JPH09252198A - Apparatus for reading electronic component and apparatus for mounting electronic component - Google Patents

Apparatus for reading electronic component and apparatus for mounting electronic component

Info

Publication number
JPH09252198A
JPH09252198A JP8059016A JP5901696A JPH09252198A JP H09252198 A JPH09252198 A JP H09252198A JP 8059016 A JP8059016 A JP 8059016A JP 5901696 A JP5901696 A JP 5901696A JP H09252198 A JPH09252198 A JP H09252198A
Authority
JP
Japan
Prior art keywords
electronic component
light source
light
source unit
reflector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8059016A
Other languages
Japanese (ja)
Other versions
JP3341569B2 (en
Inventor
Takayuki Hatase
貴之 畑瀬
Kenichi Ogata
顕一 尾形
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP05901696A priority Critical patent/JP3341569B2/en
Priority to TW086102937A priority patent/TW326619B/en
Priority to US08/815,124 priority patent/US5999640A/en
Priority to KR1019970008801A priority patent/KR100257591B1/en
Publication of JPH09252198A publication Critical patent/JPH09252198A/en
Application granted granted Critical
Publication of JP3341569B2 publication Critical patent/JP3341569B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PROBLEM TO BE SOLVED: To make it possible to obtain a clear image even without increasing the quantity of light, by making it possible to efficiently illuminate and to deal with the direct illumination and transmission illumination in response to the kind of an electronic component. SOLUTION: The apparatus for mounting an electronic component comprises a reflecting plate R1 disposed behind the component P1, a transmission illuminating light source for illuminating a light toward the plate to brighten the background of the component, a direct illuminating light source for illuminating a light to the component itself, and a line sensor 9 for introducing the reflected light from the plate or the component to itself and outputting image information. The transmission source has a first light source unit 13 and a second light source unit 14 disposed at both sides of the sensor 9 so that a first band light L1 illuminated from the unit 13 to the plate R1 and a second band light L2 illuminated from the unit 14 to the plate R1 are disposed in such a manner that the sensor 9 receives the reflected light on the plate R1. Further, the direct source has a third light source unit 20 for illuminating a third band light L3 to the area where the sensor 9 receives the reflected light.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、電子部品の画像読
み取りプロセスを改善した電子部品読み取り装置、電子
部品実装装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component reading device and an electronic component mounting device which improve an image reading process of electronic components.

【0002】[0002]

【従来の技術】従来ほとんどの電子部品実装装置におい
て、パーツフィーダからピックアップした電子部品を、
基板に実装する前に画像読み取り装置を用いて観察し、
理想位置に対する位置ずれなどを画像処理部で求め、こ
の位置ずれを補正して基板に実装している。ここで、こ
の画像読み取り装置としては、画像を2次元的に読取る
もの(前者)と、画像を電子部品の移動方向と直交する
主走査方向に1次元的に読取り、読取った1次元の画像
を副走査方向に蓄積して2次元化するもの(後者)の2
つがある。
2. Description of the Related Art In most conventional electronic component mounting apparatuses, electronic components picked up from a parts feeder are
Observe using an image reading device before mounting on the board,
The image processing unit obtains the positional deviation with respect to the ideal position, corrects the positional deviation, and mounts it on the substrate. Here, as the image reading device, one that reads an image two-dimensionally (the former) and one that reads the image one-dimensionally in the main scanning direction orthogonal to the moving direction of the electronic component and reads the one-dimensional image 2 of the one that accumulates in the sub-scanning direction and becomes two-dimensional (the latter)
There is one.

【0003】ここで、近年電子部品は、非常に小型のも
のから、多数のリードを有する大型のものまで多岐にわ
たっており、より高解像度の画像を得やすい後者が有利
である。
Here, in recent years, there have been various electronic parts from very small ones to large ones having a large number of leads, and the latter is advantageous because it is easy to obtain a higher resolution image.

