JPH09266046A - Contact pin for ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the lead of an IC package from being curved when the IC package plugged in an IC socket is removed. SOLUTION: This contact pin has first and second contact parts 3c, 3b which make contact with a lead 4a at two vertical positions, the lead 4a extending from an IC package placed on an IC socket. The width T of the surface 3c where the first contact part makes contact with the lead 4a is set so that the interval t1 between the surfaces 3c of the adjacent first contact parts is smaller than the width t3 of the lead 4a. Therefore, the lead 4a of the IC package is not caught between the contact pins.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to the shape of a contact pin used in an IC socket.

[0002]

2. Description of the Related Art Normally, after an IC package is manufactured,
It is shipped after a performance test. At the time of this performance test, an IC socket is used. 3 to 5 show an example of such an IC socket. 3 is a plan view of the IC socket, FIG. 4 is a sectional view taken along line X4-X4 of FIG. 3, and FIG. 5 is a sectional view taken along line X5-X5 of FIG. IC socket is
It has an IC socket body 1 having a rectangular planar shape (see FIG. 3) and a substantially H-shaped cross section (see FIG. 5). As shown in FIG. The partition plates 2 are integrally formed in a row and a slit is formed between the adjacent partition plates 2.

Inside the IC socket body 1, a contact pin mounting hole 1a (see FIG. 5) is formed continuously with the slit formed between the partition plates 2, and this contact pin mounting hole 1a is formed. The contact pin 3 is fitted. As shown in FIG. 5, the contact pin 3 has two contact pieces 3A and 3B extending upward in substantially parallel. Each contact piece 3 of the contact pin 3 attached to the contact pin attachment hole 1a of the IC socket body 1
The heads 3a and 3b of A and 3B are exposed from the slits formed between the adjacent partition plates 2. The contact piece 3A is provided so as to have a height higher than that of the contact piece 3B. Therefore, the head 3a of the contact piece 3A extends from the IC package 4 mounted on the IC socket body 1 in the reverse direction. The head 3b of the contact piece 3B is inserted into the J-shaped lead 4a through the slit.
Contact at a position above.

As described above, when the IC package 4 is mounted on the IC socket body 1, the leads 4a come into contact with the two contact pieces 3A and 3B of the contact pin 3. Then, the IC package 4 is supplied from a predetermined power source (not shown) through the two contact pieces 3A and 3B of the contact pin 3 and the lead 4a.
A voltage is applied to the IC package 4, and a performance test is performed on the IC package 4.

[0005]

When the performance test is completed, the IC package 4 is taken out from the IC socket body 1. At this time, a jig 5 as shown in FIG. 4 may be used. The jig 5 is a plate-shaped member having a constant width (length in the direction perpendicular to the paper surface) and an inclined surface 5a whose height gradually decreases from one end to the other end.

When the IC package 4 mounted at a predetermined position (the position shown by the broken line A in FIG. 4) is taken out by using the jig 5, as shown in FIG. 4, the height of the inclined surface 5a of the jig 5 is increased. The shorter end is inserted into the groove 1A extending in the central longitudinal direction of the IC socket body 1, and the jig 5 is advanced in the direction of arrow C. As the jig 5 advances, the IC package 4
Gradually upward force is applied from the inclined surface 5a, and the IC socket body 1 comes off.

Until the IC package 4 is detached from the IC socket body 1, the IC package 4 takes an inclined posture as shown by the chain line B in FIG. At this time, the lead 4a near the end of the IC package 4 on the opposite side (left side in FIG. 4) from the lifted side is placed between the adjacent contact pins 3 as schematically shown in FIG. It may get caught.

Normally, the jig 5 is advanced in the direction of arrow C until the IC package 4 is completely removed from the IC socket body 1. Therefore, when the IC package 4 is forcibly separated from the IC socket body 1 by the jig 5 while the lead 4a remains sandwiched between the contact pins 3, the lead 4a is twisted. Generally, lead 4
Since a is made of a material having a hardness lower than that of the contact pin 3, when the lead 4a is twisted, the force is not transmitted to the contact pin 3 but directly acts on the lead 4a itself. For this reason, the lead 4a may be bent, may not be restored while being twisted, or in some cases, the lead 4a may be broken.

The present invention has been made in view of the problems that occur in contact pins in such conventional IC sockets, and the IC package can be removed from the IC socket body without bending the leads of the IC package. It is intended to provide a contact pin for a socket.

[0010]

In order to achieve this object, the contact pin for an IC socket according to the present invention is I.
A contact pin for an IC socket, which is used by being inserted into a slit defined between a plurality of partition plates arranged at equal intervals along each of opposite sides of the C socket, the contact pin being mounted on the IC socket. In a contact pin for an IC socket, which has first and second contact portions that come into contact with a lead extending from an IC package at two positions in the vertical direction, the first or second contact portion comes into contact with the lead. The width of the surface is set such that the interval between the surfaces of the adjacent first or second contact portions is smaller than the width of the lead.

