiment of the present invention, and FIG. 8 is a plan view of the optical pickup according to the embodiment of the present invention.

The optical pickup in this embodiment includes a block 301, a submount 302, a light source 303, a diffusion angle conversion hologram 306, a diffraction grating 307 and an objective lens 30.
9, the first beam splitter film 308, the second beam splitter film 316, the light receiving element 319 and the like are arranged in the same manner, but instead of the V-groove substrate of the above-described embodiment, the first slope 305a and the second slope 305a are provided. Slope 305b and third slope 305
½ wave plate 31 on the fourth slope 305d parallel to c
8 is laminated.

In this embodiment, the light path from the light source 303 to the recording medium 310 and the light path from the recording medium 310 to the second beam splitter film 316 are the same as those in the above-described embodiments. FIG. 9 is a diagram showing the arrangement of a light receiving portion of an optical pickup and signal processing according to an embodiment of the present invention. The transmitted light 317 from the second beam splitter film 316 is a half-wave plate 318 laminated on the fourth slope 305d.
Incident on. The polarization direction of the transmitted light 317 is rotated by 45 degrees by the half-wave plate 318, and the fifth slope 305e parallel to the first slope 305a, the second slope 305b, the third slope 305c, and the fourth slope 305d. The linearly polarized light of 45 degrees is incident on the incident surface of the polarized light separation film 321 formed in the above, and the P polarized light component is transmitted and the S polarized light component is reflected by the action of the polarized light separation film 321. Polarization separation film 32
The P-polarized light component transmitted through 1 reaches the light receiving unit 370. On the other hand, the reflected light 320, which is the S-polarized component reflected by the polarization separation film 321, is reflected by the reflection film 322 of the third slope 305c, further passes through the half-wave plate 318, and then reaches the light receiving unit 371.

Next, the reflected light 323 of the light beam incident on the second beam splitter film 316 will be described.
The reflected light 323 is incident on the astigmatism generation hologram 324 formed of a reflection hologram on the second slope 305b. Here, the reflected light 323 is reflected while generating astigmatism, further reflected by the reflective film 325 of the third slope 305c, reflected by the reflective film 326 of the second slope 305b, and then returned by the main beam. The light reaches the light receiving portion 372 on the light receiving element 319, and the return light of the side beam reaches the light receiving portions 376 and 377 on the light receiving element 319.

Next, the packaging structure of the second optical pickup according to the embodiment of the present invention will be described with reference to the drawings. 10 to 12 are views showing the packaging structure of the optical pickup according to the embodiment of the present invention. However, regarding members having the same names as those of the first packaging, only parts having a configuration different from that of the first embodiment will be described.

Reference numeral 18 denotes a ceramic package, and the ceramic package 18 serves both as the package 14 and the heat dissipation plate 4 in the first embodiment. Therefore, it is preferable to use a material having a high thermal conductivity, such as AlN or Al ₂ O ₃ for efficient heat dissipation. In this embodiment, AlN having a particularly high thermal conductivity is used, but when cost needs to be prioritized, it is preferable to use Al ₂ O ₃ because it is inexpensive. The structure is made by laminating three ceramic substrates, and the substrates 18a, 18a,
18b and 18c. Each board 18a,
On 18b and 18c, patterns used for supplying electric signals from the light receiving element 13 and power supply of the light source 1 are printed on the top surface, bottom surface and side surfaces (through holes, etc.). Further, an electrode 18e for bonding a wire for guiding an electric signal from the light receiving element 13 is exposed on the upper surface of the substrate 18b, and the block 3 is fixed by cream solder or the like. Further, through holes 19a, 19b, 19c are formed in these substrates 18a, 18b, 18c, respectively. The through holes 19a, 19b, 19c may be arranged in series or may be separated as long as they are electrically connected. The through holes 19a, 19b, 19
A thin film made of a material having good conductivity such as Au is formed on the inner surface of c for supplying power, so that the upper surface of the substrate 18a and the lower surface of the substrate 18c are electrically connected. As another method for electrically connecting the upper surface of the substrate 18a and the lower surface of the substrate 18c, a paste of tungsten or the like may be poured into the through holes 19 and then fired together with the ceramic package 18. Through hole 1
It is also possible to use a through hole or the like formed in the side surface of the ceramic package 18 at the time of manufacturing without providing 9. When this method is used, the step of providing the through hole 19 can be omitted. After the various formations described above are completed, the ceramic package 18 is manufactured by firing at a high temperature.

Reference numeral 20 denotes a terminal, and the terminal 20 supplies power to the light source 1. The two terminals 20 are brazed to the electrodes on the lower surface of the substrate 18c, and the electrodes 18d formed on the upper surface of the substrate 18a via the Au surface on the inner surface of the through hole 19 or the pin or through hole. It is electrically connected. Further, the end portion on the opposite side of the terminal 20 is connected to the high frequency superimposed power supply circuit 21 when the light source 1 emits light with high output.

Power is supplied to the light source 1 by an electrode 18d formed on the substrate 18a, an electrode (not shown) formed on the upper surface of the light source 1 and a sub-surface electrically connected to the bottom surface of the light source 1. This is performed by wire bonding the electrode 2a formed on the upper surface of the mount 2.

Reference numeral 22 denotes a cap. The cap 22 is provided so as to cover the light guide member 5, and dust and the like enter the inside of the packaging, causing a problem in the light guide member 5, the light receiving element 13, and the like. Has the function of preventing The cap 22 may be made of any material such as metal or resin as long as it can be easily joined to the ceramic package 18 and has a stable shape.
In particular, when the cap 22 is made of metal, it is expected that the unnecessary radiation generated by the high frequency superimposed power supply circuit 21 and the like will be suppressed, so that the cap 22 is made of Kovar, 42 alloy, Cu.
It is preferably formed of a metal such as.

When purging the inside of the packaging to prevent the oxidation of the light source 1, the gap between the light guide member 5 and the ceramic package 18 is sealed in advance with potting agent or solder, and then N ₂ It is performed by attaching the cap 22 in an atmosphere of an antioxidant gas such as gas.

Next, the mounting of the ceramic package 18 and the cap 22 will be described. The ceramic package 18 and the cap 22 may be attached directly by using an epoxy adhesive or the like, or may be soldered, but this does not provide sufficient airtightness or is used internally. The UV adhesive that has been used is often adversely affected by heat when soldering. Therefore, in this embodiment, the ring 2 is provided between the ceramic package 18 and the cap 22.
It is preferable to sandwich 3 between them. With this structure, it becomes possible to perform electric welding between the ceramic package 18 and the cap 22, and by using this method, the sealing property of the joint is improved and the temperature of the joint is not increased during the joint. Get better The ring 23 is provided on the uppermost substrate 18a of the ceramic package 18, its shape is a substantially rectangular ring shape, and its cross section is rectangular. The material is Kovar,
It is preferable to use a metal such as 42 alloy or Cu. For attachment between the ceramic package 18 and the ring 23, first, a thin film of metallized tungsten is formed on a surface of the ceramic package 18 facing the ring 23, and nickel plating is applied on the thin film, and the nickel-plated surface and the ring 23 are separated from each other. They are joined by Ag brazing or the like. Further, the ring 23 joined as described above is plated with nickel to form an Au surface thereon. Further cap 2
The surface of the second ring facing the ring 23 is also plated with nickel, and then the ring 23 and the cap 22 are joined to each other by a seam welder (a kind of electric resistance welder) or the like.
The attachment between 3 and the cap 22 is made.