【0004】したがって、後者の考え方により、1次元
のラインセンサを用い、このラインセンサの主走査方向
(受光部の配列方向)と直交する方向に電子部品を移動
させて画像を取得する電子部品読み取り装置が、組み込
まれた電子部品実装装置が存在する。
Therefore, according to the latter idea, a one-dimensional line sensor is used and an electronic component is read by moving the electronic component in a direction orthogonal to the main scanning direction of the line sensor (arrangement direction of light receiving portions) to acquire an image. There is an electronic component mounting apparatus in which the apparatus is incorporated.

【0005】[0005]

【発明が解決しようとする課題】このものでは、電子部
品を吸着するノズルの後方(即ち電子部品の背後)に反
射板を位置させ、この反射板の全体を明るくすべく、リ
ング状の光源で反射板全体に均等な光を照射して、電子
部品の背景を明るくする(透過照明)ようになってい
る。
In this device, a reflector is positioned behind a nozzle for adsorbing an electronic component (that is, behind the electronic component), and a ring-shaped light source is used to brighten the entire reflector. The entire reflector is illuminated with uniform light to brighten the background of the electronic component (transmissive illumination).

【0006】しかしながら、近年電子部品実装装置の移
載動作のタクトタイムを短縮するため、電子部品の移送
速度が上昇し、その結果、電子部品がラインセンサを横
断する時間が非常に短くなってきている。このため、従
来の電子部品実装装置によると、ラインセンサが入射す
る光の光量が不足がちとなり、正確な認識を行いにくく
なってきている。ここで、単純に光拡散板に光を照射す
る光源の光量を増加することも、対策の一つとして考え
られるが、このようにすると、光源の寿命が低下したり
消費電力が増加したりというような副作用が避けられな
い。
However, in recent years, in order to shorten the tact time of the transfer operation of the electronic component mounting apparatus, the transfer speed of the electronic component is increased, and as a result, the time for the electronic component to traverse the line sensor becomes very short. There is. Therefore, according to the conventional electronic component mounting apparatus, the amount of light incident on the line sensor tends to be insufficient, which makes it difficult to perform accurate recognition. Here, simply increasing the amount of light of the light source that irradiates the light diffuser plate can be considered as one of the countermeasures, but if this is done, the life of the light source may be shortened or the power consumption may increase. Such side effects are unavoidable.

【0007】また、BGAのように、電子部品の品種に
よっては、電子部品そのものに光を照射(直接照射)す
べき場合もあり、従来の電子部品読み取り装置では、直
接照明にも上述したようなリング状光源を追加する構成
となっているので、上述した問題点がさらに深刻なもの
となっている。
Further, depending on the type of electronic component, such as BGA, the electronic component itself may be irradiated with light (direct irradiation). In the conventional electronic component reading device, direct illumination is also performed as described above. Since the configuration is such that a ring-shaped light source is added, the above-mentioned problems become more serious.

【0008】そこで本発明は、光量を増加しなくとも鮮
明な画像を得られる電子部品読み取り装置を提供するこ
とを目的とする。
[0008] Therefore, an object of the present invention is to provide an electronic component reading apparatus which can obtain a clear image without increasing the light quantity.

【0009】[0009]

【課題を解決するための手段】本発明の電子部品読み取
り装置は、電子部品の背後に位置する反射板と、反射板
に向けて光を照射し電子部品の背景を明るくする透過照
明光源部と、電子部品そのものに光を照射する直接照明
光源部と、反射板からの反射光又は電子部品からの反射
光を入射して画像情報を出力するラインセンサとを備
え、透過光源部は、ラインセンサの両側に位置する第1
光源部と第2光源部とを含み、第1光源部が反射板に照
射する第1帯状光と第2光源部が反射板に照射する第2
帯状光とが反射板上でラインセンサが反射光を入射する
エリアに当たるように配置され、直接照明光源部は、電
子部品のうちラインセンサが反射光を入射するエリアに
第3帯状光を照射する第3光源部を含むようにした。
An electronic component reading apparatus of the present invention includes a reflector located behind the electronic component, and a transillumination light source section for illuminating the reflector with light to brighten the background of the electronic component. , A direct illumination light source unit that irradiates the electronic component itself with light, and a line sensor that outputs image information by receiving reflected light from a reflector or reflected light from the electronic component, and the transmissive light source unit includes a line sensor. Located on both sides of
A second light source unit including a light source unit and a second light source unit, wherein the first light source unit irradiates the reflection plate with the first strip-shaped light and the second light source unit irradiates the reflection plate
The band-shaped light is arranged on the reflection plate so as to hit the area where the line sensor enters the reflected light, and the direct illumination light source unit irradiates the area where the line sensor enters the reflected light of the electronic component with the third band-shaped light. The third light source unit is included.