[0011]

1 shows an embodiment of an IC socket contact pin according to the present invention. The same components as those of the conventional IC socket contact pin 3 shown in FIG. 5 are designated by the same reference numerals. The IC socket contact pin 3 according to the present embodiment shown in FIG. 1 is different from the conventional contact pin 3 shown in FIG. 5 in that a widened portion 3c is provided on the head of the contact piece 3A. The widened portion 3c has a width T wider than that of the conventional contact pin, and this width T is larger than the width t of the contact piece 3B. Width T of widened portion 3c
Is determined as follows.

FIG. 2 shows a contact pin 3 according to this embodiment.
It is the figure which looked at the state which inserted into the slit between each partition board 2 from the front. Referring to FIG. 2, the width T of the widened portion 3c
Is the width t3 of the lead 4a of the IC package 4 when the contact pin 3 according to the present embodiment is arranged in the slits between the partition plates 2 and the interval t1 between the adjacent widened portions 3c.
It is set to be smaller than. Therefore, the leads 4a of the IC package 4 are not sandwiched between the adjacent widened portions 3c.

The interval t2 between adjacent contact pieces 3B is set larger than the width t3 of the lead 4a. Therefore, the relationship between the interval t1 between the adjacent widened portions 3c, the interval t2 between the adjacent contact pieces 3B, and the width t3 of the lead 4a is expressed by the following equation. t1 <t3 <t2

As described above, in the IC socket using the contact pins 3 according to this embodiment, the distance between the adjacent contact pins 3 is determined by the contact piece 3 of the contact pins 3.
In the widened portion 3c of A, the width is smaller than the width of the lead 4a. Therefore, using the jig 5, the IC package 4
When the IC package 4 is taken out from the IC socket body 1, even if the IC package 4 takes an inclined posture as shown in FIG. 4, the leads 4a of the IC package 4 will not be sandwiched between the adjacent contact pins 3. Therefore, the lead 4a does not bend or break due to the removal of the IC package 4 while the lead 4a is sandwiched between the contact pins 3.

In the above embodiment, an example in which the widened portion 3c is provided on the contact piece 3A of the contact pin 3 has been described, but the widened portion 3c may be provided on the contact piece 3B. Widened part 3c
When the contact piece 3B is provided with the contact piece 3B, the interval t1 between the adjacent contact pieces 3A and the interval t between the widened portions 3c of the adjacent contact pieces 3B.
2, the relationship between the width t3 of the lead 4a is expressed by the following equation. t2 <t3 <t1

Similarly, it is possible to provide the widened portion 3c on both the contact piece 3A and the contact piece 3B of the contact pin 3. In this case, the distance t1 between the widened portions 3c of the adjacent contact pieces 3A and the distance t between the widened portions 3c of the adjacent contact pieces 3B.
2, the relationship between the width t3 of the lead 4a is expressed by the following equation. t1 <t3, t2 <t3

As described above, the contact piece 3 of the contact pin 3
A widening portion 3c is provided on at least one of A and 3B,
When the contact pins 3 are arranged on the IC socket body 1, the width of the widened portion 3c may be set so that the interval between the adjacent widened portions 3c is smaller than the width of the lead 4a. The widened portion 3c of the contact pin 3 may not be formed only on the contact surface side but may be widened over the entire plate thickness. In that case, the corresponding portion of the partition plate 2 may be cut out.

[0018]

According to the contact pin for an IC socket of the present invention, the width of the surface where the first or second contact portion comes into contact with the lead is the same as that of the contact surface of the adjacent first or second contact portion. It is set so that the interval between them is smaller than the width of the lead. For this reason, when the IC package is removed from the IC socket, the leads of the IC package are not caught between the contact pins, and the leads are bent, twisted, or broken due to the removal of the IC package with an excessive force. Can be prevented.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of an IC socket contact pin according to the present invention.

FIG. 2 is a front view of the IC socket contact pin shown in FIG. 1 arranged in an IC socket.

FIG. 3 is a plan view of an IC socket when viewed from above.

4 is a cross-sectional view taken along line X4-X4 of FIG.

5 is a cross-sectional view taken along line X5-X5 of FIG.

FIG. 6 is a schematic view showing a state where a lead is sandwiched between contact pins.

[Explanation of symbols]

 1 IC socket body 1a Contact pin mounting hole 1A groove 2 Partition plate 3 Contact pin 3A, 3B Contact piece 3a, 3b Head of contact piece 3c Widened section 4 IC package 4a Lead 5 Jig 5a Inclined surface

Claims (1)

[Claims] 1. A contact pin for an IC socket, which is used by being inserted into a slit defined between a plurality of partition plates arranged at equal intervals along opposite sides of the IC socket, wherein the IC socket is used. In an IC socket contact pin having first and second contact portions that come into contact with a lead extending from an IC package placed on the top and bottom at two positions in the vertical direction, the first or second contact portion is The width of the surface in contact with the lead is set such that the distance between the surfaces of the adjacent first or second contact portions is smaller than the width of the lead. Contact pin for IC socket.