JPH09256155A - Film forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To transmit information of a film thickness monitor by a transmitter of a radio system and a receiver receiving signals of the transmitter. SOLUTION: The film forming device is constituted of a vapor deposition room 29, a vapor deposition source 26 installed at a lower part of the vapor deposition room, a substrate holder 24 which is installed at an upper part of the vapor deposition source and aligns and fixes a substrate on which a film is formed, a vapor deposition jig 21 which guides and fixes the substrate holder and rotates the substrate holder above the vapor deposition source, a film thickness monitor 22 monitoring thickness of the film formed on the substrate and a controller 53 controlling the vapor deposition source according to information of the film thickness monitor. Further, in the film forming device in which the film thickness monitor 23 and the substrate holder 24 are disposed at positions where they can move in a same way and the film thickness monitor 23 is disposed near the substrate, the transmitter 60 of a radio system for transmitting information of the film thickness monitor 23 is installed in the vapor deposition room 29 the receiver 61 for receiving signals of the transmitter is installed inside or outside the vapor deposition room.

Description

Detailed Description of the Invention

[0001]

[0001] The present invention relates to a film forming apparatus.

[0002]

2. Description of the Related Art It has long been known that a metal film is formed on the surface of a substrate to be used as an electrode or a circuit pattern, or that a thin film excitation electrode is provided on a piezoelectric substrate and an alternating current is applied to the electrode to cause resonance to serve as a reference frequency source. Has been done from. In many cases, a thin film excitation electrode is provided on a piezoelectric ceramic or a single crystal having a piezo effect to be used as a vibrator, but for film formation of a metal thin film, a vibrating piece is placed in an appropriate jig in a vacuum chamber, It is performed by methods such as vapor deposition and sputtering. What is used for the substrate and what is used for the film-forming material are merely choices in forming the thin film, and therefore, in the following, AT is used as an example.
The description will be made assuming that the electrode formation of the cut quartz oscillator is performed by the vacuum deposition method, but the present invention is not limited to the example.

FIG. 1 is a perspective view of a rectangular AT-cut crystal unit housed in a cylinder type container. FIG. 5 shows a rectangular shape A
It is a perspective view of the T-cut crystal vibrating piece 40 alone. The AT-cut crystal unit is generally manufactured as follows. Process of processing the rough quartz into the desired AT-cut quartz vibrating piece 2,
AT cutting crystal vibrating reed 2 film forming process, mounting process for fixing AT cutting crystal vibrating reed 2 to the lead terminal 5 of the airtight terminal 4, adjusting process for adjusting to desired frequency, AT cutting with metal cover 1 The process includes hermetically sealing the crystal vibrating piece 2.

The process of forming an electrode on the quartz crystal vibrating piece is mainly intended to form an exciting electrode for taking out an electric signal, but at the same time, it is also intended to roughly adjust the vibration frequency. It is known that when a mass is uniformly applied on the surface of a quartz-crystal vibrating piece, its vibration frequency has a characteristic of decreasing. Also in the step of forming the electrode, the vibration frequency is reduced by adding the mass of the electrode film to the crystal vibrating piece. This decreasing amount is called an electrode drop amount or a plate back amount. The amount of plate back varies depending on the area, density, film thickness, size, frequency, etc. of the crystal vibrating piece. As a material of the electrode film, silver, gold, nickel, aluminum, palladium, or the like is used. Depending on the application, chromium or titanium may be used as a base, and the electrode material may be laminated thereon.

FIG. 2 is a schematic front view of a film forming apparatus for explaining the prior art. A rectangular AT-cut quartz crystal vibrating piece (hereinafter referred to as a work vibrator) is provided in the vapor deposition chamber 29.
A deposition source 26 for depositing an electrode is provided at 40.
A substrate holder 24 in which a large number of work oscillators 40 are aligned and housed above the vapor deposition source 26, a film thickness monitor 22 for controlling the plate back amount, and an AT-cut quartz crystal vibrating piece in the film thickness monitor 22 (hereinafter referred to as a monitor oscillator). An oscillation circuit 23 that oscillates the vibration frequency of 30 is arranged. The substrate holder 24 is guide-fixed by the vapor deposition jig 21. The vapor deposition jig 21 is fixed to the reversing unit rotation connecting device 55, and is capable of reversing (rotating 180 degrees) or constantly rotating. The reversing part rotation connecting device 55 is the revolving part rotation connecting device 56.
, And can revolve around the center of the vapor deposition chamber 29.

