JPH09264924A - Ic testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To directly observe IC output signal waveforms under measurement upstream from the input to a comparator in an IC checking device. SOLUTION: Each pin electronics section 10, which is provided with a driver which outputs the input signal of an IC2 under measurement and a comparator which judges the output signal of the IC2 under measurement, has a waveform observing means 103 which captures in a high impedance the output signal of the IC2 under measurement upstream from the comparator 102 and outputs as the observation signal of a signal waveform in an IC tester 1 provided each pin of the IC2 under measurement.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC inspection device, and more particularly to an IC inspection device to which a handling device can be connected.

[0002]

2. Description of the Related Art Conventionally, this type of IC inspection device is
It is widely used as equipment for technical evaluation or mass production in order to measure / inspect electrical characteristics / functions of LSIs and the like. Further, this IC inspection device is often used together with a mass-production handling device and a high-low temperature measuring handling device. In this case, the test program of the IC to be measured is first designed by a technician, and is generally debugged and evaluated by the IC inspection device in a state where the handling device is not connected, and becomes a test program for the IC inspection device. After that, the test program is re-evaluated with the handling device connected, and a test program for connecting the handling device is created. This is because when a trouble occurs by connecting the handling device to the IC inspection device, the signal waveform of each part of the IC inspection device and the IC to be measured is confirmed and a test program is created.

At this time, the test program creator is
It is necessary to compare and observe a change in the input / output signal waveform of the IC to be measured with a waveform measuring device such as an oscilloscope between a state in which the handling device is not connected to the C inspection device and a state in which the handling device is connected.

However, when the handling device is connected to the IC inspection device, the measuring portion of the IC inspection device is covered with the handling device, so that the waveform cannot be directly observed by the probe of the oscilloscope. Also,
Even if the handling device is not connected, when the measured IC output signal waveform at the measured IC pin is disturbed by the reflection from the comparator in the IC inspection device, the measured IC output signal waveform is directly observed at the input of the comparator and the comparator I needed to match the input impedance, but I couldn't. Therefore, in the past, indirect observation has been performed.

For example, FIG. 3 shows Japanese Patent Laid-Open No. 63-1825.
It is a block diagram which shows the structure of the IC inspection apparatus described in the 84th publication. Referring to FIG. 3, this IC inspection apparatus is provided with a pin electronics section 1 corresponding to each measurement pin.
0, waveform observation control unit 11, processing control unit 12, memory 13
Etc., and is connected to the IC to be measured 2.

Each pin electronics section 10 includes a driver 101 and a comparator 102. The driver 101 outputs the input signal of the IC2 to be measured, and the comparator 102 determines the output signal of the IC2 to be measured. Each pin electronics section 10 includes elements other than the driver 101 and the comparator 102, and is provided by the number of measurement pins.

The waveform observation control section 11 operates synchronously under the control of the processing control section 12 and sends a strobe signal and a comparison value to the comparator 102. At each transmission timing of the strobe signal, a bit map that associates the comparison result signal, which is the output signal of the comparator 102, with the strobe signal timing is written in the memory 13.

The process control unit 12 is a process control unit of the IC inspection apparatus, and performs various controls and analysis processes for executing an electrical characteristic test and a function test of the IC 2 to be measured by a test program.

The memory 13 is a memory for storing a bitmap showing waveform data. At the time of the function test, the PASS / FAIL bit map is stored.

Next, the waveform observation operation of this conventional IC inspection apparatus will be described with reference to FIG. First, it is assumed that the function test is executed according to the test program and the output signal from the pin of the IC to be measured 2 is input to the comparator 102. The waveform observation control unit 11 operates synchronously under the control of the processing control unit 12 and sends a strobe signal and a comparison value to the comparator 102. At this time, strobe signals are continuously transmitted while sequentially shifting the strobe signal timing by unit time. Also,
Each time the final timing of a series of strobe signals is transmitted, the voltage of the comparison value is sequentially increased by a unit amount. The comparator 102 compares the voltage of the output signal from the pin of the IC under test 2 with the voltage of the comparison value, and determines whether the output signal from the pin of the IC 2 under test is equal to or higher than the voltage of the comparison value as a comparison result signal. 1 "or" 0 "is output. At the same time, the waveform observation control unit 11 writes the comparison result signal at each strobe signal timing in the bitmap on the memory 13.