【0010】[0010]

【発明の実施の形態】請求項1では、電子部品の背後に
位置する反射板と、反射板に向けて光を照射し電子部品
の背景を明るくする透過照明光源部と、電子部品そのも
のに光を照射する直接照明光源部と、反射板からの反射
光又は電子部品からの反射光を入射して画像情報を出力
するラインセンサとを備え、透過光源部は、ラインセン
サの両側に位置する第1光源部と第2光源部とを含み、
第1光源部が反射板に照射する第1帯状光と第2光源部
が反射板に照射する第2帯状光とが反射板上でラインセ
ンサが反射光を入射するエリアに当たるように配置さ
れ、直接照明光源部は、電子部品のうちラインセンサが
反射光を入射するエリアに第3帯状光を照射する第3光
源部を含むようにした。ところで、画像は、ラインセン
サにより取得されるのであって、従来の電子部品読み取
り装置のように反射板全体を明るくしても、反射板のう
ち画像読み取りのために有効なエリアは、ラインセンサ
の真上に位置するごく限られたエリアに限られるのであ
るから、このごく限られたエリア以外に当てられたひか
りは全く無駄になっているのである。そこで本発明で
は、上述の構成により、第1光源部及び第2光源部のそ
れぞれの帯状光を、上述した限られたエリアに集中さ
せ、無駄なく光を使用することができる。さらに、直接
照明を行う場合にも、電子部品のうちラインセンサに入
射される限られたエリアに光を集中させ、無駄がなく効
率的な照明を行うことができる。
According to a first aspect of the present invention, a reflector located behind an electronic component, a transillumination light source unit that illuminates the reflector to illuminate the background of the electronic component, and the electronic component itself is illuminated with light. And a line sensor that outputs image information by receiving reflected light from a reflector or reflected light from an electronic component, and the transmissive light source units are located on both sides of the line sensor. Including a first light source unit and a second light source unit,
The first band-shaped light that the first light source section irradiates the reflector and the second band-shaped light that the second light source section irradiates the reflector are arranged on the reflector so that the line sensor impinges on the area where the reflected light enters. The direct illumination light source unit includes a third light source unit that irradiates the area where the line sensor enters the reflected light of the electronic component with the third band-shaped light. By the way, since the image is acquired by the line sensor, even if the entire reflector is brightened as in the conventional electronic component reading apparatus, the area effective for image reading in the reflector is the area of the line sensor. Since it is limited to a very limited area directly above it, the lights that are applied to areas other than this very limited area are completely wasted. Therefore, in the present invention, with the above-described configuration, the band-shaped light of each of the first light source unit and the second light source unit can be concentrated on the limited area described above, and the light can be used without waste. Further, even when direct illumination is performed, light can be concentrated on a limited area of the electronic component that is incident on the line sensor, and efficient illumination can be performed without waste.