FIG. 3 is a bottom view schematically showing the inside of the film forming apparatus. FIG. 4 is a perspective view of a round AT-cut crystal vibrating piece. Ten evaporation jigs 21 are arranged, and the whole rotates in the direction of the arrow. The film thickness monitor 22 is the work vibrator 4
It is installed on one of the vapor deposition jigs 21 for guiding and fixing the substrate holder 24 for aligning and fixing 0s. Each of the ten vapor deposition jigs 21 inverts itself (rotates by 180 degrees) when the whole of the vapor deposition jigs makes one revolution, and the vapor-deposited surface changes with each inversion. If necessary, the evaporation jig 21 may be revolved around its own axis. The vapor deposition material 25 is suitably selected from the aforementioned materials. A circular monitor vibrator 30 as shown in FIG. 4 is used for the film thickness monitor 22, but the shape of the monitor vibrator 30 is not particularly limited to the round shape.

The vapor deposition rate and the vapor deposition film thickness are controlled by converting the change in the vibration frequency of the monitor vibrator 30 into the vapor deposition film thickness. In other words, the plate back amount of the work vibrator 40 is controlled.

An electrode 31 is formed in advance on the monitor vibrator 30, and by connecting it to the oscillation circuit 23, the vibration frequency can be always taken out from the start of vapor deposition.
The extracted vibration frequency is read by the control device 53.
The control device 53 controls the power of the evaporation source 26 by changing the vibration frequency of the monitor vibrator 30, and
When the vibration frequency of 0 matches the set value, the overrun prevention shutter (not shown) located on the upper surface of the vapor deposition material 25 is closed to terminate the vapor deposition.

[0009]

In the step of forming an electrode on a quartz crystal resonator element, the main purpose is to form an excitation electrode for extracting an electric signal, but at the same time, the vibration frequency is roughly adjusted to a constant value. It also aims to enter the target value of. Since the variation of the vibration frequency of the work oscillator 40 after the film formation is greatly influenced by the variation of the electrode film thickness, it is necessary to make the electrode film thickness of the work oscillator 40 in the vapor deposition chamber 29 as uniform as possible. Since the variation in the electrode film thickness depends on the distance from the deposition source 26 to the work vibrator 40, the work vibrator 40 is disposed so as to be as far as possible from the vapor deposition source 26, and is positioned at the center of the vapor deposition chamber 29 during the vapor deposition. On the other hand, since it revolves, the distance from the evaporation source 26 is always constant. Further, in order to equalize the electrode film thicknesses on the front surface and the back surface of the work vibrator 40, the work vibrator 40 aligned and fixed to the substrate holder 24 is periodically inverted (or always rotated) with respect to the substrate holder 24. It is formed into a film.

The evaporation source 26 is controlled by changing the vibration frequency of the monitor vibrator 30 via the control device 53. In other words, the film formation of the work vibrator 40 is controlled by a change in the vibration frequency of the monitor vibrator 30. Therefore, the monitor vibrator 30 is located at a position where the same movement as the work vibrator 40 can be performed, and is set as close to the work vibrator 40 as possible. In the prior art shown in FIG. 2 as well, the monitor vibrator 30 can be moved in the same manner as the work vibrator 40 and is set on the vapor deposition jig 21 so as to be as close to the work vibrator 40 as possible.
And revolves regularly (or always rotates).

