JPH09257545A - Liquid level control device of paste receiving tank - Google Patents
Liquid level control device of paste receiving tankInfo
- Publication number
- JPH09257545A JPH09257545A JP9046496A JP9046496A JPH09257545A JP H09257545 A JPH09257545 A JP H09257545A JP 9046496 A JP9046496 A JP 9046496A JP 9046496 A JP9046496 A JP 9046496A JP H09257545 A JPH09257545 A JP H09257545A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- glue
- receiving tank
- liquid level
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
- Recording Measured Values (AREA)
- Control Of Non-Electrical Variables (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は溶融糊を貯溜する糊
受槽の液位を一定に保つ液位制御装置に関し、特に、溶
融糊の蒸気付着等による誤作動が生じない信頼性の高い
液位制御装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid level control device for maintaining a constant liquid level in a glue receiving tank for storing molten glue, and particularly to a highly reliable liquid level which does not cause malfunction due to vapor adhesion of molten glue. The present invention relates to a control device.
【0002】[0002]
【従来の技術】液位制御装置において液位を検出するセ
ンサとしては、従来、フロートの上下動を検出するも
の、電極棒の先端間の導通を検出するもの、光の透過や
反射を利用するもの等が知られいる。2. Description of the Related Art As a sensor for detecting a liquid level in a liquid level control device, conventionally, a sensor for detecting a vertical movement of a float, a sensor for detecting conduction between the tips of electrode rods, a light transmission or reflection is used. Things are known.
【0003】[0003]
【発明が解決しようとする課題】しかるに、工業糊は一
般に合成樹脂材を主成分とし、固形糊を100℃〜20
0℃で溶融させて使用しており、この溶融糊には高温,
高粘度,糊蒸気の発生など悪条件が重なっていた。こう
したなか、フロート式では、機械的作動部に粘着性のあ
る糊蒸気が付着して作動不良を生じる虞れがあり、更
に、比較的大きなセンサ設置スペースを要するといった
問題もあった。光式においても、糊蒸気で検出窓が曇る
等により、良好な液位検出は困難であった。また、溶融
糊は非導電性であり、電極式のセンサ等による液位検出
は使用不能であった。However, industrial glue generally contains a synthetic resin material as a main component and solid glue at 100 ° C. to 20 ° C.
It is used by melting it at 0 ℃.
Bad conditions such as high viscosity and generation of glue vapor overlapped. Under the circumstances, in the float type, there is a possibility that adhesive glue vapor may adhere to the mechanical operating portion to cause malfunction, and further, a relatively large sensor installation space is required. Even in the optical system, it was difficult to detect the liquid level well because the detection window was clouded by the glue vapor. Further, the molten glue is non-conductive, and liquid level detection using an electrode type sensor or the like cannot be used.
【0004】本発明は上記問題点を克服するもので、コ
ンパクトな形状で、糊蒸気等の影響を受けることなく溶
融糊の液位を正確に検出してその液位を一定に維持し得
る糊受槽の液位制御装置を提供することを目的とする。The present invention overcomes the above-mentioned problems and has a compact shape and is capable of accurately detecting the liquid level of molten glue and maintaining the liquid level constant without being affected by glue vapor or the like. An object is to provide a liquid level control device for a receiving tank.
【0005】[0005]
【課題を解決するための手段】本発明は上記目的を達成
するため、請求項1に記載の発明の要旨は、溶融糊を貯
溜する糊受槽と、固形糊を貯蔵する貯蔵槽と、該貯蔵槽
に付設されて前記固形糊の一部を溶融させ、この溶融糊
を前記糊受槽内へ流入させる加熱手段と、前記糊受槽の
底面から所定高さに配設された温度検出手段と、該温度
検出手段で検出される温度が所定温度以下となった時に
前記加熱手段を作動させる加熱制御手段と、を備えるこ
とを特徴とする糊受槽の液位制御装置にある。請求項2
に記載の糊受槽の液位制御装置の発明は、請求項1で、
温度検出手段は熱電対により構成され、当該熱電対の温
度検出端を前記所定高さに位置させたことを特徴とす
る。請求項3に記載の糊受槽の液位制御装置の発明は、
請求項1又は2で、貯蔵槽の底面は糊供給口に向けて傾
斜していて、前記底面近くに設けた前記加熱手段により
加熱され溶融した溶融糊が前記底面に沿って前記糊供給
口に至り、当該糊供給口を経て前記糊受槽内へ供給され
ることを特徴とする。In order to achieve the above-mentioned object, the present invention provides a glue receiving tank for storing a molten paste, a storage tank for storing a solid paste, and a storage tank for storing the paste. Heating means attached to the tank to melt a part of the solid paste, and flowing the molten paste into the paste receiving tank; and temperature detecting means arranged at a predetermined height from the bottom surface of the paste receiving tank, And a heating control unit that operates the heating unit when the temperature detected by the temperature detection unit becomes equal to or lower than a predetermined temperature. Claim 2
The invention of the liquid level control device for a glue receiving tank according to claim 1,
The temperature detecting means is composed of a thermocouple, and the temperature detecting end of the thermocouple is located at the predetermined height. The invention of the liquid level control device for a glue receiving tank according to claim 3 is
In Claim 1 or 2, the bottom face of a storage tank inclines toward the glue supply port, and the melted glue heated and melted by the said heating means provided in the said bottom face is said glue supply port along the said bottom face. Further, the adhesive is supplied into the adhesive receiving tank through the adhesive supply port.