The ceramic package 1 described above
In the packaging using 8, the heat generated from the light source 1 and the like can be more efficiently radiated to the outside by using the ceramic package 18 which also functions as a heat dissipation plate. By arranging the terminals 20 below the ceramic package 18, the distance required for connection between the light source 1 and the high frequency superimposed power supply circuit 21 can be shortened.
Unnecessary radiation emitted from the high frequency superimposed power supply circuit 21 can be suppressed by arranging the power supply line and the signal line. Further, by using a metal for the cap 22, unnecessary radiation can be further suppressed.

In this embodiment, the block 3 and the light guide member 5 are bonded and integrated, but they may be separately provided on the ceramic package 18. In this case, the positioning between the light guide member 5 and the light receiving element 13 becomes easy. Further, the light receiving element 13 is the light guide member 5
Although it is attached to the bottom of the ceramic package, it may be attached to the ceramic package 18 as long as it does not cause a problem in optical characteristics. Further, although the ceramic package 18 is formed by laminating three ceramic substrates (three-layer structure) here, the ceramic package 18 may have two layers or one layer instead of the three-layer structure. Also, due to manufacturing reasons, etc.
It is possible that there are more layers.

Next, the packaging structure of the third optical pickup according to the embodiment of the present invention will be described with reference to the drawings. 13 to 15 are diagrams showing the packaging configuration of the optical pickup in one embodiment of the present invention. However, regarding members having the same names as those of the first and second packagings, only parts different from the embodiment shown in FIGS. 1 and 10 to 12 will be described.

Reference numeral 24 denotes a stem, and the stem 24 mounts or holds the light source 1, the submount 2, the light guide member 5 and the like, and is generated in the light source 1 and the like by being formed of a material having high thermal conductivity. It can dissipate heat very efficiently. As such a material, it is preferable to use a metal such as Kovar or 42 alloy, or a ceramic such as Al ₂ O ₃ or AlN. In this embodiment, Kovar is used.
The light guide member 5 is attached to the side surface portion 24 a of the stem 24. If this member is mounted at an angle, optical aberration becomes large and a normal optical pickup cannot be performed. Therefore, the side surface 24a is required to have high verticality and flatness. Here, the inclination of the side surface portion 24a is 90 ° ±
It was set to 0.5 °. Further, in order to realize this precise processing, in this embodiment, the side surface portion 24a of the stem 24 is precisely processed by an end mill or the like. Further, the contact area (S) between the stem 24 and the light guide member 5 is preferably S> 1 mm ² . With such a configuration, the stem 24
And the light guide member 5 can be sufficiently firmly adhered to each other, and the light guide member 5 does not come off even if a large vibration is transmitted from the stem 24. The light guide member 5 may be joined to the side surface portion of the block 3 placed on the stem 24.

A step 24b is formed on the outer peripheral portion of the upper surface of the stem 24.
Is provided, and the cap 22 is fitted along the side wall of the step 24b. The method of attaching them differs depending on the material of the stem 24, but in general, metal resistance welding such as described in connection with the ring 23 and the cap 22 of the embodiment shown in FIG. It is conceivable to use the above adhesive or use a method such as brazing or soldering.

A package 25 includes a lead frame 14a, a light receiving element 13 and a light receiving element 13 in the package 25.
An Au wire or the like for wire-bonding the lead frame 14a and the lead frame 14a is molded. With respect to the package 25, the light receiving element 13 made of Si is molded, and the light passing through the light guide member 5 is received by the light receiving element 13.
Taking into account the fact that
It is desired that the coefficient of linear expansion is close to that of Si, the water absorption rate is low, the material is transparent, and the optical characteristics such as transmittance and refractive index are stable. As such a material, urethane resin is used here. Then, the package 25 and the stem 24 are attached. At this time, an error in the distance between the light guide member 5 and the light receiving element 13 needs to be 50 μm or less due to an optical request, but this adjustment is performed by directly mounting the light guide member 5 on the package 25. Alternatively, the height may be adjusted by adjusting the height of the side wall portion 25a of the package 25. Epoxy adhesive or U
V adhesive may be used, or cream solder or the like may be used for joining.

As described above, in this embodiment, the stem 24 is used and the submount 2 is placed directly on the stem 24, so that the heat conducted by conduction from the light source 1 is efficiently released to the stem 24. It is possible to solve the thermal problem. Further, by molding the light receiving element 13 in the package 25, it is possible to prevent the light receiving element 13 from being exposed to air and being oxidized, and dust and the like being attached to deteriorate the light receiving characteristic.

The light receiving element 13 is not molded in the package 25, but the light receiving element 1 is used as shown in the first embodiment.
3 may be placed and fixed on the package 25,
It may be attached to the bottom of the light guide member 5. In this case, since the material of the package 25 may be a colored material, it is conceivable to use an inexpensive epoxy resin or the like. When purging the inside of the packaging to prevent oxidation of the light source 1, the gap between the light guide member 5 and the stem 24 is previously sealed with a sealant, and then an atmosphere of an antioxidant gas such as N ₂ gas is used. In the cap 22
By installing.

The configurations shown in the above three embodiments are combined, for example, in the first embodiment, instead of adhering the light receiving element 13 to the light guide member 5, the embodiment shown in FIGS. As a matter of course, it may be molded in the package and used. In this case, deterioration of the characteristics of the light receiving element 13 can be prevented. If the entire packaging is included by the metal stem 24 and the metal cap 22 as in the embodiment shown in FIGS. 10 to 12, unnecessary radiation generated by the high frequency superposition circuit can be greatly suppressed.

Next, a method of manufacturing the packaging of the optical pickup having the above-mentioned structure will be described in order from the first embodiment of the structure.

16 to 20 are views showing the manufacturing procedure of the packaging of the optical pickup in one embodiment of the present invention. First, the light source 1, the submount 2 and the block 3 (hereinafter referred to as an LD block) are assembled. Before assembling, especially the side surface portion 3b of the protrusion 3a of the block 3
Must be properly machined so that is perpendicular to the heat sink 4. The submount 2 and the block 3 are manufactured by punching out a pre-plated AlN plate or cutting it out using a dicing saw or the like. At that time, if surface roughness, flatness, and verticality are not sufficient, lapping may be performed. The light source 1 is attached to a predetermined position of the submount 2. Installation is Au-Sn,
This is performed by a method such as using a foil of Sn—Pb, In or the like having a thickness of several μm to several tens of μm, and pressing the foil at a high temperature. Normally, at the same time, the submount 2 and the block 3 are attached by the same method. However, when mounting the light source 1 and the submount 2 and the mounting of the submount 2 and the block 3 by different methods, it is necessary to mount them in order from the one having the highest operating temperature. A Ti or Pt film is formed on the joint surface of these members, and A
It is preferable to form a film of u and bond it there. In particular, it is very preferable to use this method for mounting between the light source 1 and the submount 2 because it leads to improvement in reliability of the light source 1. When assembling these members, the light emitting surface of the light source 1 and the side surface 3b of the protrusion 3a of the block 3 are substantially parallel to each other so that the aberration of light does not increase, and the distance error between both surfaces is 10 μm. Care must be taken to ensure that: By setting the error value in this way, it is possible to suppress variations in product characteristics.