【0011】次に図面を参照しながら、本発明の実施の
形態を説明する。図1は、本発明の一実施の形態におけ
る電子部品実装装置の平面図である。
Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

【0012】図1において、1は基台、2は、基台1の
中央部にX方向に平行に設けられ、基板3を搬送すると
共に位置決めする位置決め部としてのコンベアである。
4は基台1の前部と後部にコンベア2を挟んで相対向す
るように列設され、電子部品Pを供給するパーツフィー
ダである。5は基台1の両側部に設けられるY軸、6は
Y軸5上に設けられるX軸、7はX軸6に設けられ、X
軸6、Y軸5によってXY方向に移動する移載ヘッドで
ある。
In FIG. 1, reference numeral 1 is a base, and 2 is a conveyor which is provided in the central portion of the base 1 in parallel with the X direction and which conveys and positions the substrate 3.
Reference numeral 4 denotes a part feeder that is provided in front and rear of the base 1 so as to face each other with the conveyor 2 interposed therebetween and supplies the electronic parts P. 5 is a Y-axis provided on both sides of the base 1, 6 is an X-axis provided on the Y-axis 5, 7 is an X-axis,
It is a transfer head that moves in the XY directions by the shaft 6 and the Y-axis 5.

【0013】また、移載ヘッド7の代表的な移動経路
は、図1の矢印で示す通りであり、このうち、認識経路
M1中に、画像読み取り装置8が配設されている。
A typical moving path of the transfer head 7 is as shown by an arrow in FIG. 1, and an image reading device 8 is provided in the recognition path M1 among them.

【0014】次に、図2を参照しながら、移載ヘッド7
と画像読み取り装置8の構成について説明する。図2に
示すように、移載ヘッド7は、本形態において3つのユ
ニットU1〜U3を有している。各ユニットU1〜U3
は、それぞれ、電子部品P1〜P3を下端部に吸着する
ノズルN1〜N3と、ノズルN1〜N3を昇降させる昇
降モータZ1〜Z3と、ノズルN1〜N3を水平面内で
θ回転させる回転モータθ1〜θ3と、ノズルN1〜N
3と同軸的に軸着され、電子部品P1〜P3の背後に位
置する反射板R1〜R3とを有している。
Next, referring to FIG. 2, the transfer head 7
The configuration of the image reading device 8 will be described. As shown in FIG. 2, the transfer head 7 has three units U1 to U3 in this embodiment. Each unit U1-U3
Are nozzles N1 to N3 for adsorbing the electronic components P1 to P3 on the lower end, lift motors Z1 to Z3 for moving the nozzles N1 to N3 up and down, and rotary motors θ1 to rotate the nozzles N1 to N3 in a horizontal plane by θ. θ3 and nozzles N1 to N
3 and has reflectors R1 to R3 that are coaxially mounted and that are located behind the electronic components P1 to P3.

【0015】さて画像読み取り装置8は、次の要素を有
する。即ち、10は中央部にテレセントリックレンズ1
2を備え、テレセントリックレンズ12の両側に、テレ
セントリックレンズ12の軸芯上方に帯状光を照射する
第1光源部13、第2光源部14を有する光源ユニット
である。これら第1光源部13、第2光源部14は、ラ
イン状光源を備え、同光源部13,14により透過照明
光源部が構成される。
The image reading device 8 has the following elements. That is, 10 is a telecentric lens 1 at the center.
2 is a light source unit that includes a first light source unit 13 and a second light source unit 14 that are provided on both sides of the telecentric lens 12 and that irradiate band-shaped light above the axis of the telecentric lens 12. The first light source unit 13 and the second light source unit 14 include line-shaped light sources, and the light source units 13 and 14 constitute a transillumination light source unit.

【0016】また、11はテレセントリックレンズ12
を透過した光を真下と横に分岐するハーフミラー、9
は、テレセントリックレンズ12の真下に配設され、認
識経路M1と直交する方向に主走査方向Sが向く1次元
CCDからなるラインセンサである。なお、ハーフミラ
ー11で横に分岐された光は、作業者に観察状況をモニ
タリングするための2次元CCD15に入射するように
なっている。ラインセンサ9によって読み取られた画像
は、図示しない画像認識部へ出力され、電子部品の位置
認識が行われる。
Further, 11 is a telecentric lens 12
Half mirror that splits the light transmitted through
Is a line sensor which is arranged directly below the telecentric lens 12 and is composed of a one-dimensional CCD in which the main scanning direction S is oriented in a direction orthogonal to the recognition path M1. The light laterally branched by the half mirror 11 is made incident on the two-dimensional CCD 15 for monitoring the observation situation by the operator. The image read by the line sensor 9 is output to an image recognition unit (not shown), and the position of the electronic component is recognized.