【0006】請求項1に記載の発明によれば、溶融糊の
液位が所定高さを下回ると、温度検出手段が溶融糊外へ
露出し、外気温下におかれることによって、検出温度が
急速に低下して所定温度以下となる。すると、加熱制御
手段によって加熱手段が作動させられ、固形糊の一部を
溶融させて糊受槽内へ流入させる。新たな溶融糊の流入
により糊受槽内の溶融糊の液位は上昇する。この液位が
所定高さ以上になると、温度検出手段は再び溶融糊内に
浸漬されて検出温度が急上昇する。検出温度が所定温度
以上なると、加熱制御手段により加熱手段の作動が停止
させられ、固形糊の溶融が中止されて溶融糊の糊受槽内
への供給が止まる。このようにして、糊受槽内の溶融糊
の液位は所定高さ付近で一定に維持される。According to the first aspect of the present invention, when the liquid level of the molten paste falls below a predetermined height, the temperature detecting means is exposed to the outside of the molten paste and is kept at the outside temperature, so that the detected temperature is It drops rapidly and falls below a predetermined temperature. Then, the heating means is operated by the heating control means to melt a part of the solid paste and cause it to flow into the paste receiving tank. The liquid level of the molten glue in the glue receiving tank rises due to the inflow of new molten glue. When the liquid level becomes equal to or higher than a predetermined height, the temperature detecting means is again immersed in the molten paste, and the detected temperature rapidly rises. When the detected temperature is equal to or higher than the predetermined temperature, the heating control unit stops the operation of the heating unit, the melting of the solid paste is stopped, and the supply of the molten paste into the paste receiving tank is stopped. In this way, the liquid level of the molten glue in the glue receiving tank is kept constant near the predetermined height.
【0007】請求項2に記載の発明のごとく、温度検出
手段として熱電対を使用すると、可動部がないため故障
する虞れもなく、簡易かつ正確に液位の昇降が検出され
る。請求項3に記載の発明のように、貯蔵槽の底面が糊
供給口に向けて傾斜していると、貯蔵槽内の底面近くの
固形糊が加熱手段で加熱され溶融状態になれば、溶融糊
が糊供給口を経てスムーズに糊受槽内へ供給される。When a thermocouple is used as the temperature detecting means as in the second aspect of the invention, since there is no moving part, there is no fear of failure, and the elevation of the liquid level can be detected easily and accurately. When the bottom surface of the storage tank is inclined toward the glue supply port as in the invention described in claim 3, when the solid glue near the bottom surface in the storage tank is heated by the heating means and melted, it melts. The glue is smoothly supplied into the glue receiving tank through the glue supply port.
【0008】[0008]
【発明の実施の形態】以下、本発明の液位制御装置を連
包箸の糊付け装置に適用した一実施形態について詳述す
る。連包箸2について図1,図2で説明すると、帯状に
図の左右方向へ延びる樹脂フィルムのうち、下フィルム
22は長手方向に間隔をおいてフィルム面が長方形状に
突き出されて略U字断面をなす収納部P′となって、こ
れら各収納部P′内に割箸Sが挿置される。そして、下
フィルム22には、上方から同幅の上フィルム21が被
着接合されて各収納部P′が密閉空間を形成し、且つ、
これら各収納部P′の間では上下のフィルム21,22
が密着して前後の収納部P′を繋ぐ連結部23になって
いる。かくのごとく、割箸Sを収納した連包箸は、通
常、ユーザーへ納入された後、連結部23で切断され
る。そして、分離された各収納部P′(一の割箸包装品
P)は、本体容器T(例えば、御飯が詰められるトレー
等)にそれぞれ糊付けされる。この糊付けに用いる糊受
槽の液位制御装置が本発明である。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment in which the liquid level control device according to the present invention is applied to a gluing device for continuous chopsticks will be described in detail below. With reference to FIGS. 1 and 2, the continuous wrapping chopsticks 2 will be described below. Of the resin films that extend in the left-right direction in the figure in a strip shape, the lower film 22 is substantially U-shaped with the film surface protruding in a rectangular shape at intervals in the longitudinal direction. It becomes a storage part P'having a cross section, and the disposable chopsticks S are inserted in each of these storage parts P '. Then, the upper film 21 having the same width is adhered and joined to the lower film 22 from above so that each storage portion P ′ forms a closed space, and
The upper and lower films 21, 22 are provided between the respective storage parts P '.