Next, the LD block thus assembled is attached to a predetermined position of the heat dissipation plate 4 in a predetermined state. Although methods such as soldering are used for attachment,
At this time, it is necessary to take care so that the joining material used for assembling the LD block does not melt and the assembly accuracy does not deteriorate. It is possible to maintain the assembly accuracy only by preventing the melting, and it is possible to produce the optical pickup unit without malfunction. Also at this time, a Ti film is also formed on the bonding surface, and Ni or P is formed on the Ti film.
A film of t is formed, and a film of Au is further formed thereon,
Therefore, it is preferable to join them. However, since a very large bonding strength is not required here, Ti--Au, Ti
-Ni film may be used for joining.

As another assembly method, the above-mentioned various thin films are formed in advance on the block 3 and the heat dissipation plate 4, and then A
It is also conceivable that the block 3 and the heat dissipation plate 4 are attached with a glaw or the like, then the submount 2 is attached with cream solder or the various foils described above, and finally the light source 1 is attached with the various foils described above.

Next, the heat sink 4 having the LD block incorporated therein
Attach the package 14 in place on top. An epoxy adhesive is used for attachment. And light receiving element 1
3 is installed in the package 14, and each signal extraction electrode of the light receiving element 13 and the leg 14b of the corresponding lead frame are wire-bonded with the wire 14d. At this time, it is preferable to set the length of the wire 14d used for wire bonding to a little longer in order to finely adjust the position of the light receiving element 13 later. At the same time, for the power source of the light source 1, the electrode surface 2a of the submount 2 that is in contact with the bottom surface of the light source 1 through the upper surface of the light source 1 and the Au surface.
And the lead frame foot 14b as well as the wire 14d
Wire bonding is performed using. At this time, the light receiving element 13 is only wire-bonded and is not fixed to the heat sink 4 or the light guide member 5.

Next, the light guide member 5 is attached to the side surface portion 3b of the block 3. Since this mounting requires extremely high precision, the method will be described in detail here with reference to the drawings. FIG. 21 is a conceptual diagram showing the inconsistency between the 0th-order light and the 1st-order light observed by the CCD in one embodiment of the present invention, and FIG. 22 is the 0th-order light and the 1st-order light observed by the CCD in one embodiment of the present invention. FIG. 23 is a conceptual diagram showing coincidence with light, and FIG. 23 is a conceptual diagram of an observation experiment in one embodiment of the present invention. First, the light guide member 5 held by air tweezers or the like is moved along the side surface portion 3b of the block 3 to roughly align the position. At this time, the light guide member 5
The UV adhesive is applied to at least one of the side surface of the block 3 and the side surface 3 b of the block 3. Then, power is supplied to the light source 1 to cause it to emit light, and the light is introduced into the light guide member 5. The light introduced into the light guide member 5 is separated by the diffusion angle conversion hologram 7 into 0th-order diffracted light and 1st-order diffracted light,
After that, the light is emitted to the outside from the surface 5e of the light guide member 5.
The emitted light passes through a collimator lens (not shown) and the objective lens 26 to form an image at a position where the recording medium 27 should be. At this time, if the relative positions of the light source 1 and the light guide member 5 are correct, the 0th-order diffracted light and the 1st-order diffracted light converted by the diffusion angle conversion hologram 7 only have different depths of focus and focus at the same point. On the recording medium 27, as shown in FIG. 18, it looks like concentric circles. If the relative positions of the light source 1 and the light guide member 5 are not correct, the 0th-order diffracted light and the 1st-order diffracted light converted by the diffusion angle conversion hologram 7 have different depths of focus and focus points. Then, as shown in FIG. 17, there are two different circles. Utilizing this, the charge-coupled device camera 32 (hereinafter referred to as CCD) is set at the position of the recording medium, the deviation between the 0th order diffracted light and the 1st order diffracted light is measured, and the deviation width and the deviation direction are fed back. The light guide member 5 is moved according to the amount so that the images of the two components of light seen by the CCD 32 are concentric. Thereby, the position of the light guide member 5 with respect to the light source 1 can be determined very accurately. After positioning the light guide member 5 in this manner, ultraviolet rays are irradiated to solidify the UV adhesive.

It should be noted that a method of applying an instant adhesive after positioning may be considered instead of the UV adhesive for fixing. In that case, use a type that does not whiten during drying so as not to block light. When this adhesive is used, the step of irradiating ultraviolet rays can be omitted.

As a positioning method, a method of measuring the optical aberration of the first-order diffracted light using a wavefront aberration measuring device or the like and positioning so that the aberration is minimized may be considered. However, when the three-beam method is used as the tracking signal detection method, the side beam also enters the wavefront aberration measuring device, and therefore three different lights are simultaneously measured, which makes it difficult to use this method. .

Next, the light receiving element 13 is attached to the heat radiating plate 4 at a predetermined position. In this case also, since the light reflected by the recording medium 27 must be correctly guided to each light receiving portion of the light receiving element 13, precise relative alignment between the light receiving element 13 and the light guide member 5 is required. is there. Before describing this alignment method, the focus error signal detection by the astigmatism method in the light receiving element 13 and the state of astigmatism in this embodiment will be described with reference to the drawings.

24 to 26 show one embodiment of the present invention when the recording medium 27 is at the in-focus position, when the recording medium 27 is closer to the in-focus position, and when the recording medium 27 is far from the in-focus position. It is an external view of the astigmatic light flux in an example. 27 to 29 are light receiving portions 172a, 172b, 1 provided on the light receiving element 13 of the light generated by the astigmatism generation hologram 10 in the cases of FIGS. 24 to 26, respectively.
It is the figure which showed the spot shape in 72c and 172d.

The astigmatism generation hologram 10 is used as the recording medium 2
7 is at the in-focus position, the first focus 178 is located upstream of the light receiving section 172 and the second focus 1 is located downstream of the light receiving section 172.
When 79 is generated and the x-axis direction and the y-axis direction are taken as shown in FIGS. 27 to 29, a line image in the y-axis direction is formed at the position of the first focal point 178, and an x-axis is formed at the position of the second focal point 179. Will connect the line image of. Further, when the recording medium 27 is at the in-focus position, the astigmatism generation hologram 10 is designed at a position where the spot diameters in the x-axis and y-axis directions generated by the astigmatism become equal and a circular spot shape is formed.