The vibration frequency of the monitor oscillator 30 is controlled by the oscillation circuit 23 to control the vapor deposition source 26, and the vapor deposition chamber 2 is controlled.
9 must be transmitted to the control device 53 installed outside the device 9. However, as described above, during the film formation, the monitor oscillator 30 revolves in the vapor deposition chamber 29 with respect to the center of the vapor deposition chamber 29 and periodically inverts (or always rotates). A control device 5 that oscillates a frequency with the oscillation circuit 23 and is installed outside the vapor deposition chamber 29.
When inputting to 3, there is a problem with the transmission method. Since the monitor oscillator 30 revolves around and rotates regularly (or always rotates), it is difficult to transmit the vibration frequency to the control device 53 by wire. In summary, it is revolving during vapor deposition and is regularly reversed (or always rotated). When the vibration frequency of the monitor vibrator 30 is transmitted to the control device 53 outside the vapor deposition chamber 29 by wire, the transmission line is entangled with the revolution part rotation connection device 56 and the reversal part rotation connection device 55, and revolves revolvingly and periodically. There is a problem that (or it always rotates) and the film forming apparatus stops.

In order to solve the above-mentioned problems, the present invention provides a film forming apparatus in which a film thickness monitor and a substrate holder can be moved in the same position, and a film thickness monitor is arranged near the substrate. It is an object of the present invention to install a wireless transmitter for transmitting the information of the film thickness monitor and to install a receiver for receiving the signal of the transmitter inside the vapor deposition chamber or outside the vapor deposition chamber.

[0013]

Means for Solving the Problems A vapor deposition chamber, a vapor deposition source installed in the lower portion of the vapor deposition chamber, a substrate holder installed in the upper portion of the vapor deposition source for aligning and fixing a substrate on which a film is to be formed, and a guide holder for fixing the substrate holder. Then, it comprises a vapor deposition jig that rotates the substrate holder above the vapor deposition source, a film thickness monitor that monitors the film thickness formed on the substrate, and a controller that controls the vapor deposition source based on the information from the film thickness monitor. A wireless transmitter that transmits film thickness monitor information to the inside of the deposition chamber in a film deposition apparatus where the film thickness monitor and the substrate holder are in the same position and the film thickness monitor is located near the substrate. And a receiver for receiving the signal of the transmitter is installed inside or outside the deposition chamber.

A film thickness monitor and a wireless transmitter for transmitting information of the film thickness monitor are installed on the evaporation jig.

A film thickness monitor and a wireless transmitter for transmitting information of the film thickness monitor are installed on the substrate holder.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION FIGS. 6, 7 and 8 are front cross-sectional views schematically showing the inside of a film forming apparatus for explaining the present invention, and FIGS. 9 and 10 are for explaining the present invention. It is a bottom view which shows the model inside a film-forming apparatus.

In FIG. 6, what is different from the prior art is that a vapor deposition jig 21 is provided with a film thickness monitor 22 and a wireless transmitter 60 for transmitting information of the film thickness monitor 22, and the vapor deposition chamber 2
The wireless receiver 61 for receiving the information of the film thickness monitor 22 is installed inside the device 9, and the receiver 61 and the control device 53 are electrically connected. Substrate holder 24 during film formation
A large number of work vibrators 40 and vapor deposition jigs 21 that are aligned and housed in
The film thickness monitor 22 installed at the position is inverted (rotated 180 degrees)
Or, it always rotates and revolves around the center of the vapor deposition chamber 29. The vapor deposition rate and the vapor deposition film thickness are controlled by converting the change in the vibration frequency of the monitor oscillator 30 in the film thickness monitor 22 into the vapor deposition film thickness. During film formation, the vibration frequency of the monitor vibrator 30 is oscillated by the oscillation circuit 23 and transmitted to the transmitter 60 installed in the vapor deposition jig 21. Transmitter 60
Transmits the vibration frequency of the monitor vibrator 30 by a wireless method, receives the transmitted signal by a receiver 61 installed inside the deposition chamber 29, and inputs the vibration frequency of the monitor vibrator 30 to the control device 53. To be done. The control device 53 is the vapor deposition source 26.
Is controlled to perform the target film formation.