Form a connecting portion 23 that closely connects the front and rear storage portions P '. As described above, the continuous chopsticks containing the disposable chopsticks S are usually cut at the connecting portion 23 after being delivered to the user. Then, each of the separated storage parts P '(one disposable chopstick package P) is glued to the main body container T (for example, a tray in which rice is packed). The liquid level control device of the glue receiving tank used for this gluing is the present invention.
【0009】糊受槽の液位制御装置の説明に先立ち、割
箸包装品Pの本体容器Tへの糊付け機構について概説す
る。図3で、連包箸2は、凸状に突き出す収納部P′が
上側に向くようにしてガイドローラ63,64上の位置
へと進み、ガイドローラ64で半転して位置決めドラム
1へと送られる。位置決めドラム1は右側に配置される
切断装置71と対向し、また、位置決めドラム1の下方
に、溶融した接着糊(以下、溶融糊という)を入れた糊
受槽32が配設されている。位置決めドラム1の左方に
はトレースタック(図示略)が設けられ、これに積層さ
れたトレーのなかで、最下段のトレーTがサクションコ
ンベア74の間欠移動形態をとる搬送部75上へ順次供
給される。包装品移送用のレバー体41は糊付けされた
包装品Pを上記トレーTの側面へ送り込み、該包装品を
トレーTの側面に接着固定する。Prior to the description of the liquid level control device for the glue receiving tank, a mechanism for pasting the disposable chopstick package P on the main body container T will be outlined. In FIG. 3, the continuous-pack chopstick 2 advances to a position on the guide rollers 63 and 64 so that the storage portion P ′ protruding in a convex shape faces upward, and half-turns by the guide roller 64 to the positioning drum 1. Sent. The positioning drum 1 faces the cutting device 71 arranged on the right side, and below the positioning drum 1, a glue receiving tank 32 containing melted glue (hereinafter, referred to as molten glue) is arranged. A tray stack (not shown) is provided on the left side of the positioning drum 1, and among the trays stacked on the tray stack, the lowermost tray T is sequentially supplied onto the conveying section 75 which is in the intermittent movement form of the suction conveyor 74. To be done. The lever 41 for transferring the packaged product sends the packaged product P to which the glue has been applied to the side surface of the tray T and adheres and fixes the packaged product to the side surface of the tray T.
【0010】図3の位置決めドラム1は、連包箸2が両
サイド(紙面の垂直方向)ではみ出すように、外周幅を
連包箸2より小さくした円柱体で中心軸13回りに間欠
的に回転するようになっている。位置決めドラム1の外
周には、一定間隔をおいて細長状の凹所11が形成され
ている。凹所11は、矩形断面形状で、位置決めドラム
1の回転に伴って連包箸2の収納部P′と嵌合する。各
凹所11には真空吸引用の吸気孔が複数開口され、ま
た、各凹所11の中間位置には深溝12が形成されてい
る。上記ガイドローラ64から引き出された連包箸2
は、フィルム面から突出する各収納部P′が位置決めド
ラム1の最上位置で順次凹所11内に受容される。そし
て、凹所11に受容される過程で、フィルム21,22
が適当に伸縮して前後の収納部P′の間隔が凹所11間
の一定の間隔に矯正される。各収納部P′が凹所11内
に受容されて位置決めされた連包箸2は、位置決めドラ
ム1の回転に伴って次工程の切断装置71に対向する位
置へと送られる。切断装置71は、エアシリンダ711
から延びるロッド712の先端に保持具713を介して
カット刃714を設ける。カット刃714は、前進状態
でその刃先を図3のように位置決めドラム1外周の深溝
12内に進入させ、連包箸2を連結部23(図2)で分
断して、一つ一つの包装品P(一の割箸包装品)にす
る。切り離された包装品Pは、吸気孔からの真空吸引に
より凹所11内に保持されて位置決めドラム1と一体に
回転移動し、最下位置を通過していく。最下位置を通過
した包装品Pには、糊供給装置3のスイングアーム31
の作動により糊受槽32内の溶融糊Lが付けられる。そ
の後、溶融糊が付いた包装品Pが、レバー体41によっ
てトレーTの側面に接着固定されていく機構である。The positioning drum 1 shown in FIG. 3 is a cylindrical body having an outer peripheral width smaller than that of the continuous chopsticks 2 so that the continuous chopsticks 2 may protrude on both sides (perpendicular to the plane of the paper). It is designed to rotate. On the outer periphery of the positioning drum 1, elongated recesses 11 are formed at regular intervals. The recess 11 has a rectangular cross-sectional shape and fits into the storage portion P ′ of the continuous-pack chopsticks 2 as the positioning drum 1 rotates. A plurality of suction holes for vacuum suction are opened in each recess 11, and a deep groove 12 is formed at an intermediate position of each recess 11. Continuous wrapped chopsticks 2 pulled out from the guide roller 64
In the uppermost position of the positioning drum 1, the respective storage portions P ′ protruding from the film surface are sequentially received in the recess 11. Then, in the process of being received in the recess 11, the films 21, 22
Is appropriately expanded and contracted so that the space between the front and rear storage parts P'is corrected to a constant space between the recesses 11. The continuous chopsticks 2 in which the respective storage portions P ′ are received and positioned in the recesses 11 are sent to a position facing the cutting device 71 in the next process as the positioning drum 1 rotates. The cutting device 71 includes an air cylinder 711.