The focus error signal is received by the light receiving section 172a,
Photocurrent from 172b, 172c, 172d (or I-
The voltage converted by the V amplifier) is I172
a, I172b, I172c, and I172d are shown in FIG.
As can be seen from the circuit diagram of, it can be expressed by the following equation.

F. E. FIG. = (I172a + I172c)-
(I172b + I172d) When the recording medium 27 is at the in-focus position, the spot diameters in the x-axis and y-axis directions become equal and a substantially circular spot shape is formed, as can be seen from FIGS. 24 and 27.
Since the total amount of light received at and 172c and the total amount of light received at 172b and 172d are equal, the focus error signal is given by the following equation.

F. E. FIG. = 0 When the recording medium 27 approaches the in-focus position, as shown in FIG. 25, the first focus 178 and the second focus 179 generated in the astigmatism generation hologram 10 move away from the focus error detection element, so that the light receiving unit 172a, 172b, 172c, 172
As shown in FIG. 28, the spot shape on d becomes an elliptical light flux having a major axis in the y-axis direction, and the light receiving portions 172a and 172c.
The amount of light received by is larger than the amount of light received by the light receiving sections 172b and 172d, and the focus error signal is given by the following equation.

F. E> 0 When the recording medium 27 is separated from the in-focus position, the first focus 178 and the second focus 179 generated in the astigmatism generation hologram 10 are astigmatism generation hologram 10 as shown in FIG.
To approach the light receiving portions 172a, 172b, 172c, 1
As shown in FIG. 29, the spot shape on 72d becomes an elliptical light flux having a major axis in the x-axis direction, and the light receiving portions 172b, 17
The light receiving amount of 2d is larger than the light receiving amounts of the light receiving portions 172a and 172c, and the focus error signal is given by the following equation.

F. E <0 The focus error signal detection method described above is known as an astigmatism method.

Therefore, in this embodiment, the light receiving element 13 is positioned using this principle. That is, some method (here, from the hole provided in the heat sink 4 to the light receiving element 1
The light receiving element 13 is held by using air tweezers that adsorb the back surface of 3) to enable fine adjustment of the installation position, and a reflection plate (not shown) is installed at the position of the recording medium 27. At this time, the UV adhesive is applied in advance to the bottom surface of the light guide member 5 or the top surface of the light receiving element 13. Then, first, the intensity of the light reflected by the reflector and returned is monitored by the light receiving portions 170, 171 of the light receiving element 13 and the like to determine the rough optimum position. Then, each of the light receiving portions 172a, 172a of the light receiving portion 172 divided into four is next.
While the current or voltage (proportional to the amount of received light) from 2b, 172c and 172d is monitored, the reflector is intentionally oscillated parallel to the optical axis using a piezo element or the like. As a result, the reflection plate moves closer to or farther from the light receiving element 13. At this time, the light receiving section 172a,
If the light receiving element 13 is moved so that the light amounts of 172b, 172c and 172d are substantially equal to each other, the light receiving element 13 can be precisely positioned with respect to the light guide member 5. The states of signals from the light receiving units 172a and 172b at this time are shown in FIGS. After positioning the light receiving element 13 in this manner, ultraviolet rays are irradiated to solidify the UV adhesive. Then, after that, the gap 17 is closed with an epoxy potting agent or solder in order to seal the hole for the air tweezers.

As a fixing method, it is possible to use an instant adhesive instead of the UV adhesive. In this case, an instantaneous adhesive is applied after positioning. As the instant adhesive, it is preferable to use a type that does not whiten when dried. When the UV adhesive is used for both the adhesion between the block 3 and the light guide member 5 and the adhesion between the light guide member 5 and the light receiving element 13, the light source 1 and the light guide member 5 are bonded together. Is irradiated and ultraviolet rays are irradiated after both the positioning between the light guide member 5 and the light receiving element 13 is completed, or after the UV bonding between the block 3 and the light guide member 5 is completed,
UV adhesive is applied between the light guide member 5 and the light receiving element 13.

It should be noted that the recording medium 2 is actually used without installing a reflecting plate.
7 may be arranged, the recording medium 27 may be rotated to generate surface wobbling, and the position may be adjusted accordingly. Further, here, the method of positioning the light source 1 and the light guide member 5 and the method of positioning between the light guide member 5 and the light receiving element 13 by causing the light source 1 to emit light has been described, but as another method, each component It is also conceivable to perform image recognition of the image using a CCD or the like, recognize positions of those parts and the reference, and position the parts so that the relative position dimension becomes a predetermined dimension.

Finally, in a separate step, a cover member 16 is attached to the upper surface of the shell 15 in advance using an epoxy adhesive, and the bottom surface of this integrated member is attached to the package 14.
To the top of the. Epoxy adhesive is mainly used for attachment. Furthermore, this work is performed with N ₂ , He, Ne, Ar.
By performing in a dry antioxidant gas atmosphere such as
The inside of the packaging of the optical pickup can be purged.

By the manufacturing method as described above,
The packaging of the optical pickup is completed. By using such a manufacturing method, the packaging of the optical pickup having the light guide member 5 having such a shape can be performed more easily and precisely, and the yield can be improved.

Next, a method of manufacturing the packaging of the optical pickup according to the embodiment of the present invention will be described with reference to the embodiment having the structure shown in FIGS. However, description of the same parts as those in the above-described embodiment will be omitted.

32 to 36 are views showing the manufacturing procedure of the packaging of the optical pickup in one embodiment of the present invention. First, the LD block will be described. This L
The D block is attached to the upper surface of the substrate 18b of the ceramic package 18. A method such as cream soldering is used for attachment. At this time, it is necessary to pay attention so that the adhesive portion of the LD block does not melt and shift. The submount 2 is directly mounted on the substrate 18a without using the block 3.
Alternatively, it may be mounted on the upper surface of 18b. In this case, the flatness and parallelism of the contact surface of the ceramic package 18 with the light guide member 5 must be high.

Next, the procedure for manufacturing the ceramic package 18 will be described. First, the three substrates 18a, 18b, which have been press-molded into a predetermined shape but have not yet been sintered,
An electrode (not shown) for supplying power, a pattern electrode (not shown) for taking out a signal detected by the light receiving element 13 to the outside and a ring 23 are attached to the upper surface, the bottom surface or the side surface of each 18c. Form a pattern. Further, a through hole 19 (shown in FIG. 10) is provided so that the terminal 20 and the light source 1 are electrically connected, and a pattern is formed on the inner surface thereof or a metal paste such as W is embedded therein. Each pattern basically metallizes a film of metal such as W. Further, an Au surface is formed at a portion where electrical contact is required. And these three substrates 18a, 18b,
18c are overlaid and fired to form a Ni-plated layer thereon, and the terminals 20 are soldered or Ag to the electrode surface provided on the through hole 19 for taking in the power source.
The ceramic package 18 is completed by mounting it by brazing, and then mounting the ring 23 on the substrate 18a by soldering or Ag brazing, plating it again with Ni, and then plating it with Au.