【0017】また、光源ユニット10の認識経路M1の
前後には、第1光源部13、第2光源部14と同様にラ
イン状光源を含む第3光源部20と第4光源部21が配
設されている。第3光源部20、第4光源部21は、直
接照明光源部を構成する要素であって、帯状光を電子部
品に直接照射するようになっている。
In addition, before and after the recognition path M1 of the light source unit 10, a third light source section 20 and a fourth light source section 21 including a linear light source are arranged similarly to the first light source section 13 and the second light source section 14. Has been done. The third light source section 20 and the fourth light source section 21 are elements that directly constitute the illumination light source section, and are configured to directly irradiate the electronic component with the band-shaped light.

【0018】次に、図3を参照しながら、透過照明光源
部と直接照明光源部による帯状光の照射位置について説
明する。なお、図3では、説明のために透過照明光源部
と直接照明光源部の両方が作動している状態を示してい
るが、これらの光源部は電子部品の品種によって択一的
に作動させるものであり、通常両光源部を同時に作動さ
せることはない。
Next, the irradiation positions of the band-shaped light by the transmissive illumination light source unit and the direct illumination light source unit will be described with reference to FIG. Note that FIG. 3 shows a state in which both the transmissive illumination light source unit and the direct illumination light source unit are operating for the sake of description, but these light source units are selectively operated depending on the type of electronic component. Therefore, both light source units are not normally operated at the same time.

【0019】さて図3に示すように、透過照明光源部の
うち、第1光源部13は第1帯状光L1を、第2光源部
14は第2帯状光L2を、それぞれ反射板R1へ向けて
照射する。ここで、ラインセンサ9が反射光を入射する
エリアは、一定の狭い矩形のエリアに限られる。そこ
で、第1帯状光L1、第2帯状光L2はこのエリアだけ
に集中して当てられ、しかも、第1帯状光L1と第2帯
状光L2は、認識経路M1上(図3ではノズルN1の中
心の軌跡)上で、互いに重ね合わせられている。この意
味合いについては、図4を参照して後述する。
As shown in FIG. 3, in the transmitted illumination light source section, the first light source section 13 directs the first band-shaped light L1 and the second light source section 14 directs the second band-shaped light L2 to the reflector R1. And irradiate. Here, the area where the line sensor 9 enters the reflected light is limited to a fixed narrow rectangular area. Therefore, the first band-shaped light L1 and the second band-shaped light L2 are focused only on this area, and moreover, the first band-shaped light L1 and the second band-shaped light L2 are on the recognition path M1 (in FIG. On the center locus). This meaning will be described later with reference to FIG.

【0020】また、直接照射光源部のうち、第3光源部
20は第3帯状光L3を、第4光源部L4を、それぞれ
電子部品Pの下面が通過する面のうち、ラインセンサ9
に入射させる矩形のエリアのみに照射する。
Of the direct irradiation light source section, the third light source section 20 has the third band-shaped light L3, the fourth light source section L4, and the surface of the lower surface of the electronic component P which passes through the line sensor 9 respectively.
Irradiate only the rectangular area to be incident on.

【0021】ところで、電子部品の高さ(厚さ)は、そ
の品種によって相違する。しかし、ラインセンサ9の焦
点深度は一定であるから、ラインセンサ9が観察する電
子部品の下面は、ラインセンサ9から一定の高さを通過
するようにしなければならない。
By the way, the height (thickness) of an electronic component differs depending on its type. However, since the depth of focus of the line sensor 9 is constant, the lower surface of the electronic component observed by the line sensor 9 must pass through the line sensor 9 at a constant height.