A cutting blade 714 is provided at the tip of a rod 712 extending from the holder via a holder 713. The cutting blade 714 advances its cutting edge into the deep groove 12 on the outer circumference of the positioning drum 1 as shown in FIG. 3, divides the continuous chopsticks 2 at the connecting portion 23 (FIG. 2), and wraps each one individually. Item P (1 piece of disposable chopstick packaging). The separated packaged product P is held in the recess 11 by vacuum suction from the suction hole, rotates together with the positioning drum 1, and passes through the lowest position. The swing arm 31 of the glue supply device 3 is attached to the package P that has passed through the lowest position.
The molten glue L in the glue receiving tank 32 is attached by the operation of. After that, the package P with the molten glue is adhered and fixed to the side surface of the tray T by the lever body 41.
【0011】こうして、糊受槽32内の溶融糊Lは消費
され、その液面が下がっていくが、本発明たる糊受槽の
液位制御装置によってその液位は一定に保たれる。In this way, the melted glue L in the glue receiving tank 32 is consumed and the liquid level thereof is lowered, but the liquid level is kept constant by the liquid level control device of the glue receiving tank according to the present invention.
【0012】まず、糊受槽の液位制御に係わる糊受槽周
りの機器を説明する。糊受槽32が位置決めドラム1の
下方に設けられる。該糊受槽32の底部内にはヒータ3
4が埋設される。ヒータ34は、位置決めドラム1の軸
方向へ延びており、接着糊Lを100℃〜200℃程度
の溶融状態に保つことができる。前記糊受槽32に隣接
して、これと糊供給路53(糊供給口)で結ばれた貯蔵
槽51が設けられる(図6)。貯蔵槽51内には樹脂系
接着剤となる原材料の固形糊Mが収納される。固形糊M
は、ここでは、合成樹脂材を四角形の板片に成形したホ
ットメルト剤(サイデン化学株式会社製,商品名:サイ
ビノール,型番:HM−P−27)で、糊供給路53に
向けて下り傾斜した貯蔵槽51の槽内底面51a上に多
数積層される。貯蔵槽51の底壁内には加熱手段として
のヒータ52が埋設される。該ヒータ52は貯蔵槽51
内の下層に位置する固形糊Mを加熱融解させ得る。固形
糊Mはヒータ52で加熱されると融解して溶融糊Lとな
り、該溶融糊Lは傾斜した槽内底面51aに沿って流れ
て、糊供給路53を経て糊受槽32内へと流入する。First, the equipment around the glue receiving tank relating to the liquid level control of the glue receiving tank will be described. The glue receiving tank 32 is provided below the positioning drum 1. A heater 3 is provided in the bottom of the glue receiving tank 32.
4 is buried. The heater 34 extends in the axial direction of the positioning drum 1 and can keep the adhesive paste L in a molten state at about 100 ° C to 200 ° C. Adjacent to the glue receiving tank 32, there is provided a storage tank 51 connected to the glue receiving tank 32 by a glue supply path 53 (glue supply port) (FIG. 6). In the storage tank 51, a solid paste M which is a raw material serving as a resin adhesive is stored. Solid paste M
Is a hot melt agent (made by Saiden Chemical Co., Ltd., trade name: Cybinol, model number: HM-P-27) formed by molding a synthetic resin material into a rectangular plate piece, and is inclined downward toward the glue supply path 53. A large number of layers are stacked on the bottom surface 51a of the storage tank 51. A heater 52 as a heating means is embedded in the bottom wall of the storage tank 51. The heater 52 is a storage tank 51
The solid paste M located in the lower layer of the inside can be heated and melted. When the solid paste M is heated by the heater 52, it melts to become a molten paste L, and the molten paste L flows along the inclined bottom surface 51a of the tank and then flows into the paste receiving tank 32 via the paste supply passage 53. .
【0013】糊受槽32には、既述のヒータ34の他
に、溶融糊Lの温度検出用の熱電対81が側面から底壁
内へ挿入されている。また、図略の支持具に固定され
て、糊受槽32の上方開口より液位検出用の温度検出手
段たる熱電対82が垂設し、その温度検出端(下端)8
21が槽内底面32aから所定の高さhに位置するよう
配される。これら熱電対81,82と上記各ヒータ3
4,52はそれぞれCPUを内蔵した加熱制御手段たる
制御回路8に接続されており、制御回路8は上記各熱電
対81,82の温度信号に基づいて後述のように各ヒー
タ34,52への通電を制御する。In the glue receiving tank 32, in addition to the heater 34 described above, a thermocouple 81 for detecting the temperature of the molten glue L is inserted from the side surface into the bottom wall. Further, a thermocouple 82, which is fixed to a support (not shown) and extends downward from the upper opening of the glue receiving tank 32, serves as temperature detecting means for liquid level detection, and its temperature detecting end (lower end) 8
21 is arranged at a predetermined height h from the bottom surface 32a in the tank. These thermocouples 81 and 82 and the above heaters 3
Reference numerals 4 and 52 are connected to a control circuit 8 which is a heating control means having a built-in CPU. Control energization.