In FIG. 7, a film thickness monitor 22 and a wireless transmitter 60 for transmitting information of the film thickness monitor 22 are installed on the substrate holder 24, and the film thickness monitor 2 is installed inside the vapor deposition chamber 29.
This is a configuration in which a wireless receiver 61 for receiving the second information is installed and the receiver 61 and the control device 53 are electrically connected. During film formation, the work vibrators 40, which are arranged in a large number in the substrate holder 24, and the film thickness monitor 22 installed in the substrate holder 24 are inverted (rotated by 180 degrees) or constantly rotated, and with respect to the center of the vapor deposition chamber 29. It is revolving around. The vapor deposition rate and the vapor deposition film thickness are controlled by converting the change in the vibration frequency of the monitor oscillator 30 in the film thickness monitor 22 into the vapor deposition film thickness. During film formation, the vibration frequency of the monitor oscillator 30 is oscillated by the oscillation circuit 23 and transmitted to the transmitter 60 installed in the substrate holder 24. The transmitter 60 wirelessly transmits the vibration frequency of the monitor vibrator 30, and the receiver 61 installed inside the deposition chamber 29 receives the transmitted signal, and the vibration frequency of the monitor vibrator 30 is controlled by the control device. 53
Is input to The controller 53 controls the vapor deposition source 26 to perform the target film formation.

In FIG. 8, a film thickness monitor 22 is attached to the vapor deposition jig 21.
And a transmitter 60 of a wireless system for transmitting information of the film thickness monitor 22 is installed, and the film thickness monitor 22 is provided outside the deposition chamber 29.
This is a configuration in which a wireless receiver 61 for receiving information is installed and the receiver 61 and the control device 53 are electrically connected.
During film formation, a plurality of work vibrators 40 arranged in a row in the substrate holder 24 and a film thickness monitor 2 installed on the vapor deposition jig 21.
No. 2 is inverted (rotated by 180 degrees) or always rotates and revolves around the center of the vapor deposition chamber 29. The vapor deposition rate and the vapor deposition film thickness are controlled by the monitor oscillator 30 in the film thickness monitor 22.
It is performed by converting the change of the vibration frequency of the above into the vapor deposition film thickness. During film formation, the oscillation frequency of the monitor oscillator 30 oscillates in the oscillation circuit 23 and the transmitter 6 installed in the vapor deposition jig 21.
0 is transmitted. The transmitter 60 wirelessly transmits the vibration frequency of the monitor vibrator 30, and the receiver 61 installed outside the vapor deposition chamber 29 receives the transmitted signal, and the vibration frequency of the monitor vibrator 30 is controlled by the control device. It is input to 53. The controller 53 controls the vapor deposition source 26 to perform the target film formation.

FIG. 9 is a bottom view schematically showing the inside of the film forming apparatus for explaining the installation locations of the film thickness monitor 22 and the wireless transmitter 60 shown in FIG. 6 in detail. Deposition jig 2
1 rotates in the direction of the arrow (revolves with respect to the center of the vapor deposition chamber 29), and when the whole rotates once, each vapor deposition jig 21 is inverted (rotated by 180 degrees). The surface to be vapor-deposited changes. If necessary, the evaporation jig 21 may be revolved around its own axis. The film thickness monitor 22 and the wireless transmitter 60 are installed on the vapor deposition jig 21, and the signal of the film thickness monitor 22 is transmitted from the wireless transmitter 60.

FIG. 10 shows the film thickness monitor 22 shown in FIG.
FIG. 3 is a bottom view schematically showing the inside of the film forming apparatus for explaining the installation location of the wireless transmitter 60 in detail. The substrate holder 24 fixed to the vapor deposition jig 21 is rotated in the direction of the arrow (revolves with respect to the center of the vapor deposition chamber 29), and when the whole is rotated once, the individual substrate holders 24 are inverted (18
It is designed to rotate 0 degrees, and the surface of vapor deposition changes each time it is inverted. If necessary, the substrate holder 24 may be revolved around its own axis. The film thickness monitor 22 and the wireless transmitter 60 are installed on the substrate holder 24, and the signal of the film thickness monitor 22 is transmitted from the wireless transmitter 60.