【0022】ところで、電子部品P1の高さT1が大き
いとき、図4(a)に示すように、電子部品P1の下面
がラインセンサ9から一定の高さHに位置するようにす
ると、反射板R1の高さは、電子部品P1の下面から
(E+T1、但し、EはノズルN1の高さ)になる。こ
のとき、反射板R1に当たる第1帯状光L1と第2帯状
光L2は、認識経路M1中で重なり合っているから、図
4(c)に示すように、反射板R1のうちラインセンサ
9に入射するエリア(視野)の全体が明るく照らされ
る。一方、図4(b)に示すように、電子部品P2の高
さT2が小さいとき、反射板R1は電子部品P2の下面
を、ラインセンサ9から一定の高さHに位置させると、
反射板R1は電子部品P2の下面から高さ(E+T2)
の位置にある。このとき、反射板R1上では、図4
(d)に示すように、第1帯状光L1と第2帯状光L2
は重なり合っている。
By the way, when the height T1 of the electronic component P1 is large, as shown in FIG. 4A, when the lower surface of the electronic component P1 is positioned at a constant height H from the line sensor 9, the reflector plate is formed. The height of R1 is (E + T1, where E is the height of the nozzle N1) from the lower surface of the electronic component P1. At this time, the first band-shaped light L1 and the second band-shaped light L2 that strike the reflector R1 overlap each other in the recognition path M1. Therefore, as shown in FIG. 4C, the line sensor 9 is incident on the reflector R1. The entire area (field of view) to be illuminated is illuminated brightly. On the other hand, as shown in FIG. 4B, when the height T2 of the electronic component P2 is small, the reflector R1 positions the lower surface of the electronic component P2 at a certain height H from the line sensor 9,
The reflector R1 is at a height (E + T2) from the lower surface of the electronic component P2.
In the position. At this time, as shown in FIG.
As shown in (d), the first band-shaped light L1 and the second band-shaped light L2
Are overlapping.

【0023】図4(c)と図4(d)とを比較すれば明
らかなように、電子部品の高さが小であり、反射板R1
が比較的低い位置にあるとき(図4(d))に比べ、電
子部品の高さが大であり反射板R1が比較的高い位置に
あるとき(図4(c))では、第1帯状光L1と第2帯
状光L2とが重なり合う部分(斜線部)が狭くなる。し
かしながら、実装する電子部品のうち最も高さがあるも
のであっても、この重なり合う部分が十分確保されるよ
うにしておけば、電子部品の品種によらず、支障なく透
過照明を行うことができる。
As is apparent from a comparison between FIG. 4C and FIG. 4D, the height of the electronic component is small and the reflector R1
When the height of the electronic component is large and the reflector R1 is at a relatively high position (FIG. 4 (c)), the first band shape is higher than that at a relatively low position (FIG. 4 (d)). The portion where the light L1 and the second band-shaped light L2 overlap (hatched portion) becomes narrow. However, even if the electronic component to be mounted has the highest height, it is possible to perform transmitted illumination without trouble regardless of the type of electronic component if the overlapping portion is sufficiently secured. .

【0024】[0024]

【発明の効果】本発明の電子部品読み取り装置は、電子
部品の背後に位置する反射板と、反射板に向けて光を照
射し電子部品の背景を明るくする透過照明光源部と、電
子部品そのものに光を照射する直接照明光源部と、反射
板からの反射光又は電子部品からの反射光を入射して画
像情報を出力するラインセンサとを備え、透過光源部
は、ラインセンサの両側に位置する第1光源部と第2光
源部とを含み、第1光源部が反射板に照射する第1帯状
光と第2光源部が反射板に照射する第2帯状光とが反射
板上でラインセンサが反射光を入射するエリアに当たる
ように配置され、直接照明光源部は、電子部品のうちラ
インセンサが反射光を入射するエリアに第3帯状光を照
射する第3光源部を含むようにしているので、効率的な
照明を行えると共に、電子部品の品種に応じて、直接照
明及び透過照明のいずれにも対応することができる。
According to the electronic component reading apparatus of the present invention, a reflector located behind the electronic component, a transillumination light source unit that illuminates the reflector to illuminate the background of the electronic component, and the electronic component itself. A direct illumination light source unit for irradiating light to the light source, and a line sensor for outputting image information by inputting reflected light from a reflection plate or reflected light from an electronic component, and the transmissive light source units are located on both sides of the line sensor. Including a first light source unit and a second light source unit, the first band-shaped light that the first light source unit illuminates the reflector and the second band-shaped light that the second light source unit illuminates the reflector on the reflector plate Since the sensor is arranged so as to hit the area where the reflected light enters, the direct illumination light source section includes the third light source section that irradiates the area where the line sensor enters the reflected light of the electronic component with the third band-shaped light. , With efficient lighting Depending on the type of the electronic component, it is possible to cope with any illumination and transmitted illumination directly.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施の形態における電子部品実装装
置の平面図
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