【0014】図7,図8に制御回路の制御フローチャー
トを表す。図7は糊受槽32内の溶融糊Lの温度制御手
順を示すもので、ステップ101で熱電対81の検出信
号を読み込み、続くステップ102で検出温度が設定値
(例えば150℃)よりも低いときはヒータ34をON
とする(ステップ103)。一方、上記ステップ102
で検出温度が150℃以上の場合にはヒータ34をOF
Fとする(ステップ104)。かくして、150℃を境
としてヒータをON−OFFすることにより、溶融糊L
の温度をほぼ設定値たる150℃に保つ。上記設定値
は、溶融糊Lを確保できる温度であれば150℃に限定
されない。7 and 8 show control flowcharts of the control circuit. FIG. 7 shows the temperature control procedure of the molten glue L in the glue receiving tank 32. In step 101, the detection signal of the thermocouple 81 is read, and in the following step 102, when the detected temperature is lower than the set value (for example, 150 ° C.). Turns on the heater 34
(Step 103). On the other hand, the above step 102
If the detected temperature is 150 ° C or higher, the heater 34 is turned off.
F (step 104). Thus, by turning the heater on and off at a temperature of 150 ° C, the molten glue L
Keep the temperature at 150 ° C, which is almost the set value. The set value is not limited to 150 ° C. as long as it is a temperature that can secure the molten paste L.
【0015】図8は、溶融糊Lの加熱制御手段における
液位制御の手順の一例を示す。ステップ201で熱電対
82の検出信号を読み込み、検出温度が設定値として例
えば75℃よりも低いときには、加熱手段たるヒータ5
2をONとし(ステップ202,203)、75℃以上
の場合にはヒータ52をOFFとする(ステップ20
4)。FIG. 8 shows an example of the procedure for controlling the liquid level in the heating control means for the molten paste L. In step 201, the detection signal of the thermocouple 82 is read, and when the detected temperature is lower than the set value of, for example, 75 ° C., the heater 5 serving as a heating means.
2 is turned on (steps 202 and 203), and the heater 52 is turned off when the temperature is 75 ° C. or higher (step 20).
4).
【0016】既述のように、スイングアーム31によっ
て周期的に溶融糊Lが包装品Pに供給されると、溶融糊
Lの液位は漸次低くなっていく。本実施形態では、糊受
槽32の側壁と槽内に設けた支持柱321との間に、支
軸33を中心軸13と平行になるよう配設し、該支軸3
3に上記スイングアーム31を固定する(図5)。支軸
33の一端はピニオン35に結合し、これにラック36
が噛合する。ラック36は、シリンダ37から延びるピ
ストンロッド38の先端に固着され、下面部分をガイド
ローラ39により支持される。ラック36が後退位置に
ある場合は、各スイングアーム31は図4における反時
計方向へ旋回して全体が溶融糊L内に浸漬する(図5の
状態)。そして、位置決めドラム1に保持された包装品
Pが所定の位置へ至ると、ラック36が前進する。これ
に伴って、各スイングアーム31は時計方向へ旋回し、
図4に示すように溶融糊L外へ進出して、各アームの先
端311が包装品Pに当接する。かくのごとくして、各
アーム先端311の溶融糊Lが包装品に供給される。ス
イングアーム31は複数設けられ、包装品Pの長手方向
の複数箇所にそれぞれ溶融糊が付着供給されていく。As described above, when the melted glue L is periodically supplied to the package P by the swing arm 31, the liquid level of the melted glue L gradually decreases. In the present embodiment, the support shaft 33 is arranged between the side wall of the glue receiving tank 32 and the support column 321 provided in the tank so as to be parallel to the central axis 13, and the support shaft 3
The swing arm 31 is fixed to 3 (FIG. 5). One end of the support shaft 33 is connected to the pinion 35, and the rack 36
Meshes. The rack 36 is fixed to the tip of a piston rod 38 extending from the cylinder 37, and the lower surface portion is supported by a guide roller 39. When the rack 36 is in the retracted position, each swing arm 31 pivots counterclockwise in FIG. 4 and the whole is immersed in the melt glue L (state in FIG. 5). Then, when the package P held on the positioning drum 1 reaches a predetermined position, the rack 36 advances. Along with this, each swing arm 31 turns clockwise,
As shown in FIG. 4, the melted glue L is advanced to the outside, and the tips 311 of the respective arms abut the package P. In this way, the molten glue L at the end 311 of each arm is supplied to the package. A plurality of swing arms 31 are provided, and molten glue is attached and supplied to a plurality of locations in the longitudinal direction of the package P, respectively.