After that, wire bonding is performed in the same manner as in the above-described embodiment, the light guide member 5 is positioned and then mounted on the block 3, and the light receiving element 13 is also positioned and then mounted on the bottom surface of the light guide member 5. The gap 17 between the opening of the substrate 18c and the light receiving element 13 is also sealed with an epoxy potting agent or the like. After that, the cap 22 is placed on the ring 23 and attached by electric resistance welding, cold pressure welding, soldering, or the like. The packaging of the optical pickup is completed by the above manufacturing procedure. The cap 22 is made of metal, and the cover member 16
If the glass is made of glass, the cap 22 and the cover member 16
It is preferable to use glass bonding as a method of bonding with, because of its low water absorption.

By the manufacturing method as described above,
The packaging of the optical pickup is completed. By using such a manufacturing method, the packaging of the optical pickup having the light guide member 5 having such a shape can be performed more easily and precisely, and the yield can be improved.

Next, a method of manufacturing the packaging of the optical pickup according to the embodiment of the present invention will be described with reference to the embodiment having the structure shown in FIGS. However, the description of the same parts as those in the above embodiment will be omitted.

37 to 41 are views showing the manufacturing procedure of the packaging of the optical pickup in one embodiment of the present invention. First, the LD block including the light source 1 and the submount 2 is attached to the stem 24 at a predetermined position. At this time, care must be taken so that the light emitting surface of the light source 1 and the inner wall of the stem 24, which is the mounting surface of the light guide member 5, are parallel to each other, and the error between the two surfaces is 10 μm. Then, the light guide member 5 is attached to the side surface portion 24a of the stem 24 after the alignment thereof is performed by the same method as in the above-described embodiment. Further, the terminal 20 for supplying power is attached to the stem 24 at a predetermined position in advance. To attach the terminal 20, a hole is formed through the stem 24 at a predetermined position of the stem 24, and the terminal 2 is attached to the center of the hole.
The terminal 20 is set up so that the end of 0 reaches a little above the upper surface of the stem 24, and then an insulator such as glass having a linear expansion coefficient close to that of the material of the stem 24 is poured around it to insulate and fix it. Do it. Further, between the light guide member 5 and the stem 24, except the mounting surface thereof, is not in contact with the stem 24. Therefore, in order to facilitate the purging of this portion later, an epoxy resin or the like is poured to ensure a complete airtightness. Seal it so that it can be kept at

Next, the package 25 is attached to the stem 24. The light receiving element 13 and the lead frame 14a are molded in advance in this package 25. In the manufacturing procedure of the package 25, first, an adhesive such as Ag epoxy is applied to a predetermined position on the lead frame 14a in advance, and the light receiving element 13 is placed and fixed thereon. Then, the wire 14d is used to wire bond between the electrode surface of the light receiving element 13 and the leg 14b of the lead frame. In this case, unlike the previous embodiment, it is not necessary to lengthen the Au wire. After that, the lead frame 14a is put into a molding machine, and transfer molding is performed using a resin such as urethane having high light transmittance and stable transmittance and refractive index to form a package 25. Since the urethane resin or the like used in the package 25 is transparent, light other than the component to be detected may enter the light receiving element 13. Therefore, here, stray light treatment such as satin treatment is performed on the surfaces other than the entrance of the reflected light around the molding material of the package 25 so that light other than the detection target does not enter the light receiving element 13. Further, the package 25 is provided with a through hole so that the terminal 20 can be taken out of the package 25. An epoxy-based adhesive, a UV adhesive, or the like is applied in advance to at least one of the surface of the package 25 facing the stem 24 and the surface of the stem 24 facing the package 25. After adjusting the position by moving the package 25 together with the package 25 by the above method, the stem 24 and the package 25 are adhered, and the cap 22 to which the cover member 16 is attached is attached to the stem 24 in a nitrogen gas atmosphere to remove the optical pickup. Packaging is completed.

By the manufacturing method as described above,
The packaging of the optical pickup is completed. By using such a manufacturing method, the packaging of the optical pickup having the light guide member 5 having such a shape can be performed more easily and precisely, and the yield can be improved.

In the manufacturing method shown in the above three embodiments, when the structures are used in combination, for example, in the first embodiment shown in FIG. 1, instead of adhering the light receiving element to the light guide member, It is molded in a package as in the embodiment shown in FIGS. 13 to 15, but at this time, the manufacturing methods are naturally used in combination.

[0085]

According to the present invention, the packaging of an optical pickup is composed of a light source, an optical guide member, a light receiving element, and a housing member. It was possible to reduce the size to 1/50. Furthermore, since the heat generated by the light source can be efficiently radiated to the outside by using the base and the holding member, it is possible to prevent malfunction and destruction of the light source.
Also, by covering the upper part of the package with a cover member, it is possible to reduce the adhesion of dust and the like to the inside of the package, prevent excessive refraction of light, malfunction and deterioration of the light receiving element, and easily purge the inside of the package. You will be able to. Furthermore, by constructing a part of the storage member with a light-transmissive material and sealing the inside of the storage container, it is possible to prevent dust and the like from adhering to the inside of the package, and also to prevent deterioration of optical characteristics. By sealing between the through hole of the base and the light receiving means, the airtightness of the inside of the packaging can be enhanced, and it is possible to prevent dust and dirt from entering and oxidation and deterioration of each member. Further, by setting the thermal conductivity of the holding member to 100 w / mK or more, the heat generated by the light source can be efficiently dissipated, so that the light source 1 is not adversely affected by the heat.

Further, the base on which the light source and the holding member are mounted and the housing member molded with the connecting member are joined, the light receiving means and the housing member are arranged in a predetermined positional relationship, and the connecting member and the light receiving means are wire bonded. Then, the light guide member is arranged in the housing member, joined to the holding member and the light receiving means, and the housing member and the cover member are joined to each other. The packaging of the optical pickup equipped with the guide member can be performed more easily and precisely, and the yield can be improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing a packaging structure of an optical pickup according to an embodiment of the present invention.

FIG. 2 is a sectional view showing a packaging structure of an optical pickup according to an embodiment of the present invention.

FIG. 3 is a conceptual diagram of the operation of the optical pickup according to the embodiment of the present invention.

FIG. 4 is a plan view of an optical pickup according to an embodiment of the present invention.

FIG. 5 shows the V of the optical pickup according to the embodiment of the present invention.
Perspective view of the groove board

FIG. 6 is a diagram showing a light receiving unit arrangement and signal processing of an optical pickup according to an embodiment of the present invention.

FIG. 7 is a side view of an optical pickup according to an embodiment of the present invention.

FIG. 8 is a plan view of an optical pickup according to an embodiment of the present invention.

FIG. 9 is a diagram showing the arrangement of light receiving portions and signal processing of an optical pickup according to an embodiment of the present invention.

FIG. 10 is a diagram showing a packaging structure of an optical pickup according to an embodiment of the present invention.