【図2】本発明の一実施の形態における移載ヘッドと電
子部品読み取り装置の斜視図
FIG. 2 is a perspective view of a transfer head and an electronic component reading device according to an embodiment of the present invention.

【図3】本発明の一実施の形態における電子部品読み取
り装置の斜視図
FIG. 3 is a perspective view of an electronic component reading device according to an embodiment of the present invention.

【図4】(a)本発明の一実施の形態における電子部品
読み取り装置の動作説明図 (b)本発明の一実施の形態における電子部品読み取り
装置の動作説明図 (c)本発明の一実施の形態における電子部品読み取り
装置の動作説明図 (d)本発明の一実施の形態における電子部品読み取り
装置の動作説明図
FIG. 4A is an operation explanatory diagram of the electronic component reading device according to the embodiment of the present invention. FIG. 4B is an operation explanatory diagram of the electronic component reading device according to the embodiment of the present invention. Of operation of the electronic component reading device according to the embodiment of the present invention (d) Operation of the electronic component reading device according to one embodiment of the present invention

【符号の説明】[Explanation of symbols]

9 ラインセンサ 13 第1光源部 14 第2光源部 20 第3光源部 P1 電子部品 R1 反射板 L1 第1帯状光 L2 第2帯状光 L3 第3帯状光 9 Line sensor 13 1st light source part 14 2nd light source part 20 3rd light source part P1 Electronic component R1 Reflector L1 1st strip light L2 2nd strip light L3 3rd strip light