【0017】こうして、糊受槽内の溶融糊Lの液位が下
がり、熱電対82の先端が溶融糊Lから露出するに至
る。その結果、熱電対82の温度は外気温度(−50℃
〜50℃)に向けて低下し、設定値の75℃を下回る。
すると、ヒータ52がONになる。ヒータ52の加熱に
より、ヒータ52に近い貯蔵槽底面51a付近の固形糊
Mが次第に溶融し始める。そうして、溶融した溶融糊L
が貯蔵槽の傾斜面に沿い流れ出し、糊受槽32へと入り
込んでいく。斯る現象で、糊受槽32内の溶融糊Lの液
位が上昇してその高さがhを越える。そうすると、熱電
対82の温度検出端821が再び溶融糊Lに漬かり出
す。溶融糊Lへ温度検出端821が漬かることで、熱電
対82の検出温度が急上昇し、75℃を越える。これに
伴ない、ヒータ52がOFFとなる。固形糊Mの溶融が
停止し、糊受槽32内への溶融糊Lの流出を止める。か
くのごとく、上述の溶融糊の液位制御が繰り返され、糊
受槽32の溶融糊Lの液位は一定に保たれ、且つ、必要
量以外の固形糊Mは原形維持が図られる。尚、本実施形
態では、温度検出手段として熱電対を使用するが、熱電
対に代えて、サーミスタ(測温抵抗体)やバイメタル等
の温度検出手段を使用することもできる。これらの温度
検出手段も、その構造がシンプルで故障が少ないからで
ある。Thus, the liquid level of the molten glue L in the glue receiving tank is lowered and the tip of the thermocouple 82 is exposed from the molten glue L. As a result, the temperature of the thermocouple 82 is the outside air temperature (-50 ° C).
˜50 ° C.) and falls below the set value of 75 ° C.
Then, the heater 52 is turned on. Due to the heating of the heater 52, the solid paste M near the storage tank bottom surface 51a near the heater 52 gradually starts to melt. Then, the melted glue L melted
Flows out along the inclined surface of the storage tank and enters the glue receiving tank 32. Due to such a phenomenon, the liquid level of the molten glue L in the glue receiving tank 32 rises and its height exceeds h. Then, the temperature detecting end 821 of the thermocouple 82 is dipped in the molten paste L again. When the temperature detecting end 821 is immersed in the molten paste L, the temperature detected by the thermocouple 82 rises sharply and exceeds 75 ° C. Along with this, the heater 52 is turned off. The melting of the solid paste M is stopped, and the outflow of the molten paste L into the paste receiving tank 32 is stopped. As described above, the liquid level control of the above-mentioned molten paste is repeated, the liquid level of the molten paste L in the paste receiving tank 32 is kept constant, and the solid paste M other than the necessary amount is maintained in its original shape. In this embodiment, a thermocouple is used as the temperature detecting means, but a temperature detecting means such as a thermistor (resistance temperature detector) or bimetal can be used instead of the thermocouple. This is because these temperature detecting means also have a simple structure and few failures.
【0018】このような糊受槽の液位制御装置によれ
ば、糊受槽32内の溶融糊Lの液位はほぼ一定の値hに
保たれ、糊受槽32の溶融糊Lの量が過度に減少してス
イングアーム31による包装品Pへの糊供給が実施でき
なくなるといった事態は回避される。また、従来は、糊
受槽32内の溶融糊Lの液位コントロールが難しいとさ
れ、固形糊Mをバッチ的に糊受槽32内へ充分投入して
溶融する等により行っていた。従って、毎日の操業終了
時には、酸化,変質し易い溶融糊を大量に捨てる等の無
駄が生じていた。しかるに、本実施形態では、常に必要
なだけの固形糊のみが溶融され自動補充されるので、作
業が楽になるばかりか、固形糊を無駄に消費することは
ない。操業終了時において、貯蔵槽51に残った殆どの
固形糊Mは溶融を免がれ、大半の固形糊は次回にまた使
用できる。According to such a liquid level control device for the glue receiving tank, the liquid level of the molten glue L in the glue receiving tank 32 is maintained at a substantially constant value h, and the amount of the molten glue L in the glue receiving tank 32 becomes excessive. A situation in which the swing arm 31 cannot supply glue to the package P by the swing arm 31 is prevented. Further, conventionally, it has been considered difficult to control the liquid level of the molten paste L in the paste receiving tank 32, and the solid paste M is sufficiently charged in batches into the paste receiving tank 32 to melt it. Therefore, at the end of daily operation, waste such as discarding a large amount of melted glue that is easily oxidized and deteriorated occurs. However, in the present embodiment, only the required solid glue is always melted and automatically replenished, so that the work is easy and the solid glue is not wasted. At the end of the operation, most of the solid paste M remaining in the storage tank 51 is prevented from melting, and most of the solid paste M can be used next time.