FIG. 11 is a diagram showing a packaging structure of an optical pickup according to an embodiment of the present invention.

FIG. 12 is a diagram showing a packaging structure of an optical pickup according to an embodiment of the present invention.

FIG. 13 is a diagram showing a packaging structure of an optical pickup according to an embodiment of the present invention.

FIG. 14 is a diagram showing a packaging structure of an optical pickup according to an embodiment of the present invention.

FIG. 15 is a diagram showing a packaging structure of an optical pickup according to an embodiment of the present invention.

FIG. 16 is a diagram showing a manufacturing procedure of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 17 is a diagram showing a manufacturing procedure of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 18 is a diagram showing a manufacturing procedure of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 19 is a diagram showing the manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention.

FIG. 20 is a diagram showing the manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention.

FIG. 21 is a conceptual diagram showing inconsistency between 0th-order light and 1st-order light observed by a CCD according to an embodiment of the present invention.

FIG. 22 is a conceptual diagram showing coincidence between 0th-order light and 1st-order light observed by a CCD in one embodiment of the present invention.

FIG. 23 is a conceptual diagram of an observation experiment in one example of the present invention.

FIG. 24 is an external view of an astigmatic light beam according to an embodiment of the present invention.

FIG. 25 is an external view of an astigmatic light beam according to an embodiment of the present invention.

FIG. 26 is an external view of an astigmatic light beam according to an embodiment of the present invention.

FIG. 27 is a diagram showing a beam spot shape on a light receiving sensor according to an embodiment of the present invention.

FIG. 28 is a diagram showing a beam spot shape on a light receiving sensor according to an embodiment of the present invention.

FIG. 29 is a diagram showing a beam spot shape on a light receiving sensor according to an embodiment of the present invention.

FIG. 30 is a diagram showing a sensor light amount on a light receiving sensor according to an embodiment of the present invention.

FIG. 31 is a diagram showing a sensor light amount on a light receiving sensor according to an embodiment of the present invention.

FIG. 32 is a diagram showing a manufacturing procedure of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 33 is a view showing the manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention.

FIG. 34 is a diagram showing the manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention.

FIG. 35 is a view showing the manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention.

FIG. 36 is a view showing the manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention.

FIG. 37 is a view showing the manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention.

FIG. 38 is a view showing the manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention.

FIG. 39 is a view showing the manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention.

FIG. 40 is a diagram showing a manufacturing procedure of packaging of an optical pickup according to an embodiment of the present invention.

FIG. 41 is a view showing the manufacturing procedure of the packaging of the optical pickup according to the embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 light source 2 submount 2a electrode surface 3 block 3a protrusion 3b side surface 4 heat sink 5 light guide member 5a first slope 5b second slope 5c third slope 5d V-shaped groove 5e surface 5f surface 6 diffraction grating 7 Diffusion angle conversion hologram 8 Reflection film 9 First beam splitter film 10 Astigmatism generation hologram 11 Second beam splitter film 12 Polarization separation film 13 Light receiving element 13a Electrode 14 Package 14a Lead frame 14b Lead frame foot 14c Step 14d Wire 15 Shell 16 Cover Member 16a Antireflection Film 17 Gap 18 Ceramic Package 18a, 18b, 18c Substrate 18d Electrode 18e Electrode 19, 19a, 19b, 19c Through Hole 20 Terminal 21 High Frequency Superimposed Power Supply Circuit 22 Cap 23 Ring 24 Stem 24a Side Surface Part 24b Step 25 Package 25a Side wall 26 Objective lens 27 Recording medium 27a Information recording surface 28 Second beam splitter film 29a, 29b, 29c Beam spot 30 Ideal spherical wave 31 V groove substrate 31a Reflecting surface 32 CCD 117 Transmitted light 119 Sensor Substrate 120 Reflected light 121 Polarization separation film 122 Reflective film 123 Reflected light 125 Reflective film 126 Reflective film 170, 171, 172, 172a, 172b, 172
c, 172d, 176, 177 Light receiving part 301 Block 302 Submount 303 Light source 304 Light guide member 305a First slope 305b Second slope 305c Third slope 305d Fourth slope 305e Fifth slope 306 Diffusion angle conversion hologram 307 Diffraction Grating 308 First Beam Splitter Film 309 Objective Lens 310 Recording Medium 316 Second Beam Splitter Film 317 Transmitted Light 318 1/2 Wavelength Plate 319 Photoreceptor 320 Reflected Light 321 Polarized Separation Film 322 Reflective Film 323 Reflected Light 324 Non Point aberration generating hologram 325, 326 Reflecting film 370, 371, 372, 376, 377 Light receiving part

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Tatsuya Hiwatari 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Kazuyuki Nakajima, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (75)