Thereafter, the bitmap is processed under the control of the processing control unit 12 as necessary and output to the display 14 or the printer 15 which is an output means. FIG. 4 is a waveform diagram showing an example of this bitmap,
The comparison value voltage / strobe signal timing is plotted on the vertical axis / horizontal axis, and the comparison result signal “1” indicating that the output signal from the pin of the IC 2 to be measured is equal to or higher than the comparison value voltage is displayed as “P”. That is, the output signal waveform from the IC 2 under measurement input to the comparator 102 is indirectly obtained from the upper boundary line of these “P” regions.

[0012]

This conventional IC inspection apparatus can observe the waveform of the output signal from the IC under test 2 at the time of input of the comparator by an indirect method. However, when comparing and observing changes in input / output signal waveforms when the handling device is not connected to the IC inspection device and when the handling device is connected, especially when performing comparative observation for each measurement pin in sequence, for observing the waveform for each measurement pin. It is necessary to modify the test program of, and there is a problem that a lot of man-hours are required for the comparative observation.

Further, even if the handling device is not connected to the IC inspection device, the I to-be-measured at the IC pin to be measured is measured.
When the C output signal waveform was disturbed by the reflection from the comparator in the IC inspection apparatus, it was necessary to directly observe the IC output signal waveform to be measured at the input of the comparator to match the input impedance of the comparator, but this was not possible.

Therefore, in order to solve at least one of the above technical problems, an object of the present invention is to directly observe the measured IC output signal waveform at the input of the comparator in the IC inspection device.

[0015]

Therefore, according to the present invention, a driver for outputting an input signal of an IC to be measured and the I to be measured.
In an IC inspection device provided with a pin electronics section having a comparator for determining an output signal of C, corresponding to each pin of the IC to be measured, each pin electronics section is provided with the pin electronics section immediately before the comparator. It has a waveform observing means for taking in the output signal of the IC with high impedance and outputting it as an observation signal of the signal waveform.

Further, the waveform observing means has a high resistance element. Further, the waveform observing means has switch means connected in series with the high resistance element and conducting only when observing the waveform.

[0017]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a partial block diagram showing the first embodiment of the IC inspection apparatus of the present invention. Referring to FIG. 1, the IC inspection apparatus 1 of the present embodiment includes a pin electronics section 10 corresponding to each measurement pin, and is connected to the IC to be measured 2. Each of these pin electronics section 1
0 includes a driver 101, a comparator 102, and a waveform observing means 103. Further, each pin electronics section 10 includes a driver 101, a comparator 102,
Elements other than the waveform observing means 103 are included, and the number of measurement pins is provided.

The driver 101 outputs the input signal of the IC 2 to be measured, and the comparator 102 determines the output signal of the IC 2 to be measured.

The waveform observing means 103 is composed of a high resistance element R and takes in the output signal of the IC 2 to be measured with a high impedance immediately before the comparator 102 and outputs it as an observation signal of the signal waveform.

Next, the test program creation in the IC inspection apparatus 1 of this embodiment will be described with reference to FIG. First, as in the conventional IC inspection apparatus 1, the IC to be measured is
This test program is designed by an engineer, debugged and evaluated by the IC inspection device 1 in a state where the handling device is not connected, and becomes a test program for the IC inspection device 1. After that, when trouble occurs by connecting the handling device to the IC inspection device, the IC
The signal waveform of each part of the inspection device and the IC to be measured is confirmed, and a test program is created.