【0019】更に、糊受槽32の液位検出に温度検出手
段たる熱電対82を使用すると、熱電対が起電力効果に
基づく簡易な温度センサであるので、可動部がなくその
構造が単純であり、更に外周面を保護管で守ることもで
き、基本的にエラーを起こし難く且つ壊れない。しか
も、熱電対は小さいので、コンパクトに設置できる。勿
論、従来のような機械的作動部や検出窓へ糊蒸気が付着
して検出不能となる事態を招かず、熱電対82は長期に
亘って正確な液位検出を達成できる。加えて、糊受槽3
2の液位制御装置は、通常、周囲にある他の機械等によ
る振動を受け、この悪条件の下で液位検出を行わねばな
らないが、機械的作動部のあるもの等と異なり、温度検
出手段としての熱電対82等はこれらに全く影響されな
い利点もある。このように、本実施形態は、本来、温度
センサとしてしか使われてこなかった温度検出手段たる
熱電対(或いは、サーミスタやバイメタル)を液位検出
として特異で且つ効果的な使い方をするのに特徴があ
る。また、熱電対は、従来、あるレンジの温度域を測る
のに用いられていきたが、ここでは、設定値を越えるか
越えないかの判別に使用するところに特徴を有する。Further, when the thermocouple 82 serving as the temperature detecting means is used for detecting the liquid level in the glue receiving tank 32, the thermocouple is a simple temperature sensor based on the electromotive force effect, so that there is no moving part and its structure is simple. Also, the outer peripheral surface can be protected by a protective tube, which is basically not prone to error and does not break. Moreover, since the thermocouple is small, it can be installed compactly. As a matter of course, the situation in which the glue vapor adheres to the mechanical operation portion and the detection window as in the conventional case and the detection becomes impossible, and the thermocouple 82 can achieve accurate liquid level detection for a long period of time. In addition, the glue receiving tank 3
The liquid level control device of No. 2 is usually subjected to vibrations from other machines around it and must detect the liquid level under this adverse condition. The thermocouple 82 as a means has an advantage that it is not affected by them. As described above, the present embodiment is characterized in that the thermocouple (or thermistor or bimetal), which is the temperature detecting means originally used only as the temperature sensor, is used uniquely and effectively as the liquid level detection. There is. Further, the thermocouple has been conventionally used to measure a temperature range of a certain range, but here it is characterized in that it is used to determine whether a set value is exceeded or not exceeded.
【0020】尚、本発明においては、前記実施例に示す
ものに限られず、目的,用途に応じて本発明の範囲で種
々変更できる。例えば、ヒータ34,52の過度なON
−OFFを避けるために、ON時とOFF時でヒステリ
シス特性を与えるようにしても良い。貯蔵槽51と糊受
槽32とを糊供給路53で結ぶことは必ずしも必要でな
く、貯蔵槽51の底壁に糊供給口を設けて、この糊供給
口から溶融糊Lを糊受槽32内へ直接滴下供給するよう
にしてもよい。本実施形態における75℃、150℃の
値は設計的に変更され得るものである。勿論、本発明
は、固形糊Mとして本実施形態におけるものに限らず種
々の固形糊タイプのものを採用でき、また、糊受槽32
の溶融糊Lを糊付けする包装品Pには、一例として挙げ
た割箸包装品に限らず、用途に応じて、例えばスプーン
やストロー等の様々な包装品や更に物品自体(包装フィ
ルムなし)が対象になる。In the present invention, the present invention is not limited to the above-described embodiment, but can be variously changed within the scope of the present invention depending on the purpose and application. For example, the heaters 34 and 52 are turned on excessively.
In order to avoid -OFF, hysteresis characteristics may be given at ON and OFF. It is not always necessary to connect the storage tank 51 and the glue receiving tank 32 with the glue supply path 53, and a glue feeding port is provided on the bottom wall of the storage tank 51, and the molten glue L is introduced into the glue receiving tank 32 from this glue feeding port. You may make it supply by dripping directly. The values of 75 ° C. and 150 ° C. in this embodiment can be changed by design. Of course, the present invention is not limited to the solid paste M in the present embodiment, and various solid paste types can be adopted, and the paste receiving tank 32 can be used.
The packaged product P to which the molten glue L of is adhered is not limited to the disposable chopsticks packaged product as an example, and various packaged products such as spoons and straws and the product itself (without a packaging film) are applicable depending on the application. become.
【0021】[0021]
【発明の効果】以上のごとく、本発明の糊受槽の液位制
御装置は、故障が少ない構造で且つコンパクト化も可能
で、しかも、溶融糊の液位を正確に検出してその液位の
一定維持が図れるなど優れた効果を発揮する。As described above, the liquid level control device for the glue receiving tank of the present invention has a structure with few failures and can be made compact, and moreover, the liquid level of the molten glue can be accurately detected and It exhibits excellent effects such as maintaining a constant level.
【図面の簡単な説明】[Brief description of drawings]
【図1】連包箸の破断平面図である。FIG. 1 is a cutaway plan view of a continuous-pack chopstick.
【図2】図1のII−II線に沿う断面図である。FIG. 2 is a sectional view taken along the line II-II in FIG.