[Claims] 1. A light source, a light guide member having a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, the light receiving member, and converting the received optical signal into an electric signal. A light receiving unit, a light source, a light guide member, and a housing member that houses the light receiving unit are provided, and the light guide member reflects light from the light source on the plurality of inclined surfaces and guides the light to an optical medium. An optical pickup which guides the light reflected from the optical medium to the light receiving means. 2. The light guide member comprises a light-transmissive material at the facing portion of the housing member facing the entrance / exit portion for emitting light to the optical medium and for receiving reflected light from the optical medium. The optical pickup according to claim 1, wherein the optical pickup is sealed. 3. An optical pickup according to claim 2, wherein an antioxidant gas is enclosed in a sealed container. 4. An incident direction of light emitted from a light source of the light guide member, and incidence of light emitted from the light guide member to an optical medium and light reflected by the optical medium and returned to the optical guide member. 4. The optical pickup according to claim 1, wherein the direction is substantially vertical. 5. A light source, a light guide member having a plurality of inclined surfaces inclined with respect to the incident direction of the light emitted from the light source, the light receiving member, and converting the received optical signal into an electric signal. A light receiving unit, a storage member that stores the light source, the light guide member, and the light receiving unit and that has an opening, and a cover member that covers the opening of the storage member, and the light guide member is provided from the light source. The optical pickup characterized in that the light is reflected by the plurality of inclined surfaces to be guided to the optical medium via the cover member, and the light reflected from the optical medium is guided to the light receiving means. 6. The light guide member comprises a light-transmissive material at the facing portion of the housing member facing the entrance / exit portion for emitting light to the optical medium and for receiving reflected light from the optical medium. The optical pickup according to claim 5, wherein the optical pickup is sealed. 7. The optical pickup according to claim 6, wherein an antioxidant gas is enclosed in a sealed container. 8. An incident direction of light emitted from a light source of a light guide member, and an incident direction of light emitted from the light guide member to an optical medium and light reflected by the optical medium and returned to the optical guide member. 6. and 5 are substantially vertical.
The optical pickup according to any one of 6 and 7. 9. An optical pickup according to claim 5, wherein the cover member and the light guide member are brought into contact with each other. 10. The thickness (t1) of the cover member is 0.3 ≦ t.
The optical pickup according to claim 9, wherein 1 ≦ 3.0 (mm). 11. The optical pickup according to claim 5, wherein a gap is provided between the cover member and the light guide member. 12. A cover member having a thickness (t2) of 0.1 ≦ t.
12. It is set to 2 ≦ 3.0 (mm), which is characterized in that
Optical pickup as described. 13. The light according to claim 11, wherein the distance (d) between the cover member and the light guide member is 0.1 ≦ d ≦ 3.0 (mm). pick up. 14. A light source, a holding member for holding the light source, a light guide member having a plurality of inclined surfaces inclined with respect to the incident direction of the light emitted from the light source, the light receiving member and the light receiving member. The light receiving means for converting the optical signal into an electric signal, the housing member for housing the light source, the light guide member, and the light receiving means, and the housing member having an opening, the holding member having a thermal conductivity (w) w In addition to satisfying the condition of ≧ 100 (w / mK), the light guide member reflects the light from the light source on the plurality of inclined surfaces and guides the light to the optical medium through the cover member, and also through the cover member. An optical pickup which guides the light reflected from the optical medium to the light receiving means. 15. A light-transmissive material is used for the facing portion of the housing member facing the entrance / exit portion of the light guide member for emitting light to the optical medium or for entering reflected light from the optical medium. The optical pickup according to claim 14, which is hermetically sealed. 16. An optical pickup according to claim 15, wherein an antioxidant gas is enclosed in a sealed container. 17. An incident direction of light emitted from a light source of a light guide member, and light emitted from the light guide member to an optical medium and incident of light reflected by the optical medium and returned to the light guide member. The optical pickup according to any one of claims 14, 15 and 16, wherein the direction is substantially vertical. 18. The optical pickup according to claim 14, wherein the holding member is composed of a plurality of members, and the size of the member increases as the distance from the light source increases. 19. The optical pickup according to claim 14, wherein the holding member and the light guide member are in contact with each other. 20. The holding member and the housing member are brought into contact with each other, 14, 15, 16, 17, 18, and 1.
9. The optical pickup described in any one of 1. 21. The holding member has a linear expansion coefficient (k) of 3 × 10 ^-6.
15. The condition of ≦ k ≦ 10 × 10 ⁻⁶ (/ ° C.) is satisfied, 14, 15, 16, 17, 18, 19, and 2.
The optical pickup according to any one of 0 and 1. 22. A light source, a light guide member having a plurality of inclined surfaces inclined with respect to the incident direction of the light emitted from the light source, the light receiving member, and converting the received optical signal into an electric signal. The light guide includes a light receiving unit, a storage member that stores the light source, the light guide member, and the light receiving unit, and a base on which the storage member is mounted. An optical pickup characterized in that the light is reflected by an inclined surface and guided to an optical medium, and the light reflected from the optical medium is guided to the light receiving means. 23. The light guide member comprises a light-transmissive material at the facing portion of the housing member facing the entrance / exit portion for emitting light to the optical medium and for receiving reflected light from the optical medium. 3. The container according to claim 2, which is closed.
The optical pickup described in 2. 24. The optical pickup according to claim 23, wherein an antioxidant gas is enclosed in a sealed container. 25. An incident direction of light emitted from the light source of the light guide member, and an incident direction of light emitted from the light guide member to the optical medium and light reflected by the optical medium and returned to the optical guide member. And are substantially vertical.
The optical pickup according to any one of 2, 23, and 24. 26. An optical pickup according to any one of claims 22, 23, 24 and 25, wherein a light source is mounted on a base. 27. A light source, a holding member for holding the light source, a light guide member having a plurality of inclined surfaces inclined with respect to an incident direction of the light emitted from the light source, the light receiving member and the light receiving member. The light receiving means for converting the optical signal into an electric signal, the light source, the holding member, the light guide member, and the light receiving means are housed, and the light guide member emits light to the optical medium or emits light from the optical medium. The holding member includes a storage member having an opening at a portion facing an incident / emission portion where reflected light enters and a cover member that covers the opening, and the holding member has a thermal conductivity (w) w ≧ 100 (w / mK), the light guide member reflects the light from the light source on the plurality of inclined surfaces to guide it to the optical medium through the cover member, and at the same time, reflects the light reflected from the optical medium. Light receiving means The optical pick-up, characterized in that lead. 28. The optical pickup according to claim 27, wherein the inside of the housing member is sealed. 29. The optical pickup according to claim 28, wherein an antioxidant gas is enclosed in a sealed container. 30. The incident direction of the light emitted from the light source of the light guide member, the light emitted from the light guide member to the optical medium, and the light reflected by the optical medium and returned to the light guide member. 30. The optical pickup according to claim 27, 28, 29, wherein the incident direction is substantially vertical. 31. The optical pickup according to claim 27, 28, 29 or 30, wherein the cover member and the light guide member are brought into contact with each other. 32. The thickness (t1) of the cover member is 0.3 ≦ t
32. 1≤3.0 (mm)
Optical pickup as described. 33. A gap is provided between the cover member and the light guide member, 27, 28, 29, 30.
An optical pickup according to any one of the above. 34. The cover member has a thickness (t2) of 0.1 ≦ t.
34. 2 ≦ 3.0 (mm)
Optical pickup as described. 35. The optical pickup according to claim 33, wherein a distance (d) between the cover member and the light guide member is 0.1 ≦ d ≦ 3.0 (mm). 36. The holding member is divided into two or more members, and the holding members are arranged such that the cross-sectional area of the members increases in the order from the member closer to the light source to the member farther from the light source. 35. The optical pickup described in any one of 1. 37. The holding member and the light guide member are attached in contact with each other, and the light guide member is attached.
Optical pickup as described. 38. The optical pickup according to claim 27, wherein the holding member and the housing member are attached in contact with each other. 39. The holding member has a linear expansion coefficient (k) of 3 × 10 ^−6.