At this time, when the handling device is connected to the IC inspection device 1, the measurement part of the IC inspection device 1 is covered with the handling device, but the pin electronics part 10 corresponding to each measurement pin has the waveform observation means 103.
Therefore, by directly observing the observation signal output from the waveform observing means 103 with a waveform measuring device such as an oscilloscope, the test program creator can connect the IC inspection device 1 to a state in which the handling device is not connected and a state in which it is connected. It is possible to compare and observe changes in input / output signal waveforms at and. Even when the handling device is not connected, when the measured IC output signal waveform at the measured IC pin is disturbed by the reflection from the comparator in the IC inspection device, the measured IC output signal waveform is directly observed at the input of the comparator. The input impedance of the comparator can be matched.

FIG. 2 is a partial block diagram showing the second embodiment of the IC inspection apparatus of the present invention. Referring to FIG. 2, the IC inspection device 1 according to the present embodiment is the same as the first embodiment shown in FIG.
Like the IC inspection apparatus 1 of FIG. 1, the pin electronics section 10 corresponding to each measurement pin is provided and connected to the IC to be measured 2. Each of these pin electronics section 10
Includes a driver 101, a comparator 102, and a waveform observing means 103. I of Embodiment 1 shown in FIG.
The difference from the C inspection apparatus 1 is only the waveform observing means 103, and duplicate description of other blocks will be omitted.

The waveform observing means 103 in the IC inspection apparatus 1 of this embodiment includes a high resistance element R and the high resistance element R.
And a switch means S connected in series with the switch 102 and conducting only when observing the waveform.
The output signal of C2 is taken in with high impedance and output as an observation signal of the signal waveform.

The switch means S is composed of, for example, a relay element or the like, and is not connected to the input of the comparator 102 at the time of the electrical characteristic test and the function test of the IC 2 under test other than the time of waveform observation.

By the IC inspection apparatus 1 of this embodiment, the observation signal output from the waveform observation means 103 is directly observed by a waveform measuring apparatus such as an oscilloscope, so that the IC inspection apparatus 1 is connected to a state in which the handling apparatus is not connected. The change of the input / output signal waveform in the state can be compared and observed, and the electrical characteristic test and the function test of the IC 2 to be measured are executed without being affected by the waveform observing means 103.

[0027]

As described above, the IC according to the present invention is used.
Since the inspection device has a waveform observing means for capturing the output signal of the IC to be measured with high impedance immediately before the comparator of the pin electronics section and outputting it as an observation signal of the signal waveform, the inspection device is connected to the state where the handling device is not connected. The change in the output signal waveform of the IC under measurement in the above-described state can be directly compared and observed with a waveform measuring device such as an oscilloscope.

In particular, when comparing and observing the change of the input / output signal waveform between the state in which the handling device is not connected and the state in which the handling device is connected, the test program for observing the waveform is modified for each measuring pin. It is not necessary to do so, and there is an effect that the man-hour required for the comparative observation can be significantly reduced.

[Brief description of drawings]

FIG. 1 is a partial block diagram showing a first embodiment of an IC inspection apparatus of the present invention.

FIG. 2 is a partial block diagram showing a second embodiment of the IC inspection apparatus of the present invention.

FIG. 3 is a block diagram showing a configuration of a conventional IC inspection device.

4 is a waveform diagram showing an example of a bitmap output by the IC inspection apparatus of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC inspection device 2 IC to be measured 10 Pin electronics section 11 Waveform observation control section 12 Processing control section 13 Memory 14 Display 15 Printer 101 Driver, Pin driver 102 Comparator 103 Waveform observation means R High resistance element S switch means

Claims (3)

[Claims] 1. A pin electronics section having a driver for outputting an input signal to an IC under test and a comparator for judging an output signal of the IC under test, said pin electronics section comprising:
In the IC inspection device provided corresponding to each pin of C, a waveform in which each pin electronics section captures the output signal of the IC under measurement with high impedance immediately before the comparator and outputs it as an observation signal of the signal waveform. An IC inspection apparatus having an observing means. 2. The IC inspection apparatus according to claim 1, wherein the waveform observing means has a high resistance element. 3. The IC inspection apparatus according to claim 1, wherein the waveform observing means has a switch means connected in series with the high resistance element and conducting only when observing the waveform.