【図3】本発明の液位制御装置を使用する糊付け装置の
要部拡大側面図である。FIG. 3 is an enlarged side view of an essential part of a gluing device using the liquid level control device of the present invention.
【図4】本発明の液位制御装置を使用する糊供給装置の
横断面図である。FIG. 4 is a cross-sectional view of a glue supply device using the liquid level control device of the present invention.
【図5】本発明の液位制御装置を使用する糊供給装置の
縦断面図である。FIG. 5 is a vertical cross-sectional view of a glue supply device using the liquid level control device of the present invention.
【図6】本発明の一実施形態における液位制御装置を付
設した糊受槽と貯蔵槽の断面図である。FIG. 6 is a cross-sectional view of a glue receiving tank and a storage tank provided with a liquid level control device according to an embodiment of the present invention.
【図7】本発明の一実施形態における制御回路の制御フ
ローチャートである。FIG. 7 is a control flowchart of the control circuit according to the embodiment of the present invention.
【図8】本発明の一実施形態における制御回路の制御フ
ローチャートである。FIG. 8 is a control flowchart of the control circuit according to the embodiment of the present invention.
32 糊受槽 51 貯蔵槽 51a 底面 52 ヒータ(加熱手段) 53 糊供給路 71 切断装置 8 制御回路(加熱制御手段) 82 熱電対(温度検出手段) 821 温度検出端 L 溶融糊 M 固形糊 32 glue receiving tank 51 storage tank 51a bottom surface 52 heater (heating means) 53 glue supply path 71 cutting device 8 control circuit (heating control means) 82 thermocouple (temperature detection means) 821 temperature detection end L melted glue M solid glue
Claims (3)
蔵する貯蔵槽と、該貯蔵槽に付設されて前記固形糊の一
部を溶融させ、この溶融糊を前記糊受槽内へ流入させる
加熱手段と、前記糊受槽の底面から所定高さに配設され
た温度検出手段と、該温度検出手段で検出される温度が
所定温度以下となった時に前記加熱手段を作動させる加
熱制御手段と、を備えることを特徴とする糊受槽の液位
制御装置。1. A glue receiving tank for storing molten paste, a storage tank for storing solid paste, and a storage tank attached to the storage tank to melt a part of the solid paste, and the melt paste into the paste receiving tank. Heating means for inflowing, temperature detecting means arranged at a predetermined height from the bottom surface of the glue receiving tank, and heating control for operating the heating means when the temperature detected by the temperature detecting means falls below a predetermined temperature. A liquid level control device for a glue receiving tank, comprising:
れ、当該熱電対の温度検出端を前記所定高さに位置させ
たことを特徴とする請求項1に記載の糊受槽の液位制御
装置。2. The liquid level control device for a glue receiving tank according to claim 1, wherein the temperature detecting means is composed of a thermocouple, and a temperature detecting end of the thermocouple is located at the predetermined height. .
斜していて、前記底面近くに設けた前記加熱手段により
加熱され溶融した溶融糊が前記底面に沿って前記糊供給
口に至り、当該糊供給口を経て前記糊受槽内へ供給され
ることを特徴とする請求項1又は2に記載の糊受槽の液
位制御装置。3. The bottom surface of the storage tank is inclined toward the glue supply port, and the melted glue heated and melted by the heating means provided near the bottom surface reaches the glue supply port along the bottom surface. The liquid level control device for a glue receiving tank according to claim 1 or 2, wherein the liquid is supplied into the glue receiving tank through the glue supply port.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9046496A JPH09257545A (en) | 1996-03-19 | 1996-03-19 | Liquid level control device of paste receiving tank |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9046496A JPH09257545A (en) | 1996-03-19 | 1996-03-19 | Liquid level control device of paste receiving tank |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09257545A true JPH09257545A (en) | 1997-10-03 |
Family
ID=13999335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9046496A Pending JPH09257545A (en) | 1996-03-19 | 1996-03-19 | Liquid level control device of paste receiving tank |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09257545A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008264910A (en) * | 2007-04-18 | 2008-11-06 | Yaskawa Electric Corp | Robot control method, robot control device, and robot control system |
JP2013242241A (en) * | 2012-05-22 | 2013-12-05 | Canon Machinery Inc | Liquid level detection device and adhesive application device |
CN105259936A (en) * | 2015-10-21 | 2016-01-20 | 蓝星(北京)技术中心有限公司 | Rectifying tower liquid level control method and apparatus based on calorific value |
-
1996
- 1996-03-19 JP JP9046496A patent/JPH09257545A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008264910A (en) * | 2007-04-18 | 2008-11-06 | Yaskawa Electric Corp | Robot control method, robot control device, and robot control system |
JP2013242241A (en) * | 2012-05-22 | 2013-12-05 | Canon Machinery Inc | Liquid level detection device and adhesive application device |
CN105259936A (en) * | 2015-10-21 | 2016-01-20 | 蓝星(北京)技术中心有限公司 | Rectifying tower liquid level control method and apparatus based on calorific value |
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