39. The optical pickup according to claim 27, wherein the condition of ≦ k ≦ 10 × 10 ⁻⁶ (/ ° C.) is satisfied. 40. A light source, a light guide member having a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, receiving light, and converting the received optical signal into an electric signal. The light receiving means, the light source, the light guide member, and the light receiving means are housed, and the light guide member faces an input / output portion that emits light to the optical medium or that receives reflected light from the optical medium. A storage member having an opening in a portion, a cover member that covers the opening, and a base on which the storage member is mounted are provided, and the light guide member allows the light from the light source to pass through the plurality of inclined surfaces. An optical pickup characterized in that the light is reflected and guided to the optical medium through the cover member, and the light reflected from the optical medium is guided to the light receiving means. 41. A light source, a holding member for holding the light source, a light guide member having a plurality of inclined surfaces inclined with respect to an incident direction of the light emitted from the light source, the light receiving and light receiving members. A light receiving means for converting the optical signal into an electric signal, a storage member for storing the light source, the holding member, the light guide member and the light receiving means, and a base for mounting the storage member, The holding member has thermal conductivity (w) w
In addition to satisfying the condition of ≧ 100 (w / mK), the light guide member reflects the light from the light source on the plurality of inclined surfaces to guide it to the optical medium through the cover member and reflects it from the optical medium. An optical pickup characterized in that the received light is guided to the light receiving means. 42. A light source, a holding member for holding the light source, a light guide member having a plurality of inclined surfaces inclined with respect to an incident direction of the light emitted from the light source, the light receiving member and the light receiving member. The light receiving means for converting the optical signal into an electric signal, the light source, the holding member, the light guide member, and the light receiving means are housed, and the light guide member emits light to the optical medium or from the optical medium. The storage member having an opening in a portion facing the incident / exiting portion where the reflected light enters, a cover member that covers the opening, and a base on which the storage member is mounted are provided, and the holding member is While satisfying the condition of thermal conductivity (w) w ≧ 100 (w / mK), the light guide member reflects the light from the light source on the plurality of inclined surfaces and allows the light medium to pass through the cover member to the optical medium. Guide and light medium An optical pickup characterized in that leads to the light receiving means the light reflected from. 43. The light emitting surface of the light source and the surface of the light guide member facing the light source are substantially parallel to each other.
42. The optical pickup according to any one of 42. 44. The optical pickup according to claim 1, wherein the light guide member and the light receiving means are in close contact with each other. 45. The optical pickup according to any one of claims 1 to 13, 22 to 26, and 40 to 42, wherein the light source and the housing member are in close contact with each other. 46. The light receiving means is molded in the housing member, and all the surfaces of the housing member facing the light receiving means are formed of a substance having a light transmitting property. The optical pickup described in 1. 47. A light source, a holding member for holding the light source, and a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, and the plurality of inclined surfaces are substantially parallel to each other. A light guide member having various optical elements formed on the plurality of inclined surfaces and arranged, a light receiving unit for converting light transmitted through the light guide member into an electric signal, and an electric signal converted by the light receiving unit. Connection member to take out,
A storage member that stores the light source, the holding member, the light guide member, the light receiving unit, and the connection member, has an opening, and a cover member that covers the opening of the storage member. Optical pickup to do. 48. The optical pickup according to claim 47, wherein the light guide member and the holding member are in contact with each other. 49. The optical pickup according to claim 47, wherein the light receiving means and the light guide member are in contact with each other. 50. The optical pickup according to claim 47, wherein the holding member is placed on the storage member. 51. The cover member and the housing member are joined together via a mounting ring.
The optical pickup according to any one of 9, 50. 52. The optical pickup according to claim 47, wherein the housing member is made of a ceramic material. 53. The optical pickup according to claim 47, wherein the connection member is molded in the housing member. 54. A light source, a holding member for holding the light source, and a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, and the plurality of inclined surfaces are substantially parallel to each other. A light guide member having various optical elements formed on the plurality of inclined surfaces and arranged, a light receiving unit for converting light transmitted through the light guide member into an electric signal, and an electric signal converted by the light receiving unit. Connection member to take out,
The light source, the holding member, the light guide member, the light receiving means, and the connection member are stored, and a storage member having an opening, a cover member that covers the opening of the storage member, and the storage member are placed. An optical pickup characterized by having a base. 55. The optical pickup according to claim 54, wherein the light guide member and the holding member are in contact with each other. 56. The optical pickup according to claim 54, wherein the holding member is mounted on a base. 57. An optical pickup according to claim 54, 55 or 56, wherein the light receiving means and the light guide member are in contact with each other. 58. The optical pickup according to claim 54, 55 or 56, wherein the light receiving means is molded in a housing member. 59. The optical pickup according to claim 54, wherein the connection member is molded in the housing member. 60. A base on which a light source and a holding member are mounted and a housing member molded with a connecting member are joined together, and the light receiving means and the housing member are arranged in a predetermined positional relationship, and the connecting member and the light receiving means. Is wire-bonded, the optical guide member is arranged in the housing member, the holding member and the light receiving means are joined, and the housing member and the cover member are joined. 61. The method of manufacturing an optical pickup according to claim 60, wherein a UV adhesive is used in joining the light guide member to the light receiving means and the holding member. 62. A method of manufacturing an optical pickup according to claim 60, wherein an instant adhesive is used in joining the light guide member to the light receiving means and the holding member. 63. An adjustment jig is inserted from the through hole in the fine adjustment at a position performed when the light receiving means and the light guide member are joined, by providing a through hole in the base. , 61, 62. A method for manufacturing an optical pickup according to any one of 1. 64. The fine adjustment of the position performed when joining the light receiving means and the light guide member is performed based on the amount of light emitted from the light source and returned to the light receiving means. 63. A method for manufacturing an optical pickup according to any one of items 1. 65. Fine adjustment of a position performed when joining a holding member and a light guide member is performed on the basis of a deviation in image formation at an optical medium position caused by a difference in a component of light emitted from a light source. 65. The method of manufacturing an optical pickup according to claim 60, wherein: 66. A connection member is molded, a housing member that has been subjected to a predetermined treatment in advance is joined to an LD block having a light source and a holding member, and the light receiving means and the housing member are arranged in a predetermined positional relationship. Wire bonding the connecting member and the light receiving means, arranging a light guide member in the housing member, joining the LD block and the light receiving means, and joining the housing member and the cover member. Pickup manufacturing method. 67. A method of manufacturing an optical pickup according to claim 66, wherein an ultraviolet curing adhesive is used in joining the light guide member and the LD block. 68. A moisture absorbing adhesive is used for joining the light guide member and the LD block.
A method for manufacturing the optical pickup described. 69. The method of manufacturing an optical pickup according to claim 66, wherein the housing member and the cover member are joined via a ring. 70. A base on which a light source and a holding member are mounted and a light guide member are joined together, and the base and a housing member molded with the light receiving means and the connecting means are joined together in a predetermined positional relationship. A method for manufacturing an optical pickup, comprising joining the base and the cover member. 71. A method of manufacturing an optical pickup according to claim 70, wherein an ultraviolet curing adhesive is used in joining the light guide member and the base. 72. A moisture absorbing adhesive is used for joining the light guide member and the LD block.
A method for manufacturing the optical pickup described. 73. A light source, a holding member for holding the light source, and a plurality of inclined surfaces inclined with respect to an incident direction of light emitted from the light source, and the plurality of inclined surfaces are substantially parallel to each other. A light guide member having various optical elements formed on the plurality of inclined surfaces and arranged, a light receiving unit for converting light transmitted through the light guide member into an electric signal, and an electric signal converted by the light receiving unit. Connection member to take out,
The light source, the holding member, the light guide member, the light receiving means, and the connection member are stored, and a storage member having an opening, a cover member that covers the opening of the storage member, and the storage member are placed. And an pedestal having a through hole, and a seal is provided between the through hole of the pedestal and the light receiving means. 74. An optical pickup characterized in that an epoxy potting agent is used as a sealing agent for sealing between the through hole of the base and the light receiving means. 75. An optical pickup characterized in that solder is used as a sealant for sealing between the through hole of the base and the light receiving means.