In summary, during the film formation, the vibration frequency of the monitor oscillator 30 in the film thickness monitor 22 installed in the vapor deposition jig 21 or the substrate holder 24 is oscillated by the oscillation circuit 23 to cause the vapor deposition jig 21 or the substrate. It is transmitted to the transmitter 60 installed in the holder 24. The transmitter 60 wirelessly transmits the vibration frequency of the monitor vibrator 30, and the receiver 61 installed inside or outside the deposition chamber 29 receives the vibration frequency, and the vibration frequency of the monitor vibrator 30 is input to the control device 53. To be done. The controller 53 controls the vapor deposition source 26 to perform the target film formation.

[0023]

EFFECT OF THE INVENTION In a film forming apparatus in which the film thickness monitor and the substrate holder are in the same position and is installed near the substrate, a wireless transmission for transmitting the information of the film thickness monitor to the inside of the deposition chamber. The film thickness monitor oscillates even when the film thickness monitor is inverted (or always spinning) and revolves during film formation by installing the receiver inside the vapor deposition chamber and the receiver that receives the signal from the transmitter. The frequency can be input to the control device, and the control device can control the vapor deposition source to perform the target film formation.

By installing a film thickness monitor and a wireless transmitter for transmitting information of the film thickness monitor on the evaporation jig or the substrate holder, the film thickness monitor is inverted (or always rotated) and revolves during film formation. However, the vibration frequency of the film thickness monitor can be input to the control device, and the control device can control the evaporation source to perform the desired film formation.

[Brief description of drawings]

FIG. 1 is a perspective view of a rectangular AT-cut quartz resonator.

FIG. 2 is a front sectional view schematically showing the inside of a film forming apparatus according to a conventional technique.

FIG. 3 is a bottom view showing a schematic diagram of the inside of a film forming apparatus according to a conventional technique.

[FIG. 4] A round AT-cut crystal vibrating piece used for a monitor vibrator.

FIG. 5 is a perspective view of a rectangular AT-cut crystal vibrating piece.

FIG. 6 is a front sectional view schematically showing the inside of the film forming apparatus according to the present invention.

FIG. 7 is a front sectional view schematically showing the inside of the film forming apparatus according to the present invention.

FIG. 8 is a front sectional view schematically showing the inside of the film forming apparatus according to the present invention.

FIG. 9 is a bottom view schematically showing the inside of the film forming apparatus according to the present invention.

FIG. 10 is a bottom view schematically showing the inside of the film forming apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal cover 2 AT cut crystal vibrating piece 3 Electrode 4 Airtight terminal 5 Lead terminal 21 Vapor deposition jig 22 Film thickness monitor 23 Oscillation circuit 24 Substrate holder 25 Vapor deposition material 26 Vapor deposition source 29 Vapor deposition chamber 30 Monitor oscillator 31 Electrode 40 Rectangular AT Cut crystal vibrating piece 53 Control device 55 Reversing part rotation connecting device 56 Revolution part rotation connecting device 60 Transmitter 61 Receiver

Claims (3)

[Claims] 1. A vapor deposition chamber, a vapor deposition source installed in the lower portion of the vapor deposition chamber, a substrate holder disposed above the vapor deposition source for aligning and fixing a substrate on which a film is formed, and a substrate holder for guiding and fixing the substrate holder. A vapor deposition jig that rotates above the vapor deposition source, and a film thickness monitor that monitors the film thickness formed on the substrate,
A film forming apparatus comprising a control device for controlling a vapor deposition source according to the information of the film thickness monitor, at a position where the film thickness monitor and the substrate holder can move in the same manner, and in which the film thickness monitor is arranged near the substrate. A film forming method characterized in that a transmitter of a wireless system for transmitting information of a film thickness monitor is installed inside the deposition chamber, and a receiver for receiving a signal of the transmitter is installed inside or outside the deposition chamber. apparatus. 2. The film forming apparatus according to claim 1, wherein a film thickness monitor and a wireless transmitter for transmitting information of the film thickness monitor are installed on the vapor deposition jig. 3. The film forming apparatus according to claim 1, wherein a film thickness monitor and a wireless transmitter for transmitting information of the film thickness monitor are installed in the substrate holder.