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】電子部品の背後に位置する反射板と、前記
反射板に向けて光を照射し電子部品の背景を明るくする
透過照明光源部と、電子部品そのものに光を照射する直
接照明光源部と、前記反射板からの反射光又は電子部品
からの反射光を入射して画像情報を出力するラインセン
サとを備え、 前記透過光源部は、前記ラインセンサの両側に位置する
第1光源部と第2光源部とを含み、前記第1光源部が前
記反射板に照射する第1帯状光と前記第2光源部が前記
反射板に照射する第2帯状光とが前記反射板上で前記ラ
インセンサが反射光を入射するエリアに当たるように配
置され、 前記直接照明光源部は、電子部品のうち前記ラインセン
サが反射光を入射するエリアに第3帯状光を照射する第
3光源部を含むことを特徴とする電子部品読み取り装
置。
1. A reflector located behind an electronic component, a transmissive illumination light source unit that illuminates the reflector to illuminate the background of the electronic component, and a direct illumination light source that illuminates the electronic component itself. And a line sensor that outputs image information by receiving reflected light from the reflector or reflected light from an electronic component, the transmissive light source unit being a first light source unit located on both sides of the line sensor. And a second light source unit, wherein the first band-shaped light that the first light source unit irradiates the reflector and the second band-shaped light that the second light source unit irradiates the reflector are on the reflector. The line sensor is arranged so as to hit the area where the reflected light is incident, and the direct illumination light source section includes a third light source section that irradiates the area where the line sensor enters the reflected light of the electronic component with the third band-shaped light. Electronic component reading characterized by Apparatus.
【請求項2】基板を位置決めする位置決め部と、電子部
品を供給するパーツフィーダと、前記パーツフィーダか
ら電子部品をピックアップし基板に電子部品を搭載する
移載ヘッドと、前記移載ヘッドと共に移動する電子部品
の移動経路中にて電子部品を観察するラインセンサとを
有する電子部品読み取り装置を備え、 前記移載ヘッドは、電子部品を吸着するノズルと、前記
ノズルに吸着された電子部品の背後に位置する反射板と
を有し、前記電子部品読み取り装置は、前記反射板に向
けて光を照射し電子部品の背景を明るくする透過照明光
源部と、電子部品そのものに光を照射する直接照明光源
部とを有し、 前記透過照明光源部は、前記ラインセンサの両側に位置
する第1光源部と第2光源とを含み、前記第1光源部が
前記反射板に照射する第1帯状光と前記第2光源部が前
記反射板に照射する第2帯状光とが、前記反射板上で前
記ラインセンサが反射光を入射するエリアに当たるよう
に配置され、 前記直接照明光源部は、電子部品のうち前記ラインセン
サが反射光を入射するエリアに第3帯状光を照射する第
3光源部を含むことを特徴とする電子部品実装装置。
2. A positioning unit for positioning a substrate, a parts feeder for supplying electronic components, a transfer head for picking up electronic components from the parts feeder and mounting the electronic components on the substrate, and a transfer head that moves together with the transfer head. An electronic component reading device having a line sensor for observing an electronic component in a moving path of the electronic component is provided, wherein the transfer head is provided with a nozzle for adsorbing the electronic component and behind the electronic component adsorbed by the nozzle. The electronic component reading device has a reflection plate located therein, and the electronic component reading device directs a light source to illuminate the reflection plate with light to illuminate the background of the electronic component and to illuminate the electronic component itself with direct light. The transmission light source unit includes a first light source unit and a second light source located on both sides of the line sensor, and the first light source unit irradiates the reflection plate. The first strip-shaped light and the second strip-shaped light that the second light source section irradiates to the reflector are arranged so as to strike an area on the reflector where the line sensor enters the reflected light, and the direct illumination light source section is provided. Is an electronic component mounting apparatus including a third light source unit that irradiates a third band-shaped light to an area of the electronic component where the line sensor receives reflected light.
JP05901696A 1996-03-15 1996-03-15 Electronic component reading device and electronic component mounting device Expired - Fee Related JP3341569B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP05901696A JP3341569B2 (en) 1996-03-15 1996-03-15 Electronic component reading device and electronic component mounting device
TW086102937A TW326619B (en) 1996-03-15 1997-03-10 Electronic part mounting apparatus and method thereof
US08/815,124 US5999640A (en) 1996-03-15 1997-03-11 Electronic part mounting apparatus with reflector which optimizes available light
KR1019970008801A KR100257591B1 (en) 1996-03-15 1997-03-14 Apparatus and method for mounting electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05901696A JP3341569B2 (en) 1996-03-15 1996-03-15 Electronic component reading device and electronic component mounting device

Publications (2)

Publication Number Publication Date
JPH09252198A true JPH09252198A (en) 1997-09-22
JP3341569B2 JP3341569B2 (en) 2002-11-05

Family

ID=13101080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05901696A Expired - Fee Related JP3341569B2 (en) 1996-03-15 1996-03-15 Electronic component reading device and electronic component mounting device

Country Status (1)

Country Link
JP (1) JP3341569B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103857998A (en) * 2011-10-25 2014-06-11 美艾利尔瑞士公司 Improvements in or relating to reading of assays

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9015928B2 (en) 2013-07-25 2015-04-28 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus
US9491411B2 (en) 2013-07-25 2016-11-08 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus and electronic component mounting method
US9332230B2 (en) 2013-07-25 2016-05-03 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting apparatus and electronic component mounting method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103857998A (en) * 2011-10-25 2014-06-11 美艾利尔瑞士公司 Improvements in or relating to reading of assays

Also Published As

Publication number Publication date
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